WO2013007083A1 - Carte de circuit imprimé à deux couches, procédé d'impression associé, et terminal de communication mobile - Google Patents

Carte de circuit imprimé à deux couches, procédé d'impression associé, et terminal de communication mobile Download PDF

Info

Publication number
WO2013007083A1
WO2013007083A1 PCT/CN2011/083665 CN2011083665W WO2013007083A1 WO 2013007083 A1 WO2013007083 A1 WO 2013007083A1 CN 2011083665 W CN2011083665 W CN 2011083665W WO 2013007083 A1 WO2013007083 A1 WO 2013007083A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
layer printed
pads
capacitor
Prior art date
Application number
PCT/CN2011/083665
Other languages
English (en)
Chinese (zh)
Inventor
刘玉鹏
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201110190890.3A external-priority patent/CN102300398B/zh
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to KR1020137033731A priority Critical patent/KR20140010991A/ko
Publication of WO2013007083A1 publication Critical patent/WO2013007083A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting

Definitions

  • the present invention relates to mobile communication technologies, and more particularly to a mobile communication terminal and a two-layer printed circuit board therefor, and a method of printing the two-layer printed circuit board.
  • the printed circuit is a conductive pattern for connection between components formed on the surface of the insulating substrate or by a printing method in accordance with a pre-designed circuit.
  • Printed circuit boards play an important role in electronics.
  • the printed circuit boards used in low-end mobile communication terminals are mainly six-layer printed circuit boards (referred to as six-layer boards) and four-layer printed circuit boards (referred to as four-layer boards).
  • the cost of a two-layer printed circuit board is only half that of a four-layer printed circuit board, and only one-third of a six-layer printed circuit board. Therefore, applying two-layer printed circuit boards to low-end mobile communication. On the terminal, the cost of the mobile communication terminal will be significantly reduced.
  • the technical problem to be solved by the present invention is to provide a two-layer printed circuit board that can be applied to a mobile communication terminal, which overcomes the existing low-end mobile communication terminal and uses a six-layer printed circuit board or a four-layer printed circuit board.
  • the disadvantage of higher board cost is to provide a two-layer printed circuit board that can be applied to a mobile communication terminal, which overcomes the existing low-end mobile communication terminal and uses a six-layer printed circuit board or a four-layer printed circuit board.
  • the present invention provides a two-layer printed circuit board based on the MT6251 platform, in the two-layer printed circuit board:
  • the pad diameter is 0.27 mm
  • the line width between the two pads is 0.075 mm
  • the minimum spacing between the traces and the pads is 0.075 mm
  • the pads in the inner row are threaded from the outer pads.
  • the main ground pad of the main chip is a complete ground plane
  • the C7 pin and C8 pin are led out to the ground.
  • a first capacitor is disposed on the VBAT (power supply) line on the two-layer printed circuit board.
  • a second capacitor is disposed on the VBAT line on the two-layer printed circuit board.
  • the second capacitor is a tantalum capacitor.
  • the clock line and the data line of the memory on the two-layer printed circuit board are taken out from the baseband chip, and the clock line of the memory and the back side of the data line are a complete ground plane.
  • the present invention also provides a two-layer printed circuit board printing method for printing a two-layer printed circuit board based on the MT6251 platform, the method comprising:
  • the pads of the inner row are threaded out from the outer row pads, and the back surface of the main pad of the main chip is set to a complete ground plane, and the C7 pin and the C8 pin are led out to the outside ground hole.
  • a first capacitance is provided on the VBAT line on the two-layer printed circuit board.
  • a second capacitor is provided on the VBAT line on the two-layer printed circuit board.
  • the clock line and the data line of the memory are disposed at a position leading from the baseband chip on the two-layer printed circuit board, and the clock line of the memory and the back side of the data line are set to a complete ground plane.
  • the present invention also provides a mobile communication terminal comprising any of the above two layers of printed circuit boards.
  • the two-layer printed circuit board of the embodiment of the present invention can ensure the function of the mobile communication terminal is normal when applied to the mobile communication terminal, compared with the existing four-layer printed circuit board or six-layer printing.
  • the mobile communication terminal of the circuit board significantly reduces the cost without increasing the function, and improves the competitive advantage of the product.
  • FIG. 1 is a schematic diagram of a main chip outlet in an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a first capacitor and a second capacitor on a VBAT line in an embodiment of the present invention.
  • 3 is a schematic view of a pad of a main chip in an embodiment of the present invention.
  • FIG. 4 is a schematic view showing the setting of a high speed signal line in the embodiment of the present invention.
  • FIG. 5 is a schematic flow chart of printing a two-layer printed circuit board according to an embodiment of the present invention. Preferred embodiment of the invention
  • the embodiment of the present invention is based on the MT6251 platform, and the implemented two-layer printed circuit board reduces the diameter of the ball grid array (BGA) peripheral pad compared to the prior art, and reduces the line and the pad. The spacing between them. This is convenient for the inside of the pad to exit the surface.
  • BGA ball grid array
  • the existing BGA pads have a diameter of 0.3 mm mm and the center distance between the two pads is 0.5 mm. According to the current industry regulations, the width of the trace is 0.1mm, and the safety distance between the trace and the pad is 0.1 mm. This way there is no way to thread between the two pads.
  • the embodiment of the present invention is as shown in FIG. 1.
  • the center distance between the pad and the pad is 0.5 mm as in the prior art, and the pad diameter is set to 0.27 mm, and the line between the two pads of the BGA is traced.
  • the width is set to 0.075mm, the rest is not the line from the BGA pad, the line width is set to 0.1mm; and the minimum spacing rule between the trace and the pad is set to 0.075mm.
  • the minimum pitch is 0.075mm, which allows the pads of the inner row to be routed from between the outer pads. Verified, adjust pad diameter and go The spacing between the lines and the pads can meet the functional requirements and mass production requirements of the mobile communication terminal.
  • the positions indicated by the two ellipses are more commonly used.
  • the above-mentioned pad diameter is set to 0.27 mm and the line width between the two pads of the BGA is set to 0.075 mm. Process.
  • the main chip shown in Figure 1, the rest of the place also has the application of this process.
  • the VB AT line is on the surface layer, and a first capacitor having a capacity of 22 microfarads (uF) or more is provided on the VBAT line, and the first capacitor is, for example, a tantalum capacitor or a ceramic capacitor.
  • the first capacitor can effectively eliminate the interference on the power supply, prevent the voltage drop of the VBAT from significantly affecting the RF phase, and greatly improve the stability of the RF index and the system.
  • the first capacitor on the VBAT line is as close as possible to the battery connector.
  • PCB A Print Cirruit Board + Assembly
  • the embodiment of the present invention further sets a second capacitor having a capacity of 22 uF or more on the VBAT line, which can effectively eliminate the sound that may be emitted from the PCBA line; wherein the second capacitor is a tantalum capacitor.
  • 2 is a schematic structural view of a first capacitor and a second capacitor according to an embodiment of the present invention, wherein the second capacitor is disposed as close as possible to the baseband processing chip. In the embodiment shown in FIG.
  • the ellipse on the left side indicates the position of the first capacitor
  • the ellipse on the right side indicates the position of the second capacitor
  • the first capacitor and the second capacitor are tantalum capacitors.
  • the main pad back of the master chip is a complete ground plane.
  • some of the easily disturbed ground pads are led out to the outside, such as pulling the C7 and C8 pins to the outside.
  • Time Division Distortion (TDD) NOISE is generated on the audio (a noise generated by the radio frequency module periodically transmitting and receiving information generated by the time division duplex communication mode).
  • the copper area in the ellipse in Figure 3 is the ground plane
  • the ground pin in the ellipse is the main grounding pin of the chip.
  • the memory has a high clock frequency that can reach tens or hundreds of megahertz (MHz). If the clock and data lines of the memory are exposed outside, or are placed back to back with other sensitive traces, there may be some risk to the stability of the system.
  • the clock line and the data line of the memory (MEMORY) (the high-brightness line shown in the ellipse in Fig. 4) are taken out from the baseband chip, and the back side thereof is a complete ground plane.
  • FIG. 5 is a schematic flow chart of printing a two-layer printed circuit board according to an embodiment of the present invention. As shown in Figure 5, the embodiment of the present invention mainly includes the following steps:
  • the first capacitor such as tantalum capacitor or ceramic capacitor
  • Its capacity is 22uF or more, which can effectively eliminate the interference on the power supply.
  • the RF indicators and the stability of the system have been greatly improved.
  • the second capacitor (tantalum capacitor) is placed on the VBAT line on the two-layer printed circuit board as close as possible to the baseband processing chip. Its capacity is 22uF or more, which can effectively eliminate the sound of the PCBA line.
  • the main ground pad back of the main chip on the two-layer printed circuit board is set to a complete ground plane, and some easily disturbed ground pads are led out to punch holes, for example, the C7 pin and the C8 pin are taken out to the outside. Playing the hole, effectively avoiding TDD NOISE on the audio.
  • the clock line and the data line of the memory (MEMORY) on the two-layer printed circuit board are taken out from the baseband chip, and the back side of the clock line and the data line are set to a complete ground plane, which reduces the clock line and data line exposure of the memory.
  • Embodiments of the present invention also include applying the aforementioned two-layer printed circuit board to a mobile communication terminal.
  • a mobile communication terminal For details, refer to the description of the two-layer printed circuit board in the foregoing embodiment, which is not mentioned here.
  • the embodiment of the present invention realizes the threading of the inner row of pads from the outer row pads by reducing the pad diameter and the line width of the inner portion of the BGA, thereby ensuring the functional requirements and mass production requirements of the mobile communication terminal. .
  • the embodiment of the invention effectively eliminates the interference on the power supply by setting the first tantalum capacitor on the VBAT line, and greatly improves the stability of the radio frequency index and the system.
  • Embodiments of the present invention effectively eliminate the possible sound of the PCBA line by providing a second tantalum capacitor on the VBAT line.
  • Embodiments of the present invention set the back surface of the ground pad of the main chip to be relatively complete The ground plane avoids the generation of TDD NOISE on the audio.
  • the embodiment of the present invention improves the stability of the system by setting a complete ground plane on the back of the MEMORY clock and data lines.
  • the two-layer printed circuit board of the embodiment of the present invention can ensure that the function of the mobile communication terminal is normal, compared with the existing four-layer printed circuit board or six-layer printed circuit board.
  • the mobile communication terminal significantly reduces the cost and improves the competitive advantage of the product without losing the function.

Abstract

Une carte de circuit imprimé à deux couches, un procédé d'impression associé et un terminal de communication mobile résolvent l'inconvénient du coût élevé d'une carte de circuit imprimé à six couches ou d'une carte de circuit imprimé à quatre couches utilisée par le terminal communication mobile à extrémité basse existant. La carte de circuit imprimé à deux couches est basée sur la plateforme MT6251. Le diamètre d'un plot de liaison est de 0,27 millimètre. La largeur de ligne d'un câblage entre deux plots de liaison est de 0,075 millimètre. Un intervalle minimum entre le câblage et le plot de liaison est de 0,075 millimètre. Un câble partant d'un plot de liaison d'une rangée intérieure est fileté dans un emplacement situé entre les plots de liaison d'une rangée extérieure. L'arrière d'un plot de liaison à la masse principal d'une puce principale est un plan de masse entier. Un trou de mise à la masse est ouvert après qu'une tige C7 et une tige C8 ont été menées à l'extérieur. Lorsque la carte de circuit imprimé à deux couches du mode de réalisation de la présente invention est appliquée au terminal de communication mobile, par rapport à un terminal de communication mobile utilisant une carte de circuit imprimé à quatre couches ou une carte de circuit imprimé à six couches, le coût est bien entendu réduit en supposant aucune perte de fonctions et l'avantage compétitif du produit est amélioré.
PCT/CN2011/083665 2011-07-08 2011-12-08 Carte de circuit imprimé à deux couches, procédé d'impression associé, et terminal de communication mobile WO2013007083A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020137033731A KR20140010991A (ko) 2011-07-08 2011-12-08 2층 인쇄회로기판, 2층 인쇄회로기판의 인쇄방법, 및 이동통신 단말기

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110190890.3A CN102300398B (zh) 2011-07-08 两层印制电路板及其印刷方法、移动通信终端
CN201110190890.3 2011-07-08

Publications (1)

Publication Number Publication Date
WO2013007083A1 true WO2013007083A1 (fr) 2013-01-17

Family

ID=45360474

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/083665 WO2013007083A1 (fr) 2011-07-08 2011-12-08 Carte de circuit imprimé à deux couches, procédé d'impression associé, et terminal de communication mobile

Country Status (2)

Country Link
KR (1) KR20140010991A (fr)
WO (1) WO2013007083A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1812689A (zh) * 2005-01-26 2006-08-02 松下电器产业株式会社 多层电路基板及其制造方法
CN101119614A (zh) * 2006-07-31 2008-02-06 比亚迪股份有限公司 一种用于双面及多层柔性印刷线路板的图形电镀方法
US20080202799A1 (en) * 2007-02-26 2008-08-28 Bhret Graydon Embedding an electronic component between surfaces of a printed circuit board
US20090308638A1 (en) * 2008-06-12 2009-12-17 Jeong-Min Cho Flexible printed circuit board, method of fabricating the flexible printed circuit board, and display device having the flexible printed circuit board
CN201550357U (zh) * 2009-12-18 2010-08-11 杭州华三通信技术有限公司 一种印刷电路板
CN101998756A (zh) * 2009-08-11 2011-03-30 鸿富锦精密工业（深圳）有限公司 印刷电路板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1812689A (zh) * 2005-01-26 2006-08-02 松下电器产业株式会社 多层电路基板及其制造方法
CN101119614A (zh) * 2006-07-31 2008-02-06 比亚迪股份有限公司 一种用于双面及多层柔性印刷线路板的图形电镀方法
US20080202799A1 (en) * 2007-02-26 2008-08-28 Bhret Graydon Embedding an electronic component between surfaces of a printed circuit board
US20090308638A1 (en) * 2008-06-12 2009-12-17 Jeong-Min Cho Flexible printed circuit board, method of fabricating the flexible printed circuit board, and display device having the flexible printed circuit board
CN101998756A (zh) * 2009-08-11 2011-03-30 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN201550357U (zh) * 2009-12-18 2010-08-11 杭州华三通信技术有限公司 一种印刷电路板

Also Published As

Publication number Publication date
KR20140010991A (ko) 2014-01-27
CN102300398A (zh) 2011-12-28

Similar Documents

Publication Publication Date Title
TWI615065B (zh) 柔性線路板及其製作方法
CN104754855A (zh) 柔性电路板及其制作方法
US20150060127A1 (en) Combined printed wiring board and method for manufacturing the same
US9854663B2 (en) Radio frequency module
KR20130044978A (ko) 임베디드 인쇄회로기판 및 이의 제조 방법
JP6108887B2 (ja) 半導体パッケージ及びプリント回路板
CN103052258B (zh) 印刷电路板及其制造方法
US20080245555A1 (en) Circuit substrate with plated through hole structure and method
WO2012009999A1 (fr) Carte de circuit imprimé à quatre couches à interconnexions et terminal mobile l'utilisant
US20160270214A1 (en) Printed circuit board and electronic device
US8633398B2 (en) Circuit board contact pads
US8772644B2 (en) Carrier with three-dimensional capacitor
US8253031B2 (en) Printed circuit board
JP2008258464A (ja) 回路基板および差動伝送機器
WO2013007083A1 (fr) Carte de circuit imprimé à deux couches, procédé d'impression associé, et terminal de communication mobile
TWI551484B (zh) 電子裝置及雷達裝置
US8315066B2 (en) Printed circuit board
US10470308B1 (en) Printed circuit board assembly and electronic device using the same
KR20150021342A (ko) 다층인쇄회로기판
CN210042399U (zh) 一种软硬结合板、smt贴片加工的载具以及电子终端
TW200529727A (en) Wiring structure for improving wiring response
TW201611675A (zh) 電路板結構之改良方法
US8283574B2 (en) Printed circuit board with compound via
WO2013056561A1 (fr) Carte de circuits imprimés à deux couches et terminal de communication mobile
CN106714443A (zh) 高精度柔性电路板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11869247

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20137033731

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11869247

Country of ref document: EP

Kind code of ref document: A1