WO2013004074A1 - 低温发热实木复合地板及其制备方法 - Google Patents

低温发热实木复合地板及其制备方法 Download PDF

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Publication number
WO2013004074A1
WO2013004074A1 PCT/CN2012/000920 CN2012000920W WO2013004074A1 WO 2013004074 A1 WO2013004074 A1 WO 2013004074A1 CN 2012000920 W CN2012000920 W CN 2012000920W WO 2013004074 A1 WO2013004074 A1 WO 2013004074A1
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WO
WIPO (PCT)
Prior art keywords
layer
substrate layer
heat generating
heat
low
Prior art date
Application number
PCT/CN2012/000920
Other languages
English (en)
French (fr)
Inventor
全俊成
Original Assignee
上海热丽电热材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海热丽电热材料有限公司 filed Critical 上海热丽电热材料有限公司
Priority to EP12807009.1A priority Critical patent/EP2733280B1/en
Priority to US14/130,620 priority patent/US8866048B2/en
Priority to AU2012278749A priority patent/AU2012278749B2/en
Priority to CA2840892A priority patent/CA2840892C/en
Priority to JP2014517398A priority patent/JP5657838B2/ja
Publication of WO2013004074A1 publication Critical patent/WO2013004074A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D13/00—Electric heating systems
    • F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
    • F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
    • F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/142—Laminating of sheets, panels or inserts, e.g. stiffeners, by wrapping in at least one outer layer, or inserting into a preformed pocket
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/345—Heating elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2419/00—Buildings or parts thereof
    • B32B2419/04—Tiles for floors or walls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D13/00—Electric heating systems
    • F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Definitions

  • the invention relates to a solid wood composite floor, in particular to a low-temperature heating solid wood composite floor and a preparation method thereof.
  • the existing heating floor has a high heating temperature, which is liable to damage the floor and cause fire, etc., and there are disadvantages in terms of insulation, temperature control, service life, and stability.
  • Chinese Patent Publication No. CN101600270 discloses an electrically conductive heat-generating material and a floor and a manufacturing method therefor.
  • the heat-generating material in the floor is mainly made of conductive graphite and conductive carbon black, and then the conductive coating is printed. Attached to the wooden floor substrate. Because the heating material uses graphite and conductive paint, and the heat-generating material made of graphite and conductive paint has a large energy consumption ratio, the surface temperature of the floor is too high. After actual testing, the test data shows that the maximum surface temperature can reach 80'C. It is easy to deform, crack and burn the wooden floor. If these conditions occur in the floor installed in the building, it will bring economic losses to the consumers, and even need to reinstall the floor, which will seriously lead to safety accidents.
  • the present invention discloses a low-temperature heat-generating solid wood composite floor and a preparation method thereof. It has the technical features described below to solve the existing problems.
  • the object of the present invention is to provide a low-temperature heating solid wood composite floor and a preparation method thereof, which can reduce the design power per unit area of the floor, and the maximum temperature of the floor surface is 50 ° C - 55 ° C, solving the problem of deformation and cracking of the floor. , increased heat radiation and conduction.
  • a low-temperature heating solid wood composite floor of the invention and the preparation method thereof are achieved by the following technical solutions:
  • a low-temperature heating solid wood composite floor comprising: an outer facing layer, an upper substrate layer, a heat generating layer and a lower substrate layer stacked one after another Put and heat the pressure.
  • the upper substrate layer, the heat generating layer and the lower substrate layer are hot pressed after a total of 9 layers, and the heat generating layer is located 5-7, the upper layer of the heat generating layer is an upper substrate layer, the lower layer of the heat generating layer is a lower substrate layer, and the upper substrate layer is composed of 3 to 5 layers, and the lower base
  • the material layer is composed of 4 to 6 layers; the outer facing layer is disposed on the upper substrate layer by hot pressing.
  • the outer facing layer, the upper substrate layer, the heat generating layer and the lower substrate layer are respectively elongated; the heat generating layer has a pair of copper poles on both sides of the wide side, and the copper pole and the heat generating layer The same width is provided; a fireproof layer is respectively disposed between the bottom of the upper substrate layer and the heat generating layer, the top of the lower substrate layer and the heat generating layer; and the bottom layer of the lower substrate layer is provided with a reflective layer.
  • the upper substrate layer is formed by laminating and laminating a plurality of layers of the substrate wood core board
  • the lower substrate layer is formed by laminating and laminating the layers of the plurality of base plates.
  • the low-temperature heat-generating solid wood composite floor wherein the heat-generating layer is carbon fiber conductive paper, and a plurality of small holes are formed on the carbon fiber conductive paper; and the copper pole is formed by pressing copper-aluminum foil.
  • the two ends of the lower substrate layer are respectively provided with a pair of through holes, and the positions of the through holes correspond to the positions of the copper poles on the heat generating layer.
  • connection terminal comprises a male terminal, a female terminal, a connection male terminal, a connection female terminal and a pair of connecting wires, and the connecting male terminal
  • the male terminal is matched with the size of the female terminal
  • the female terminal is matched with the size of the female terminal.
  • the female terminal is disposed in the through hole of the lower substrate layer, and is in contact with the copper pole of the heat generating layer, and the pair of connecting wires are pressed together.
  • connection male terminal is connected to another connection female terminal in the same device, and the connection female terminal is connected to another male terminal in the same device;
  • the thermal component is placed on the male terminal.
  • the method comprises at least the following steps:
  • Step 1 hot pressing to prepare the upper substrate layer; Step 2, hot pressing to prepare the heat generating layer; Step 3, hot pressing to prepare the lower substrate layer; Step 4, hot pressing to prepare low temperature heating solid wood composite floor substrate; Step 5, at low temperature
  • the connecting terminal and the heat sensitive component are arranged on the heating solid wood composite floor substrate.
  • Step 1. Select the substrate wood core board and apply it to the glue;
  • Step 1. 2 the stepped wood core board in step 1.1 is arranged in a crisscross layer, and bonded together, by 3 to 5 layers;
  • Step 1. 3 in the step 1.2, the bottom of the substrate wood core board is glued, and a fireproof layer is attached, and the length and width of the fireproof layer are matched with the substrate wood core board;
  • 1. 4 hot pressing the substrate wood core board prepared in the step 1.3 to obtain the upper substrate layer.
  • step 2 further includes:
  • Step 2 Impregnate the carbon fiber conductive paper with a polyvinyl alcohol solution having a concentration of 10% to 20%, and the adhesion amount of the polyvinyl alcohol on the carbon fiber conductive paper after the impregnation is 15% to 30%, and then carry out Drying treatment; Step 2. 2, using a resin of one or a combination of a thermosetting phenolic resin, an epoxy resin, the carbon fiber conductive paper prepared in the step 2.1 is impregnated with a resin; The carbon fiber conductive paper prepared in step 2.2 is carbonized; step 2. 4, the carbon fiber conductive paper prepared in step 2. 3 is cut; step 2. 5, after cutting in step 2.
  • Step 2 a pair of wide sides of the carbon fiber conductive paper are respectively pressed against the copper poles, and the copper poles are the same width as the carbon fiber conductive paper; Step 2. 6.
  • the carbon fiber conductive paper after the copper poles are pressed in step 2.5 is hot pressed; 2.
  • the carbon fiber conductive paper prepared in step 2.6 is glued to obtain a heat generating layer.
  • step 3 further includes:
  • Step 3. Select the bottom plate of the lower substrate layer and apply glue on the reverse side of the bottom plate; Step 3. 2, attach a reflective layer to the rubberized surface of the bottom plate, and the reflective layer is equal to the bottom plate; Step 3. 3, Heat The pressure-reflecting layer and the bottom plate; step 3. 4, the non-reflective layer of the bottom plate after the hot pressing in step 3. 3 is coated; step 3. 5, the stepped layer of the bottom plate after the stepping in step 3.4 Arranged, bonded together, consisting of 4 to 6 layers; Step 3. 6. Apply the fireproof layer, fireproof layer and bottom plate to the upper end of the bottom plate prepared in step 3.5. The same width; and hot pressing to obtain the substrate layer; Step 3. 7, according to the position of the copper pole on the lower substrate layer correspondingly set through holes.
  • step 4 further includes:
  • Step 4. Apply a fire-resistant layer to the upper substrate layer and the lower substrate layer; step 4. 2, place the female terminal in the connection terminal in the through hole of the lower substrate layer; Step 4. 3 The step of placing the heat generating layer on the lower substrate layer, the copper electrode on the heat generating layer is in contact with the female terminal; step 4. 4, attaching the upper substrate layer to the heat generating layer and performing hot pressing; step 4. 5, the step 4. 4 After the hot pressing is completed, the substrate is treated for 5-15 days to prepare a low-temperature heating solid wood composite floor substrate.
  • step 5 further includes:
  • Step 5. Press the outer facing layer on the low-temperature heating solid wood composite floor substrate to prepare the low-temperature heating solid wood composite floor; Step 5. 2, press the connecting wire on the male terminal, and press one male terminal on the common terminal. Root connection wire; Step 5. 3, press the male terminal and the connection female terminal once on the other end of the two connecting wires; Step 5. 4, insert the heat-sensitive component into the male terminal.
  • the maximum temperature of the low-temperature heating solid wood composite floor of the invention is 50°C-55°C, and when it continues to heat up, it belongs to a low temperature state, and does not cause deformation, cracking and charring of the wooden floor.
  • the low-temperature heating solid wood composite floor of the invention adopts carbon fiber conductive paper, and the heat conversion efficiency of the carbon fiber conductive paper can reach 97%, which is more energy-saving than the traditional materials.
  • the heat transfer of carbon fiber conductive paper is mainly based on far-infrared radiation, and also releases far-infrared light waves of 8 ⁇ m-18 ⁇ m, which activates water molecules in the human body, increases blood oxygen content, enhances cell viability, and improves human microcirculation. to promote metabolism.
  • the low temperature heat-generating solid wood composite floor of the invention has a moisture content of about 6% on a high-temperature-set floor substrate, which is an insulator.
  • a high-temperature-set floor substrate which is an insulator.
  • carbon fiber conductive paper under normal voltage (220V) the entire surface is The electronic path, the current density is very small, combined with the performance of the floor substrate, no harm to the human body, safe to use.
  • FIG. 1 is a schematic structural view of a heat generating layer of a low-temperature heat-generating solid wood composite floor of the present invention.
  • Fig. 2 is a schematic structural view showing a preferred embodiment of the heat generating layer of the low-temperature heat-generating solid wood composite floor of the present invention.
  • FIG 3 is a schematic structural view of a lower substrate layer of the low-temperature heat-generating solid wood composite floor of the present invention.
  • FIG. 4 is a schematic structural view of a low-temperature heat-generating solid wood composite floor of the present invention.
  • Fig. 5 is a schematic view showing the terminal structure of the low-temperature heat-generating solid wood composite floor of the present invention.
  • Fig. 6 is a structural schematic view showing the connection terminal of the low-temperature heat-generating solid wood composite floor of the present invention.
  • FIG. 7 is a flow chart of a method for preparing a low temperature heat-generating solid wood composite floor of the present invention.
  • Figure 8 is a step-by-step flow diagram of the first step of the preparation method of the low-temperature heat-generating solid wood composite floor of the present invention.
  • Figure 9 is a step-by-step flow diagram of the second step of the preparation method of the low-temperature heat-generating solid wood composite floor of the present invention.
  • Figure 10 is a step-by-step flow diagram of the third step of the method for preparing the low-temperature heat-generating solid wood composite floor of the present invention.
  • Figure 11 is a step-by-step flow diagram of the step 4 of the method for preparing the low-temperature heat-generating solid wood composite floor of the present invention.
  • Fig. 12 is a step-by-step flow chart showing the step 5 of the method for preparing a low-temperature heat-generating solid wood composite floor of the present invention.
  • the low temperature heat-generating solid wood composite floor of the present invention comprises an outer facing layer 1, an upper substrate layer 2, a heat generating layer 3 and a lower substrate layer 4 which are sequentially stacked and hot pressed; After the substrate layer 2, the heat generating layer 3 and the lower substrate layer 4 are hot pressed, a total of 9 layers, the heat generating layer 3 is located at 5-7 layers, preferably the sixth layer, and the upper layer of the heat generating layer 3 is the upper substrate layer 2, and the heat generating layer 3 Below is the lower substrate layer 4, the upper substrate layer 2 is composed of 3 to 5 layers, and the lower substrate layer 4 is composed of 4 to 6 layers; the outer facing layer 1 is disposed on the upper substrate layer 2 by heat pressing. on.
  • the outer facing layer 1, the upper base material layer 2, the heat generating layer 3 and the lower base material layer 4 are respectively elongated; the heat generating layer 3 has a pair of copper poles 31 on the wide sides thereof, and the copper poles 31 and the heat are respectively provided.
  • the layer 3 has the same width, and the polyethylene terephthalate resin 32 may be respectively coated on the front and back sides of the heat generating layer 3, and the polyethylene terephthalate resin 32 is adhered to the heat generating layer 3 by hot pressing. Hehe.
  • a fireproof layer 5 is disposed between the bottom of the upper substrate layer 2 and the heat generating layer 3.
  • a fireproof layer 5 is disposed between the top of the lower substrate layer 4 and the heat generating layer 3.
  • the fireproof layer 5 may be impregnated with melamine paper.
  • the upper substrate layer 2 and the lower substrate layer 4 are respectively heat-pressed onto the surface of the laminate; the bottom of the lower substrate layer 4 is provided with a reflective layer 41.
  • the outer facing layer 1 can be used as a conventional surface layer of the bottom board industry such as oak, teak, merbau, and dragon and phoenix.
  • the heat generating layer 3 may be made of carbon fiber conductive paper, and a plurality of small holes 33 are reserved on the carbon fiber conductive paper for better penetration and adhesion of the polyethylene terephthalate resin.
  • the copper pole 31 on the heat generating layer 3 can be formed by pressing aluminum foil.
  • the length and width of the heat generating layer 3 can be adjusted according to the size requirements of the solid wood composite floor.
  • the resistance value of each carbon fiber conductive paper is about 1500 ⁇ - 4000 ⁇ . .
  • the upper substrate layer 2 is formed by orderly laminating and laminating the multi-layer substrate wood core board, and the substrate wood core board may be one of a willow, poplar, elm or imported wood or Several combinations.
  • the thickness of the aluminum foil is about 0. 05mm - 0. 2mm ; the reflective layer 41 is fixed to the bottom of the lower substrate layer 4 by hot pressing, and the pressure of the hot pressing is about 80 to 150 tons.
  • the hot pressing time is about 5 minutes - 30 minutes.
  • the two ends of the lower substrate layer 4 are respectively provided with a pair of through holes 42 having a diameter range of about 6mm-12mm; the position of the through hole 42 corresponds to the position of the copper pole 31 on the heat generating layer 3.
  • the lower substrate layer 4 is formed by orderly laminating and laminating the layers of the plurality of bottom plates, and the bottom plate may be formed by one or a combination of sorghum, poplar, eucalyptus or imported wood, preferably eucalyptus. .
  • connection terminal 6 and the heat-sensitive component (not shown) are further included; the connection terminal 6 includes a male terminal 61, a female terminal 62, a connection male terminal 65, a connection female terminal 64, and a pair of connecting wires 63,
  • connection male terminal 65 is sized to match the size of the female terminal 64.
  • the male terminal 61 is sized to fit the female terminal 62.
  • the female terminal 62 is disposed in the through hole 42 of the lower substrate layer 4, and the heat generating layer 3
  • the copper pole 31 is in contact with each other, a pair of connecting wires 63 are press-fitted on the male terminal 61, the connecting male terminal 65 is externally connected to the connecting female terminal in the same device, and the connecting female terminal 64 is externally connected to the male terminal in the same device;
  • the block low-temperature heating solid wood composite floor, the connecting terminal 6 is the terminal for connecting each low-temperature heating solid wood composite floor.
  • the heat-sensitive component is placed on the male terminal 61.
  • the maximum temperature of the heat-sensitive component is 55°C-65°C, and the maximum current is 160mA-240mA.
  • the thermal component automatically cuts off the power supply to protect the temperature and current of the low-temperature heating parquet floor.
  • the low-temperature heating solid wood composite floor of the invention further comprises a temperature controller, and the temperature controller comprises a power switch, a temperature control, a time control and a temperature measuring and controlling probe which are respectively connected in parallel on the connecting wire 63.
  • the preparation method of the low-temperature heat-generating solid wood composite floor of the present invention comprises at least the following steps:
  • Step 1 Prepare the upper substrate layer 2 by hot pressing.
  • Step 1. Select the wood core board of the substrate and apply it to the glue; the wood core board of the base material may be selected from one or a combination of willow, poplar, eucalyptus or imported wood, and the glue may be selected. One or more of a polyurethane resin, a urea resin resin or a phenol resin.
  • Step 1. 2 the substrate wood core board after the stepping in step 1.1 is arranged in an orderly manner, and is bonded together, and is composed of 3 to 5 layers. Step 1.
  • Step 1.2 in the step 1.2, the bottom of the substrate wood core board is glued, and the fireproof layer 5 is attached, the fireproof layer 5
  • the melamine impregnated paper can be used, and the length and width of the fireproof layer 5 are matched with the substrate wood core board.
  • Step 1. 4 hot pressing the substrate wood core board prepared in the step 1.3 to obtain the upper substrate layer 2.
  • Step 2 hot pressing to prepare the heat generating layer 3.
  • Step 2. Dip the carbon fiber conductive paper with a polyvinyl alcohol solution having a concentration of 10% to 20%, and the adhesion amount of the polyvinyl alcohol on the carbon fiber conductive paper after the impregnation is 15% to 30%, and then carry out the same. Drying treatment.
  • Step 2. The carbon fiber conductive paper prepared in the step 2.1 is subjected to impregnation resin treatment using a resin of one or a combination of a thermosetting phenol resin and an epoxy resin, preferably an ammoniated methylphenol resin.
  • Step 2. 3 Carbonize the carbon fiber conductive paper prepared in step 2. 2, the carbonization temperature is 200 ° C - 500 ° C, and the carbonization time is 10 minutes - 40 minutes.
  • the length and width of carbon fiber conductive paper can be 850*100 legs, 1200*115 legs or 1400*115 ⁇ .
  • Step 2. 5. Press the copper pole 31 on the pair of wide sides of the cut carbon fiber conductive paper in step 2. 4, and the copper pole 31 is the same width as the carbon fiber conductive paper.
  • Step 2. 6. Hot-press the carbon fiber conductive paper after the copper pole 31 is pressed in step 2. 5; the hot pressing temperature is 150 ° C - 300 ° C, the hot pressing pressure is eOkgA - lOOkgA, and the time is 15 minutes. - 60 minutes.
  • the front and back surfaces of the carbon fiber conductive paper after the copper pole 31 is embossed in step 2.
  • Step 2 The carbon fiber conductive paper prepared in step 2. 6 is subjected to a rubberizing process to obtain a heat generating layer 3; the diameter of the plastic nail is 8 awake - 16 let, and the resistance is 1500 ⁇ - 4000 ⁇ .
  • Step 3 Prepare the lower substrate layer 4 by hot pressing.
  • Step 3. Select the bottom plate of the lower substrate layer 4.
  • the bottom plate may be made of one or a combination of ram, poplar, eucalyptus or imported wood, preferably eucalyptus; and the glue is applied on the reverse side of the bottom plate.
  • Step 3. 2 a reflective layer 41 is attached to the rubberized surface of the bottom plate, and the reflective layer 41 is as long as the bottom plate.
  • Step 3. 3 the hot pressure reflective layer 41 and the bottom plate, the pressure of hot pressing is about 80 tons to 150 tons, and the hot pressing time is 5 minutes to 30 minutes.
  • Step 3. 4 the non-reflective layer of the bottom plate after the hot pressing in step 3.3 is glued.
  • Step 3 5 the glued bottom plate in step 3.4 is arranged in an orderly manner, and is bonded together, from 4 to 6 Layer composition.
  • Step 3. 6. Apply the fireproof layer 5 to the upper end of the bottom plate obtained in the step 3.5.
  • the fireproof layer 5 is preferably melamine impregnated paper, and the fireproof layer 5 is the same width as the bottom plate; and the base layer is thermally pressed. 4.
  • Step 3. 7. The through hole 42 is correspondingly disposed on the lower substrate layer 4 according to the position of the copper pole 31.
  • Step 4 Prepare a low-temperature heating solid wood composite substrate by hot pressing.
  • Step 4. Glue the fire-retardant layer 5 of the upper substrate layer 2 and the lower substrate layer 4 described above.
  • Step 4. 2. The female terminal 62 of the connection terminal 6 is placed in advance in the through hole 42 of the lower substrate layer 4.
  • Step 4. 3. Attach the heat generating layer 3 to the lower substrate layer 4, and confirm that the copper electrode 31 on the heat generating layer 3 is in full contact with the mother terminal 62.
  • Step 4. 4 the upper substrate layer 2 is attached to the heat generating layer 3 and hot pressed, and the hot pressing pressure is 800 to 1200 tons, and the hot pressing time is 10 minutes to 60 minutes.
  • Step 4. 5 the substrate after the hot pressing in step 4. 4 is subjected to a 5-15 day curing treatment to obtain a low-temperature heating solid wood composite floor substrate.
  • Step 5 connecting the connection terminal 6 and the heat-sensitive component on the low-temperature heating solid wood composite floor substrate.
  • Step 5. Press the outer facing layer 1 on the low-temperature heating solid wood composite floor substrate to make the low-temperature heating solid wood composite floor.
  • the outer surface layer 1 can be made of oak, teak, kebab, dragon and phoenix.
  • Step 5. press the connecting wire 63 on the male terminal 61, and press the two connecting wires 63 on one male terminal 63 at a time.
  • Step 5.3 the male terminal 65 and the connecting female terminal 64 are respectively press-fitted on the other end of the two connecting wires 63; the connecting male terminal 65 is connected to the connecting female terminal in the same device, and the connecting female terminal 64 is connected to another device.
  • the connection of the male terminal is used for its circuit connection with other low temperature heat-generating parquet.
  • Step 5. Insert the thermal unit on the male terminal 61.
  • Step 1 Prepare the upper substrate layer 2 by hot pressing.
  • Step 1. Select the combination of willow and eucalyptus into a substrate wood core board and coat it with glue.
  • the glue is urea-formaldehyde resin glue.
  • Step 1. 2 the substrate wood core board after the stepping in step 1.1 is arranged in an orderly manner, and is bonded together and composed of three layers.
  • Step 1. 3 in the step 1.2, the bottom of the substrate wood core board is coated with melamine impregnated paper as the fireproof layer 5, melamine impregnated paper The length and width of the base are matched to the base wood core board.
  • Step 1. 4 hot pressing the substrate wood core board prepared in the step 1.3 to obtain the upper substrate layer 2.
  • Step 2 hot pressing to prepare the heat generating layer 3.
  • Step 2. Dip the carbon fiber conductive paper with a polyvinyl alcohol solution having a concentration of 10%. After impregnation, the adhesion of the polyvinyl alcohol to the carbon fiber conductive paper is 20%, and then drying.
  • Step 2. 2 the carbon fiber conductive paper prepared in the step 2.1 is subjected to impregnation resin treatment using an ammoniated methyl phenol resin.
  • Step 2. 3 carbonization treatment of the carbon fiber conductive paper prepared in the step 2.2, the temperature of the carbonization treatment is 250 ° C, and the carbonization treatment time is 10 minutes.
  • Step 2. 4 according to the actual needs of the carbon fiber conductive paper prepared in step 2.3, the carbon fiber conductive paper length and width can be 850 * 100mra 1200 * 115 or 1400 * 115 legs.
  • Step 2. 5 the copper poles 31 are respectively pressed on a pair of wide sides of the cut carbon fiber conductive paper in the step 2. 4, and the copper poles 31 are the same width as the carbon fiber conductive paper.
  • Step 2. 6. Apply a layer of polyethylene terephthalate resin 32 to the front and back sides of the carbon fiber conductive paper after the copper pole 31 is pressed in step 2.5, and then hot press; the hot pressing temperature is 200°. C, the hot pressing pressure is 80 kg/ cm 2 , and the time is 15 minutes.
  • Step 3 Prepare the lower substrate layer 4 by hot pressing.
  • Step 3. Select the coffin as the bottom plate of the lower substrate layer 4 and apply glue on the reverse side of the bottom plate.
  • the aluminum foil is applied as a reflective layer 41 on the rubberized surface of the bottom plate, the thickness of the aluminum foil is 0.1 mm, and the reflective layer 41 is as long as the bottom plate.
  • Step 3. 3. Heat-reflecting layer 41 and bottom plate, the pressure of hot pressing is about 100 tons, and the hot pressing time is 10 minutes.
  • Step 3. 4. Glue the non-aluminum foil surface of the bottom plate after hot pressing in step 3. 3.
  • Step 3. 5 the glued bottom plate in step 3.4 is arranged in an orderly manner, and is bonded together and composed of 6 layers.
  • Step 3 Apply the melamine impregnated paper to the upper end of the bottom plate prepared in the steps 3 and 5, and the melamine impregnated paper is the same width as the bottom plate; and heat-press the lower substrate layer 4.
  • Step 3. 7 A through hole 42 having a hole diameter of 6 mm is provided on the lower base material layer 4 in accordance with the position of the copper pole 31.
  • Step 4 Prepare a low-temperature heating solid wood composite substrate by hot pressing.
  • Step 4. 1 Glue the melamine-impregnated paper surface of the upper substrate layer 2 and the lower substrate layer 4 described above.
  • Step 4. 2 the female terminal 62 of the connection terminal 6 is placed in advance in the through hole 42 of the lower substrate layer 4.
  • Step 4. 3 the heat generating layer 3 is attached to the lower substrate layer 4, and it is confirmed that the copper electrode 31 on the heat generating layer 3 is in full contact with the female terminal 62.
  • Step 4. 4 the upper substrate layer 2 was attached to the heat generating layer 3 and hot pressed, and the hot pressing pressure was 800 tons, and the hot pressing time was 15 minutes.
  • Step 4. 5 the substrate after the hot pressing in step 4.4 is subjected to a 10-day health treatment to obtain a low-temperature heating solid wood composite floor substrate.
  • Step 5 connecting the connection terminal 6 and the heat-sensitive component on the low-temperature heating solid wood composite floor substrate.
  • Step 5. 1 Press the outer facing layer 1 on the low-temperature heating solid wood composite floor substrate to prepare the low-temperature heating solid wood composite floor.
  • the outer surface layer 1 can be made of oak, teak, kebab, dragon and phoenix.
  • Step 5. 2 the connecting wire 63 is press-fitted on the male terminal 61, and one male terminal 61 is pressed together with the two connecting wires 63 at one time; in step 5.3, the other connecting ends of the two connecting wires 63 are respectively pressed and connected at a time.
  • Step 5 Insert the thermal module on the male terminal 61.
  • the thermal module can carry a maximum temperature of 65 ° C and a maximum current of 240 mA.
  • Example 2 Example 1 was modified by the following method:
  • Step 1 Prepare the upper substrate layer 2 by hot pressing.
  • Step 1. Select the combination of willow and imported wood into a wood core board of the substrate and apply it to the glue.
  • the glue is made of polyurethane resin.
  • Steps 1. 2 the substrate wood core board after the stepping in step 1. 1 is arranged in an orderly and horizontally interlaced manner, bonded together, and composed of 4 layers.
  • Step 1. 3. In step 1. 2, the bottom of the substrate wood core board is coated with melamine impregnated paper as the fireproof layer. 5 The length and width of the melamine impregnated paper are matched with the substrate wood core board.
  • Step 1. 4 hot pressing the substrate wood core board prepared in the step 1. 3 to obtain the upper substrate layer 2.
  • Step 2 hot pressing to prepare the heat generating layer 3.
  • Step 2. Dip the carbon fiber conductive paper with a 15% polyvinyl alcohol solution. The amount of polyvinyl alcohol adhered to the carbon fiber conductive paper after impregnation was 25%, and then it was dried.
  • Step 2. 2 the carbon fiber conductive paper prepared in the step 2.1 is subjected to impregnation resin treatment using an ammoniated methyl phenol resin.
  • Step 2. 3 carbonization treatment of the carbon fiber conductive paper prepared in the step 2. 2, the carbonization treatment temperature is 300 ° C, and the carbonization treatment time is 15 minutes.
  • Step 2. 4 according to actual needs, the carbon fiber conductive paper prepared in step 2.3 is cut, the length and width of the carbon fiber conductive paper may be 850*100 legs, 1200*115 earned or 1400*115 awake.
  • Step 2. 5 the copper poles 31 are respectively pressed on a pair of wide sides of the cut carbon fiber conductive paper in the step 2. 4, and the copper poles 31 are the same width as the carbon fiber conductive paper.
  • Step 3 Prepare the lower substrate layer 4 by hot pressing.
  • Step 3. Select the willow as the bottom plate of the lower substrate layer 4; and apply glue on the reverse side of the bottom plate.
  • Step 3. 2 an aluminum foil having a thickness of 0.1 mm is attached as a reflective layer 41 on the rubberized surface of the bottom plate, and the reflective layer 41 is as long as the bottom plate.
  • Step 3. 3. Heat-reflecting layer 41 and bottom plate, the pressure of hot pressing is about 100 tons, and the hot pressing time is 10 minutes.
  • Step 3. 4 Glue the non-aluminum foil surface of the bottom plate after hot pressing in step 3. 3.
  • Step 3. 5 the glued bottom plate in step 3.4 is arranged in an orderly manner, and is bonded together and composed of 5 layers.
  • Step 3. 7 A through hole 42 having a hole diameter of 10 mm is provided on the lower base material layer 4 in accordance with the position of the copper pole 31.
  • Step 4 Prepare a low-temperature heating solid wood composite substrate by hot pressing.
  • Step 4. Glue the melamine-impregnated paper surface of the upper substrate layer 2 and the lower substrate layer 4 described above.
  • Step 4. 2 the female terminal 62 of the connection terminal 6 is placed in advance in the through hole 42 of the lower substrate layer 4.
  • Step 4. 3 the heat generating layer 3 is attached to the lower substrate layer 4, and it is confirmed that the copper electrode 31 on the heat generating layer 3 is in full contact with the female terminal 62.
  • Step 4. 4 the upper substrate layer 2 was attached to the heat generating layer 3 and hot pressed, the hot pressing pressure was 1000 tons, and the hot pressing time was 10 minutes.
  • Step 4. 5 the substrate after the hot pressing in step 4.4 is subjected to 15 days of curing treatment to obtain a low-temperature heating solid wood composite floor substrate.
  • Step 5 providing a connection terminal 6 and a heat-sensitive component on the low-temperature heating solid wood composite floor substrate.
  • Step 5. Press the outer facing layer 1 on the low-temperature heating solid wood composite floor substrate to prepare a low-temperature heating solid wood composite floor.
  • the outer surface layer 1 may be made of oak, teak, kebab, dragon and phoenix.
  • Step 5. 2 the connecting wire 63 is press-fitted on the male terminal 61, and the two connecting wires 63 are pressed together on one male terminal 61 at a time.
  • Step 5.3 the male terminal 65 and the connecting female terminal 64 are respectively press-fitted on the other end of the two connecting wires 63; the connecting male terminal 65 is connected to the connecting female terminal in the same device, and the connecting female terminal 64 is connected to another device.
  • the connection of the male terminal is used for its circuit connection with other low temperature heat-generating parquet.
  • Step 5. 4. Insert the thermal module on the male terminal 61.
  • the maximum temperature that the thermal module can carry is 65 ° C, and the maximum current is 240 mA.
  • the maximum temperature of the low-temperature heating solid wood composite floor of the invention is 50 ° C - 55 ° C, and when it is continuously heated, it belongs to a low temperature state, and does not cause deformation, cracking and scorching of the wooden floor;
  • Carbon fiber conductive paper, carbon fiber conductive paper has a thermal conversion efficiency of 97%, which is more energy efficient than traditional materials.
  • the heat transfer of carbon fiber conductive paper is mainly based on far-infrared radiation, and also releases far-infrared light waves of 8 ⁇ m - 18 ⁇ m, activates water molecules in the human body, increases blood oxygen content, enhances cell viability, and improves human microcirculation.
  • the high temperature setting of the floor substrate of the present invention has a moisture content of about 6%, which is an insulator.
  • the entire surface is an electronic path, the current density is extremely small, and it combines with the performance of the floor substrate, no harm to the human body, safe to use.

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Abstract

一种低温发热实木复合地板，包括：外饰面层（1）、上基材层（2）、发热层（3）及下基材层（4）叠放并依次热压构成；上基材层（2）、发热层（3）及下基材层（4）热压后共9层，发热层（3）位于第5——7层，发热层（3）的上方为上基材层（2），发热层（3）的下方为下基材层（4），外饰面层（1）通过热压设置在上基材层（2）上；该低温发热实木复合地板能降低地板单位面积的设计功率，使地板表面的最高温度在50°C——55°C，解决了地板变形开裂等问题，提高了热量的辐射和传导。

Description

低温发热实木复合地板及其制备方法
技术领域
本发明涉及一种实木复合地板， 具体涉及一种低温发热实木复合地板及 其制备的方法。
背景技术
目前， 现有的发热地板的发热温度较高， 容易损坏地板并引起火灾等事 故， 且绝缘、 控温、 使用寿命、 稳定性等方面均存在不足。
中国专利公布号 CN101600270公开了一种导电发热材料及包含该导电发 热材料的地板和制造方法， 该地板中的发热材料主要石墨和导电炭黑制备成 导电发热涂料， 然后将导电涂料以印刷的方式附着在木地板基材上。 由于其 发热材料采用石墨和导电涂料，而石墨和导电涂料制成的发热材料能耗比大， 故使得地板表面温度过高， 经过实际测试， 测试数据显示其最高表面温度可 达到 80'C， 容易使木地板产生变形、 开裂和烧焦， 在建筑中安装的地板一旦 出现这些情况， 将给消费者带来经济损失， 甚至需要重新安装地板， 严重的 还会导致安全事故的发生。
鉴于上述问题，本发明公开了一种低温发热实木复合地板及其制备方法。 其具有如下文所述之技术特征， 以解决现有的问题。
发明内容
本发明的目的是提供一种低温发热实木复合地板及其制备方法， 它能降 低地板单位面积的设计功率， 使地板表面的最高温度在 50°C- 55°C， 解决了 地板变形开裂等问题， 提高了热量的辐射和传导。
本发明低温发热实木复合地板及其制备方法的目的是通过以下技术方案 实现的： 一种低温发热实木复合地板， 包括： 外饰面层、 上基材层、 发热层 及下基材层依次叠放并热压构成。
所述的上基材层、 发热层及下基材层热压后共 9层， 所述的发热层位于 5-7层， 所述的发热层的上方为上基材层， 所述的发热层的下方为下基材层， 所述的上基材层由 3至 5层构成， 所述的下基材层由 4至 6层构成； 所述的 外饰面层通过热压设置在上基材层上。
所述的外饰面层、 上基材层、 发热层及下基材层分别呈长条状； 所述的 发热层的两端宽边上分别设有一对铜极， 且铜极与发热层同宽； 所述的上基 材层底部与发热层、 下基材层顶部与发热层之间分别设有一层防火层； 所述 的下基材层的底部设有一层反射层。
所述的上基材层由多层基材木芯板纵横交错分层排列并粘合而成， 所述 的下基材层由多层底板纵横交错分层排列并粘合而成。
上述的低温发热实木复合地板， 其中， 所述的发热层是碳纤维导电纸， 且在碳纤维导电纸上设有多个小孔； 所述的铜极由铜铝箔压扎而成。
上述的低温发热实木复合地板， 其中， 所述的下基材层的两端分别设有 一对通孔， 且通孔的位置与发热层上铜极的位置相对应。
上述的低温发热实木复合地板， 其中： 还包括连接端子及热敏组件； 所述的连接端子包括公端子、 母端子， 连接公端子、 连接母端子及一对 连接导线， 所述的连接公端子与连接母端子大小相适配， 所述的公端子与母 端子大小相适配， 母端子设置在下基材层的通孔中， 与发热层的铜极接触， 一对连接导线压合在公端子上，连接公端子外接另一同装置中的连接母端子， 连接母端子外接另一同装置中的公端子；
热敏组件设置在公端子上。
上述的低温发热实木复合地板的制备方法， 其中： 该方法至少包括以下 步骤：
步骤 1， 热压制备上基材层； 步骤 2， 热压制备发热层； 步骤 3， 热压制 备下基材层； 步骤 4， 热压制备低温发热实木复合地板基材； 步骤 5， 在低温 发热实木复合地板基材上设置连接端子及热敏组件。 上述的低温发热实木复合地板的制备方法， 其中： 所述的步骤 1中还包 括：
步骤 1. 1， 选取基材木芯板并对其进行涂胶； 步骤 1. 2,将步骤 1. 1中涂 胶后的基材木芯板纵横交错分层排列， 粘合在一起， 由 3至 5层组成； 步骤 1. 3， 在步骤 1. 2中基材木芯板的底部进行涂胶， 并贴上防火层， 防火层的长 宽与基材木芯板相适配； 步骤 1. 4， 对步骤 1. 3中制得的基材木芯板进行热 压制得上基材层。
上述的低温发热实木复合地板的制备方法， 其中： 所述的步骤 2中还包 括：
步骤 2. 1， 用浓度为 10%- 20%的聚乙烯醇溶液对碳纤维导电纸做浸渍处 理， 浸渍后聚乙烯醇在碳纤维导电纸上的附着量为 15%- 30%， 再对其进行干 燥处理； 步骤 2. 2, 用热固性酚醛树脂、 环氧树脂中的一种或几种组合而成 的树脂对步骤 2. 1中制得的碳纤维导电纸进行浸渍树脂处理； 步骤 2. 3， 对 步骤 2. 2中制得的碳纤维导电纸进行碳化处理； 步骤 2. 4， 对步骤 2. 3中制 得的碳纤维导电纸进行剪裁； 步骤 2. 5， 在步骤 2. 4中剪裁后的碳纤维导电 纸的一对宽边上分别压扎铜极， 铜极与碳纤维导电纸同宽； 步骤 2. 6， 将步 骤 2. 5中压扎铜极后的碳纤维导电纸其进行热压； 步骤 2. 7， 将步骤 2. 6中 制得的碳纤维导电纸进行打胶钉制得发热层。
上述的低温发热实木复合地板的制备方法， 其中： 所述的步骤 3中还包 括：
步骤 3. 1， 选取下基材层的底板， 并在底板的反面涂胶； 步骤 3. 2， 在底 板的涂胶面贴上反射层， 反射层与底板等长； 步骤 3. 3， 热压反射层及底板; 步骤 3. 4， 对步骤 3. 3中热压后的底板的非反射层面进行涂胶； 步骤 3. 5，将 步骤 3. 4中涂胶后的底板纵横交错分层排列，粘合在一起， 由 4至 6层组成; 步骤 3. 6， 对步骤 3. 5中制得的底板上端涂胶后贴覆防火层， 防火层与底板 同宽； 并进行热压制得下基材层； 步骤 3. 7， 根据铜极的位置在下基材层上 对应设置通孔。
上述的低温发热实木复合地板的制备方法， 其中： 所述的步骤 4中还包 括：
步骤 4. 1，对上述上基材层及下基材层的有防火层面进行涂胶;步骤 4. 2, 将连接端子中的母端子放置在下基材层的通孔中； 步骤 4. 3， 将发热层贴在 下基材层上， 发热层上的铜极与母端子接触； 步骤 4. 4， 将上基材层贴覆在 发热层上并进行热压； 步骤 4. 5， 将步骤 4. 4中热压完成后的基材做 5-15天 的养生处理， 制得低温发热实木复合地板基材。
上述的低温发热实木复合地板的制备方法， 其中， 所述的步骤 5中还包 括：
步骤 5. 1， 将外饰面层压制在低温发热实木复合地板基材上制得低温发 热实木复合地板； 步骤 5. 2， 在公端子上压合连接导线， 一个公端子上一次 压合两根连接导线； 步骤 5. 3， 在两根连接导线另外一端上分别一次压合连 接公端子和连接母端子； 步骤 5. 4， 在公端子上插入热敏组件。
本发明低温发热实木复合地板及其制备方法由于采用了上述方案， 使之 与现有技术相比， 具有以下的优点和积极效果：
1、 本发明低温发热实木复合地板的最高温度为 50°C- 55°C， 其持续发热 时， 属于低温状态， 不会使木地板产生变形、 开裂和烧焦。
2、本发明低温发热实木复合地板采用了碳纤维导电纸，碳纤维导电纸的 热转换效率可达 97%， 比传统材料节能。 碳纤维导电纸热量传递主要以远红 外辐射为主，而且还释放出 8 μ m-18 μ m的远红外线光波，活化人体内水分子， 提高血液含氧量， 增强细胞活力， 改善人体微循环， 促进新陈代谢。
3、 本发明低温发热实木复合地板经过高温定型的地板基材含水率在 6% 左右， 其为绝缘体。 在加上碳纤维导电纸在一般电压下 （220V) 整个面都是 电子通路， 电流密度极小， 其与地板基材性能相结合， 对人体毫无伤害， 使 用安全。
以下， 将通过具体的实施例做进一步的说明， 然而实施例仅是本发明可 选实施方式的举例， 其所公幵的特征仅用于说明及阐述本发明的技术方案， 并不用于限定本发明的保护范围。
附图说明
图 1是本发明低温发热实木复合地板的发热层的结构示意图。
图 2 是本发明低温发热实木复合地板的发热层的优选方式的结构示意 图。
图 3是本发明低温发热实木复合地板的下基材层的结构示意图。
图 4是本发明低温发热实木复合地板的结构示意图。
图 5是本发明低温发热实木复合地板的端子结构示意图。
图 6是本发明低温发热实木复合地板的连接端子结构示意图。
图 7是本发明低温发热实木复合地板的制备方法的方法流程图。
图 8是本发明低温发热实木复合地板的制备方法的步骤 1的分步骤流程 图。
图 9是本发明低温发热实木复合地板的制备方法的步骤 2的分步骤流程 图。
图 10是本发明低温发热实木复合地板的制备方法的步骤 3的分步骤流程 图。
图 11是本发明低温发热实木复合地板的制备方法的步骤 4的分步骤流程 图。
图 12是本发明低温发热实木复合地板的制备方法的步骤 5的分步骤流程 图。
具体实施方式 根据本发明的权利要求和发明内容所公开的内容， 本发明的技术方案具 体如下所述。
请参见附图 1-附图 6所示，本发明低温发热实木复合地板包括外饰面层 1、 上基材层 2、 发热层 3及下基材层 4依次叠放并热压构成； 上基材层 2、 发热层 3及下基材层 4热压后共 9层， 发热层 3位于 5- 7层， 优选第 6层， 发热层 3的上方为上基材层 2, 发热层 3的下方为下基材层 4， 上基材层 2 由 3至 5层构成， 下基材层 4由 4至 6层构成； 外饰面层 1通过热压的方式 设置在上基材层 2上。外饰面层 1、上基材层 2、发热层 3及下基材层 4分别 呈长条状； 发热层 3的两端宽边上分别设有一对铜极 31， 且铜极 31与发热 层 3同宽，可在发热层 3的正反两面分别覆有聚对苯二甲酸乙二醇酯树脂 32， 聚对苯二甲酸乙二醇酯树脂 32通过热压的方式与发热层 3粘合。上基材层 2 底部与发热层 3之间设有一层防火层 5， 下基材层 4顶部与发热层 3之间设 有一层防火层 5， 防火层 5可采用三聚氰胺浸渍纸， 在热压上基材层 2和下 基材层 4时分别热压至该层板面上； 下基材层 4的底部设有一层反射层 41。
外饰面层 1可采用橡木、柚木、 印茄木、龙凤檀等底板行业的常规面层。 发热层 3可采用碳纤维导电纸， 且在碳纤维导电纸上预留多个小孔 33， 用于使聚对苯二甲酸乙二醇酯树脂更好的渗透和粘合。发热层 3上的铜极 31 可采用铜铝箔压扎而成， 发热层 3的长宽尺寸可以根据实木复合地板的尺寸 要求进行调节， 每片碳纤维导电纸的电阻值约为 1500 Ω -4000 Ω。
上基材层 2由多层基材木芯板有序的纵横交错分层排列并粘合而成， 基 材木芯板可选用柳桉、 杨木、 榉木或进口杂木中的一种或几种组合而成。
反射层 41可采用铝箔， 铝箔的厚度范围大约为 0. 05mm- 0. 2mm; 反射层 41通过热压的方式固定在下基材层 4的底部， 热压的压力大约为 80吨 -150 吨， 热压时间大约为 5分钟- 30分钟。
下基材层 4 的两端分别设有一对通孔 42， 通孔 42 的孔径范围约为 6mm-12mm; 通孔 42的位置与发热层 3上铜极 31的位置相对应。 下基材层 4 由多层底板有序的纵横交错分层排列并粘合而成， 底板可采用柳桉、 杨木、 榉木或进口杂木中的一种或几种组合而成， 优选榉木。
还包括连接端子 6及热敏组件 （图中未示出） ； 所述的连接端子 6包括 公端子 61、 母端子 62， 连接公端子 65、 连接母端子 64及一对连接导线 63， 所述的连接公端子 65与连接母端子 64大小相适配,所述的公端子 61与母端 子 62大小相适配， 母端子 62设置在下基材层 4的通孔 42中， 与发热层 3 的铜极 31接触， 一对连接导线 63压合在公端子 61上， 连接公端子 65外接 另一同装置中的连接母端子，连接母端子 64外接另一同装置中的公端子； 由 此串联起多块低温发热实木复合地板， 连接端子 6即为每块低温发热实木复 合地板之间点连接的端子。热敏组件套置在公端子 61上，热敏组件承载的最 高温度为 55°C-65°C，承载的最高电流为 160mA-240mA,当低温发热实木复合 地板基材的最高温度和电流达到最高承载值时， 热敏组件会自动切断电源对 低温发热实木复合地板基材的温度和电流起到保护作用。
本发明低温发热实木复合地板还包括温度控制器， 温度控制器包括分别 并联在连接导线 63上的电源开关、温度控制、时间控制和温度测控探头等组 成。
请参见附图 7-附图 12所示， 本发明低温发热实木复合地板的制备方法 至少包括如下步骤：
步骤 1， 热压制备上基材层 2。
步骤 1. 1， 选取基材木芯板并对其进行涂胶； 基材木芯板可选用柳桉、 杨木、 榉木或进口杂木中的一种或几种组合而成， 胶水可选用聚氨酯树脂、 脲醛树脂胶或酚醛树脂中的一种或几种。 步骤 1. 2， 将步骤 1. 1中涂胶后的 基材木芯板有序地纵横交错分层排列， 粘合在一起， 由 3至 5层组成。 步骤 1. 3， 在步骤 1. 2中基材木芯板的底部进行涂胶， 并贴上防火层 5， 防火层 5 可采用三聚氰胺浸渍纸， 防火层 5的长宽与基材木芯板相适配。 步骤 1. 4， 对步骤 1. 3中制得的基材木芯板进行热压制得上基材层 2。
步骤 2， 热压制备发热层 3。
步骤 2. 1，采用浓度为 10%- 20%的聚乙烯醇溶液对碳纤维导电纸做浸渍处 理， 浸渍后聚乙烯醇在碳纤维导电纸上的附着量为 15%- 30%, 然后对其进行 干燥处理。 步骤 2. 2， 采用热固性酚醛树脂、 环氧树脂中的一种或几种组合 而成的树脂对步骤 2. 1中制得的碳纤维导电纸进行浸渍树脂处理， 优选氨化 甲基酚醛树脂。步骤 2. 3， 对步骤 2. 2中制得的碳纤维导电纸进行碳化处理， 碳化处理的温度为 200°C- 500°C， 碳化处理的时间为 10分钟 -40分钟。 步骤 2. 4，根据实际需要对步骤 2. 3中制得的碳纤维导电纸进行剪裁，碳纤维导电 纸长宽可以是 850*100腿、 1200*115腿或 1400*115誦等。 步骤 2. 5， 在步骤 2. 4中剪裁后的碳纤维导电纸的一对宽边上分别压扎铜极 31，铜极 31与碳纤 维导电纸同宽。 步骤 2. 6， 将步骤 2. 5中压扎铜极 31后的碳纤维导电纸其进 行热压； 热压温度为 150°C- 300°C， 热压压力为 eOkgA -lOOkgA , 时间为 15分钟- 60分钟。优选的，在步骤 2. 5中压扎铜极 31后的碳纤维导电纸的正 反面各覆一层聚对苯二甲酸乙二醇酯树脂 32, 再进行热压。 步骤 2. 7， 将步 骤 2. 6中制得的碳纤维导电纸进行打胶钉处理制得发热层 3; 胶钉的直径为 8醒- 16讓， 阻值为 1500 Ω -4000 Ω。
步骤 3， 热压制备下基材层 4。
步骤 3. 1， 选取下基材层 4的底板， 底板可采用柳桉、 杨木、 榉木或进 口杂木中的一种或几种组合而成，优选榉木；并在底板的反面涂胶。步骤 3. 2， 在底板的涂胶面贴上反射层 41，反射层 41与底板等长。步骤 3. 3， 热压反射 层 41及底板，热压的压力大约为 80吨 -150吨，热压时间为 5分钟 -30分钟。 步骤 3. 4，对步骤 3. 3中热压后的底板的非反射层面进行涂胶。步骤 3. 5，将 步骤 3. 4中涂胶后的底板有序地纵横交错分层排列， 粘合在一起， 由 4至 6 层组成。步骤 3. 6,对步骤 3. 5中制得的底板上端涂胶后贴覆防火层 5， 防火 层 5优选三聚氰胺浸渍纸， 防火层 5与底板同宽； 并进行热压制得下基材层 4。 步骤 3. 7， 根据铜极 31的位置在下基材层 4上对应设置通孔 42。
步骤 4， 热压制备低温发热实木复合地板基材。
步骤 4. 1， 对上述上基材层 2及下基材层 4的有防火层 5面进行涂胶。 步骤 4. 2，将连接端子 6中的母端子 62预先放置在下基材层 4的通孔 42中。 步骤 4. 3， 将发热层 3贴在下基材层 4上， 并确认发热层 3上的铜极 31与母 端子 62充分接触。 步骤 4. 4， 将上基材层 2贴在发热层 3上并进行热压， 热 压压力为 800吨- 1200吨， 热压时间为 10分钟- 60分钟。 步骤 4. 5, 将步骤 4. 4中热压完成后的基材做 5-15天的养生处理，制得到低温发热实木复合地 板基材。
步骤 5， 在低温发热实木复合地板基材上设置连接端子 6及热敏组件。 步骤 5. 1， 将外饰面层 1压制在低温发热实木复合地板基材上制得低温 发热实木复合地板， 外饰面层 1可以采用橡木、 柚木、 引茄木、 龙凤檀等。 步骤 5. 2， 在公端子 61上压合连接导线 63， 一个公端子 63上一次性须压合 两根连接导线 63。步骤 5. 3,在两根连接导线 63另外一端上分别一次压合连 接公端子 65和连接母端子 64;连接公端子 65外接另一同装置中的连接母端 子，连接母端子 64外接另一同装置中的连接公端子，用于其与其他低温发热 实木复合地板间的电路连接。 步骤 5. 4， 在公端子 61上插入热敏组件。
实施例 1 :
步骤 1， 热压制备上基材层 2。
步骤 1. 1， 选取柳桉和榉木组合成基材木芯板并对其进行涂胶， 胶水采 用脲醛树脂胶。 步骤 1. 2， 将步骤 1. 1中涂胶后的基材木芯板有序地纵横交 错分层排列， 粘合在一起， 由 3层组成。 步骤 1. 3， 在步骤 1. 2中基材木芯 板的底部进行涂胶， 并贴上三聚氰胺浸渍纸作为防火层 5， 三聚氰胺浸渍纸 的长宽与基材木芯板相适配。 步骤 1. 4， 对步骤 1. 3中制得的基材木芯板进 行热压制得上基材层 2。
步骤 2， 热压制备发热层 3。
步骤 2. 1， 采用浓度为 10%的聚乙烯醇溶液对碳纤维导电纸做浸渍处理， 浸渍后聚乙烯醇在碳纤维导电纸上的附着量为 20%，然后对其进行干燥处理。 步骤 2. 2， 采用氨化甲基酚醛树脂对步骤 2. 1中制得的碳纤维导电纸进行浸 渍树脂处理。 步骤 2. 3， 对步骤 2. 2中制得的碳纤维导电纸进行碳化处理， 碳化处理的温度为 250°C， 碳化处理的时间为 10分钟。 步骤 2. 4， 根据实际 需要对步骤 2. 3中制得的碳纤维导电纸进行剪裁， 碳纤维导电纸长宽可以是 850*100mra 1200*115讓或 1400*115腿等。 步骤 2. 5， 在步骤 2. 4中剪裁后 的碳纤维导电纸的一对宽边上分别压扎铜极 31， 铜极 31与碳纤维导电纸同 宽。 步骤 2. 6， 将步骤 2. 5中压扎铜极 31后的碳纤维导电纸的正反面各覆一 层聚对苯二甲酸乙二醇酯树脂 32后进行热压； 热压温度为 200°C， 热压压力 为 80kg/cm 2， 时间为 15分钟。
步骤 3， 热压制备下基材层 4。
步骤 3. 1， 选取榉木作为下基材层 4的底板， 并在底板的反面涂胶。 步 骤 3. 2， 在底板的涂胶面贴上铝箔作为反射层 41， 铝箔的厚度为 0. lmm, 反 射层 41与底板等长。 步骤 3. 3， 热压反射层 41及底板， 热压的压力大约为 100吨， 热压时间为 10分钟。 步骤 3. 4， 对步骤 3. 3中热压后的底板的非铝 箔面进行涂胶。 步骤 3. 5， 将步骤 3. 4中涂胶后的底板有序地纵横交错分层 排列， 粘合在一起， 由 6层组成。 步骤 3. 6， 对步骤 3, 5中制得的底板上端 涂胶后贴覆三聚氰胺浸渍纸， 三聚氰胺浸渍纸与底板同宽； 并进行热压制得 下基材层 4。 步骤 3. 7， 根据铜极 31的位置在下基材层 4上对应设置孔径为 6mm的通孔 42。
步骤 4， 热压制备低温发热实木复合地板基材。 步骤 4. 1， 对上述上基材层 2及下基材层 4的有三聚氰胺浸渍纸面进行 涂胶。步骤 4. 2， 将连接端子 6中的母端子 62预先放置在下基材层 4的通孔 42中。 步骤 4. 3， 将发热层 3贴在下基材层 4上， 并确认发热层 3上的铜极 31与母端子 62充分接触。步骤 4. 4,将上基材层 2贴在发热层 3上并进行热 压， 热压压力为 800吨， 热压时间为 15分钟。 步骤 4. 5， 将步骤 4. 4中热压 完成后的基材做 10天的养生处理， 制得到低温发热实木复合地板基材。
步骤 5， 在低温发热实木复合地板基材上设置连接端子 6及热敏组件。 步骤 5. 1 , 将外饰面层 1压制在低温发热实木复合地板基材上制得低温 发热实木复合地板， 外饰面层 1可以采用橡木、 柚木、 引茄木、 龙凤檀等。 步骤 5. 2， 在公端子 61上压合连接导线 63， 一个公端子 61上一次压合两根 连接导线 63;步骤 5. 3,在两根连接导线 63另外一端上分别一次压合连接公 端子 65和连接母端子 64; 连接公端子 65外接另一同装置中的连接母端子， 连接母端子 64外接另一同装置中的连接公端子，用于其与其他低温发热实木 复合地板间的电路连接。 步骤 5. 4， 在公端子 61上插入热敏组件， 热敏组件 能承载的最高温度为 65°C， 最高电流为 240mA。
实施例 2， 采用以下方法改进实施例 1 :
步骤 1， 热压制备上基材层 2。
步骤 1. 1， 选取柳桉和进口杂木组合成基材木芯板并对其进行涂胶， 胶 水采用聚氨酯树脂。 步骤 1. 2， 将步骤 1. 1中涂胶后的基材木芯板有序地纵 横交错分层排列， 粘合在一起， 由 4层组成。 步骤 1. 3， 在步骤 1. 2中基材 木芯板的底部进行涂胶， 并贴上三聚氰胺浸渍纸作为防火层 5， 三聚氰胺浸 渍纸的长宽与基材木芯板相适配。 步骤 1. 4， 对步骤 1. 3中制得的基材木芯 板进行热压制得上基材层 2。
步骤 2, 热压制备发热层 3。
步骤 2. 1， 采用浓度为 15%的聚乙烯醇溶液对碳纤维导电纸做浸渍处理， 浸渍后聚乙烯醇在碳纤维导电纸上的附着量为 25%，然后对其进行干燥处理。 步骤 2. 2， 采用氨化甲基酚醛树脂对步骤 2. 1中制得的碳纤维导电纸进行浸 渍树脂处理。 步骤 2. 3， 对步骤 2. 2中制得的碳纤维导电纸进行碳化处理， 碳化处理的温度为 300 °C , 碳化处理的时间为 15分钟。 步骤 2. 4， 根据实际 需要对步骤 2. 3中制得的碳纤维导电纸进行剪裁， 碳纤维导电纸长宽可以是 850*100腿、 1200*115賺或 1400*115醒等。 步骤 2. 5， 在步骤 2. 4中剪裁后 的碳纤维导电纸的一对宽边上分别压扎铜极 31， 铜极 31与碳纤维导电纸同 宽。
步骤 3， 热压制备下基材层 4。
步骤 3. 1， 选取柳桉作为下基材层 4的底板； 并在底板的反面涂胶。 步 骤 3. 2， 在底板的涂胶面贴上厚度为 0. 1mm的铝箔作为反射层 41， 反射层 41 与底板等长。 步骤 3. 3， 热压反射层 41及底板， 热压的压力大约为 100吨， 热压时间为 10分钟。步骤 3. 4， 对步骤 3. 3中热压后的底板的非铝箔面进行 涂胶。 步骤 3. 5， 将步骤 3. 4中涂胶后的底板有序地纵横交错分层排列， 粘 合在一起， 由 5层组成。 步骤 3. 6， 对步骤 3. 5中制得的底板上端涂胶后贴 覆三聚氰胺浸渍纸作为防火层 5， 防火层 5与底板同宽； 并进行热压制得下 基材层 4。步骤 3. 7，根据铜极 31的位置在下基材层 4上对应设置孔径为 10mm 的通孔 42。
步骤 4， 热压制备低温发热实木复合地板基材。
步骤 4. 1， 对上述上基材层 2及下基材层 4的有三聚氰胺浸渍纸面进行 涂胶。 步骤 4. 2， 将连接端子 6中的母端子 62预先放置在下基材层 4的通孔 42中。 步骤 4. 3， 将发热层 3贴在下基材层 4上， 并确认发热层 3上的铜极 31与母端子 62充分接触。步骤 4. 4，将上基材层 2贴在发热层 3上并进行热 压， 热压压力为 1000吨， 热压时间为 10分钟。 步骤 4. 5， 将步骤 4. 4中热 压完成后的基材做 15天的养生处理， 制得到低温发热实木复合地板基材。 步骤 5， 在低温发热实木复合地板基材上设置连接端子 6及热敏组件。 步骤 5. 1， 将外饰面层 1压制在低温发热实木复合地板基材上制得低温 发热实木复合地板， 外饰面层 1可以采用橡木、 柚木、 引茄木、 龙凤檀等。 步骤 5. 2， 在公端子 61上压合连接导线 63， 一个公端子 61上一次性须压合 两根连接导线 63。步骤 5. 3，在两根连接导线 63另外一端上分别一次压合连 接公端子 65和连接母端子 64;连接公端子 65外接另一同装置中的连接母端 子，连接母端子 64外接另一同装置中的连接公端子，用于其与其他低温发热 实木复合地板间的电路连接。 步骤 5. 4， 在公端子 61上插入热敏组件， 热敏 组件能承载的最高温度为 65°C， 最高电流为 240mA。
综上所述， 本发明低温发热实木复合地板的最高温度为 50°C-55°C , 其 持续发热时， 属于低温状态， 不会使木地板产生变形、 开裂和烧焦； 本发明 采用了碳纤维导电纸， 碳纤维导电纸的热转换效率可达 97%， 比传统材料节 能。 碳纤维导电纸热量传递主要以远红外辐射为主， 而且还释放出 8 μ ιη - 18 μ ιη的远红外线光波， 活化人体内水分子， 提高血液含氧量， 增强细胞活力， 改善人体微循环， 促进新陈代谢； 本发明经过高温定型的地板基材含水率在 6%左右， 其为绝缘体。 在加上碳纤维导电纸在一般电压下 （220V) 整个面都 是电子通路， 电流密度极小， 其与地板基材性能相结合， 对人体毫无伤害， 使用安全。
上述内容为本发明低温发热实木复合地板及其制备方法的具体实施例的 列举， 对于其中未详尽描述的设备和结构， 应当理解为采取本领域已有的通 用设备及通用方法来予以实施。

Claims

权 利 要 求
1、 一种低温发热实木复合地板， 其特征在于， 包括： 外饰面层 （1 ) 、 上基材层 （2) 、 发热层 （3) 及下基材层 （4) 叠放并依次热压构成；
所述的上基材层（2) 、 发热层（3)及下基材层（4)热压后共 9层， 所 述的发热层 （3) 位于 5- 7层， 所述的发热层 （3) 的上方为上基材层 （2) ， 所述的发热层 （3) 的下方为下基材层 （4) ， 所述的上基材层 （2) 由 3至 5 层构成， 所述的下基材层 （4) 由 4至 6层构成； 所述的外饰面层 （1 ) 通过 热压设置在上基材层 （2) 上；
所述的外饰面层 （1 ) 、 上基材层 （2) 、 发热层 （3) 及下基材层 （4) 分别呈长条状； 所述的发热层 （3) 的两端宽边上分别设有一对铜极 （31 ) ， 且铜极（31 )与发热层（3)同宽； 所述的上基材层（2)底部与发热层（3)、 下基材层（4)顶部与发热层（3)之间分别设有一层防火层（5) ； 所述的下 基材层 （4) 的底部设有一层反射层 （41 ) ；
所述的上基材层 （2) 由多层基材木芯板纵横交错分层排列并粘合而成， 所述的下基材层 （4) 由多层底板纵横交错分层排列并粘合而成。
2、根据权利要求 1所述的低温发热实木复合地板， 其特征在于： 所述的 发热层（3)是碳纤维导电纸， 且在碳纤维导电纸上设有多个小孔（33) ； 所 述的铜极 （31 ) 由铜铝箔压扎而成。
3、根据权利要求 1或 2所述的低温发热实木复合地板，其特征在于： 所 述的下基材层（4)的两端分别设有一对通孔（42) ， 且通孔（42) 的位置与 发热层 （3) 上铜极 （31 ) 的位置相对应。
4、根据权利要求 1所述的低温发热实木复合地板， 其特征在于： 还包括 连接端子 （6) 及热敏组件；
所述的连接端子（6)包括公端子（61 )、母端子（62)，连接公端子（65)、 连接母端子 （64) 及一对连接导线 （63) ， 所述的连接公端子 （65) 与连接 母端子（64)大小相适配， 所述的公端子（61 )与母端子（62)大小相适配， 母端子 （62) 设置在下基材层 （4) 的通孔 （42) 中， 与发热层 （3) 的铜极 (31 )接触， 一对连接导线（63)压合在公端子（61 )上， 连接公端子（65) 外接另一同装置中的连接母端子， 连接母端子 （64) 外接另一同装置中的连 接公端子；
热敏组件设置在公端子 （61 ) 上。
5、根据权利要求 1所述的低温发热实木复合地板的制备方法，其特征在 于： 该方法至少包括以下步骤：
步骤 1， 热压制备上基材层 （2); 步骤 2， 热压制备发热层 （3) ； 步骤 3, 热压制备下基材层 （4) ； 步骤 4, 热压制备低温发热实木复合地板基材； 步骤 5， 在低温发热实木复合地板基材上设置连接端子 （6) 及热敏组件。
6、 根据权利要求 5所述的低温发热实木复合地板的制备方法，其特征在 于： 所述的步骤 1中还包括：
步骤 1. 1，选取基材木芯板并对其进行涂胶； 步骤 1. 2,将步骤 1. 1中涂 胶后的基材木芯板纵横交错分层排列， 粘合在一起， 由 3至 5层组成； 步骤 1. 3, 在步骤 1. 2中基材木芯板的底部进行涂胶， 并贴上防火层 （5) ， 防火 层（5) 的长宽与基材木芯板相适配； 步骤 1. 4， 对步骤 1. 3中制得的基材木 芯板进行热压制得上基材层 （2) 。
7、根据权利要求 5所述的低温发热实木复合地板的制备方法，其特征在 于： 所述的步骤 2中还包括：
步骤 2. 1， 用浓度为 10%- 20%的聚乙烯醇溶液对碳纤维导电纸做浸渍处 理， 浸渍后聚乙烯醇在碳纤维导电纸上的附着量为 15%- 30%， 再对其进行干 燥处理； 步骤 2. 2， 用热固性酚醛树脂、 环氧树脂中的一种或几种组合而成 的树脂对步骤 2. 1中制得的碳纤维导电纸进行浸渍树脂处理； 步骤 2. 3, 对 步骤 2. 2中制得的碳纤维导电纸进行碳化处理； 步骤 2. 4， 对步骤 2. 3中制 得的碳纤维导电纸进行剪裁； 步骤 2. 5， 在步骤 2. 4中剪裁后的碳纤维导电 纸的一对宽边上分别压扎铜极 （31 ) ， 铜极 （31 ) 与碳纤维导电纸同宽； 步 骤 2. 6， 将步骤 2. 5中压扎铜极 （31 ) 后的碳纤维导电纸其进行热压； 步骤 2. 7， 将步骤 2. 6中制得的碳纤维导电纸进行打胶钉制得发热层 （3) 。
8、根据权利要求 5所述的低温发热实木复合地板的制备方法，其特征在 于： 所述的步骤 3中还包括：
步骤 3. 1， 选取下基材层（4)的底板， 并在底板的反面涂胶； 步骤 3. 2， 在底板的涂胶面贴上反射层 （41 ) ， 反射层 （41 ) 与底板等长； 步骤 3. 3， 热压反射层 （41 )及底板； 步骤 3. 4， 对步骤 3. 3中热压后的底板的非反射 层面进行涂胶； 步骤 3. 5， 将步骤 3. 4中涂胶后的底板纵橫交错分层排列， 粘合在一起， 由 4至 6层组成； 步骤 3. 6， 对步骤 3. 5中制得的底板上端涂 胶后贴覆防火层 （5) ， 防火层 （5) 与底板同宽； 并进行热压制得下基材层
(4) ； 步骤 3. 7， 根据铜极 （31 ) 的位置在下基材层 （4) 上对应设置通孔
(42) 。
9、 根据权利要求 5所述的低温发热实木复合地板的制备方法，其特征在 于： 所述的步骤 4中还包括：
步骤 4. 1， 对上述上基材层 （2)及下基材层 （4) 的有防火层（5)面进 行涂胶； 步骤 4. 2， 将连接端子（6) 中的母端子（62)放置在下基材层 （4) 的通孔 （42) 中； 步骤 4. 3， 将发热层 （3) 贴在下基材层 （4) 上， 发热层 (3) 上的铜极 （31 ) 与母端子 （62)接触； 步骤 4. 4， 将上基材层 （2) 贴 覆在发热层 （3)上并进行热压； 步骤 4. 5， 将步骤 4. 4中热压完成后的基材 做 5- 15天的养生处理， 制得低温发热实木复合地板基材。
10、 根据权利要求 5所述的低温发热实木复合地板的制备方法， 其特征 在于： 所述的步骤 5中还包括： 步骤 5.1， 将外饰面层（1)压制在低温发热实木复合地板基材上制得低 温发热实木复合地板； 步骤 5.2， 在公端子 （61) 上压合连接导线 （63) ， 一个公端子 （61) 上一次压合两根连接导线 （63) ； 步骤 5.3， 在两根连接 导线（63)另外一端上分别一次压合连接公端子（65)和连接母端子（64) ； 步骤 5.4， 在公端子 （61) 上插入热敏组件。
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