WO2012169858A2 - Buffer sheet used in vacuum chuck that adsorbs object to be processed - Google Patents

Buffer sheet used in vacuum chuck that adsorbs object to be processed Download PDF

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Publication number
WO2012169858A2
WO2012169858A2 PCT/KR2012/004597 KR2012004597W WO2012169858A2 WO 2012169858 A2 WO2012169858 A2 WO 2012169858A2 KR 2012004597 W KR2012004597 W KR 2012004597W WO 2012169858 A2 WO2012169858 A2 WO 2012169858A2
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WO
WIPO (PCT)
Prior art keywords
workpiece
vacuum chuck
sheet
coating layer
weight
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PCT/KR2012/004597
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French (fr)
Korean (ko)
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WO2012169858A3 (en
Inventor
이재덕
최일환
김승렬
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(주)탑나노시스
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Priority to CN201280028646.XA priority Critical patent/CN103608912B/en
Publication of WO2012169858A2 publication Critical patent/WO2012169858A2/en
Publication of WO2012169858A3 publication Critical patent/WO2012169858A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to a buffer sheet, and more particularly, it can be applied to a vacuum chuck that works by absorbing a workpiece in a flat panel display panel, a semiconductor wafer, or the like.
  • the glass substrates for display devices used in display devices must be fixed without misalignment in the precise cutting or precision painting operations.
  • the semiconductor wafer must also be fixed without misalignment.
  • the vacuum adsorption method is mainly employed for fixing a workpiece such as a glass substrate or a semiconductor wafer.
  • the method is a method of fixing the workpiece 4 by vacuum suction as the vacuum chuck 3.
  • vent holes 1 for adsorbing the workpiece 4 are formed on the surface of the vacuum chuck 3, and the vent holes 1 receive negative pressure and static pressure through the suction hole 2. .
  • the vacuum chuck 3 is usually a hard material such as a metal, and thus comes into contact with the workpiece 4 such as glass, thereby causing damage to the workpiece 4.
  • the workpiece 4 such as glass
  • the vacuum chuck 3 due to the generation of static electricity between the workpiece 4 and the vacuum chuck 3, there is a possibility that damage may occur to the electronic products on the workpiece 4 and the peeling voltage is high.
  • the buffer sheet 5 may be interposed between the vacuum chuck 3 and the workpiece 4.
  • the buffer sheet 5 functions as a buffer when the workpiece 4 is adsorbed, thereby preventing damage to the workpiece.
  • the buffer sheet 5 has electrical conductivity to prevent damage due to static electricity and lowers the peeling voltage.
  • the buffer sheet 5 is a porous material, and functions to maintain the adsorption force when the workpiece is adsorbed by the vacuum chuck, and prevents the blocking of the vent hole of the vacuum chuck by foreign matters generated in the LCD process. do. In addition, the periodic exchange of the cushioning sheet 5 is facilitated.
  • the buffer sheet 5 is made of a rubber sheet.
  • rubber sheets have a large coefficient of friction. Therefore, there is a problem that workability deteriorates when the workpiece is moved after the end or the end of processing. In addition, the rubber is not good porosity, it is difficult to adsorb the workpiece.
  • a film (sunmap product, NITTO DENKO Co., Ltd.) formed of a sintered porous film forming body of polyethylene powder may be used as the buffer sheet 5. Since the film is porous, the adsorption force from the vacuum chuck is transmitted to the workpiece, and the friction coefficient is also small.
  • polyethylene films do not have electrical conductivity in materials. Therefore, in order to prevent the glass substrate and the static electricity, a conductive material should be added separately by adding a conductive material.
  • the conventional cushion sheet is about 10 10 ohm / sq, the electrical conductivity is not enough for the antistatic.
  • An object of the present invention is to provide a buffer sheet for use in a vacuum chuck which is excellent in antistatic effect and excellent in adsorption force for adsorbing a workpiece.
  • Another object of the present invention is to provide a shock absorbing sheet for use in a vacuum chuck having a low cost and excellent workability.
  • the buffer sheet used in the vacuum chuck of the present invention is bonded to the upper surface of the vacuum chuck for adsorbing and fixing the workpiece.
  • the workpiece is seated on the buffer sheet.
  • the cushioning sheet includes a nonwoven sheet and an ESD coating layer.
  • the ESD coating layer includes carbon nanotubes on the nonwoven fabric sheet.
  • the nonwoven sheet may include polyethylene and polyethylene terephthalate.
  • the nonwoven fabric sheet may be formed by continuously forming a unit structure formed by wrapping the polyethylene terephthalate with low density polyethylene.
  • a primer layer may be further provided between the nonwoven fabric sheet and the ESD coating layer to increase the adhesion of the ESD coating layer.
  • the ESD coating layer is formed by applying a CNT coating solution.
  • the CNT coating solution includes a solvent.
  • the ESD coating solution is mixed in the solvent, phenoxy, AUD (Acryl urethane Dispersion), Carboxyl-Modified Vinyl Copolymer, waterborne polyurethane, polyester, and polyvinyl butylal It includes at least one resin selected from.
  • the ESD coating solution also contains carbon nanotubes.
  • the resin may be 10 to 20% by weight of the weight of the CNT coating solution, the carbon nanotubes may occupy 0.1 to 5.0% by weight of the weight of the CNT coating solution.
  • the surface resistance of the ESD coating layer may be 10 6 ohm / sq to 10 8 ohm / sq.
  • the buffer sheet used in the vacuum chuck to adsorb the workpiece according to the present invention is excellent in the antistatic effect by applying an ESD coating layer comprising carbon nanotubes having electrical conductivity.
  • the nonwoven fabric which is a porous material as a substrate, the adsorption force from the vacuum chuck is excellently transmitted to the workpiece, and the cost is also reduced.
  • FIG. 1 is a cross-sectional view schematically showing a vacuum chuck for adsorbing a conventional workpiece.
  • FIG. 2 is a cross-sectional view showing a cushioning sheet used in a vacuum chuck for adsorbing a workpiece according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view showing a cushioning sheet used in a vacuum chuck for adsorbing a workpiece according to another embodiment of the present invention.
  • the buffer sheet 100 of the present invention includes a nonwoven fabric sheet 110 and an ESD coating layer 130.
  • the buffer sheet 100 is coupled to the upper surface of the vacuum chuck 3 (see FIG. 1) for adsorbing and fixing the workpiece.
  • the workpiece is mounted on an upper surface of the buffer sheet 100.
  • the vacuum chuck is used for the precision cutting of glass substrates or semiconductor wafers for liquid crystal display devices, precision coating operations for glass substrates or semiconductor wafers for liquid crystal display devices, and precision bonding of polarizing plates and retardation plates or these and glass plates. It can function to adsorb and fix the workpiece.
  • the nonwoven fabric sheet 110 means that the fibers are arranged in parallel or in an inverted direction without being subjected to a woven fabric process and bonded with a synthetic resin adhesive to form a felt-like sheet.
  • Nonwoven material is a porous structure made of fine fiber (Fiber), it is possible to transfer the pressure supplied from the vacuum chuck to the workpiece. In addition, it has the advantage of easy heat formation and low cost as a loose dense structure.
  • the ESD coating layer 130 is coated on the nonwoven fabric sheet 110 and includes a carbon nanotube 131.
  • the ESD coating layer 130 may be formed by applying a CNT coating solution on the nonwoven sheet 110.
  • the CNT coating solution may include a solvent formed by mixing ethanol and deionized water.
  • the solvent at least one resin and a conductive material selected from phenoxy, AUD (Acryl urethane Dispersion), Carboxyl-Modified Vinyl Copolymer, waterborne polyurethane, polyester, and polyvinyl butylal Phosphorus carbon nanotubes 131 may be mixed to form a CNT coating solution.
  • water-dispersed polyurethane for example, Sancure TM 12954 or Sancure TM 898 may be applied.
  • Polyester 200, 305, polyvinyl butyl al may be applied to BM-2, 60H, 08HX.
  • the resin added to the solvent may be 5 to 30% by weight of the weight of the CNT coating solution.
  • the resin is less than 5% by weight, the adhesion of the CNT coating solution is weak and there is a problem in that the mixing and dispersion of the carbon nanotubes are not uniform.
  • the adhesion of the CNT coating solution is improved, but the viscosity is high and the volatility deteriorates workability.
  • Carbon nanotubes 131 may be added to the solvent 0.1 to 5.0% by weight of the weight of the CNT coating solution. Injecting less than 0.1% by weight of carbon nanotubes may cause deterioration of the conductive performance of the interleaver 10. On the other hand, the addition of more than 5.0% by weight of carbon nanotubes increases the time and cost of the production of the interleaf paper 10, thereby lowering the economics. In consideration of cost reduction, the application of multi-wall carbon nanotubes (MWCNT) is preferable to the application of single-wall carbon nanotubes (SWCNT).
  • MWCNT multi-wall carbon nanotubes
  • SWCNT single-wall carbon nanotubes
  • the buffer sheet 100 including the carbon nanotubes has the advantage that the generation of static electricity is suppressed, and the workpiece such as an LCD panel falls well. This advantage has the advantage that the work process is faster. In addition, there is an advantage that the material is less pollution.
  • ethanol constituting the solvent may account for 30 to 45% by weight of the weight of the CNT coating solution
  • deionized water may occupy 30 to 45% by weight of the weight of the CNT coating solution.
  • the carbon nanotube 131 is applied to the conductive material and the CNT coating solution is prepared by mixing the carbon nanotube in a solvent. Therefore, there is a low risk of volatilization of carcinogens, which is relatively safe in the manufacturing process or use.
  • a trace amount of a leveling agent and a matting agent may be added together in a solvent.
  • the coating leveling agent improves the performance so that the CNT coating solution is applied thinly and flatly.
  • a coating leveling agent such as Dynol TM 604, 607 may be added at 0.01 to 0.5% by weight of the weight of the CNT coating solution.
  • the nonwoven sheet 110 may include polyethylene (PE, polyethylene) and polyethylene terephthalate (PET).
  • the nonwoven fabric sheet 110 may form a web by self-adhesive by heat by spinning the raw material.
  • the nonwoven fabric sheet 110 may be formed by continuously forming a unit structure formed by wrapping the polyethylene terephthalate with low density polyethylene.
  • a primer layer 120 may be interposed between the nonwoven fabric sheet 110 and the ESD coating layer 130.
  • the primer layer 120 is a layer for improving the adhesion of the ESD coating layer 130, to form a primer coating by mixing chlorinated polyolefin and modified rubber in an oil solvent (solvent),
  • the primer coating agent may be formed by applying a thin coating on the nonwoven fabric sheet 110 and curing the thin film.
  • the solvent may be formed by mixing toluene and xylene.
  • various methods such as spray coating, precipitation, gravure coating, roll coating, and spin coating may be used.
  • a general metal roll is processed with a laser to make a pocket of a fine line shape that can contain ink at an appropriate depth and number.
  • the metal roll When the metal roll is immersed in the container containing the ink to be coated, the ink is filled in the pocket, and the fabric is coated by pressing the fabric with another roller.
  • the ESD coating layer 130 may be repeatedly coated on the nonwoven fabric sheet 110 to an appropriate degree. Accordingly, the degree of electrical conduction of the ESD coating layer 130 can be adjusted.
  • the electrical resistance of the ESD coating layer 130 is preferably adjusted to 10 6 ohm / sq to 10 8 ohm / sq. This is because when the electrical resistance is less than 10 6 ohm / sq, the buffer sheet 100 becomes a conductive material, not antistatic, and when the electrical resistance is greater than 10 8 ohm / sq, the antistatic effect is deteriorated. .
  • the ESD coating layer 130 may be formed only on one surface to which the workpiece of the nonwoven fabric sheet 110 is bonded. In addition, the ESD coating layer 130 may be formed on both sides of the nonwoven fabric sheet 10. In this case, the ESD coating layer 130 is more preferably formed only on one surface to which the workpiece is bonded to the nonwoven fabric sheet 110, which is the surface on which the ESD coating layer 130 is not formed is coupled to the vacuum chuck This is because there is no need to prevent the power failure as a part, which is cheaper in terms of cost.
  • the buffer sheet 200 includes a nonwoven fabric sheet 110, a corona treated layer 220 formed on at least one side of the nonwoven fabric sheet 110, and the corona treatment.
  • the ESD coating layer 130 is formed on the layer 220 and includes carbon nanotubes.
  • Corona treatment refers to a method of applying a high frequency and high voltage output between a discharge electrode and a roller to generate a corona discharge, and surface treating the substrate by passing the substrate under the corona discharge thus formed.
  • the corona treatment layer 220 is a layer formed by corona treatment of the surface of the nonwoven fabric sheet 110 under corona discharge conditions, and enhances adhesion of the CNT coating solution, improves coating stain, and laminates the ESD coating layer 130. It has the effect of reducing the thickness.
  • the buffer sheet 100 shown in FIG. 1 41.86% by weight of ethanol as an aqueous solvent, 42.5% by weight of deionized water as an aqueous solvent, 0.04% by weight of Dynol TM 604 as a film smoothing agent, water 15.0 wt% of Sancure TM 898 and 0.6 wt% of multiwall carbon nanotubes (MWCNT) as a dispersion polyurethane were mixed to prepare a CNT coating solution, and then applied and cured to form an ESD coating layer 130.
  • the ESD coating layer 130 prepared as described above was coated on the nonwoven fabric sheet 110, and then a physical property test was performed after preparing the embodiment.
  • the film (sunmap product, NITTO DENKO Co., Ltd.) formed from the sintered porous film formation body of polyethylene powder was used.
  • the tensile strength is almost the same as in the Examples and Comparative Examples. This is because the carbon nanotubes are included in the buffer sheet 200, thereby improving mechanical properties such as tensile strength.
  • the sheet resistance is 10 6.4 ohm / sq in the case of the embodiment, it can be seen that the effect of the generation of anti-static is excellent, whereas in the comparative example, the surface resistance is 10 10.2 ohm / sq. Is not appropriate.
  • the peeling electrification voltage is 200 V, which is much lower than that of the comparative example.
  • the present invention can be used in the semiconductor industry, the display industry and the like.

Abstract

Disclosed is a buffer sheet used in a vacuum chuck that adsorbs an object to be processed. The buffer sheet of the present invention is coupled to the upper side of the vacuum chuck which adsorbs and fixes the object to be processed, and includes a non-woven sheet and an ESD coating layer comprising carbon nanotube on the non-woven sheet so that the object to be processed is mounted. According to the present invention, an antistatic effect is excellent since the ESD coating layer comprising the carbon nanotube with electrical conductivity is applied.

Description

피가공체를 흡착하는 진공 척에 사용되는 완충시트Shock-absorbing sheet used for vacuum chuck to adsorb workpiece
본 발명은 완충시트에 관한 것으로, 보다 상세하게는 평판 디스플레이 패널, 반도체 웨이퍼 등에서 피가공체를 흡착하여 작업하는 진공 척에 적용될 수 있다.The present invention relates to a buffer sheet, and more particularly, it can be applied to a vacuum chuck that works by absorbing a workpiece in a flat panel display panel, a semiconductor wafer, or the like.
일반적으로, 노트북, 데스크톱컴퓨터, 텔레비젼과 같은 표시장치에 이용되고 있는 표시소자용 유리기판의 정밀절단작업이나 정밀 도장작업에는 유리기판의 위치가 어긋남 없이 고정되어 있어야 한다. 또한, 반도체 웨이퍼의 정밀절단작업, 정밀 도장작업 등의 가공에 있어서, 반도체 웨이퍼 또한 위치가 어긋남 없이 고정되어 있어야 한다. In general, the glass substrates for display devices used in display devices such as laptops, desktop computers, and televisions must be fixed without misalignment in the precise cutting or precision painting operations. Further, in processing such as precise cutting of the semiconductor wafer, precision painting, etc., the semiconductor wafer must also be fixed without misalignment.
상기 유리기판이나 반도체 웨이퍼 등과 같은 피가공체의 고정에는 진공흡착법이 주로 채용되고 있다. 상기 방법은 도 1에 도시된 바와 같이, 진공 척(3)으로서 피가공체(4)를 진공 흡착하여 고정시키는 방법이다. 이 경우, 진공 척(3)의 표면에는 피가공체(4)를 흡착하기 위한 통기 구멍(1)들이 형성되고, 상기 통기 구멍(1)들은 흡입 구멍(2)을 통하여 부압 및 정압을 전달받는다. The vacuum adsorption method is mainly employed for fixing a workpiece such as a glass substrate or a semiconductor wafer. As shown in FIG. 1, the method is a method of fixing the workpiece 4 by vacuum suction as the vacuum chuck 3. In this case, vent holes 1 for adsorbing the workpiece 4 are formed on the surface of the vacuum chuck 3, and the vent holes 1 receive negative pressure and static pressure through the suction hole 2. .
즉, 진공 척(3)의 통기 구멍(1) 상면 상에 피가공체(4)를 위치시키고, 흡입구멍(2)에 연결된 진공펌프(미도시)에 의하여 감압하면, 진공 척(3) 내부를 감압상태가 됨으로써, 피가공체(4)를 진공 척 상에 위치 어긋남 없이 고정시킨다. That is, when the workpiece 4 is placed on the upper surface of the vent hole 1 of the vacuum chuck 3 and the pressure is reduced by a vacuum pump (not shown) connected to the suction hole 2, the inside of the vacuum chuck 3 is opened. By being in a reduced pressure state, the workpiece 4 is fixed on the vacuum chuck without shifting.
그런데, 상기 진공척(3)은 통상 금속 등의 단단한 소재로서 유리등의 피가공체(4)와의 접촉으로 인하여, 피가공체(4)에 손상이 발생한다. 또한, 피가공체(4)와 진공 척(3)과의 정전기 발생으로 인하여, 피가공체(4) 상의 전자제품에 손상이 발생할 가능성이 있고, 박리 전압이 높아진다는 문제점이 있다. By the way, the vacuum chuck 3 is usually a hard material such as a metal, and thus comes into contact with the workpiece 4 such as glass, thereby causing damage to the workpiece 4. In addition, due to the generation of static electricity between the workpiece 4 and the vacuum chuck 3, there is a possibility that damage may occur to the electronic products on the workpiece 4 and the peeling voltage is high.
이러한 문제점을 해결하기 위하여 진공 척(3)과 피가공체(4) 사이에 완충시트(5)를 개재시킬 수 있다. 상기 완충시트(5)는 상기 피가공체(4)가 흡착될 시에 완충작용을 하여서, 피가공체에 손상이 발생하는 것을 방지시킨다. 또한, 완충시트(5)는 전기 전도성을 가지고 있어서 정전기로 인한 손상을 방지하며, 박리 전압이 낮춘다. 또한, 완충시트(5)는 다공성 물질로서, 진공척에 의하여 상기 피가공체를흡착시에 흡착력을 유지시키는 기능을 하며, LCD 공정 등에서 발생 할 수 있는 이물질에 의한 진공척의 통기구멍 막힘 방지기능을 한다. 또한, 완충시트(5)의 주기적인 교환이 용이하게 된다.In order to solve this problem, the buffer sheet 5 may be interposed between the vacuum chuck 3 and the workpiece 4. The buffer sheet 5 functions as a buffer when the workpiece 4 is adsorbed, thereby preventing damage to the workpiece. In addition, the buffer sheet 5 has electrical conductivity to prevent damage due to static electricity and lowers the peeling voltage. In addition, the buffer sheet 5 is a porous material, and functions to maintain the adsorption force when the workpiece is adsorbed by the vacuum chuck, and prevents the blocking of the vent hole of the vacuum chuck by foreign matters generated in the LCD process. do. In addition, the periodic exchange of the cushioning sheet 5 is facilitated.
종래에는 상기 완충시트(5)가 고무시트로 이루어졌다. 그러나 고무시트는 마찰계수가 크다. 따라서, 가공의 중간이나 종료 후에 피가공체를 이동시키는 경우에 작업성이 나빠진다는 문제점이 있다. 또한, 고무는 다공성이 좋지 않아서, 상기 피가공체를 흡착시키기가 어렵다.Conventionally, the buffer sheet 5 is made of a rubber sheet. However, rubber sheets have a large coefficient of friction. Therefore, there is a problem that workability deteriorates when the workpiece is moved after the end or the end of processing. In addition, the rubber is not good porosity, it is difficult to adsorb the workpiece.
이러한 문제점을 해결하기 위하여, 상기 완충시트(5)로서 폴리에틸렌 분말의 소결다공질막 형성체로 형성시킨 필름(sunmap 제품, ㈜NITTO DENKO)을 사용할 수 있다. 상기 필름은 다공질이므로 진공척으로부터의 흡착력이 피가공체로 전달되고, 마찰계수 또한 작다는 장점이 있다.In order to solve this problem, a film (sunmap product, NITTO DENKO Co., Ltd.) formed of a sintered porous film forming body of polyethylene powder may be used as the buffer sheet 5. Since the film is porous, the adsorption force from the vacuum chuck is transmitted to the workpiece, and the friction coefficient is also small.
그러나, 폴리에틸렌 필름은 재질상 전기전도성을 가지지 않는다. 따라서, 유리기판과 정전기 방지를 위해서는, 전도성 물질을 첨가하는 방법 등으로 전도성 물질을 별도로 추가하여야 한다. 그러나, 종래의 완충시트는 전기저항이 1010 ohm/sq정도로서 전기전도성이 정전기 방지용으로는 충분하지 못한다. However, polyethylene films do not have electrical conductivity in materials. Therefore, in order to prevent the glass substrate and the static electricity, a conductive material should be added separately by adding a conductive material. However, the conventional cushion sheet is about 10 10 ohm / sq, the electrical conductivity is not enough for the antistatic.
또한, 상기 폴리에틸렌 필름의 소재상 고가이며, 통풍성도 우수하지 않다.Moreover, it is expensive on the raw material of the said polyethylene film, and is not excellent also in breathability.
본 발명은 대전방지 효과가 우수한 동시에, 피가공체를 흡착하는 흡착력이 우수한 진공 척에 사용되는 완충시트를 제공하는 것을 목적으로 한다.An object of the present invention is to provide a buffer sheet for use in a vacuum chuck which is excellent in antistatic effect and excellent in adsorption force for adsorbing a workpiece.
본 발명의 다른 목적은, 소재가 저가이면서, 작업성이 우수한 진공 척에 사용되는 완충시트를 제공하는 것이다.Another object of the present invention is to provide a shock absorbing sheet for use in a vacuum chuck having a low cost and excellent workability.
본 발명의 진공 척에 사용되는 완충시트는, 피가공체를 흡착하여 고정시키는 진공척의 상면에 결합된다. 상기 완충시트 상에 상기 피가공체가 안착된다. 상기 완충시트는 부직포 시트와, ESD 코팅층을 구비한다. 상기 ESD 코팅층은 상기 부직포 시트 상에, 탄소나노튜브(carbon nano tube)를 포함하여 이루어진다.The buffer sheet used in the vacuum chuck of the present invention is bonded to the upper surface of the vacuum chuck for adsorbing and fixing the workpiece. The workpiece is seated on the buffer sheet. The cushioning sheet includes a nonwoven sheet and an ESD coating layer. The ESD coating layer includes carbon nanotubes on the nonwoven fabric sheet.
상기 부직포 시트는 폴리에틸렌(polyethylene) 및 폴리에틸렌 테레프탈레이트(polyethylene terephthalate)를 포함할 수 있다. 이 경우, 상기 부직포 시트는, 상기 폴리에틸렌테레프탈레이트를 저밀도 폴리에틸렌이 감싸서 이루어진 단위구조가 연속적으로 이루어져서 형성될 수 있다.The nonwoven sheet may include polyethylene and polyethylene terephthalate. In this case, the nonwoven fabric sheet may be formed by continuously forming a unit structure formed by wrapping the polyethylene terephthalate with low density polyethylene.
상기 부직포 시트 및 상기 ESD 코팅층 사이에, 상기 ESD 코팅층의 접착력을 증대시키기 위한 프라이머층(primer layer)를 더 구비할 수 있다. A primer layer may be further provided between the nonwoven fabric sheet and the ESD coating layer to increase the adhesion of the ESD coating layer.
또한, 상기 ESD 코팅층은 CNT 코팅용액을 도포하여 형성된다. 상기 CNT 코팅용액은 용매를 포함한다. 또한, ESD 코팅용액은, 상기 용매에 혼합된 것으로, 페녹시(phenoxy), AUD(Acryl urethane Dispersion),Carboxyl-Modified Vinyl Copolymer, 수분산 폴리우레탄(waterborne polyurethane), 폴리에스테르, 및 폴리비닐부틸알 중에서 선택된 적어도 하나의 수지를 포함한다. 또한 ESD 코팅용액은 탄소나노튜브를 포함한다. 이 경우, 상기 수지는 상기 CNT 코팅용액 중량의 10 내지 20 중량%, 상기 탄소나노튜브는 상기 CNT 코팅용액 중량의 0.1 내지 5.0 중량%를 차지할 수 있다. In addition, the ESD coating layer is formed by applying a CNT coating solution. The CNT coating solution includes a solvent. In addition, the ESD coating solution is mixed in the solvent, phenoxy, AUD (Acryl urethane Dispersion), Carboxyl-Modified Vinyl Copolymer, waterborne polyurethane, polyester, and polyvinyl butylal It includes at least one resin selected from. The ESD coating solution also contains carbon nanotubes. In this case, the resin may be 10 to 20% by weight of the weight of the CNT coating solution, the carbon nanotubes may occupy 0.1 to 5.0% by weight of the weight of the CNT coating solution.
한편, 상기 ESD 코팅층의 표면 저항은 106 ohm/sq 내지 108 ohm/sq일 수 있다.Meanwhile, the surface resistance of the ESD coating layer may be 10 6 ohm / sq to 10 8 ohm / sq.
본 발명에 따른 피가공체를 흡착하는 진공 척에 사용되는 완충시트는, 전기 전도성을 가지는 탄소나노튜브를 포함하는 ESD 코팅층을 적용하여 정전기 방지 효과가 우수하다. The buffer sheet used in the vacuum chuck to adsorb the workpiece according to the present invention is excellent in the antistatic effect by applying an ESD coating layer comprising carbon nanotubes having electrical conductivity.
또한, 다공성 물질인 부직포를 기재로 사용함으로써, 진공 척으로부터의 흡착력이 피가공체에 우수하게 전달되고, 비용도 감소한다.In addition, by using the nonwoven fabric which is a porous material as a substrate, the adsorption force from the vacuum chuck is excellently transmitted to the workpiece, and the cost is also reduced.
도 1은 통상적인 피가공체를 흡착하는 진공 척을 개략적으로 도시한 단면도이다.1 is a cross-sectional view schematically showing a vacuum chuck for adsorbing a conventional workpiece.
도 2는 본 발명의 실시예에 따른 피가공체를 흡착하는 진공 척에 사용되는 완충시트를 도시한 단면도이다.2 is a cross-sectional view showing a cushioning sheet used in a vacuum chuck for adsorbing a workpiece according to an embodiment of the present invention.
도 3은 본 발명의 다른 실시예에 따른 피가공체를 흡착하는 진공 척에 사용되는 완충시트를 도시한 단면도이다.3 is a cross-sectional view showing a cushioning sheet used in a vacuum chuck for adsorbing a workpiece according to another embodiment of the present invention.
도 4는 실시예와 비교예의 박리 대전압을 대비한 그래프이다.4 is a graph comparing the peeling electrification voltages of Examples and Comparative Examples.
이하, 첨부된 도면을 참조하여 본 발명의 실시예에 따른 유리 패널 적층용 간지 및 이의 제조방법을 상세하게 설명한다. Hereinafter, with reference to the accompanying drawings will be described in detail a glass panel laminating sheet according to an embodiment of the present invention and a manufacturing method thereof.
도 1은본 발명의 일 실시예에 따른 피가공체를 흡착하는 진공 척에 사용되는 완충시트(100)를 도시한 단면도이다. 도 1에 도시된 바와 같이 본 발명의 완충시트(100)는 부직포 시트(110) 및 ESD 코팅층(130)을 포함한다. 1 is a cross-sectional view illustrating a buffer sheet 100 used in a vacuum chuck for adsorbing a workpiece according to an embodiment of the present invention. As illustrated in FIG. 1, the buffer sheet 100 of the present invention includes a nonwoven fabric sheet 110 and an ESD coating layer 130.
이 경우, 완충시트(100)는 피가공체를 흡착하여 고정시키는 진공 척(3, 도 1 참조)의 상면에 결합된다. 상기 피가공체는 상기 완충시트(100) 상면에 안착된다. 상기 진공 척은 액정표시소자용 유리기판 또는 반도체 웨이퍼의 정밀절단작업, 액정표시소자용 유리기판이나 반도체 웨이퍼의 정밀 도장작업, 편광판과 위상차판 또는 이것들과 유리판과의 정밀 합착 작업 등의 가공에 있어서, 피가공체를 흡착 고정시키는 기능을 할 수 있다.In this case, the buffer sheet 100 is coupled to the upper surface of the vacuum chuck 3 (see FIG. 1) for adsorbing and fixing the workpiece. The workpiece is mounted on an upper surface of the buffer sheet 100. The vacuum chuck is used for the precision cutting of glass substrates or semiconductor wafers for liquid crystal display devices, precision coating operations for glass substrates or semiconductor wafers for liquid crystal display devices, and precision bonding of polarizing plates and retardation plates or these and glass plates. It can function to adsorb and fix the workpiece.
부직포 시트(110)란 섬유를 직포 공정을 거치지 않고, 평행 또는 부정방향(不定方向)으로 배열하고 합성수지 접착제로 결합하여 펠트모양의 시트 형상으로 만든 것을 의미한다. The nonwoven fabric sheet 110 means that the fibers are arranged in parallel or in an inverted direction without being subjected to a woven fabric process and bonded with a synthetic resin adhesive to form a felt-like sheet.
부직포 소재는 미세한 파이바(Fiber)로 만들어진 다공성 구조로서, 진공 척부터 공급된 압력을 피가공체에 전달 가능하다. 또한, 느슨한 다밀성 구조로써 열형성에 용이하며, 비용이 적게 든다는 장점을 가지고 있다. Nonwoven material is a porous structure made of fine fiber (Fiber), it is possible to transfer the pressure supplied from the vacuum chuck to the workpiece. In addition, it has the advantage of easy heat formation and low cost as a loose dense structure.
ESD 코팅층(130)은 상기 부직포 시트(110) 상에 코팅되는 것으로, 탄소나노튜브(carbon nano tube)(131)를 포함하여 이루어진다. The ESD coating layer 130 is coated on the nonwoven fabric sheet 110 and includes a carbon nanotube 131.
상기 ESD 코팅층(130)은 CNT 코팅용액을 상기 부직포 시트(110) 상에 도포하여 코팅함으로써 이루어질 수 있다. The ESD coating layer 130 may be formed by applying a CNT coating solution on the nonwoven sheet 110.
이 경우, CNT 코팅용액은, 에탄올(ethanol)과 탈이온수(deionized water)를 혼합하여 형성된 용매를 포함할 수 있다. 또한 상기 용매에, 페녹시(phenoxy), AUD(Acryl urethane Dispersion),Carboxyl-Modified Vinyl Copolymer, 수분산 폴리우레탄(waterborne polyurethane), 폴리에스테르, 및 폴리비닐부틸알 중에서 선택된 적어도 하나의 수지와 도전 물질인 탄소나노튜브(131)를 혼합하여 CNT 코팅용액을 형성할 수 있다. In this case, the CNT coating solution may include a solvent formed by mixing ethanol and deionized water. In the solvent, at least one resin and a conductive material selected from phenoxy, AUD (Acryl urethane Dispersion), Carboxyl-Modified Vinyl Copolymer, waterborne polyurethane, polyester, and polyvinyl butylal Phosphorus carbon nanotubes 131 may be mixed to form a CNT coating solution.
상기 수분산폴리우레탄은 예컨대, Sancure™ 12954 또는 Sancure™898가 적용될 수 있다. 폴리에스테르는Vylon 200, 305, 폴리비닐부틸알은 BM-2, 60H, 08HX 가 적용될 수 있다. As the water-dispersed polyurethane, for example, Sancure ™ 12954 or Sancure ™ 898 may be applied. Polyester 200, 305, polyvinyl butyl al may be applied to BM-2, 60H, 08HX.
상기 용매에 투입되는 수지는 CNT 코팅용액 중량의 5 내지 30 중량% 일 수 있다. 5 중량% 미만의 상기 수지를 투입시CNT 코팅용액의 부착력이 약하고 탄소나노튜브의 혼합 및 분산이 균일하게 이루어지지 못한다는 문제점이 있다. 또한, 30 중량% 초과의 수지를 투입시 CNT 코팅용액의 부착력은 향상되나 점성이 크고 휘발성이 나빠져 작업성이 저하된다. The resin added to the solvent may be 5 to 30% by weight of the weight of the CNT coating solution. When the resin is less than 5% by weight, the adhesion of the CNT coating solution is weak and there is a problem in that the mixing and dispersion of the carbon nanotubes are not uniform. In addition, when more than 30% by weight of resin is added, the adhesion of the CNT coating solution is improved, but the viscosity is high and the volatility deteriorates workability.
탄소나노튜브(131)는 CNT 코팅용액의 중량의 0.1 내지 5.0 중량%가 상기 용매에 투입될 수 있다. 0.1 중량% 미만의 탄소나노튜브 투입은 간지(10)의 도전 성능 저하를 유발할 수 있다. 한편, 5.0 중량% 초과의 탄소나노튜브 투입은 간지(10) 제조의 시간과 비용을 증대시켜 경제성을 저하시킨다. 원가 절감을 고려하면 다중벽탄소나노튜브(MWCNT: multi-wall carbon nano tube)의 적용이 단일벽탄소나노튜브(SWCNT: single-wall carbon nano tube)의 적용보다 바람직하다. Carbon nanotubes 131 may be added to the solvent 0.1 to 5.0% by weight of the weight of the CNT coating solution. Injecting less than 0.1% by weight of carbon nanotubes may cause deterioration of the conductive performance of the interleaver 10. On the other hand, the addition of more than 5.0% by weight of carbon nanotubes increases the time and cost of the production of the interleaf paper 10, thereby lowering the economics. In consideration of cost reduction, the application of multi-wall carbon nanotubes (MWCNT) is preferable to the application of single-wall carbon nanotubes (SWCNT).
탄소나노튜브는 우수한 도전성을 가진다. 따라서 상기 탄소나노튜브를 포함한 완충시트(100)는 정전기의 발생이 억제되어서, LCD 패널 등과 같은 피가공체가 잘 떨어진다는 장점이 있다. 이러한 장점으로 인하여 작업 공정이 빨라진다는 장점이 있다. 또한, 소재적으로도 오염이 적게 된다는 장점이 있다. Carbon nanotubes have excellent conductivity. Therefore, the buffer sheet 100 including the carbon nanotubes has the advantage that the generation of static electricity is suppressed, and the workpiece such as an LCD panel falls well. This advantage has the advantage that the work process is faster. In addition, there is an advantage that the material is less pollution.
여기서, 용매를 구성하는 에탄올은 CNT 코팅용액의 중량의 30 내지 45 중량%을 차지할 수 있고, 탈이온수는 CNT 코팅용액의 중량의 30 내지 45 중량%을 차지할 수 있다. 여기에 도전 물질로서 탄소나노튜브(131)를 적용하고 용매에 탄소나노튜브를 혼합하여 CNT 코팅용액을 제조한다. 따라서, 발암 물질의 휘발 위험이 적어 제조 과정이나 사용에 있어 상대적으로 안전하다.Here, ethanol constituting the solvent may account for 30 to 45% by weight of the weight of the CNT coating solution, deionized water may occupy 30 to 45% by weight of the weight of the CNT coating solution. The carbon nanotube 131 is applied to the conductive material and the CNT coating solution is prepared by mixing the carbon nanotube in a solvent. Therefore, there is a low risk of volatilization of carcinogens, which is relatively safe in the manufacturing process or use.
상기 CNT 코팅용액 형성 단계에는 미량의 도막 평활제(leveling agent)와 소광제(matting agent)가 용매에 함께 투입될 수 있다. 도막 평활제는 CNT 코팅용액이 얇고 편평하게 도포되도록 성능을 개선하는 것으로, 예컨대, Dynol™ 604, 607과 같은 도막 평활제가CNT 코팅용액의 중량의 0.01 내지 0.5 중량% 투입될 수 있다. In the forming of the CNT coating solution, a trace amount of a leveling agent and a matting agent may be added together in a solvent. The coating leveling agent improves the performance so that the CNT coating solution is applied thinly and flatly. For example, a coating leveling agent such as Dynol ™ 604, 607 may be added at 0.01 to 0.5% by weight of the weight of the CNT coating solution.
이 경우, 상기 부직포 시트(110)는 폴리에틸렌(PE, polyethylene) 및 폴리에틸렌 테레프탈레이트(PET, polyethylene terephthalate)를 포함할 수 있다. 상기 부직포 시트(110)는 원료를 방사하여 열에 의해 자체 접착하여 웹을 형성시킬 수 있다. In this case, the nonwoven sheet 110 may include polyethylene (PE, polyethylene) and polyethylene terephthalate (PET). The nonwoven fabric sheet 110 may form a web by self-adhesive by heat by spinning the raw material.
보다 바람직하게는, 상기 부직포 시트(110)는, 상기 폴리에틸렌테레프탈레이트를 저밀도 폴리에틸렌이 감싸서 이루어진 단위구조가 연속적으로 이루어져서 형성될 수 있다. More preferably, the nonwoven fabric sheet 110 may be formed by continuously forming a unit structure formed by wrapping the polyethylene terephthalate with low density polyethylene.
상기 부직포 시트(110)와 ESD 코팅층(130) 사이에는 프라이머층(120)이 개재될 수 있다. 상기 프라이머층(120)은 ESD 코팅층(130)의 접착력을 향상시켜주기 위한 층으로, 유성 용매(solvent)에 염화올레핀(chlorinated Polyolefin) 및 변성 고무(modified rubber)를 혼합하여 프라이머 코팅제를 형성하고, 상기 프라이머 코팅제를 상기 부직포 시트(110)에 얇게 도포하고 경화하여 형성할 수 있다. 상기 용매는 톨루엔(toluene)과 크실렌(xylene)을 혼합하여 형성될 수도 있다.A primer layer 120 may be interposed between the nonwoven fabric sheet 110 and the ESD coating layer 130. The primer layer 120 is a layer for improving the adhesion of the ESD coating layer 130, to form a primer coating by mixing chlorinated polyolefin and modified rubber in an oil solvent (solvent), The primer coating agent may be formed by applying a thin coating on the nonwoven fabric sheet 110 and curing the thin film. The solvent may be formed by mixing toluene and xylene.
상기 ESD 코팅층(130)을 코팅하는 방법은, 스프레이 코팅법, 침전법, 그라비아코팅법, 롤코팅법, 스핀 코팅법 등 다양한 방법을 사용할 수 있다. As the method for coating the ESD coating layer 130, various methods such as spray coating, precipitation, gravure coating, roll coating, and spin coating may be used.
그라비아코팅법을 예로 들면 일반적인 금속롤을 레이져(Laser)로 가공하여 적절한 깊이와 개수로 잉크를 담을 수 있는 미세한 선형태의 포켓(Pocket)을 만든다. Taking the gravure coating method as an example, a general metal roll is processed with a laser to make a pocket of a fine line shape that can contain ink at an appropriate depth and number.
코팅하고자 하는 잉크가 담긴 용기에 이 금속롤을 담근 상태로 회전시키면 포켓(Pocket)에 잉크가 채워지고, 그 위에 원단을 다른 롤러(Roller)로 누르면서 통과시키면 코팅이 되는 것이다. When the metal roll is immersed in the container containing the ink to be coated, the ink is filled in the pocket, and the fabric is coated by pressing the fabric with another roller.
상기 ESD 코팅층(130)의 코팅을 상기 부직포 시트(110) 상에 적절한 정도로 반복하여 코팅할 수 있다. 이에 따라서 ESD 코팅층(130)의 전기 전도 정도를 조절할 수 있다. 이 경우, 상기 ESD 코팅층(130)의 전기저항은 106 ohm/sq 내지 108 ohm/sq가 되도록 조절하는 것이 바람직하다. 상기 전기저항이 106 ohm/sq 미만인 경우, 완충시트(100)가 정전기 방지용이 아닌 도전성 물질이 되게 되고, 상기 전기저항이 108 ohm/sq를 초과하는 경우에는 정진기 방지효과가 떨어지기 때문이다. The ESD coating layer 130 may be repeatedly coated on the nonwoven fabric sheet 110 to an appropriate degree. Accordingly, the degree of electrical conduction of the ESD coating layer 130 can be adjusted. In this case, the electrical resistance of the ESD coating layer 130 is preferably adjusted to 10 6 ohm / sq to 10 8 ohm / sq. This is because when the electrical resistance is less than 10 6 ohm / sq, the buffer sheet 100 becomes a conductive material, not antistatic, and when the electrical resistance is greater than 10 8 ohm / sq, the antistatic effect is deteriorated. .
이 경우, ESD 코팅층(130)은 상기 부직포 시트(110)의 상기 피가공체가 접착되는 일면에만 형성될 수도 있다. 또한, ESD 코팅층(130)은 상기 부직포 시트(10)의 양면에 형성될 수도 있다. 이 경우, ESD 코팅층(130)은 상기 부직포 시트(110)의 상기 피가공체가 접착되는 일면에만 형성되는 경우가 보다 바람직한데, 이는 상기 ESD 코팅층(130)이 형성되지 않은 면은 상기 진공 척에 결합되는 부분으로서 정전 방지 필요가 없고, 비용 측면에서도 보다 저렴하기 때문이다. In this case, the ESD coating layer 130 may be formed only on one surface to which the workpiece of the nonwoven fabric sheet 110 is bonded. In addition, the ESD coating layer 130 may be formed on both sides of the nonwoven fabric sheet 10. In this case, the ESD coating layer 130 is more preferably formed only on one surface to which the workpiece is bonded to the nonwoven fabric sheet 110, which is the surface on which the ESD coating layer 130 is not formed is coupled to the vacuum chuck This is because there is no need to prevent the power failure as a part, which is cheaper in terms of cost.
도3은 본 발명의 또 다른 일 실시예에 따른 피가공체를 흡착하는 진공 척에 사용되는 완충시트(200)를 도시한 단면도이다. 도 3에 도시된 바와 같이, 완충시트(200)는, 부직포 시트(110)와, 상기 부직포 시트(110)의 적어도 일측면상에 형성된 코로나 처리층(corona treated layer)(220)과, 상기 코로나 처리층(220) 상에 형성되며 탄소나노튜브를 포함하는 ESD 코팅층(130)을 구비한다. 3 is a cross-sectional view illustrating a buffer sheet 200 used in a vacuum chuck for adsorbing a workpiece according to another embodiment of the present invention. As shown in FIG. 3, the buffer sheet 200 includes a nonwoven fabric sheet 110, a corona treated layer 220 formed on at least one side of the nonwoven fabric sheet 110, and the corona treatment. The ESD coating layer 130 is formed on the layer 220 and includes carbon nanotubes.
상기 부직포 시트(110) 및 ESD 코팅층(130)의 소재 및 구조는 도 1을 참조하여 설명한 부직포 시트 및 ESD 코팅층과 동일하므로 중복된 설명은 생략한다. 코로나 처리는 고주파 및 고전압의 출력을 방전 전극과 롤러 사이에 인가하여 코로나 방전을 발생시키고, 이렇게 형성된 코로나 방전 하에서 기재를 통과시켜 기재를 표면 처리하는 방식을 의미한다. 상기 코로나 처리층(220)은 코로나 방전 조건 하에서 부직포 시트(110)의 표면을 코로나 처리하여 형성된 층으로, CNT 코팅용액의 접착력을 강화하고, 코팅 얼룩을 개선하며, 적층되는 ESD 코팅층(130)의 두께를 줄이는 효과가 있다. Materials and structures of the nonwoven fabric sheet 110 and the ESD coating layer 130 are the same as the nonwoven fabric sheet and the ESD coating layer described with reference to FIG. Corona treatment refers to a method of applying a high frequency and high voltage output between a discharge electrode and a roller to generate a corona discharge, and surface treating the substrate by passing the substrate under the corona discharge thus formed. The corona treatment layer 220 is a layer formed by corona treatment of the surface of the nonwoven fabric sheet 110 under corona discharge conditions, and enhances adhesion of the CNT coating solution, improves coating stain, and laminates the ESD coating layer 130. It has the effect of reducing the thickness.
이하, 구체적 실험예를 통하여 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail through specific experimental examples.
실시예로서는, 도 1에 도시된 완충시트(100)를 제조함에 있어서, 수성 용매로서 에탄올을 41.86 중량%, 수성 용매로서 탈이온수를 42.5 중량%, 도막 평활제로서Dynol™ 604를 0.04 중량%, 수분산 폴리우레탄으로서Sancure™ 898을 15.0 중량%, 및 다중벽탄소나노튜브(MWCNT)를 0.6 중량% 조성비로 혼합하여 CNT 코팅용액을 제조하고 이를 도포 및 경화하여 ESD 코팅층(130)을 형성하였다. 이와 같이 제조된 ESD 코팅층(130)을 부직포 시트(110)에 코팅하여, 실시예를 제조 한 후에 물성 시험을 행하였다. For example, in preparing the buffer sheet 100 shown in FIG. 1, 41.86% by weight of ethanol as an aqueous solvent, 42.5% by weight of deionized water as an aqueous solvent, 0.04% by weight of Dynol ™ 604 as a film smoothing agent, water 15.0 wt% of Sancure ™ 898 and 0.6 wt% of multiwall carbon nanotubes (MWCNT) as a dispersion polyurethane were mixed to prepare a CNT coating solution, and then applied and cured to form an ESD coating layer 130. The ESD coating layer 130 prepared as described above was coated on the nonwoven fabric sheet 110, and then a physical property test was performed after preparing the embodiment.
이와 비교되는 비교예로서는, 폴리에틸렌 분말의 소결다공질막 형성체로 형성시킨 필름(sunmap 제품, ㈜NITTO DENKO)을 사용하였다.As a comparative example compared with this, the film (sunmap product, NITTO DENKO Co., Ltd.) formed from the sintered porous film formation body of polyethylene powder was used.
이에 대한 시험 결과는 다음 표와 같았다. The test results were as shown in the following table.
표 1
시험 물성치 단위 실시예 비교예 측정방법
공기투과도 cm3/cm2·S 137 11.6 JIS L 1096:2010A
인장강도 N/cm2 MD1):1174CD2): 1307 MD: 1188CD: 1233 KS M 3001:2006
표면저항 ohm/sq 106.4 1010.2 ASTM D 257
1) MD : Machine Direct2) CD : Cross Direct
Table 1
Test property value unit Example Comparative example How to measure
Air permeability cm 3 / cm 2 · S 137 11.6 JIS L 1096: 2010A
The tensile strength N / cm 2 MD 1) : 1174CD 2) : 1307 MD: 1188CD: 1233 KS M 3001: 2006
Surface resistance ohm / sq 10 6.4 10 10.2 ASTM D 257
1) MD: Machine Direct 2) CD: Cross Direct
표 1에 기재된 바와 같이, 실시예의 경우, 공기 투과도가 비교예보다 10배 이상 우수한 것을 알 수 있다. 이는 부직포 소재 특성상 기공도가 높고 이에 따라서 공기투과도가 우수하기 때문이다. 이에 따라서 진공 척으로부터의 압력의 전달력도 실시예가 보다 우수하다는 것을 알 수 있다. As shown in Table 1, in the case of the Example, it turns out that air permeability is 10 times more excellent than a comparative example. This is because of the high porosity and excellent air permeability due to the nature of the nonwoven fabric material. Accordingly, it can be seen that the embodiment is also superior in the transmission force of the pressure from the vacuum chuck.
반면, 인장강도는 실시예와 비교예와 거의 동일한 것을 알 수 있다. 이는 완충시트(200)에 탄소나노튜브를 포함시킴으로써, 인장강도 등의 기계적 물성이 우수해지기 때문이다. On the other hand, it can be seen that the tensile strength is almost the same as in the Examples and Comparative Examples. This is because the carbon nanotubes are included in the buffer sheet 200, thereby improving mechanical properties such as tensile strength.
또한, 표전저항은, 실시예의 경우 106.4ohm/sq로 정전기 방지 발생의 효과가 우수한 것을 알 수 있으며, 이와 달리 비교예의 경우 표면저항이 1010.2ohm/sq로서 표면저항이 커서 정전기 방지 발생의 효과가 적정하지 않게 된다. In addition, the sheet resistance is 10 6.4 ohm / sq in the case of the embodiment, it can be seen that the effect of the generation of anti-static is excellent, whereas in the comparative example, the surface resistance is 10 10.2 ohm / sq. Is not appropriate.
이에 따라서 도 4에 도시된 바와 같이, 실시예의 경우 박리 대전압이 200V로 비교예보다 훨씬 낮은 것을 알 수 있다.Accordingly, as shown in FIG. 4, in the case of the embodiment, it can be seen that the peeling electrification voltage is 200 V, which is much lower than that of the comparative example.
본발명은 도면에 도시된 실시예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 당해 분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한타실시예가 가능함을 이해할 수 있을 것이다. 따라서 본 발명의 진정한보호범위는 첨부된 특허청구범위에 의해서만 정해져야 할 것이다. Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.
본 발명은 반도체 산업, 디스플레이 산업 등에 사용 가능하다.The present invention can be used in the semiconductor industry, the display industry and the like.

Claims (6)

  1. 피가공체를 흡착하여 고정시키는 진공척의 상면에 결합되며, 상기 피가공체가 안착되는 것으로서, It is coupled to the upper surface of the vacuum chuck to suck and fix the workpiece, the workpiece is seated,
    부직포 시트: 및Nonwoven sheet: and
    상기 부직포 시트상에, 탄소나노튜브(carbon nano tube)를 포함하여 이루어진 ESD 코팅층:On the nonwoven sheet, ESD coating layer comprising a carbon nanotube (carbon nano tube):
    을 구비하는 것을 특징으로 하는 피가공체를 흡착하는 진공 척에 사용되는 완충시트. A cushioning sheet used for the vacuum chuck to adsorb the workpiece, characterized in that it comprises a.
  2. 제1 항에 있어서, According to claim 1,
    상기 부직포 시트는 폴리에틸렌(polyethylene) 및 폴리에틸렌 테레프탈레이트(polyethylene terephthalate)를 포함하는 것을 특징으로 하는 피가공체를 흡착하는 진공 척에 사용되는 완충시트.The nonwoven sheet is a cushioning sheet used in the vacuum chuck to adsorb the workpiece, characterized in that the polyethylene (polyethylene) and polyethylene terephthalate (polyethylene terephthalate).
  3. 제2 항에 있어서, The method of claim 2,
    상기 부직포 시트는, 상기 폴리에틸렌테레프탈레이트를 저밀도 폴리에틸렌이 감싸서 이루어진 단위구조가 연속적으로 이루어져서 형성된 것을 특징으로 하는 피가공체를 흡착하는 진공 척에 사용되는 완충시트.The nonwoven fabric sheet is a cushioning sheet used in a vacuum chuck for adsorbing a workpiece, characterized in that the unit structure formed by wrapping the polyethylene terephthalate with low density polyethylene is formed continuously.
  4. 제1 항 내지 제3 항 중 어느 하나의 항에 있어서, The method according to any one of claims 1 to 3,
    상기 부직포 시트 및 상기 ESD 코팅층 사이에, 상기 ESD 코팅층의 접착력을 증대시키기 위한 프라이머층(primer layer)를 더 구비하는 것을 특징으로 하는 피가공체를 흡착하는 진공 척에 사용되는 완충시트.And a primer layer between the nonwoven fabric sheet and the ESD coating layer to increase adhesion of the ESD coating layer.
  5. 제1 항 내지 제3 항 중 어느 하나의 항에 있어서, The method according to any one of claims 1 to 3,
    상기 ESD 코팅층은:The ESD coating layer is:
    용매와, 상기 용매에 혼합된 것으로, 용매에 페녹시(phenoxy), AUD(Acryl urethane Dispersion),Carboxyl-Modified Vinyl Copolymer, 수분산 폴리우레탄(waterborne polyurethane), 폴리에스테르, 및 폴리비닐부틸알 중에서 선택된 적어도 하나의 수지와, 탄소나노튜브를 포함하여 이루어진 CNT 코팅용액를 도포하여 형성되고, A solvent, mixed with the solvent, selected from phenoxy, acryl urethane dispersion (AUD), carboxyl-modified vinyl copolymer, waterborne polyurethane, polyester, and polyvinyl butylal in the solvent It is formed by applying a CNT coating solution comprising at least one resin and carbon nanotubes,
    상기 수지는, 상기 CNT 코팅용액 중량의 5 내지 30 중량%, 상기 탄소나노튜브는 상기 CNT 코팅용액 중량의 0.1 내지 5.0 중량%를 차지하는 것을 특징으로 하는 피가공체를 흡착하는 진공 척에 사용되는 완충시트.The resin is 5 to 30% by weight of the weight of the CNT coating solution, the carbon nanotubes occupy 0.1 to 5.0% by weight of the weight of the CNT coating solution buffer used in the vacuum chuck to adsorb the workpiece Sheet.
  6. 제1항 내지 제3항 중 어느 하나의 항에 있어서, The method according to any one of claims 1 to 3,
    상기 ESD 코팅층의 표면 저항은 106 ohm/sq 내지 108 ohm/sq인 것을 특징으로 하는 피가공체를 흡착하는 진공 척에 사용되는 완충시트.The surface resistance of the ESD coating layer is a buffer sheet used in the vacuum chuck for adsorbing the workpiece, characterized in that 10 6 ohm / sq to 10 8 ohm / sq.
PCT/KR2012/004597 2011-06-10 2012-06-11 Buffer sheet used in vacuum chuck that adsorbs object to be processed WO2012169858A2 (en)

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WO2019022293A1 (en) * 2017-07-27 2019-01-31 주식회사 스마테크 Composite sheet for protecting flexible substrate during suction
CN107283448B (en) * 2017-08-01 2024-02-06 南京协辰电子科技有限公司 Substrate adsorption device
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