KR101440752B1 - Composite film, Composite sheet having the same, and its Manufacturing method - Google Patents

Abstract

The present invention relates to a composite film and a composite sheet including the same and a manufacturing method thereof and, more specifically, to a polymer composite film including polyvinyl chloride, polyethylene terephthalate, and at least one among the polymers and carbon nanotube (CNT), a composite sheet including the composite film and a manufacturing method thereof. The present invention provides a composite film and a composite sheet which are capable of improving thermal conductivity and efficiently transmitting pressure. Also, the composite sheet is capable of reducing energy consumption and processing hours in a stacking process of a printed circuit board.

Description

TECHNICAL FIELD [0001] The present invention relates to a composite film, a composite sheet including the composite film, and a method for manufacturing the composite film,

The present invention relates to a composite film, a composite sheet including the composite film, and a method for manufacturing the composite film.

BACKGROUND ART Flexible printed circuit boards (FPCBs) are manufactured by photolithography or etching (etching) a metal thin film laminate (a copper foil laminate film) on which a copper or other metal film is laminated on a flexible substrate film. ) Technology and the like to fabricate a conductor circuit pattern.

One of the key processes in the manufacturing process of such a flexible printed circuit board is a lamination process. The lamination process of a general flexible printed circuit board is a process of bonding a copper foil, a polyimide (PI), a PI film and a PI film to an adhesive by applying heat and pressure at a predetermined temperature and pressure in the upper and lower portions. In order to reduce the physical impact by reducing the pressure applied to the flexible printed circuit board, to transfer heat to the flexible printed circuit board, and to reduce the step according to the thickness of the copper foil of the circuit, Various materials such as PET, release film, paper, and aluminum foil are used.

For example, it can be used as a lamination film laminated on one side of an FPCB, in the order of release film (PET), PVC, paper, PET and aluminum foil.

Since the above materials perform 10 to 15 circuits at once in the flexible printed circuit board laminating process, the lay-up process also consumes a considerable amount of time. In addition, these materials are discarded after one use to generate a large amount of waste and increase the processing cost. In addition, since the work is performed for one and a half hours at a pressure of 1 ton at 150 DEG C to apply a constant temperature and pressure, high energy loss is caused and the process efficiency is lowered.

Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made to solve the above-mentioned problems occurring in the prior art, and it is an object of the present invention to provide a composite film capable of achieving thermal conductivity and efficient pressure transmission and improving process efficiency in a step of laminating a flexible printed circuit board, And a method for manufacturing the same.

However, the problems to be solved by the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

The polymer composite film of the present invention comprises (a) at least one of polyvinylchloride, polyethylene terephthalate and polymers thereof; And (b) carbon nanotubes (CNTs); .

The polyvinyl chloride may be soft or rigid polyvinyl chloride.

The polymer composite film may further comprise a rubber-modified vinyl-based polymer.

And 0.2 to 2 parts by weight of the carbon nanotubes relative to 100 parts by weight of the polymer composite film. In addition, the carbon nanotubes may have an average particle diameter of 5 to 30 nm.

The epoxy composite film of the present invention comprises (a) an epoxy resin; And (b) a fibrous filler and a thermally conductive inorganic particle dispersed in the epoxy resin; .

5 to 50 parts by weight of the fibrous filler per 100 parts by weight of the epoxy composite film; And 2 to 8 parts by weight of the thermally conductive inorganic particles; . ≪ / RTI >

The thermally conductive inorganic particles may be particles having an average particle diameter of 10 to 60 mu m.

The composite sheet of the present invention comprises a polymer composite film layer comprising a polymer composite film according to the present invention; An adhesive layer formed on at least one side of the polymer composite film layer; And an epoxy composite film layer formed on the adhesive layer and including an epoxy composite film according to the present invention.

Wherein the adhesive layer comprises a silicone polymer; And at least one metal selected from the group consisting of Cu, Al, Zn, and Ag, and the metal may be applied between the silicone polymer and the epoxy composite film layer.

The silicone polymer may be a copolymer of a silicone resin and polyurethane comprising at least one of polydimethylsiloxane and oligosiloxane.

Based on 100 parts by weight of the silicone polymer, 5 to 20 parts by weight of the metal.

The metal may have an average particle diameter of from 5 to 25 mu m.

The method for producing a composite sheet according to the present invention includes the steps of: preparing a mixture of THF (tetrahydropyran) and DOP (Dioctyl phthalate) in which carbon nanotubes are dispersed; the mixture; and a mixture of polyvinyl chloride, polyethylene terephthalate, Forming a polymer composite film layer by mixing the polymer composite material, forming an adhesive layer on at least one surface of the polymer composite film layer, and forming an adhesive layer on the adhesive layer, , A fibrous filler, and an epoxy composite film layer in which thermally conductive inorganic particles are dispersed.

The step of forming the adhesive layer may include coating a silicone polymer on at least one surface of the polymer composite film layer and applying at least one metal selected from the group consisting of Cu, Al, Zn, and Ag onto the adhesive.

The present invention provides a composite film having improved functions such as heat dispersion, heat conduction and pressure transmission, and the composite film can shorten the operation time of the lamination process of the flexible printed circuit board and provide effects such as energy saving and waste reduction can do.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a general configuration of a film for a lamination process of a flexible printed circuit board used in the prior art.
2 is a conceptual view of a composite sheet according to an embodiment of the present invention.
FIG. 3 is a view showing a film stacking state used in a lamination process of a flexible printed circuit board including a composite sheet according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, terms used in this specification are terms used to appropriately express the preferred embodiments of the present invention, which may vary depending on the user, the intention of the operator, or the practice of the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification. Like reference symbols in the drawings denote like elements.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a general configuration of a film for a lamination process of a flexible printed circuit board used in the prior art. 1, a laminated film (PET) 120, a PVC 130, a paper 140, a PET 150, and an aluminum foil 160 are stacked in this order on one surface of an FPCB 110, Film 100 is used. The present invention relates to a novel structure for improving the above-described problems of the conventional lamination film.

According to an embodiment of the present invention, the polymer composite film may include at least one of polyvinylchloride, polyethylene terephthalate, and polymers thereof; And carbon nanotubes; .

The carbon nanotubes may be dispersed in a form dispersed in at least one of the above polyvinyl chloride, polyethylene terephthalate and polymers thereof.

The polymer composite film may include polyvinyl chloride or polyethylene terephthalate; Or polyvinyl chloride, and a mixture of polyethylene terephthalate, and the polyvinyl chloride and polyethylene terephthalate may be mixed at a mixing ratio (w / w) of 9: 1 to 7: 3. The polyvinyl chloride may be soft or rigid polyvinyl chloride.

The polymer composite film may further comprise a rubber-modified vinyl-based polymer in order to soften or harden the film. The kind of the rubber-modified vinyl-based polymer can be appropriately selected according to the field to which the polymer composite film is applied, for example, the specification of the FPCB and the material to be laminated with the FPCB. For example, the rubber-modified vinyl polymer may be at least one rubber-like polymer selected from natural rubber, styrene-butadiene rubber, butadiene rubber, polychlorprene rubber, acrylonitrile-butadiene rubber, acrylic rubber and silicone rubber; And polyvinyl chloride. [0035] The term " polyvinyl chloride "

The carbon nanotubes can be dispersed in the polymer to improve the thermal conductivity of the film. The carbon nanotubes may be at least one of a single-walled carbon nanotube and a multiple-walled carbon nanotube, and may be a multi-walled carbon nanotube.

The carbon nanotubes may be included in an amount of 0.2 to 2 parts by weight based on 100 parts by weight of the polymer composite film. If the content of the carbon nanotubes is less than 0.2 parts by weight, the effect of thermal decomposition by the carbon nanotubes is not sufficient. The stability of the polymer matrix in crystallization may become poor and the elasticity of the film may deteriorate.

The carbon nanotubes may have an average particle diameter of 5 to 50 nm, preferably 5 to 30 nm. If the diameter of the carbon nanotubes is less than 5 nm, the cost of the film is lowered and the production cost of the film is lowered. If the diameter is more than 50 nm, the dispersion of the carbon nanotubes in the polymer matrix may be deteriorated.

The polymer composite film may have a heat resistance of 100 to 200 캜. Exceeding the heat resistance range may result in defective products in the process of applying heat and pressure. For example, during the FPCB lamination process, the interlayer adhesive is not impregnated between the circuit and the circuit, and delamination may occur in the circuit, or the resin may flow excessively, resulting in a fatal product defect.

According to one embodiment of the present invention, an epoxy composite film comprises an epoxy resin; And a fibrous filler and thermally conductive inorganic particles dispersed in the epoxy resin.

The fibrous filler and the thermally conductive inorganic particles dispersed in the epoxy resin can improve the thermal conductivity and the thermal diffusivity and can alleviate the thermal shock applied to the film and can provide efficient pressure transmission.

The fibrous filler may be pulp, cellulose pulp, wood pulp, or the like. The fibrous filler may be included in an amount of 5 to 50 parts by weight based on 100 parts by weight of the epoxy composite film. If the amount is less than 5 parts by weight, the effect of thermal shock mitigation is insufficient, and the epoxy film may be damaged by thermal shock. The thermal conductivity may be lowered or the fibrous filler may be clumped, so that the foreign matter due to the fibrous filler may protrude to the outside of the epoxy film.

The thermally conductive inorganic particles, Si, SiO _2, and Al ₂ O ₃ And may be surface-treated with a silane compound for uniform dispersion in an epoxy resin. The silane compound may be at least one of aminosilane, methoxysilane, epoxysilane, hydroxysilane, vinylsilane, alkoxysilane and chlorosilane, preferably aminosilane.

The thermally conductive inorganic particles may be contained in an amount of 2 to 8 parts by weight based on 100 parts by weight of the epoxy composite film. When the amount is less than 2 parts by weight, the effect of improving thermal shock can not be obtained. When the amount is more than 8 parts by weight, Or when the inorganic particles surface-treated with silane are used, the portion treated with the silane may induce phonon scattering in the epoxy resin to lower the thermal conductivity of the film.

The thermally conductive inorganic particles may have an average particle diameter of 10 to 60 mu m. If the average particle diameter of the thermally conductive inorganic particles is less than 10 mu m, there is a problem in the cost of the product. If the average particle diameter exceeds 60 mu m, the dispersibility of the inorganic particles is lowered and the transfer of the high pressure becomes difficult. So that film damage may occur.

The epoxy composite film may have a heat resistance of 250 to 300 캜. If the heat resistance is out of the range, dispersion of heat applied to the film and pressure transmission may not be smooth. For example, in the FPCB lamination process, if sufficient heat dispersion and pressure transfer are not performed, the adhesive layer may not be sufficiently adsorbed to the copper foil, which may make it difficult to laminate the PI film and the copper foil.

According to one embodiment of the present invention, the composite sheet of the present invention includes the polymer composite film and the epoxy composite film of the present invention. The composite sheet is a composite sheet in which the polymer composite film and the epoxy composite film according to the present invention, which are made of polymers having different molecular structures and have different thermal conductivities, are integrated, and the composite sheet can exhibit excellent thermal conductivity and thermal diffusivity .

2 is a conceptual view of a composite sheet according to an embodiment of the present invention. A composite sheet according to the present invention will be described with reference to Fig. The composite sheet 200 of the present invention comprises a polymer composite film layer 210; An adhesive layer 220; And an epoxy composite film layer 230.

The polymer composite film layer 210 may be a polymer composite film in which the carbon nanotubes of the present invention are dispersed.

The adhesive layer 220 is formed on at least one surface of the polymer composite film layer 210, and is made of a silicone polymer 221 as an adhesive; And metal (222).

The metal 222 may be formed between the silicone polymer 221 and the epoxy composite film layer 230 and may be formed at the interface between the silicone polymer 221 and the epoxy composite film layer 230, have.

The silicone polymer 221 improves the adhesion between the polymer composite film layer 210 and the epoxy composite film layer 230 and serves as a cushion for providing good dispersibility against impact applied to the film. Preferably, the silicone polymer is a silyl group-containing polymer and may be, for example, a copolymer of a silicone resin and polyurethane comprising at least one of polydimethylsiloxane and oligosiloxane.

The metal 222 provides a function of efficiently transferring the heat and pressure applied to the epoxy composite film layer 230 to the polymer composite film layer 210 and may be at least one of Cu, Al, Zn, and Ag , Preferably Cu.

The metal (222) may be included in an amount of 5 to 20 parts by weight based on 100 parts by weight of the silicone polymer (221). If the metal (222) is less than 5, it is difficult to obtain a thermal conductivity increasing effect. The manufacturing cost may increase or the metal may be aggregated to weaken the adhesive force with the epoxy film layer and the cushioning effect may be inferior during the manufacturing process.

On the other hand, the metal 222 may have an average particle diameter of 5 to 25 μm. If the average particle diameter of the metal is less than 5 mu m, the adhesive force with the epoxy film layer becomes weak due to the small area bonded to the epoxy film layer. If the average particle diameter exceeds 25 mu m, the adhesive layer does not sufficiently cushion, Can be concentrated.

The epoxy composite film layer 230 is formed on the adhesive layer 220 and includes a fibrous filler 231 in the epoxy resin; And Si, SiO _2, and Al ₂ O ₃ The thermally conductive inorganic particles 232 may be dispersed in the epoxy composite film according to the present invention.

In the composite sheet 200, the thicknesses of the polymer composite film layer 210, the adhesive layer 220, and the epoxy composite film layer 230 can be appropriately adjusted to suit the field to which the composite sheet is applied. Preferably, the polymer composite film layer 210 has a thickness of 200 to 400 占 퐉, the adhesive layer 220 has a thickness of 15 to 40 占 퐉, and the epoxy composite film layer 230 has a thickness of 200 to 400 占 퐉.

According to an embodiment of the present invention, a method for producing a composite sheet of the present invention includes the steps of forming a polymer composite film layer, forming an adhesive layer, and forming an epoxy composite film layer.

The step of forming the polymer composite film layer may be performed by using a polymer composite material including carbon nanotubes. For example, mixing a solvent in which carbon nanotubes are dispersed and a plasticizer to prepare a mixture; The mixture, and at least one of polyvinyl chloride, polyethylene terephthalate, and polymers thereof; And polymerizing the mixture to form a polymer composite material; And forming a polymer composite film layer by molding the polymer composite material into a film; . ≪ / RTI >

The solvent may be selected from, for example, isopropyl alcohol, ethanol, methanol, butyl alcohol, chloroform, diethyl ether, hexane, cyclohexane, propylene glycol, monomethyl ether acetate, tetrahydrofuran, cyclotetrahydrofuran, , Preferably tetrahydrofuran, and the like.

The plasticizer may be at least one of DOP (Dioctyl phthalate), DOA (Dioctyladipate), TOTM (Trioctyl Trimellitate), DID (Diisodecyladipate), DOZ (dioctyladipate) and DOS (Dioctylsebacate) DOP (Dioctyl phthalate).

The step of forming the adhesive layer may be formed by coating a silicone polymer adhesive on at least one side of the polymer composite film layer and then coating at least one metal selected from the group consisting of Cu, Al, Zn, and Ag on the adhesive. Preferably, after applying the metal, the silicone polymer adhesive may be cured and a certain pressure may be applied to pend the metal particles to the surface of the adhesive layer.

The step of forming the epoxy composite film layer may include: a fibrous filler; And Si, SiO _2, and Al ₂ O ₃ Is coated on the adhesive layer to form an epoxy composite film layer. The applied epoxy composite can be dried or cured. The epoxy resin composite material is prepared by mixing an epoxy resin and a fibrous filler and then mixing Si, SiO ₂ , and Al ₂ O ₃ May be added and dispersed. Alternatively, the epoxy resin composite material may further include a curing agent, and at least one of the Si, SiO ₂ , and Al ₂ O ₃ may be surface-treated with a silane compound.

According to an embodiment of the present invention, the composite sheet may be applied to a flexible printed circuit board (FPCB). For example, it can be used as a film for a lamination process of a flexible printed circuit board (FPCB). By simplifying the auxiliary materials used in the process, it is possible to reduce waste and energy waste and provide improved process efficiency can do.

FIG. 3 shows a film for a lamination process of a flexible printed circuit board including a composite sheet according to the present invention, and a film for a lamination process of a flexible printed circuit board is described with reference to FIG. The flexible printed circuit board laminating film 300 may include a flexible printed circuit board 310, a release film 320, a composite sheet 330, 340, 350 and an Al foil 360.

The release film 320 is formed on the flexible printed circuit board 310 to prevent the composite sheets 330, 340 and 350 from being pressed against the flexible printed circuit board 310 during the laminating process. The release film 320 may comprise a polyethylene terephthalate film.

The composite sheets 330, 340, and 350 are formed on the release film 320 and can efficiently transmit heat and pressure applied during the lamination process, and can improve the energy efficiency and the working time of the lamination process. The Al foil 360 is formed on the composite sheets 330, 340, and 350 and has a function of transmitting a pressure applied to the FPCB in the laminating process. For example, when stacking multiple FPCBs in a stacking machine with a pressure of 1 ton or more, they have the function of separating each FPCB operation layup and delivering pressure.

It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the following claims It will be understood.

Example  One

PVC Composite Film Manufacturing

10 wt% of purified MWCNT (CNI, USA, MWCNT 110-DIAMETER 5-20 nm, purity 99%) was added to THF solution for 3 hours or more by ultrasonication. The THF solution in which MWCNT was dispersed was stirred at a ratio of 1: 1 (w / w) to a plasticizer DOP (LG Chem, LGFLEX DOP) of PVC resin (LG Chem, LS080S) A plasticizer with 5 wt% dispersed MWCNT was prepared. The DOP with MWCNT dispersed in PVC powder was stirred at a ratio of 20: 1 (w / w) to cause a polymerization reaction (emulsion polymerization reaction: temperature 40 to 60 ° C) in the simple tank to form a 0.1 wt% MWCNT- The resin was extracted and calendered with a film (Japan PLABOR COC extruder). The film has a thickness of 250 [mu] m. The thermal conductivity and the thermal diffusivity of the prepared film were measured and shown in Table 1.

Example  2

Except that 0.2 wt% of the MWCNT-PVC composite resin was used. The thermal conductivity and the thermal diffusivity were measured and shown in Table 1.

Example  3

Except that 1 wt% of MWCNT-PVC composite resin was used. The thermal conductivity and thermal diffusivity of the film were measured and shown in Table 1.

Example  4

Except that 2 wt% of MWCNT-PVC composite resin was used. The thermal conductivity and the thermal diffusivity were measured and shown in Table 1.

Comparative Example  One

Except that MWCNT was not added. The thermal conductivity and the thermal diffusivity were measured and shown in Table 1. The results are shown in Table 1. < tb >< TABLE >

Comparative Example 1 Example 1 Example 2 Example 3 Example 4 CNT addition amount (wt%) 0 0.1 0.2 One 2 Thermal conductivity
(W / mK) 4.447 5.251 5.907 11.557 15.224 Thermal diffusivity
(mm ² / s) 2.103 2.765 3.102 6.386 8.554

Example  5

(1) Epoxy Composites

The fibrous pulp (Korean pulp, natural pulp jumbo roll) was heated for 4 hours at a temperature of 80 to 100 ° C in a hot water bath, dried and then pulverized using a ball mill. The fibrous pulp powder was placed in an epoxy matrix (Diglycidyl ether of Bisphenol-A, National Kagaku KSR-177) and dispersed with stirring for 20 minutes to prepare a 10 wt% pulp-epoxy composite material.

(2) Epoxy Composite Film

An epoxy composite material containing 10 wt% of a hardener MTHPA (Methyl Tetrahydrophthalic anhydride, Kukdo Chemical Co., Ltd., G640) was prepared, and then calendered (Japan PLABOR COC extruder) with a film (thickness of 200 μm).

Example  6

The film was molded in the same manner as in Example 5 except that the 20 wt% pulp-epoxy composite material was produced, and the thermal conductivity and the thermal diffusivity were measured and shown in Table 2.

Example  7

The film was molded in the same manner as in Example 5 except that the 30 wt% pulp-epoxy composite material was produced, and the thermal conductivity and the thermal diffusivity were measured and shown in Table 2. [

Example  8

A film was molded in the same manner as in Example 5 except that an epoxy composite material containing 50 wt% pulp was produced, and thermal conductivity and thermal diffusivity were measured and shown in Table 2.

Comparative Example  2

The film was molded in the same manner as in Example 5 without adding the fibrous pulp, and the thermal conductivity and the thermal diffusivity were measured and shown in Table 2.

Comparative Example 2 Example 5 Example 6 Example 7 Example 8 Fiber (pulp) addition amount (wt%) 0 10 20 30 50 Thermal conductivity (W / m · K) 5.552 7.301 6.609 6.208 6.031 Thermal Diffusivity (mm ² / s) 2.745 4.916 4.363 3.775 3.427

Example  9

Si powder (20 to 50 mu m, ALDRICH, Silicon powder-325mesh) was dipped in the aminosilane solution for 30 minutes, put in a drier, and dried at 150 DEG C for two hours. Next, the dried Si powder was added to the epoxy composite material containing 30 wt% pulp of Example 7 and then stirred for 1 hour to prepare a pulp-Si-epoxy composite material containing 2 wt% Si. Next, an epoxy composite material containing 40 wt% of a hardening agent MTHPA (Methyl Tetrahydrophthalic anhydride, National Chemical Industries, Ltd., G640) was prepared and then calendered (Japan PLABOR COC extruder) with a film (thickness of 200 μm). The thermal conductivity and the thermal diffusivity of the film were measured and shown in Table 3.

Example  10

A film was formed in the same manner as in Example 9 except that a pulp-Si-epoxy composite material containing 5 wt% Si was produced. Thermal conductivity and thermal diffusivity were measured and shown in Table 3.

Example  11

A film was formed in the same manner as in Example 9 except that a pulp-Si-epoxy composite material containing 8 wt% Si was produced. Thermal conductivity and thermal diffusivity were measured and shown in Table 3.

Example 9 Example 10 Example 11 Si addition amount (wt%) 2 5 8 Thermal conductivity (W / m · K) 6.643 7.605 8.543 Thermal Diffusivity (mm ² / s) 3.765 4.558 6.008

Example  12

Manufacture of composite sheet

(SL220LB) was coated on the 250 탆 PVC composite film of Example 1 to a thickness of 20 탆, and then Cu powder (average particle diameter: 20 탆, ALDRICH, COPPER POWDER) The polymer is applied on the polymer in an amount of 5 wt% based on the silyl group-containing polymer, and is cured using a hot air blower. Next, an epoxy composite material of Example 10 containing 40 wt% of a hardening agent MTHPA (Methyl Tetrahydrophthalic anhydride, National Chemical Industries, G640) was coated on the Cu powder and then cured to form a 200 탆 thick epoxy composite film layer To prepare a composite sheet. The thermal conductivity and thermal diffusivity of the composite sheet were measured and shown in Table 4.

Comparative Example  3

A composite sheet was prepared in the same manner as in Example 12 except that Cu powder was not used, and the thermal conductivity and the thermal diffusivity were measured and shown in Table 4.

Comparative Example 3 Example 12 Cu content (wt%) 0 5 wt% Thermal conductivity (W / m · K) 5.578 5.954 Thermal Diffusivity (mm ² / s) 3.210 3.621

Comparative Example  4

A composite sheet was prepared in the same manner as in Example 12 except that a polyurethane-based adhesive (manufactured by UHU, MULTI-MATERIAUX) was used instead of the silyl group-containing polymer. Thermal conductivity and thermal diffusivity were measured and shown in Table 5.

Comparative Example 4 Example 12 glue Polyurethane adhesive Silyl group-containing polymer Thermal conductivity
(W / mK) 5.411 5.954 Thermal diffusivity
(mm ² / s) 3.189 3.621

Property evaluation method

The physical properties of the films and sheets prepared in the Examples and Comparative Examples were measured by the following methods.

(1) Thermal conductivity (W / m 占 K): Measured by the method specified in ASTM E1530.

(2) Thermal diffusivity (mm ² / s): Measured by the method specified in ASTM E1461.

It was confirmed that the polymer composite film, the epoxy composite film and the composite sheet comprising the same of the present invention exhibited improved functions of heat dissipation and thermal conductivity through the above Examples and Comparative Examples, and the use of the composite film of the present invention It is confirmed that the effect of shortening the working time, energy saving, waste reduction, etc. of the lamination process of the flexible printed circuit board can be expected.

Claims (17)

At least one of polyvinylchloride, polyethylene terephthalate and polymers thereof; And carbon nanotubes (CNTs); A polymer composite film layer comprising a polymer composite film comprising a polymer;
An adhesive layer formed on at least one side of the polymer composite film layer; And
An epoxy resin formed on the adhesive layer; And a fibrous filler and a thermally conductive inorganic particle dispersed in the epoxy resin; An epoxy composite film layer comprising an epoxy composite film comprising
.
The method according to claim 1,
Wherein the polyvinyl chloride is a soft or rigid polyvinyl chloride.
The method according to claim 1,
Wherein the polymer composite film further comprises a rubber-modified vinyl-based polymer.
The method according to claim 1,
With respect to 100 parts by weight of the polymer composite film,
And 0.2 to 2 parts by weight of the carbon nanotubes.
The method according to claim 1,
Wherein the carbon nanotubes have an average particle diameter of 5 to 30 nm.
delete The method according to claim 1,
With respect to 100 parts by weight of the epoxy composite film,
5 to 50 parts by weight of the fibrous filler; And
2 to 8 parts by weight of the thermally conductive inorganic particles;
The composite sheet comprising:
The method according to claim 1,
Wherein the thermally conductive inorganic particles are particles having an average particle diameter of 10 to 60 占 퐉.
The method according to claim 1,
Wherein the thermally conductive inorganic particles are at least one of Si, SiO ₂ , and Al ₂ O ₃ .
The method according to claim 1,
Wherein the fibrous filler is pulp.
delete The method according to claim 1,
The adhesive layer
Silicone polymers; And
Cu, Al, Zn and Ag,
Wherein the metal is applied between the silicone polymer and the epoxy composite film layer.
13. The method of claim 12,
Wherein the silicone polymer is a copolymer of a polyurethane with a silicone resin comprising at least one of polydimethylsiloxane and oligosiloxane.
13. The method of claim 12,
With respect to 100 parts by weight of the silicone polymer,
And 5 to 20 parts by weight of the metal.
13. The method of claim 12,
Wherein the metal has an average particle diameter of 5 to 25 占 퐉.
Preparing a mixture of THF (tetrahydropyran) and DOP (Dioctyl phthalate) in which carbon nanotubes are dispersed;
Said mixture; And at least one of polyvinyl chloride, polyethylene terephthalate and polymers thereof; To form a polymer composite material;
Forming a polymer composite film layer with the polymer composite material;
Forming an adhesive layer on at least one side of the polymer composite film layer; And
On the adhesive layer, a fibrous filler; And a step of forming an epoxy composite film layer in which thermally conductive inorganic particles are dispersed
Wherein the composite sheet is a sheet.
17. The method of claim 16,
Wherein forming the adhesive layer comprises:
Wherein at least one surface of the polymer composite film layer is coated with a silicone polymer and then at least one of Cu, Al, Zn and Ag is applied.
A method for manufacturing a composite sheet.

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