WO2012165310A1 - 流体圧インプリント装置およびインプリント方法 - Google Patents

流体圧インプリント装置およびインプリント方法 Download PDF

Info

Publication number
WO2012165310A1
WO2012165310A1 PCT/JP2012/063397 JP2012063397W WO2012165310A1 WO 2012165310 A1 WO2012165310 A1 WO 2012165310A1 JP 2012063397 W JP2012063397 W JP 2012063397W WO 2012165310 A1 WO2012165310 A1 WO 2012165310A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
molding
pressurizing
chamber
fluid
Prior art date
Application number
PCT/JP2012/063397
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
河口宏輔
田村裕宣
田中覚
Original Assignee
Ｓｃｉｖａｘ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｓｃｉｖａｘ株式会社 filed Critical Ｓｃｉｖａｘ株式会社
Priority to KR1020137034369A priority Critical patent/KR20140033159A/ko
Priority to CN201280027116.3A priority patent/CN103717376B/zh
Priority to JP2013518041A priority patent/JP5488766B2/ja
Priority to KR1020197011845A priority patent/KR20190047112A/ko
Publication of WO2012165310A1 publication Critical patent/WO2012165310A1/ja

Links

Images

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers

Definitions

  • the present invention relates to an imprint apparatus and an imprint method for continuously transferring a pattern of a mold to a workpiece.
  • nanoimprint technology has attracted attention as a method for forming micro-order and nano-order ultrafine patterns.
  • a mold having a fine pattern is pressed on a molded object such as resin, and the pattern is transferred to the molded object (see, for example, Patent Document 1).
  • an imprint apparatus using fluid pressure has been considered in order to increase the transfer area (see, for example, Patent Document 2).
  • the imprint apparatus described in Patent Document 2 is provided with deaeration means for reducing the atmosphere around the mold and the molding object and removing the gas between the mold and the molding object.
  • the object to be molded is a non-planar object having a large transfer area or a curved surface of a lens
  • the gas existing between the mold and the object to be molded is sufficient by simply providing a deaeration means. Sometimes it could not be removed.
  • an object of the present invention is to provide an imprint apparatus and an imprint method that can reliably remove the gas between the mold and the workpiece.
  • an imprint apparatus of the present invention is for transferring a molding pattern of a mold to a molding, and pressurizing the mold and the molding with a fluid
  • a pressurizing part having a chamber, a stage that supports the mold and the molding that have been subjected to the pressure of the pressurizing part, a pressurizing means that adjusts the pressure of the fluid in the pressurizing chamber, the mold, and the A decompression section having a decompression chamber for decompressing an atmosphere around the molding object, and a separating means for separating the mold and the molding object in the decompression chamber are provided.
  • fluid ejecting means for ejecting fluid into the gap formed at the end of the mold and the molding by the spacing means.
  • the pressurizing unit includes a pressurizing chamber casing that forms the pressurizing chamber together with the mold or the molding, a sealing unit that seals between the mold or the molding, and the pressurizing unit. Opening / closing means for opening and closing between the pressure chamber housing and the mold or the molding object, or flexible disposed on the surface in contact with the mold or the molding object What is necessary is just to comprise from the film
  • a temperature adjusting means for adjusting the temperature of the mold or the molding object, or a light irradiation means for irradiating the molding object with light having a predetermined wavelength.
  • the imprint method of the present invention is for transferring a molding pattern of a mold to a molding object, and the atmosphere around the mold and the molding object is maintained in a state where the mold and the molding object are separated from each other.
  • a depressurizing step for depressurization, a close-up step for closely closing the mold and the molding object, and a pressurizing step for pressurizing with a fluid in a state of close contact between the mold and the molding object It is characterized by.
  • the imprint apparatus of the present invention is for transferring a molding pattern of a mold 100 to a molding object 200, and pressurizes the mold 100 and the molding object 200 with a fluid.
  • a pressurizing unit 5 having a pressurizing chamber 51, a stage 2 that supports the mold 100 and the workpiece 200 that have received the pressure of the pressurizing unit 5, and a pressure that adjusts the pressure of the fluid in the pressurizing chamber 51.
  • the mold 100 is made of, for example, “metal such as nickel”, “ceramics”, “carbon material such as glassy carbon”, “silicon”, etc., and one end surface thereof (molding) Surface) having a predetermined pattern.
  • This pattern can be formed by subjecting the molding surface to precision machining.
  • it is formed on a silicon substrate or the like by a semiconductor micromachining technique such as etching, or the surface of the silicon substrate or the like is subjected to metal plating by an electroforming method, for example, nickel plating, and the metal plating layer is peeled off. It can also be formed.
  • a resin mold produced using an imprint technique In this case, the mold may be formed in a film shape that is flexible with respect to the molding surface of the molding object.
  • the material and manufacturing method of the mold 100 are not particularly limited as long as a fine pattern can be formed.
  • the molding pattern formed on the mold 100 is not only a geometrical shape composed of irregularities, but also for transferring a predetermined surface state, such as a mirror surface transfer having a predetermined surface roughness, Also included are those for transferring an optical element such as a lens having a predetermined curved surface.
  • the molding pattern is formed in various sizes such as the minimum width of the convex portion and the concave portion in the plane direction is 100 ⁇ m or less, 10 ⁇ m or less, 2 ⁇ m or less, 1 ⁇ m or less, 100 nm or less, 10 nm or less.
  • dimensions in the depth direction are formed in various sizes such as 10 nm or more, 100 nm or more, 200 nm or more, 500 nm or more, 1 ⁇ m or more, 10 ⁇ m or more, 100 ⁇ m or more.
  • the molded object 200 refers to a resin produced by, for example, a polymerization reaction (thermosetting or photocuring) of a thermoplastic resin or a polymerizable reactive group-containing compound.
  • thermoplastic resin examples include cyclic olefin ring-opening polymerization / hydrogenated product (COP) and cyclic olefin-based resin such as cyclic olefin copolymer (COC), acrylic resin, polycarbonate, vinyl ether resin, perfluoroalkoxyalkane (PFA), and the like.
  • Fluorine resin such as polytetrafluoroethylene (PTFE), polystyrene, polyimide resin, polyester resin, or the like can be used.
  • Resins produced by polymerization reaction (thermosetting or photocuring) of polymerizable reactive group-containing compounds include epoxide-containing compounds, (meth) acrylic acid ester compounds, vinyl ether compounds, bisallyl nadiimide compounds As described above, unsaturated hydrocarbon group-containing compounds such as vinyl groups and allyl groups can be used. In this case, it is possible to use the polymerization-reactive group-containing compounds alone for thermal polymerization, and to add a heat-reactive initiator to improve thermosetting. Is also possible. Furthermore, the thing which can add a photoreactive initiator and can advance a polymerization reaction by light irradiation and can form a shaping
  • Organic peroxides and azo compounds can be preferably used as the heat-reactive radical initiator, and acetophenone derivatives, benzophenone derivatives, benzoin ether derivatives, xanthone derivatives and the like can be preferably used as the photoreactive radical initiator.
  • the reactive monomer may be used without a solvent, or may be used after being dissolved in a solvent and desolvated after coating.
  • the molded object 200 may be a flexible film or a layer formed on a substrate made of an inorganic compound such as silicon or a metal. Further, the molded object 200 is not limited to a planar one, and includes, for example, a molded object having a curved surface such as a lens (see FIGS. 5 and 6).
  • the mold 100 is arranged on the stage 2 side and the molding object 200 is arranged on the pressing part 5 side, but the molding object 200 is arranged on the stage 2 side and the mold 100 is arranged on the pressing part 5 side. It doesn't matter.
  • the pressurizing unit 5 includes a pressurizing chamber 51 for directly or indirectly pressurizing the mold 100 and the molding target 200 with a fluid.
  • the pressurizing chamber 51 includes the pressurizing chamber 51 together with the mold 100 or the molding target 200.
  • Sealing means 54 for sealing between the pressurizing chamber casing 52 and the mold 100 or the molding object 200, and opening and closing between the pressurizing chamber casing 52 and the mold 100 or the molding object 200. What is necessary is just to comprise with an opening-and-closing means (not shown).
  • FIG. 3 shows a case where the pressurizing chamber 51 is configured by the pressurizing chamber casing 52 and the molding 200.
  • the pressurizing chamber casing 52 is formed in a bottomed cylindrical shape having an opening, and constitutes the pressurizing chamber 51 which is a sealed space by closing the opening with the mold 100 or the molding object 200. It is.
  • the opening is formed to be larger than at least the pattern region transferred to the molding object 200.
  • the material may be anything as long as it has pressure resistance and heat resistance with respect to the molding conditions during the imprint process. For example, iron materials such as carbon steel and metals such as SUS can be used.
  • the sealing means 54 is for bringing the pressurizing chamber casing 52 into close contact with the mold 100 or the molding target 200 in order to seal the pressurizing chamber 51.
  • an O-ring is prepared as the sealing means 54, and a concave groove 55 shallower than the diameter of the cross-section of the O-ring is formed at the stage side end of the side wall 52A of the pressurizing chamber housing 52.
  • an O-ring may be disposed in this groove.
  • the opening / closing means opens and closes the pressurizing chamber 51 by bringing the pressurizing chamber casing 52 and the mold 100 or the molding 200 close to or away from each other. It is possible to apply one that moves by a hydraulic or pneumatic cylinder, one that moves by an electric motor and a ball screw, or the like.
  • the mold 100 or the molding target 200 constituting the pressurizing chamber 51 is a flexible film. In this way, a uniform pressure by the fluid can be applied to the surface to be molded.
  • the pressurizing unit 5 includes a flexible film disposed on the surface in contact with the mold 100 or the molding object 200, and a pressurizing chamber that forms a pressurizing chamber together with the film. You may comprise with the housing
  • an elastic body such as resin, thin metal, or rubber can be used.
  • a material that can transmit the light is selected for the film.
  • the thickness of the film is 10 mm or less, preferably 3 mm or less, more preferably 1 mm or less.
  • the casing for the pressurizing chamber is formed in a bottomed cylindrical shape having an opening as in the previous example. Further, the pressurizing chamber casing and the membrane are fixed by an adhesive or the like, and the pressurizing chamber is sealed.
  • the pressurizing chamber casing and the membrane may be sealed by a sealing means in the same manner as described above.
  • the stage 2 is for supporting the mold 100 and the molding object 200 that have received the pressure of the pressurizing unit 5.
  • the surface of the stage 2 that comes into contact with the mold 100 or the workpiece 200 is sufficiently wide and smooth.
  • the material may be anything as long as it has pressure resistance and heat resistance with respect to the molding conditions during the imprint process.
  • iron materials such as carbon steel and metals such as SUS can be used.
  • a metal or the like having high thermal conductivity.
  • a low thermal conductivity material may be used to prevent heat from escaping to the stage 2 side.
  • the stage surface In order to prevent this, it is preferable to configure the stage surface with a material having high thermal conductivity.
  • a transparent material such as glass may be used.
  • the mold 100 and the stage 2 may be integrally formed in order to prevent unnecessary transfer marks from being generated on the molding target 200. For example, conventionally, after a pattern is formed by electroforming, only the portion of the pattern is cut out and used, but this can be used as it is without being cut out.
  • the pressurizing means 6 may be anything as long as the pressure of the fluid in the pressurizing chamber 51 can be adjusted to a pressure at which the pattern of the mold 100 can be transferred to the molding target 200.
  • the pressurizing chamber gas supply / discharge channel 62 is connected to the pressurizing chamber 52, and air or an inert gas or the like is supplied or exhausted to the pressurizing chamber 51 via the pressurizing chamber gas supply / exhaust channel 62. Just do it.
  • a gas supply source 61 such as a cylinder or a compressor having a compressed gas can be used.
  • the gas may be exhausted by opening and closing a deaeration valve. In addition, you may provide a safety valve etc. suitably.
  • the decompression unit 9 has a decompression chamber 91 for decompressing the atmosphere around the mold 100 and the molding object 200, particularly the atmosphere between the mold 100 and the molding object 200.
  • the gas existing between the object 200 and the stage 2 can be removed, and the mold 100 and the object 200 can be pressed uniformly.
  • Examples of the decompression unit 9 include a decompression chamber 91 containing either one or both of the mold 100 and the molding 200, a decompression chamber gas supply / discharge channel 95 connected to the decompression chamber, and a decompression chamber gas. What is necessary is just to comprise with the pump 96 for pressure reduction which exhausts the gas in the pressure reduction chamber 91 through the supply / discharge flow path 95.
  • FIG. 1 A decompression chamber 91 containing either one or both of the mold 100 and the molding 200, a decompression chamber gas supply / discharge channel 95 connected to the decompression chamber, and a decompression chamber gas.
  • the decompression chamber 91 covers the pressurizing chamber casing 52, a flange portion 52 ⁇ / b> B extending horizontally from the upper portion of the pressurizing chamber casing 52, and the pressurizing chamber casing 52.
  • the bellows 93 hanging from the flange portion 52B, the seal member 94 for sealing between the bellows 93 and the stage 2, and the stage 2 are formed. Therefore, the pressurizing chamber 51 is also a part of the decompression chamber.
  • the seal member 94 is disposed in a concave groove 97 formed on the stage 2 side of the bellows 93.
  • the decompression pump 96 may be any pump that can decompress the decompression chamber 91 to the extent that no transfer failure occurs when the molding 200 is pressurized to the mold 100. Needless to say, the bellows 93 and the seal member 94 are strong enough to withstand external force when decompressed.
  • the gas supply / discharge flow path 62 for the pressurizing chamber and the gas supply / discharge flow path 95 for the decompression chamber common.
  • the gas in the decompression chamber 91 and the pressurization chamber 51 is removed in a state where the pressurization chamber 51 is released to remove the gas in the decompression chamber 91, and then the pressurization chamber 51 is closed, What is necessary is just to supply the gas to the pressurizing chamber 51 and press the molding object 200 against the mold 100.
  • the pressurizing unit 5 is composed of a pressurizing chamber casing and a flexible membrane, and the pressurizing chamber casing and the membrane are fixed to each other with an adhesive or the like, it is applied at the time of decompression.
  • Pressure reducing pressure adjusting means (not shown) for making the pressure in the pressure chamber 51 and the pressure reducing chamber 91 the same may be provided.
  • the pressure adjusting means for pressure reduction for example, a communication path that connects the pressurizing chamber 51 and the decompression chamber 91 via an on-off valve may be provided. Thus, by opening the on-off valve at the time of decompression, the pressurizing chamber 51 and the decompression chamber 91 can be made to have the same pressure.
  • the separating means 7 is for separating the mold 100 and the molded article 200 between the mold 100 and the molded article 200 in the decompression chamber 91 and reducing the gas between the mold 100 and the molded article 200 with certainty. Thereby, gas can be reliably removed even when the transfer area is increased.
  • the separation means 7 may be anything as long as it forms a gap 150 between the mold 100 and the workpiece 200. For example, as shown in FIG. What is necessary is just to comprise by the clamping part 71 which clamps, and the raising / lowering means 72 which moves the said clamping part 71 in the direction in which the type
  • the holding part 71 for example, a clip or the like that holds and holds an elastic force such as a spring can be used.
  • the lifting / lowering means 72 one that is moved by a hydraulic or pneumatic cylinder, one that is moved by an electric motor and a ball screw, or the like can be used.
  • the imprint apparatus may be provided with fluid ejecting means 3 that ejects fluid to the ends of the mold 100 and the molding 200. Accordingly, the mold 100 can be released by injecting a fluid into the gap by forming the gap between the mold 100 and the end of the molding 200 that are in close contact with each other by using the separating means 7.
  • the fluid ejecting means 3 includes an ejection port 31 that ejects fluid between the mold 100 and the molding 200, a flow rate adjusting means (not shown) that regulates the flow rate of the fluid ejected from the ejection port 31, and the ejection port 31. And a fluid supply source (not shown) for supplying fluid to the main body.
  • the injection port 31 can be formed, for example, in the form of a slit formed along the end of the molding 200.
  • the width of the slit may be adjusted in accordance with the adhesive force between the mold 100 and the molded article 200, but for example, a slit having a width of 0.2 to 0.5 mm may be used. It is also possible to use a multi-nozzle in which a plurality of holes are provided at appropriate intervals along the end of the molding 200.
  • the injection port 31 may be provided independently of the separating means 7, but may be formed integrally with the lower portion of the above-described holding portion 11, for example.
  • the injection port 31 is provided at a position facing the molding object 200.
  • the fluid ejected from the opposing position collides at the center between the mold 100 and the molding 200.
  • the fluid loses speed and changes from dynamic pressure to static pressure, and the static pressure at the collision portion becomes higher than the pressure on the upper surface of the molding object 200, so that the molding object 200 is lifted.
  • the energy of the ejected high-speed fluid is converted to static pressure, so that the pattern transferred to the molding 200 is damaged by instantaneously eliminating the peeling, eddy current, and shearing force generated on the wall surface. It can be prevented from receiving.
  • the injection port 31 can of course be provided at a position where the fluid is injected from three directions or four directions.
  • the flow rate adjusting means may be any device as long as it can adjust the flow rate of the fluid ejected from the ejection port 31.
  • a device that regulates the flow rate by the pressure and the ejection time can be used.
  • the fluid pressurized to 0.2 to 0.5 MPa with an accumulator may be ejected with a pulse of 50 to 300 ms.
  • an air compressor that sends gas to the injection port 31, a cylinder that stores compressed gas, or the like can be used.
  • the temperature adjusting means is for adjusting the temperature of the molding by heating or cooling the molding.
  • a heating means for directly or indirectly heating the molding or a cooling means for cooling can be used.
  • any heating means can be used as long as one or both of the mold 100 and the molding 200 can be heated to a predetermined temperature, for example, the glass transition temperature or the melting temperature of the molding 200 or higher. But it ’s okay.
  • the object 200 may be heated from the stage 2 side or heated from the pressurizing chamber 51 side.
  • a heater provided in the stage 2 to heat the mold 100 and the molding object 200 from the stage 2 side can be used.
  • a radiant heat source for heating by electromagnetic radiation such as a ceramic heater or a halogen heater may be provided in the pressurizing chamber 51 so as to heat the mold 100 or the molded article 200. It is also possible to heat using a heated liquid or gas.
  • any cooling means may be used as long as one or both of the mold 100 and the molding 200 can be cooled to a predetermined temperature, for example, below the glass transition temperature or the melting temperature of the molding 200. But it ’s okay.
  • the object 200 may be cooled from the stage 2 side or may be cooled from the pressurizing chamber 51 side.
  • a cooling water channel provided in the stage 2 to cool the mold 100 and the molding object 200 from the stage 2 side.
  • a light source capable of emitting an electromagnetic wave having a predetermined wavelength may be disposed in the pressurizing chamber 51.
  • the imprint method of the present invention is for transferring the molding pattern of the mold 100 to the molding object 200, and the mold 100 and the molding object 200 are separated from each other around the mold 100 and the molding object 200.
  • a depressurizing step for depressurizing the atmosphere, an intimate step for closely closing the mold 100 and the molding object 200, and a pressing step for pressurizing the mold 100 and the molding object 200 with a fluid in close contact with each other. Mainly composed.
  • the pressurizing chamber casing 52 is moved by the opening / closing means, the seal member 94 of the decompression unit 9 is brought into contact with the stage 2, and the decompression chamber 91 is sealed. Further, the molding object 200 is separated from the mold 100 using the separating means 7. In this state, the decompression pump 96 is operated to decompress the interior of the decompression chamber 91 and remove the gas between the molding object 200 and the mold 100 (see FIG. 1 or FIG. 5).
  • the object 200 is stacked on the mold 100 using the separating means 7 (see FIG. 2). Subsequently, the pressurizing chamber housing 52 is moved by the opening / closing means, and the seal member 54 of the pressurizing unit 5 is brought into contact with the molding target 200 to close the space between the mold 100 and the molding target 200 (see FIG. 3). .
  • the pressurizing step gas is supplied from the gas supply source 61 to the pressurizing chamber 51 to pressurize the workpiece 200 and the mold 100.
  • the molding object 200 is heated and cooled by the temperature control means to transfer the molding pattern of the mold 100 to the molding object 200.
  • the molding object 200 is irradiated with light from a light source to transfer the molding pattern of the mold 100 to the molding object 200.
PCT/JP2012/063397 2011-06-02 2012-05-24 流体圧インプリント装置およびインプリント方法 WO2012165310A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020137034369A KR20140033159A (ko) 2011-06-02 2012-05-24 유압 임프린트 장치 및 임프린트 방법
CN201280027116.3A CN103717376B (zh) 2011-06-02 2012-05-24 流体压印装置以及压印方法
JP2013518041A JP5488766B2 (ja) 2011-06-02 2012-05-24 流体圧インプリント装置およびインプリント方法
KR1020197011845A KR20190047112A (ko) 2011-06-02 2012-05-24 유압 임프린트 장치 및 임프린트 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-124622 2011-06-02
JP2011124622 2011-06-02

Publications (1)

Publication Number Publication Date
WO2012165310A1 true WO2012165310A1 (ja) 2012-12-06

Family

ID=47259167

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/063397 WO2012165310A1 (ja) 2011-06-02 2012-05-24 流体圧インプリント装置およびインプリント方法

Country Status (4)

Country Link
JP (1) JP5488766B2 (zh)
KR (2) KR20140033159A (zh)
CN (1) CN103717376B (zh)
WO (1) WO2012165310A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10343312B2 (en) * 2012-08-27 2019-07-09 Scivax Corporation Imprint device and imprint method
WO2020021989A1 (ja) * 2018-07-23 2020-01-30 株式会社日立ハイテクノロジーズ 凹面回折格子の製造方法、製造装置及び凹面回折格子

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102372918B1 (ko) * 2020-09-15 2022-03-11 한국기계연구원 임프린트 장치 및 임프린트 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003516644A (ja) * 1999-12-10 2003-05-13 オブドゥカト アクティエボラーグ 構造物の製造に関する装置および方法
JP2008114482A (ja) * 2006-11-06 2008-05-22 Sumitomo Heavy Ind Ltd 金型装置及びそれによる成形方法
JP2008230027A (ja) * 2007-03-20 2008-10-02 Hitachi High-Technologies Corp 微細構造転写装置および微細構造体の製造方法
JP2009154393A (ja) * 2007-12-26 2009-07-16 Scivax Kk インプリント装置およびインプリント方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5161707B2 (ja) * 2008-08-28 2013-03-13 株式会社日立産機システム 微細構造転写モールド及び微細構造転写装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003516644A (ja) * 1999-12-10 2003-05-13 オブドゥカト アクティエボラーグ 構造物の製造に関する装置および方法
JP2008114482A (ja) * 2006-11-06 2008-05-22 Sumitomo Heavy Ind Ltd 金型装置及びそれによる成形方法
JP2008230027A (ja) * 2007-03-20 2008-10-02 Hitachi High-Technologies Corp 微細構造転写装置および微細構造体の製造方法
JP2009154393A (ja) * 2007-12-26 2009-07-16 Scivax Kk インプリント装置およびインプリント方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10343312B2 (en) * 2012-08-27 2019-07-09 Scivax Corporation Imprint device and imprint method
WO2020021989A1 (ja) * 2018-07-23 2020-01-30 株式会社日立ハイテクノロジーズ 凹面回折格子の製造方法、製造装置及び凹面回折格子
JP7348182B2 (ja) 2018-07-23 2023-09-20 株式会社日立ハイテク 凹面回折格子の製造方法、製造装置及び凹面回折格子

Also Published As

Publication number Publication date
CN103717376B (zh) 2016-12-07
JP5488766B2 (ja) 2014-05-14
CN103717376A (zh) 2014-04-09
KR20140033159A (ko) 2014-03-17
JPWO2012165310A1 (ja) 2015-02-23
KR20190047112A (ko) 2019-05-07

Similar Documents

Publication Publication Date Title
JP6330157B2 (ja) インプリント用型を用いたインプリント方法
JP5644014B2 (ja) ローラ式加圧装置、インプリント装置、ローラ式加圧方法
JP5970646B2 (ja) インプリント装置およびインプリント方法
JP6028266B2 (ja) インプリント装置およびインプリント方法
JP6364684B2 (ja) ローラ式加圧装置、インプリント装置、ローラ式加圧方法
JP6291687B2 (ja) インプリント装置およびインプリント方法
JP6592659B2 (ja) ローラ式加圧装置、インプリント装置およびローラ式加圧方法
JP5488766B2 (ja) 流体圧インプリント装置およびインプリント方法
WO2012147958A1 (ja) 流体圧インプリント装置および加圧装置
JP5499306B2 (ja) 加圧部用固定具を備えた流体圧インプリント装置
WO2012096076A1 (ja) 離型装置、離型方法およびこれらを用いたインプリント装置
JP6031655B2 (ja) 剛体ステージを備えた流体圧インプリント装置
WO2021132142A1 (ja) インプリント装置およびインプリント方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12792486

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2013518041

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20137034369

Country of ref document: KR

Kind code of ref document: A

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC

122 Ep: pct application non-entry in european phase

Ref document number: 12792486

Country of ref document: EP

Kind code of ref document: A1