WO2012152661A1 - Ensembles diamant composite - Google Patents

Ensembles diamant composite Download PDF

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Publication number
WO2012152661A1
WO2012152661A1 PCT/EP2012/058155 EP2012058155W WO2012152661A1 WO 2012152661 A1 WO2012152661 A1 WO 2012152661A1 EP 2012058155 W EP2012058155 W EP 2012058155W WO 2012152661 A1 WO2012152661 A1 WO 2012152661A1
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WO
WIPO (PCT)
Prior art keywords
diamond
component
shaped
side wall
opening
Prior art date
Application number
PCT/EP2012/058155
Other languages
English (en)
Inventor
Berdinus Christianus Maria VROLIJK
Gerrit Jan Pels
Original Assignee
Element Six N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Element Six N.V. filed Critical Element Six N.V.
Publication of WO2012152661A1 publication Critical patent/WO2012152661A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/04—Diamond
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/08—Etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/007—Pressure-resistant sight glasses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Definitions

  • the present invention relates to composite diamond assemblies in which different types of diamond material are bonded together.
  • the composite diamond assemblies have uses such as in optical applications and as thermal substrates.
  • Composite diamond assemblies in which different types of diamond material are bonded together are known in the art. Such assemblies are particularly useful when a high quality diamond material and/or single crystal diamond material is desirable for a particular application and where large areas of diamond material are also desirable. In such cases, it may be difficult or impossible to form the high quality diamond material and/or single crystal diamond material to the surface areas which are desired. Accordingly, it has been proposed that a wafer of lower quality and/or polycrystalline diamond material may be formed to the desired surface area and that higher quality and/or single crystal diamond material can be mounted to the wafer such that a composite diamond assembly is provided which comprises one or more high quality and/or single crystal diamond components mounted to a diamond wafer.
  • EP0589464 discloses a method comprising: providing a plurality of closely spaced or touching single crystal diamond plates disposed on a silicon substrate; growth of a continuous layer of low quality single crystal diamond material over the plurality of single crystal diamond plates to adhere the single crystal diamond plates together; removal of the silicon substrate; processing of the single crystal diamond plates to obtain a highly flat surface; and growth of a continuous layer of higher quality single crystal diamond material over the processed surface of the plurality of single crystal plates. All layers are bonded together via diamond-diamond bonding
  • One potential problem with this approach is that it is very difficult to grow a wafer of high quality single crystal diamond material over a plurality of single crystal diamond plates in a consistent and reproducible manner required for commercial production.
  • a large number of crystal dislocation defects tend to extend from the plate boundaries through the overlying single crystal material.
  • Such dislocation defects cause strain and birefringence within the single crystal material thus reducing optical performance.
  • strain can lead to cracking of the single crystal layer.
  • the dislocations reduce thermal conductivity and can also provide electrical conduction paths thus reducing electrical breakdown voltage.
  • JP 08-208387 discloses a method comprising: providing a single crystal diamond substrate on a silicon support substrate; growing diamond over the composite substrate to grow single crystal diamond over the single crystal diamond substrate and poly crystalline diamond over the silicon support substrate; and removal of the silicon below the diamond substrate to form a diamond window.
  • the single crystal diamond window is disposed within a polycrystalline layer and bonded thereto by diamond-to- diamond bonding around an edge of the single crystal diamond window. It is also described that more than one single crystal diamond window can be provided within the polycrystalline diamond layer.
  • US 6562127 discloses bonding of single crystal plates to a polycrystalline carrier substrate to form composite substrates for growth of semiconductor components.
  • Various possible materials and methods of bonding are suggested.
  • the described arrangement are suitable for use as a thermally conductive substrate.
  • they do not appear to be suitable for optical applications as the single crystal plates are not mounted within the polycrystalline layer to provide an optical path through the polycrystalline layer.
  • US20050160968 discloses a composite structure comprising a layer of single crystal diamond plates mounted to a polycrystalline diamond layer. The mounting is achieved by CVD deposition of the polycrystalline layer onto a plurality of single crystal diamond plates. This arrangement is suitable for use as a thermally conductive substrate. However, it is not suitable for optical applications as the single crystals are not mounted within the polycrystalline layer to provide an optical path through the polycrystalline layer.
  • US 4260397 discloses the mounting of single crystal diamonds within a polycrystalline diamond matrix.
  • Various possible applications for such a composite structure are suggested.
  • One example is a wire drawing die.
  • the die comprises a single crystal diamond embedded in polycrystalline diamond matrix which is sintered within and bonded to cobalt cemented tungsten carbide annulus.
  • a double tapered wire drawing hole is made through the centre of the die using a laser.
  • US 4260397 also suggest that a composite structure as described therein may be used as an optical window. It is stated that if large single crystals are ground, an optical path can be provided through them. Laser windows are mentioned as a possible application. It is further stated that if an optical path is unnecessary, the single crystal diamond need not extend completely through the composite and may be surrounded by polycrystalline matrix.
  • US 4260397 discloses a method of forming a single crystal- poly crystalline composite using a HPHT process.
  • a single crystal diamond is embedded in the centre of a mass of diamond grains in a HPHT capsule which may also contain graphite and/or a metal catalyst. The capsule is subjected to HPHT conditions to form the composite. This method would appear to be not well designed to form large polycrystalline disks.
  • US 3895313 discloses the use of diamond windows for laser applications and suggests a number of mounting configurations.
  • a single diamond is employed as a window while several other diamonds having a similar high thermal conductivity are located in intimate heat transfer relation with the window diamond and serve as a heat transfer means.
  • the window and heat transfer diamonds are interfaced either directly or by the use of very thin metal foils or layers of thermally conductive metal such as gold or silver sputtered onto adjacent diamond surfaces. Adjacent diamond surfaces are mechanically lapped to tolerances of less than ten thousandths of an inch, followed by sputtering of the metal films onto the diamond surfaces in thicknesses of less than 50 microns, and preferably in the order of microns.
  • the diamonds are maintained at as high a temperature as possible during sputtering, after which the surfaces are directly compressed, preferably in a vacuum.
  • WO2005/010245 discloses a composite structure comprising a plurality of single crystal diamond plates adhered together by growing a layer of polycrystallme CVD diamond over an array of the single crystal diamond plates in a similar manner to US20050160968. It is also disclosed that the polycrystallme diamond grows between the plurality of single crystal diamond plates and the polycrystallme material disposed over the single crystal plates can be removed to form a structure in which a polycrystallme diamond layer is provided with embedded single crystal diamond plates exposed on both surfaces. As such the polycrystallme diamond forms a frame for the single crystal diamond plates. Window applications are suggested and it is disclosed that the polycrystallme frame provides a means of mounting and cooling a single crystal diamond window.
  • Diamond material is useful as an optical component as it has low absorption.
  • Diamond material has the additional advantage over other possible window materials in that it is mechanically strong, inert, and biocompatible.
  • the inertness of diamond material makes it an excellent choice for use in reactive chemical environments where other optical window materials would not be suitable.
  • diamond material has very high thermal conductivity and a low thermal expansion coefficient. As such, diamond material is useful for use as an optical component in high energy beam applications where the component will tend to be heated.
  • the diamond material will rapidly conduct away heat to cool areas where heating occurs so as to prevent heat build-up at a particular point, e.g. where a high energy beam passes through the material. To the extent that the material is heated, the low thermal expansion coefficient of diamond material ensures that the component does not unduly deform which may cause optical and/or mechanical problems in use.
  • One problem with using diamond as a window material is that the diamond window has a tendency to de-bond from the optical tool to which it is attached, for example due to chemical and/or thermal conditions.
  • Another related problem when faced with designing an optical component for use in reactive chemical environments is how to improve diamond window bonding whilst also ensuring that the optical tool is chemically inert to the reactive chemical environments in which it is to be used.
  • Yet another problem is that the best thermal and optical properties are achieved by using a single crystal diamond material.
  • the present inventors have found that the vast majority of known bonding techniques are unsuitable for reliably bonding diamond material. This is largely due to the extreme rigidity of diamond material and the very low thermal expansion coefficient of diamond material which causes thermal expansion mismatch between the diamond material and adhesive material used to bond the diamond material. During use, changes in temperature cause strain build up in the adhesive material due to thermal expansion or contraction and failure of the adhesive material results. As such, the inventors have recognized that bonding diamond material is a somewhat unique problem due to the extreme properties of diamond material and much effort has been put into the identification of bonding techniques which can reliably bond diamond components without failure in use due to changes in temperature. This is particularly problematic as diamond material is often selected for a particular use when thermal management is a problem.
  • diamonds extremely high thermal conductivity, low electrical conductivity, and low thermal expansion coefficient allowing the material to effectively remove heat from electronic components while not conducting away any charge and while retaining dimensional stability.
  • diamonds apparent advantages in this regard have also been found to be problematic in that adhesive material which is adhered to the diamond material does not share diamonds extreme thermal properties and thus can fail due to a thermal mismatch between the adhesive material and the diamond material.
  • certain embodiments of the present invention seek to provide a diamond composite assembly which is stable, reliable, and has improved lifetime.
  • a first aspect of the present invention provides a composite diamond assembly comprising:
  • a diamond component mounted within an opening formed within the wafer of diamond material, the diamond component being formed of a different type of diamond material to that of the wafer,
  • the opening comprising a wedge-shaped or step-shaped side wall
  • the diamond component is in the form of a plate having a front face and a rear face bounded by a wedge-shaped or step-shaped side wall which is complimentary to the wedge-shaped or step-shaped side wall of the opening, said front face having a larger surface area than said rear surface, and
  • the diamond component is mounted within the opening by a braze join disposed between the wedge-shaped or step-shaped side wall of the opening and the complimentary wedge-shaped or step-shaped side wall of the diamond component.
  • a second aspect of the present invention provides a method of manufacturing a diamond component as described above, the method comprising:
  • an opening in a wafer of diamond material comprising a wedge-shaped or step-shaped side wall
  • the diamond component being in the form of a plate having a front face and a rear face bounded by a wedge-shaped or step-shaped side wall which is complimentary to the wedge-shaped or step-shaped side wall of the opening, said front face having a larger surface area than said rear surface,
  • the diamond component is mounted within the opening by brazing together the wedge-shaped or step-shaped side wall of the opening and the complimentary wedge-shaped or step-shaped side wall of the diamond component to form a braze join.
  • a third aspect of the present invention provides an apparatus comprising the composite diamond assembly as described above, wherein the composite diamond assembly is mounted within the apparatus such that in normal use a pressure at the rear face of the diamond component is lower than a pressure at the front face of the diamond component.
  • Figure 1 illustrates a plan view of a diamond window component according to an embodiment of the present invention
  • Figure 2 illustrates a cross-sectional view of a diamond window component according to an embodiment of the present invention.
  • Figure 3 illustrates a cross-sectional view of a diamond window component according to an alternative embodiment of the present invention.
  • Figures 1 and 2 illustrate an embodiment of the present invention which comprises a single crystal diamond part 2 mounted in a poly crystalline diamond disc 4 using a braze join 6 in combination with a wedge-shaped mounting configuration.
  • This arrangement has the following advantages:
  • the Polycrystalline material can be used for cooling and/or handling purposes.
  • the brazing material can be made thin so that the impact on the thermal conductivity is very limited and the thermal advantages of using diamond material are retained. As such, the arrangement combines the advantages of single crystal and polycrystalline diamond material to obtain large area diamond windows with a region of high quality optical grade single crystal material. Furthermore, it has been found that the use of a braze join in combination with a wedge-shaped mounting configuration results in bond which is more stable that prior art configurations.
  • FIG. 3 In relation to Figures 2 and 3 it should be noted that the components have been expanded and illustrated as being separate so as to illustrate the individual components clearly. In practice, during brazing the components are in intimate contact with a portion of the single crystal diamond part 2 overlapping with a portion of the polycrystalline diamond disc 4 such that the largest diameter of the single crystal diamond part is larger than the smallest diameter of the opening within the polycrystalline diamond disc. This arrangement will prevent the possibility of the single crystal diamond part being pushed through the opening within the polycrystalline diamond disc.
  • the mounting configuration may also be useful for non-single crystal diamond components.
  • a polycrystalline diamond plate may be mounted within a polycrystalline diamond carrier wafer, the diamond material used for the plate and the carrier wafer having different optical, thermal, and/or electronic characteristics.
  • Such a configuration may be useful when it is difficult to form large areas of very high quality polycrystalline diamond material in which case a smaller area of high quality polycrystalline diamond material may be fabricated and mounted within a larger area of lower quality polycrystalline diamond material.
  • a synthetic single crystal CVD diamond material may be used as the central component although natural or synthetic HPHT diamond material may alternatively be used.
  • a synthetic polycrystalline CVD diamond material may be used as the carrier wafer.
  • other diamond materials may be used for the carrier wafer including, for example, composite materials such as PCD and ScD.
  • a diamond component mounted within an opening formed within the wafer of diamond material, the diamond component being formed of a different type of diamond material to that of the wafer,
  • the opening comprising a wedge-shaped or step-shaped side wall
  • the diamond component is in the form of a plate having a front face and a rear face bounded by a wedge-shaped or step-shaped side wall which is complimentary to the wedge-shaped or step-shaped side wall of the opening, said front face having a larger surface area than said rear surface, and
  • the diamond component is mounted within the opening by a braze join disposed between the wedge-shaped or step-shaped side wall of the opening and the complimentary wedge-shaped or step-shaped side wall of the diamond component.
  • Preferred braze materials for forming the braze join including the following: Au/Sn (for example in a mass ratio of 80/20); Au/Ge (for example in a mass ratio of 88/12); Cu/Ag (for example in a mass ratio of 72/28); Cu/Ag/Ti (for example in a mass ratio of 72/27/1); AuSi; or Au/Ta.
  • Au/Sn for example in a mass ratio of 80/20
  • Au/Ge for example in a mass ratio of 88/12
  • Cu/Ag for example in a mass ratio of 72/28
  • Cu/Ag/Ti for example in a mass ratio of 72/27/1
  • AuSi or Au/Ta.
  • a Cu/Ag/Ti braze is preferred for many applications.
  • the braze join may have a thickness in a range: 0.5 to 10.0 ⁇ ; 1.0 to 8.0 ⁇ ; 2.0 to 6.0 ⁇ ; or 3.0 to 6.0 ⁇ .
  • the thickness may be selected such that the braze join is sufficiently thick to form a reliable bond while being sufficiently thin that it doesn't unduly reduce the thermal conductivity of the composite diamond assembly.
  • the side wall of the opening and the side wall of the diamond component are complementary to an extent that a difference in angle between the respective side walls is no more than 30°, 20°, 10°, 5°, 2°, or 1°.
  • a difference in angle between the respective side walls is no more than 30°, 20°, 10°, 5°, 2°, or 1°.
  • the opening is preferably substantially circular and the diamond component is preferably a circular disk as illustrated in Figure 2. It has been found that the most reliable bonding can be achieved using a substantially circular arrangement to provide more uniform stresses and avoid stress-peaks leading to bonding failure. However, it is also envisaged that other shapes could be used according to the required application.
  • the front and rear faces of the diamond component may be parallel to within 30°, 20°, 10°, 5°, 2°, or 1°.
  • the diamond component may form a simple window type structure.
  • more complex diamond component structures may be provided.
  • the front and/or rear faces of the single crystal diamond component may comprise an optical outcoupling structure such as one or more of: an angled surface; a convex surface; a microlens array; a solid immersion lens (SIL); a plurality of surface indentations or nano-structures; a diffraction grating; a fresnel lens; and a coating such as an antireflective coating.
  • an optical outcoupling structure such as one or more of: an angled surface; a convex surface; a microlens array; a solid immersion lens (SIL); a plurality of surface indentations or nano-structures; a diffraction grating; a fresnel lens; and a coating such as an antireflect
  • the diamond component may be formed of a diamond material having one or more of the following characteristics: an absorption coefficient in a range 0.01 to 0.05 cm “1 at a wavelength of 10.6 ⁇ ; an absorption coefficient in a range 0.0001 to 0.03 cm “1 , 0.0003 to 0.01 cm “1 , or 0.0003 to 0.005 cm “1 at a wavelength of 1.064 ⁇ ; and a birefringence (n e -no) in a range 5 x 10 "4 to 1 x 10 "8 , 1 x 10 "4 to 5 x 10 "8 , or 5 x 10 "5 to 1 x 10 "7 .
  • the wafer of diamond material may be formed of a diamond material having one or more of the following characteristics: a thermal conductivity in a range 1500 to 2200 Wm 'K "1 at a temperature of 300 ; and a Young's modulus in a range 1000 to 1100 GPa.
  • the diamond component may be formed and mounted such that the rear face of the diamond component (i.e. the smaller area face) is more resistant to tensile stress than the front face of the diamond component.
  • the rear face of the diamond component i.e. the smaller area face
  • polycrystalline diamond material having a smaller average grain size tends to be more resistant to tensile stress.
  • synthetic polycrystalline CVD diamond material grows, the grain size of the as-grown layer increases.
  • a nucleation surface will have a smaller grain size than a growth surface.
  • a diamond component may be formed and mounted with the rear face having a smaller average grain size than the front face.
  • the composite diamond assembly can then be mounted within an apparatus such that in normal use a pressure at the rear face of the diamond component is lower than a pressure at the front face of the diamond component. This will result in the diamond component being pressed into the wedge-shaped or step- shaped seat.
  • the rear face will be placed in tension. Accordingly, it is desirable for this face to be more resistant to tensile
  • a method of manufacturing a diamond component as previously described may comprise:
  • an opening in a wafer of diamond material comprising a wedge-shaped or step-shaped side wall
  • the diamond component being in the form of a plate having a front face and a rear face bounded by a wedge-shaped or step-shaped side wall which is complimentary to the wedge-shaped or step-shaped side wall of the opening, said front face having a larger surface area than said rear surface,
  • the diamond component is mounted within the opening by brazing together the wedge-shaped or step-shaped side wall of the opening and the complimentary wedge-shaped or step-shaped side wall of the diamond component to form a braze join.
  • the opening may be formed by cutting, for example, using a laser.
  • the brazing may be performed at a temperature in a range 200 to 1500°C or 250 to 1250°C.
  • the preferred temperature will depend on the type of material used for the braze.
  • the brazing may be performed at a temperature in a range 250 to 300°C for an Au/Sn braze material, a temperature in a range 750 to 850°C for a Cu/Ag braze material, a temperature in a range 900 to 1000°C for a Cu/Ag/Ti braze material, or a temperature in a range 1200 to 1250°C for an Au/Ta braze material.
  • the braze may be performed under vacuum or a protective atmosphere.
  • Protective atmospheres include, but are not limited to, argon, argon/hydrogen, nitrogen, or nitrogen/hydrogen.
  • the diamond component may be formed by growing synthetic CVD diamond material and slicing the as grown synthetic CVD diamond material in a direction within 45°, 30°, 20°, 10°, or 5° of the growth direction to form a plate in which the font and rear faces have a larger surface area than a side wall bounding the front and rear faces, the font and rear faces being formed of surfaces lying in a plane within 45°, 30°, 20°, 10°, or 5° of the growth direction, the plate being further processed to form a wedge-shaped or step-shaped side wall.
  • Such a method can be advantageous as dislocation defects tend to form in the CVD growth direction.
  • a plate By slicing the as grown material in a direction approximately parallel to the growth direction then a plate can be formed in which dislocation defects extend approximately parallel to front and rear surfaces. This results in a low birefringence of light passing through the plate in a direction approximately perpendicular to the front and rear surfaces of the plate.
  • a plate of synthetic single crystal CVD diamond can be formed in this manner.
  • the diamond component may alternatively be formed by growing synthetic polycrystalline CVD diamond material and slicing the as grown synthetic CVD diamond material in a direction within 45°, 30°, 20°, 10°, or 5° to a normal of the growth direction to form a plate in which the font and rear faces have a larger surface area than a side wall bounding the front and rear faces, the font and rear faces being formed of surfaces lying in a plane within 45°, 30°, 20°, 10°, or 5° of the normal to the growth direction, the plate being further processed to form a wedge-shaped or step- shaped side wall with the rear face being formed by a plane closer to a nucleation surface of the as grown synthetic polycrystalline CVD diamond material relative to the front surface whereby the rear surface has a smaller average grain size than the front face.
  • This method can be used to form polycrystalline diamond components which can be oriented such that the rear surface (i.e. the one which will be in tensile stress in normal use) is more resistant to tensile stress and cracking.
  • An apparatus comprising the composite diamond assembly may be provided wherein the composite diamond assembly is mounted within the apparatus such that in normal use a pressure at the rear face of the diamond component is lower than a pressure at the front face of the diamond component.
  • the rear surface of the diamond component may be disposed on the inside of a low pressure chamber.
  • the rear surface of the diamond component may be disposed on the outside of a high pressure chamber.
  • the wafer may comprise more than one opening in which a diamond component is mounted such that a composite diamond assembly is provided with a plurality of diamond components.
  • a mounting ring which is made of a material having a coefficient of linear thermal expansion a of 14 x 10 "6 K "1 or less at 20°C and a thermal conductivity of 60 Wrrf'K "1 or more at 20°C.
  • the mounting ring may have a coefficient of linear thermal expansion a which is 12 x 10 "6 _1 or less, 10 x 10 "6 K “1 or less, 8 x 10 "6 K “1 or less, 6 x 10 "6 K “1 or less, or 4 x 10 6 K or less and/or a thermal conductivity of 60 Wrrf'i 1 or more, 80 Wm 'K "1 or more, 100 Wrn ' ⁇ "1 or more, 120 Wm ' "1 or more, or 140 Wm 'K "1 or more.
  • a mounting ring aids in preventing heat build-up and thermal expansion mismatch at the mounting between the composite diamond assembly and the surrounding apparatus.
  • suitable materials for the mounting ring include one or more of molybdenum, chromium, tungsten, nickel, rhodium, ruthenium, silicon carbide (SiC), tungsten carbide (WC), aluminium nitride (A1N), molybdenum alloys such as titanium zirconium molybdenium (TZM), and tungsten alloys such as tungsten nickel iron (W iFe) and tungsten nickel copper (WNiCu).
  • Molybdenum has been found to be particularly useful as it can readily be manufactured into a mounting ring, has a low thermal expansion coefficient of 5 x 10 "6 K "1 , and has a relatively high thermal conductivity of 144 Wm ⁇ "1 .
  • the composite diamond assembly may be bonded to such a mounting ring by brazing.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
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  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un ensemble diamant composite comprenant : une tranche de matériau de diamant ; et un composant de diamant monté dans une ouverture formée dans la tranche de matériau de diamant, le composant de diamant étant formé d'un type de matériau de diamant différent de celui de la tranche, l'ouverture comprenant une paroi latérale en forme de biseau ou en forme de gradin, le composant de diamant étant sous la forme d'une plaque ayant une face avant et une face arrière délimitées par une paroi latérale en forme de biseau ou en forme de gradin qui est complémentaire de la paroi latérale en forme de biseau ou en forme de gradin de l'ouverture, ladite face avant ayant une plus grande surface que ladite face arrière, et le composant de diamant étant monté dans l'ouverture par une jonction de brasage disposée entre la paroi latérale en forme de biseau ou en forme de gradin de l'ouverture et la paroi latérale en forme de biseau ou en forme de gradin complémentaire du composant de diamant.
PCT/EP2012/058155 2011-05-10 2012-05-03 Ensembles diamant composite WO2012152661A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161484541P 2011-05-10 2011-05-10
GBGB1107736.9A GB201107736D0 (en) 2011-05-10 2011-05-10 Composite diamond assemblies
US61/484,541 2011-05-10
GB1107736.9 2011-05-10

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WO2012152661A1 true WO2012152661A1 (fr) 2012-11-15

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2513964A (en) * 2013-03-06 2014-11-12 Element Six N V Synthetic diamond optical elements
EP2887380A1 (fr) * 2013-12-06 2015-06-24 Canon Kabushiki Kaisha Cible de type à transmission et tube de génération de rayons x fournis avec la cible de type à transmission
WO2016086983A1 (fr) * 2014-12-03 2016-06-09 Carl Zeiss Smt Gmbh Agencement optique pourvu d'un composant conducteur de chaleur
US20170067471A1 (en) * 2013-05-10 2017-03-09 Summit Esp, Llc Apparatus and system for a thrust-absorbing horizontal surface pump assembly
WO2019088916A1 (fr) * 2017-11-03 2019-05-09 Sunset Peak International Limited Diamant(s) monocristallin(s) intégré(s) dans une structure de diamant polycristallin et son/leur procédé de croissance
US10363624B2 (en) 2014-04-06 2019-07-30 Diamond Innovations, Inc. Active metal braze joint with stress relieving layer

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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