WO2012146165A1 - Ligne de test de circuit imprimé souple (fpc) - Google Patents

Ligne de test de circuit imprimé souple (fpc) Download PDF

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Publication number
WO2012146165A1
WO2012146165A1 PCT/CN2012/074642 CN2012074642W WO2012146165A1 WO 2012146165 A1 WO2012146165 A1 WO 2012146165A1 CN 2012074642 W CN2012074642 W CN 2012074642W WO 2012146165 A1 WO2012146165 A1 WO 2012146165A1
Authority
WO
WIPO (PCT)
Prior art keywords
test line
fpc test
fpc
sockets
component
Prior art date
Application number
PCT/CN2012/074642
Other languages
English (en)
Chinese (zh)
Inventor
张洋
李博
朱光华
汪翠兰
Original Assignee
青岛海信移动通信技术股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201120133269U external-priority patent/CN202133755U/zh
Priority claimed from CN2011101105308A external-priority patent/CN102253249A/zh
Priority claimed from CN2011202590236U external-priority patent/CN202262059U/zh
Application filed by 青岛海信移动通信技术股份有限公司 filed Critical 青岛海信移动通信技术股份有限公司
Publication of WO2012146165A1 publication Critical patent/WO2012146165A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Abstract

La présente invention concerne une ligne de test de FPC, qui comprend une pluralité de supports de carte mère pour effectuer un branchement en correspondance dans les connecteurs d'un ensemble carte de circuit imprimé (PCBA) d'un équipement électronique et au moins un support de composant pour effectuer un branchement en correspondance dans les connecteurs d'un composant à assembler. Après avoir été connectés en parallèle, les supports de carte mère sont connectés en correspondance avec des broches ayant les mêmes définitions d'interface dans le support de composant. Grâce à la disposition parallèle des supports de connecteurs sur la ligne de test de FPC de l'invention, quand un support ne peut pas être utilisé en raison d'une usure importante, le support suivant peut être utilisé comme connecteur de test, ce qui permet de prolonger la durée de vie de la ligne de test de FPC, de réduire l'apport de main-d'œuvre pour la maintenance et l'arrêt de la station de test pendant la maintenance et d'améliorer l'efficacité globale de la machine de test. En outre, en raison de la durée de vie prolongée de la ligne individuelle de la ligne de test de FPC, le coût d'achat de la ligne de test de FPC est réduit de manière importante, et le coût du PCBA par machine est réduit, ce qui permet d'avoir des produits a un prix avantageux.
PCT/CN2012/074642 2011-04-29 2012-04-25 Ligne de test de circuit imprimé souple (fpc) WO2012146165A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201120133269U CN202133755U (zh) 2011-04-29 2011-04-29 一种fpc测试线
CN201120133269.9 2011-04-29
CN201110110530.8 2011-04-29
CN2011101105308A CN102253249A (zh) 2011-04-29 2011-04-29 一种fpc测试线
CN201120259023.6 2011-07-21
CN2011202590236U CN202262059U (zh) 2011-07-21 2011-07-21 一种金手指类fpc延长线

Publications (1)

Publication Number Publication Date
WO2012146165A1 true WO2012146165A1 (fr) 2012-11-01

Family

ID=47071601

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/074642 WO2012146165A1 (fr) 2011-04-29 2012-04-25 Ligne de test de circuit imprimé souple (fpc)

Country Status (1)

Country Link
WO (1) WO2012146165A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2468093Y (zh) * 2001-02-20 2001-12-26 大连电子工业股份有限公司 改进型的计算机连接线
CN2520017Y (zh) * 2001-12-19 2002-11-06 富士康(昆山)电脑接插件有限公司 堆叠式电子卡连接器
JP2007012379A (ja) * 2005-06-29 2007-01-18 Yamaha Fine Technologies Co Ltd 電気接続部材と電気接触子との接続構造および接続方法
CN201018026Y (zh) * 2006-12-29 2008-02-06 深圳市奥拓电子有限公司 一种金手指连接装置
US20110025972A1 (en) * 2006-03-15 2011-02-03 Au Optronics Corp. Display Circuits
CN102253249A (zh) * 2011-04-29 2011-11-23 青岛海信移动通信技术股份有限公司 一种fpc测试线
CN202133755U (zh) * 2011-04-29 2012-02-01 青岛海信移动通信技术股份有限公司 一种fpc测试线

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2468093Y (zh) * 2001-02-20 2001-12-26 大连电子工业股份有限公司 改进型的计算机连接线
CN2520017Y (zh) * 2001-12-19 2002-11-06 富士康(昆山)电脑接插件有限公司 堆叠式电子卡连接器
JP2007012379A (ja) * 2005-06-29 2007-01-18 Yamaha Fine Technologies Co Ltd 電気接続部材と電気接触子との接続構造および接続方法
US20110025972A1 (en) * 2006-03-15 2011-02-03 Au Optronics Corp. Display Circuits
CN201018026Y (zh) * 2006-12-29 2008-02-06 深圳市奥拓电子有限公司 一种金手指连接装置
CN102253249A (zh) * 2011-04-29 2011-11-23 青岛海信移动通信技术股份有限公司 一种fpc测试线
CN202133755U (zh) * 2011-04-29 2012-02-01 青岛海信移动通信技术股份有限公司 一种fpc测试线

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