WO2012132823A1

WO2012132823A1 - Light-emitting device

Info

Publication number: WO2012132823A1
Application number: PCT/JP2012/056018
Authority: WO
Inventors: 基晋青木; 真吾寳角
Original assignee: パナソニック株式会社
Priority date: 2011-03-29
Filing date: 2012-03-08
Publication date: 2012-10-04
Also published as: TWI485900B; TW201244208A; JP2012209073A

Abstract

A light-emitting device of this embodiment comprises a first substrate, an organic EL element, a second substrate, a joint part, and a drying member. The organic EL element has a light-emitting section for emitting light. The organic EL element is formed on one surface of the first substrate. The second substrate is so arranged as to face the one surface of the first substrate. The second substrate is so adapted that a void space for housing the light-emitting section is formed between the second substrate and the first substrate. The joint part is formed in a frame shape so as to surround the light-emitting section. The joint part is so adapted as to joint a first-substrate-facing surface of the second substrate to the above-mentioned one surface of the first substrate. The drying member is arranged on the outside edge of a region surrounded by the joint part on the above-mentioned facing surface of the second substrate, so that the drying member cannot be in contact with the light-emitting section.

Description

Light emitting device

The present invention relates to a light emitting device.

Conventionally, as shown in FIG. 16, a substrate 201, an organic EL structure 202 formed on the substrate 201, and a sealing disposed at a predetermined interval so as to cover the organic EL structure 202 An organic EL element having a plate 203 has been proposed (Document 1 [Japanese Patent Publication No. 2000-277254]). In this organic EL element, a sealing plate 203 is bonded and fixed to a substrate 201 with an adhesive 204. Further, in this organic EL element, a mixture 205 of a silicone resin and a desiccant is disposed in a recess formed on the inner surface side of the sealing plate 203 for the purpose of suppressing deterioration with time such as generation and expansion of dark spots. .

However, in the organic EL element having the configuration shown in FIG. 16, a pressing force is applied to the sealing plate 203 when the organic EL element is handled, so that the sealing plate 203 is recessed inside (projects toward the organic EL structure 202 side). There is a concern that the mixture 205 may come into contact with the organic EL structure 202 and the organic EL structure 202 cannot emit light.

The present invention has been made in view of the above reasons, and an object thereof is to provide a light emitting device capable of improving reliability.

A light emitting device according to a first aspect of the present invention includes a first substrate, an organic EL element, a second substrate, a bonding portion, and a drying member. The organic EL element has a light emitting unit that emits light. The organic EL element is formed on one surface of the first substrate. The second substrate is disposed to face the one surface of the first substrate. The second substrate is configured to form a space for accommodating the light emitting unit between the second substrate and the first substrate. The joining part is formed in a frame shape surrounding the light emitting part. The bonding portion is configured to bond a surface of the second substrate facing the first substrate to the one surface of the first substrate. The drying member is disposed at an outer edge of a region surrounded by the bonding portion on the facing surface of the second substrate so as not to contact the light emitting portion.

In the light emitting device of the second form according to the present invention, in the first form, the light emitting part is located at the center of the joint part.

In the light emitting device of the third aspect according to the present invention, in the first or second aspect, the second substrate includes a polygonal recess in the facing surface. The recess has an outer periphery that surrounds the light emitting part in a plane parallel to the one surface of the first substrate. The second substrate is bonded to the first substrate through the bonding portion around the recess on the facing surface. The said drying member is arrange | positioned at the corner | angular part in the bottom face of the said recess.

In the light emitting device of the fourth aspect according to the present invention, in the third aspect, the corner portion has a predetermined inner angle. The drying member is formed in a shape having an angle equal to the predetermined inner angle.

In the light emitting device of the fifth aspect according to the present invention, in the fourth aspect, the drying member has two sides defining the corner respectively facing and parallel to the two sides defining the predetermined inner angle. Arranged.

In the light emitting device of the sixth aspect according to the present invention, in any one of the first to fifth aspects, the drying member is disposed at each corner of the bottom surface of the recess.

In the light emitting device according to the seventh aspect of the present invention, in any one of the first to sixth aspects, the drying member has an infrared absorption rate higher than that of the second substrate.

1 shows a light-emitting device of Embodiment 1, wherein (a) is a schematic rear view, and (b) is a schematic cross-sectional view taken along line H-H ′ of (a). It is a rear view of the light-emitting device of the said Embodiment 1. FIG. 3 is a schematic sectional view taken along line B-B ′ of FIG. 2. FIG. 3 is a schematic sectional view taken along line C-C ′ of FIG. 2. FIG. 3 is a schematic cross-sectional view taken along line G-G ′ of FIG. 2. FIG. 3 is a schematic sectional view taken along line D-D ′ of FIG. 2. FIG. 3 is a schematic sectional view taken along line E-E ′ of FIG. 2. FIG. 3 is a schematic cross-sectional view taken along the line F-F ′ of FIG. 2. It is a main process top view for demonstrating the manufacturing method of a light-emitting device same as the above. It is a main process top view for demonstrating the manufacturing method of a light-emitting device same as the above. It is a main process top view for demonstrating the manufacturing method of a light-emitting device same as the above. It is a main process top view for demonstrating the manufacturing method of a light-emitting device same as the above. It is a main process top view for demonstrating the manufacturing method of a light-emitting device same as the above. It is a main process top view for demonstrating the manufacturing method of a light-emitting device same as the above. It is a schematic rear view of the light-emitting device of Embodiment 2. It is a schematic sectional drawing of the organic EL element of a prior art example.

(Embodiment 1)
Hereinafter, a light emitting device (planar light emitting device) A according to the present embodiment will be described with reference to FIGS.

The light emitting device A includes a translucent substrate 1 and an element substrate (organic EL element module) 3 having an organic EL element 2 formed on one surface side (the upper surface side in FIG. 1B) of the translucent substrate 1. And a cover substrate 5 which is disposed opposite to the one surface side of the translucent substrate 1 and is bonded to the element substrate 3 via the bonding portion 4.

Further, the light emitting device A includes a heat equalizing plate 6 (see FIGS. 3 to 8) disposed on the side of the cover substrate 5 opposite to the organic EL element 2 side.

Here, the cover substrate 5 has a recess 51 formed on the surface facing the element substrate 3 (the lower surface in FIG. 1B), and the circumferential portion of the recess 51 on the facing surface extends over the entire circumference. Bonded to the element substrate 3. The recess 51 has an outer periphery surrounding the light emitting unit 20 in a plane parallel to the one surface of the first substrate 1. In the present embodiment, the recess 51 is formed in a rectangular shape.

Thus, in the light emitting device A, the light emitting portion 20 of the organic EL element 2 is accommodated in an airtight space (accommodating space) 8 surrounded by the translucent substrate 1, the cover substrate 5, and the joint portion 4.

In the present embodiment, the translucent substrate 1 constitutes the first substrate, and the cover substrate 5 constitutes the second substrate.

As described above, the light-emitting device A of the present embodiment includes the first substrate (translucent substrate) 1, the organic EL element 2, the second substrate 5, and the bonding portion 4. The organic EL element 2 includes a light emitting unit 20 that emits light. The organic EL element 2 is formed on the one surface of the first substrate 1. The second substrate 5 is disposed so as to face the one surface of the first substrate 1. The second substrate 5 is configured to form a space 8 for accommodating the light emitting unit 20 between the second substrate 5 and the first substrate 1. The joint portion 4 is formed in a frame shape surrounding the light emitting portion 20. The bonding portion 4 is configured to bond the surface of the second substrate 5 facing the first substrate 1 to the one surface of the first substrate 1.

Further, the light emitting device A includes a drying member (moisture absorbing member) 7 disposed on the light emitting unit 20 via a space on the side of the cover substrate 5 facing the light transmissive substrate 1 on the side facing the light transmitting device A.

In this embodiment, the recess 51 and the drying member 7 are both rectangular. That is, the drying member 7 is formed in a shape having an angle α2 equal to a predetermined inner angle α1 of the recess 51 (see FIG. 1A).

As shown in FIG. 1, the drying member 7 is disposed on the outer edge of the region surrounded by the joint 4 on the facing surface (the lower surface in FIG. 1B) of the second substrate 5. In particular, in the present embodiment, the drying member 7 is disposed on the inner bottom surface of the recess 51 in the cover substrate 5. The drying member 7 has a function of adsorbing moisture.

The light emitting device A of the present embodiment includes four drying members 7. The four drying members 7 are respectively arranged at the four corners of the bottom surface of the recess 51. That is, the drying member 7 is disposed at each corner of the bottom surface of the recess 51. Each drying member 7 is arranged so that the two

sides

71 and 72 defining the angle α2 are opposed to and parallel to the two

sides

511 and 512 defining the predetermined inner angle α1.

As shown in FIGS. 3 to 8, the organic EL element 2 includes a first electrode 21 formed on the one surface of a translucent substrate (first substrate) 1 and an organic formed on the first electrode 21. An EL layer 22 and a second electrode 23 formed on the organic EL layer 22 are provided. The organic EL layer 22 includes a light emitting layer formed using an organic material.

In the present embodiment, the organic EL element 2 includes a first electrode 21 that is disposed on the one surface side of the translucent substrate 1 and made of a transparent conductive film, and a side opposite to the translucent substrate 1 side of the first electrode 21. And an organic EL layer 22 including a light emitting layer made of an organic material, and a second electrode 23 made of a metal film and disposed on the opposite side of the organic EL layer 22 from the first electrode 21 side.

Further, the organic EL element 2 is formed on the one surface of the translucent substrate 1 and the first terminal portion T1 formed on the one surface of the translucent substrate 1 and electrically connected to the first electrode 21. And a second terminal portion T2 electrically connected to the second electrode 23.

In the present embodiment, the organic EL element 2 is disposed on the side of the light emitting unit 20 where the first electrode 21, the organic EL layer 22, and the second electrode 23 overlap, and is electrically connected to the first electrode 21. A terminal portion T1 and a second terminal portion T2 disposed on the side of the light emitting portion 20 and electrically connected to the second electrode 23 are provided.

Here, the second electrode 23 is electrically connected to the second terminal portion T <b> 2 via a lead wire 23 b extending from the second electrode 23.

The organic EL element 2 is made of a material having a specific resistance smaller than that of the first electrode 21 and is formed along the periphery of the surface of the first electrode 21 opposite to the light-transmitting substrate 1 side. Auxiliary electrode 26 electrically connected to is provided. That is, the organic EL element 2 includes the auxiliary electrode 26 made of a material having a specific resistance smaller than that of the first electrode 21. The auxiliary electrode 26 is formed on the first electrode 21 so as to surround the light emitting layer (organic EL layer 22).

The organic EL element 2 includes an insulating film 29 that covers the side edges of the auxiliary electrode 26 and the first electrode 21 on the one surface side of the translucent substrate 1. In the organic EL element 2, short circuit between the auxiliary electrode 26 and the first electrode 21 and the second electrode 23 is prevented by the insulating film 29. That is, the organic EL element 2 includes an insulating film 29 that electrically insulates the first electrode 21 and the auxiliary electrode 26 from the second electrode 23.

In addition, although the auxiliary electrode 26 is formed in the rectangular frame shape along the perimeter of the peripheral part of the surface on the opposite side to the translucent board | substrate 1 side in the 1st electrode 21, it does not necessarily need to be a rectangular frame shape. However, as long as it is electrically connected to the first electrode 21, it may be partially open (for example, C-shaped or U-shaped) or divided into a plurality of parts.

In the organic EL element 2, the region where the translucent substrate 1, the first electrode 21, the light emitting layer, and the second electrode 23 overlap in the thickness direction of the translucent substrate 1 constitutes the above-described light emitting unit 20. A region other than the light emitting unit 20 is a non-light emitting unit.

That is, a portion of the first electrode 21 that overlaps the light emitting layer (organic EL layer 22) and the second electrode 23, a portion of the light emitting layer that overlaps the first electrode 21 and the second electrode 23, and a portion of the second electrode 23 that overlaps the light emitting layer and The light emitting unit 22 is configured by a portion overlapping the first electrode 21.

Here, in the organic EL element 2, each of the first electrode 21, the organic EL layer 22, and the second electrode 23 has a planar view shape that is smaller than the translucent substrate 1 (in the illustrated example, a square shape). . Therefore, the planar view shape of the light emitting unit 20 is a rectangular shape (square shape in the illustrated example) smaller than the translucent substrate 1. The auxiliary electrode 26 has a rectangular frame shape (in the illustrated example, a square frame shape) in plan view. The insulating film 29 has a rectangular frame shape (in the illustrated example, a square frame shape) in plan view.

The organic EL element 2 includes m (m + 1 in the example of FIG. 1) second terminal portions T2 and [m + 1] (see FIG. 1) along each of two predetermined parallel sides of the rectangular light emitting unit 20. In one example, the three first terminal portions T1 are arranged so that the first terminal portions T1 are positioned on both sides of the second terminal portion T2 in the width direction.

Therefore, in the example shown in FIG. 1, the first terminal portion T <b> 1 and the second terminal portion T <b> 2 are provided at each of both ends in the longitudinal direction of the translucent substrate 1. Specifically, the organic EL element 2 includes three first terminal portions T1 that are spaced apart in the lateral direction of the translucent substrate 1 at both ends in the longitudinal direction of the translucent substrate 1. In addition, the second terminal portion T2 is disposed between the first terminal portions T1 adjacent to each other in the short direction of the translucent substrate 1.

In the present embodiment, the longitudinal direction of the one surface of the translucent substrate 1 is defined as a prescribed direction, and the element substrate 3 is provided with first terminal portions at both ends in the prescribed direction on the one surface of the translucent substrate 1. T1 and second terminal portion T2 are arranged.

Here, the first terminal portion T1 is a laminate of a transparent conductive oxide layer 24 (hereinafter also referred to as a first transparent conductive oxide layer 24) and a metal layer 27 (hereinafter also referred to as a first metal layer 27). It has a structure.

The second terminal portion T2 has a laminated structure of a transparent conductive oxide layer 25 (hereinafter also referred to as a second transparent conductive oxide layer 25) and a metal layer 28 (hereinafter also referred to as a second metal layer 28). have.

The planar shape of the soaking plate 6 is a rectangular shape (square shape in the illustrated example) that is smaller than the cover substrate 5 and larger than the light emitting unit 20.

Hereinafter, each component of the light emitting device A will be described in detail.

The light emitting device A uses the other surface (the lower surface in FIG. 1B) of the translucent substrate 1 as a light emitting surface (light emitting surface). Therefore, in the light emitting device A, a region where three of the first electrode 21, the organic EL layer 22, and the second electrode 23 are projected on the other surface of the translucent substrate 1 is a light emitting surface. The translucent substrate 1 has a rectangular shape in plan view, but is not limited thereto, and may be, for example, a square shape.

The translucent substrate 1 is formed of a material that transmits light emitted from the organic EL element 2. In the present embodiment, a glass substrate is used as the translucent substrate 1, but the present invention is not limited thereto, and a plastic substrate may be used, for example. As the glass substrate, for example, a soda lime glass substrate or an alkali-free glass substrate can be used. Further, as the plastic substrate, for example, a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate (PEN) substrate, a polyethersulfone (PES) substrate, a polycarbonate (PC) substrate, or the like may be used. When a plastic substrate is used, an SiON film, an SiN film, or the like may be formed on the surface of the plastic substrate to suppress moisture permeation.

The translucent substrate 1 preferably has a transmittance of 70% or more with respect to the light emitted from the organic EL element 2.

When a glass substrate is used as the translucent substrate 1, the unevenness on the one surface of the translucent substrate 1 may cause a leak current of the organic EL element 2 (cause of deterioration of the organic EL element 2). Sometimes). For this reason, when using a glass substrate as the translucent substrate 1, it is preferable to prepare a glass substrate for forming an element that is polished with high accuracy so that the surface roughness of the one surface is reduced.

Regarding the surface roughness of the one surface of the translucent substrate 1, the arithmetic average roughness Ra defined in JIS B 0601-2001 (ISO 4287-1997) is preferably set to several nm or less. On the other hand, when a plastic substrate is used as the light-transmitting substrate 1, a substrate having an arithmetic average roughness Ra of several nanometers or less can be obtained at low cost without performing particularly high-precision polishing. It is possible.

In the organic EL element 2, the first electrode 21 constitutes an anode, and the second electrode 23 constitutes a cathode. The organic EL element 2 includes an organic EL layer 22 interposed between the first electrode 21 and the second electrode 23 in order from the first electrode 21 side, the hole transport layer, the light emitting layer, the electron transport layer, An electron injection layer is provided.

The laminated structure of the organic EL layer 22 is not limited to the above-described example. For example, a single-layer structure of a light emitting layer, a laminated structure of a hole transport layer, a light emitting layer, and an electron transport layer, or a hole transport layer and a light emitting layer. Or a stacked structure of a light emitting layer and an electron transport layer. In addition, a hole injection layer may be interposed between the first electrode 21 and the hole transport layer.

The light emitting layer may have a single layer structure or a multilayer structure. For example, when the desired emission color is white, the emission layer may be doped with three types of dopant dyes of red, green, and blue, or the blue hole-transporting emission layer and the green electron-transporting property. A laminated structure of a light emitting layer and a red electron transporting light emitting layer may be adopted, or a laminated structure of a blue electron transporting light emitting layer, a green electron transporting light emitting layer and a red electron transporting light emitting layer may be adopted. Good.

In addition, the organic EL layer 22 having a function of emitting light when a voltage is applied between the first electrode 21 and the second electrode 23 is used as one light-emitting unit, and a plurality of light-emitting units are intermediates having optical transparency and conductivity. A multi-unit structure in which layers are stacked and electrically connected in series (that is, a structure including a plurality of light emitting units overlapping in the thickness direction between one first electrode 21 and one second electrode 23) May be adopted.

The first electrode 21 constituting the anode is an electrode for injecting holes into the light emitting layer, and it is preferable to use an electrode material made of a metal, an alloy, an electrically conductive compound, or a mixture thereof having a high work function. It is preferable to use a material having a work function of 4 eV or more and 6 eV or less so that the difference between the energy level of the first electrode 21 and the HOMO (Highest Occupied Molecular Orbital) level does not become too large.

Examples of the electrode material of the first electrode 21 include ITO, tin oxide, zinc oxide, IZO (Indium Zinc Oxide), copper iodide, and the like doped with a conductive polymer such as PEDOT and polyaniline and an arbitrary acceptor. Examples thereof include conductive light transmissive materials such as conductive polymers and carbon nanotubes.

Here, the first electrode 21 may be formed as a thin film on the one surface side of the translucent substrate 1 by, for example, sputtering, vacuum deposition, coating, or the like.

The sheet resistance of the first electrode 21 is preferably several hundred Ω / sq or less, particularly preferably 100 Ω / sq or less.

Here, the film thickness of the first electrode 21 varies depending on the light transmittance of the first electrode 21, the sheet resistance, etc., but is preferably set to 500 nm or less, preferably in the range of 10 nm to 200 nm.

The second electrode 23 constituting the cathode is an electrode for injecting electrons into the light emitting layer, and an electrode material made of a metal, an alloy, an electrically conductive compound, or a mixture thereof having a low work function is used. It is preferable to use a material having a work function of 1.9 eV or more and 5 eV or less so that the difference between the energy level of the second electrode 23 and the LUMO (Lowest Unoccupied Molecular Orbital) level does not become too large.

Examples of the electrode material of the second electrode 23 include aluminum, silver, magnesium, gold, copper, chromium, molybdenum, palladium, tin, and alloys of these with other metals, such as a magnesium-silver mixture, magnesium-indium. Examples thereof include a mixture and an aluminum-lithium alloy.

Also, a metal, a metal oxide, etc., and a mixture of these and other metals, for example, an ultrathin film made of aluminum oxide (here, a thin film of 1 nm or less capable of flowing electrons by tunnel injection) and aluminum. A laminated film with a thin film can also be used.

The electrode material of the second electrode 23 is preferably a metal having a high reflectance with respect to light emitted from the light emitting layer and a low resistivity, and preferably aluminum or silver.

As the material of the light emitting layer, any material known as a material for an organic EL element can be used. For example, anthracene, naphthalene, pyrene, tetracene, coronene, perylene, phthaloperylene, naphthaloperylene, diphenylbutadiene, tetraphenylbutadiene, coumarin, oxadiazole, bisbenzoxazoline, bisstyryl, cyclopentadiene, quinoline metal complex, tris (8-hydroxyxyl) Norinato) aluminum complex, tris (4-methyl-8-quinolinato) aluminum complex, tris (5-phenyl-8-quinolinato) aluminum complex, aminoquinoline metal complex, benzoquinoline metal complex, tri- (p-terphenyl- 4-yl) amine, 1-aryl-2,5-di (2-thienyl) pyrrole derivative, pyran, quinacridone, rubrene, distyrylbenzene derivative, distyrylarylene derivative, distili And amine derivatives, and various fluorescent pigments, but include those including a material system and its derivatives described above, not limited to these.

It is also preferable to use a light emitting material selected from these compounds in an appropriate mixture. Further, not only a compound that emits fluorescence, typified by the above compound, but also a material system that emits light from a spin multiplet, for example, a phosphorescent material that emits phosphorescence, and a part thereof are included in a part of the molecule. A compound can also be used suitably.

The light emitting layer made of these materials may be formed by a dry process such as vapor deposition or transfer, or by a wet process such as spin coating, spray coating, die coating, or gravure printing. You may do.

The material used for the hole injection layer can be formed using a hole injection organic material, a metal oxide, a so-called acceptor organic material or inorganic material, a p-doped layer, or the like.

An example of the hole-injecting organic material is a material that has a hole-transporting property, a work function of about 5.0 to 6.0 eV, and exhibits strong adhesion to the first electrode 21. Examples thereof include CuPc and starburst amine.

The hole-injecting metal oxide is a metal oxide containing any of molybdenum, rhenium, tungsten, vanadium, zinc, indium, tin, gallium, titanium, and aluminum, for example. In addition, an oxide of a plurality of metals containing any one of the above metals, such as indium and tin, indium and zinc, aluminum and gallium, gallium and zinc, titanium and niobium, etc. It may be.

The hole injection layer made of these materials may be formed by a dry process such as vapor deposition or transfer, or by a wet process such as spin coating, spray coating, die coating, or gravure printing. It may be a film.

The material used for the hole transport layer can be selected from a group of compounds having hole transport properties, for example. Examples of this type of compound include 4,4′-bis [N- (naphthyl) -N-phenyl-amino] biphenyl (α-NPD), N, N′-bis (3-methylphenyl)-(1 , 1′-biphenyl) -4,4′-diamine (TPD), 2-TNATA, 4,4 ′, 4 ″ -tris (N- (3-methylphenyl) N-phenylamino) triphenylamine (MTDATA) 4,4′-N, N′-dicarbazole biphenyl (CBP), spiro-NPD, spiro-TPD, spiro-TAD, TNB and the like, arylamine compounds, amine compounds containing carbazole groups, An amine compound containing a fluorene derivative can be exemplified, and any generally known hole transporting material can be used.

The material used for the electron transport layer can be selected from a group of compounds having electron transport properties. Examples of this type of compound include metal complexes known as electron transporting materials such as Alq3, and compounds having a heterocyclic ring such as phenanthroline derivatives, pyridine derivatives, tetrazine derivatives, oxadiazole derivatives, etc. Instead, any generally known electron transport material can be used.

The material of the electron injection layer is, for example, a metal fluoride such as lithium fluoride or magnesium fluoride, a metal halide such as sodium chloride or magnesium chloride, aluminum, cobalt, zirconium, Titanium, vanadium, niobium, chromium, tantalum, tungsten, manganese, molybdenum, ruthenium, iron, nickel, copper, gallium, zinc, silicon, and other metal oxides, nitrides, carbides, oxynitrides, etc., for example, aluminum oxide , Magnesium oxide, iron oxide, aluminum nitride, silicon nitride, silicon carbide, silicon oxynitride, boron nitride and other insulating materials, silicon compounds such as SiO2 and SiO, carbon compounds, etc. Can be used. These materials can be formed into a thin film by being formed by a vacuum deposition method or a sputtering method.

Further, the same material as that of the second electrode 23 is adopted as the material of the lead-out wiring 23b. Here, the thickness of the lead wiring 23 b is set to the same thickness as the second electrode 23. The lead wire 23 b is formed continuously with the second electrode 23. Therefore, the light emitting device A of the present embodiment can simultaneously form the lead wiring 23b and the second electrode 23 at the time of manufacture.

Further, the lead-out wiring 23b extends to a portion formed on the inner side of the bonding region 25a with the bonding portion 4 in the second transparent conductive oxide layer 25 of the second terminal portion T2.

The width (wiring width) of the lead-out wiring 23b is such that the second terminal portion T2 can prevent a short circuit with the first terminal portion T1 and ensure a predetermined insulation distance from the first terminal portion T1. It is set to a value slightly smaller than the width dimension.

The width dimension of the lead-out wiring 23b is preferably equal to or smaller than the width of the second terminal portion T2, but is preferably as large as possible in order to increase electromigration resistance.

The material of the first transparent conductive oxide layer 24 and the second transparent conductive oxide layer 25 is transparent conductive oxide (TCO), such as ITO, AZO, GZO, and IZO. Can be adopted.

The first transparent conductive oxide layer 24 and the second transparent conductive oxide layer 25 are made of the same material as that of the first electrode 21, and the first electrode 21, the first transparent conductive oxide layer 24, The two transparent conductive oxide layers 25 are set to the same thickness.

The material of the first metal layer 27 and the second metal layer 28 is, for example, a metal such as aluminum, silver, gold, copper, chromium, molybdenum, aluminum, palladium, tin, lead, magnesium, or at least one of these metals. An alloy containing a seed is preferred.

Further, the first metal layer 27 and the second metal layer 28 are not limited to a single layer structure, and may have a multilayer structure. For example, the first metal layer 27 and the second metal layer 28 can adopt a three-layer structure of MoNb layer / AlNd layer / MoNb layer. In this three-layer structure, the lower MoNb layer is preferably provided as an adhesion layer with the base, and the upper MoNb layer is preferably provided as a protective layer for the AlNd layer.

In this embodiment, the material of the first metal layer 27 and the material of the second metal layer 28 are the same, and the first metal layer 27 and the second metal layer 28 are set to the same thickness. The first metal layer 27 and the second metal layer 28 may employ the same material as the second electrode 23.

Moreover, as a material of the auxiliary electrode 26, for example, a metal such as aluminum, silver, gold, copper, chromium, molybdenum, aluminum, palladium, tin, lead, and magnesium, or an alloy including at least one of these metals is preferable. .

Further, the auxiliary electrode 26 is not limited to a single layer structure, and may have a multilayer structure. For example, the auxiliary electrode 26 can adopt a three-layer structure of MoNb layer / AlNd layer / MoNb layer. In this three-layer structure, the lower MoNb layer is preferably provided as an adhesion layer with the base, and the upper MoNb layer is preferably provided as a protective layer for the AlNd layer.

In the light emitting device A of the present embodiment, the material of the auxiliary electrode 26 and the material of the first metal layer 27 and the second metal layer 28 are the same. Thereby, in the light-emitting device A of this embodiment, it becomes possible to form the auxiliary electrode 26, the 1st metal layer 27, and the 2nd metal layer 28 simultaneously at the time of manufacture, and can achieve cost reduction.

Further, as the material of the insulating film 29, for example, polyimide is adopted, but not limited thereto, for example, novolak resin, epoxy resin, or the like can be adopted.

In the organic EL element 2 described above, the region where only the organic EL layer 22 is interposed between the first electrode 21 and the second electrode 23 constitutes the light emitting unit 20 described above, and the planar shape of the light emitting unit 20 is insulated. The film 29 has the same rectangular shape (in the illustrated example, a square shape) as the shape of the inner peripheral edge. Here, in the light emitting device A, a portion other than the light emitting portion 20 of the organic EL element 2 is a non-light emitting portion in plan view.

Further, although the glass substrate is used as the cover substrate 5, the present invention is not limited thereto, and for example, a plastic substrate may be used. As the glass substrate, for example, a soda lime glass substrate or an alkali-free glass substrate can be used. Further, as the plastic substrate, for example, a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate (PEN) substrate, a polyethersulfone (PES) substrate, a polycarbonate (PC) substrate, or the like may be used. When a plastic substrate is used, an SiON film, an SiN film, or the like may be formed on the surface of the plastic substrate to suppress moisture permeation.

As the material of the cover substrate 5, a material having a small difference in linear expansion coefficient from the material of the translucent substrate 1 is preferable, and stress generated due to the difference in linear expansion coefficient between the cover substrate 5 and the translucent substrate 1 is applied. From the viewpoint of reduction, materials having the same linear expansion coefficient difference are more preferable.

The cover substrate 5 is bonded to the element substrate 3 via the bonding portion 4 as described above. Here, the interface between the bonding portion 4 and the element substrate 3 includes the first interface between the bonding portion 4 and the first terminal portion T1, the second interface between the bonding portion 4 and the second terminal portion T2, and the bonding portion 4. And a third interface between the transparent substrate 1 and the transparent substrate 1.

As a material (adhesive) of the joint portion 4, an epoxy resin is used, but is not limited thereto, and for example, an acrylic resin, a frit glass, or the like may be employed. The epoxy resin or acrylic resin may be an ultraviolet curable type or a thermosetting type. In addition, as a material for the joint portion 4, an epoxy resin containing a filler (for example, silica, alumina, etc.) may be used.

The drying member 7 is formed using a desiccant such as calcium oxide, barium oxide, or silica gel, for example. Here, as the desiccant, a material having an infrared absorption rate higher than that of the cover substrate 5 is preferable.

As the material of the soaking plate 6, a metal having high thermal conductivity among various metals is preferable, and copper is adopted. The material of the soaking plate 6 is not limited to copper, and may be aluminum, gold, bronze, brass, or the like, for example. The soaking plate 6 may be a metal foil (for example, a copper foil, an aluminum foil, a gold foil, etc.).

In the light emitting device A of the present embodiment, the opening size of the recess 51 in the cover substrate 5 is set larger than the size of the outer peripheral shape of the insulating film 29, and the peripheral portion of the cover substrate 5 (the periphery of the recess 51 is ) Is bonded to the element substrate 3 through the bonding portion 4.

Thereby, in the light emitting device A, since the first electrode 21 and the second electrode 23 are not exposed to the outside, the moisture resistance can be improved. Here, a part of each of the first terminal portion T1 and the second terminal portion T2 is exposed to the outside of the organic EL element 2.

Here, the first terminal portion T1 has a laminated structure of the first transparent conductive oxide layer 24 and the first metal layer 27 as described above, but only the first transparent conductive oxide layer 24 is present. The joining region 24a configured by the following is provided over the entire length in the width direction of the first terminal portion T1 along the circumferential direction of the joining portion 4.

The second terminal portion T2 has a laminated structure of the second transparent conductive oxide layer 25 and the second metal layer 28 as described above, but only by the second transparent conductive oxide layer 25. The joining region 25a to be configured is provided over the entire length in the width direction of the second terminal portion T2 along the circumferential direction of the joining portion 4.

Accordingly, the first interface between the junction 4 and the first terminal portion T1 is constituted by the interface between the junction 4 and the first transparent conductive oxide layer 24, and the first interface between the junction 4 and the second terminal portion T2. The two interface is constituted by an interface between the joint portion 4 and the second transparent conductive oxide layer 25.

Thereby, the light emitting device A of the present embodiment can improve the bonding strength between the bonding portion 4 and the first terminal portion T1 and the second terminal portion T2, and the first metal layer 27 and the second metal. It is possible to prevent the oxidation of the layer 28 with the passage of time and change the state of the first interface and the second interface, thereby improving the reliability.

Moreover, in the light-emitting device A of this embodiment, since the soaking plate 6 is provided, the temperature of the light emitting unit 20 of the organic EL element 2 can be soaked, and the temperature of the light emitting unit 20 can be reduced. In-plane variation can be reduced, and heat dissipation can be improved.

However, in the light emitting device A, the temperature rise of the organic EL element 2 can be suppressed, and the lifetime can be extended when the input power is increased to increase the luminance.

In the light emitting device A of the present embodiment, the planar size of the light emitting unit 20 is set to 80 × 80 mm, but is not limited thereto, and may be set as appropriate within a range of about 30 × 30 to 300 × 300 mm, for example.

Moreover, although the center-to-center distance between the two first terminal portions T1 and T1 disposed on both sides in the width direction of the second terminal portion T2 is set to 30 mm, this value is an example and is not particularly limited. Absent.

The thickness of the first electrode 21 is in the range of about 110 nm to 300 nm, the thickness of the organic EL layer 22 is in the range of about 150 nm to 300 nm, the thickness of the second electrode 23 is in the range of about 70 nm to 300 nm, and the insulating film 29 The thickness of the auxiliary electrode 26, the first metal film 27, and the second metal film 28 is appropriately set in the range of about 300 nm to 600 nm. These values are There is no particular limitation.

As the width of the auxiliary electrode 26 increases, the impedance of the auxiliary electrode 26 decreases as the width increases, and the in-plane variation of the luminance of the light emitting unit 20 is reduced. Since it decreases, it is preferable to set in the range of about 0.3 mm to 3 mm. In a lighting fixture in which a plurality of light-emitting devices A according to this embodiment are used as a light source, the distance between adjacent light-emitting portions 20 can be reduced and the appearance can be improved as the width of the auxiliary electrode 26 is reduced.

Moreover, although the distance of the 1st terminal part T1 and 2nd terminal part T2 and the periphery of the translucent board | substrate 1 is set to 0.2 mm, this value is not specifically limited, For example, 0. It is preferable to set appropriately within a range of about 1 to 2 mm. In order to reduce the area of the non-light emitting portion of the light emitting device A, it is preferable to shorten the distance between the first terminal portion T1 and the second terminal portion T2 and the peripheral edge of the translucent substrate 1, but the first terminal portion T1. And when it is necessary to ensure a predetermined creepage distance between the second terminal portion T2 and another metal member (for example, a metal fixture body of a lighting fixture), the value is longer than this creepage distance. It is preferable to set.

Hereinafter, a method for manufacturing the light emitting device A of the present embodiment will be described with reference to FIGS.

First, the first electrode 21 and the first transparent conductive material made of the same transparent conductive oxide (for example, ITO, AZO, GZO, IZO, etc.) on the one surface side of the transparent substrate 1 made of a glass substrate. By simultaneously forming the oxide layer 24 and the second transparent conductive oxide layer 25 by using a vapor deposition method, a sputtering method, or the like, the structure shown in FIG. 9 is obtained.

Next, the auxiliary electrode 26, the first metal layer 27, and the second metal layer 28 made of, for example, the same metal material are applied to the one surface side of the translucent substrate 1 by using a vapor deposition method, a sputtering method, or the like. 10 to obtain the structure shown in FIG.

Subsequently, an insulating film 29 made of a resin material (for example, polyimide, novolac resin, epoxy resin, etc.) is formed on the one surface side of the translucent substrate 1 to obtain the structure shown in FIG.

Then, the structure shown in FIG. 12 is obtained by forming the organic EL layer 22 on the one surface side of the translucent substrate 1 by, for example, vapor deposition. In addition, the formation method of the organic EL layer 22 is not limited to the vapor deposition method, and may be a coating method, for example, and may be appropriately selected according to the material of the organic EL layer 22.

Subsequently, the second electrode 23 and the lead wiring 23b made of the same metal material (for example, aluminum, silver, etc.) are formed on the one surface side of the translucent substrate 1 by using a vapor deposition method, a sputtering method, or the like. Thus, the element substrate 3 having the structure shown in FIG. 13 is obtained. This is the element substrate forming step for forming the organic EL element 2 on the one surface side of the translucent substrate 1.

Thereafter, for example, an adhesive (for example, epoxy resin, acrylic resin, glass frit, etc.) 4a, which is a material of the joint portion 4, is applied to the element substrate 3 with a dispenser or the like, thereby obtaining the structure shown in FIG. The adhesive 4a emits light across the first terminal portion T1 and the second terminal portion T2 so that a part of each of the first terminal portion T1 and the second terminal portion T2 is located outside the space (storage space) 8. It is formed so as to surround the portion 20.

Here, in the application step of applying the adhesive 4a, the adhesive 4a is applied to the peripheral portion of the element substrate 3 in a rectangular frame shape, but the peripheral portion of the recess 51 in the cover substrate 5 instead of the element substrate 3. The adhesive 4a may be applied to the (periphery) in a rectangular frame shape.

In addition, the coating apparatus which apply | coats the adhesive agent 4a used as the junction part 4 is not restricted to a dispenser, For example, you may use a screen printing apparatus, a die coater, a slit coater, etc.

Thereafter, an overlaying process is performed in which the cover substrate 5 and the element substrate 3 to which the drying member 7 and the soaking plate 6 are previously attached are superposed, followed by curing to form the joint portion 4 by curing the adhesive 4a. The light emitting device A is obtained by performing the steps.

In the overlapping process, the element substrate 3 and the cover substrate 5 are overlapped and pressed to crush and spread the adhesive 4a.

In the curing step, when the adhesive 4a is an ultraviolet curing type, the adhesive 4a is cured by irradiating with ultraviolet rays. When the adhesive 4a is a thermosetting type, the adhesive 4a is cured by heating the adhesive 4a.

Here, the step of attaching the drying member 7 to the cover substrate 5, the application step of applying the adhesive 4a to the element substrate 3 or the cover substrate 5, the overlapping step of overlapping the element substrate 3 and the cover substrate 5, the adhesive 4a The curing step for curing is performed in a nitrogen atmosphere with a dew point of −65 ° C., for example.

The soaking plate 6 may be attached to the cover substrate 5 after the adhesive 4a of the joint 4 is cured.

Moreover, as a desiccant of the drying member 7, for example, a seal-type desiccant or a coating-type desiccant can be used. Depending on the combination with the agent 4 a, it may be performed either before the cover substrate 5 and the element substrate 3 are overlapped with each other, or may be combined with a curing step of curing the adhesive 4 a of the joint portion 4. As a method for applying the coating type desiccant, for example, a method using a dispenser, a screen printing apparatus, a metal mask, a die coater, a slit coater, or the like can be employed.

By the way, the manufacturing method of the light emitting device A will be further described. For example, the element substrate 3 is a rectangular plate that can be arranged in a 2 × 2 array and is divided into individual element substrates 3 later. A substrate (not shown) or a fourth substrate (not shown) that is a rectangular plate that can arrange the cover substrates 5 in a 2 × 2 array and is divided into individual cover substrates 5 later. On the other hand, an application step of applying the adhesive 4a is performed.

Here, the third substrate may be a rectangular plate that can arrange the element substrates 3 in an array of 2 × i (i is an integer of 1 or more). The fourth substrate may be a rectangular plate that can arrange the cover substrates 5 in a 2 × j (j = i) array.

After the coating process, an overlapping process for overlapping the fourth substrate and the third substrate is performed, and subsequently, a curing process for forming the joint portion 4 by curing the adhesive 4a is performed. Thereafter, a dividing step of dividing the third substrate into individual element substrates 3 and dividing the fourth substrate into individual cover substrates 5 is performed.

Further, when the third substrate is divided in the dividing step, the first scribe line is drawn on the surface of the third substrate opposite to the fourth substrate side by, for example, a scriber, and then, for example, by a break machine from the fourth substrate side. The third substrate may be cut by applying pressure.

Further, when the fourth substrate is divided in the dividing step, a second scribe line is drawn on the surface of the fourth substrate opposite to the third substrate side, for example, by a scriber, and then, for example, by a break machine from the third substrate side. The fourth substrate may be cut by applying pressure.

The third substrate is not limited to a rectangular plate shape in which the element substrates 3 can be arranged in an array of 2 × i (i is an integer equal to or greater than 1), and the element substrate 3 having a first unit dimension defined in advance. As a larger rectangular plate, the element substrate 3 may be divided into a first unit dimension or a desired outer dimension smaller than the third substrate.

In this case, the fourth substrate is not limited to the rectangular plate shape in which the cover substrates 5 can be arranged in an array of 2 × j (j = i), but more than the cover substrate 5 having the second unit dimension defined in advance. As a large rectangular plate, the cover substrate 5 may be divided into the second unit size or a desired outer size smaller than the fourth substrate.

By the way, as described above, the light-emitting device A of the present embodiment includes the light-transmitting substrate 1 and the element substrate 3 including the organic EL element 2 formed on the one surface side of the light-transmitting substrate 1, and the light-transmitting property. The cover substrate 5 disposed opposite to the one surface side of the substrate 1, and the element substrate 3 and the cover substrate 5 formed in a frame shape surrounding the light emitting portion 20 of the organic EL element 2 on the one surface side of the translucent substrate 1. And a bonding portion 4 made of an adhesive 4a. Further, the light emitting device A includes a drying member 7 disposed on the light emitting unit 20 through a space on the side of the cover substrate 5 facing the translucent substrate 1. The drying member 7 is disposed on the peripheral portion of the cover substrate 5 inside the region of the cover substrate 5 that overlaps the bonding portion 4.

In the light emitting device A of the present embodiment, the shape of the drying member 7 in a plan view is a quadrangular shape, and the four drying members 7 are spaced apart at substantially equal intervals in the circumferential direction of the cover substrate 5.

In other words, the light-emitting device A of the present embodiment includes a first substrate (translucent substrate) 1, an organic EL element 2, a second substrate (cover substrate) 5, a bonding portion 4, and a drying member 7. . The organic EL element 2 includes a light emitting unit 20 that emits light. The organic EL element 2 is formed on the one surface of the first substrate 1. The second substrate 5 is disposed so as to face the one surface of the first substrate 1. The second substrate 5 is configured to form a space 8 for accommodating the light emitting unit 20 between the second substrate 5 and the first substrate 1. The joint portion 4 is formed in a frame shape surrounding the light emitting portion 20. The bonding portion 4 is configured to bond the surface of the second substrate 5 facing the first substrate 1 to the one surface of the first substrate 1. The drying member 7 is disposed on the outer edge of the region surrounded by the joint portion 4 on the facing surface of the second substrate 5 so as not to contact the light emitting portion 20. Further, in the light emitting device A of the present embodiment, the light emitting unit 20 is located at the center of the joint 4.

As described above, in the light emitting device A according to the present embodiment, the drying member 7 is disposed on the periphery of the cover substrate 5 inside the region of the cover substrate 5 that overlaps the bonding portion 4. Even when the heat equalizing plate 6 and the cover substrate 5 are pressed during the handling of A, and the cover substrate 5 may be bent in the form of a convex toward the light emitting portion 20 side of the organic EL element 2, the drying member 7 is It is possible to suppress the occurrence of a defect in which the light emitting unit 20 cannot contact the light emitting unit 20 to emit light. Thereby, the light emitting device A can improve the reliability.

Further, in the light emitting device A according to the present embodiment, as described above, the provision of the soaking plate 6 enables the temperature of the light emitting unit 20 of the organic EL element 2 to be soaked, thereby emitting light. It is possible to reduce in-plane variations in the temperature of the portion 20.

In the light emitting device A of the present embodiment, the drying member 7 having a lower thermal conductivity than the soaking plate 6 is disposed on the periphery of the cover substrate 5 inside the region of the cover substrate 5 that overlaps the joint 4. As a result, it is possible to prevent the soaking effect of the soaking plate 6 from being impaired.

Further, in the light emitting device A of the present embodiment, the drying member 7 is formed using a desiccant having an infrared absorption rate higher than that of the cover substrate 5. In other words, the drying member 7 has an infrared absorption rate higher than that of the second substrate (cover substrate) 5.

Therefore, according to the light emitting device A of the present embodiment, it becomes possible to lower the temperature of the peripheral portion of the light emitting portion 20 compared to the temperature of the central portion of the light emitting portion 20, and to reduce the current density of the peripheral portion of the light emitting portion 20. Thus, by reducing the light emission amount, it is possible to reduce in-plane variation in luminance of the light emitting unit 20.

By the way, as shown in FIG. 1, the recess 51 formed in the said opposing surface with the translucent board | substrate 1 in the cover board | substrate 5 is formed in the opening shape of a 1st polygon shape (this embodiment square shape). Has been. On the other hand, the drying member 7 is formed in a second polygonal shape (in the present embodiment, a quadrangular shape) in which a specific inner angle α2 (= 90 °) is combined with the inner angle α1 (= 90 °) of the first polygonal shape. Has been. In the drying member 7, the two

sides

71 and 72 having the vertex of the specific inner angle α2 as the end points and the two

sides

511 and 512 having the vertex of the first polygonal inner angle α1 as the end points are parallel to each other. Are arranged as follows.

In other words, the second substrate 5 includes a polygonal recess 51 on the facing surface (the lower surface in FIG. 1B). The recess 51 has an outer periphery surrounding the light emitting unit 20 in a plane parallel to the one surface of the first substrate 1. The second substrate 5 is bonded to the first substrate 1 via the bonding portion 4 around the recess 51 on the facing surface. The drying member 7 is disposed at a corner portion on the bottom surface of the recess 51.

Further, in the light emitting device A of the present embodiment, the corner portion has a predetermined inner angle α1. The drying member 7 is formed in a shape having an angle (inner angle) α2 equal to a predetermined inner angle α1.

In the light emitting device A of the present embodiment, the drying member 7 includes two

sides

71 and 72 that define an angle (inner angle) α2 that are opposite to and parallel to two

sides

511 and 512 that define a predetermined inner angle α1. To be arranged.

Further, in the light emitting device A of the present embodiment, the drying member 7 is disposed at each corner of the bottom surface of the recess 51.

Therefore, in the light emitting device A of the present embodiment, it becomes possible to make the two

sides

71 and 72 having the vertex of the specific inner angle α2 in the drying member 7 parallel to the joint portion 4, and to remove moisture from the outside. The drying member 7 can absorb efficiently, and the reliability can be further improved.

In addition, in this embodiment, since the planar view shape of the drying member 7 is a square shape, what is necessary is just to arrange | position the drying member 7 by making any one of four interior angles into the specific interior angle (alpha) 2.

Further, in the light emitting device A of the present embodiment, as described above, the organic EL element 2 includes the first electrode 21, the organic EL layer 22, the second electrode 23, the first terminal portion T1, the second terminal portion T2, and the auxiliary. An electrode 26 is provided, and a first terminal portion T1 and a second terminal portion T2 are disposed on each of both end portions in the specified direction on the one surface of the translucent substrate 1.

Thereby, in the light emitting device A of the present embodiment, it is possible to increase the luminance and improve the in-plane uniformity of the luminance, and it is possible to reduce the area of the non-light emitting portion. Moreover, in the lighting fixture which uses the light-emitting device A of this embodiment as a light source by arranging two or more in the direction orthogonal to the said prescription | regulation direction, the distance between the adjacent light emission parts 20 can be made small, and an appearance improves.

Further, in the light emitting device A of the present embodiment, as described above, the first terminal portion T1 and the second terminal portion T2 are each a laminated structure of the transparent conductive oxide layers 24 and 25 and the metal layers 27 and 28. It is preferable that only the transparent conductive oxide layers 24 and 25 are in contact with the joint portion 4.

Thereby, in the light-emitting device A of this embodiment, it is possible to increase the luminance and improve the in-plane uniformity of the luminance, and further improve the bonding strength between the bonding portion 4 and the first terminal portion T1 and the second terminal portion T2. It becomes possible to make it. In addition, it is possible to prevent the first metal layer 27 and the second metal layer 28 from being oxidized with the passage of time and change the state of the first interface and the second interface, thereby improving the reliability. It becomes.

In the light emitting device A of the present embodiment and the comparative example in which the metal layers 27 and 28 are in contact with the joint 4 at the first terminal portion T1 and the second terminal portion T2, the light emitting portion 20 does not emit light (dark area). ), It was confirmed that the time required for the light emitting device A of the present embodiment to take a longer time was compared with the time taken to travel a specified distance from the edge of the light emitting unit 20. Therefore, in the light emitting device A of the present embodiment, it is possible to improve the gas barrier property, which is the performance of blocking moisture and oxygen, and to extend the life.

In the light emitting device A of the present embodiment, the current flowing through the organic EL element 2 is set by setting the total dimension of the width of the first terminal portion T1 and the total dimension of the width of the second terminal portion T2 to the same value. It is possible to increase the size, and the luminous efficiency can be improved.

Further, in the light emitting device A of the present embodiment, electromigration occurs when a current of a critical current density (1 × 10 ⁵ A / cm ² when the metal is aluminum) flows over a long period of time in the lead wiring 23b. There is a concern that disconnection is likely to occur.

On the other hand, the first transparent conductive oxide layer 24 formed of TCO such as ITO and continuing to the first electrode 21 has a larger critical current density and a larger margin for the critical current density than the lead wiring 23b. .

Therefore, in the light emitting device A of the present embodiment, electromigration resistance (hereinafter abbreviated as EM resistance) is made by making the total width of the second terminal portion T2 larger than the total width of the first terminal portion T1. Can be improved.

1, the total dimension of the width of the second terminal portion T2 is the total dimension of the widths of the four second terminal portions T2 (the dimension in the left-right direction in FIG. 2). The total dimension of the width of T1 is the total dimension of the widths (dimensions in the horizontal direction in FIG. 2) of the six first terminal portions T1.

Further, the light emitting device A of the present embodiment includes m (m ≧ 1) second terminal portions T2 and [m + 1] along each of two predetermined parallel sides of the light emitting portion 20 having a rectangular shape in plan view. The first terminal portions T1 are arranged so that the first terminal portions T1 are positioned on both sides in the width direction of the second terminal portions T2, and the first transparent conductive oxide layer 24 and the second transparent conductive layers are disposed. The thickness of the conductive oxide layer 25 is set to the same thickness.

Thereby, in the light-emitting device A of this embodiment, it becomes possible to arrange | equalize the joint strength and adhesiveness with respect to 1st terminal part T1 and 2nd terminal part T2 of the junction part 4, and it can improve reliability more. Become.

By the way, the planar view shape of the translucent substrate 1 is not limited to the rectangular shape, but may be a square shape in the case of the rectangular shape. When the planar view shape of the translucent substrate 1 is a square shape, the planar shape of the light emitting unit 20 may be a rectangular shape, and the two short sides of the rectangular light emitting unit 20 may be the predetermined two sides. Further, the plan view shape of the translucent substrate 1 is a rectangular shape, and the plan view shape of the light emitting unit 20 is a non-similar rectangular shape to the translucent substrate 1, and the two long sides of the light emitting unit 20 having the rectangular shape are used. May be the two predetermined sides.

(Embodiment 2)
The basic configuration of the light emitting device A of the present embodiment is substantially the same as that of the first embodiment, and as shown in FIG. 15, a plan view of a light transmitting substrate 1 as a first substrate, a cover substrate 5 as a second substrate, and the like. The shape is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

The translucent substrate 1 in the present embodiment has a regular hexagonal shape in plan view, and the cover substrate 5 has a regular hexagonal shape in plan view similar to that of the translucent substrate 1. Moreover, the planar view shape of the light emission part 20 (refer FIG.1 (b)) demonstrated in Embodiment 1 is also a regular hexagon shape.

The recess 51 formed in the cover substrate 5 on the surface facing the translucent substrate 1 is formed in an opening shape of a first polygonal shape (regular hexagonal shape in the present embodiment). On the other hand, the drying member 7 has a second polygonal shape (isosceles triangular shape in the present embodiment) obtained by combining a specific interior angle α2 (= 120 °) with the interior angle α1 (= 120 °) of the first polygonal shape. Is formed. In the drying member 7, the two

sides

Therefore, also in the light emitting device A of the present embodiment, it becomes possible to make the two

sides

71 and 72 having the vertex of the specific inner angle α2 as the end point in the drying member 7 parallel to the joint portion 4, and moisture from the outside. Can be efficiently absorbed by the drying member 7, and the reliability can be further improved.

The first polygonal shape (that is, the shape of the recess 51) is not limited to a regular hexagonal shape, and may be, for example, a regular pentagonal shape or a regular octagonal shape. In addition, the first polygonal shape is not limited to the regular polygonal shape, but may be any polygonal shape. However, when the regular polygonal shape is used, a single second polygonal shape is prepared as the drying member 7. It is possible to reduce the cost well.

In the organic EL element 2 in each embodiment described above, the first electrode 21 made of a transparent conductive film constitutes an anode, and the second electrode 23 having a sheet resistance smaller than that of the first electrode 21 constitutes a cathode. The first electrode 21 may constitute a cathode and the second electrode 23 may constitute an anode. In any case, it is sufficient that light can be extracted through the first electrode 21 made of a transparent conductive film.

The light-emitting device A described in each embodiment can be suitably used as a light source for illumination, for example, but is not limited to illumination, and can be used for other purposes.

Claims

An organic EL device having a first substrate and a light emitting unit that emits light, and formed on one surface of the first substrate;
A second substrate disposed so as to oppose the one surface of the first substrate, and forming a space for housing the light emitting unit between the first substrate,
A joining portion formed in a frame shape surrounding the light emitting portion, and joining a surface of the second substrate facing the first substrate to the one surface of the first substrate;
A drying member disposed on an outer edge of a region surrounded by the bonding portion on the facing surface of the second substrate so as not to contact the light emitting portion;
A light emitting device comprising:
The light emitting device according to claim 1, wherein the light emitting unit is positioned at a center of the joint.
The second substrate includes a polygonal recess on the facing surface,
The recess has an outer periphery that surrounds the light emitting unit in a plane parallel to the one surface of the first substrate,
The second substrate is bonded to the first substrate through the bonding portion around the recess in the facing surface,
The light-emitting device according to claim 1, wherein the drying member is disposed at a corner of the bottom surface of the recess.
The corner portion has a predetermined inner angle;
The light-emitting device according to claim 3, wherein the drying member is formed in a shape having an angle equal to the predetermined inner angle.
The light-emitting device according to claim 4, wherein the drying member is arranged such that two sides defining the corner are opposed to and parallel to the two sides defining the predetermined inner angle.
The light emitting device according to any one of claims 1 to 5, wherein the drying member is disposed at each of the corners of the bottom surface of the recess.
6. The light emitting device according to claim 1, wherein the drying member has an infrared absorption rate higher than that of the second substrate.