TW201244208A - Light emitting device - Google Patents

Light emitting device Download PDF

Info

Publication number
TW201244208A
TW201244208A TW101108165A TW101108165A TW201244208A TW 201244208 A TW201244208 A TW 201244208A TW 101108165 A TW101108165 A TW 101108165A TW 101108165 A TW101108165 A TW 101108165A TW 201244208 A TW201244208 A TW 201244208A
Authority
TW
Taiwan
Prior art keywords
substrate
light
emitting
layer
emitting device
Prior art date
Application number
TW101108165A
Other languages
Chinese (zh)
Other versions
TWI485900B (en
Inventor
Motonobu Aoki
Shingo Houzumi
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW201244208A publication Critical patent/TW201244208A/en
Application granted granted Critical
Publication of TWI485900B publication Critical patent/TWI485900B/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/874Passivation; Containers; Encapsulations including getter material or desiccant

Landscapes

  • Electroluminescent Light Sources (AREA)

Abstract

A light emitting device of the present embodiment comprises a first substrate, an organic EL element, a second substrate, a junction portion and a drying member. The organic El element comprises a light emitting portion for emitting light. The organic El element is formed at one surface of the first substrate. The second substrate is disposed oppositely to the foresaid surface of the first substrate. The second substrate is constituted to form a space, between it and the first substrate, for receiving the light emitting portion. The junction portion is formed in a frame shape of surrounding the light emitting portion. The junction portion is constituted to join the surface of the second substrate opposite to the first substrate with the foresaid surface of the first substrate. The drying member is disposed in the way of keeping from contact with the light emitting portion at an outer edge of an area surrounded by the junction portion on the surface opposite to the second substrate.

Description

201244208 六、發明說明: 【發明所屬之技術領域】 本發明關於一種發光裝置。 【先前技術】 以往以來’如圖16所示’已提出一種有機電致發光(el) 元件,其具有基板201,形成在基板201上的有機el構造 體202 ,及密封板203,其以覆蓋該有機EL構造體202的 方式而以規定間隔配置著(請參閱文獻1「日本國公開專利 公報第2000-277254號」。該有機EL元件中密封板203 由黏者劑204而黏著、固定在基板201上。又,該有機el 元件以使得黑點的發生、擴大等的經時劣化受到抑制為目 的,在达、封板203的内面側形成的凹部中配置有聚石夕氧樹 脂和乾燥劑的混合物205。 然而,如圖16所示構成的有機EL元件中,操作該有 機EL元件時會有密封板2〇3上受到按壓力且密封板2〇3會 有凹向内側(有機EL構造體202側成為凸形而發生撓曲)的 情況’且混合物205與有機EL構造體2〇2接觸而存在該有 機EL構造體202成為不能發光的不良現象之隱憂。 【發明内容】 ^ 本發明係有鑑於上述理由而開發者,其目的為提供— 種能使可靠性提高的發光裝置。 明之第】形態的發光裝置具備:帛】基板、有機 _疋件、第2基板、接合部、及乾燥構件。前述有機豇 ^牛4具有放射光的發㈣。前财機EL元件軸在前 表面上。前述第2基板配置成與前述第1基板的 月IJ述-表面相對向。前述第2基板構成為與前述第】基 4/35201244208 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a light-emitting device. [Prior Art] Conventionally, as shown in Fig. 16, an organic electroluminescence (el) element having a substrate 201, an organic EL structure 202 formed on a substrate 201, and a sealing plate 203 to cover The organic EL structure 202 is disposed at a predetermined interval (refer to Japanese Laid-Open Patent Publication No. 2000-277254). In the organic EL device, the sealing plate 203 is adhered and fixed by the adhesive 204. On the substrate 201, the organic EL element is designed to suppress the deterioration of the occurrence of black spots over time, and the like, and the polycrystalline oxide resin and the drying are disposed in the concave portion formed on the inner surface side of the sealing plate 203. In the organic EL element constructed as shown in Fig. 16, when the organic EL element is operated, there is a pressing force on the sealing plate 2〇3 and the sealing plate 2〇3 is concavely inward (organic EL) When the structure 202 is convex and is bent, and the mixture 205 is in contact with the organic EL structure 2〇2, there is a concern that the organic EL structure 202 is incapable of emitting light. [Summary of the Invention] ^本Invention department For the above reasons, the developer aims to provide a light-emitting device capable of improving reliability. The light-emitting device of the first aspect includes a substrate, an organic element, a second substrate, a joint portion, and a drying member. The organic cerium 4 has a radiation (four). The front surface of the EL element is on the front surface, and the second substrate is disposed to face the surface of the first substrate. The second substrate is formed. For the above mentioned base 4/35

201244208 之間形成可收㈣述發光部之㈣。誠接合部形成為圍 繞前述發光部之框狀。前述接合部構成為使前述第$板 n!基板i的對向面接合至前述第1基板“述 二表面。㈣乾燥構件以不接觸前述發光部之方式配置在 前述第2基板的前述對向面中由俞 - 囟T由刖述接合部所圍繞的區域 的外緣。 本發明之第2形態的發光裝置中,係使第1形態的前 述發光部位於前述接合部的中心。 & j發明之第3形態的發光裝置中,係使ρ或第:形 態的f述第2基板在前述對向面具備多角形狀的凹處。前述凹 處在丽述第1基板之與前述—表面平行的_具有圍繞前述 么光4之外周。&述第2基板在前述對向面之前述凹處的周邊 由刖述接合部而接合至前述第丨基板。前述乾雜件配置在 鈾述凹處的底面之角部。 本發明之第4形態的發光裝置中,係使第3形態的前 述角部具有規定的内肖。前述乾賴件形成為具有與前述規定 的内角相等的角的形狀。 本發明之第5形態的發光裝置中,係使第4形態的前 达乾燥構件配置成使定義前述角的二邊與定義前述規定的内 角的二邊各別地相對向且相平行。 仏本發明之第6形態的發光裝置中,係使第1至第5形 的任-形態之前述乾燥構魏置在前述凹處的前述底面的 各前述角部處。 ^本發明之第7形態的發光裝置中,係使第1至第6形 悲的任—形態之前述乾燥構件較前述第2基板具有更高的紅 外線吸收率。 5/35 201244208 【實施方式】 以下,基於圖】至圖8來說明本實施 狀發光裝置)A。 置(面 ,發光農置A具備元件基板(有機乱元件模 含形成在透光性基板i及透光性基板i的 4 的上面側)的有機EL元件2 ;及蓋基板5 、貝成(=(b) 性基板1的上述—表面側相對向且經由接合部 元件基板;3。 | *而接合至 阶署Α具備均熱板6(請參閱圖3至圖8),Α 配置在盍基板5之為有機EL元件2側的相反側。” 此處,蓋基板5係在與元件基板3的對向面 下面)上形成有凹處51 ’且蓋基板5係全周 之凹處5的周部而與元件基板3接合。凹處51在盘第= ^的上述-表面平行的面内具有圍繞發光部2 ς 實施形態中,凹處51形成為矩形狀。 的卜門本 藉此,發光裝置Α中,有機EL元件2的發光部 納在以透紐基板!和錄板5及接合部 空間(收納空間)8中。 吓固%之虱袷 本實細彡態巾,透紐基板1構成帛1基板,蓋 基板5構成第2基板。 土攸盖 賴’本#卿||的發絲置Α具備第丨基板(透光性 二且件2、第2基板5、接合部4。有機a 〃有放射光的發光部2〇。有機乱 m一表面上。第2基板5配置成與第 6/35 Η开,二爾Γ:對向。第2 _ 5構成為與第】基板1之 間形成i來收納發光部2G之空間8。接合…形成為圍 201244208 框狀。接合部4構成為使第2基板5之與第 Π面接合至第1基板1的上述-表面。 在蓋基板5之與透紐基板1的上述 濕構件)7者空間硫置在發光部2上的乾燥構件(吸 本貫施形態中,凹處51和乾燥構件7都是矩开 乾Z件7形成為具有與凹處51規定的内角a i相等的角 α2的形狀(請參閱圖〗(a))。 7 1 2 ^5 、下面)之以接合部4所圍繞的區域之外緣。本實 悲中,特別將乾燥構件7配置在蓋基板5之凹處51的 内底面。該乾燥構件7具有吸收水份的功能。 β本實施形態之發光裝置Α具備4個乾燥構件7。4個乾 炼構件7分別配置在凹處51底面的四個角。即。乾燥構件 7分別配置在凹處51底面的角部。各乾燥構件7中,用來 定義角α2的二邊7卜72分別與用來定義蚊的内角α1 的二邊511、512相對向且平行地配置著。 有機EL元件2如圖3至圖8所示,其具備:第!電極 21 ’其形成在透光性基板(第〗基板)】的上述—表面上;有 機EL層22 ’其形成在第i電極21上;及第2電極,其 形成在有機EL層22上。有機EL層22含有使用有機材料 而形成的發光層。 本實施形態t ’有機EL元件2具備:第]電極2卜 其配置在透光性基板1的上述一表面側且由透明導電膜構 成;有機EL層22,其配置在第】電極2】之為透光性基板 1側的相反側且含有由有機材料構成的發光層;及第2電極 7/35 201244208 23 ’其配置在有機EL層22夕A笙ι + 由金屬膜構成。θ 22之為第1電極21側的相反側且 又,有機EL元件2具有:第】端 透光性基板】的上述—表面上且電性連接至第!電才^在 及第2端子部了2,其形成錢紐基板表上 且電性連接至第2電極23。 7上玟表面上 本實施形態中,有機EL元件2具備:第!端 卜 /、配置在第1電極2卜有機EL層22 Γ2’其配置在發光部2°之側方且電性連接至第2電1 此處,第2電極23經由自第2電極2 出配線23b而與第2端子部T2形成電性連接。设置的引 材料具備較第1電極21小的 材枓構成的輔助電極26,其沿著第】電極2ι 板1侧的相反側而形成且電性連接至第1電極21。即二 ^^^^由比電阻較第巧極^小的材“二 輔助電極26。_電極26關繞 再, 方式而形成在第!電極21上。 4有機肛層22)之 又’有機EL元件21在透光性基板 上具備絕緣膜29,其覆蓋該輔助電極%和第1電,: 側緣。有機eL元件2形成為藉由該絕緣膜m1的 助電極26及第1電極21和第2 _ 23 ^ EL·元件2具備該絕緣膜29,其由第2電極 極2〗及該輔助電極26達成電性絕緣。 使第1電 又’輔助電極26沿電極21之為透光性基板! 201244208 側的相反側的表面周部的全周而形成為矩形框狀M日可不 必為矩形框狀’若輔助電極26在電性上連接至 21,則亦可一部份為開放的形狀(例如,c字狀=u字狀 等)、或亦可切割成複數個。 次U子狀 有機EL元件2中,在读朵装也, 土 !中在透先生基板之厚度方向上該透 先性基板1、弟1電極2卜發光層和第 域構,上發光部2。以外的區域成為 P弟電極21中,發光層(有機£ t ^卩42電極23中發光層及與t 豐的部位構成了發光部22。 此處,有機EL元件2中,第!電極2ι tUt23各別的平面視形狀係作成較透光性基板曰 1 =式例中為正方形狀)。因此,發光部㈣ 性基板丨還小的矩形狀(圖式例中為 气㈣輔助電極26中平面視形狀做成矩形框狀(圖 开ί框狀)。又’絕緣膜29中平面視形狀做成矩 形杧狀(圖式例中為正方形框狀)。 70件2中,沿著矩形狀的發光部2G的規定的 τ二;t的各邊’將爪個(圖1的例中,m=2)第2端子部 第=Γ]_’3旬第1端子部τι配置成使 第】=部T1位於第2端子部T2的寬度方向的兩側。 兩端圖1所不的例令,透光性基板1的長邊方向的 2 =各端部處具備第丨端子部η和第2端子部τ2。 二二:機乱元件2令,在透光性基板I的長邊方向 而抑各端部處3㈣1軒部了】分義配置在透光 9/35 201244208 ϊίί ’且透光性基板1的短邊方向中相鄰 ^子部T1之間配置著第2端子部Τ2β 貝靶形態中,在透光性基板1的上述一表 县 邊方向做為規定方向, 上述-^ 4 件基板巾在透紐基板1的 子部W笛規定方向的兩端部的各端部配置著第1端 十。卩Π和第2端子部Τ2。 下,=1端子部丁1具有透明導電性氧化物層24(以 ^ ^ 透明導電性氧化物層24)和金屬層27(以下, 亦%為苐1金屬層27)的積層構造。 •fm / 子部T2具有透明導電性氧化物層25(以下, 亦稱為苐2透明導電性氧化物層25)和金屬層Μ(以下,亦 柄為第2金屬層28)的積層構造。 又’均熱板6的平面形狀做成較蓋基板5還小且較發 光部20還大的矩形狀(圖示例中為正方形狀)。 、下就發光裝置Α的各構成要素做詳細說明。 發光裝置八中使用透光性基板1的另-表面(圖1(b)中 的下面)做為光出射面(發光面)。因此 光性基板^的上述另—表面之中^電極2f、置有機;J 22二第2電極23共3個所重複而投影的區域成為發光面。 透光性基板1的平面視形絲舰絲方職,但不限於 此,例如,亦可做成正方形狀。 透光性基板1係藉由可透過從有機EL元件2所放射的 光的材料來形成。本實施形態中,雜可使用玻璃基板做 為透光性基板1 ’但不限於此,例如,亦可使用塑膠基板。 例如,可使用鈉鈣(s〇daHme)破璃基板、無鹼玻璃基板等做 為玻璃基板。又,例如亦可使用聚對苯二曱酸乙二酯(pET) 10/35(4) The light-emitting part of (4) is formed between 201244208. The bonding portion is formed in a frame shape surrounding the light emitting portion. The bonding portion is configured to bond the opposing surface of the first plate n! substrate i to the first substrate "the two surfaces. (4) The drying member is disposed on the opposite side of the second substrate so as not to contact the light emitting portion. In the light-emitting device according to the second aspect of the present invention, the light-emitting portion of the first aspect is located at the center of the joint portion. In the light-emitting device according to the third aspect of the invention, the second substrate having the ρ or the first aspect has a polygonal recess in the opposing surface. The recess is parallel to the surface of the first substrate. _ has a periphery around the aforementioned light 4. The second substrate is joined to the second substrate by a joint portion in the periphery of the recess of the opposite surface. The dry part is disposed in the uranium In the light-emitting device according to the fourth aspect of the present invention, the corner portion of the third aspect has a predetermined inner corner. The dry member is formed into a shape having an angle equal to the predetermined inner angle. The illuminating device of the fifth aspect of the present invention In the middle, the front drying member of the fourth aspect is arranged such that the two sides defining the angle and the two sides defining the predetermined inner angle are opposed to each other and are parallel to each other. In the light-emitting device according to the seventh aspect of the present invention, the first drying device is placed at each of the corners of the bottom surface of the recess. The drying member of the sixth embodiment has a higher infrared absorption rate than the second substrate. 5/35 201244208 [Embodiment] Hereinafter, the light-emitting device of the present embodiment will be described based on the drawings to FIG. A. The organic EL element 2 including the element substrate (the organic disorder element module is formed on the upper surface side of the light-transmitting substrate i and the light-transmitting substrate i); and the cover substrate 5 and the shell The above-mentioned surface side of the (b) substrate 1 is opposed to and via the joint element substrate; 3..* is joined to the step Α with the heat equalizing plate 6 (see FIGS. 3 to 8), Α configuration On the opposite side of the side of the organic EL element 2 on the side of the ruthenium substrate 5." Here, the cover substrate 5 is attached to the element A recess 51' is formed on the lower surface of the opposite surface of the substrate 3, and the cover substrate 5 is joined to the element substrate 3 by the peripheral portion of the recess 5 of the entire circumference. The recess 51 is in the plane parallel to the above-surface of the disc = ^ In the embodiment, the recess 51 is formed in a rectangular shape. In the light-emitting device, the light-emitting portion of the organic EL element 2 is placed on the substrate and the recording board 5 and the bonding. Part of the space (storage space) 8. In the case of the scareness of the 彡 虱袷 虱袷 , , , , , , , , , 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽The hairline is provided with a second substrate (transparent member 2, second substrate 5, and bonding portion 4. The organic portion a luminescent portion 2b that emits light. Organic chaos m on the surface. The second substrate 5 is disposed to be separated from the 6th/35th, and Erlang: opposite. The second to fifth embodiments are configured to form a space 8 between the first substrate 1 and the light-emitting portion 2G. The joint is formed into a frame of 201244208. The joint portion 4 is configured to bond the second substrate 5 to the first surface of the first substrate 1 to the first surface. In the dry member of the cover substrate 5 and the wet member 7 of the transparent substrate 1 which is disposed on the light-emitting portion 2, the recess 51 and the drying member 7 are both open and dry. 7 is formed into a shape having an angle α2 equal to the inner angle ai prescribed by the recess 51 (see Fig. (a)). 7 1 2 ^5 , the lower edge is the outer edge of the region surrounded by the joint portion 4. In this case, the drying member 7 is placed in particular on the inner bottom surface of the recess 51 of the lid substrate 5. The drying member 7 has a function of absorbing moisture. The light-emitting device 本 of the present embodiment has four drying members 7. The four drying members 7 are disposed at four corners of the bottom surface of the recess 51, respectively. which is. The drying members 7 are respectively disposed at the corners of the bottom surface of the recess 51. In each of the drying members 7, the two sides 7b 72 for defining the angle α2 are disposed opposite to and parallel to the two sides 511, 512 for defining the inner angle α1 of the mosquito. The organic EL element 2 is as shown in FIGS. 3 to 8 and includes: The electrode 21' is formed on the above-mentioned surface of the light-transmitting substrate (the first substrate); the organic EL layer 22' is formed on the i-th electrode 21; and the second electrode is formed on the organic EL layer 22. The organic EL layer 22 contains a light-emitting layer formed using an organic material. In the present embodiment, the 'electrode EL element 2 includes the first electrode 2 disposed on the one surface side of the light-transmitting substrate 1 and composed of a transparent conductive film, and the organic EL layer 22 disposed on the first electrode 2 A light-emitting layer made of an organic material on the side opposite to the side of the light-transmitting substrate 1 and a second electrode 7/35 201244208 23' are disposed on the organic EL layer 22, and are made of a metal film. θ 22 is the opposite side of the first electrode 21 side, and the organic EL element 2 has the above-mentioned surface of the first end of the light-transmissive substrate and is electrically connected to the first! The second terminal portion 2 is electrically formed and electrically connected to the second electrode 23. 7 Upper surface of the upper surface In the present embodiment, the organic EL element 2 is provided with: The first electrode 2 is disposed on the first electrode 2, and the organic EL layer 22 Γ 2 ′ is disposed on the side of the light-emitting portion 2° and electrically connected to the second power 1 . The second electrode 23 is output from the second electrode 2 . The wiring 23b is electrically connected to the second terminal portion T2. The lead material provided has an auxiliary electrode 26 made of a material smaller than the first electrode 21, and is formed along the opposite side of the first electrode 2i plate 1 side and electrically connected to the first electrode 21. That is, the second ^^^^ is made of a material having a smaller specific resistance than the first "second auxiliary electrode 26. The electrode 26 is wound around and formed on the !! electrode electrode. 4 organic anal layer 22" The element 21 is provided with an insulating film 29 covering the auxiliary electrode % and the first electric and side edges on the light-transmissive substrate. The organic eL element 2 is formed by the auxiliary electrode 26 and the first electrode 21 of the insulating film m1. The second _ 23 ^ EL element 2 includes the insulating film 29, which is electrically insulated by the second electrode 2 and the auxiliary electrode 26. The first electric and the auxiliary electrode 26 are translucent along the electrode 21. 201244208 The entire circumference of the surface on the opposite side of the side is formed in a rectangular frame shape. It is not necessary to have a rectangular frame shape. If the auxiliary electrode 26 is electrically connected to 21, it may be partially open. The shape (for example, c-shape = u-shaped, etc.), or may be cut into a plurality of pieces. In the sub-U sub-organic EL element 2, in the case of reading the doll, in the thickness direction of the substrate The precursor substrate 1, the first electrode 2, the light-emitting layer and the first domain, and the upper light-emitting portion 2. The other region becomes the P-electrode 21, and the light-emitting layer (there is In the organic light-emitting element 2, the planar shape of the second electrode of the organic EL element 2 is made of a light-transmissive substrate 曰 t 卩 42 23 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 电极 有机1 = a square shape in the example. Therefore, the light-emitting portion (four) substrate 丨 is also small in a rectangular shape (in the example, the gas (four) auxiliary electrode 26 has a rectangular frame shape in a plan view shape (a frame shape is opened) Further, the insulating film 29 has a rectangular shape in a plan view (a square frame shape in the illustrated example). Among the 70 pieces 2, a predetermined τ 2 along the rectangular light-emitting portion 2G; The claws (in the example of FIG. 1 , m=2), the second terminal portion, the first terminal portion, and the first terminal portion τ1 are disposed such that the first portion T1 is located in the width direction of the second terminal portion T2. In the longitudinal direction of the translucent substrate 1, 2 = the second terminal portion η and the second terminal portion τ2 are provided at the respective ends. In the longitudinal direction of the light-transmitting substrate I, the end portion is 3 (four) 1 轩 了 】 】 透光 透光 透光 透光 透光 透光 透光 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且It In the second terminal portion Τ2β shell target configuration, the direction of the one of the transparent substrates 1 is a predetermined direction, and the substrate is in the direction of the flute of the through-substrate 1 The first end ten and the second terminal portion Τ2 are disposed at the respective end portions of the both end portions. Next, the =1 terminal portion D1 has a transparent conductive oxide layer 24 (to transparent conductive oxide layer 24). And a laminated structure of the metal layer 27 (hereinafter, also referred to as the 苐1 metal layer 27). The fm / sub-portion T2 has a transparent conductive oxide layer 25 (hereinafter also referred to as a 苐2 transparent conductive oxide layer 25). And a laminated structure of the metal layer Μ (hereinafter, the handle is also the second metal layer 28). Further, the planar shape of the heat equalizing plate 6 is formed in a rectangular shape (square shape in the illustrated example) which is smaller than the cover substrate 5 and larger than the light emitting portion 20. The components of the light-emitting device 做 will be described in detail below. In the light-emitting device 8, the other surface (the lower surface in Fig. 1(b)) of the light-transmitting substrate 1 is used as the light-emitting surface (light-emitting surface). Therefore, among the other surfaces of the optical substrate, the electrodes 2f and the organic electrodes; and the second and second electrodes 23 of the second and second electrodes 23 are repeated and the regions projected are the light-emitting surfaces. The flat-viewing wire of the light-transmitting substrate 1 is not limited thereto, and may be, for example, a square shape. The light-transmitting substrate 1 is formed of a material that can transmit light emitted from the organic EL element 2. In the present embodiment, a glass substrate can be used as the light-transmitting substrate 1', but the present invention is not limited thereto. For example, a plastic substrate can also be used. For example, a soda lime (s〇daHme) glass substrate, an alkali-free glass substrate or the like can be used as the glass substrate. Further, for example, polyethylene terephthalate (pET) 10/35 can also be used.

201244208 基=、聚對苯二曱酸萘二g|(PEN)基板、聚賴(pES)基板、 (PC)基板等做為塑勝基板。使用塑膠基板的情況 下,亦可在塑膠基板的表面上使si0N^、腿膜等成膜而 抑制水份的透過。 透光[•生基板1對於由有機EL元件2所放射之光較佳是 具有70%以上的透過率。 使用玻璃基板做為透光性基板1的情況下,透光性基 板1的上述-表面的凹凸可成為有機肛元件2的漏電流等 的發生原因(成為有機EL元件2的劣化原因因此,使用 玻璃基板做騎紐基板丨的情況下,較佳是準備高精度 地研磨而成的元件形成__基板,使上述—表面的表 面粗糙度變小。 就透光性基板1的上述一表面的表面粗縫度而言,較 佳是將;IS B瞻侧_ 4287_1997)所規定的算術平均 粗糙度Ra設成數毫米以下。载,使用塑膠基板做為透光 性基板1的情況下,即使特職進行高精度的研磨,亦可 低成本地制上述—表_算術平均粗糙度Ra在數毫米以 下的情況。 有機EL凡件2中第1電極21構成陽極,第2電極幻 構成陰極。而且,有機EL元件2中介於第丨電極2ι和第 2電極23之間的有機EL層22由第i電極21側開始依序 具備電洞輸送層、上述的發光層、電子輸送層、電子 層。 上述的有機EL層22的積層構造不限於上述的例,例 如,發光層的單層構造、或物輪送朴發光層和電子輸 运層的積層構造、或電洞輸送層和發光層的積層構造、或 11/35 201244208 發光層和電子輸送㈣積層構 和電洞輸送層之間亦可隔著電洞注人層。帛1電極21 又’發光層可為單層構造亦可 生 期望的發光色為白色的情況 二9構&°例如’所 綠色、藍色的3種類的摻雜物質t層中亦可摻雜紅色、 洞輸送性發光層和、綠色電诗 [^亦可細k色電 性發光層的積層構造。==層和紅色電子輸送 =色電子輸处發以和紅色電子輸送性發光層的積層構 目若挾持第1電極21和第2電極23而施加電屍, 以具有發光功能之有機EL層22做為i個發光單元^ 可採用多單元構造(即,i個第i電極21 _ 厚度方向中重複的複數個發光單元 光透過性和導電性的中間層來對複數個發光單 疋進订積層且予以電性串聯連接而成。 構成陽極之第丨電極21是絲將電洞注人至發光 的電極,較佳是使用功函數大的金屬、合金、導電性^ ^、或這些混合物構錢電極材料,且触是使用功函二 為4 eV以上6eV以下的物質,使第}電極21力能量準位 和 HOMO (Highest Occupied Molecular 〇rbital,最高 子執域)準位之差不會過大。 例如,可舉出以汀0、氧化錫、氧化辞、IZ〇(氧化钢 錫)、蛾化銅等、PEDOT、聚苯胺等的導電性高分子及任音 的受體等摻雜而成的導電性高分子、碳奈米管等的導電ς 光透過性材料,以做為第1電極21的電極材料。 此處,第1電極21例如藉㈣鍍法、真空蒸鍍法 12/35 201244208 布法等而f透光性基板i的上述一表面側形成為_。 又,第1電極21的薄片(sheet)電阻較佳是在數百Ω/ 以下’特別佳時可在1〇〇 Q/Sq以下。 此處,第1電極21的膜厚雖然由於第丨電極21的光 透過率、薄片電阻等而不同,但可設定在5〇〇奈米以下, 車父佳疋没定在1〇奈米至2〇〇奈米的範圍中。 ” 又’構成陰極的第2電極23是用來使電子注入至發光 層中的電極,較佳是使用功函數小的金屬、合金、導^性 化合物、及這些混合物構成的電極材料,且 函數為eV以上5 eV以下的物質, ^用^ 低未佔用刀子軌域)準位之差不會過大。 ,,可舉出叙、銀、鎂、金、銅、鉻、錮、鈀、錫 ^銦金屬與其它金相合金m銀混合物、 鎂·銦轧合物、鋁-鋰合金做為例 電極材料。 以做為弟2電極23的 屬二::金屬、金屬氧化物等、及這些與其它金 例如,可使用由氧化轉成的 可使好流_奈以下的_和由銘 構成的缚臈的積層構造等。 八 的光電極23的電極材料,較佳是對由發光層放射 做向且電阻率低的金屬,較佳為銘或銀。 之材料所的材料’可使用作為有機電致發光元件用 四材料。可列舉例如:葱、蔡、拓、稠 香豆素、氧雜」隸、二笨丁二烯、四苯丁二稀、 —、又本开°惡姆、雙笨乙稀、環戊二烯、 13/35 201244208 喹啉金屬錯合物、三(8-羥基喹啉)鋁錯合物、三(4_甲基 •8-喹啉)鋁錯合物、三(5_苯基_8_喹啉)鋁錯合物、鋁二 啉金屬錯合物、苯并喹啉金屬錯合物、三(對三笨基_4_基) 胺' 1-芳基-2,5-二(2·嗟吩基)吡咯衍生物、π比喃、喹吖酮' 紅熒烯、二苯乙烯笨(distyrylbenzene)衍生物、二苯乙烯 方烴(di=rylarylene)衍生物、二苯乙稀胺衍生物及各種 營光色素等’以上述材料及其衍生物為代表者,但不限定 於此等。 料二較佳為適當地混合選擇自此等化合物中之發光材 土吏用。又’不僅可使用以上述化合物所代表之產生營 可適用呈現來自旋轉多重態一_ 7先材枓糸之例如產生鱗光之碟光發光材料、及在分 子内具有料所構成的雜之化合物。 法等:rtf Γ所構成之發光層可藉由蒸鑛法、轉印 寺之乾核絲成膜,村 法、=缝布法、凹版印刷法等之濕式製程來r ㈣人層所用之材料可使用電洞注人性之有機 "、金屬氧化物之所謂受體系 或層等來職。 m 功函:ϊίΓΓΓ性之有機材料係以具有電洞輸送性,且 著性的材料·等為m程度’並呈現與第1電㈣有強密 a—等為其例者,例如:CUPC、星芒狀胺(触祕 鶴、鈒、鋅、人性之金屬氧化物為例如含有鉬、銖、 又,亦可為含右z,你八^ 者之金屬氧化物。 堇種孟屬之氧化物,例如含有铜與錫、 14/35201244208 base =, polyphthalic acid naphthalene di g | (PEN) substrate, poly (pES) substrate, (PC) substrate, etc. as a plastic substrate. When a plastic substrate is used, it is also possible to form a film of si0N^, a leg film or the like on the surface of the plastic substrate to suppress the permeation of moisture. The light-transmitting substrate 1 preferably has a transmittance of 70% or more with respect to the light emitted from the organic EL element 2. When the glass substrate is used as the light-transmitting substrate 1 , the unevenness of the above-described surface of the light-transmitting substrate 1 may cause a leakage current or the like of the organic anion element 2 (the cause of deterioration of the organic EL element 2 is therefore used. In the case where the glass substrate is a snap-on substrate, it is preferable to form an element which is polished with high precision to form a substrate, and the surface roughness of the surface is reduced. The surface of the light-transmitting substrate 1 is In terms of the rough surface degree, it is preferable to set the arithmetic mean roughness Ra defined by IS B Zhan Side _ 4287_1997 to several millimeters or less. In the case where the plastic substrate is used as the light-transmitting substrate 1, the above-described table-arithmetic average roughness Ra can be made at a low cost even if the workpiece is polished with high precision. In the organic EL element 2, the first electrode 21 constitutes an anode, and the second electrode phantom constitutes a cathode. In the organic EL element 2, the organic EL layer 22 interposed between the second electrode 21 and the second electrode 23 is provided with a hole transport layer, the above-described light-emitting layer, electron transport layer, and electron layer in this order from the i-th electrode 21 side. . The laminated structure of the organic EL layer 22 described above is not limited to the above examples, for example, a single layer structure of the light emitting layer, or a laminated structure of the object light emitting layer and the electron transporting layer, or a layering of the hole transporting layer and the light emitting layer. Construction, or 11/35 201244208 illuminating layer and electron transport (4) laminated structure and hole transport layer can also be separated by a hole injection layer.帛1 electrode 21 and 'the luminescent layer can be a single-layer structure or a desired luminescent color is white. The second constitutive &°, for example, the green, blue, three kinds of dopants can also be doped in the t layer. The reddish, hole-transporting luminescent layer and the green electric poem [^ can also be a laminated structure of a fine k-color electroluminescent layer. == layer and red electron transport = color electrons are transmitted in a layered configuration with the red electron transporting light-emitting layer. If the first electrode 21 and the second electrode 23 are held, an electro-optical body is applied to the organic EL layer 22 having a light-emitting function. As the i-lighting unit, a multi-unit structure (that is, an i-th electrode 21 _ a plurality of light-emitting units in which the plurality of light-emitting units are repeatedly transmitted in the thickness direction) may be used to interleave a plurality of light-emitting units into a predetermined layer. And the second electrode 21 constituting the anode is an electrode for injecting a hole into the light, preferably a metal having a large work function, an alloy, a conductivity, or a mixture thereof. The electrode material is a material having a work function of 4 eV or more and 6 eV or less, so that the difference between the first electrode 21 and the HOMO (Highest Occupied Molecular 〇rbital) level is not excessive. For example, it may be doped with a conductive polymer such as Ting 0, tin oxide, oxidized metal, IZ 〇 (oxidized steel tin), molybdenum copper, PEDOT or polyaniline, and a receptor of any sound. Conductive enthalpy of conductive polymer, carbon nanotube, etc. The permeable material is used as the electrode material of the first electrode 21. Here, the first electrode 21 is formed by the (four) plating method, the vacuum vapor deposition method 12/35 201244208, or the like, and the above surface of the light-transmitting substrate i Further, the sheet resistance of the first electrode 21 is preferably less than or equal to or less than a few hundred Ω/s. Although it differs depending on the light transmittance of the second electrode 21, the sheet resistance, etc., it can be set to 5 nanometers or less, and the car father is not set in the range of 1 nanometer to 2 nanometers." Further, the second electrode 23 constituting the cathode is an electrode for injecting electrons into the light-emitting layer, and is preferably an electrode material composed of a metal having a small work function, an alloy, a conductive compound, and a mixture thereof, and has a function of For substances below 5 eV above eV, ^ is not too large for the position of the lower unoccupied knife rail. The sulphur, silver, magnesium, gold, copper, chromium, bismuth, palladium, tin, and indium are mentioned. Metal and other metallographic alloys, m-silver mixture, magnesium-indium-rolled alloy, and aluminum-lithium alloy are used as electrode materials. The genus 2 of the 2 electrode 23: a metal, a metal oxide, or the like, and these and other golds, for example, a laminated structure which can be converted by oxidation, which can be used for the formation of a good flow, and a bond made of a good one can be used. The electrode material of the photoelectrode 23 of eight is preferably a metal which is emitted by the light-emitting layer and has a low resistivity, preferably in the form of silver or silver. The material of the material can be used as the four materials for the organic electroluminescence device. For example, onion, Cai, Tuo, thick coumarin, oxazet, dibutadiene, tetraphenylbutadiene, -, and open 恶 恶, double stupid, cyclopentane Alkene, 13/35 201244208 Quinoline metal complex, tris(8-hydroxyquinoline)aluminum complex, tris(4-methyl•8-quinoline)aluminum complex, tris(5-phenyl_ 8_ quinoline) aluminum complex, aluminum porphyrin metal complex, benzoquinoline metal complex, tris(p-trisyl-4-yl)amine '1-aryl-2,5-di (2. fluorenyl) pyrrole derivative, π-pyran, quinacridone' rubrene, distyrylbenzene derivative, stilbene hydrocarbon (di=rylarylene) derivative, diphenylethylene amine The derivatives and various camping pigments and the like are represented by the above materials and derivatives thereof, but are not limited thereto. Feed 2 is preferably suitably mixed with the luminescent material selected from the compounds. Further, 'not only the use of the above-mentioned compound, but also a compound which exhibits a luminescent material such as a ray-emitting material from a rotating multi-state material, and a compound having a material in the molecule can be used. . Method: The luminescent layer composed of rtf 可 can be formed by the steaming method, the dry core silk film of the transfer temple, the wet process such as the village method, the sew method, the gravure printing method, etc. The material can be used in the so-called system or layer of metal oxides. m work function: 有机 ΓΓΓ 之 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机The astral amine (the metal oxide of the crane, the strontium, the zinc, and the human body is, for example, containing molybdenum, strontium, or a metal oxide containing a right z, which is a compound of the genus , for example, containing copper and tin, 14/35

S 201244208 姻與鋅、結與鎵、錄 屬的複數個金屬之氧化物。,、銳寺之3有上述任—種金 轉印法等之料所構成的電洞注入層可藉由蒸錢法、 塗布法、模具i;:來成二亦可藉由旋轉塗布法、噴霧 又,電洞iti印刷法等之濕式製程來成膜。 定。此種化合物可列二如= ” 月女基Λ本(a_NPD)、N,NK3^x 二二:(=)三笨基胺(mt_)、 ΤΝΒ箄PD、螺⑽、螺·ΤΑΟ、 物、八H 綠㈣化合物、含有料基之胺化合 的電洞輸送材料。物寻可使用—般習知的任意 合二;I?送層所用之材料可由具有電子輸送性之化 口物的群令選定。此種化合物 電子輸送性材料的全屬q3寺之❻做為 四唪衍生物1 非琳衍生物、咬咬衍生物、 不衍生物等之具有雜環之化合物等,但 (' b,可使知之料的電子輸送材料。 用,宜等注人層之材料,可自τ述者中任意選取來使 ^納Γ氣=氣化鐘、氣化鎖等之金屬氣化物;以氯 麵、於:=_代表的金屬氯化物等之金屬鹵化物;铭、 _#叙銳絡、趣、鶴、Μ1目m、 L二夕等各種金屬的氧化物、氮化物、碳化物、 例如氧她、氧化鎂、氧化鐵、氮化紹、氮 錢石夕、祕化石夕、氮化硕等之做為絕緣體者、或 15/35 201244208 以Sif2、Si〇等為代表之雜合物、碳化合物等。此等材 料可藉由真空蒸鍍法、或麟法等形成㈣成為薄膜狀。 又,做為引出配線23b的材料,採用與第2電極23相 同的材料。此處,5丨出配線23b的厚度設定成與第2電極 23為同樣的厚度。而且,引出配線23b係與第2電極μ連S 201244208 A combination of zinc, agglomerate and gallium, a plurality of oxides of metals. , the sharp temple 3 has the above-mentioned any kind of gold transfer method and the like, and the hole injection layer can be formed by a steaming method, a coating method, a mold i; The spray is again formed by a wet process such as a hole iti printing method. set. Such compounds can be listed as = ” 女 女 ( ( (a_NPD), N, NK3^x 二二: (=) trisylamine (mt_), ΤΝΒ箄PD, snail (10), snail, sputum, Eight H green (four) compound, a hole-transporting material containing a group of amines. The material can be used in any conventional combination; the material used for the layer can be made of a group of electron transporting substances. Selected. The electron transporting material of this compound belongs to the q3 temple and is a tetracyclic derivative, a non-lin derivative, a bite derivative, a non-derivative, etc., but has a heterocyclic compound, but ('b, The electron transporting material of the known material can be selected from the material of the human body, and can be selected from the description of the gas to make the metal gasification of the gasification clock, gasification lock, etc.; And: metal halides such as metal chlorides represented by ==; Ming, _# Syrian, interesting, crane, Μ1 mesh m, L Erxi and other metal oxides, nitrides, carbides, such as oxygen She, magnesium oxide, iron oxide, nitriding, nitrogen, lining, sinus, sulphide, etc. as insulators, or 15/35 201244208 to Si F2, Si〇, etc. are represented by a hybrid, a carbon compound, etc. These materials can be formed into a film shape by a vacuum deposition method or a lining method, etc. Further, as a material for the lead wiring 23b, The same material as the second electrode 23. Here, the thickness of the 5 wiring 23b is set to be the same as that of the second electrode 23. Further, the lead wiring 23b is connected to the second electrode μ.

接而形成。因此,本實施形態的發光裝置Α在製造時同時 形成引出配線23b和第2電極23。 X 又’引出配線23b延伸設置至形成在較與第2端子部 T2的第2透明導電性氧化物層25之接合部接合的接合用區 域25a更内側的部位為止。 引出配線23b的覓度(配線寬度)尺寸設定成較第2端子 部T2的寬度尺寸_、的值,以防止與$〗端子部τ]的短 路’且確健第i端子部T1之間具有規定的絕緣距離。 引出配線23b的寬度尺寸雖然較佳是在第2端子部丁2 的寬度以下’但為了使f子遷移魏提高,較妓設為儘 可能大的值。 又’第1透明導電性氧化物層24和第2透明導電性氧 化物層25的材料是透明導電性氧化物⑽肪叩批故 Conducting Oxide: TCO),例如,可採用 IT〇、AZ〇、位〇、 IZO 等。 又,第1透明導電性氧化物層24和第2透明導電性氧 化物層25的材料設為與帛]電極21才目同的材料,且第ι 電極21和第1透明導f性氧化物層24和第2透明導電性 氧化物層25設為相同厚度。 又’第1金屬層27和第2金屬層28的材料例如較佳 是鋁、銀、金、銅、鉻'鉬、鈀、錫、鉛、鎂等的金屬、 16/35Then formed. Therefore, in the light-emitting device of the present embodiment, the lead wiring 23b and the second electrode 23 are simultaneously formed at the time of manufacture. The X-lead wiring 23b is extended to a portion which is formed inside the bonding region 25a which is joined to the bonding portion of the second transparent conductive oxide layer 25 of the second terminal portion T2. The dimension (wiring width) of the lead wiring 23b is set to a value smaller than the width dimension _ of the second terminal portion T2 to prevent short-circuiting with the $ terminal portion τ] and to ensure that there is a gap between the i-th terminal portion T1. The specified insulation distance. The width dimension of the lead wire 23b is preferably equal to or less than the width of the second terminal portion 2, but it is set to a value as large as possible in order to improve the f-migration. Further, the material of the first transparent conductive oxide layer 24 and the second transparent conductive oxide layer 25 is a transparent conductive oxide (10), such as Conductive Oxide: TCO, and for example, IT〇, AZ〇, Position, IZO, etc. Further, the materials of the first transparent conductive oxide layer 24 and the second transparent conductive oxide layer 25 are made of the same material as the electrode 21, and the first electrode 21 and the first transparent conductive oxide are The layer 24 and the second transparent conductive oxide layer 25 have the same thickness. Further, the material of the first metal layer 27 and the second metal layer 28 is preferably a metal such as aluminum, silver, gold, copper, chromium 'molybdenum, palladium, tin, lead or magnesium, 16/35.

S 201244208 或包含這些金屬的至少1種的合金。 又,第1金屬層27和第2金屬層28不限於單層構造, 亦可採用多層構造。例如,第1金屬層27和第2金屬層% 可採用MoNb層/AINd層/MoNb層的3層構造。此3 ^構 造中,下層的MoNb層較佳是設為下底的密接層,上^的 M()Nb層則設為A〗Nd層的保護層。 曰 又,本實施形態中,第1金屬層27的材料和第2金屬 層Μ的材料設為相同,第!金屬層27和第2金屬層% # 二成相同的厚度…第】金屬層27和第2金屬層曰% ; 才木用與第2電極23相同的材料。 又’做為辅助電極26的材料,例如,較佳是鋁、銀、 t 、錫、錯、鎂等的金屬、或包含料 金屬的至少1種的合金。 一 又’辅助電極26不限於單層構造,亦可採用多層構造。 丄::輔:=26可採用層麵物_層的3 物:,上==二層的祕層較佳是設㈣ 上盾的MoNb層則設為A1Nd層的保護層。 本^形態的發光裝置A中,輔助電極%的材曰料盘第 金屬層27和第2金屬層28的材料設為相同。藉此,林 &形態的發光裝置A中,制、皮口士 .,, 篦1厶屆s n 衣坆日可可同4形成輔助電極26與 弟1金屬層27和第2金屬層I達成低成知卜 但不限於 1 為:it膜29的材料’例如’雖然採用聚醯亞胺, 在述的有機£ 元件 ^、Μ f 氧才对月曰專 23之間口右訪古^ π兀2中,第1電極21和第2電極 部20,i光Ϊ 20之2 22來介隔的區域構成上述的發光 卞曲形狀係與絕緣膜29的内周緣的形 Π/35 201244208 狀形成為相同的矩形狀(圖示例中,正方形狀)。此處,發光 裝置A在平面視中有機EL元件2的發光部20以外的部份 成為非發光部。 又’可使用玻璃基板做為蓋基板5,但不限於此。例如, 亦可使用塑膠基板。做為玻璃基板,例如,可使用鈉鈣玻 璃基板、無鹼玻璃基板。又,做為塑膠基板,例如,亦可 使用聚對苯二甲酸乙二酯(PET)基板、聚對苯二甲酸萘二酯 (PEN)基板、聚醚颯(pES)基板、聚碳酸酯(pc)基板等。使用 塑膠基板的情況下,亦可在塑膠基板的表面上使Si〇N膜、 SiN膜等成膜而抑制水份的透過。 做為玻璃基板5的材料,較佳是使用與透光性基板! 的材料的線膨脹率之差較小的材料,由降低起因於玻璃基 板5與透級紐1的線軸率差*產㈣應力之觀點而 言,更佳是使用線膨脹率之差為相等的材料。 如上所述,蓋基板5隔著接合部4而與元件基板3相 接合。此處’接合部4和元件基板3的界面存在著:接合 部4和第1端早都τι沾笛!田^ ..S 201244208 or an alloy containing at least one of these metals. Further, the first metal layer 27 and the second metal layer 28 are not limited to a single layer structure, and a multilayer structure may be employed. For example, the first metal layer 27 and the second metal layer % may have a three-layer structure of a MoNb layer/AINd layer/MoNb layer. In the 3^ structure, the lower MoNb layer is preferably an underlying adhesion layer, and the upper M()Nb layer is set to a protective layer of the A-Nd layer. Further, in the present embodiment, the material of the first metal layer 27 and the material of the second metal layer 设为 are the same, and the first! The metal layer 27 and the second metal layer % # are the same thickness as the second metal layer 27 and the second metal layer ;%; the same material as the second electrode 23 is used for the wood. Further, as the material of the auxiliary electrode 26, for example, a metal such as aluminum, silver, t, tin, aluminum, or magnesium, or an alloy containing at least one kind of a metal is preferable. Further, the auxiliary electrode 26 is not limited to a single layer structure, and a multilayer structure may be employed.丄::Auxiliary:=26 can use layer material _ layer of 3 things:, upper == second layer of the secret layer is preferably set (4) The shield of the MoNb layer is set to the protective layer of the A1Nd layer. In the light-emitting device A of the present embodiment, the material of the second electrode layer 27 and the second metal layer 28 of the auxiliary electrode % are the same. Thereby, in the light-emitting device A of the forest & form, the system, the skin, and the second metal layer 27 and the second metal layer I are formed to be low. Cheng Zhi Bu, but not limited to 1 is: the material of the film 29 'for example', although the use of polyimine, in the description of the organic element ^, Μ f oxygen is only right between the month of the 23rd in the ancient ^ π 兀 2 The region in which the first electrode 21 and the second electrode portion 20 are separated by the second aperture 20 and the second aperture 20 are formed in the same manner as the shape of the inner circumference of the insulating film 29/35 201244208. It is rectangular (in the example of the figure, square). Here, the light-emitting device A is a non-light-emitting portion other than the light-emitting portion 20 of the organic EL element 2 in plan view. Further, a glass substrate can be used as the lid substrate 5, but is not limited thereto. For example, a plastic substrate can also be used. As the glass substrate, for example, a soda lime glass substrate or an alkali-free glass substrate can be used. Further, as the plastic substrate, for example, a polyethylene terephthalate (PET) substrate, a polybutylene terephthalate (PEN) substrate, a polyether fluorene (pES) substrate, or a polycarbonate (for example) may be used. Pc) substrate or the like. When a plastic substrate is used, a Si〇N film, a SiN film or the like may be formed on the surface of the plastic substrate to suppress the permeation of moisture. As the material of the glass substrate 5, it is preferable to use a light-transmitting substrate! The material having a small difference in the coefficient of linear expansion of the material is preferably reduced in the use of the difference in the linear expansion ratio from the viewpoint of the difference in the yield ratio of the glass substrate 5 and the transmissive core 1 * (four) stress. material. As described above, the lid substrate 5 is bonded to the element substrate 3 via the joint portion 4. Here, the interface between the joint portion 4 and the element substrate 3 is such that the joint portion 4 and the first end are already smashed by the whistle! Tian ^ ..

做為接合部4的材料,亦可使用 !如,二氧化矽 '氧化鋁等)而成的 5 使環氧樹脂中含有填料(例如, 物質。 .丐、氣化鋇、石夕膠(silica gel) 做為乾燥劑,較佳是使用紅 乾燥構件7例如使用氧化名丐 等的乾燥劑等來形成。此處,傲 18/35As the material of the joint portion 4, it is also possible to use a material such as ruthenium dioxide (alumina, etc.) to make the epoxy resin contain a filler (for example, a substance, a ruthenium, a gasification ruthenium, a diarrhea gelatin (silica). As a desiccant, it is preferably formed using a red drying member 7 such as a desiccant such as oxidized niobium or the like. Here, proud 18/35

S 201244208 外線吸收率較蓋基板5還高的材料。 做為均熱板6的材料,各 率高的金屬,可採用銅,熱==用熱傳導 亦可使•金、青鋼'黃銅(心材 亦可採用金屬_如,_、_、金^為均熱板6, 又’本實施形態的發光裝置 苗 關口大候定級€_9❽ 盍基板5的周部(凹處51 ' 遇大且 件基板3。 、51關_由接合部4吨合至元 未二:=二, 2 t露出至外部的部份是第機:, 的各個的一部份。 #苐2、子部T2 藉由第i 屬層7的積層構造,但亦可將只 著接合部4 _化物層24構成的接合用區域24a沿 二周方向橫跨第1端子部η的寬度方向的全長 氧二2:ΓΡΤ2如上所述雖然具有第2透明導 ==金屬層28的積層構造,但亦可將只葬 接合部4的周25構成的接合用區域25a “ 設置著。。4跨苐2端子部T2的寬度方向的全長而 合部=第!_端子部T1的第1界面係藉由接 可乐1透明導電性氧化物層24的 部4和第^子部T2的第2界面係藉由接合部4和第2 ^ 19/35 ^S 201244208 The material whose external absorption rate is higher than that of the cover substrate 5. As the material of the soaking plate 6, the metal with high rate can be made of copper, heat == heat conduction can also make gold, blue steel 'brass (heartwood can also use metal _, _, _, gold ^ In the case of the heat-receiving plate 6, the light-emitting device of the present embodiment is arranged at a level of the circumference of the substrate 5 (the recess 51' is large and the substrate 3 is closed.至元二二:=二, 2 t exposed to the outside part is the part of each of the first:: #苐2, sub-part T2 by the layered structure of the i-th layer 7, but also The joint region 24a composed only of the joint portion 4_chemical layer 24 spans the entire length of the first terminal portion η in the circumferential direction in the width direction of the oxygen dioxide 2: ΓΡΤ 2 as described above, and has the second transparent guide == metal layer 28 as described above. The laminated structure 25a of the circumference 25 of the burial joint portion 4 may be "provided." The total length in the width direction of the 2-terminal 2 terminal portion T2 is _ _ _ _ _ _ _ _ The first interface is formed by the junction 4 of the portion 4 of the transparent conductive oxide layer 24 and the second interface of the second sub-portion T2 by the junction portion 4 and the second ^ 19/35 ^

S 201244208 明導電性氧化物層25的界面而構成。 藉此,本實施形態的發光裝置A中,可使接合部4和 第1端子部T1及第2端子部T2的接合強度提高,而且f "T防止.在第1金屬層27和第2金屬層28的經時變化而 發生氧化時第1界面和第2界面的狀態發生變化。這樣 使可靠性提高。 ’ 又,本實施形態的發光裝置A中’由於具備均熱板6, 則可使有機EL元件的發光部20的溫度達成均熱化,且可 使發光部20的溫度的面内偏差減低。而且,可使排熱性提 南0 而且,發光裝置A中有機EL元件2的溫度上升可受 到抑制,在輸入電力大而達成高亮度化的情況下可達成長 哥命化。 本實施形態的發光裝置A中,發光部20的平面大小設 定成80x80毫米,但不限於此,例如,若適宜地設定成3〇 X30至300x300毫米左右的範圍亦可。 又,配置在第2端子部T2的寬度方向的兩側的2個第 1端子部ΤΙ、T1的中心間距離設定成3〇毫米,但此值只 是一例’沒有特別地限定。 又’第1電極21的厚度適宜地設定在no奈米至3〇〇 奈米左右的範圍’有機EL層22的厚度設定在150奈米至 300奈米左右的範圍,第2電極23的厚度設定在70奈米至 300奈米左右的範圍,絕緣膜29的厚度設定在〇.7微米至1 微米左右的範圍’輔助電極26、第1金屬膜27和第2金屬 膜28的厚度設定在300奈米至600奈米左右的範圍,但該 些值沒有特別地限定。 20/35S 201244208 is formed by the interface of the conductive oxide layer 25. As a result, in the light-emitting device A of the present embodiment, the bonding strength between the joint portion 4 and the first terminal portion T1 and the second terminal portion T2 can be improved, and f "T can be prevented from being in the first metal layer 27 and the second layer. The state of the first interface and the second interface changes when the metal layer 28 is oxidized with time. This improves reliability. In the light-emitting device A of the present embodiment, the heat-receiving plate 6 is provided, so that the temperature of the light-emitting portion 20 of the organic EL element can be uniformly heated, and the in-plane variation of the temperature of the light-emitting portion 20 can be reduced. In addition, the temperature rise of the organic EL element 2 in the light-emitting device A can be suppressed, and the input power can be increased to achieve high brightness. In the light-emitting device A of the present embodiment, the plane size of the light-emitting portion 20 is set to 80 x 80 mm. However, the present invention is not limited thereto. For example, it may be suitably set to a range of about 3 〇 X30 to 300 x 300 mm. In addition, the distance between the centers of the two first terminal portions ΤΙ and T1 disposed on the both sides in the width direction of the second terminal portion T2 is set to 3 mm. However, this value is merely an example, and is not particularly limited. Further, the thickness of the first electrode 21 is set to a range of from about n nm to about 3 nm. The thickness of the organic EL layer 22 is set to be in the range of about 150 nm to 300 nm, and the thickness of the second electrode 23 is set. The thickness of the insulating film 29 is set in the range of about 70 μm to about 1 μm, and the thickness of the auxiliary electrode 26, the first metal film 27, and the second metal film 28 is set in the range of about 70 nm to 300 nm. The range is from about 300 nm to about 600 nm, but these values are not particularly limited. 20/35

S 201244208 又’就輔助電極26的寬度而言,寬度越大,則輔助電 極26的阻抗越低,且發光部2()的亮度的面内偏差越低, $發光部的面積增加而光束減小,因此較佳是將該寬度設 定在0.3笔米至3毫米左右的範圍。本實施形態的發光裝置 ^並列有複數個以做為光源的照明器具中,輔助電極26的 寬度越窄’則相鄰的發光部2〇間的麟可越小,外觀良好。 又,第1端子部T1及第2端子部丁2和透光性基板! 的周緣的距離設定成〇.2㈣,但職並未特職限定,例 如較佳是亦可適宜地設定在〇」至2毫米左右的範圍。將發 光裝置A的非發光部的面積做成較小,則第丨端子部u 及第2端子部T2和透紐紐丨㈣狀麟較佳是做成 ,短’但第1端子部T1及第2端子部Τ2和其它金屬構件(例 °,照明器具的金屬製的器具本體等)之間有確保規定的沿 面距離的情況下’較佳是設定成較該沿面距_長的值。 齡—方面參照圖9至圖】4—方面說明本實施形態 的發光裝置Α的製造方法。 首先,在由玻璃基板構成的透光性基板丨的上述— 面側上利用紐法或贿法而同時形成由同—的透^ ^氧^物(例如’ITO,AZO,GZ〇,IZ〇等)構成的第丨電極 透明導電性氧化物層24及第2透明導電性 增25 ’错以得到圖9所示的構造。 其次’在透光性基板1的上述一表面側上, ^鑛法而同時形成由同一的金屬材;心 金屬層27和第2金屬層28,藉以得到= 然後,在透光性基板丄的上述一表面側上,形成由樹 201244208 月曰材料(例如,聚酿亞胺、祕清漆樹脂、環氧樹脂等)所構 成的絕緣祺29,藉以得到圖1丨所示的構造。 —此後,在透光性基板1的上述一表面側上,例如藉由 洛鍍法而形成有機虹層22 ’藉以得到圖12所示的構造。 又’有機EL I 22的形成方法不限於蒸鑛法,例如,亦可 為塗布法,依據有機EL層22的材料而適當地選擇即可。 、然後’在透光性基板1的上述一表面側上,利用蒸鐵 法或踐鑛法而形成由同—的金屬材料(例如,銘、銀等)所^ 成的第2電極23及引出配線23b,藉以得到圖13所示的構 造的兀件基板3。至此為止是在透光性基板】的上述一表面 側上形成有機EL元件2的元件基板形成過程。 冷布j人Γ如在兀件基板3上藉由分佈器(dispenser)來 的材料即黏著劑(例如,馳^ ^曰、玻璃燒結劑等)4a,藉以得到圖14所 劑4a橫切第i端子部T1及第2端子 k 2者 。卩T2而形成為圍繞該 毛先^0,使第i端子部T1及第2端 部份位於空_触_外。 的各別的- 此處,在塗布該黏著劑4a的塗布過程中 3的周部將黏著劑4a塗布成矩形框狀 在几件基板 上進行,亦可在玻璃基板5之凹處5 ^ 70件基板3 劑知塗布成矩形框狀。 周邊)將黏著 於分佈器,例如,亦可使用絲網印刷夺㈣布裝置不限 器、狹縫(slit)塗布器等。 、、杈具(die)塗布 然後,進行一種重疊過程’使預先 和均熱板6之朗基板5和元件基板3 *,有乾燥構件7 22/35 衷雙’接著繼續進S 201244208 Further, in terms of the width of the auxiliary electrode 26, the larger the width, the lower the impedance of the auxiliary electrode 26, and the lower the in-plane variation of the luminance of the light-emitting portion 2 (), the area of the light-emitting portion increases and the beam decreases. It is small, so it is preferable to set the width in the range of about 0.3 to 3 mm. In the illuminating device of the present embodiment, in which a plurality of illuminating devices are used as the light source, the narrower the width of the auxiliary electrode 26 is, the smaller the lining between the adjacent illuminating portions 2 is, and the appearance is good. Moreover, the first terminal portion T1 and the second terminal portion 2 and the light-transmitting substrate! The distance of the circumference is set to 〇.2 (4), but the position is not limited. For example, it is preferably set to a range of about 2 mm. When the area of the non-light-emitting portion of the light-emitting device A is made small, the second terminal portion u and the second terminal portion T2 and the through-hole (four)-shaped rib are preferably formed, and the first terminal portion T1 and the first terminal portion T1 are When the second terminal portion Τ2 and other metal members (for example, the metal device body of the lighting fixture or the like) have a predetermined creeping distance therebetween, it is preferable to set the value to be longer than the creeping distance _. Age-related aspects A method of manufacturing the light-emitting device 本 according to the present embodiment will be described with reference to Figs. 9 to 4 . First, on the above-mentioned surface side of the light-transmissive substrate 构成 composed of a glass substrate, a neo-method or a brittle method is simultaneously formed by the same method (for example, 'ITO, AZO, GZ〇, IZ〇). The structure of the second electrode transparent conductive oxide layer 24 and the second transparent conductivity 25 is increased to obtain the structure shown in FIG. Next, 'on the one surface side of the light-transmitting substrate 1, the same metal material; the core metal layer 27 and the second metal layer 28 are simultaneously formed by the ore method, thereby obtaining = then, on the light-transmissive substrate On the one surface side, an insulating crucible 29 composed of a tree 201244208 ember material (for example, polyacrylonitrile, a varnish resin, an epoxy resin, or the like) is formed, thereby obtaining the structure shown in FIG. - Thereafter, on the one surface side of the light-transmitting substrate 1, the organic rainbow layer 22' is formed, for example, by a Luo plating method, whereby the structure shown in Fig. 12 is obtained. Further, the method of forming the organic EL I 22 is not limited to the distillation method, and may be appropriately selected depending on the material of the organic EL layer 22, for example, a coating method. Then, on the one surface side of the light-transmitting substrate 1, a second electrode 23 made of the same metal material (for example, Ming, silver, etc.) is formed by a steaming iron method or a mineralizing method. The wiring 23b is obtained to obtain the element substrate 3 of the structure shown in FIG. The component substrate forming process in which the organic EL element 2 is formed on the one surface side of the light-transmitting substrate has been described. For example, an adhesive (for example, a squeezing agent, a glass sintering agent, etc.) 4a is used as a material on a member substrate 3 by a dispenser, thereby obtaining a cross-cut of the agent 4a of FIG. The i terminal portion T1 and the second terminal k 2 are.卩T2 is formed to surround the hair first ^0, so that the i-th terminal portion T1 and the second end portion are located outside the space. Individually - here, in the coating process of applying the adhesive 4a, the adhesive 4a is applied in a rectangular frame shape on a plurality of substrates, or in a recess of the glass substrate 5; The substrate 3 is coated in a rectangular frame shape. The periphery) will be adhered to the distributor, and for example, a screen printing device may be used, and a slit applicator or the like may be used. Then, the die is coated, and then an overlapping process is performed, so that the front substrate and the heat equalizing plate 6 and the element substrate 3* are provided with the drying member 7 22/35.

S 201244208 藉以形成接合部4而得到 行硬化過程,使黏著劑4a硬化 發光裝置A。 葬由重4過財,使元件基板3和蓋基板5重疊, 糟域緊(press)壓毁該黏著劑4a而使其擴大。 ㈣石ft過程I,黏著劑如為紫外線硬化型的情況下,照 产兄:=者劑4a硬化。又,點著劑4&為熱硬化型的 隋況下’错由對黏著劑如加熱,使黏著劑4a硬化。 =,將乾_件7朝向蓋基板5而進行的貼付過程、 塗布在元件基板3或蓋基板5上的塗布過程、 =▲反3和盍基板5重疊的重疊過程、使黏著劑4a硬 的硬化過程例如是在露點_机的氮氣環境中進行。 又均熱板6在使接合部4的黏著劑乜硬化之後亦可 貼付至蓋基板5。 又做為乾餘構件7的乾燥劑,例如可使用密封型的 L燥劑或塗布型的乾㈣。使用塗布型的乾燥綱情況下 的硬化過程域與接合部4 4a的組合,在元件基 板3和蓋基板5的重疊之前單獨地進行、或是在使接合部4 的黏著劑4a硬化的硬化過程中—起進行的任—種都可。做 為塗布型的乾㈣的塗布方法,例如可制各種使用分佈 器、絲網印刷裝置、金屬遮罩、模具塗布器、狹 布器等的方法。 ,因此,若進一步說明發光裝置A的製造方法,則例如 須進行塗布過程,其在元件基板3可並列成2χ2的陣列狀 的矩形板狀之後對_為各別的元件基板3的第3基板(圖 中未顯示)、或在蓋基板5可並列成2χ2的陣列狀的矩形板 狀之後對切割為各別的蓋基板5的第4基板(圖中未顯示) 23/35 201244208 塗布該黏著劑4a。 此處,第3基板若為元件基板3可並列成2χί 〇為j以 上的整數)_列狀的矩形板狀即可。χ,第4基板若為蓋 基板5可並列成2xj (j=i)的陣列狀的矩形板狀即可。 ^布過程之後’進行-種使第4基板和第3基板重疊 的重4:過程。然後,進行硬化過程,使黏著劑知硬化以形 成接合部4。此後’進行切割過程,將第3基板切割成各別 的元件基板3且將第4基板切割成各別的蓋基板5。 又’在切割過程中,進行第3基板的切割,第3基板 之為第2基板側的相反側的表面上例如藉由刻劃器㈣㈣ 而引出第1刻劃線,由第4基板側例如若藉由破碎機 (breaking machine)而施加壓力來切斷第3基板即可。 又’在切割過程中,進行第4基板的切割,第4基板 之為第3基板側的相反側的表面上例如藉由刻劃器而引出 第2刻劃線’由帛3基板側例如若藉由破碎機而施加壓力 來切斷第4基板即可。 .又,做為第3基板,不限於使元件基板3可並列成2>d 0為1以上的整數)的陣列狀的矩形板狀。做為較預先規定 的第1單位尺寸的元件基板3還大的矩形板狀的物件,亦 可切割為第1單位尺寸或切割為較第3基板還小的所期望 的外形尺寸的元件基板3。 .,此種情況下,第4基板不限於使蓋基板5可並列成2xj (j=i)的陣列狀的矩形板狀。做為較預先規定的第2單位尺寸 的蓋基板5還大的矩形板狀的物件,亦可切割為第2單位 尺寸或切割為較第4基板還小的所期望的外形尺寸的蓋基 24/35S 201244208 is formed by forming the joint portion 4 to obtain a hardening process for causing the adhesive 4a to harden the light-emitting device A. The burial is carried out by the weight 4, and the element substrate 3 and the lid substrate 5 are overlapped, and the adhesive 4a is pressed and pressed to expand. (4) Stone ft process I, in the case of an ultraviolet curing type of adhesive, according to the production brother: = agent 4a hardened. Further, when the dot 4& is a heat-curing type, the adhesive 4a is hardened by heating the adhesive. = a pasting process of the dry material 7 toward the lid substrate 5, a coating process applied to the element substrate 3 or the lid substrate 5, an overlap process in which the ▲ reverse 3 and the ruthenium substrate 5 overlap, and the adhesive 4a is hard. The hardening process is carried out, for example, in a nitrogen atmosphere of a dew point machine. Further, the heat equalizing plate 6 can be attached to the lid substrate 5 after the adhesive 乜 of the joint portion 4 is cured. Further, as the desiccant of the dry remainder member 7, for example, a sealed type of d-drying agent or a coated type of dry (four) can be used. The combination of the hardening process field in the case of the coating type drier and the joint portion 44a is performed separately before the overlap of the element substrate 3 and the lid substrate 5, or in the hardening process of hardening the adhesive 4a of the joint portion 4. Anything from the middle to the beginning can be done. As the coating method of the coating type (four), for example, various methods using a distributor, a screen printing device, a metal mask, a die coater, a slitter, and the like can be produced. Therefore, if the method of manufacturing the light-emitting device A is further described, for example, a coating process is required, and after the element substrate 3 can be arranged in a rectangular plate shape of an array of 2χ2, the third substrate of the respective element substrate 3 is _ (not shown in the drawing), or after the lid substrate 5 can be arranged in an array of rectangular plates of 2χ2, the fourth substrate (not shown) diced into the respective lid substrates 5 is applied to the second substrate 23/35 201244208. Agent 4a. Here, the third substrate may be a rectangular plate shape in which the element substrate 3 can be arranged in parallel with an array of 2 χ 〇 整数. In other words, if the fourth substrate is the lid substrate 5, it may be arranged in a rectangular plate shape of 2xj (j = i). After the cloth process, a weight 4: process in which the fourth substrate and the third substrate are overlapped is performed. Then, a hardening process is performed to harden the adhesive to form the joint portion 4. Thereafter, the cutting process is performed, and the third substrate is cut into individual element substrates 3, and the fourth substrate is cut into individual lid substrates 5. Further, in the dicing process, the third substrate is cut, and the surface of the third substrate on the side opposite to the second substrate side is drawn by the first scribe line, for example, by the scriber (4) (4), for example, by the fourth substrate side. The third substrate may be cut by applying pressure by a breaking machine. Further, in the cutting process, the fourth substrate is cut, and the second substrate is drawn on the surface on the opposite side of the third substrate side by, for example, a second scribe line by the scriber. The fourth substrate may be cut by applying pressure by a crusher. Further, the third substrate is not limited to an array-shaped rectangular plate shape in which the element substrate 3 can be arranged in parallel with an integer of 2 > d 0 . The rectangular plate-shaped object which is larger than the element substrate 3 of the first unit size which is defined in advance may be cut into the first unit size or the element substrate 3 which is cut into a desired outer shape smaller than the third substrate. . In this case, the fourth substrate is not limited to a rectangular plate shape in which the lid substrate 5 can be arranged in an array of 2xj (j=i). The rectangular plate-shaped object that is larger than the predetermined second unit size cover substrate 5 may be cut into a second unit size or a cover base that is cut to a desired outer size smaller than the fourth substrate. /35

S 201244208 美板二施形態的發光裝置A %上所述具備透光性 二偏=基板3,具有形成在透光性基板1的上述一表 SI ,件2 ;蓋基板5 ’與透光性基板1的上述 :=㈣向而配置著;及接合部4 ’在透光性基板i的 側形成為圍繞有機EL元件2的發光部2〇之框 狀且由接5我件基板3和蓋基板5之黏著劑知所構成。 光η A具備乾燥構件7,其在蓋基板5之為透光 土 1白上對向面側隔著空間而配置在發光部別上。乾燥 構件7在盍基板5巾在較重疊於接合部*的 配置在蓋基板5的周部。 、 又,本實施形態的發光裝置A中,乾燥構件7的平面 視形狀為四角雜,4個乾燥構件7在蓋基板5的周方向中 大略等間隔地隔開而配置著。 換吕之,本實施形態的發光裝置A具備第1基板(透光 性基板)卜有機EL元件2、第2基板(蓋基板)5、接合部4、 乾燥構件7。有機EL元件2具有放射光的發光部2〇。有機 a 7L件2形成在第i基板!的上述一表面。第2基板5配 置成與第1基板1的上述—表面相對向。帛2基板5構成 為與第1基板1之間形成收納發光部2〇的空間8。接合部 4形成為圍繞發光部2〇的框狀。接合部4構成為使第2基 板5之為第1基板丨之上述對向面接合至第丨基板丨的上 述一表面。乾燥構件7以未接觸發光部2〇的方式配置在第 2基板5之上述對向面之以接合部4圍繞的區域的外緣。 又,本貫施形態的發光裝置A中,發光部20位於接合部4 的中心。 如上所述,本實施形態的發光裝置A中,乾燥構件7 25/35 201244208 由於在蓋基板5中在較重疊於接合部4之區域更内側處配 置在蓋基板5的周部,所以該發光裝置a的處理時即使將 按壓力施加至均熱板6及蓋板5且蓋基板5在有機EL元件 的發光部20側形成為凸形而撓曲,亦可使「乾燥構件7接 觸發光部20且使發光部2〇不能發光的不良的發生」受到 抑制。 又,本實施形態的發光裝置A中,如上所述,藉由具 備均熱板6,可達成有機El元件2的發光部的溫度的 均熱化,使發光部20的溫度的面内偏差減低。 而且,本貫施形態的發光裝置A中,在與均熱板6比 較下,熱傳導率低的乾燥構件7在蓋基板5中由於在較重 疊於接合部4之區域更内側處配置在蓋基板5的周部,則 可使均熱板6的均熱效果受損的現象受到抑制。 又,本實施形態的發光裝置A中,乾燥構件7使用紅 外線吸收率較蓋基板5更高的乾燥劑來形成。換言之,乾 燥構件7的紅外線吸收率較第2基板(蓋基板)5還高。 因此,依據本實施形態的發光裝置A,在盥發光部2〇 的中央部的溫度比較下,發光部2〇的周部的溫度可較低, 且發光。卩20的周部的電流松度較小,發光量下降,這樣可 使發光部20的亮度的面内偏差減低。 此處’如圖1所示,蓋基板5中形成在透光性基板i 的上述對向面的凹處51形成為第!多角形狀(本實施形態中 為四角形狀)關口雜。對此,乾燥構件7形成為使特定 的内角α2(=90度)與第1多角形狀的内角α度)重疊 的第2多角形狀(本實施形態中為四角形狀)。而且,乾燥構 件7配置成使得在端點處具有特定的内角以的頂點的二個 26/35S 201244208 The light-emitting device A of the second embodiment has a light transmissive two-bias=substrate 3, and has one of the above-mentioned tables SI and 2 formed on the light-transmitting substrate 1; the cover substrate 5' and the light transmissive property The substrate 1 is disposed in the above-mentioned direction: (4); and the bonding portion 4' is formed in a frame shape surrounding the light-emitting portion 2 of the organic EL element 2 on the side of the light-transmitting substrate i, and is connected to the substrate 3 and the cover. The adhesive of the substrate 5 is known to be formed. The light η A is provided with a drying member 7 which is disposed on the light-emitting portion of the cover substrate 5 as a light-transmitting soil 1 on the opposite side of the surface. The drying member 7 is disposed on the peripheral portion of the lid substrate 5 on the crucible substrate 5 so as to overlap the joint portion*. Further, in the light-emitting device A of the present embodiment, the planar shape of the drying member 7 is four-corner, and the four drying members 7 are arranged at substantially equal intervals in the circumferential direction of the lid substrate 5. In the light-emitting device A of the present embodiment, the first substrate (translucent substrate), the organic EL element 2, the second substrate (cover substrate) 5, the joint portion 4, and the drying member 7 are provided. The organic EL element 2 has a light-emitting portion 2A that emits light. Organic a 7L piece 2 is formed on the ith substrate! The above surface. The second substrate 5 is disposed to face the above-described surface of the first substrate 1. The 帛2 substrate 5 is configured to form a space 8 in which the light-emitting portion 2A is housed with the first substrate 1. The joint portion 4 is formed in a frame shape surrounding the light emitting portion 2''. The joint portion 4 is configured such that the opposing surface of the second substrate 5 as the first substrate 接合 is joined to the one surface of the second substrate 丨. The drying member 7 is disposed on the outer edge of the region of the opposite surface of the second substrate 5 surrounded by the joint portion 4 so as not to contact the light-emitting portion 2''. Further, in the light-emitting device A of the present embodiment, the light-emitting portion 20 is located at the center of the joint portion 4. As described above, in the light-emitting device A of the present embodiment, the drying member 7 25/35 201244208 is disposed on the peripheral portion of the lid substrate 5 at the inner side of the lid substrate 5 which is more overlapped with the joint portion 4, so that the light is emitted. In the process of the apparatus a, even if a pressing force is applied to the heat equalizing plate 6 and the lid 5 and the lid substrate 5 is convexly deflected on the side of the light emitting portion 20 of the organic EL element, the drying member 7 can be brought into contact with the light emitting portion. In addition, the occurrence of defects in which the light-emitting portion 2 is not able to emit light is suppressed. Further, in the light-emitting device A of the present embodiment, as described above, by providing the heat equalizing plate 6, the temperature of the light-emitting portion of the organic EL element 2 can be uniformized, and the in-plane variation of the temperature of the light-emitting portion 20 can be reduced. . Further, in the light-emitting device A of the present embodiment, the drying member 7 having a low thermal conductivity is disposed on the lid substrate in the cover substrate 5 at the inner side of the region overlapping the joint portion 4, in comparison with the heat equalizing plate 6. The circumferential portion of 5 can suppress the phenomenon that the soaking effect of the heat equalizing plate 6 is impaired. Further, in the light-emitting device A of the present embodiment, the drying member 7 is formed using a desiccant having a higher absorption rate of the infrared ray than the lid substrate 5. In other words, the infrared absorbing rate of the drying member 7 is higher than that of the second substrate (liding substrate) 5. Therefore, according to the light-emitting device A of the present embodiment, in the temperature comparison of the central portion of the xenon light-emitting portion 2A, the temperature of the peripheral portion of the light-emitting portion 2A can be made low and emit light. The current relaxation at the peripheral portion of the crucible 20 is small, and the amount of luminescence is lowered, so that the in-plane variation of the luminance of the light-emitting portion 20 can be reduced. Here, as shown in Fig. 1, the recess 51 formed in the opposing surface of the light-transmitting substrate i in the lid substrate 5 is formed as the first! The polygonal shape (four-corner shape in the present embodiment) is closed. On the other hand, the drying member 7 is formed in a second polygonal shape (four-corner shape in the present embodiment) in which a specific internal angle α2 (=90 degrees) and an internal angle α degree of the first polygonal shape are superposed. Moreover, the drying member 7 is configured such that two vertices having a specific inner angle at the end point are 26/35

S 201244208 邊71、72、與在端點處具有第1多角形狀的内角α1_ 點的二個邊511、512分別成為相平行。 換言之,第2基板5在上述對向面(圖i(b)的下面)中呈 備多角形狀的凹處5!。凹處51在平行於第i基板ι的上述 一表面之面内具有圍繞發光部2 0的外周。帛2基板5在上 述對向面之凹處51的周邊經由接合部4而接合至第丨美板 卜乾燥構件7配置在凹處51的底面處的角部口。 土 又,本實施形態的發光裝置A中,角部具有規定的内 角α 1。乾無構件7形成為具有與規定的内角α j相等的角 (内角)α 2的形狀。 又’本實施形態的發光裝置Α中,乾燥構件7配置成 使定義該角(内角)《2的二邊71、72分別奴義規定的内 角αΐ的二邊511、512相對向且相平行。 又’本實施形態的發光裝i Α中’乾燥構件7分別配 置在凹處51的底面的角部。 而且,本貫施形態的發光裝置Α中,乾燥構件7中在 端點具有特定的内角α2的頂點的二邊7〗、72可做成與接 合部4平行,由外部來的水份在乾燥構件7中可效率良好 地被吸收,能使可靠性進一步提高。 又,本實施形態中,乾燥構件7的平面視形狀為四角 形狀,所以4個内角的任一個若都可做為特定的内角α2來. 配置乾燥構件7即可。 又,本實施形態的發光裝置Α中,如上所述,有機EL 元件2具備第1電極21、有機EL層22、第2電極23、第 1端子部T1、第2端子部T2及輔助電極26。透光性基板1 的上述一表面上’在上述規定方向的兩端部的各端部配置 27/35S 201244208 The sides 71 and 72 are parallel to the two sides 511 and 512 of the inner angle α1_ point having the first polygonal shape at the end point. In other words, the second substrate 5 has a polygonal recess 5 in the opposite surface (the lower surface of Fig. i(b)). The recess 51 has an outer circumference surrounding the light emitting portion 20 in a plane parallel to the above-described one surface of the i-th substrate ι. The 基板2 substrate 5 is joined to the corner of the bottom surface of the recess 51 by the joint portion 4 at the periphery of the concave portion 51 of the opposite surface. In addition, in the light-emitting device A of the present embodiment, the corner portion has a predetermined internal angle α 1 . The dry member 7 is formed into a shape having an angle (inner angle) α 2 equal to the predetermined inner angle α j . Further, in the light-emitting device of the present embodiment, the drying member 7 is disposed such that the two sides 511, 512 defining the internal angle α of the two sides 71 and 72 of the angle (the inner angle) "2" are opposite and parallel. Further, in the light-emitting device i of the present embodiment, the drying members 7 are disposed at the corners of the bottom surface of the recess 51, respectively. Further, in the light-emitting device of the present embodiment, the two sides 7 and 72 of the drying member 7 having the apex of the specific internal angle α2 at the end point can be made parallel to the joint portion 4, and the moisture from the outside is dried. The member 7 can be efficiently absorbed, and the reliability can be further improved. Further, in the present embodiment, since the planar shape of the drying member 7 is a quadrangular shape, any of the four internal angles can be made to have a specific internal angle α2. The drying member 7 can be disposed. In the light-emitting device of the present embodiment, the organic EL element 2 includes the first electrode 21, the organic EL layer 22, the second electrode 23, the first terminal portion T1, the second terminal portion T2, and the auxiliary electrode 26 as described above. . The one surface of the light-transmitting substrate 1 is disposed at each end portion of the both ends in the predetermined direction. 27/35

S 201244208 第1端子部T1及第2端子部T2。 因此,本實施形態的發光裝置Α中,<達成高亮度化 及亮度的面内均一性的提高。而且’可使蚱發光部的面積 減低。又,在與上述規定方向正交的方向中’本實施形態 的發光裝置A並列複數個以做為光源的照明器具中’可使 相鄰的發光部20間的距離變小,外觀成為優美° 又,本實施形態的發光裝置A中,如上所述’第1端 子部T1及第2端子部T2分別具有透明導電性氧化物層 24、25和金屬層27、28的積層構造,較佳是只有透明導電 性氧化物層24、25與接合部4接合。 藉此,本實施形態的發光裝置A中,可達成高亮度化 且使亮度的面内均一性提高。然後,可使接合部4和第1 端子部T1及第2端子部T2的接合強度提高。而且,可防 止:第1金屬層27和第2金屬層28的經時變化而發生氧 化時第1界面和第2界面的狀態發生變化。這樣可使可靠 性提高。 本實施形態的發光裝置A、與以第1端子部T1及第2 端子部T2使金屬層27、28與接合部4相接合而成的比較 例中,以發光部20中未發光的區域(暗區)而言由發光部2〇 的限度只進行規定距離所需的時間來比較,已確認本實施 形態的發光裝置A需要較長的時間。因此,本實施形態的 發光裝置A中’用來遮斷水份或氧的性能即氣體阻障 (barrier)性可提高,且可達成長壽命化。 又,本實施形態的發光裝置A中,第i端子部T1的寬 度的。权寸及第2端子部ή的寬度的合計尺寸設定成相 同值’藉此可使流向有機EL元件的電流變大。又,可使發 28/35S 201244208 The first terminal portion T1 and the second terminal portion T2. Therefore, in the light-emitting device of the present embodiment, <high brightness and improved in-plane uniformity of luminance are achieved. Moreover, the area of the illuminating portion can be reduced. Further, in the direction orthogonal to the predetermined direction, the light-emitting device A of the present embodiment is arranged in a plurality of lighting fixtures as a light source, and the distance between the adjacent light-emitting portions 20 can be made small, and the appearance becomes beautiful. Further, in the light-emitting device A of the present embodiment, as described above, the first terminal portion T1 and the second terminal portion T2 have a laminated structure of the transparent conductive oxide layers 24 and 25 and the metal layers 27 and 28, respectively. Only the transparent conductive oxide layers 24, 25 are bonded to the joint portion 4. As a result, in the light-emitting device A of the present embodiment, high luminance can be achieved and the in-plane uniformity of luminance can be improved. Then, the joint strength between the joint portion 4 and the first terminal portion T1 and the second terminal portion T2 can be improved. Further, it is possible to prevent the states of the first interface and the second interface from changing when the first metal layer 27 and the second metal layer 28 are oxidized with time. This will increase reliability. In the comparative example in which the light-emitting device A of the present embodiment and the metal layers 27 and 28 are joined to the joint portion 4 by the first terminal portion T1 and the second terminal portion T2, the light-emitting portion 20 is not illuminated ( In the dark region, it is confirmed that the light-emitting device A of the present embodiment requires a long time because the limit of the light-emitting portion 2 is only a predetermined time. Therefore, in the light-emitting device A of the present embodiment, the gas barrier property for shutting off moisture or oxygen can be improved, and the life can be extended. Further, in the light-emitting device A of the present embodiment, the width of the i-th terminal portion T1 is large. The total size of the width and the width of the second terminal portion 设定 is set to the same value', whereby the current flowing to the organic EL element can be increased. Also, can make hair 28/35

201244208 光效率提高。 又’本實施形態的發光裝置A中,引出配線23b中若 臨界電流密度(金屬為鋁的情況下為lxl〇5 A/cm2)以上的電 流長時間地流過,則會造成電子遷移,可能會有容易造成 斷線的疑慮。 對此’藉由ITO等的TCO來形成且連接至第1電極21 的第1透明導電性氧化物層24在與引出配線23b比較下, 臨界電流密度較大,且對臨界電流密度的限度(margin)亦較 大0 因此,本貫施形態的發光裝置A中,使第2端子部丁2 的寬度的合計尺寸較第丨端子部T1的寬度的合計尺寸還 大,这樣就可使電子遷移耐性(以下,大略稱為EM耐性) 提1¾。 又,若參閱圖1,第2端子部T2的寬度的合計尺寸係 為4個第2端子部T2的寬度(圖2中之左右方向的尺寸)的 合计尺寸,g 1端子部丁1白勺寬度的合計尺寸係為6個第】 端子部T1的寬度(圖2中之左右方向的尺寸)的合計尺寸, /又,本實施形態的發光裝置A中,沿著平面視形狀為 矩形狀的發光部2的規定的平行之2邊的各邊,m個_ 1)的第2端子部τ2和[m+1]個的第i端子部n配置成使第 1端子部T1位於第2端子部丁2的寬度方向的兩側,且第ι ,明導電性氧化物層24和第2透明導電性氧化物層25設 定成相同厚度。 。 藉此,本實施形態的發光裝置A中,可使該接合部4 1對第1端子部T1及第2端句η的接合強度或密接性 一致’且可使可靠性提高。 29/35 201244208 然而,透光性基板1的平面視形狀在矩形狀 不限於長方形,亦可為正方形。透光性基板】的平面視妒 狀為正方形狀的情況下,發光部2〇的平面形狀做成長^ 狀’且該長方形狀的發光部20之2個短邊若做為上述蚊 ^邊即可。X,亦可將透紐基板丨的平面視形狀做成 長方形狀,發光部20的平面視形狀做成與透光性義板 相似的長方_,且㈣長方雜的發光部2()的^ 做為上述規定的2邊。 (實施形態2) 本實施形態的發光裝置A的基本構成與實 略_。如圖15所示,第^基板即透光性基板 板即盍基板5等的平面視形狀不…又’與實施形態= 同的構成要素付上相同的符號且省略說明。 ^實施形態的透光性基板i的平面視形狀為六角形 狀丄蓋基板5的平面視形狀是與透光性基板i為相似形的 正六角形。又,實施形態丨中所說明的發光部2表^ _的平面視形狀亦做成正六㈣^ 〃閱圖 蓋基板5中形成在透光性基板丨的上述對向面中的凹 處51形成為第1多角形狀(本實施形態中為正六角形)的 口形狀。對此’乾燥構件7形成為使特定的内角歼 度)與第1多角形狀的内角叫〜㈣―致的第2多 (本實施形態中為二等邊三角形)。而且,乾燥構件7 使得在端點昊有特定的內肖a2的頂點的二邊71、乃、與 在端點具有第1多角形狀的内角αΐ的頂㈣二邊511^ 各別地成為相平行。 12 因此’即使在本實施形態的發光裝置Α中,乾燥構件 30/35 201244208 7中在端點具有特定的内角α2 _點的二邊7卜72可做 成與接合部4平彳了’且可在乾燥構件 來自外部的水份,可使可靠性進—步提高。千民及收 第1多角形狀(即,凹處51的形狀)不限於正六角形狀, 例如,正五角形狀、正八角形狀等亦可。又,第1夕, 狀不限於正多角形狀’若為多角形狀即可,但在正j形 狀的情況下,若準備單一的第2多角 夕角形 燥構件7即可,以達成域本化。的物件以做為乾 上述的各實施形態的有機虹元件2中,由 所構成的第i電極21構成陽極,薄片電阻較第^導電膜 還小的第2電極23構成陰極,但第1電極21 \極21 第2電極23構成陽極亦可,任一種情況下,若可馮,極且 明導電膜構成的第1電極21而將光取出即可。。I過由透 又,以各實施形態來說明的發光裝置A例如可 用作照明用的光源,但不限於照明,亦可用於其它、备地 中。 、匕的用途 【圖式簡單說明】 圖1顯示實施形態1之發光裝置,(a)是概略背面 (b)是⑻之H-H,的概略斷面圖。 11 圖2係上述實施形態1的發光裝置的背面圖。 圖3係圖2的B-B,線的概略斷面圖。 圖4係圖2的C-C’線的概略斷面圖。 圖5係圖2的G-G’線的概略斷面圖。 圖6係圖2的D-D,線的概略斷面圖。 圖7係圖2的E-E,線的概略斷面圖。 圖8係圖2的F-F,線的概略斷面圖。 31 /35 201244208 圖9係說明同上的發光裝置之製造方法的主要工程平 面圖。 圖10係說明同上的發光裝置之製造方法的主要工程平 面圖。 圖11係說明同上的發光裝置之製造方法的主要工程平 面圖。 圖12係說明同上的發光裝置之製造方法的主要工程平 面圖。 圖13係說明同上的發光裝置之製造方法的主要工程平 面圖。 圖14係說明同上的發光裝置之製造方法的主要工程平 面圖。 圖15係實施形態2的發光裝置的概略背面圖。 圖16係先前例子的有機EL元件的概略斷面圖。 【主要元件符號說明】 1 透光性基板(第1基板) 2 有機EL元件 20 發光部 201 基板 202 有機EL構造體 203 密封板 204 黏著劑 205 混合物 21 第1電極 22 有機EL層 23 第2電極201244208 Increased light efficiency. In the light-emitting device A of the present embodiment, if a current having a critical current density (1x10 〇 5 A/cm 2 in the case of aluminum is 1×1 〇 5 A/cm 2 in the lead wire 23b) flows for a long time, electron migration may occur. There are doubts that can easily cause a disconnection. In contrast, the first transparent conductive oxide layer 24 formed by the TCO of ITO or the like and connected to the first electrode 21 has a large critical current density and a limit on the critical current density (compared to the lead line 23b). Therefore, in the light-emitting device A of the present embodiment, the total size of the width of the second terminal portion 2 is larger than the total size of the width of the second terminal portion T1, so that the electrons can be made. Migration tolerance (hereinafter, roughly referred to as EM tolerance) is raised. Moreover, referring to Fig. 1, the total size of the width of the second terminal portion T2 is the total size of the widths of the four second terminal portions T2 (the dimensions in the left-right direction in Fig. 2), and the g 1 terminal portion is 1 The total size of the width is the total size of the width of the six terminal portions T1 (the size in the left-right direction in FIG. 2), and the light-emitting device A of the present embodiment has a rectangular shape along the plane view. Each of the two sides of the predetermined parallel side of the light-emitting portion 2, the second terminal portion τ2 of m_1) and the i-th terminal portion n of [m+1] are disposed such that the first terminal portion T1 is located at the second terminal On both sides in the width direction of the portion 2, the first conductive oxide layer 24 and the second transparent conductive oxide layer 25 are set to have the same thickness. . As a result, in the light-emitting device A of the present embodiment, the bonding strength or the adhesion between the first terminal portion T1 and the second end sentence η can be made uniform, and the reliability can be improved. 29/35 201244208 However, the planar shape of the light-transmitting substrate 1 is not limited to a rectangular shape, and may be a square shape. In the case where the planar shape of the light-transmitting substrate is a square shape, the planar shape of the light-emitting portion 2A is grown and the two short sides of the rectangular light-emitting portion 20 are the mosquitoes. can. X, the planar shape of the through-substrate 丨 can also be made into a rectangular shape, and the planar view of the light-emitting portion 20 can be made into a rectangular shape similar to that of the light-transmissive plate, and (4) the light-emitting portion 2 () ^ is the two sides of the above regulations. (Embodiment 2) The basic configuration and concept of the light-emitting device A of the present embodiment. As shown in Fig. 15, the planar shape of the substrate, i.e., the substrate 5, which is a light-transmissive substrate, is not the same as that of the embodiment, and the same components are denoted by the same reference numerals, and description thereof will be omitted. The planar view of the light-transmitting substrate i of the embodiment is a hexagonal shape. The plan view of the cover substrate 5 is a regular hexagonal shape similar to the light-transmitting substrate i. Further, the plan view shape of the light-emitting portion 2 described in the embodiment is also formed into a concave portion 51 formed in the opposite surface of the light-transmitting substrate 中 in the cover sheet substrate 5 in the plan view. It is a mouth shape of the first polygonal shape (normal hexagon in the present embodiment). The 'drying member 7 is formed such that the specific inner angle ) is equal to the inner angle of the first polygonal shape is called the fourth (the fourth embodiment) is the second side (the equilateral triangle in the present embodiment). Further, the drying member 7 is such that the two sides 71 of the apex of the specific inner axis a2 at the end point are parallel to the top (four) two sides 511 of the inner angle α 第 having the first polygonal shape at the end point. . Therefore, even in the light-emitting device of the present embodiment, the two sides 7 of the drying member 30/35 201244208 7 having a specific internal angle α2 _ point at the end point can be made flush with the joint portion 4 and The moisture from the outside of the drying member can be further improved in reliability. The first multi-angle shape (that is, the shape of the recess 51) is not limited to a regular hexagonal shape, and may be, for example, a regular pentagon shape or a regular octagonal shape. Further, the first shape is not limited to the regular polygonal shape. The polygonal shape may be a polygonal shape. However, in the case of a positive j-shape, a single second polygonal drying member 7 may be prepared to achieve localization. In the organic rainbow element 2 of each of the above-described embodiments, the second electrode 23 having a sheet resistance smaller than that of the second conductive film constitutes a cathode, but the first electrode is formed. 21 \Pole 21 The second electrode 23 may constitute an anode. In either case, the light may be taken out by the first electrode 21 formed of a conductive film. . The light-emitting device A described in the respective embodiments can be used as a light source for illumination, for example, but it is not limited to illumination, and can be used in other places. [Brief Description of the Drawings] Fig. 1 is a schematic cross-sectional view showing the light-emitting device of the first embodiment, wherein (a) is a schematic rear surface (b) and (8) is H-H. Fig. 2 is a rear elevational view of the light-emitting device of the first embodiment. Fig. 3 is a schematic cross-sectional view showing the line B-B of Fig. 2; Fig. 4 is a schematic cross-sectional view taken along line C-C' of Fig. 2; Fig. 5 is a schematic cross-sectional view taken along line G-G' of Fig. 2; Fig. 6 is a schematic cross-sectional view showing the line D-D of Fig. 2; Fig. 7 is a schematic cross-sectional view showing the line E-E of Fig. 2; Fig. 8 is a schematic cross-sectional view showing the line F-F of Fig. 2; 31 / 35 201244208 FIG. 9 is a main engineering plan view illustrating a method of manufacturing the same light-emitting device. Fig. 10 is a main engineering plan view showing a method of manufacturing the same light-emitting device. Fig. 11 is a main engineering plan view showing a method of manufacturing the same light-emitting device. Fig. 12 is a main engineering plan view showing a method of manufacturing the same light-emitting device. Fig. 13 is a main engineering plan view showing a method of manufacturing the same light-emitting device. Fig. 14 is a main engineering plan view showing a method of manufacturing the same light-emitting device. Fig. 15 is a schematic rear view showing a light-emitting device of a second embodiment. Fig. 16 is a schematic cross-sectional view showing an organic EL element of the prior art. [Description of main component symbols] 1 Translucent substrate (first substrate) 2 Organic EL device 20 Light-emitting portion 201 Substrate 202 Organic EL structure 203 Sealing plate 204 Adhesive 205 Mixture 21 First electrode 22 Organic EL layer 23 Second electrode

32/35 201244208 23b 引出配線 24 第1透明導電性氡化物層 24a 接合用區域 25 第2透明導電性氧化物層 25a 接合用區域 26 輔助電極 27 第1金屬層 28 第2金屬層 29 絕緣膜 3 元件基板 4 接合部 4a 黏著劑 5 蓋基板(第2基板) 51 凹處 511 > 512 邊 6 均熱板 7 乾燥構件 71 > 72 邊 8 空間 A 發光裝置 T1 第1端子部 T2 第2端子部 33/3532/35 201244208 23b lead wiring 24 first transparent conductive vaporized layer 24a bonding region 25 second transparent conductive oxide layer 25a bonding region 26 auxiliary electrode 27 first metal layer 28 second metal layer 29 insulating film 3 Element substrate 4 Bonding portion 4a Adhesive 5 Cover substrate (second substrate) 51 Recess 511 > 512 Side 6 Heat absorbing plate 7 Drying member 71 > 72 Side 8 Space A Light-emitting device T1 First terminal portion T2 Second terminal Department 33/35

Claims (1)

201244208 七、申請專利範圍: 1. 一種發光裝置,其具備: 第1基板; 有機EL元件,其具有放射光的發光部’且形成在前述 第1基板的一表面上; 第2基板’其配置成與前述第1基板的前述一表面相對 向’且與前述第1基板之間形成可收納前述發光部之空間; 接合部’其形成為圍繞前述發光部之框狀,且使前述第 2 t板之與前述第1基板1的對向面接合至前述第1基板 的前述一表面;及 乾燥構件,其以不接觸前述發光部之方式配置在前述第 2基板的削述對向面中由前述接合部所圍繞的區域的 緣。 2. 3. Γ請專概圍第1奴發錄置,其巾前述發光部似 月·】述接合部的中心。 如專利範圍第1項之發光I置,其中 二$第f基板在前述對向面具備多角形狀的凹處; 有二在剐述第1基板之與前述-表面平行的面内; 有圍繞前述發光部之外周; 前述凹處的周邊經由❸ 如申請專:第處的底面之角部。 !述角部具有=光裝置’其中 的形=。Λ構件$成為具有與前述規定的内角相等的^ 34/35 4. 201244208 5. 如申請專利範圍第4項之發光裝置,其中前述乾燥構件配 置成使定義前述角的二邊與定義前述規定的内角的二邊 各別地相對向且相平行。 6. 如申請專利範圍第1至5項中任一項之發光裝置,其中前 述乾燥構件配置在前述凹處的前述底面的各前述角部處。 7. 如申請專利範圍第1至5項中任一項之發光裝置,其中前 述乾燥構件較前述第2基板具有更高的紅外線吸收率。 35/35201244208 VII. Patent application scope: 1. A light-emitting device comprising: a first substrate; an organic EL element having a light-emitting portion that emits light and formed on one surface of the first substrate; and a second substrate Forming a space in which the light-emitting portion can be formed between the first substrate and the first substrate; the joint portion is formed in a frame shape surrounding the light-emitting portion, and the second t The plate is bonded to the surface of the first substrate 1 to the one surface of the first substrate, and the drying member is disposed on the opposite surface of the second substrate so as not to contact the light-emitting portion. The edge of the region surrounded by the aforementioned joint portion. 2. 3. Please refer to the first slave registration, and the light-emitting part of the towel is like the center of the joint. The light-emitting device I of the first aspect of the patent, wherein the two-th f-substrate has a polygonal recess in the opposite surface; two of the first substrate are in a plane parallel to the surface-surface; The periphery of the light-emitting portion; the periphery of the aforementioned recess is via a corner portion of the bottom surface of the application. The corner portion has the shape = of the optical device'. Λ $ $ $ 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光The two sides of the inner corner are respectively opposite and parallel. 6. The light-emitting device according to any one of claims 1 to 5, wherein the drying member is disposed at each of the aforementioned corners of the bottom surface of the recess. 7. The light-emitting device according to any one of claims 1 to 5, wherein the drying member has a higher infrared absorption rate than the second substrate. 35/35
TW101108165A 2011-03-29 2012-03-09 Light emitting device TWI485900B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011072775A JP2012209073A (en) 2011-03-29 2011-03-29 Light-emitting device

Publications (2)

Publication Number Publication Date
TW201244208A true TW201244208A (en) 2012-11-01
TWI485900B TWI485900B (en) 2015-05-21

Family

ID=46930563

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101108165A TWI485900B (en) 2011-03-29 2012-03-09 Light emitting device

Country Status (3)

Country Link
JP (1) JP2012209073A (en)
TW (1) TWI485900B (en)
WO (1) WO2012132823A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW584822B (en) * 2002-03-28 2004-04-21 Sanyo Electric Co Organic electroluminescence panel
JP2004296202A (en) * 2003-03-26 2004-10-21 Tohoku Pioneer Corp Organic el panel and its manufacturing method
JP2006140079A (en) * 2004-11-15 2006-06-01 Seiko Epson Corp Electro-optical device and electronic apparatus equipped with this
JP2006185840A (en) * 2004-12-28 2006-07-13 Tohoku Pioneer Corp Sheet like drying member, organic el panel, manufacturing method of organic el panel
JP2007103314A (en) * 2005-10-07 2007-04-19 Toshiba Matsushita Display Technology Co Ltd Organic el display panel
JP2007335365A (en) * 2006-06-19 2007-12-27 Hitachi Displays Ltd Organic el display device
KR100812023B1 (en) * 2006-08-23 2008-03-10 삼성에스디아이 주식회사 Organic Light Emitting Display Device and Mother Substrate of the Same
JP5390778B2 (en) * 2008-03-11 2014-01-15 出光興産株式会社 Organic electroluminescence panel

Also Published As

Publication number Publication date
JP2012209073A (en) 2012-10-25
TWI485900B (en) 2015-05-21
WO2012132823A1 (en) 2012-10-04

Similar Documents

Publication Publication Date Title
JP6429767B2 (en) Substrates for organic electronic devices
JP6268615B2 (en) Substrates for organic electronic devices
TWI535088B (en) Substrate for organic electronic device
JP5981019B2 (en) ORGANIC LIGHT EMITTING ELEMENT AND LIGHTING DEVICE
JP2015514293A (en) Organic light emitting device
CN104770063A (en) Organic electroluminescence element and lighting device
CN104335381B (en) For the substrate of organic electronic device
TWI466286B (en) Planar light emitting device
KR20140021052A (en) Optoelectronic component and method for producing an optoelectronic component
JP2011204645A (en) Light-emitting device
WO2013042784A1 (en) Light emission device
JP5421843B2 (en) Light emitting device
JP2013098103A (en) Organic light-emitting device
WO2013146350A1 (en) Light emitting apparatus and method for manufacturing light emitting apparatus
KR102147518B1 (en) Method for producing an optoelectronic component and optoelectronic component
DE102013105905B4 (en) Optoelectronic component and method for producing an optoelectronic component
TW201244208A (en) Light emitting device
WO2015118798A1 (en) Organic electroluminescence element and illumination device
JP2012212555A (en) Light-emitting device
TW201424075A (en) Substrate for organic electronic device
DE102013111409A1 (en) Optoelectronic component and method for producing an optoelectronic component
JP5452266B2 (en) Light emitting device
JP2019102299A (en) Organic el element, organic el lighting device, organic el element light source and organic el display device
JP2011222448A (en) Method for manufacturing light-emitting device
DE102014110271B4 (en) Optoelectronic component and method for producing an optoelectronic component

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees