WO2012126739A1 - Dispositif d'éclairage et phare de véhicule pourvu d'un dispositif d'éclairage - Google Patents
Dispositif d'éclairage et phare de véhicule pourvu d'un dispositif d'éclairage Download PDFInfo
- Publication number
- WO2012126739A1 WO2012126739A1 PCT/EP2012/054011 EP2012054011W WO2012126739A1 WO 2012126739 A1 WO2012126739 A1 WO 2012126739A1 EP 2012054011 W EP2012054011 W EP 2012054011W WO 2012126739 A1 WO2012126739 A1 WO 2012126739A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- light source
- semiconductor light
- region
- lighting device
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
Definitions
- Lighting device and vehicle headlight with lighting device are Lighting device and vehicle headlight with lighting device
- the invention relates to a lighting device according to the preamble of patent claim 1.
- Such a lighting device is disclosed, for example, in WO 2009/037053 Al.
- This document describes an illumination device with at least one semiconductor light source arrangement, which is thermally coupled by means of a carrier on which it is mounted to two heat sinks which form power supply lines for the semiconductor light source arrangement mounted on the carrier.
- the object of the invention to provide a generic BL LEVEL ⁇ processing device with an improved heat sink.
- the lighting device has Minim ⁇ least one semiconductor light source assembly which is mounted on a first region of a cooling body, wherein the first portion of the heat sink forms a first current supply for the at least one semiconductor light source arrangement and a second region of the heat sink which is electrically insulated from the first region of the Heatsink is executed, a second power supply for the at least one semiconductor light source arrangement is formed.
- At least a half ⁇ conductor light source assembly is mounted on the first portion of the heat sink and the first region of the cooling element thus serves as a carrier for the at least one Halbleiterlichtquel ⁇ lena order, is a good thermal coupling Zvi ⁇ rule of the at least one semiconductor light source arrangement and the first portion of the Heat sink manufactured, so that thereby generated by the at least one semiconductor light source arrangement heat can be dissipated very efficiently over the first Be ⁇ rich of the heat sink to the environment.
- the first portion of the cooling body may be metal ⁇ lisch and massive than the second region of the heat sink is formed so that the first area of the heat sink has a comparatively high heat capacity, thereby forming an efficient heat sink for the at least one semiconducting ⁇ terlichtizonan Aunt.
- the first region of the heat sink can be equipped with a heat pipe arrangement or with cooling fins in order to allow good heat dissipation to the environment.
- the second portion of the heat sink is thermally coupled to the first portion of the cooling body to ermögli ⁇ chen efficient heat dissipation to the environment.
- the first and second regions of the heat sink can be connected to one another via a heat-conducting, electrically insulating ceramic.
- the invention prestseinrich ⁇ processing electronics for operation of at least a semi-conductor ⁇ light source arrangement and the at least a half ⁇ conductor light source assembly is connected by the first and second current supply with these electronics.
- a plurality of semiconductor light source assembly are preferably mounted so that the first area of the heat sink forms a common power supply for the semiconducting ⁇ terlichtánnan füren.
- the first region of the heat sink serves as a carrier and heat sink for a plurality of semiconductor light source arrangements.
- a common Ver ⁇ bond the semiconductor light source arrangement is made possible to a ground reference potential of the electronics means of the first portion of the heat sink.
- the heat sink of the illumination device advantageously comprises a plurality of spaced electrically isolated regions, each of which forms a second current supply for at least one of the Halbleiterlichtquel ⁇ lena orders.
- Figure 1 is a plan view of a lighting device according to a preferred embodiment of the invention
- FIG. 2 shows an enlarged illustration of the semiconductor light source arrangement of the illumination device depicted in FIG.
- the figures show schematic representations of a Favor ⁇ th embodiment of the lighting device ⁇ invention which is intended for use in a headlamp for a motor vehicle, for example, the Lighting functions low beam, high beam, fog light, daytime running lights, position light or parking light so ⁇ to realize ⁇ .
- This illumination device has two semiconductor light source arrangements 1 and a heat sink 2 and an electronic unit 3 for operating the semiconductor light source arrangement.
- the heat sink 2 is formed approximately columnar and fixed with a first end to a housing of the electronics 3.
- the other, second end of the heat sink 2 has in a spatial direction perpendicular to the longitudinal extension of the heat sink 2 has a greater thickness than its first end.
- the heat sink 2 has a first region 21 which extends from the first end to the second end over the entire length of the heat sink 2 and consists of metal, preferably of copper or aluminum.
- the first region 21 of the heat sink 2 has a substantially rectangular cross-section and has two near the second end of the heat sink 2 angeord ⁇ designated oblique surfaces 210, on each of which one of the semiconductor light source assemblies 1 is mounted.
- a semiconductor light source arrangement 1 is mounted on the inclined surface 210 at the top of the first region 21 of the heat sink 2, while the other semiconductor light source arrangement is mounted on the inclined surface on the underside, which is not visible in FIGS. 1 and 2 of the first region 21 of the heat sink 2 is mounted.
- the first region 21 of the cooling body 2 serves as a support, a heat sink and as a common first current supply for the semiconductor light source devices 1.
- the semiconductor light source assemblies 1 have in each case a first terminal wire 10 of the respective half- ⁇ conductor light source assembly 1 electrically connected to the first region 21 of the heat sink combines.
- a side face of the first region 21 of the heat sink 2 arranged perpendicular to the inclined surfaces 210 is provided with an electrically insulating, heat-conducting layer 4 of ceramic or another electrically insulating material.
- an electrically insulating, heat-conducting layer 4 of ceramic or another electrically insulating material.
- two mutually parallel and separated by a gap 40 further regions 22, 23 of the heat sink 2 are arranged, which consist of metal, preferably of copper or aluminum.
- the other areas 10 22, 23 of the heat sink 2 are electrically isolated from each other and each extend over the entire length of the cooling ⁇ body 2. They extend from the first end to the second end of the heat sink. 2
- a second connecting wire 10 'of the first semiconductor light source arrangement 1 is connected to the second region 22 of the heat sink 2, and a second connecting wire of the second, not visible in FIGS. 1 and 2, semiconductor light source arrangement is connected to the third region 23 of the heat sink 2 , The second region 22 of the heat sink 2
- the first semiconductor light source arrangement 1 is thus connected through the connection wires 10,
- the first region 21 and the second region 22 of the heat sink 2 are connected to the electronics 3, while the second semiconductor light source arrangement is connected to the electronics 3 through its connecting wires by means of the first region 21 and the third region 23 of the heat sink 2.
- the first and second semiconductor light source arrangement 1 can therefore be controlled and operated separately from each other.
- the first region 21 of the heat sink 2 is electrically insulated from the further regions 22, 23 of the heat sink 2 and has larger dimensions perpendicular to its longitudinal ⁇ direction and a larger mass than the other areas 22, 23 of the heat sink 2, to form an effective heat sink for the semiconductor light source assemblies 1 can.
- the semiconductor light source assemblies 1 each consist of five in a row on a metal core printed circuit board arranged light-emitting diodes chips 11, 12, 13, 14, 15 which emit during their Be ⁇ drive white light.
- further semiconductor light source arrangements can be mounted on the first region 21 of the heat sink 2 and further electrically insulated regions of the heat sink 2 can be provided, which serve as second power supply lines for the additional semiconductor light source arrangements.
- These further regions of the heat sink 2 may be arranged in the manner of a lamellar, for example, by means of further insulating layers on a side face of the heat sink 2 extending perpendicular to the surfaces 210.
- the semiconductor light source arrangements can also have white light-generating laser diodes instead of light-emitting diodes.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
L'invention concerne un dispositif d'éclairage comprenant au moins un système de source lumineuse à semi-conducteur (1) qui est fixé à un corps de refroidissement (2) qui forme des alimentations en courant pour ledit système de source lumineuse à semi-conducteur (1), ce dernier (1) étant monté sur une première région (21) du corps de refroidissement (2) qui forme une première alimentation en courant pour ledit système de source lumineuse à semi-conducteur (1), et une deuxième région (22) du corps de refroidissement (2) qui est électriquement isolée de la première région (21) du corps de refroidissement (2) forme une deuxième alimentation en courant pour ledit système de source lumineuse à semi-conducteur (1).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011005823A DE102011005823A1 (de) | 2011-03-21 | 2011-03-21 | Beleuchtungseinrichtung und Fahrzeugscheinwerfer mit Beleuchtungseinrichtung |
DE102011005823.0 | 2011-03-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012126739A1 true WO2012126739A1 (fr) | 2012-09-27 |
Family
ID=45852531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2012/054011 WO2012126739A1 (fr) | 2011-03-21 | 2012-03-08 | Dispositif d'éclairage et phare de véhicule pourvu d'un dispositif d'éclairage |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102011005823A1 (fr) |
WO (1) | WO2012126739A1 (fr) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10251955A1 (de) * | 2002-11-08 | 2004-05-19 | Hella Kg Hueck & Co. | Einbaumodul mit leistungsstarker LED, insbesondere für ein Kraftfahrzeug |
DE102004036931A1 (de) * | 2004-07-29 | 2006-03-23 | Daimlerchrysler Ag | Automobiler Scheinwerfer |
WO2009037053A1 (fr) | 2007-09-19 | 2009-03-26 | Osram Gesellschaft mit beschränkter Haftung | Projecteur et son utilisation |
EP2187121A1 (fr) * | 2008-11-12 | 2010-05-19 | Valeo Vision | Dissipateur de chaleur monobloc pour modules optiques d'un dispositif d'éclairage et/ou de signalisation de véhiucle automobile |
EP2236914A1 (fr) * | 2009-03-31 | 2010-10-06 | Koito Manufacturing Co., Ltd. | Élément modularisant de dispositif électroluminescent et unité de lampe |
-
2011
- 2011-03-21 DE DE102011005823A patent/DE102011005823A1/de not_active Withdrawn
-
2012
- 2012-03-08 WO PCT/EP2012/054011 patent/WO2012126739A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10251955A1 (de) * | 2002-11-08 | 2004-05-19 | Hella Kg Hueck & Co. | Einbaumodul mit leistungsstarker LED, insbesondere für ein Kraftfahrzeug |
DE102004036931A1 (de) * | 2004-07-29 | 2006-03-23 | Daimlerchrysler Ag | Automobiler Scheinwerfer |
WO2009037053A1 (fr) | 2007-09-19 | 2009-03-26 | Osram Gesellschaft mit beschränkter Haftung | Projecteur et son utilisation |
EP2187121A1 (fr) * | 2008-11-12 | 2010-05-19 | Valeo Vision | Dissipateur de chaleur monobloc pour modules optiques d'un dispositif d'éclairage et/ou de signalisation de véhiucle automobile |
EP2236914A1 (fr) * | 2009-03-31 | 2010-10-06 | Koito Manufacturing Co., Ltd. | Élément modularisant de dispositif électroluminescent et unité de lampe |
Also Published As
Publication number | Publication date |
---|---|
DE102011005823A1 (de) | 2012-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1995514B1 (fr) | Unité d'éclairage | |
DE102008016458A1 (de) | Leiterplatte | |
DE202015009890U1 (de) | Leuchtdiode | |
DE202010009679U1 (de) | Eine LED-Beleuchtungseinrichtung | |
DE10063876B4 (de) | Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle | |
DE102012207519A1 (de) | Verfahren zum herstellen eines bauelementträgers, einer elektronischen anordnung und einer strahlungsanordnung und bauelementträger, elektronische anordnung und strahlungsanordnung | |
DE102008047104A1 (de) | Leuchtdiodenchip und Verfahren zu dessen Herstellung | |
DE102019104792A1 (de) | Lichtemittierendes modul | |
WO2010060417A1 (fr) | Module de diode électroluminescente et élément à diode électroluminescente | |
DE102015118984B4 (de) | Lichtquelle | |
DE102008039071B4 (de) | Beleuchtungsvorrichtung für Fahrzeuge | |
DE202007002129U1 (de) | Hochleistungsleuchtdiode | |
EP2054947B1 (fr) | Composant opto-électronique | |
WO2012123300A1 (fr) | Appareil d'éclairage et projecteur de véhicule muni de l'appareil d'éclairage | |
DE102008026627B3 (de) | Kühlsystem für LED-Chip-Anordnung | |
DE102012221250A1 (de) | Leuchtvorrichtung mit biegbarer Trägerplatte | |
WO2012126739A1 (fr) | Dispositif d'éclairage et phare de véhicule pourvu d'un dispositif d'éclairage | |
EP3357098B1 (fr) | Module d'eclairage à dels | |
DE102019116021B4 (de) | Flexible Leiterplatte mit thermisch leitender Verbindung zu einer Wärmesenke | |
WO2014173623A1 (fr) | Puce de semi-conducteur optoélectronique et composant à semi-conducteur optoélectronique | |
DE102014202196B3 (de) | Leiterplatte und Schaltungsanordnung | |
EP3267501B1 (fr) | Montage de composants à conductibilité thermique élevée pour diffusion de chaleur | |
DE102008054235A1 (de) | Optoelektronisches Bauteil | |
DE102012211143A1 (de) | Träger für elektrisches bauelement mit wärmeleitkörper | |
EP2283275B1 (fr) | Dispositif d'éclairage à réseau de del |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12709307 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12709307 Country of ref document: EP Kind code of ref document: A1 |