WO2012117812A1 - Film conducteur transparent, substrat comprenant un film conducteur transparent et élément électroluminescent organique les utilisant - Google Patents

Film conducteur transparent, substrat comprenant un film conducteur transparent et élément électroluminescent organique les utilisant Download PDF

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Publication number
WO2012117812A1
WO2012117812A1 PCT/JP2012/052692 JP2012052692W WO2012117812A1 WO 2012117812 A1 WO2012117812 A1 WO 2012117812A1 JP 2012052692 W JP2012052692 W JP 2012052692W WO 2012117812 A1 WO2012117812 A1 WO 2012117812A1
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Prior art keywords
conductive film
transparent conductive
substrate
metal wires
transparent
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PCT/JP2012/052692
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English (en)
Japanese (ja)
Inventor
太祐 松井
辻本 光
横川 弘
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パナソニック株式会社
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Publication of WO2012117812A1 publication Critical patent/WO2012117812A1/fr

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H05B33/28Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode of translucent electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • H10K50/814Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines

Definitions

  • the present invention relates to a transparent conductive film used for various optical devices, a substrate with a transparent conductive film, and an organic electroluminescence element using the same.
  • organic EL element is an organic light emitting layer sandwiched between a pair of electrodes formed on a transparent substrate. It passes through the electrode and is taken out from the substrate side.
  • organic EL element a material having conductivity and translucency is used as an electrode material on the substrate side, and indium tin oxide (hereinafter referred to as ITO) is widely used.
  • ITO indium tin oxide
  • electrodes using ITO as a material are vulnerable to bending and physical stress and are fragile.
  • high vapor deposition temperature and / or high annealing temperature are needed, and there exists a possibility that it may become high cost in manufacture of the device using an organic EL element.
  • the base material 101 with a transparent conductive film includes a base material 102 having translucency and a transparent conductive film 103 formed on the base material 102.
  • the transparent conductive film 103 includes a plurality of fine metal wires 103a and a transparent resin layer 103b as a binder. The plurality of fine metal wires 103a are bonded onto the base material 102 by the transparent resin layer 103b.
  • the substrate 101 with the transparent conductive film the plurality of fine metal wires 103a protrude from one surface opposite to the surface facing the substrate 102 of the transparent resin layer 103b.
  • the smoothness is poor. Therefore, when the substrate 101 with a transparent conductive film is used in an organic EL element, for example, when a functional layer such as a hole injection layer, a hole transport layer, or an organic light emitting layer is formed on the transparent conductive film 103, These functional layers may not be formed to a uniform thickness.
  • the above-mentioned organic EL element is expected to be used as a surface light emitter, and it is desired that the thickness of the functional layer is uniform in order to achieve uniform surface light emission, and the transparent where the functional layer is formed. It is necessary to smooth one surface of the conductive film 103. In order to smooth one surface of the transparent conductive film 103, it is conceivable to reduce the amount of the fine metal wires 103a. However, when the amount of the fine metal wires 103a is reduced, the conductivity of the transparent conductive film 103 is lowered.
  • the present invention has been made in order to solve the above problems, and without reducing the conductivity, a transparent conductive film capable of smoothing one surface on which a functional layer is formed, a substrate with a transparent conductive film, Another object of the present invention is to provide an organic electroluminescence device including the same.
  • the transparent conductive film of the present invention is a transparent conductive film provided on a substrate and provided with a transparent resin layer containing fine metal wires, on one surface opposite to the surface facing the substrate of the transparent resin layer.
  • the existence ratio P1 of the fine metal wires and the existence ratio P2 of the fine metal wires in a cross section that is parallel to the base material of the transparent resin layer and closer to the base material than the one surface have a relationship of P1 ⁇ P2. It is comprised as follows.
  • the cross section is a cross section that bisects the transparent resin layer in parallel with the base material, and the existence ratios P1 and P2 of the fine metal wires have a relationship of P1 ⁇ 0.7P2. Is preferred.
  • the existence ratios P1 and P2 of the fine metal wires have a relationship of 0.1P2 ⁇ P1.
  • the fine metal wire is preferably a metal nanowire.
  • the metal nanowire preferably contains silver.
  • this transparent conductive film is formed on a substrate and configured as a substrate with a transparent conductive film.
  • This substrate with a transparent conductive film is preferably used for an organic electroluminescence element.
  • the ratio of the thin metal wires on the surface opposite to the surface facing the substrate of the transparent resin layer is small, and the number of protruding metal wires is small.
  • electroconductivity can be improved.
  • the transparent conductive film of the present embodiment is formed on a light-transmitting substrate and is configured as a substrate with a transparent conductive film, and is used for, for example, an organic electroluminescence (hereinafter referred to as organic EL) element.
  • FIG. 1 shows a cross-sectional configuration of an organic EL element.
  • the organic EL element 1 includes a substrate 2, a transparent conductive film 3, an organic light emitting layer 4 as a functional layer, and a conductor layer 5, and the transparent conductive film 3, the organic light emitting layer 4, And the conductor layer 5 are sequentially laminated.
  • a hole injection layer that promotes injection of holes from the transparent conductive film 3 is provided between the organic light emitting layer 4 and the transparent conductive film 3, and promotes injection of electrons from the conductor layer 5.
  • An electron injection layer is preferably provided between the conductor layer 5.
  • a hole transport layer that efficiently transports holes or an electron transport layer that efficiently transports electrons may be provided.
  • the organic EL element 1 configured as described above, when a voltage is applied between the transparent conductive film 3 and the conductor layer 5 with the transparent conductive film 3 side as a positive potential, holes are emitted from the transparent conductive film 3 to organic light emission. Electrons are injected into the layer 4 and electrons are injected from the conductor layer 5 into the organic light emitting layer 4. Then, the holes and electrons injected into the organic light emitting layer 4 are recombined in the organic light emitting layer 4 so that the organic light emitting layer 4 emits light. The light emitted from the organic light emitting layer 4 passes through the substrate 6 with the transparent conductive film (the transparent conductive film 3 and the substrate 2), and is taken out of the organic EL element 1. The light irradiated on the conductor layer 5 is reflected on the surface of the conductor layer 5, passes through the substrate 6 with a transparent conductive film, and is taken out of the organic EL element 1.
  • the material of the base material 2 will not be specifically limited if it has translucency.
  • a base material 2 for example, a rigid transparent glass plate such as soda glass or non-alkali glass, or a flexible transparent plastic plate such as polycarbonate or ethylene terephthalate is used.
  • a rigid transparent glass plate such as soda glass or non-alkali glass
  • a flexible transparent plastic plate such as polycarbonate or ethylene terephthalate
  • the strength of the device using the substrate 2 is excellent, and the formation of the transparent conductive film 3 on the substrate 2 can be facilitated.
  • a flexible transparent plastic plate is used as the substrate 2, the device using the substrate 2 can be reduced in weight, and the device can have flexibility.
  • Examples of the material of the organic light emitting layer 4 include anthracene, naphthalene, pyrene, tetracene, coronene, perylene, phthaloperylene, naphthaloperylene, diphenylbutadiene, tetraphenylbutadiene, coumarin, oxadiazole, bisbenzoxazoline, bisstyryl, and cyclopentadiene.
  • a compound or a polymer is used.
  • a light-emitting material such as an iridium complex, an osmium complex, a platinum complex, or a europium complex, or a phosphorescent light-emitting material such as a compound or polymer having these in a molecule can be used. These materials can be appropriately selected and used as necessary.
  • a material of the conductor layer 5 for example, aluminum or the like is used.
  • a laminated structure may be formed by combining aluminum and another material. Examples of such combinations include a laminate of an alkali metal and aluminum, a laminate of an alkali metal and silver, a laminate of an alkali metal halide and aluminum, a laminate of an alkali metal oxide and aluminum, and an alkali.
  • a laminate of an earth metal or rare earth metal and aluminum, or an alloy of these metal species with another metal can be used.
  • the substrate 6 with a transparent conductive film includes a substrate 2 and a transparent conductive film 3 formed on the substrate 2.
  • the transparent conductive film 3 includes a plurality of fine metal wires 3a having conductivity and a transparent resin layer 3b as a binder.
  • the organic light emitting layer 4 is laminated on the surface 3c on the opposite side of the surface of the transparent resin layer 3b facing the substrate 2, and the organic light emitting layer 4 is laminated. Therefore, in the following description, this surface is referred to as a working surface 3c.
  • the plurality of fine metal wires 3a are bonded onto the base material 2 by the transparent resin layer 3b in a state in which a part protrudes from the action surface 3c. For this reason, on the base material 2, a three-dimensional conductive network of a plurality of fine metal wires 3a is formed. Thereby, the transparent conductive film 3 has electroconductivity.
  • the three-dimensional conductive network of the plurality of fine metal wires 3a indicates a state in which the plurality of fine metal wires 3a are in contact with or close to each other in three dimensions.
  • the fine metal wire 3a protruding from the working surface 3c of the transparent resin layer 3b comes into contact with the organic light emitting layer 4, and a voltage is applied to the organic EL element 1. Then, holes are injected into the organic light emitting layer 4 from the plurality of fine metal wires 3a.
  • the existence ratio P1 of the plurality of fine metal wires 3a on the working surface 3c of the transparent resin layer 3b is parallel to the base material 2 of the transparent resin layer 3b and is present on the base material 2 side with respect to the working surface 3c.
  • the existence ratio P2 of the thin metal wires 3a in the cross section 3d is adjusted to satisfy P1 ⁇ P2.
  • the abundance ratio P1 of the metal fine wires 3a is not zero, and a predetermined amount of the metal fine wires 3a is present on the working surface 3c of the transparent resin layer 3b.
  • a plurality of fine metal wires 3a are continuously present from the working surface 3c of the transparent resin layer 3b to the surface facing the substrate 2.
  • These thin metal wires 3a form a three-dimensional conductive network as described above, whereby the transparent conductive film 3 can obtain high conductivity.
  • the abundance ratios P1 and P2 of the fine metal wires 3a are P1 ⁇ 0.7P2. It is preferable to satisfy the relationship. Thereby, the smoothness of the action surface 3c of the transparent conductive film 3 can be improved. Further, it is preferable that the existence ratios P1 and P2 of the fine metal wires 3a satisfy the relationship of 0.1P2 ⁇ P1. Thereby, it is possible to prevent the conductivity of the working surface 3c of the transparent conductive film 3 from being lowered and the surface resistance value on the working surface 3c from becoming unstable.
  • the following methods can be mentioned. That is, in the step of forming the transparent conductive film 3 on the substrate 2, a plurality of coating agent compositions having different concentrations of the fine metal wires 3a are prepared. And these coating agent compositions are apply
  • the coating agent composition that is finally applied onto the substrate 2 is a coating agent composition having the lowest concentration of the fine metal wires 3a among the plurality of coating agent compositions.
  • the existence ratio P2 of the metal fine wire 3a becomes large gradually toward the surface which opposes the base material 2 from the action surface 3c of the transparent resin layer 3b in the transparent resin layer 3b.
  • the fine metal wire 3a is made of a fibrous metal, metal, or metal fine particle having a line width of several nm to several tens of ⁇ m.
  • the length of the fine metal wire 3a is sufficiently longer than the diameter of the cross section perpendicular to the length direction of the fine metal wire 3a.
  • the amount of the plurality of fine metal wires 3a contained in the transparent conductive film 3 is preferably 0.1 mg / m 2 or more and 1000 mg / m 2 or less, more preferably 1 mg / m 2 or more and 100 mg / m 2 or less. preferable.
  • the length of each of the plurality of fine metal wires 3a is preferably 300 nm or less in consideration of the translucency of the transparent conductive film 3, and the average diameter of the plurality of fine metal wires 3a is 0.3 nm or more and 200 nm or less. Preferably there is. For the same reason, the average aspect ratio of the plurality of fine metal wires 3a is preferably 10 or more and 10,000 or less. Furthermore, considering the conductivity of the transparent conductive film 3, the thickness of the transparent resin layer 3b is preferably not less than the average diameter of the plurality of fine metal wires 3a and not more than 500 nm.
  • the material of the metal thin wire 3a for example, a metal mesh, a metal nanowire, an aggregate of metal fine particles, or the like is used, but it is preferable to use a metal nanowire excellent in transparency and conductivity of the transparent conductive film 3.
  • the metal used for the thin metal wire 3a include gold, silver, copper, aluminum, zinc, cobalt, nickel, and tungsten.
  • gold, silver, or copper having high conductivity is preferably used, and silver having the highest conductivity is more preferably used.
  • the length of the metal nanowires is preferably 3 ⁇ m or more, more preferably 3 ⁇ m or more and 500 ⁇ m or less in consideration of the conductivity of the transparent conductive film 8. More preferably, it is 300 ⁇ m or less.
  • the average diameter of the metal nanowires is preferably 10 nm or more and 300 nm or less, and more preferably 30 nm or more and 200 nm or less in consideration of the translucency and conductivity of the transparent conductive film 8.
  • the manufacturing method of metal nanowire is not specifically limited, For example, well-known methods, such as a liquid phase method or a gaseous-phase method, are used.
  • Examples of the material for the transparent resin layer 3b include polyethylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer and a saponified product thereof partially or entirely, ethylene-ethyl acrylate copolymer, ethylene-methyl methacrylate copolymer.
  • Polymers ethylene-vinyl acetate-methyl methacrylate copolymers, olefin resins such as polypropylene and propylene- ⁇ -olefin copolymers, vinyl chloride resins such as polyvinyl chloride resins, and acrylonitrile such as acrylonitrile-styrene copolymers Resin, polystyrene, styrene resin such as styrene-methyl methacrylate copolymer, acrylate polymer such as polyethyl acrylate, methacrylate polymer such as polymethyl methacrylate, copolymers thereof and others (Meth) acrylic with added copolymer component Ester resin, a polyester resin such as polyethylene terephthalate, polyamide resins such as nylon, polycarbonate resin, ethyl cellulose, cellulose resins such as acetyl cellulose, polyurethane resins, and silicone resins.
  • Ester resin a polyester resin such as polyethylene
  • thermosetting resins such as phenol resin, urea resin, diallyl phthalate resin, melamine resin, unsaturated polyester resin, polyurethane resin, epoxy resin, aminoalkyd resin, silicon resin, or polysiloxane resin can be used.
  • thermosetting resins such as phenol resin, urea resin, diallyl phthalate resin, melamine resin, unsaturated polyester resin, polyurethane resin, epoxy resin, aminoalkyd resin, silicon resin, or polysiloxane resin can be used.
  • curing agent, a hardening accelerator, or a solvent to these thermosetting resins as needed.
  • the ionizing radiation curable resin preferably has an acrylate functional group, for example, a relatively low molecular weight polyester resin, polyether resin, acrylic resin, epoxy resin, urethane resin, alkyd resin, spiroacetal. Resins, polybutadiene resins, polythiol polyene resins, oligomers such as (meth) acrylates of polyfunctional compounds such as polyhydric alcohols, prepolymers, and reactive diluents such as ethyl (meth) acrylate, ethylhexyl (meth) acrylate, styrene, methyl Monofunctional monomers such as styrene and N-vinylpyrrolidone, as well as polyfunctional monomers such as trimethylolpropane tri (meth) acrylate, hexanediol (meth) acrylate, tripropylene glycol di (meth) acrylate A relatively large amount of diethylene glycol di (me
  • the ionizing radiation curable resin an ultraviolet curable resin
  • a photopolymerization initiator acetophenones, benzophenones, ⁇ -amyloxime esters, thioxanthones or the like are used.
  • a photosensitizer may be used.
  • the photosensitizer n-butylamine, triethylamine, tri-n-butylphosphine, thioxanthone, or the like is used.
  • the coating method of the transparent conductive film 3 is not particularly limited, and a known coating method such as spin coating, screen printing, dip coating, die coating, casting, spray coating, or gravure coating is used. Further, in order to smooth the working surface 3c of the transparent resin layer 3b and stabilize the surface resistance value on the working surface 3c, a pressurizing step using, for example, a roller press may be performed.
  • the existence ratio of the thin metal wires 3a on the working surface 3c of the transparent resin layer 3b is small, and the protruding fine metal wires 3a are small.
  • the surface 3c can be smoothed.
  • the conductivity can be improved.
  • Silver nanowires were produced as thin metal wires according to a known paper “Materials Chemistry and Physics vol. 114 p333-338“ Preparation of Ag nanorods with high yield by polyol process ””. In this case, the average diameter of the silver nanowire was 50 nm, and the average length of the silver nanowire was 5 ⁇ m.
  • Example 1 3 parts by mass of methyl cellulose “M7140” manufactured by Sigma-Aldrich was dissolved in 200 parts by mass of water to prepare a methylcellulose solution. Next, a dispersion liquid in which the above-mentioned silver nanowire was dispersed as a metal thin wire and water was used as a dispersion medium at a solid content of 3.0% by mass was prepared. Next, 100 parts by mass of this dispersion was added to the methylcellulose solution and mixed well. Thereby, the 1st coating agent composition was produced. Moreover, the dispersion liquid which disperse
  • the first coating composition was applied on a glass substrate BK7 having dimensions of 100 mm in length, 100 mm in width, and 0.7 mm in height by a spin coater so as to have a thickness of 100 nm. And after drying the glass base material with which the 1st coating agent composition was apply
  • Example 2 A third coating agent composition was prepared in the same manner as in Example 1 above by adding a dispersion liquid in which silver nanowires were dispersed in water with a solid content of 1.8% by mass to a methylcellulose solution. Then, instead of the second coating agent composition, a third transparent conductive film is formed on the first transparent conductive film using the third coating agent composition, and the same as in Example 1 above. Thus, a sample of Example 2 was produced.
  • Comparative Example 1 A sample of Comparative Example 1 was produced in the same manner as in Example 1 except that only the first coating agent composition was applied onto a substrate with a spin coater so that the thickness was 150 nm.
  • Comparative Example 2 A dispersion obtained by dispersing silver nanowires with water as a dispersion medium at a solid content of 2.1% by mass was added to the methylcellulose solution to prepare a fourth coating agent composition in the same manner as in Example 1 above. Then, instead of the second coating agent composition, a fourth transparent conductive film is formed on the first transparent conductive film using the fourth coating agent composition, and the same as in Example 1 above. Thus, a sample of Comparative Example 2 was produced.
  • Comparative Example 3 A fifth coating agent composition was prepared in the same manner as in Example 1 above by adding a dispersion liquid in which silver nanowires were dispersed in water with a solid content of 0.3% by mass to a methylcellulose solution. Then, instead of the second coating agent composition, a fifth transparent conductive film is formed on the first transparent conductive film using the fifth coating agent composition, and the same as in Example 1 above. Thus, a sample of Comparative Example 3 was produced.
  • the surface resistance value, the surface roughness Ra, and the leakage current were measured for the samples of Examples 1 and 2 and Comparative Examples 1 to 3. Hereinafter, these measurements will be described in order.
  • the surface resistance value of the transparent conductive film of each sample was measured using Loresta EP MCP-T360 manufactured by Mitsubishi Chemical Corporation.
  • N, N-diphenyl-N, N-bis3-methyl-phenyl-1,1-diphenyl-4,4 diamine manufactured by Doujin Chemical Laboratory Co., Ltd. is 50 nm thick on the transparent conductive film of each sample produced. Vacuum deposition was performed. This formed the positive hole transport layer on the transparent conductive film of each sample. Next, an aluminum quinolinol complex (tris (8-hydroquinoline) aluminum) manufactured by Doujin Chemical Laboratory Co., Ltd. was vacuum-deposited on the hole transport layer so as to have a thickness of 50 nm. This formed the organic light emitting layer on the positive hole transport layer.
  • the presence ratios P1 and P2 of the silver nanowires are 0.1P2 ⁇ P1 ⁇ 0.7P2. It is shown that it is preferable to satisfy this relationship.
  • the transparent conductive film 3 can be used as a transparent electrode such as a liquid crystal display, a plasma display, or a solar organic battery.
  • carbon nanotubes may be used as the material of the fine metal wires 3a
  • conductive polymers may be used as the material of the transparent resin layer 3b.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un substrat (6) comprenant un film conducteur transparent, qui comprend un substrat (2) et le film conducteur transparent (3) formé sur le substrat (2). Le film conducteur transparent (3) comprend une pluralité de fils métalliques fins conducteurs (3a) et une couche de résine transparente (3b). Une partie des différents fils métalliques fins (3a) font saillie d'une surface d'action (3c) de la couche de résine transparente (3b). La proportion (P1) des différents fils métalliques fins (3a) présents dans la surface d'action (3c) et la proportion (P2) des fils métalliques fins (3a) présents dans une surface de section (3d) parallèle à la couche de résine transparente (3b) du substrat (2) et davantage sur le côté substrat (2) que la surface d'action (3c), satisfont la condition P1 < P2. Par suite, le nombre de fils métalliques fins en saillie (3a) diminue et la surface d'action (3c) peut être lissée. De plus, la proportion de fils métalliques fins (3a) présents davantage sur le côté du substrat (2) que la surface d'action (3c) augmente et la conductivité peut être augmentée.
PCT/JP2012/052692 2011-03-03 2012-02-07 Film conducteur transparent, substrat comprenant un film conducteur transparent et élément électroluminescent organique les utilisant WO2012117812A1 (fr)

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JP2011-046257 2011-03-03
JP2011046257A JP2012185919A (ja) 2011-03-03 2011-03-03 透明導電膜、透明導電膜付き基材、及びそれを用いた有機エレクトロルミネッセンス素子

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021232596A1 (fr) * 2020-05-21 2021-11-25 电子科技大学中山学院 Film conducteur transparent souple a réparation thermique et son procédé de préparation

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JP6074851B2 (ja) * 2013-03-29 2017-02-08 パナソニックIpマネジメント株式会社 導電性光学部材

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JPH01249436A (ja) * 1988-03-31 1989-10-04 Toray Ind Inc 透明導電性フィルムおよびその製造方法
JP2006171336A (ja) * 2004-12-15 2006-06-29 Takiron Co Ltd 画像表示用透明電極体および画像表示装置
JP2007229989A (ja) * 2006-02-28 2007-09-13 Takiron Co Ltd 導電性成形体及びその製造方法
JP2009252493A (ja) * 2008-04-04 2009-10-29 Konica Minolta Holdings Inc 透明導電性フィルムその製造方法及び有機エレクトロルミネッセンス素子
JP2010513175A (ja) * 2006-06-30 2010-04-30 カーディナル・シージー・カンパニー カーボンナノチューブグレージング技術
WO2011013618A1 (fr) * 2009-07-30 2011-02-03 住友化学株式会社 Elément électroluminescent organique

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Publication number Priority date Publication date Assignee Title
JPH01249436A (ja) * 1988-03-31 1989-10-04 Toray Ind Inc 透明導電性フィルムおよびその製造方法
JP2006171336A (ja) * 2004-12-15 2006-06-29 Takiron Co Ltd 画像表示用透明電極体および画像表示装置
JP2007229989A (ja) * 2006-02-28 2007-09-13 Takiron Co Ltd 導電性成形体及びその製造方法
JP2010513175A (ja) * 2006-06-30 2010-04-30 カーディナル・シージー・カンパニー カーボンナノチューブグレージング技術
JP2009252493A (ja) * 2008-04-04 2009-10-29 Konica Minolta Holdings Inc 透明導電性フィルムその製造方法及び有機エレクトロルミネッセンス素子
WO2011013618A1 (fr) * 2009-07-30 2011-02-03 住友化学株式会社 Elément électroluminescent organique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021232596A1 (fr) * 2020-05-21 2021-11-25 电子科技大学中山学院 Film conducteur transparent souple a réparation thermique et son procédé de préparation

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