WO2012098573A1 - Printed board and acceleration detection apparatus - Google Patents

Printed board and acceleration detection apparatus Download PDF

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Publication number
WO2012098573A1
WO2012098573A1 PCT/JP2011/000224 JP2011000224W WO2012098573A1 WO 2012098573 A1 WO2012098573 A1 WO 2012098573A1 JP 2011000224 W JP2011000224 W JP 2011000224W WO 2012098573 A1 WO2012098573 A1 WO 2012098573A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
contact surface
capacitor
stepped portion
Prior art date
Application number
PCT/JP2011/000224
Other languages
French (fr)
Japanese (ja)
Inventor
直哉 野崎
山下　利幸
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2012553452A priority Critical patent/JP5490262B2/en
Priority to PCT/JP2011/000224 priority patent/WO2012098573A1/en
Publication of WO2012098573A1 publication Critical patent/WO2012098573A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Definitions

  • the present invention relates to a printed circuit board having a structure for preventing vibration of electronic components such as capacitors, and an acceleration detection apparatus using the printed circuit board.
  • a tall component such as an aluminum electrolytic capacitor is not used.
  • the capacitor element is housed in a bottomed cylindrical outer case, the lead terminal is led out from the open end of the outer case, and sealed by a sealing member.
  • a plurality of protrusions are provided on the end surface of the outer case. When this capacitor is mounted on the substrate, these protrusions abut against the substrate and suppress the vibration of the capacitor.
  • Such a conventional anti-vibration structure requires an exterior case in addition to the capacitor element, which increases the price.
  • the mounting area on the substrate is increased by attaching the outer case.
  • the present invention has been made to solve the above-described problems, and an object thereof is to prevent vibration of an electronic component mounted on a printed circuit board without using an additional component.
  • the printed circuit board according to the present invention includes a stepped portion including a contact surface that contacts the outer edge portion from the lead terminal of the seating surface of the electronic component, and a separation surface that is formed lower than the corresponding contact surface and is separated from the outer edge portion on the center side. It is to be prepared.
  • the acceleration detecting device includes a contact surface that contacts the outer edge portion from the lead terminal of the seating surface of the electronic component, and a separation surface that is formed lower than the corresponding contact surface and is separated from the outer edge portion on the center side.
  • a printed circuit board provided with a step portion is used.
  • the step portion is provided on the printed circuit board so as to contact the outer edge portion outside the lead terminal of the seating surface of the electronic component, and the center side is separated from the outer edge portion.
  • the vibration of the electronic component mounted on the printed circuit board can be prevented. Further, since the vibration of the electronic component can be prevented even when the printed circuit board vibrates, it can be used for an acceleration detection device in which an acceleration sensor is mounted on the same substrate.
  • FIG. 2 It is an external appearance perspective view which shows the state which mounted the capacitor
  • FIG. 6 is a plan view showing a modification of the printed circuit board according to Embodiment 1.
  • FIG. It is a top view which shows the structure of the printed circuit board concerning Embodiment 2 of this invention. It is sectional drawing which cut
  • FIG. 12 It is sectional drawing which cut
  • FIG. 10 It is sectional drawing which cut
  • Embodiment 1 FIG.
  • the capacitor 3 shown in FIGS. 1 and 2 is normally mounted on the printed circuit board 1 with a rubber member (seat surface rubber 6) for sealing an internal electrolyte solution or the like as a seat surface. Since it is difficult to process the surface in contact with the substrate into a flat surface, the posture of the capacitor 3 is unstable and easily vibrates. For this reason, stress is easily generated in the lead terminal 4 protruding so as to penetrate the seating surface rubber 6 and is easily broken. Therefore, in the first embodiment, as shown in FIGS.
  • a step portion 2 is formed which is formed lower than the contact surface 2a and is formed of a separation surface 2b which is separated from the center side of the seat rubber 6.
  • the stepped portion 2 is formed by solder.
  • a land portion 8 (shown in FIG. 2) made of copper foil is formed on the printed board 1. Since the cylindrical capacitor 3 has a circular seating rubber 6, the land portion 8 is formed in an annular shape having an outer peripheral portion substantially the same shape as the circular shape. Two through holes 5 for inserting the two lead terminals 4 are formed. Subsequently, the land portion 8 is soldered by a reflow process or the like, and a step is formed by the thickness of the solder. The higher side is the contact surface 2a of the step portion 2, and the lower side is the separation surface 2b of the step portion 2. To do. As shown in FIG.
  • the contact surface 2 a is an annular shape having an outer peripheral portion that is substantially the same shape as the circular shape of the seating rubber 6, and a portion surrounded by the annular shape is a circular separation surface 2 b.
  • the lead terminal 4 is inserted into the through hole 5 so that the seating rubber 6 of the capacitor 3 is in contact with the contact surface 2a formed of solder, and the solder portion 7 is formed by flow soldering or the like.
  • a capacitor 3 is fixed to the printed circuit board 1.
  • the capacitor 3 In a state where the capacitor 3 is mounted on the printed circuit board 1, a gap is formed between the center portion of the seating surface rubber 6 where the lead terminal 4 is located and the separation surface 2b (the surface of the printed circuit board 1), and the contact surface 2a
  • the seat rubber 6 is in contact with the outer edge 6a outside the lead terminal 4 and supported in a stable state. Therefore, even if the printed circuit board 1 vibrates, the vibration of the capacitor 3 can be suppressed and breakage of the lead terminal 4 can be prevented.
  • the outer diameter of the contact surface 2a is larger than the outer diameter of the seat rubber 6 (the outer edge 6a of the two-dot chain line shown in FIG. 3), but may be smaller than the outer diameter of the seat rubber 6. Good. However, the capacitor 3 is less likely to vibrate by supporting the seat rubber 6 on the outer edge side.
  • the reflow process for forming the stepped portion 2 can use the reflow process for mounting the mounting component on the printed circuit board 1, it is not necessary to newly increase the process. Moreover, since solder is used, there is no need to install additional parts such as a conventional outer case and a damper mechanism.
  • an acceleration sensor can be mounted on the same circuit board and used for an acceleration detection device such as an airbag control unit.
  • the printed circuit board 1 on which the capacitor 3 with the lead terminals 4 protruding from the seat rubber 6 is mounted on the outer edge portion 6 a outside the lead terminals 4 of the seat rubber 6.
  • the contact surface 2a to be contacted and the stepped portion 2 formed to be lower than the corresponding contact surface 2a and separated from the outer edge portion 6a on the center side are provided, and the contact surface 2a is formed by solder. did. Thereby, the vibration of the capacitor 3 can be prevented without installing additional components on the printed circuit board 1.
  • FIG. 4 is a plan view showing a modified example of the printed circuit board 1 according to Embodiment 1, in which two slit portions 9 are formed on the contact surface 2a.
  • the capacitor (not shown) is likely to vibrate in the direction perpendicular to the line connecting the two through holes 5 (the direction of arrow B), it is preferable to provide the contact surface 2a in that direction to support the capacitor. Therefore, in the illustrated example, the slit portion 9 is formed on the line connecting the two through holes 5 so that the vibration preventing effect is not reduced.
  • FIG. 1 is a plan view showing the configuration of the printed circuit board 1 according to the second embodiment.
  • FIG. 6 is a cross-sectional view of the printed circuit board 1 according to Embodiment 2 cut at a position corresponding to the line AA in FIG.
  • a step is formed by two mounting components 10. 5 and 6, the same or corresponding parts as those in FIGS. 1 and 2 are denoted by the same reference numerals and description thereof is omitted.
  • mounting component land portions 11 for mounting two mounting components 10 to be stepped portions are formed on the printed circuit board 1.
  • these mounting component land portions 11 are in positions where they abut against the outer edge portion 6 a of the seating surface rubber 6 of the capacitor 3 and are orthogonal to the line connecting the two through holes 5. It is preferable to form in the direction.
  • soldering is performed by a reflow process or the like to form a mounting component solder portion 12, and the mounting component 10 is fixed to the printed circuit board 1.
  • the lead terminal 4 is inserted into the through hole 5 so that the seating rubber 6 of the capacitor 3 abuts on the mounted component 10, and the solder portion 7 is formed by flow soldering or the like, and the capacitor 3 is attached to the printed circuit board 1. Fix it.
  • the mounting components 10 are arranged with a gap between them, the air permeability of the through hole 5 can be improved and soldering can be improved. Moreover, since the reflow process for mounting the mounting component 10 can use a reflow process for mounting another mounting component on the printed circuit board 1, it is not necessary to newly increase the number of processes. Further, as the mounting component 10, a mounting component necessary for the circuit configuration may be used. In this case, no additional component is required.
  • the surface of the printed circuit board 1 becomes a separation surface separated from the center portion of the seating surface rubber 6 with the lead terminals 4, and the mounting component 10 having a height higher than the separation surface.
  • the top surface is a contact surface that contacts the outer edge portion 6a of the seat rubber 6, and the capacitor 3 is supported in a stable state with respect to the printed circuit board 1 to suppress vibration.
  • the arrangement number and arrangement position of the mounting component 10 are not limited to the example of FIG. 5, and may be arbitrary.
  • the mounting component 10 is arranged on the circumference corresponding to the outer diameter of the seat rubber 6 (the outer edge portion 6a of the two-dot chain line shown in FIG. 5). You may comprise so that may come to the center side from the outer edge part 6a. However, as described in the first embodiment, the capacitor 3 is less likely to vibrate by supporting the seat rubber 6 on the outer edge side.
  • the contact surface of the stepped portion is formed by the mounting component 10 mounted on the printed circuit board 1, so that additional components can be added as in the first embodiment.
  • the vibration of the capacitor 3 can be prevented without being installed.
  • the stepped portion is formed by solder or a mounting component.
  • a conductive material such as a copper foil, a solder resist material, and an ink for silk printing used for circuit pattern formation in a printed circuit board manufacturing process.
  • the printing member may be used.
  • FIG. 7 is a cross-sectional view of printed circuit board 1 according to Embodiment 3 cut at a position corresponding to line AA in FIG. 7 that are the same as or equivalent to those in FIG. 2 are assigned the same reference numerals, and descriptions thereof are omitted.
  • a step is formed by the thickness of ink (silk material) for silk printing, which is a printing member used for printing characters or the like on the printed circuit board 1, and the silk portion is contacted with the contact surface 13 a of the step portion 13.
  • the contact surface 13a may have an annular shape having an outer peripheral portion that is substantially the same shape as the circular shape of the seating rubber 6, and may further form a slit portion 9 as shown in FIG. Further, the portion surrounded by the ring becomes a circular separation surface 13b.
  • FIG. 8 is a plan view showing the configuration of the printed circuit board 1 according to the third embodiment.
  • FIG. 9 is a cross-sectional view of printed circuit board 1 according to Embodiment 3 cut at a position corresponding to line AA in FIG. 8 and 9, the same or corresponding parts as those in FIGS. 1 to 3 are denoted by the same reference numerals and description thereof is omitted.
  • a step is formed by a depression formed by partially missing the copper foil part 14 and the resist part 15 formed in a layered manner on the surface of the printed circuit board 1.
  • the copper foil part 14 and the resist part 15 are printing members used for forming a circuit pattern.
  • a recess is formed by masking a part corresponding to the separation surface 16 b. .
  • the portion where the copper foil portion 14 and the resist portion 15 are printed is used as the contact surface 16a of the step portion 16, and the depression of the mask portion (surface exposed portion of the printed circuit board 1) is used as the separation surface 16b.
  • the outer diameter of the separation surface 16b is smaller than that of the outer edge portion 6a.
  • the stepped portion 16 may also be formed with a slit in a part of the contact surface 16a as in the case of FIG. FIG. 10 shows an example of the slit portion 9.
  • the contact surfaces 13a and 16a of the step portions 13 and 16 are formed by the printing member, or the depression formed in the printed circuit board 1 is separated from the step portion 16. Since it is used for the surface 16b, the vibration of the capacitor 3 can be prevented without installing additional parts as in the first and second embodiments.
  • FIG. 7 shows an example in which a step is formed by a silk material alone
  • FIGS. 8 and 9 show an example in which a step is formed by combining a copper foil and a resist material.
  • the step may be formed by using various printing members alone or in combination.
  • a step may be formed by overlapping solder on these printing members. Even in that case, it is obvious that the same anti-vibration effect can be obtained.
  • the capacitor 3 is described as an example of the electronic component to be mounted on the printed circuit board 1, but the present invention is not limited to this, and the electronic component having a seating surface on which a lead terminal protrudes. If it is.
  • the effect of the present invention is high in the case of a large component that has a large stress on the lead terminal due to vibration.
  • the contact surface of the stepped portion is formed in an annular shape and the separation surface is formed in a circular shape.
  • the present invention is not limited to this shape. What is necessary is just to form the level
  • the printed circuit board according to the present invention forms a stepped portion on the substrate to support the electronic components such as the capacitors and to dampen the vibration, so that the airbag on which the acceleration sensor is mounted on the same substrate. Suitable for use in control units.

Abstract

On the surface of a printed board (1) having a cylindrical capacitor (3) mounted thereon, a step portion (2) is formed by soldering, and the capacitor (3) is supported by having the higher contact surface (2a) in contact with the outer edge portion (6a) of a seating surface rubber (6).

Description

プリント基板および加速度検出装置Printed circuit board and acceleration detection device
　この発明は、コンデンサ等の電子部品の振動防止構造を備えたプリント基板、およびこのプリント基板を用いた加速度検出装置に関する。 The present invention relates to a printed circuit board having a structure for preventing vibration of electronic components such as capacitors, and an acceleration detection apparatus using the printed circuit board.
　車両等の移動体で、凹凸路等の悪路を走行する際の振動が直接かつ継続的に伝達される位置に電子機器を配置するケースでは、アルミ電解コンデンサのように高さのある部品を基板上に実装する場合、基板が振動するとコンデンサのリード端子にストレス（応力）が発生し、最悪の場合折損に至る可能性があった。そこで、例えば特許文献１のチップ型コンデンサは、コンデンサ素子を有底筒状の外装ケース内に収納して当該外装ケースの開放端からリード端子を導出すると共に封口部材により封口し、この封口部材または外装ケース端面に複数の突起部を設ける構成にしていた。このコンデンサを基板に実装すると、これら突起部が基板に当接してコンデンサの振動を抑制する。 In cases where the electronic equipment is placed at a position where vibrations when traveling on rough roads such as bumpy roads with a moving body such as a vehicle are directly and continuously transmitted, a tall component such as an aluminum electrolytic capacitor is not used. When mounting on a substrate, if the substrate vibrates, stress (stress) is generated in the lead terminal of the capacitor, and in the worst case, breakage may occur. Therefore, for example, in the chip type capacitor of Patent Document 1, the capacitor element is housed in a bottomed cylindrical outer case, the lead terminal is led out from the open end of the outer case, and sealed by a sealing member. A plurality of protrusions are provided on the end surface of the outer case. When this capacitor is mounted on the substrate, these protrusions abut against the substrate and suppress the vibration of the capacitor.
特開２００１－１０２２３９号公報JP 2001-102239 A
　このような従来の振動防止構造では、コンデンサ素子とは別に外装ケースが必要となり、価格が増大するという課題があった。また、外装ケースを装着することで、基板への実装面積が大きくなるという課題もあった。 Such a conventional anti-vibration structure requires an exterior case in addition to the capacitor element, which increases the price. In addition, there is a problem that the mounting area on the substrate is increased by attaching the outer case.
　他方、振動防止構造を設けずにコンデンサの振動を抑制するためには、コンデンサを実装した基板、または外装ケースと基板の当接部分に振動を吸収するためのダンパ機構等を設置する必要がある。しかしながら、特にエアバッグコントロールユニットのような、基板上に加速度センサを実装し加速度を検出する加速度検出装置では、上記ダンパ機構により振動が吸収され、実際に測定すべき加速度が基板に伝達されないという問題が発生するため、ダンパ機構を設置できない。よって、加速度センサとコンデンサを同一基板に実装するためには、基板が振動してもコンデンサは振動しないような構造が必要であった。 On the other hand, in order to suppress the vibration of the capacitor without providing a vibration prevention structure, it is necessary to install a damper mechanism or the like for absorbing the vibration on the substrate on which the capacitor is mounted or the contact portion between the outer case and the substrate. . However, particularly in an acceleration detection device that detects acceleration by mounting an acceleration sensor on a board, such as an airbag control unit, vibration is absorbed by the damper mechanism, and the acceleration to be actually measured is not transmitted to the board. Therefore, the damper mechanism cannot be installed. Therefore, in order to mount the acceleration sensor and the capacitor on the same substrate, a structure in which the capacitor does not vibrate even when the substrate vibrates is necessary.
　この発明は、上記のような課題を解決するためになされたもので、追加部品を用いることなく、プリント基板上に実装された電子部品の振動を防止することを目的とする。 The present invention has been made to solve the above-described problems, and an object thereof is to prevent vibration of an electronic component mounted on a printed circuit board without using an additional component.
　この発明に係るプリント基板は、電子部品の座面のリード端子より外縁部に当接する当接面、および該当接面より低く形成されて外縁部より中心側で離間する離間面からなる段差部を備えるものである。 The printed circuit board according to the present invention includes a stepped portion including a contact surface that contacts the outer edge portion from the lead terminal of the seating surface of the electronic component, and a separation surface that is formed lower than the corresponding contact surface and is separated from the outer edge portion on the center side. It is to be prepared.
　また、この発明に係る加速度検出装置は、電子部品の座面のリード端子より外縁部に当接する当接面、および該当接面より低く形成されて外縁部より中心側で離間する離間面からなる段差部を備えるプリント基板を用いるようにしたものである。 The acceleration detecting device according to the present invention includes a contact surface that contacts the outer edge portion from the lead terminal of the seating surface of the electronic component, and a separation surface that is formed lower than the corresponding contact surface and is separated from the outer edge portion on the center side. A printed circuit board provided with a step portion is used.
　この発明によれば、プリント基板に段差部を設けて電子部品の座面のリード端子より外側の外縁部に当接させ、外縁部より中心側は離間させるようにしたので、追加部品を用いることなく、プリント基板上に実装された電子部品の振動を防止することができる。
　また、このプリント基板が振動しても電子部品の振動は防止できるようにしたので、同一基板上に加速度センサを実装するような加速度検出装置に用いることができる。 According to the present invention, the step portion is provided on the printed circuit board so as to contact the outer edge portion outside the lead terminal of the seating surface of the electronic component, and the center side is separated from the outer edge portion. In addition, the vibration of the electronic component mounted on the printed circuit board can be prevented.
Further, since the vibration of the electronic component can be prevented even when the printed circuit board vibrates, it can be used for an acceleration detection device in which an acceleration sensor is mounted on the same substrate.
この発明の実施の形態１に係るプリント基板にコンデンサを実装した状態を示す外観斜視図である。It is an external appearance perspective view which shows the state which mounted the capacitor | condenser on the printed circuit board which concerns on Embodiment 1 of this invention. 実施の形態１に係るプリント基板を図１に示すＡＡ線に沿って切断した断面図である。It is sectional drawing which cut | disconnected the printed circuit board which concerns on Embodiment 1 along the AA line shown in FIG. 実施の形態１に係るプリント基板の構成を示す平面図である。2 is a plan view showing a configuration of a printed circuit board according to Embodiment 1. FIG. 実施の形態１に係るプリント基板の変形例を示す平面図である。6 is a plan view showing a modification of the printed circuit board according to Embodiment 1. FIG. この発明の実施の形態２に係るプリント基板の構成を示す平面図である。It is a top view which shows the structure of the printed circuit board concerning Embodiment 2 of this invention. 実施の形態２に係るプリント基板を、図１に示すＡＡ線に相当する位置で切断した断面図である。It is sectional drawing which cut | disconnected the printed circuit board which concerns on Embodiment 2 in the position corresponded to the AA line shown in FIG. この発明の実施の形態３に係るプリント基板を、図１に示すＡＡ線に相当する位置で切断した断面図である。It is sectional drawing which cut | disconnected the printed circuit board which concerns on Embodiment 3 of this invention in the position corresponded to the AA line shown in FIG. 実施の形態３に係るプリント基板の別の構成例を示す平面図である。12 is a plan view illustrating another configuration example of the printed circuit board according to Embodiment 3. FIG. 実施の形態３の別の構成例のプリント基板を、図１に示すＡＡ線に相当する位置で切断した断面図である。It is sectional drawing which cut | disconnected the printed circuit board of another structural example of Embodiment 3 in the position corresponded to the AA line shown in FIG. 実施の形態３に係るプリント基板の別の構成例の変形例を示す平面図である。10 is a plan view showing a modification of another configuration example of the printed circuit board according to Embodiment 3. FIG.
　以下、この発明をより詳細に説明するために、この発明を実施するための形態について、添付の図面に従って説明する。
実施の形態１．
　図１および図２に示すコンデンサ３は、通常、内部の電解液等を封止するためのゴム部材（座面ゴム６）を座面にしてプリント基板１に実装されるが、座面ゴム６の基板に接触する面を平面状に加工することが難しいため、コンデンサ３の姿勢が不安定で振動しやすい。そのため、座面ゴム６を貫通するように突設されたリード端子４にストレスが発生して折損しやすい。そこで、本実施の形態１では、図１～図３に示すように、プリント基板１に、コンデンサ３の座面ゴム６のリード端子４より外側の外縁部６ａに当接する当接面２ａと、この当接面２ａより低く形成されて座面ゴム６の中心側で離間する離間面２ｂとからなる段差部２を設ける。 Hereinafter, in order to explain the present invention in more detail, modes for carrying out the present invention will be described with reference to the accompanying drawings.
Embodiment 1 FIG.
The capacitor 3 shown in FIGS. 1 and 2 is normally mounted on the printed circuit board 1 with a rubber member (seat surface rubber 6) for sealing an internal electrolyte solution or the like as a seat surface. Since it is difficult to process the surface in contact with the substrate into a flat surface, the posture of the capacitor 3 is unstable and easily vibrates. For this reason, stress is easily generated in the lead terminal 4 protruding so as to penetrate the seating surface rubber 6 and is easily broken. Therefore, in the first embodiment, as shown in FIGS. 1 to 3, a contact surface 2 a that contacts the outer edge portion 6 a outside the lead terminal 4 of the seat rubber 6 of the capacitor 3 on the printed circuit board 1, A step portion 2 is formed which is formed lower than the contact surface 2a and is formed of a separation surface 2b which is separated from the center side of the seat rubber 6.
　本実施の形態１では段差部２をはんだにより形成する。
　プリント基板１には、段差部２の当接面２ａを形成するために、銅箔のランド部８（図２に示す）を形成する。円筒状のコンデンサ３は座面ゴム６も円形形状のため、ランド部８を、この円形形状と略同形の外周部を有する円環状にする。また、２本のリード端子４を挿入するためのスルーホール５を２つ形成する。続いて、リフロー工程等によりランド部８にはんだ付けを行って、このはんだの厚みにより段差を形成し、高い側を段差部２の当接面２ａ、低い側を段差部２の離間面２ｂとする。図３に示すように、当接面２ａが座面ゴム６の円形形状と略同形の外周部を有する円環状になり、この円環に囲まれた部分が円形形状の離間面２ｂとなる。
　続いて、はんだで形成された当接面２ａの上にコンデンサ３の座面ゴム６が当接するように、リード端子４をスルーホール５に挿入し、フローはんだ等によりはんだ部７を形成してプリント基板１にコンデンサ３を固定する。 In the first embodiment, the stepped portion 2 is formed by solder.
In order to form the contact surface 2 a of the stepped portion 2, a land portion 8 (shown in FIG. 2) made of copper foil is formed on the printed board 1. Since the cylindrical capacitor 3 has a circular seating rubber 6, the land portion 8 is formed in an annular shape having an outer peripheral portion substantially the same shape as the circular shape. Two through holes 5 for inserting the two lead terminals 4 are formed. Subsequently, the land portion 8 is soldered by a reflow process or the like, and a step is formed by the thickness of the solder. The higher side is the contact surface 2a of the step portion 2, and the lower side is the separation surface 2b of the step portion 2. To do. As shown in FIG. 3, the contact surface 2 a is an annular shape having an outer peripheral portion that is substantially the same shape as the circular shape of the seating rubber 6, and a portion surrounded by the annular shape is a circular separation surface 2 b.
Subsequently, the lead terminal 4 is inserted into the through hole 5 so that the seating rubber 6 of the capacitor 3 is in contact with the contact surface 2a formed of solder, and the solder portion 7 is formed by flow soldering or the like. A capacitor 3 is fixed to the printed circuit board 1.
　コンデンサ３がプリント基板１に実装された状態では、リード端子４がある座面ゴム６の中心部と離間面２ｂ（プリント基板１の表面）との間で間隙を形成し、当接面２ａが座面ゴム６のリード端子４より外側の外縁部６ａに当接して安定した状態に支持する。よって、プリント基板１が振動しても、コンデンサ３の振動を抑制することができ、リード端子４の折損を防止できる。
　なお、図示例では当接面２ａの外径を座面ゴム６の外径（図３に示す二点鎖線の外縁部６ａ）より大きくしたが、座面ゴム６の外径より小さくしてもよい。ただし、座面ゴム６をより外縁側で支持することにより、コンデンサ３がより振動しにくくなる。 In a state where the capacitor 3 is mounted on the printed circuit board 1, a gap is formed between the center portion of the seating surface rubber 6 where the lead terminal 4 is located and the separation surface 2b (the surface of the printed circuit board 1), and the contact surface 2a The seat rubber 6 is in contact with the outer edge 6a outside the lead terminal 4 and supported in a stable state. Therefore, even if the printed circuit board 1 vibrates, the vibration of the capacitor 3 can be suppressed and breakage of the lead terminal 4 can be prevented.
In the illustrated example, the outer diameter of the contact surface 2a is larger than the outer diameter of the seat rubber 6 (the outer edge 6a of the two-dot chain line shown in FIG. 3), but may be smaller than the outer diameter of the seat rubber 6. Good. However, the capacitor 3 is less likely to vibrate by supporting the seat rubber 6 on the outer edge side.
　この段差部２を形成するためのリフロー工程は、プリント基板１に実装部品を実装するためのリフロー工程を利用できるため、新たに工程を増やす必要がない。また、はんだを利用するため、従来のような外装ケース、ダンパ機構といった追加部品を設置する必要もない。 Since the reflow process for forming the stepped portion 2 can use the reflow process for mounting the mounting component on the printed circuit board 1, it is not necessary to newly increase the process. Moreover, since solder is used, there is no need to install additional parts such as a conventional outer case and a damper mechanism.
　また、プリント基板１にダンパ機構を設けずともコンデンサ３の振動を防止できるので、同一基板上に加速度センサを実装して、エアバッグコントロールユニット等の加速度検出装置に用いることもできる。 In addition, since the vibration of the capacitor 3 can be prevented without providing a damper mechanism on the printed circuit board 1, an acceleration sensor can be mounted on the same circuit board and used for an acceleration detection device such as an airbag control unit.
　以上より、実施の形態１によれば、座面ゴム６にリード端子４の突設されたコンデンサ３が実装されるプリント基板１に、座面ゴム６のリード端子４より外側の外縁部６ａに当接する当接面２ａ、および該当接面２ａより低く形成されて外縁部６ａより中心側で離間する離間面２ｂからなる段差部２を設ける構成にし、当接面２ａをはんだにより形成するようにした。これにより、プリント基板１に追加部品を設置することなく、コンデンサ３の振動を防止することができる。 As described above, according to the first embodiment, the printed circuit board 1 on which the capacitor 3 with the lead terminals 4 protruding from the seat rubber 6 is mounted on the outer edge portion 6 a outside the lead terminals 4 of the seat rubber 6. The contact surface 2a to be contacted and the stepped portion 2 formed to be lower than the corresponding contact surface 2a and separated from the outer edge portion 6a on the center side are provided, and the contact surface 2a is formed by solder. did. Thereby, the vibration of the capacitor 3 can be prevented without installing additional components on the printed circuit board 1.
　なお、上記実施の形態１では当接面２ａを切れ目のない円環状にしたが、一部にスリットを形成してもよい。
　図４は、実施の形態１に係るプリント基板１の変形例を示す平面図であり、当接面２ａに２箇所のスリット部９を形成している。この構成により、スルーホール５の通気性を向上させて、はんだ上がりを良くする効果がある。ただし、コンデンサ（不図示）は２つのスルーホール５を結ぶ線に直交する方向（矢印Ｂの方向）に振動しやすいので、その方向に当接面２ａを設けてコンデンサを支持することが好ましい。そこで、図示例ではスリット部９を２つのスルーホール５を結ぶ線上に形成して、振動防止効果が軽減しないようにしている。 In the first embodiment, the contact surface 2a is formed in a continuous annular shape, but a slit may be formed in a part thereof.
FIG. 4 is a plan view showing a modified example of the printed circuit board 1 according to Embodiment 1, in which two slit portions 9 are formed on the contact surface 2a. With this configuration, there is an effect of improving the air permeability of the through hole 5 and improving the soldering. However, since the capacitor (not shown) is likely to vibrate in the direction perpendicular to the line connecting the two through holes 5 (the direction of arrow B), it is preferable to provide the contact surface 2a in that direction to support the capacitor. Therefore, in the illustrated example, the slit portion 9 is formed on the line connecting the two through holes 5 so that the vibration preventing effect is not reduced.
実施の形態２．
　上記実施の形態１では段差部をはんだにより形成したが、実装部品（チップ部品、例えば抵抗）により形成してもよい。
　図５は、実施の形態２に係るプリント基板１の構成を示す平面図である。図６は、実施の形態２に係るプリント基板１を図１のＡＡ線に相当する位置で切断した断面図である。図のように、２つの実装部品１０により段差を形成する。なお、図５および図６において図１～図２と同一または相当の部分については同一の符号を付し説明を省略する。 Embodiment 2. FIG.
In the first embodiment, the step portion is formed by solder, but may be formed by a mounting component (chip component, for example, a resistor).
FIG. 5 is a plan view showing the configuration of the printed circuit board 1 according to the second embodiment. FIG. 6 is a cross-sectional view of the printed circuit board 1 according to Embodiment 2 cut at a position corresponding to the line AA in FIG. As shown in the figure, a step is formed by two mounting components 10. 5 and 6, the same or corresponding parts as those in FIGS. 1 and 2 are denoted by the same reference numerals and description thereof is omitted.
　図５に示すように、段差部となる２つの実装部品１０を実装するための実装部品用ランド部１１を４箇所、プリント基板１に形成する。なお、振動防止の効果を高めるために、これら実装部品用ランド部１１を、コンデンサ３の座面ゴム６の外縁部６ａと当接する位置であって、２つのスルーホール５を結ぶ線に直交する方向に形成することが好ましい。
　続いて、図６に示すように、リフロー工程等によりはんだ付けを行って実装部品用はんだ部１２を形成し、実装部品１０をプリント基板１に固定する。そして、実装部品１０の上にコンデンサ３の座面ゴム６が当接するように、リード端子４をスルーホール５に挿入し、フローはんだ等によりはんだ部７を形成してプリント基板１にコンデンサ３を固定する。 As shown in FIG. 5, four mounting component land portions 11 for mounting two mounting components 10 to be stepped portions are formed on the printed circuit board 1. In order to enhance the effect of preventing vibrations, these mounting component land portions 11 are in positions where they abut against the outer edge portion 6 a of the seating surface rubber 6 of the capacitor 3 and are orthogonal to the line connecting the two through holes 5. It is preferable to form in the direction.
Subsequently, as shown in FIG. 6, soldering is performed by a reflow process or the like to form a mounting component solder portion 12, and the mounting component 10 is fixed to the printed circuit board 1. Then, the lead terminal 4 is inserted into the through hole 5 so that the seating rubber 6 of the capacitor 3 abuts on the mounted component 10, and the solder portion 7 is formed by flow soldering or the like, and the capacitor 3 is attached to the printed circuit board 1. Fix it.
　実装部品１０同士を隙間を空けて配置するので、スルーホール５の通気性を向上させてはんだ上がりを良くすることができる。また、実装部品１０を実装するリフロー工程は、プリント基板１に他の実装部品を実装するためのリフロー工程を利用できるため、新たに工程を増やす必要がない。さらに、実装部品１０としては、回路構成に必要な実装部品を利用するようにしてもよく、この場合には追加部品が不要である。 Since the mounting components 10 are arranged with a gap between them, the air permeability of the through hole 5 can be improved and soldering can be improved. Moreover, since the reflow process for mounting the mounting component 10 can use a reflow process for mounting another mounting component on the printed circuit board 1, it is not necessary to newly increase the number of processes. Further, as the mounting component 10, a mounting component necessary for the circuit configuration may be used. In this case, no additional component is required.
　コンデンサ３がプリント基板１に実装された状態では、プリント基板１の表面がリード端子４のある座面ゴム６の中心部から離間する離間面になり、この離間面より高さのある実装部品１０の天面が座面ゴム６の外縁部６ａに当接する当接面になって、コンデンサ３をプリント基板１に対して安定した状態に支持して振動を抑制する。 In a state where the capacitor 3 is mounted on the printed circuit board 1, the surface of the printed circuit board 1 becomes a separation surface separated from the center portion of the seating surface rubber 6 with the lead terminals 4, and the mounting component 10 having a height higher than the separation surface. The top surface is a contact surface that contacts the outer edge portion 6a of the seat rubber 6, and the capacitor 3 is supported in a stable state with respect to the printed circuit board 1 to suppress vibration.
　なお、実装部品１０の配置数および配置位置は図５の例に限定されるものではなく、任意でよい。また、実装部品１０を座面ゴム６の外径に相当する円周上（図５に示す二点鎖線の外縁部６ａ）に配置したが、この円周より内側に配置して、当接面が外縁部６ａより中心側にくるように構成してもよい。ただし、上記実施の形態１でも説明したように、座面ゴム６をより外縁側で支持することにより、コンデンサ３がより振動しにくくなる。 In addition, the arrangement number and arrangement position of the mounting component 10 are not limited to the example of FIG. 5, and may be arbitrary. Further, the mounting component 10 is arranged on the circumference corresponding to the outer diameter of the seat rubber 6 (the outer edge portion 6a of the two-dot chain line shown in FIG. 5). You may comprise so that may come to the center side from the outer edge part 6a. However, as described in the first embodiment, the capacitor 3 is less likely to vibrate by supporting the seat rubber 6 on the outer edge side.
　以上より、実施の形態２によれば、段差部の当接面を、プリント基板１の上に実装される実装部品１０により形成するようにしたので、上記実施の形態１と同様に追加部品を設置することなく、コンデンサ３の振動を防止することができる。 As described above, according to the second embodiment, the contact surface of the stepped portion is formed by the mounting component 10 mounted on the printed circuit board 1, so that additional components can be added as in the first embodiment. The vibration of the capacitor 3 can be prevented without being installed.
実施の形態３．
　上記実施の形態１，２では段差部をはんだまたは実装部品により形成したが、プリント基板の製造工程において回路パターン形成に用いられる銅箔等の導電材、ソルダレジスト材、およびシルク印刷用のインク等、印刷部材により形成してもよい。 Embodiment 3 FIG.
In the first and second embodiments, the stepped portion is formed by solder or a mounting component. However, a conductive material such as a copper foil, a solder resist material, and an ink for silk printing used for circuit pattern formation in a printed circuit board manufacturing process. The printing member may be used.
　図７は、実施の形態３に係るプリント基板１を、図１のＡＡ線に相当する位置で切断した断面図である。なお、図７において図２と同一または相当の部分については同一の符号を付し説明を省略する。
　この例では、プリント基板１に文字等を印字するために用いる印刷部材である、シルク印刷用のインク（シルク材）の厚みにより段差を形成し、シルク部を段差部１３の当接面１３ａとする。この当接面１３ａは、図３に示すように、座面ゴム６の円形形状と略同形の外周部を有する円環状にし、さらに図４に示すようなスリット部９を形成してもよい。また、この円環に囲まれた部分が円形形状の離間面１３ｂとなる。 FIG. 7 is a cross-sectional view of printed circuit board 1 according to Embodiment 3 cut at a position corresponding to line AA in FIG. 7 that are the same as or equivalent to those in FIG. 2 are assigned the same reference numerals, and descriptions thereof are omitted.
In this example, a step is formed by the thickness of ink (silk material) for silk printing, which is a printing member used for printing characters or the like on the printed circuit board 1, and the silk portion is contacted with the contact surface 13 a of the step portion 13. To do. As shown in FIG. 3, the contact surface 13a may have an annular shape having an outer peripheral portion that is substantially the same shape as the circular shape of the seating rubber 6, and may further form a slit portion 9 as shown in FIG. Further, the portion surrounded by the ring becomes a circular separation surface 13b.
　図８は、実施の形態３に係るプリント基板１の構成を示す平面図である。図９は、実施の形態３に係るプリント基板１を、図１のＡＡ線に相当する位置で切断した断面図である。なお、図８および図９において、図１～図３と同一または相当の部分については同一の符号を付し説明を省略する。
　この例では、プリント基板１の表面に層状に形成された銅箔部１４およびレジスト部１５が部分的に欠落して出来た窪みにより段差を形成する。銅箔部１４およびレジスト部１５は回路パターンを形成するために用いる印刷部材であり、例えば、プリント基板１の表面に印刷する際に離間面１６ｂに相当する部分にマスクをして窪みを形成する。そして、銅箔部１４およびレジスト部１５が印刷された部分を段差部１６の当接面１６ａにし、マスク部分の窪み（プリント基板１の表面露出部分）を離間面１６ｂにする。この離間面１６ｂの外径は、外縁部６ａより小径にする。
　また、この段差部１６についても、図４の場合と同様に、当接面１６ａの一部にスリットを形成してもよい。図１０にスリット部９の一例を示す。 FIG. 8 is a plan view showing the configuration of the printed circuit board 1 according to the third embodiment. FIG. 9 is a cross-sectional view of printed circuit board 1 according to Embodiment 3 cut at a position corresponding to line AA in FIG. 8 and 9, the same or corresponding parts as those in FIGS. 1 to 3 are denoted by the same reference numerals and description thereof is omitted.
In this example, a step is formed by a depression formed by partially missing the copper foil part 14 and the resist part 15 formed in a layered manner on the surface of the printed circuit board 1. The copper foil part 14 and the resist part 15 are printing members used for forming a circuit pattern. For example, when printing on the surface of the printed circuit board 1, a recess is formed by masking a part corresponding to the separation surface 16 b. . Then, the portion where the copper foil portion 14 and the resist portion 15 are printed is used as the contact surface 16a of the step portion 16, and the depression of the mask portion (surface exposed portion of the printed circuit board 1) is used as the separation surface 16b. The outer diameter of the separation surface 16b is smaller than that of the outer edge portion 6a.
Further, the stepped portion 16 may also be formed with a slit in a part of the contact surface 16a as in the case of FIG. FIG. 10 shows an example of the slit portion 9.
　図７の場合、ならびに図８および図９の場合とも、コンデンサ３がプリント基板１に実装された状態では、座面ゴム６の中心部と離間面１３ｂ，１６ｂとの間で間隙を形成し、印刷部材により形成した当接面１３ａ，１６ａが座面ゴム６のリード端子４より外側の外縁部６ａに当接することとなり、コンデンサ３をプリント基板１に対して安定した状態に支持できると共に、振動を抑制することができる。また、新たな工程を増やす必要がなく、追加部品を設置する必要もない。 In the case of FIG. 7 and also in FIGS. 8 and 9, when the capacitor 3 is mounted on the printed circuit board 1, a gap is formed between the center portion of the seating rubber 6 and the separation surfaces 13 b and 16 b, The contact surfaces 13a and 16a formed by the printing member are in contact with the outer edge portion 6a outside the lead terminal 4 of the seating rubber 6 so that the capacitor 3 can be supported in a stable state with respect to the printed circuit board 1 and vibrations are generated. Can be suppressed. Moreover, there is no need to add new processes and no additional parts need to be installed.
　以上より、実施の形態３によれば、段差部１３，１６の当接面１３ａ，１６ａを印刷部材により形成するようにしたので、または、プリント基板１に形成された窪みを段差部１６の離間面１６ｂに用いるようにしたので、上記実施の形態１，２と同様に追加部品を設置することなく、コンデンサ３の振動を防止することができる。 As described above, according to the third embodiment, the contact surfaces 13a and 16a of the step portions 13 and 16 are formed by the printing member, or the depression formed in the printed circuit board 1 is separated from the step portion 16. Since it is used for the surface 16b, the vibration of the capacitor 3 can be prevented without installing additional parts as in the first and second embodiments.
　また、上記実施の形態３において、図７ではシルク材単独で段差を形成し、図８および図９では銅箔とレジスト材を組み合わせて段差を形成する例を示したが、これらに限定されるものではなく、様々な印刷部材を単独または組み合わせて段差を形成してもよい。さらに、これらの印刷部材にはんだを重ねて段差を形成してもよい。その場合にも上記同様の防振効果が得られることは自明である。 In the third embodiment, FIG. 7 shows an example in which a step is formed by a silk material alone, and FIGS. 8 and 9 show an example in which a step is formed by combining a copper foil and a resist material. The step may be formed by using various printing members alone or in combination. Furthermore, a step may be formed by overlapping solder on these printing members. Even in that case, it is obvious that the same anti-vibration effect can be obtained.
　また、上記実施の形態１～３ではプリント基板１に実装する電子部品の一例としてコンデンサ３を挙げたが、これに限定されるものではなく、リード端子が突設された座面を有する電子部品であればよい。特に、振動によるリード端子へのストレスが大きい大型部品の場合に本発明の効果が高い。また、図示例では、座面ゴム６の形状に合わせるために、段差部の当接面を円環状にすると共に離間面を円形形状にしたが、この形状に限定されるものではなく、電子部品の座面形状に合わせた形状の段差部を形成すればよい。 In the first to third embodiments, the capacitor 3 is described as an example of the electronic component to be mounted on the printed circuit board 1, but the present invention is not limited to this, and the electronic component having a seating surface on which a lead terminal protrudes. If it is. In particular, the effect of the present invention is high in the case of a large component that has a large stress on the lead terminal due to vibration. Further, in the illustrated example, in order to match the shape of the seat rubber 6, the contact surface of the stepped portion is formed in an annular shape and the separation surface is formed in a circular shape. However, the present invention is not limited to this shape. What is necessary is just to form the level | step-difference part of the shape match | combined with the shape of this seating surface.
　上記以外にも、本願発明はその発明の範囲内において、各実施の形態の自由な組み合わせ、あるいは各実施の形態の任意の構成要素の変形、もしくは各実施の形態において任意の構成要素の省略が可能である。 In addition to the above, within the scope of the invention, the invention of the present application can be freely combined with each embodiment, modified any component of each embodiment, or omitted any component in each embodiment. Is possible.
　以上のように、この発明に係るプリント基板は、基板上に段差部を形成してコンデンサなどの電子部品を支持し防振するようにしたので、同一基板上に加速度センサが実装されるエアバッグコントロールユニットなどに用いるのに適している。 As described above, the printed circuit board according to the present invention forms a stepped portion on the substrate to support the electronic components such as the capacitors and to dampen the vibration, so that the airbag on which the acceleration sensor is mounted on the same substrate. Suitable for use in control units.
　１　プリント基板、２，１３，１６　段差部、２ａ，１３ａ，１６ａ　当接面、２ｂ，１３ｂ，１６ｂ　離間面、３　コンデンサ（電子部品）、４　リード端子、５　スルーホール、６　座面ゴム（座面）、６ａ　外縁部、７　はんだ部、８　ランド部、９　スリット部、１０　実装部品（段差部）、１１　実装部品用ランド部、１２　実装部品用はんだ部、１４　銅箔部（印刷部材）、１５　レジスト部（印刷部材）。 1 printed circuit board, 2, 13, 16 stepped part, 2a, 13a, 16a contact surface, 2b, 13b, 16b separation surface, 3 capacitor (electronic component), 4 lead terminal, 5 through hole, 6 seat rubber (seat) Surface), 6a outer edge part, 7 solder part, 8 land part, 9 slit part, 10 mounting part (step part), 11 mounting part land part, 12 mounting part solder part, 14 copper foil part (printing member), 15 Resist section (printing member).

Claims (9)

  1. 　座面にリード端子の突設された電子部品が実装されるプリント基板において、前記座面の前記リード端子より外縁部に当接する当接面、および該当接面より低く形成されて前記外縁部より中心側で離間する離間面からなる段差部を備えることを特徴とするプリント基板。 In a printed circuit board on which an electronic component having a lead terminal projecting is mounted on a seating surface, a contact surface that contacts the outer edge portion of the seat surface from the lead terminal, and a lower surface than the corresponding contact surface. A printed circuit board comprising a stepped portion formed of a separation surface separated on the center side.
  2. 　前記段差部の当接面は、プリント基板上にはんだにより形成されることを特徴とする請求項１記載のプリント基板。 The printed circuit board according to claim 1, wherein the contact surface of the stepped portion is formed on the printed circuit board by solder.
  3. 　前記段差部の当接面は、プリント基板上に印刷部材により形成されることを特徴とする請求項１記載のプリント基板。 The printed circuit board according to claim 1, wherein the contact surface of the stepped portion is formed by a printing member on the printed circuit board.
  4. 　前記段差部の当接面は、プリント基板上の実装部品により形成されることを特徴とする請求項１記載のプリント基板。 The printed circuit board according to claim 1, wherein the contact surface of the stepped portion is formed by a mounting component on the printed circuit board.
  5. 　前記段差部の当接面は、円形の前記座面の外縁部と略同形の外周部を有する円環状であることを特徴とする請求項１記載のプリント基板。 2. The printed circuit board according to claim 1, wherein the contact surface of the stepped portion is an annular shape having an outer peripheral portion substantially the same shape as the outer edge portion of the circular seating surface.
  6. 　前記段差部の離間面は、プリント基板上に形成された窪みであることを特徴とする請求項１記載のプリント基板。 The printed circuit board according to claim 1, wherein the separation surface of the stepped portion is a depression formed on the printed circuit board.
  7. 　前記段差部の当接面の一部にスリットが形成されることを特徴とする請求項１記載のプリント基板。 The printed circuit board according to claim 1, wherein a slit is formed in a part of the contact surface of the stepped portion.
  8. 　前記電子部品はコンデンサであることを特徴とする請求項１記載のプリント基板。 The printed circuit board according to claim 1, wherein the electronic component is a capacitor.
  9. 　加速度センサ、および座面にリード端子の突設された電子部品がそれぞれ実装されたプリント基板であって、前記電子部品の座面のリード端子より外縁部に当接する当接面、および該当接面より低く形成されて前記外縁部より中心側で離間する離間面からなる段差部を備えるプリント基板を用いた加速度検出装置。 A printed circuit board on which an acceleration sensor and an electronic component having a lead terminal projecting on the seat surface are mounted, and a contact surface that contacts an outer edge portion of the lead terminal of the seat surface of the electronic component, and the corresponding contact surface An acceleration detection device using a printed circuit board comprising a stepped portion formed of a separation surface formed lower and spaced apart from the outer edge on the center side.
PCT/JP2011/000224 2011-01-18 2011-01-18 Printed board and acceleration detection apparatus WO2012098573A1 (en)

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