JP4777097B2 - Shield case for electronic circuit - Google Patents

Shield case for electronic circuit Download PDF

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Publication number
JP4777097B2
JP4777097B2 JP2006059978A JP2006059978A JP4777097B2 JP 4777097 B2 JP4777097 B2 JP 4777097B2 JP 2006059978 A JP2006059978 A JP 2006059978A JP 2006059978 A JP2006059978 A JP 2006059978A JP 4777097 B2 JP4777097 B2 JP 4777097B2
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partition
frame
circuit board
printed circuit
cover
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JP2007242725A (en
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治文 横山
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Hitachi Kokusai Electric Inc
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Description

本発明は通信機器等の電子機器のシールドケースに関するものである。   The present invention relates to a shield case for electronic equipment such as communication equipment.

通信機器の電子回路では、外部からのノイズ、或は内部で発生するノイズによる、エラー発生、或は信号品質の低下を防止する為、電子回路にはシールドケースが設けられ、ノイズの遮断が行われている。   In the electronic circuit of communication equipment, a shield case is provided in the electronic circuit to prevent noise from being generated due to external noise or noise generated internally, or signal quality degradation. It has been broken.

従来の電子回路のシールドケースについて図６、図７により説明する。   A conventional shield case for an electronic circuit will be described with reference to FIGS.

図６、図７に於いて、１はプリント基板、２は台座、３は仕切フレーム、４は仕切カバーを示し、前記台座２、前記仕切フレーム３は切削用アルミニウム若しくはアルミニウムのダイカスト製であり、前記仕切カバー４はアルミ板製である。前記台座２、前記仕切フレーム３、前記仕切カバー４によってシールドケース５が構成されている。   6 and 7, 1 is a printed circuit board, 2 is a base, 3 is a partition frame, 4 is a partition cover, and the base 2 and the partition frame 3 are made of cutting aluminum or aluminum die-casting, The partition cover 4 is made of an aluminum plate. The pedestal 2, the partition frame 3, and the partition cover 4 constitute a shield case 5.

前記プリント基板１の図６中で下面に配置された前記台座２は、前記プリント基板１を挿通する台座固定螺子６によって螺着され、該台座固定螺子６は前記仕切フレーム３と干渉しない様に配置されている。   The pedestal 2 disposed on the lower surface of the printed circuit board 1 in FIG. 6 is screwed by a pedestal fixing screw 6 that passes through the printed circuit board 1, so that the pedestal fixing screw 6 does not interfere with the partition frame 3. Has been placed.

図８、図９は、前記仕切フレーム３を示しており、該仕切フレーム３は矩形の外枠７と該外枠７の内部をシールドすべき回路毎に仕切る仕切枠８によって構成され、前記仕切フレーム３の下面の位置には舌片９が突設され、該舌片９には通孔１１が穿設されている。   8 and 9 show the partition frame 3. The partition frame 3 includes a rectangular outer frame 7 and a partition frame 8 that partitions the inside of the outer frame 7 for each circuit to be shielded. A tongue piece 9 projects from the lower surface of the frame 3, and a through hole 11 is formed in the tongue piece 9.

又、前記仕切フレーム３の上面の位置には、舌片１２が突設され、該舌片１２には螺子孔１３が穿設され、前記舌片９と前記舌片１２とは、平面位置（図８上）で重ならない様に位置がずらされている。   Further, a tongue piece 12 projects from the position of the upper surface of the partition frame 3, and a screw hole 13 is formed in the tongue piece 12, and the tongue piece 9 and the tongue piece 12 are in a planar position ( The position is shifted so as not to overlap in FIG.

前記仕切フレーム３を前記プリント基板１に取付ける場合、前記仕切フレーム３を前記プリント基板１の上面に設置し、フレーム取付け螺子１４を前記通孔１１及び前記プリント基板１に挿通させ、前記台座２に螺着する。又、前記仕切カバー４を前記仕切フレーム３に取付ける場合は、カバー取付け螺子１５を前記仕切カバー４に挿通して、前記螺子孔１３に螺着する。   When attaching the partition frame 3 to the printed circuit board 1, the partition frame 3 is installed on the upper surface of the printed circuit board 1, and a frame mounting screw 14 is inserted through the through hole 11 and the printed circuit board 1, Screw it on. When the partition cover 4 is attached to the partition frame 3, a cover attachment screw 15 is inserted through the partition cover 4 and screwed into the screw hole 13.

図６中、ａは台座固定螺子６を示し、ｂはフレーム取付け螺子１４、ｃはカバー取付け螺子１５を示しており、それぞれが干渉しない様になっている。   In FIG. 6, a indicates the base fixing screw 6, b indicates the frame mounting screw 14, and c indicates the cover mounting screw 15 so that they do not interfere with each other.

尚、前記仕切フレーム３の前記外枠７、前記仕切枠８の上下両面にはガスケット用溝１６が連続して刻設されており、高度のシール性が要求される場合は、前記ガスケット用溝１６に電導性ガスケット（図示せず）が装填され、前記仕切フレーム３と前記プリント基板１に形成されたグランドパターンとの電気的接触、前記仕切フレーム３と前記仕切カバー４との電気的接触を確実としている。   Note that gasket grooves 16 are continuously engraved on the upper and lower surfaces of the outer frame 7 and the partition frame 8 of the partition frame 3, and the gasket grooves are required when a high degree of sealing performance is required. 16 is filled with a conductive gasket (not shown), and electrical contact between the partition frame 3 and the ground pattern formed on the printed circuit board 1 and electrical contact between the partition frame 3 and the partition cover 4 are performed. I am sure.

上記従来の電子回路のシールドケースに於いて、前記仕切フレーム３には前記舌片９、前記舌片１２がそれぞれ形成され、前記舌片９には前記通孔１１が、前記舌片１２には前記螺子孔１３が穿設される構造であり、前記通孔１１の加工工程、前記螺子孔１３の加工工程は別工程となり、而も前記通孔１１の加工は下面から、前記螺子孔１３の加工は上面からとなり、各加工工程毎に前記仕切フレーム３を加工機に再セットしなければならず、加工工程が多く、又時間の掛かる作業となっており、製作コスト増大の要因となっていた。   In the shield case of the conventional electronic circuit, the tongue frame 9 and the tongue piece 12 are respectively formed on the partition frame 3, the through hole 11 is formed in the tongue piece 9, and the tongue piece 12 is formed on the tongue piece 12. The screw hole 13 is perforated, and the processing step of the through hole 11 and the processing step of the screw hole 13 are separate steps. The processing of the through hole 11 is performed from the bottom surface of the screw hole 13. Processing starts from the top surface, and the partition frame 3 must be reset on the processing machine for each processing step, which requires many processing steps and takes time. This causes an increase in production cost. It was.

尚、基板に取付ける電子回路のシールドケースとしては特許文献１に示されるものがある。   In addition, there exists a thing shown by patent document 1 as a shield case of the electronic circuit attached to a board | substrate.

特開２００４−１５８６２９号公報JP 2004-158629 A

本発明は斯かる実情に鑑み、電子回路のシールドケースの加工工程の減少、加工時間の短縮を図り、製作コストの低減を図るものである。   In view of such circumstances, the present invention aims to reduce the manufacturing process of the shield case of the electronic circuit, reduce the processing time, and reduce the manufacturing cost.

本発明は、プリント基板に取付けられるシールドケースが少なくとも台座、仕切フレーム、仕切カバーによって構成され、前記プリント基板の下面に前記台座が前記プリント基板の上面から螺子止めされ、該プリント基板の上面に配置された前記仕切フレームが、該仕切フレームの上面から該仕切フレーム、前記プリント基板を貫通するフレーム取付け螺子により前記台座に螺着され、前記仕切フレームの上面に配置された前記仕切カバーが、該仕切カバーの上面から該仕切カバー、前記仕切フレーム、前記プリント基板を貫通するカバー取付け螺子により前記台座に螺着した電子回路のシールドケースに係るものである。   In the present invention, a shield case attached to a printed circuit board is constituted by at least a pedestal, a partition frame, and a partition cover, and the pedestal is screwed to the lower surface of the printed circuit board from the upper surface of the printed circuit board and disposed on the upper surface of the printed circuit board The partition frame is screwed to the pedestal by a frame mounting screw that penetrates the partition frame and the printed circuit board from the upper surface of the partition frame, and the partition cover disposed on the upper surface of the partition frame includes the partition frame. The present invention relates to a shield case for an electronic circuit that is screwed to the pedestal by a cover mounting screw that penetrates the partition cover, the partition frame, and the printed board from the upper surface of the cover.

本発明によれば、プリント基板に取付けられるシールドケースが少なくとも台座、仕切フレーム、仕切カバーによって構成され、前記プリント基板の下面に前記台座が前記プリント基板の上面から螺子止めされ、該プリント基板の上面に配置された前記仕切フレームが、該仕切フレームの上面から該仕切フレーム、前記プリント基板を貫通するフレーム取付け螺子により前記台座に螺着され、前記仕切フレームの上面に配置された前記仕切カバーが、該仕切カバーの上面から該仕切カバー、前記仕切フレーム、前記プリント基板を貫通するカバー取付け螺子により前記台座に螺着したので、前記仕切フレームには螺子加工をする必要がなく、加工工程が少なくなり、製作コストが低減するという優れた効果を発揮する。   According to the present invention, the shield case attached to the printed circuit board includes at least a pedestal, a partition frame, and a partition cover, and the pedestal is screwed to the lower surface of the printed circuit board from the upper surface of the printed circuit board. The partition frame arranged on the top of the partition frame is screwed to the pedestal by a frame mounting screw that penetrates the partition frame and the printed board, and the partition cover arranged on the top surface of the partition frame includes: Since the partition cover, the partition frame, and a cover mounting screw that penetrates the printed circuit board are screwed to the base from the upper surface of the partition cover, the partition frame does not need to be threaded and processing steps are reduced. The excellent effect of reducing the production cost is exhibited.

以下、図面を参照しつつ本発明を実施する為の最良の形態を説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

図１〜図５に於いて、図６〜図９に示したものと同等のものには同符号を付してある。   1 to 5, the same components as those shown in FIGS. 6 to 9 are denoted by the same reference numerals.

図３、図４は、仕切フレーム３を示しており、該仕切フレーム３は、外枠７と仕切枠８で構成され、前記外枠７、前記仕切枠８の上下両面にはガスケット用溝１６が形成され、前記仕切枠８の下面には、プリント基板１に形成されたパターンと干渉しない様に、逃げ溝１７が形成されている。   3 and 4 show the partition frame 3. The partition frame 3 includes an outer frame 7 and a partition frame 8. Gasket grooves 16 are formed on the upper and lower surfaces of the outer frame 7 and the partition frame 8. FIG. A relief groove 17 is formed on the lower surface of the partition frame 8 so as not to interfere with the pattern formed on the printed circuit board 1.

又、前記外枠７、前記仕切枠８の所要位置にはボス部１９、ボス部２１が形成されており、前記ボス部１９、前記ボス部２１は前記外枠７、前記仕切枠８と同じ厚みとなっている。   Further, a boss portion 19 and a boss portion 21 are formed at required positions of the outer frame 7 and the partition frame 8, and the boss portion 19 and the boss portion 21 are the same as the outer frame 7 and the partition frame 8. It is thick.

前記ボス部１９、前記ボス部２１には螺子貫通孔２２が穿設されている。又、前記ボス部１９は角を有する形状に、又前記ボス部２１は丸みを帯びた形状となっている。   The boss portion 19 and the boss portion 21 are formed with screw through holes 22. The boss portion 19 has a corner shape, and the boss portion 21 has a rounded shape.

前記外枠７は、好ましくはダイカストアルミ製とし、前記ガスケット用溝１６、前記螺子貫通孔２２も一体成型であることが好ましい。   The outer frame 7 is preferably made of die-cast aluminum, and the gasket groove 16 and the screw through hole 22 are preferably integrally formed.

前記プリント基板１には後述する台座固定螺子６用の通孔、前記ボス部１９、前記ボス部２１の前記螺子貫通孔２２と対応する位置にはそれぞれ通孔が穿設されている。又、台座２には全ての通孔に対応する位置に螺子孔（図示せず）が穿設されている。   The printed circuit board 1 has through holes at positions corresponding to the through holes for a base fixing screw 6 described later, the boss portion 19, and the screw through hole 22 of the boss portion 21. In addition, screw holes (not shown) are formed in the base 2 at positions corresponding to all the through holes.

前記仕切フレーム３の上面に取付けられる仕切カバー４の所要位置の角部（図中では３箇所）は面取り２３が加工され、前記ボス部１９の螺子貫通孔２２と対応する位置には逃げ孔２４が穿設され、前記ボス部２１の螺子貫通孔２２と対応する位置には螺子通孔（図示せず）が穿設されている。   Chamfers 23 are machined at corners (three locations in the figure) of required positions of the partition cover 4 attached to the upper surface of the partition frame 3, and clearance holes 24 are formed at positions corresponding to the screw through holes 22 of the boss portion 19. Are formed, and screw through holes (not shown) are formed at positions corresponding to the screw through holes 22 of the boss portion 21.

前記台座２は前記プリント基板１の下面に配置され、該プリント基板１に挿通された台座固定螺子６が前記台座２に螺着され、該台座２が前記プリント基板１に固定される。前記台座固定螺子６は、前記外枠７、前記仕切枠８と干渉しない位置に設定される（図５参照）。   The pedestal 2 is disposed on the lower surface of the printed circuit board 1, and a pedestal fixing screw 6 inserted through the printed circuit board 1 is screwed to the pedestal 2, and the pedestal 2 is fixed to the printed circuit board 1. The base fixing screw 6 is set at a position where it does not interfere with the outer frame 7 and the partition frame 8 (see FIG. 5).

前記仕切フレーム３を前記プリント基板１に固定する場合は、前記仕切フレーム３を前記プリント基板１の上面に設置し、前記ボス部１９の螺子貫通孔２２にフレーム取付け螺子１４を挿通して前記台座２に螺着する。尚、前記フレーム取付け螺子１４で固定する位置は、前記ボス部１９が角を有するので、容易に判断可能である。   When the partition frame 3 is fixed to the printed circuit board 1, the partition frame 3 is installed on the upper surface of the printed circuit board 1, and the frame mounting screw 14 is inserted into the screw through hole 22 of the boss portion 19. Screw onto 2. The position fixed by the frame mounting screw 14 can be easily determined because the boss portion 19 has a corner.

又、前記仕切カバー４を前記仕切フレーム３に取付ける場合は、該仕切フレーム３の上面に前記仕切カバー４を設置し、前記ボス部２１の螺子貫通孔２２（即ち、明きとなっている全ての通孔）にカバー取付け螺子１５を挿通して、前記台座２に螺着する。   When the partition cover 4 is attached to the partition frame 3, the partition cover 4 is installed on the upper surface of the partition frame 3, and the screw through-holes 22 of the boss portion 21 (that is, all the lighted holes are clear). The cover mounting screws 15 are inserted into the through holes) and screwed to the base 2.

前記仕切カバー４には、前記面取り２３、前記逃げ孔２４が形成されているので、先に取付けたフレーム取付け螺子１４は前記仕切カバー４と干渉することはない。   Since the chamfer 23 and the escape hole 24 are formed in the partition cover 4, the frame mounting screw 14 attached in advance does not interfere with the partition cover 4.

前記仕切カバー４が前記仕切フレーム３に固定され、前記プリント基板１にシールドケース５が取付けられる。尚、該シールドケース５に高いシールド効果が求められる場合は、前記ガスケット用溝１６に電導性ガスケットを装填し、前記プリント基板１と前記仕切フレーム３、該仕切フレーム３と前記仕切カバー４との電気的接触を確実とする。又、前記ボス部１９、前記ボス部２１は前記外枠７、前記仕切枠８とは別に設け、前記螺子貫通孔２２は前記外枠７、前記仕切枠８の上面より離れた位置に穿設されるので、前記ガスケット用溝１６の連続性を遮ることがない。   The partition cover 4 is fixed to the partition frame 3, and a shield case 5 is attached to the printed circuit board 1. When the shield case 5 is required to have a high shielding effect, an electrically conductive gasket is loaded in the gasket groove 16, and the printed circuit board 1, the partition frame 3, the partition frame 3, and the partition cover 4 Ensure electrical contact. The boss portion 19 and the boss portion 21 are provided separately from the outer frame 7 and the partition frame 8, and the screw through hole 22 is formed at a position away from the upper surface of the outer frame 7 and the partition frame 8. Therefore, the continuity of the gasket groove 16 is not obstructed.

尚、前記カバー取付け螺子１５により、前記仕切フレーム３は前記仕切カバー４と共締めとなるので、前記フレーム取付け螺子１４による前記仕切フレーム３の前記プリント基板１への取付けは、作業上該プリント基板１と一体化できればよく、少なくとも２箇所で固定すれば充分である。従って、例えば、前記外枠７の角部の３箇所を前記フレーム取付け螺子１４で固定し、残りは螺子貫通孔２２については全てカバー取付け螺子１５により固定してもよい。   Since the partition frame 3 is fastened together with the partition cover 4 by the cover mounting screw 15, the mounting of the partition frame 3 to the printed circuit board 1 by the frame mounting screw 14 is the printed circuit board in operation. It is sufficient if it can be integrated with 1, and it is sufficient if it is fixed at at least two places. Therefore, for example, the three corners of the outer frame 7 may be fixed by the frame mounting screw 14, and the rest of the screw through holes 22 may be fixed by the cover mounting screw 15.

この場合、前記ボス部１９は省略でき、その分前記プリント基板１のパターン形成面積が広くなる。又、前記逃げ孔２４の加工も省略できる。   In this case, the boss portion 19 can be omitted, and the pattern formation area of the printed circuit board 1 is increased accordingly. Further, the processing of the relief hole 24 can be omitted.

又、前記ボス部１９について、螺子の頭分前記ボス部２１より低く成型することで、或は、座刳り形成することで、前記逃げ孔２４を穿設することが省略できる。   Further, by forming the boss portion 19 lower than the boss portion 21 of the screw head, or by forming a seat, it is possible to omit the drilling of the escape hole 24.

前記仕切フレーム３について、螺子加工がなくなり、加工工程が少なくなり、加工コストが低減し、更に前記螺子貫通孔２２を一体成型することで、一切の後加工が必要なくなり、製作コストの低減が図れる。   With respect to the partition frame 3, there is no screw processing, the number of processing steps is reduced, the processing cost is reduced, and the screw through-hole 22 is integrally formed, so that no post-processing is required and the manufacturing cost can be reduced. .

本発明の実施の形態を示す平面図である。It is a top view which shows embodiment of this invention. 同前本発明の実施の形態を示す正面図である。It is a front view showing an embodiment of the present invention. 本発明の実施の形態に使用される仕切フレームの平面図である。It is a top view of the partition frame used for embodiment of this invention. 該仕切フレームの底面図である。It is a bottom view of this partition frame. 本発明の実施の形態に於いて、プリント基板と仕切フレームとを取付けた状態の平面図である。In embodiment of this invention, it is a top view of the state which attached the printed circuit board and the partition frame. 従来例を示す平面図である。It is a top view which shows a prior art example. 従来例を示す正面図である。It is a front view which shows a prior art example. 従来例に於ける仕切フレームの平面図である。It is a top view of the partition frame in a prior art example. 従来例に於ける仕切フレームのＡ−Ａ矢視図である。It is an AA arrow view of the partition frame in a prior art example.

符号の説明Explanation of symbols

１ プリント基板
２ 台座
３ 仕切フレーム
４ 仕切カバー
６ 台座固定螺子
７ 外枠
８ 仕切枠
１４ フレーム取付け螺子
１５ カバー取付け螺子
１６ ガスケット用溝
１９ ボス部
２１ ボス部
２３ 面取り
２４ 逃げ孔 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Base 3 Partition frame 4 Partition cover 6 Base fixing screw 7 Outer frame 8 Partition frame 14 Frame mounting screw 15 Cover mounting screw 16 Gasket groove 19 Boss part 21 Boss part 23 Chamfer 24 Escape hole

Claims (1)

プリント基板に取付けられるシールドケースが少なくとも前記プリント基板下面に取付けられる台座と、矩形の外枠と該外枠の内部をシールドすべき回路毎に仕切る仕切枠によって構成された仕切フレームと、該仕切フレームの上面に取付けられる仕切カバーによって構成され、
前記台座が前記プリント基板の上面から前記プリント基板を貫通する螺子により螺子止めされ、該プリント基板の上面に配置された前記仕切フレームが、該仕切フレームの上面から該仕切フレーム、前記プリント基板を貫通するフレーム取付け螺子により前記台座に螺着され、
前記仕切フレームの上面に配置された前記仕切カバーが、該仕切カバーの上面から該仕切カバー、前記仕切フレーム、前記プリント基板を貫通するカバー取付け螺子により前記台座に螺着し、前記プリント基板、前記仕切フレーム、前記仕切カバーがそれぞれ前記台座に螺着される様構成したことを特徴とする電子回路のシールドケース。 A pedestal on which a shield case attached to a printed circuit board is attached to at least the lower surface of the printed circuit board, a rectangular outer frame, a partition frame configured to partition the inside of the outer frame for each circuit to be shielded, and the partition frame Composed of a partition cover attached to the upper surface of the
Screwed by screws before Symbol pedestal extending through the printed circuit board from the upper surface of the printed circuit board, the partition frame disposed on an upper surface of the printed circuit board, the partition switch frame from the upper surface of the partition off the frame, the printed circuit board It is screwed to the pedestal by a frame mounting screw that penetrates,
The partition cover disposed on the upper surface of the partition frame is screwed to the base by a cover mounting screw that penetrates the partition cover, the partition frame, and the printed circuit board from the upper surface of the partition cover, and the printed circuit board, A shield case for an electronic circuit , wherein the partition frame and the partition cover are respectively screwed onto the pedestal .
JP2006059978A 2006-03-06 2006-03-06 Shield case for electronic circuit Expired - Fee Related JP4777097B2 (en)

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JP6042094B2 (en) * 2012-05-08 2016-12-14 京セラ株式会社 Electronics

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JP3037321B1 (en) * 1999-02-26 2000-04-24 埼玉日本電気株式会社 Shield case
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