JP2005135962A - Shield structure of electronic apparatus - Google Patents

Shield structure of electronic apparatus Download PDF

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JP2005135962A
JP2005135962A JP2003367200A JP2003367200A JP2005135962A JP 2005135962 A JP2005135962 A JP 2005135962A JP 2003367200 A JP2003367200 A JP 2003367200A JP 2003367200 A JP2003367200 A JP 2003367200A JP 2005135962 A JP2005135962 A JP 2005135962A
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shield case
wiring board
conductive tape
rib
protrusion
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Toshio Takagi
俊夫 高木
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Hitachi Kokusai Electric Inc
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Hitachi Kokusai Electric Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a shield structure of an electronic apparatus having a simple structure and displaying certain shielding ability. <P>SOLUTION: Integrally formed shield cases 11 and 12 have a rib 13 with continuous structure around it. The shield cases are fitted to a wiring board 10 through a conductive tape 21 stuck to an upper face of the rib. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、通信機等電子機器の無線回路を電磁波ノイズからシールドするシールド構造に関するものである。   The present invention relates to a shield structure that shields a radio circuit of an electronic device such as a communication device from electromagnetic noise.

通信機等の無線回路等では電磁波の影響を受けやすく、外部から浸入する電磁波ノイズ、或は通信機内部の電源部等から発せられる電磁波ノイズによって誤作動を生じる。この為、無線回路等は、電磁波ノイズの浸入を防止する為、シールドケースに収納される。   A radio circuit or the like of a communication device is easily affected by electromagnetic waves, and malfunctions are caused by electromagnetic noise entering from the outside or electromagnetic noise generated from a power supply unit or the like inside the communication device. For this reason, a radio circuit or the like is housed in a shield case in order to prevent electromagnetic noise from entering.

例えば、特許文献1に示される電子機器のシールド構造では、配線基板のシールドを必要とする部分をシールドケースで覆う様になっている。図11に示される様に、シールドケース1は配線基板2の所要部分を覆う様に取付けられ、前記シールドケース1は基板側の面が開放された箱形状であり、該シールドケース1の側面には取付け爪3が形成され、前記配線基板2の前記取付け爪3と対応する位置には切欠5が形成されている。   For example, in the shield structure of an electronic device disclosed in Patent Document 1, a portion of the wiring board that needs to be shielded is covered with a shield case. As shown in FIG. 11, the shield case 1 is attached so as to cover a required portion of the wiring board 2, and the shield case 1 has a box shape with the board side surface open. A mounting claw 3 is formed, and a notch 5 is formed at a position corresponding to the mounting claw 3 of the wiring board 2.

前記シールドケース1は、前記取付け爪3が前記切欠5に引掛けられることで、前記配線基板2に取付けられる。尚、前記シールドケース1の取付け爪3,3との間には接点4が設けられ、前記配線基板2のアースラインに接触する様になっている。   The shield case 1 is attached to the wiring board 2 by the attachment claw 3 being hooked on the notch 5. A contact 4 is provided between the mounting case 3 and 3 of the shield case 1 so as to contact the ground line of the wiring board 2.

上記した従来の電子機器のシールド構造では、基本的にシールドケース1と配線基板2のアースラインとは点接触であり、前記取付け爪3と取付け爪3間、取付け爪3と接点4間は確実にアースラインに接触しているとはいえず、又基板の経時的変化で基板が反ることも考えられるが、この場合、前記シールドケース1と配線基板2間に隙間が生じ、この隙間からノイズが浸入する虞れが生じる。   In the shield structure of the conventional electronic device described above, the shield case 1 and the ground line of the wiring board 2 are basically in point contact, and the attachment claw 3 and the attachment claw 3 are securely connected between the attachment claw 3 and the contact 4. It may be said that the substrate is not in contact with the ground line, and the substrate may be warped due to the change of the substrate over time. In this case, a gap is generated between the shield case 1 and the wiring substrate 2, and There is a risk of noise intrusion.

尚、シールド構造を2重のシールドケースとすることも考えられるが、製作コストが上昇するという問題がある。又、従来の電子機器のシールド構造ではシールドが必要な箇所それぞれにシールドケースを設ける必要があり、同一の配線基板2に複数のシールドケースが必要となる等やはりコスト上昇の要因となっていた。   Although it is conceivable that the shield structure is a double shield case, there is a problem that the manufacturing cost increases. Further, in the shield structure of the conventional electronic device, it is necessary to provide a shield case at each place where the shield is necessary, and a plurality of shield cases are required on the same wiring board 2, which causes a cost increase.

特開2000−286584号公報JP 2000-286484 A

本発明は斯かる実情に鑑み、簡潔な構造で而も確実なシールド性能を発揮する電子機器のシールド構造を提供するものである。   In view of such circumstances, the present invention provides a shield structure for an electronic device that exhibits a reliable shield performance with a simple structure.

本発明は、一体成形したシールドケースが少なくとも周囲に連続したリブを有し、該リブの上面に貼設した導電性テープを介して前記シールドケースを配線基板に取付けた電子機器のシールド構造に係るものである。   The present invention relates to a shield structure for an electronic device in which an integrally formed shield case has at least a continuous rib around the rib, and the shield case is attached to a wiring board via a conductive tape attached to the upper surface of the rib. Is.

本発明によれば、一体成形したシールドケースが少なくとも周囲に連続したリブを有し、該リブの上面に貼設した導電性テープを介して前記シールドケースを配線基板に取付けたので、シールドケースの全周で配線基板のアースと導通し、又導電性テープにより配線基板とシールドケース間に隙間が生じないので、確実なシールド効果が得られる等の優れた効果を発揮する。   According to the present invention, the integrally formed shield case has at least a continuous rib, and the shield case is attached to the wiring board via the conductive tape attached to the upper surface of the rib. Since it is electrically connected to the ground of the wiring board around the entire circumference and no gap is formed between the wiring board and the shield case by the conductive tape, an excellent effect such as a reliable shielding effect is exhibited.

以下、図面を参照しつつ本発明を実施する為の最良の形態を説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

先ず、図1〜図5により本発明の第1の実施の形態について説明する。   First, a first embodiment of the present invention will be described with reference to FIGS.

図中、10は配線基板、11はベース側シールドケース、12はカバー側シールドケースを示している。   In the figure, 10 is a wiring board, 11 is a base-side shield case, and 12 is a cover-side shield case.

前記ベース側シールドケース11とカバー側シールドケース12とは略同様な構造を有している。   The base side shield case 11 and the cover side shield case 12 have substantially the same structure.

前記ベース側シールドケース11について説明する。   The base shield case 11 will be described.

該ベース側シールドケース11はアルミ製であり、ダイカスト等の製造方法により一体成形されており、周囲を囲繞し、全周に亘り連続した周辺リブ13、内部を格子状に仕切る縦リブ14、横リブ15により、基板側が開放された所要数の箱状の空間16が形成されている。   The base-side shield case 11 is made of aluminum, and is integrally formed by a die casting method or the like. The base-side shield case 11 surrounds the periphery and is continuous around the entire periphery. The rib 15 forms the required number of box-like spaces 16 with the substrate side open.

前記周辺リブ13と縦リブ14、前記周辺リブ13と横リブ15、前記縦リブ14と横リブ15が交差するそれぞれの交差部分には螺子穴17が穿設され、又前記周辺リブ13の所要位置、図示では角の4箇所に突起部18が形成され、該突起部18にも螺子穴19が穿設されている。   Screw holes 17 are formed in the intersecting portions where the peripheral ribs 13 and the vertical ribs 14, the peripheral ribs 13 and the horizontal ribs 15, and the vertical ribs 14 and the horizontal ribs 15 intersect with each other. Projections 18 are formed at four positions, in the figure, at the corners, and screw holes 19 are also formed in the protrusions 18.

前記カバー側シールドケース12は前記突起部18を有していないことを除き前記ベース側シールドケース11と略同様な構造であり、説明を省略する。   The cover-side shield case 12 has substantially the same structure as the base-side shield case 11 except that it does not have the protruding portion 18, and a description thereof will be omitted.

該ベース側シールドケース11と前記カバー側シールドケース12は、前記配線基板10を挾む様に取付けられる。   The base-side shield case 11 and the cover-side shield case 12 are attached so as to sandwich the wiring board 10.

先ず、前記ベース側シールドケース11の、前記周辺リブ13、前記縦リブ14、前記横リブ15の上面に図4(A)に示される帯状の導電性テープ21を貼設する。前記周辺リブ13、前記縦リブ14、前記横リブ15と前記導電性テープ21とは接着剤により接着してもよく、好ましくは該導電性テープ21の裏面に予め導電性粘着テープを付着し、該導電性粘着テープにより接着する。前記導電性テープ21は貼付け長さに予め切断しておくか、或は所定寸法に切断されたものを適宜継足し、或は適宜切断する。   First, a strip-shaped conductive tape 21 shown in FIG. 4A is attached to the upper surfaces of the peripheral rib 13, the vertical rib 14, and the horizontal rib 15 of the base-side shield case 11. The peripheral ribs 13, the vertical ribs 14, the horizontal ribs 15 and the conductive tape 21 may be adhered by an adhesive, preferably a conductive adhesive tape is attached in advance to the back surface of the conductive tape 21, It adheres with this conductive adhesive tape. The conductive tape 21 is cut in advance to the pasting length, or a piece cut to a predetermined dimension is added as appropriate, or cut appropriately.

該導電性テープ21は、プラスチックフォームを芯材として、ニッケルメッキ等金属メッキしたポリエステル繊維等の導電性繊維を前記芯材に被覆したものであり、柔らかく、接着面の形状に馴染みやすく、更にハサミで容易に切断が可能であると共に抜き加工も容易であるという性質を持っている。   The conductive tape 21 is made of a plastic foam as a core material and coated with a conductive material such as a nickel-plated polyester fiber or the like on the core material, and is soft and easy to adjust to the shape of the adhesive surface. It has the property that it can be cut easily and can be easily punched.

前記カバー側シールドケース12の周辺リブ、縦リブ、横リブの上面に帯状の導電性テープ(いずれも図示せず)を貼設する。   A strip-shaped conductive tape (not shown) is attached to the upper surfaces of the peripheral ribs, vertical ribs, and horizontal ribs of the cover-side shield case 12.

前記配線基板10を前記ベース側シールドケース11に重ね、螺子22を前記配線基板10に挿通して前記突起部18に螺着する。前記配線基板10は前記導電性テープ21を介して前記ベース側シールドケース11に取付けられる。図示しないが、前記配線基板10の前記導電性テープ21が当接する部分にはアースパターンが形成されており、前記ベース側シールドケース11は前記導電性テープ21を介して前記アースパターンに接触する。   The wiring board 10 is overlaid on the base-side shield case 11, and a screw 22 is inserted through the wiring board 10 and screwed to the protrusion 18. The wiring board 10 is attached to the base-side shield case 11 via the conductive tape 21. Although not shown, a ground pattern is formed on the portion of the wiring board 10 where the conductive tape 21 abuts, and the base shield case 11 contacts the ground pattern via the conductive tape 21.

次に、前記カバー側シールドケース12を前記配線基板10に重ね、螺子23を前記カバー側シールドケース12、配線基板10に挿通させ、前記ベース側シールドケース11の交差部分に螺着する。前記カバー側シールドケース12と前記配線基板10とは前記螺子23により前記ベース側シールドケース11に共締される。   Next, the cover-side shield case 12 is overlaid on the wiring board 10, the screw 23 is inserted through the cover-side shield case 12 and the wiring board 10, and is screwed to the intersection of the base-side shield case 11. The cover side shield case 12 and the wiring board 10 are fastened together with the base side shield case 11 by the screw 23.

上記した様に、前記カバー側シールドケース12の周辺リブ、縦リブ、横リブにも帯状の導電性テープが貼設されており、前記配線基板10のカバー側シールドケース12側にもアースパターンが形成されており、前記導電性テープは前記アースパターンに接触する。尚、配線基板の両面に形成されるアースパターンは適宜スルーホールで導通させる。   As described above, the strip-shaped conductive tape is also affixed to the peripheral rib, the vertical rib, and the horizontal rib of the cover-side shield case 12, and the ground pattern is also formed on the cover-side shield case 12 side of the wiring board 10. The conductive tape is in contact with the ground pattern. Note that the ground patterns formed on both surfaces of the wiring board are appropriately conducted through through holes.

前記導電性テープ21は柔軟で接触面に馴染み、更に前記螺子23を締込むことで、前記ベース側シールドケース11と前記配線基板10間、該配線基板10と前記カバー側シールドケース12間が密閉されると共に前記周辺リブ、縦リブ、横リブの全長に亘り前記配線基板10のアースパターンと導通する。   The conductive tape 21 is flexible and conforms to the contact surface. Further, by tightening the screw 23, the base-side shield case 11 and the wiring board 10 are sealed, and the wiring board 10 and the cover-side shield case 12 are sealed. In addition, it is electrically connected to the ground pattern of the wiring board 10 over the entire length of the peripheral rib, the vertical rib, and the horizontal rib.

而して、前記ベース側シールドケース11、前記カバー側シールドケース12それぞれに形成される前記空間16が個々に、又相互にシールドされる構造となる。又、前記ベース側シールドケース11、前記カバー側シールドケース12が前記配線基板10の補強部材となり、又基板の経時変化を防止する。   Thus, the space 16 formed in each of the base side shield case 11 and the cover side shield case 12 is individually and mutually shielded. Further, the base-side shield case 11 and the cover-side shield case 12 serve as a reinforcing member for the wiring board 10 and prevent the substrate from changing with time.

前記導電性テープ21を貼設する作業は、前記周辺リブ、前記縦リブ、前記横リブの上面に貼付けるものであり、組立てた状態で前記配線基板10のアースパターンと接触すればよい。従って、前記導電性テープ21が前記ベース側シールドケース11の外側に食出したとしても、性能上支障はなく、貼設作業に高精度、熟練を要するものでもない。   The operation of attaching the conductive tape 21 is performed on the upper surfaces of the peripheral ribs, the vertical ribs, and the horizontal ribs, and may be in contact with the ground pattern of the wiring board 10 in an assembled state. Therefore, even if the conductive tape 21 protrudes to the outside of the base-side shield case 11, there is no problem in performance, and the attaching operation does not require high accuracy and skill.

尚、導電性テープ21を貼設する際の、導電性テープ21の位置決めを容易にする構成として、前記ベース側シールドケース11、カバー側シールドケース12に位置決め突起を設けてもよい。   Note that positioning protrusions may be provided on the base-side shield case 11 and the cover-side shield case 12 as a configuration that facilitates positioning of the conductive tape 21 when the conductive tape 21 is attached.

例えば、図2、図3に示される様に、縦リブ14と横リブ15の交差部24にコの字状の突起25を設ける。該突起25は、線状の隆起がコの字状に連続したものであり、前記導電性テープ21が充分に圧縮変形できる高さとなっている。   For example, as shown in FIGS. 2 and 3, a U-shaped protrusion 25 is provided at the intersection 24 of the vertical rib 14 and the horizontal rib 15. The protrusion 25 has a linear bulge continuous in a U-shape, and has a height at which the conductive tape 21 can be sufficiently compressed and deformed.

前記突起25が設けられることで、前記導電性テープ21を貼付ける場合に、先端の長手方向及び幅方向の位置が容易に決められ、作業性が向上する。尚、前記突起25を設け、先端部の位置決めをすることで、前記交差部24部分に前記導電性テープ21が不足した状態となるが、予め前記交差部24の形状に合わせて打抜いた導電性テープ21a(図4(B)〜図4(D)参照)を前記交差部24に貼設する。   By providing the protrusion 25, when the conductive tape 21 is pasted, the position in the longitudinal direction and the width direction of the tip is easily determined, and workability is improved. In addition, by providing the protrusion 25 and positioning the tip, the conductive tape 21 is in shortage at the intersecting portion 24, but the conductive material previously punched in accordance with the shape of the intersecting portion 24 is used. The adhesive tape 21a (see FIG. 4B to FIG. 4D) is attached to the intersection 24.

前記周辺リブ13、前記縦リブ14、前記横リブ15、前記交差部24にそれぞれ前記導電性テープ21、導電性テープ21aを貼設した状態は、図5に示される。   FIG. 5 shows a state in which the conductive tape 21 and the conductive tape 21a are attached to the peripheral rib 13, the vertical rib 14, the horizontal rib 15, and the intersecting portion 24, respectively.

前記導電性テープ21を位置決めする為の突起の形状は種々考えられ、図6、図7に示される様に、単に前記周辺リブ13、前記縦リブ14、前記横リブ15を直線的に横切る突起26としてもよい。該突起26により、前記導電性テープ21の先端の位置決めがなされる。尚、該導電性テープ21の幅方向の位置決めは、前記周辺リブ13、前記縦リブ14、前記横リブ15の縁を基準として作業できるので、作業上は支障ない。   Various shapes of protrusions for positioning the conductive tape 21 are conceivable. As shown in FIGS. 6 and 7, the protrusions simply linearly cross the peripheral ribs 13, the vertical ribs 14, and the horizontal ribs 15. 26 may be used. The protrusion 26 positions the tip of the conductive tape 21. The positioning of the conductive tape 21 in the width direction can be performed with reference to the edges of the peripheral ribs 13, the vertical ribs 14, and the horizontal ribs 15, so that there is no problem in the work.

尚、特に図示しないが、前記交差部24部分を前記周辺リブ13、前記縦リブ14、前記横リブ15の上面より高くして、交差部24全体を突起としてもよい。尚、この場合、図8、図9に示される様に凹み24aを形成してもよい。   Although not particularly shown, the intersecting portion 24 may be made higher than the upper surfaces of the peripheral rib 13, the vertical rib 14, and the lateral rib 15, and the entire intersecting portion 24 may be a projection. In this case, a recess 24a may be formed as shown in FIGS.

図10は、前記周辺リブ13、前記縦リブ14、前記横リブ15の上面に、所要ピッチで点状の突起27を形成した場合を示している。該突起27を形成することで、該突起27が前記導電性テープ21に食込んだ状態となり、前記突起27と前記導電性テープ21との導通状態が向上し、更に電子機器が振動する等した場合の該導電性テープ21の位置ずれを抑止する。   FIG. 10 shows a case where dot-like protrusions 27 are formed on the upper surfaces of the peripheral rib 13, the vertical rib 14, and the horizontal rib 15 at a required pitch. By forming the protrusions 27, the protrusions 27 are bitten into the conductive tape 21, the conduction state between the protrusions 27 and the conductive tape 21 is improved, and the electronic device vibrates. In this case, the displacement of the conductive tape 21 is suppressed.

次に、前記突起25、突起26、突起27と前記配線基板10との関係は、前記導電性テープ21を組込んだ状態で、前記配線基板10と前記突起25、突起26、突起27が接触しない様にしてもよく、或は前記配線基板10と前記突起25、突起26、突起27が接触する様にしてもよい。更に、前記導電性テープ21に孔を穿設し、前記突起25、突起26、突起27が基板側のアースパターンに直接接触する様にし、前記突起25、突起26、突起27部分で導通を得る様にしてもよい。更に、前記配線基板10と前記突起25、突起26、突起27とが接触しない様にするには、上記した様に前記突起25、突起26、突起27を前記導電性テープ21、導電性テープ21aが圧縮されても前記配線基板10と接触しない高さとする場合、或は該配線基板10側の前記突起25、突起26、突起27の対向位置に、凹部、切欠等の逃げを形成する場合がある。逃げを形成する場合は、前記導電性テープ21、導電性テープ21aにより前記配線基板10と前記ベース側シールドケース11、カバー側シールドケース12との間で充分な導通が得られる場合に、前記突起25、突起26、突起27と対向する部分に局部的な荷重が発生するのを防止する効果がある。   Next, the relationship between the protrusion 25, the protrusion 26, and the protrusion 27 and the wiring substrate 10 is such that the wiring substrate 10 and the protrusion 25, the protrusion 26, and the protrusion 27 are in contact with each other with the conductive tape 21 incorporated. Alternatively, the wiring board 10 and the protrusions 25, 26, and 27 may be in contact with each other. Further, a hole is formed in the conductive tape 21 so that the protrusion 25, protrusion 26, and protrusion 27 are in direct contact with the ground pattern on the substrate side, and conduction is obtained at the protrusion 25, protrusion 26, and protrusion 27 portions. You may do it. Further, in order to prevent the wiring board 10 and the protrusions 25, 26, and 27 from contacting each other, the protrusion 25, the protrusion 26, and the protrusion 27 are connected to the conductive tape 21 and the conductive tape 21a as described above. When the height is set so as not to come into contact with the wiring board 10 even when compressed, or in some cases, recesses, cutouts, etc. are formed at positions facing the projections 25, 26, 27 on the wiring board 10 side. is there. When the relief is formed, when the conductive tape 21 and the conductive tape 21a provide sufficient conduction between the wiring board 10 and the base-side shield case 11 and the cover-side shield case 12, the protrusions 25, the protrusion 26, and the protrusion 27 have an effect of preventing a local load from being generated at a portion facing the protrusion 26 and the protrusion 27.

尚、上記実施の形態では配線基板10の両面にシールドケースを設けたが、いずれか一方の面にシールドケースを設けてもよい。又、シールドケースの内部を縦リブ14、横リブ15で仕切ったが、シールドケース単体で空間16を形成する様にしてもよい。   In the embodiment described above, the shield cases are provided on both surfaces of the wiring substrate 10, but the shield cases may be provided on either one of the surfaces. Further, although the inside of the shield case is partitioned by the vertical rib 14 and the horizontal rib 15, the space 16 may be formed by the shield case alone.

本発明の実施の形態を示す斜視図である。It is a perspective view which shows embodiment of this invention. 該実施の形態に於けるシールドケースの斜視図である。It is a perspective view of the shield case in this embodiment. 図2のA部拡大図である。It is the A section enlarged view of FIG. (A)(B)(C)(D)は該実施の形態に使用される導電性テープの説明図である。(A) (B) (C) (D) is explanatory drawing of the electroconductive tape used for this embodiment. 該実施の形態に於けるシールドケースと導電性テープの関係を示す説明図である。It is explanatory drawing which shows the relationship between the shield case and electroconductive tape in this embodiment. 本発明の他の実施の形態を示す説明図である。It is explanatory drawing which shows other embodiment of this invention. 図6のB部拡大図である。It is the B section enlarged view of FIG. 本発明に於ける突起部の他の例を示す説明図である。It is explanatory drawing which shows the other example of the projection part in this invention. 本発明に於ける突起部の他の例を示す説明図である。It is explanatory drawing which shows the other example of the projection part in this invention. 本発明に於ける突起部の更に他の例を示す説明図である。It is explanatory drawing which shows the further another example of the projection part in this invention. 従来例の説明図である。It is explanatory drawing of a prior art example.

符号の説明Explanation of symbols

10 配線基板
11 ベース側シールドケース
12 カバー側シールドケース
13 周辺リブ
14 縦リブ
15 横リブ
16 空間
21 導電性テープ
24 交差部
25 突起
26 突起
27 突起
DESCRIPTION OF SYMBOLS 10 Wiring board 11 Base side shield case 12 Cover side shield case 13 Peripheral rib 14 Vertical rib 15 Horizontal rib 16 Space 21 Conductive tape 24 Intersection 25 Projection 26 Projection 27 Projection

Claims (1)

一体成形したシールドケースが少なくとも周囲に連続したリブを有し、該リブの上面に貼設した導電性テープを介して前記シールドケースを配線基板に取付けたことを特徴とする電子機器のシールド構造。   A shield structure for an electronic device, wherein the integrally formed shield case has at least a continuous rib around the periphery, and the shield case is attached to a wiring board via a conductive tape attached to the upper surface of the rib.
JP2003367200A 2003-10-28 2003-10-28 Shield structure of electronic apparatus Pending JP2005135962A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003367200A JP2005135962A (en) 2003-10-28 2003-10-28 Shield structure of electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003367200A JP2005135962A (en) 2003-10-28 2003-10-28 Shield structure of electronic apparatus

Publications (1)

Publication Number Publication Date
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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242725A (en) * 2006-03-06 2007-09-20 Hitachi Kokusai Electric Inc Shield case of electronic circuit
CN102238808A (en) * 2010-04-22 2011-11-09 鸿富锦精密工业(深圳)有限公司 Gummed paper pasting method and main board formed by using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242725A (en) * 2006-03-06 2007-09-20 Hitachi Kokusai Electric Inc Shield case of electronic circuit
CN102238808A (en) * 2010-04-22 2011-11-09 鸿富锦精密工业(深圳)有限公司 Gummed paper pasting method and main board formed by using same

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