KR101785368B1 - Camera module for Vehicle - Google Patents

Abstract

The camera module according to the present embodiment includes first and second printed circuit boards including a ground portion of a conductive material; And an outer shield that separates and supports the first and second printed circuit boards at a predetermined interval, wherein the outer shield is formed by partially bending a side wall surface and disposed at a position corresponding to the ground portion; .

Description

[0001] The present invention relates to a camera module for a vehicle,

The present invention relates to a camera module used in a vehicle.

In recent years, camera modules for image acquisition have been used in many cases due to the influence of the upgrading and automation of vehicle parts. Typically, camera modules used in forward and backward surveillance cameras, black boxes, and the like are examples.

Korean Unexamined Patent Publication No. 2006-0125570 (published on December 16, 2006) discloses a camera module for capturing the surroundings of a vehicle, and a camera module which is fixedly connected to such a camera module, Mounted camera structure composed of a connector unit for mounting the camera on a vehicle.

However, the camera unit constructed as disclosed in the prior art uses a plurality of screws to fix the sensor printed circuit board on which the image sensor is mounted and the power printed circuit board for supplying power to the housing.

When the sensor and the power printed circuit board are combined using the screw, the time required for the assembling process increases, and optical axis misalignment due to rotational moment due to the screw fastening force may occur when adjusting the optical axis of the lens.

In addition, in order to combine the sensor and the power printed circuit board, a screw hole must be formed in each printed circuit board, so that the mounting area of the component of the printed circuit board may be limited.

In addition, since the sensor and the printed circuit board usually need to maintain a constant spacing in order to eliminate interference between the heat dissipation and mounting mechanisms, a separate spacer for space separation must be provided, It is troublesome to separately perform ground processing because interference with the substrate occurs.

Korea Patent Publication 2006-0125570 (2006.12.06.)

It is an object of the present invention to provide a camera module for a vehicle, which is improved in structure so that a plurality of printed circuit boards can be fixed and supported in a separated state without a separate spacer and a screw thread.

The camera module according to the present embodiment includes first and second printed circuit boards including a ground portion of a conductive material; And an outer shield that separates and supports the first and second printed circuit boards at a predetermined interval, wherein the outer shield is formed by partially bending a side wall surface and disposed at a position corresponding to the ground portion; .

The ground portion may be formed on a side surface or an upper surface or a lower surface of the first and second printed circuit boards.

The plurality of ground portions may be formed along the peripheries of the first and second printed circuit boards.

The tension spring may contact the ground portion to support the ground portion.

A through hole may be formed around the tension spring.

Wherein the tension spring includes: a first pressing portion contacting the ground portion of the first printed circuit board; And a second pressing portion contacting the ground portion of the second printed circuit board.

The first and second printed circuit boards may have a shape corresponding to the outer shield and the tension spring.

The first and second pressing portions may be vertically disposed on the side surface of the outer shield.

The outer shield and the tension spring may be integrally formed of a conductive material.

The camera module according to the present embodiment includes a lens module; Image sensor; And a cover member covering an upper surface of the lens module, the image sensor, and the first printed circuit board.

The outer shield may support at least three surfaces of the first and second printed circuit boards.

The outer shield may be electrically connected to the ground portion, and the first and second printed circuit boards may be grounded through the outer shield.

The sidewall surface of the outer shield may be formed to be larger than the sum of the thickness of the first and second printed circuit boards and the distance between them.

The distance that the first and second printed circuit boards are spaced apart from each other can be determined by the tension spring.

The distance between the first and second printed circuit boards may be defined as the distance between the first and second pressing portions.

A camera module according to another embodiment includes a first printed circuit board; A second printed circuit board for supplying power to the first printed circuit board; And an outer shield of a conductive material for separating and supporting the first and second printed circuit boards at a predetermined interval, wherein the first and second printed circuit boards each include a ground terminal portion formed of a conductive material, The outer shield includes a tension spring formed at a position corresponding to the ground terminal portion. The outer shield has at least three side surfaces and is formed of a conductive material to fix the first and second printed circuit boards at the same time And the first and second printed circuit boards can be electrically connected through the tension spring.

The tension spring is in contact with the ground terminal portion and may be connected to the outer shield and the first and second printed circuit boards so as to be energized.

The tension spring may be integrally formed on the side wall of the outer shield.

Further, a lens module; Image sensor; And a cover member covering an upper surface of the lens module, the image sensor, and the first printed circuit board.

Wherein the tension spring comprises: a first pressing portion contacting the ground terminal portion of the first printed circuit board; And a second pressing portion contacting the ground terminal portion of the second printed circuit board.

The first and second pressing portions may be vertically disposed on the side surface of the outer shield.

1 is a view showing an example of a camera module for a vehicle according to a preferred embodiment of the present invention.
Fig. 2 is an exploded perspective view of the first and second printed circuit boards and the outer shield of Fig. 1,
3 is a cross-sectional view taken along line AA of FIG. 2,
4 is a rear view of a first printed circuit board according to an embodiment of the present invention.

Hereinafter, an embodiment of a motor according to a preferred embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view of the first and second printed circuit boards and the outer shield of FIG. 1, FIG. FIG. 4 is a rear view of a first printed circuit board according to an embodiment of the present invention. FIG.

The camera module for a vehicle according to a preferred embodiment of the present invention includes a first printed circuit board 10, a second printed circuit board 20, an outer shield 30, and a supporting unit 100 .

The first printed circuit board 10 is mounted on the upper side of the image sensor 10a to sense external image information and the second printed circuit board 20 is mounted on the first printed circuit board 10 at a predetermined distance And is disposed on the bottom surface of the first printed circuit board 10 in a spaced apart state. The second printed circuit board (20) is preferably provided with a module for supplying power to the first printed circuit board (10).

1, a camera module for a vehicle according to a preferred embodiment of the present invention is disposed on the first printed circuit board 10 and transmits an image to the image sensor 10a And a cover member 10c covering the lens module 10b and the image sensor 10a and the lens module 10b and the side 10 on the first printed circuit board. Such a configuration can be changed according to the component configuration.

The outer shield 30 is formed to enclose the side surfaces of the first and second printed circuit boards 10 and 20 so that the first and second printed circuit boards 10 and 20 can be EMI- . 1 and 2, the outer shield 30 is formed such that the sidewall surface thereof is larger than the sum of the thickness of the first and second printed circuit boards 10 and 20 and the separation distance therebetween, It is preferable to have a large value.

Further, the outer shield 30 is preferably formed of a metal body of a conductive metal. The outer shield 30 absorbs the electromagnetic waves generated from the first and second printed circuit boards 10 and 20 and the electromagnetic waves flowing from the outside to the first and second printed circuit boards 10 and 20 Therefore, it is possible to prevent the malfunction of the camera module due to disturbance of the external electromagnetic wave and the influence of the electromagnetic wave generated in the camera operation on the peripheral components.

The support unit 100 is integrally formed with the outer shield 30 and is disposed at a position where it interferes with the first and second printed circuit boards 10 and 20. 2, the supporting unit 100 supports the first and second printed circuit boards 10 and 20, and the first and second printed circuit boards 10 and 20, It is preferable that a plurality of portions are provided along the circumference of the housing.

The support unit 100 includes a through hole 110 and a tension spring 120.

The through holes 110 are formed through the wall surface of the outer shield 30 to receive the support protrusions 11 protruding from the side surfaces of the first and second printed circuit boards 10 and 20. The support protrusions 11 are formed near the center of the circumferential surface of each of the first and second printed circuit boards 10 and 20, and as shown in FIG. 4, The recesses 13 having a predetermined depth are formed on the circumferential surface of the substrate 10 or 20 so that the protrusions are separated from other circumferential surfaces.

The tension spring 120 is formed by bending a side wall of the outer shield 30 and may include first and second pressing portions 121 and 122 as shown in FIG. . The tension spring 120 is disposed to face the support protrusion 11 passing through the through hole 110 and elastically supports a facing surface of the support protrusion 11.

2 and 3, the support unit 100 is disposed on the sidewall of the outer shield 30 so as to be vertically symmetrical with respect to the first and the second printed circuit boards 10 ) 20 are spaced apart from each other by a predetermined distance.

The support protrusion 11 may be formed with a ground terminal portion 11a plated with a conductive material at a position where the support protrusion 11 interferes with the tension spring 120. The ground terminal portion 11a is electrically connected to the outer shield 30 of the metallic material so that electromagnetic waves and residual electricity generated in the first and second printed circuit boards 10 and 20 are electrically connected to the outer shield (30).

As shown in FIGS. 2 and 3, the support unit 100 configured as described above preferably supports at least three surfaces of the first and second printed circuit boards 10 and 20, 1 and the second printed circuit boards 10 and 20 can be spaced apart from each other by a predetermined distance or more without a separate spacer.

3, since the first and second printed circuit boards 10 and 20 are supported above and below the pair of tension springs 120, Can be spaced apart from each other by a length. Therefore, the first and second printed circuit boards 10 and 20 can be spaced apart from each other by a predetermined distance without the aid of a separate spacer or the like.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

10; A first printed circuit board 10a; Image sensor
10b; A lens module 10c; The cover member
11; Supporting protrusions 11a; Ground terminal portion
20; A second printed circuit board 30; Outer Shield
100; A support unit 110; Through-hole
120; Tension spring

Claims (21)

A first printed circuit board including a first ground portion;
A second printed circuit board including a second ground portion spaced apart from the first ground portion; And
And an outer shield including a tension spring,
Wherein the tension spring is formed by bending a part of the outer shield and is disposed at a position corresponding to the first ground portion and the second ground portion,
Wherein the first ground portion and the second ground portion comprise a conductive material.
The method according to claim 1,
Wherein the first and second ground portions are disposed on a side surface or an upper surface or a lower surface of the first and second printed circuit boards,
Wherein the tension spring is in contact with the first ground portion and the second ground portion.
3. The method of claim 2,
Wherein the tension spring includes: a first tension spring that is in contact with the first ground portion; and a second tension spring that is in contact with the second ground portion.
The method according to claim 1,
Wherein a plurality of the first ground portions are disposed along the periphery of the first printed circuit board,
And a plurality of second ground portions are disposed along a periphery of the second printed circuit board.
The method according to claim 1,
Wherein the tension spring contacts the first and second ground portions to support the first and second ground portions.
The method according to claim 1,
Wherein the outer shield includes a side wall coupled with the first and second printed circuit boards,
Wherein a side wall of the outer shield includes first and second through holes,
And at least a part of the tension spring is disposed in the first and second through holes.
6. The method of claim 5,
The tension spring
A first pressing portion contacting the first ground portion of the first printed circuit board; And
And a second pressing portion that contacts the second ground portion of the second printed circuit board.
The method according to claim 1,
Wherein the first and second printed circuit boards have a shape corresponding to the outer shield and the tension spring.
8. The method of claim 7,
Wherein the first and second pressing portions are vertically disposed on a side surface of the outer shield.
10. The method according to any one of claims 1 to 9,
Wherein the outer shield and the tension spring are integrally formed of a conductive material.
10. The method according to any one of claims 1 to 9,
A lens module;
Image sensor; And
Further comprising a cover member covering the lens module, the image sensor, and an upper surface of the first printed circuit board.
10. The method according to any one of claims 1 to 9,
Wherein the outer shield supports at least three sides of the first and second printed circuit boards.
11. The method of claim 10,
Wherein the outer shield is electrically connected to the first and second ground portions, and the first and second printed circuit boards are grounded through the outer shield.
The method according to claim 1,
Wherein the side walls of the outer shield are formed to be larger than the sum of the thicknesses of the first and second printed circuit boards and the distance between them.
The method according to claim 1,
Wherein the distance between the first and second printed circuit boards is determined by the tension spring.
A first printed circuit board;
A second printed circuit board for supplying power to the first printed circuit board; And
And an outer shield of a conductive material for supporting the first and second printed circuit boards so as to be spaced apart from each other,
Wherein the first printed circuit board includes a first ground portion of a conductive material,
Wherein the second printed circuit board includes a second ground portion of a conductive material,
Wherein the outer shield includes a tension spring formed by bending a part of the outer shield and formed in contact with the first and second ground portions,
The outer shield is formed of a conductive material having at least three side surfaces and supports the first and second printed circuit boards and electrically connects the first and second printed circuit boards through the tension spring Camera module.
delete 17. The method of claim 16,
Wherein the tension spring is integrally formed on the side wall of the outer shield.
17. The method of claim 16,
A lens module;
Image sensor; And
Further comprising a cover member covering the lens module, the image sensor, and an upper surface of the first printed circuit board.
17. The method of claim 16,
The tension spring
A first pressing portion contacting the first ground portion of the first printed circuit board; And
And a second pressing portion that contacts the second ground portion of the second printed circuit board. delete

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