CN106817843A - A kind of method of DIP device position information in inspection PCB - Google Patents
A kind of method of DIP device position information in inspection PCB Download PDFInfo
- Publication number
- CN106817843A CN106817843A CN201710131622.1A CN201710131622A CN106817843A CN 106817843 A CN106817843 A CN 106817843A CN 201710131622 A CN201710131622 A CN 201710131622A CN 106817843 A CN106817843 A CN 106817843A
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- China
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- measurement
- dip
- distance
- pcb
- component bodies
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The method that the present invention discloses DIP device position information in a kind of inspection PCB, is related to PCB design field；The distance of measurement DIP component bodies and PCB edge, measurement distance data are obtained, compares the range data of measurement and the size of safe distance, when the range data of measurement is more than safe distance, the positional information of DIP component bodies is normal, otherwise judges the positional information abnormity of DIP component bodies；The present invention is to enter the inspection of row positional information to one of which DIP components in PCB design, checks whether the position of DIP devices places mistake, prevents from being electrically connected abnormal device appearance on pcb board, it is ensured that the correctness of PCB design.
Description
Technical field
The method that the present invention discloses DIP device position information in a kind of inspection PCB, is related to PCB design field.
Background technology
PCB (Printed Circuit Board), printed circuit board, also known as printed substrate, is the important ministry of electronics industry
Part, is the supporter of electronic component, is also the carrier of electronic component electrical connection.Because it is using electron printing system
Make, therefore be referred to as " printing " circuit board.Current almost every kind of electronic equipment, it is small to electronic watch, calculator, it is big to calculating
Machine, communication electronic device, military issue weapons system, as long as there is the electronic components such as integrated circuit, in order to electric mutual between them
Even, printed board will be used.With continuing to develop for electronic information technology, the integrated level of electronic product also more and more higher, PCB makees
It is the carrier of each function of electronic product, in relatively large electronic product research process, most basic success factor is the product
Design, documentation and the manufacture of the printed board of product.The design and workmanship of printed board directly influence the matter of whole product
Amount and cost, even result in the success or failure of commercial competition.The method that the present invention provides DIP device position information in a kind of inspection PCB,
It is the inspection for entering row positional information to one of which DIP components in PCB design, checks whether the position of DIP devices places mistake
By mistake, prevent from being electrically connected abnormal device appearance on pcb board, it is ensured that the correctness of PCB design.
Wherein DIP is encapsulated, and is also dual-inline package technology, it is double enter line encapsulation, refer to using the encapsulation of dual-in-line form
IC chip, most middle small scale integrated circuits use this packing forms, and its number of pins is usually no more than
100.The cpu chip of DIP encapsulation has two row's pins, it is necessary to be inserted on the chip carrier socket with DIP structures.Certainly, also can DIP
Encapsulation is welded with being directly inserted on the circuit board that identical welding hole number and geometry are arranged.
The content of the invention
The method that the present invention provides DIP device position information in a kind of inspection PCB, checks whether the position of DIP devices puts
Mistake is put, prevents from being electrically connected abnormal device appearance on pcb board, it is ensured that the correctness of PCB design, with highly versatile, reality
The features such as applying simplicity, has broad application prospects.
Concrete scheme proposed by the present invention is：
A kind of method of DIP device position information in inspection PCB,
Measurement DIP component bodies and the distance of PCB edge, obtain measurement distance data,
Compare the range data of measurement and the size of safe distance, when the range data of measurement is more than safe distance, DIP units device
The positional information of part body is normal, otherwise judges the positional information abnormity of DIP component bodies.
The center position measurement from DIP component bodies and the distance of PCB edge, obtain measurement distance data.
According to actual conditions, the size of safe distance is pre-defined.
Using the Display-Measure orders of Candence softwares measure DIP component bodies and PCB edge away from
From obtaining measurement distance data.
Concretely comprise the following steps：
It is Display-Element to open the selection of Candence softwares, and the DIP devices to be detected are clicked on one by one, shows device
The centre coordinate of part, clicks on the distance of Display-Measure measurement DIP component bodies and PCB edge, obtain measuring away from
From data；
Automatic detection DIP devices, compare measurement distance data：
When the range data of measurement is more than safe distance, the positional information of DIP component bodies is normal, otherwise judges DIP units
The positional information abnormity of device body.
The system of DIP device position information in a kind of inspection PCB：
Including measurement module, compare authentication module,
Measurement module is used to measure the distance of DIP component bodies and PCB edge, obtains measurement distance data,
Compare authentication module for comparing the range data of measurement and the size of safe distance, when the range data of measurement is more than peace
During full distance, the positional information of DIP component bodies is normal, otherwise judges the positional information abnormity of DIP component bodies.
The measurement module obtains measurement distance from the center position measurement of DIP component bodies and the distance of PCB edge
Data.
The authentication module that compares pre-defines the size of safe distance according to actual conditions.
Usefulness of the present invention is：
The method that the present invention discloses DIP device position information in a kind of inspection PCB：Measurement DIP component bodies and PCB edge
Distance, obtains measurement distance data, compares the range data of measurement and the size of safe distance, when the range data of measurement is more than
During safe distance, the positional information of DIP component bodies is normal, otherwise judges the positional information abnormity of DIP component bodies；Profit
It is to enter the inspection of row positional information to one of which DIP components in PCB design with the present invention, checking the position of DIP devices is
No placement mistake, prevents from being electrically connected abnormal device appearance on pcb board, it is ensured that the correctness of PCB design, with versatility
By force, the features such as being easy to implement, has broad application prospects.
Brief description of the drawings
Fig. 1 is the inventive method schematic flow sheet.
Fig. 2 present system block schematic illustrations.
Specific embodiment
The method that the present invention provides DIP device position information in a kind of inspection PCB,
Measurement DIP component bodies and the distance of PCB edge, obtain measurement distance data,
Compare the range data of measurement and the size of safe distance, when the range data of measurement is more than safe distance, DIP units device
The positional information of part body is normal, otherwise judges the positional information abnormity of DIP component bodies.
The system for providing DIP device position information in a kind of inspection PCB simultaneously：
Including measurement module, compare authentication module,
Measurement module is used to measure the distance of DIP component bodies and PCB edge, obtains measurement distance data,
Compare authentication module for comparing the range data of measurement and the size of safe distance, when the range data of measurement is more than peace
During full distance, the positional information of DIP component bodies is normal, otherwise judges the positional information abnormity of DIP component bodies.
To make the object, technical solutions and advantages of the present invention become more apparent, below in conjunction with specific embodiment, to this hair
Bright further description.
Using the inventive method, whether DIP device positions information of being tested to a certain pcb board there is exception.Use
Candence softwares are used as instrument.
Wherein concretely comprise the following steps：
It is Display-Element to open the selection of Candence softwares, and the DIP devices to be detected are clicked on one by one, shows device
The centre coordinate of part, clicks on the distance of Display-Measure measurement DIP component bodies and PCB edge, obtain measuring away from
From data；
Wherein according to actual conditions, it is 5mm to pre-define safe distance, and welding can be influenceed apart from too small,
Then automatic detection DIP devices, compare measurement distance data：
When the range data of measurement is more than safe distance 5mm, the positional information of DIP component bodies is normal, otherwise measures
Range data is less than or equal to safe distance 5mm, judges the positional information abnormity of DIP component bodies, can run Candence
The name and coordinate of the software window automatic spring device.
It is above-mentioned to carry out the inspection of DIP component locations information in PCB design using of the invention, check the position of DIP devices
Put and whether place mistake, prevent from being electrically connected abnormal device appearance on pcb board, it is ensured that the correctness of PCB design.
Claims (8)
1. in a kind of inspection PCB DIP device position information method, it is characterized in that
Measurement DIP component bodies and the distance of PCB edge, obtain measurement distance data,
Compare the range data of measurement and the size of safe distance, when the range data of measurement is more than safe distance, DIP units device
The positional information of part body is normal, otherwise judges the positional information abnormity of DIP component bodies.
2. method according to claim 1, it is characterized in that the center position measurement and PCB from DIP component bodies
The distance at edge, obtains measurement distance data.
3. method according to claim 1 and 2, it is characterized in that according to actual conditions, pre-defining the size of safe distance.
4. method according to claim 3, it is characterized in that using the Display-Measure orders of Candence softwares to survey
Amount DIP component bodies and the distance of PCB edge, obtain measurement distance data.
5. method according to claim 4, it is characterized in that
Concretely comprise the following steps：
It is Display-Element to open the selection of Candence softwares, and the DIP devices to be detected are clicked on one by one, shows device
The centre coordinate of part, clicks on the distance of Display-Measure measurement DIP component bodies and PCB edge, obtain measuring away from
From data；
Automatic detection DIP devices, compare measurement distance data：
When the range data of measurement is more than safe distance, the positional information of DIP component bodies is normal, otherwise judges DIP units
The positional information abnormity of device body.
6. in a kind of inspection PCB DIP device position information system, it is characterized in that
Including measurement module, compare authentication module,
Measurement module is used to measure the distance of DIP component bodies and PCB edge, obtains measurement distance data,
Compare authentication module for comparing the range data of measurement and the size of safe distance, when the range data of measurement is more than peace
During full distance, the positional information of DIP component bodies is normal, otherwise judges the positional information abnormity of DIP component bodies.
7. system according to claim 6, it is characterized in that the measurement module is surveyed from the center of DIP component bodies
Amount and the distance of PCB edge, obtain measurement distance data.
8. the system according to claim 6 or 7, it is characterized in that the authentication module that compares is according to actual conditions, determines in advance
The size of Yian city full distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710131622.1A CN106817843A (en) | 2017-03-07 | 2017-03-07 | A kind of method of DIP device position information in inspection PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710131622.1A CN106817843A (en) | 2017-03-07 | 2017-03-07 | A kind of method of DIP device position information in inspection PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106817843A true CN106817843A (en) | 2017-06-09 |
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ID=59114588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710131622.1A Pending CN106817843A (en) | 2017-03-07 | 2017-03-07 | A kind of method of DIP device position information in inspection PCB |
Country Status (1)
| Country | Link |
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| CN (1) | CN106817843A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201576015U (en) * | 2009-12-16 | 2010-09-08 | 宁波三星电气股份有限公司 | PCB for electric energy meter |
| WO2012098573A1 (en) * | 2011-01-18 | 2012-07-26 | 三菱電機株式会社 | Printed board and acceleration detection apparatus |
-
2017
- 2017-03-07 CN CN201710131622.1A patent/CN106817843A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201576015U (en) * | 2009-12-16 | 2010-09-08 | 宁波三星电气股份有限公司 | PCB for electric energy meter |
| WO2012098573A1 (en) * | 2011-01-18 | 2012-07-26 | 三菱電機株式会社 | Printed board and acceleration detection apparatus |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170609 |
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| RJ01 | Rejection of invention patent application after publication |