WO2012095019A1 - 照明装置 - Google Patents

照明装置 Download PDF

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Publication number
WO2012095019A1
WO2012095019A1 PCT/CN2012/070318 CN2012070318W WO2012095019A1 WO 2012095019 A1 WO2012095019 A1 WO 2012095019A1 CN 2012070318 W CN2012070318 W CN 2012070318W WO 2012095019 A1 WO2012095019 A1 WO 2012095019A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
air
lighting device
heat sink
light
Prior art date
Application number
PCT/CN2012/070318
Other languages
English (en)
French (fr)
Inventor
李志伟
约阿基姆⋅戈贝尔
Original Assignee
查克森科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 查克森科技有限公司 filed Critical 查克森科技有限公司
Priority to EP12734685.6A priority Critical patent/EP2664845A4/de
Publication of WO2012095019A1 publication Critical patent/WO2012095019A1/zh

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/777Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04Recessed bases
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/673Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for intake
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device. Background technique
  • Reference EP 2025999 describes a lighting device in which the air for cooling the lighting device is discharged laterally from the housing of the lighting device through an opening provided therethrough in the housing. In this case, the housing of the lighting device and the heat sink are thermally separated from each other. Summary of the invention
  • the aim is to provide a lighting device which can be embodied in a particularly small manner in terms of its dimensions, in particular its volume.
  • the illumination device comprises at least one light-emitting diode chip.
  • the illumination device comprises a plurality of light emitting diode chips.
  • the LED chip in operation, for example, produces light in the transmission region between the infrared radiation and the ultraviolet radiation.
  • the light-emitting diode chip forms the light source of the illumination device and thus produces light emitted by the illumination device during operation.
  • the lighting device comprises a heat sink.
  • the heat sink can have a plurality of heat dissipation fins.
  • the heat radiating fins are disposed, for example, on the outer surface of the heat sink and enlarge the outer surface of the heat sink. Thereby, a particularly large amount of heat is output from the cooling body to the environment through its outer surface.
  • the heat sink can be formed, for example, integrally with a plurality of heat dissipating fins. Furthermore, it is possible to mechanically fix the heat dissipation fins to the base body of the heat sink without forming the heat sink integrally with its heat dissipation fins.
  • the lighting device comprises a housing.
  • the housing at least partially houses at least a majority of the components of the illumination device, such as a light emitting diode chip or a heat sink.
  • the housing partially encloses the illumination device externally. That is to say that the outer surface of the housing facing away from the heat sink at least partially forms the outer surface of the illumination device.
  • the light-emitting diode chip is in thermal contact with the heat sink.
  • the light-emitting diode chip can be applied directly to the heat sink.
  • the light-emitting diode chip is thermally connected to the heat sink, so that the heat sink absorbs the heat generated by the light-emitting diode chip during operation.
  • the housing encloses the heat sink at least partially laterally. That is to say, the housing encloses the heat sink, for example in the transverse direction, which can be, for example, transverse or perpendicular to the main emission direction of the light produced by the light-emitting diode chip during operation.
  • the housing can enclose the heat sink in a completely lateral manner, so that the housing surrounds the lateral outer surface of the heat sink. It is especially possible that the housing does not have a lateral opening towards the heat sink. Therefore, the heat sink can be completely surrounded by the casing at least on its side.
  • the heat dissipating fins extend towards the housing. That is, the heat dissipating fins have a side facing the housing and a side facing away from the housing. On the side of the heat dissipation fin facing away from the housing, for example, a base body of the heat sink is provided.
  • the heat radiating fins have end faces on the side of the heat radiating fins facing the housing, and at least some of the heat radiating fins are in thermal contact with the housing on the end faces.
  • a thermally conductive material can be provided between the end face and the housing for this purpose.
  • the space between the end face and the housing is not filled with a gas such as air in the area of thermal contact.
  • the end face is in direct contact with the housing in the thermal contact position. That is, at least some of the end faces of the heat dissipating fins touch the case. In this way, a particularly good thermal connection and thus a particularly good heat transfer from the heat sink through the heat dissipation fins to the housing is possible.
  • the connection between the heat sink and the housing can be released without damage. That is to say, for the purpose of maintenance, for example, the housing can be released from the heat sink without damaging or even damaging the components of the lighting device.
  • the lighting device comprises at least one light-emitting diode chip, a heat sink with a plurality of heat-dissipating fins and a housing.
  • at least one of the light-emitting diode chips is in thermal contact with the heat sink, for example all of the lighting device
  • the photodiode chip is in thermal contact with the heat sink.
  • At least some of the heat dissipation fins of the heat sink extend toward the housing and are at least partially in thermal contact with the housing, in particular in direct contact, on its end face facing the housing.
  • the area for outputting heat from the illuminating device to the outside is increased by the thermal connection of the heat radiating fins and the casing to the area of the casing.
  • This enlargement of the area causes a cooling improvement, and also improves passive cooling, for example by convection between the air surrounding the illuminating device and the outer surface of the housing, wherein the outer surface directs the illuminating device outwardly to at least some of the radiating fins of the P UK
  • the housings are in direct contact with one another, which forms a good thermal connection of the heat sink and the housing.
  • a heat flow from the cooling body through the heat dissipating fins to the housing is obtained.
  • the heat sink and the housing are formed, for example, of a material which is thermally conductive, such as a metal.
  • the turbulent flow improves the passive cooling of the housing because it can pass through the housing.
  • the relatively hot outer surface undergoes heat exchange with the environment.
  • the size of the illuminating device, particularly the volume of the illuminating device, can be reduced with respect to the conventional illuminating device. In this way, almost the entire surface of the illumination device can be used for cooling.
  • the lighting device comprises a plurality of air ducts.
  • the air duct extends partially between the housing of the lighting device and the heat sink.
  • air for cooling the cooling body and the casing flows or flows through the air duct.
  • At least some of the air ducts for example at least 50%, in particular at least 90%, in extreme cases all of the air ducts are laterally bounded, ie in the transverse direction, by two immediately adjacent radiating fins and the casing.
  • the duct is formed by the housing and the cooling body, and air can flow through the duct.
  • the air flows both through the heat sink and through the inner surface of the housing facing the heat sink, so that the cooling of the housing and the heat sink takes place by means of the air.
  • the targeted guidance of the air flow through the lighting device is carried out via the air duct.
  • An air pressure differential can be created by natural convection and/or a ventilator that increases or pushes airflow through the air duct. At least some of the air ducts are laterally surrounded by the heat sink and the housing with its heat dissipating fins, so that the air flowing through the air duct for cooling can exchange heat with a particularly large area of the lighting device. Due to the thermal and mechanical connection between the heat sink and the housing, the air-flowing faces of the housing and the heat sink carry the same thermal energy and are cooled by the surrounding air. Since the enlarged surface to be cooled is provided by means of the casing, the speed of the air flow for cooling can be reduced compared to conventional lighting devices. In this way, the ventilators that may be present can also be constructed smaller and/or with a lower cooling power. In this manner, the size and/or cost and/or energy requirements of the lighting device can be further reduced relative to conventional lighting devices.
  • the heat sink has a recess in which at least one light-emitting diode chip is arranged.
  • the cooling body can be formed, for example, in a partially hollow manner. Therefore, the light-emitting diode chip of the illumination device can be arranged in the recess of the heat sink. In this way, the light-emitting diode chip of the illuminating device can also be laterally surrounded, that is to say surrounded by the heat sink in the transverse direction. In this way, the heat sink can absorb a particularly high amount of heat from the light-emitting diode chip, in particular in the operation of the light-emitting diode chip.
  • the inner surface of the heat sink facing the light-emitting diode chip can have optical properties, for example the optical properties of the reflector for the light emitted by the light-emitting diode during operation.
  • the recess can be arranged, for example, in the base body of the heat sink.
  • the heat sink comprises a base body, wherein at least some of the heat dissipation fins extend at least partially from the heat sink toward the housing, wherein at least some of the air ducts pass laterally through two adjacent heat sinks.
  • the ribs, the housing and the base of the heat sink are bounded. It is possible here that this applies to most of the heat dissipation fins, ie more than 50% of the heat dissipation fins, or in the extreme case all the heat dissipation fins.
  • the base body of the heat sink and the heat dissipation fins can be formed in one piece. In this case, the mechanical and thermal connection between the substrate and the heat dissipating fins is particularly good.
  • the housing completely surrounds the heat sink laterally and most of the heat dissipation ribs are at least partially in direct contact with the housing. That is In this case, more than 50% of the heat dissipating fins, for example 90% of the heat dissipating fins, are at least partially in direct contact with the housing. It is advantageous here if the contact surface between the heat dissipation fin and the housing is particularly large. For example, most of the end face of each heat sink facing the housing is in direct contact with the housing.
  • the air ducts extend along a majority of the heat sink.
  • the heat radiating fins of the heat sink extend, for example, perpendicularly or obliquely to the lateral direction.
  • the heat sink has a main extension direction in the direction of the main emission direction of the light generated by the light-emitting diode chip. Therefore, the heat dissipating fins extend at least partially along the main extension direction of the heat sink.
  • the heat dissipating fins which laterally delimit at least some of the air ducts preferably extend over at least 50% of the length of the base body of the heat sink, so that at least some of the air ducts can also extend along the majority of the heat sink. In this way, a particularly effective cooling of the heat sink is ensured.
  • the base body of the heat sink is at least partially formed in the form of a cylinder and/or a truncated cone, at least some of which are at least partially along the cylinder and/or the paraplegic
  • the busbar extends.
  • "in the form of a cylinder or a paraplegic” means that the base body does not have to have the shape of a mathematically precise cylinder or truncated cone, but the outer surface of the base body can in particular be very close to these geometrical shapes at least in sections.
  • the cylinder may be a normal cylinder.
  • the truncated cone can be a common truncated cone.
  • a general cylinder is understood to be a cylinder in which the base surface is not necessarily circularly formed but can be formed by any surface. Furthermore, in the case of a general cylinder, it is possible that it is a so-called inclined or skewed cylinder, wherein the bottom and top surfaces do not overlap directly, but are offset relative to one another. The corresponding applies to ordinary truncated cones.
  • the base body has a recess in which a light-emitting diode chip of the illumination device can be disposed.
  • the illumination device comprises a light exit side provided with a light exit surface. At least a portion, in particular a majority of the light generated by the at least one light-emitting diode chip during operation, exits the illumination device through the light exit surface. Especially It is possible that all of the light emitted by the illumination device during operation exits the illumination device through the light exit face.
  • the light exit face can be placed in the larger outer surface of the illumination device on the light exit side of the illumination device.
  • the illumination device includes at least one gas permeable opening disposed on the light exit side.
  • the air from the air duct can be discharged from the illuminating device in particular through the venting opening or the air can be drawn into the air duct from the outside through the venting opening. That is to say, the air for cooling the heat sink and the base body is currently not led out of the illumination device through the opening of the base body, but the air is at least partially discharged in the direction of the light emitted from the illumination device or vice versa This direction is inhaled.
  • a lighting device in which it is not necessary to provide a space for air discharge laterally to the lighting device.
  • the illuminating device can be inserted into the opening, for example in an extremely precise manner, for example in a cover or wall, and these openings do not have to provide a space for absorbing the discharged air.
  • venting openings are arranged around the light exit face, for example at a distance from one another.
  • one or more venting openings can surround the light exit face in a frame shape.
  • air from at least one of the air ducts flows through each of the ventilation openings or each of the ventilation openings supplies air drawn by at least one of the air ducts .
  • the end of each air duct on the light exit side of the illumination device itself forms a venting opening.
  • a plurality of air ducts lead to a common venting opening.
  • one or more venting openings may partially enclose the light exit face on the light exit side of the illuminating device.
  • one or more venting openings can surround the light exit face in a frame shape.
  • an air filter is provided on each venting opening, for example in the form of a mesh of fine mesh made of plastic or metal.
  • the air filter is responsible for: No dust can pass through the associated venting opening into the lighting device while the air is being drawn.
  • the lighting device comprises a fan which is arranged on the side of the housing facing away from the light exit side.
  • a ventilator is used to force air, in particular through the air duct, to the light exit side or to draw air from the light exit side. If air is directed to the light exit side, air can leak through the at least one venting opening on the light exit side. In the case where the ventilator draws air from the light exit side, the air leaks on the side of the illuminating device that faces away from the light exit side.
  • the ventilator comprises a rotor having a rotational axis that is not perpendicular to the light exit surface.
  • the fan and the light exit side are not arranged directly on one another, but the housing can have a curvature, for example, such that the axis of rotation of the rotor is inclined, in the extreme case parallel to the light exit side of the illumination device. This curved configuration of the housing achieves a reduction in the height of the illuminator structure.
  • 1A, 1B, 1C, ID show a first embodiment of a lighting device described herein and a schematic view of the components of the lighting device.
  • FIGS. 2A, 2B and 2C detail the cooling of the illumination device described herein.
  • 3A, 3B, 3C show schematic perspective views of other embodiments of the illumination device described herein.
  • FIG 1A shows a schematic top view of a horizontal section through a section of a lighting device as described herein.
  • Figure 1B shows a perspective cutaway view of a corresponding embodiment of a lighting device.
  • the lighting device comprises a cooling body 2.
  • the heat sink 2 has a base body 22, the current outer surface of which is constructed in the form of a truncated cone.
  • the heat dissipating fins 21 integrally formed with the base body 22 of the heat sink extend along the generatrices of the truncated cone.
  • the heat dissipating fin 21 body 22 extends towards the housing 3, which completely encloses the heat sink 2 in the transverse direction 1.
  • the end face 210 of the heat radiating fin 21 facing the casing 3 faces the inner surface of the casing 3. Most or all of the heat dissipating fins 21 are at least partially in contact with the casing 3 on their end faces 210.
  • the housing 3 and the heat sink 2 are currently connected to one another by means of a fastening means 5, which can be formed, for example, as a screw, as a cooperating pin or as a bolt.
  • the heat sink 2 which is currently the base body 22 of the heat sink 2, has a recess 23 in which a light-emitting diode chip 1 as a light source of the illumination device is arranged.
  • the light-emitting diode chip 1 is arranged, for example, on a connection carrier 10, for example a circuit board, which is in turn fixed in the recess on the mounting surface 24 of the heat sink 2.
  • the inner surface of the recess 23 facing the light-emitting diode chip 1 may be configured to reflect the electromagnetic radiation emitted by the light-emitting diode chip 1 such that the recess 23 acts as a reflector.
  • an optical element not shown, such as a lens, can be provided in the recess 23 for shaping the light beam produced by the light-emitting diode chip 1 during operation.
  • the illuminating device has a ventilator 7, which is arranged on the side facing away from the light exit side 6 of the illuminating device and drives or absorbs the air 41 passing through the cooling body 2 and the casing 3.
  • FIG. 1C shows a partially enlarged view in which the air duct 4 is shown.
  • the air duct 4 is laterally bounded by the immediately adjacent heat dissipation fins 21 and the base body of the housing 3 and the heat sink 2 .
  • the air 41 for cooling the casing 3 and the cooling body 2 is guided through the air ducts 4 through these elements.
  • FIG. 1D shows the stand of the heat sink 2 with the heat dissipation fins 21 on the base body 22 for this purpose.
  • an air duct 4 is formed between the heat radiating fins.
  • the temperature of the cooling body is reduced by about 25%.
  • the decrease in temperature is caused by an enlargement as follows, on which heat can be exchanged with the environment.
  • the volume of the illumination device can be correspondingly reduced.
  • the ventilator 7 includes at least one rotor 71 that rotates about an axis of rotation 72.
  • the ventilator draws air 41 into the interior of the luminaire, i.e., through the area enclosed by the housing 3, and drives air 41 through the air duct 4 toward the light exit side 6 of the luminaire.
  • the axis of rotation 72 is not perpendicular to the light exit side 6, in this way it is possible to carry out a uniform flow of the cooling body in the transverse direction.
  • the heat dissipation ribs 21 are stretched over the upper side of the base body 22 of the heat sink 2 facing away from the light exit side 6 , so that air can be introduced into or from the air duct 4 (for this purpose, see also FIG. 1D). ). Furthermore, the upper side of the heat sink facing the fan 7 can be formed in an arched manner. That is to say, in particular, the base body 22 has a convex curvature here. This configuration also improves the guidance of the air 41 along the entire outer surface of the heat sink.
  • a simulation of the air flow is symbolically shown by arrow 41 in connection with Figure 2B for one embodiment of the illumination device.
  • an air flow is formed around the illumination device, i.e., the outer surface of the substrate 3 facing away from the heat sink 2, which air flow is also beneficial for cooling the illumination device on the outer surface of the illumination device.
  • the base body 3 has approximately the same temperature as the heat sink body 2.
  • the illumination device is thus effectively cooled by free convection (see also Fig. 2C for this).
  • the illumination device comprises on the light exit side 6 a light exit surface 61 through which light generated by the light emitting diode chip 1 exits the illumination device.
  • the light exit surface 61 is partially surrounded by a venting opening 42 through which air 41 from the air duct 4 is blown from the illuminating device or through which air is drawn from the environment. That is, in particular, the air does not have to leak laterally from the opening in the casing 3 in the lateral direction.
  • the illumination device further comprises a holding device 8, which is arranged for mounting the illumination device in a cavity, for example in a wall or a cover.
  • a holding device is set forth in detail in, for example, International Patent Application No. PCT/CN 2010/079,569, the entire disclosure of which is hereby incorporated by reference.
  • the expansion of the illumination device described herein allows for particularly efficient cooling of the illumination device.
  • the illumination device can be further reduced in its size, particularly in its volume. It is also possible to determine the size of the ventilator in terms of size and/or cooling power.
  • the air duct also allows for a curved configuration of the housing of the lighting device without thereby obtaining a location of poor cooling on the cooling body or housing.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

照明装置 技术领域
[01]本发明涉及一种照明装置。 背景技术
[02]参考文献 EP 2025999描述了一种照明装置, 其中用于冷却 照明装置的空气侧向地从照明装置的壳体穿过在壳体中为其设 置的开口排出。 在此, 照明装置的壳体以及冷却体彼此热分开。 发明内容
[03]要实现的目的在于, 提出一种照明装置, 其可以在其尺寸, 特别在其体积方面特别小地构成。
[04]根据照明装置的至少一个实施形式,照明装置包括至少一个 发光二极管芯片。优选的是,照明装置包括多个发光二极管芯片。 发光二极管芯片在工作中例如产生在红外辐射和紫外辐射之间 的傳区域中的光。发光二极管芯片尤其形成照明装置的光源并且 因此产生由照明装置在工作中所发出的光。
[05]根据照明装置的至少一个实施形式, 照明装置包括冷却体。 冷却体尤其可以具有多个散热肋片。散热肋片例如设置在冷却体 的外表面上并且扩大冷却体的外表面。 由此,特别多热量由冷却 体通过其外表面输出给环境。冷却体例如可以与多个散热肋片一 体地构成。此外可能的是,将散热肋片以机械方式固定于冷却体 的基体, 而没有将冷却体与其散热肋片一体地构成。
[06]根据照明装置的至少一个实施形式, 照明装置包括壳体。 壳 体至少局部地容纳照明装置的至少大部分部件,例如发光二极管 芯片或冷却体。 壳体局部地对外封闭照明装置。 也就是说, 壳体 的背离冷却体的外表面至少局部地形成照明装置的外表面。
[07]根据照明装置的至少一个实施形式,发光二极管芯片与冷却 体热接触。 例如, 发光二极管芯片可以直接地施加到冷却体上。 还可能的是,将一个或多个连接支承体一一例如一个或多个电路 板一一固定在冷却体上,并且将发光二极管芯片在连接支承体的 背离冷却体的侧上固定并且电连接。发光二极管芯片在任何情况 下都热连接到冷却体上,使得冷却体吸收由发光二极管芯片在工 作中所产生的热量。
[08]根据照明装置的至少一个实施形式,壳体至少局部地侧向包 围冷却体。也就是说, 壳体例如沿横向方向包围冷却体, 所述横 向方向例如可以横向于或者垂直于由发光二极管芯片在工作中 所产生的光的主发射方向。在此, 壳体尤其可以完全侧向地包围 冷却体, 使得壳体围绕冷却体的侧向的外表面。 尤其可能的是, 壳体不具有朝向冷却体的侧向开口。 因此,冷却体可以至少在其 侧面上被壳体完全围绕。
[09]根据照明装置的至少一个实施形式,散热肋片中的至少一些 朝着壳体延伸。也就是说,散热肋片具有朝向壳体的侧和背离壳 体的侧。在散热肋片的背离壳体的侧上例如有冷却体的基体。散 热肋片在散热肋片的朝向壳体的侧上具有端面,至少一些散热肋 片在所述端面上与壳体热接触。例如, 为此可以在端面和壳体之 间设置导热材料。尤其是,端面与壳体之间的空间在热接触的区 域中并未填充如空气的气体。尤其可能的是,端面在热接触位置 上与壳体直接接触。也就是说,至少一些散热肋片的端面触碰壳 体。 以这种方式,尤其好的热连接并且因此从冷却体经过散热肋 片到壳体的尤其好的导热是可能的。尤其可以构成在冷却体的材 料与壳体的材料之间的接触面,而不用设置其他材料来引起在热 接触位置上的接触。 因此,在冷却体和壳体之间的连接尤其可以 是可无损坏地松开。也就是说, 例如为了维护的目的, 可以将壳 体从冷却体松开, 而在此没有损害或者甚至损毁照明装置的部 件。
[10]根据照明装置的至少一个实施形式,照明装置包括至少一个 发光二极管芯片、具有多个散热肋片的冷却体和壳体。在此, 至 少一个发光二极管芯片与冷却体热接触,例如照明装置的全部发 光二极管芯片与冷却体热接触。 壳体至少局部地包围冷却体,例 如完全地包围,并且冷却体的至少一些散热肋片朝着壳体延伸并 且在其朝向壳体的端面上至少局部地与壳体热接触,尤其直接接 触。
[11]通过散热肋片和壳体的热连接,用于将热量从照明装置向外 部输出的面积增加了壳体的面积。 面积的这种扩大引起冷却改 进,还改进例如通过包围照明装置的空气和壳体的外表面之间的 对流引起的被动冷却,其中所述外表面将照明装置向外 P UK至 少一些散热肋片和壳体彼此尤其直接才 接触,这形成冷却体和 壳体的良好的热连接。尤其得到从冷却体经过散热肋片到壳体的 热流。
[12]为此, 冷却体和壳体例如由良好导热的材料形成, 如金属。
[13]由于冷却体和壳体通过散热肋片进行的热平衡而在发光装 置的工作中具有基^目同的温度,所以通 it†流改进了壳体的被 动冷却,因为可以通过壳体的相对热的外表面进行与环境的热交 换。
[14]因为通过壳体扩大了照明装置的能够与环境进行热交换的 面积, 所以相对于传统的照明装置能够减小照明装置的尺寸,尤 其是照明装置的体积。 以这种方式,照明装置的几乎整个表面可 以用于冷却。
[15]根据照明装置的至少一个实施形式,照明装置包括多个空气 管道。 空气管道局部地在照明装置的壳体和冷却体之间延伸。在 照明装置工作中,用于对冷却体和壳体进行冷却的空气流过或者 涌流过空气管道。 至少一些空气管道, 例如至少 50% , 尤其至 少 90% , 在极端情况下全部的空气管道, 侧向地, 即沿横向方 向通过两个紧邻的散热肋片和壳体来限界。换而言之, 由于散热 肋片局部地与壳体机械连接, 所以通过壳体和冷却体构成管道, 空气可以涌流过所述管道。该空气既流经冷却体还流经壳体的朝 向冷却体的内表面, 使得借助该空气进行壳体和冷却体的冷却。 通过空气管道进行气流穿过照明装置的有针对性的引导。
[16]通过自然对流和 /或通风机可以产生空气压力差, 所述压力 差增大或者推动穿过空气管道的气流。至少一些空气管道侧向地 通过带有其散热肋片的冷却体和壳体来围绕,使得流过空气管道 的、 用于冷却的空气能够与照明装置特别大的面积进行热交换。 由于在冷却体和壳体之间的热连接和机械连接,壳体和冷却体的 由空气绕流的面承载相同的热能并且通过绕流的空气均勾地冷 却。 由于借助壳体提供了扩大的待冷却的面,相比较于传统的照 明装置能够降低用于冷却的气流的速度。 以这种方式,可能存在 的通风机还能够更小地构成和 /或以更低的冷却功率构成。 以这 种方式,相对于传统的照明装置可以进一步降低照明装置的大小 和 /或成本和 /或能量需求。
[17]根据照明装置的至少一个实施形式, 冷却体具有凹部, 在所 述凹部中设置有至少一个发光二极管芯片。也就是说,冷却体例 如能够局部空心地构成。 因此,在冷却体的凹处中能够设置照明 装置的发光二极管芯片。照明装置的发光二极管芯片以这种方式 也能够侧向地, 即以横向方向由冷却体包围。冷却体能够以这种 方式尤其在发光二极管芯片工作中从发光二极管芯片吸收特别 多的热量。此外可能的是,冷却体的朝向发光二极管芯片的内表 面具有光学特性,例如用于由发光二极管在工作中发射的光的反 射器的光学特性。 凹部例如能够设置在冷却体的基体中。
[18]根据照明装置的至少一个实施形式, 冷却体包括基体, 其中 至少一些散热肋片至少局部地从冷却体中朝着壳体延伸,其中至 少一些空气管道侧向地通过两个紧邻的散热肋片、壳体和冷却体 的基体来限界。 在此可能的是, 这适用于大部分的散热肋片, 即 超过 50%的散热肋片, 或者在极端情况下全部的散热肋片。 在 此, 冷却体的基体和散热肋片能够一体地构成。 在这种情况下, 在基体和散热肋片之间的机械和热连接尤其好。
[19]根据照明装置的至少一个实施形式,壳体侧向完全地围绕冷 却体并且大部分的散热肋片至少局部地与壳体直接接触。也就是 说, 在这种情况下, 超过 50%的散热肋片, 例如 90%的散热肋 片至少局部地与壳体直 触。在此有利的是,散热肋片和壳体 之间的接触面特别大。例如,每个冷却体的朝向壳体的端面的大 部分与壳体直接接触。
[20]根据照明装置的至少一个实施形式,至少一些空气管道沿着 冷却体的大部分延伸。冷却体的散热肋片例如垂直于或者倾斜于 横向方向来延伸。例如,冷却体在由发光二极管芯片所产生的光 的主发射方向的方向中具有主延伸方向。 因此,散热肋片至少局 部地沿着冷却体的该主延伸方向延伸。在此,侧向对至少一些空 气管道限界的散热肋片优选地在冷却体的基体的至少 50%的长 度上延伸,使得至少一些空气管道还能够沿着冷却体的大部分延 伸。 以这种方式, 确保冷却体的尤其有效的冷却。
[21]根据照明装置的至少一个实施形式,冷却体的基体至少局部 地按照圆柱体和 /或截锥的形式成型, 其中至少一些散热肋片至 少局部地沿着圆柱体和 /或截雉的母线延伸。 在此, "按照圆柱体 或者截雉的形式"表示,基体不必具有数学上精确的圆柱体或截 锥的形状,而是基体的外表面尤其可以至少以分区段的方式非常 接近这些几何形状。
[22]特别地, 圆柱体可以为普通的圆柱体。截锥可以为普通的截 锥。普通的圆柱体理解为如下圆柱体, 在该圆柱体的情况下, 基 面不强制圆形地构成, 而是能够通过任意面来形成。 此外, 在普 通的圆柱体的情况下可能的是,其为所谓的倾斜的或者歪斜的圆 柱体,其中底面和顶面不直接重叠,而是相对于彼此偏移地设置。 相应物适用于普通的截锥。
[23]例如,基体具有凹部, 在所述凹部中能够设置照明装置的发 光二极管芯片。
[24]根据照明装置的至少一个实施形式,照明装置包括设置有光 出射面的光出射侧。至少一部分,尤其大部分由至少一个发光二 极管芯片在工作时产生的光穿过光出射面从照明装置出射。尤其 可能的是,所有由照明装置在工作中发射的光穿过光出射面离开 照明装置。
[25]光出射面能够在照明装置的光出射侧上设置在照明装置的 较大的外表面内。
[26]此外, 照明装置包括设置在光出射侧上的至少一个透气开 口。来自空气管道的空气尤其可以通过透气开口从照明装置排出 或者空气从外部穿过透气开口被吸入到空气管道中。 也就是说, 用于对冷却体以及基体进行冷却的空气当前没有穿过基体的开 口以横向方向从照明装置中导出,而是空气至少部分地以从照明 装置出射的光的方向排放或者相反于这个方向被吸入。
[27]以这种方式提出了一种照明装置,其中不必侧向于照明装置 设置用于空气排放的空间。照明装置能够以这种方式例如极其精 确匹配地插入到开口中,例如在盖板或者壁中, 而这些开口不必 提供用于吸收排出的空气的空间。
[28]尤其可能的是, 两个或多个透气开口包围光出射面。 因此, 透气开口围绕着光出射面,例如彼此隔开一定的距离设置。例如, 一个或多个透气开口能够框架状地围绕光出射面。
[29]根据照明装置的至少一个实施形式, 在照明装置工作中, 来 自空气管道中的至少一个的空气穿流每个透气开口或者每个透 气开口为空气管道中的至少一个供应所吸取的空气。例如,每个 空气管道在照明装置的光出射侧上的端部本身形成透气开口。此 外可能的是, 多个空气管道通向共同的透气开口。在此, 一个或 多个透气开口可以局部地包围在照明装置的光出射侧上的光出 射面。 例如, 一个或多个透气开口能够框架状地围绕光出射面。
[30]根据照明装置的至少一个实施形式,在每个透气开口上设置 有空气过滤器, 例如以由塑料或者金属组成的细网眼的网为形 式。 该空气过滤器负责: 在吸取空气时, 没有灰尘能够穿过相关 联的透气开口 ^到照明装置中。 [31]根据照明装置的至少一个实施形式, 照明装置包括通风机, 所述通风机设置在壳体的背离光出射侧的侧上。通风机用于, 迫 使空气尤其穿过空气管道直至光出射侧或者从光出射侧吸取空 气。如果将空气导向到光出射侧,那么空气可以在光出射侧通过 至少一个透气开口泄露。 对于通风机从光出射侧吸取空气的情 况, 空气在照明装置的背离光出射侧的侧上泄露。
[32]根据照明装置的至少一个实施形式,通风机包括具有旋转轴 线的转子, 所述旋转轴线不垂直于光出射面。换而言之, 通风机 和光出射侧不直接彼此重叠地设置,而是壳体例如可以具有弯曲 部,使得转子的旋转轴线倾斜于,在极端情况下平行于照明装置 的光出射侧走向。壳体的这种弯曲的构造实现照明装置结构高度 的降低。
[33]然而, 由于存在如下空气管道, 所以气体沿着冷却体的外表 面和壳体的内表面来引导,其中至少一部分空气穿过所述空气管 道由通风机驱动或者取得。 以这种方式,尽管有壳体的弯曲的构 型,在冷却体或者壳体上仍然基本没有或者完全没有出现显著热 于壳体或者冷却体的其他位置的位置。也就是说, 由于空气管道 的构成, 在弯曲构成的壳体中特别均匀的冷却也是可能的。 附图说明
[34]下面借助实施例和相关附图详细阐明在此描述的照明装置。
[35]图 1A、 1B、 1C、 ID示出在此描述的照明装置的第一实施 例以及该照明装置的部件的示意图。
[36]图 2A、 2B和 2C详细阐明在此说明的照明装置的冷却。
[37]图 3A、 3B、 3C示出在此描述的照明装置的其他实施例的示 意立体图。
[38]相同的、同类的或者相同作用的元件在附图中设有相同的附 图标记。附图和在附图中示出的元件的彼此间的大小关系不应视 为按照比例的。 相反地, 为了更好的可示出性和 /或为了更好的 理解可以夸张更大地示出各个元件。 具体实施方式
[39]图 1A示出通过在此描述的照明装置的部段的水平截面的示 意性俯视图。 图 1B示出照明装置的一个相应的实施例的透视截 面图。 照明装置包括冷却体 2。 冷却体 2具有基体 22, 所述基体 当前的外表面按照截锥的形式构成。 与冷却体的基体 22—体地 构成的散热肋片 21 沿着截锥的母线延伸。 散热肋片 21 体 22朝着壳体 3延伸,所述壳体在横向方向 1中完全地包围冷却体 2。
[40]散热肋片 21的朝向壳体 3的端面 210朝向壳体 3的内表面。 大多数或者全部散热肋片 21在其端面 210上至少分区段地与壳 体 3直 触。壳体 3和冷却体 2当前通过固定机构 5才0¾地彼 此连接, 所述固定机构例如可以构成为螺钉、 配合销或螺栓。
[41]冷却体 2, 当前也就是冷却体 2的基体 22, 具有凹部 23, 在所述凹部中设置有作为照明装置光源的发光二极管芯片 1。发 光二极管芯片 1例如设置在例如为电路板的连接支承体 10上, 所述电路板又在凹部中固定在冷却体 2的安装面 24上。 凹部 23 的朝向发光二极管芯片 1 的内表面可以构成为反射由发光二极 管芯片 1所发射的电磁辐射,使得凹部 23作用为反射器。此外, 在凹部 23中能够设置例如为透镜的未示出的光学元件, 其用于 将发光二极管芯片 1在工作中所产生的光射束成型。
[42]此外, 照明装置具有通风机 7, 所述通风机设置在背离照明 装置的光出射侧 6的侧上并且驱动或者吸收经过冷却体 2和壳体 3的空气 41。
[43]空气至少局部地通过空气管道 4来引导。 图 1C示出了部分 放大图, 其中示出空气管道 4。 空气管道 4侧向地通过紧邻的散 热肋片 21以及壳体 3和冷却体 2的基体来限界。 用于冷却壳体 3和冷却体 2的空气 41通过空气管道 4来引导经过这些元件。 图 1D为此示出具有在基体 22上的散热肋片 21的冷却体 2的立 体图, 在所述散热肋片之间构成空气管道 4。
[44]在照明装置的工作中,由于在冷却体 2和基体 3之间的热连 接, 也就是说由于散热肋片 21的端面 210与壳体 3接触, 相对 于并不这样热连接到壳体上的冷却体,冷却体的温度降低了大约 25%。温度的降低通过如下面的扩大而引起,在所述面上可以与 环境交换热量。 因此, 例如可以将照明装置的体积相应地变小。
[45]结合图 2A、 2B和 2C详细阐明照明装置的冷却。 在图 2A 中, 根据立体截面图示出, 通风机 7包括至少一个转子 71 , 所 述转子围绕着旋转轴线 72转动。 当前,通风机将空气 41抽入到 照明装置的内部区域中,也就是通过壳体 3所围绕的区域,并且 朝着照明装置的光出射侧 6驱动空气 41穿过空气管道 4。 尽管 有在图 2A中示出的壳体 3的弯曲的实施方式, 即旋转轴线 72 不垂直于光出射侧 6,但是以这种方式能够进行在横向方向中的 冷却体的均勾绕流。
[46]为此,散热肋片 21被拉伸超过冷却体 2的基体 22的背离光 出射侧 6的上侧,使得实现将空气导入空气管道 4或者从其中导 出(为此尤其还参见图 1D )。 此外, 冷却体的朝向通风机 7的上 侧可以拱形弯曲地构成。 也就是说, 因此尤其基体 22在此具有 凸起的弯曲部。 这种构型还改进空气 41沿着冷却体的整个外表 面的引导。
[47]结合图 2B针对照明装置的一个实施例通过箭头 41象征性地 示出了气流的模拟图。在此能够看出, 围绕照明装置, 即围绕基 体 3的背离冷却体 2的外表面构成气流,所述气流还有益于在照 明装置的外表面上冷却照明装置。 这由于基体 3具有与冷却体 2 大约相同的温度而是尤其有利的。特别地, 由此还通过自由对流 得到照明装置有效地冷却(对此还参见图 2C )。
[48]不同于在图 2A和 2B中示出的驱动形式, 还可以驱动通风 机, 使得由通风机 7通过空气管道 4吸取空气 41。 然后在通风 机 7上排放空气 41。 这种驱动形式的优点是, 如果从空间中将 空气 41吸入到照明装置中, 可以简化照明装置的清洁。 仅需要 从透气开口 42中移除灰尘。为此,还能够在透气开口 42之前或 者在透气开口 42处设置空气过滤器。
[49]当将空气 41吹离光出射侧 6, 例如吹到空间中时, 缺点是 例如绝缘材料的灰尘在通风机开口上聚集并且可以阻塞或者堵 塞通风机 7, 所述绝缘材料在固定有照明装置的盖板中。 因此, 对于清洁, 必须将照明装置从盖板中取出。
[50]结合图 3A至 3C的立体图详细阐明在此说明的照明装置的 另一实施例。 照明装置在光出射侧 6上包括光出射面 61, 由发 光二极管芯片 1所产生的光穿过所述光出射面离开照明装置。光 出射面 61局部地由透气开口 42所包围,源自空气管道 4的空气 41 穿过所述透气开口从照明装置中吹出或者穿过所述透气开口 从环境中吸取空气 41。 也就是说, 特别地, 空气不必须侧向地 以横向方向从壳体 3中的开口中泄露。
[51]照明装置还包括保持装置 8, 所述保持装置设置用于将照明 装置安装在空腔中,例如在壁或者盖板中。例如在国际专利申请 PCT/CN 2010/079569 (同样见 DE 102009057443.3 )中详细阐明 这种保持装置, 其公开内容在此明确地通过引用结合于此。
[52]特别地,在此描述的照明装置的扩展方案允许照明装置的尤 其有效的冷却。 由此, 照明装置能够在其尺寸, 特别在其体积方 面进一步减小。 还能够在大小和 /或冷却功率方面更小地来确定 通风机的尺寸。此外, 空气管道还允许照明装置的壳体的弯曲的 构型, 而没有由此在冷却体或壳体上获得不良冷却的位置。
[53]本发明不通过借助实施例的描述而局限于此。相反, 本发明 包括任意新的特征以及这些特征的任意组合,这尤其包含权利要 求中的特征的任意组合,即使该特征或该组合本身没有明确地在 权利要求或实施例中说明。
[54]本专利申请要求德国专利申请 102011008613.7的优先权,其 公开内容通过引用结合于此。

Claims

权 利 要 求
1. 照明装置, 其具有
- 至少一个发光二极管芯片 ( 1),
- 具有多个散热肋片 (21) 的冷却体(2), 和
- 壳体(3), 其中
- 所述至少一个发光二极管芯片 ( 1) 与所述冷却体(2) 热接触,
- 所述壳体(3)至少局部地侧向包围所述冷却体(2), - 所述散热肋片 (21) 中的至少一些朝着所述壳体(3) 延伸并且在其朝向所述壳体( 3 )的端面( 210 )上至少局 部地与所述壳体(3)接触, 尤其是直接接触。
2. 根据上一项权利要求所述的照明装置, 具有多个空气 管道(4), 在所述照明装置工作中, 用于冷却所述冷却体(2) 和所述壳体(3) 的空气(41) 流过所述空气管道, 其中所述 空气管道(4) 中的至少一些侧向地通过两个紧邻的散热肋片
( 21 )和所述壳体( 3 )来限界。
3. 根据上述权利要求之一所述的照明装置, 其中所述冷 却体(2)具有凹部(23), 在所述凹部中设置有所述至少一个 发光二极管芯片 ( 1)。
4. 根据上述权利要求之一所述的照明装置, 其中所述冷 却体(2)包括基体(22), 其中所述散热肋片 (21) 中的至少 一些至少局部地从所述基体 (22)朝着所述壳体(3)延伸, 其中所述空气管道(4) 中的至少一些侧向地通过两个紧邻的 散热肋片 (21)、 所述壳体(3)和所述冷却体(2) 的所述基 体( 22 )来限界。
5. 根据上述权利要求之一所述的照明装置, 其中所述壳 体(3)侧向完全地围绕所述冷却体(2), 并且所述散热肋片 (21) 的大部分至少局部地与所述壳体(3) 直接接触。
6. 根据上述权利要求之一所述的照明装置, 其中所述空 气管道(4)中的至少一些沿着所述冷却体(2)的大部分延伸。
7. 根据上述权利要求之一所述的照明装置, 其中所述冷 却体(2)的所述基体 (22)至少局部地按照圆柱体和 /或截雉 的形式成型,其中所述散热肋片中的至少一些至少局部地沿着 所述圆柱体和 /或截锥的母线延伸。
8. 根据上述权利要求之一所述的照明装置, 其中所述冷 却体(2) 的所述基体 (22) 至少局部地按照倾斜圆柱体和 / 或倾斜截锥的形式成型,其中所述散热肋片中的至少一些至少 局部地沿着所述倾斜圆柱体和 /或倾斜截锥的母线延伸。
9. 根据上述权利要求之一所述的照明装置, 具有光出射 侧 (6), 在所述光出射侧上设置有光出射面 (61), 其中
- 由所述至少一个发光二极管芯片在工作中所产生的光 的至少一部分穿过所述光出射面(61)离开所述照明装置, 并 且
- 在所述光出射侧(6)上设置有至少一个透气开口(42)。
10. 根据上述权利要求之一所述的照明装置,其中在所述 照明装置的工作中, 来自所述空气管道(4) 中的至少一个的 空气(41) 穿流每个所述透气开口 (42), 或者每个所述透气 开口 (42)将空气(41)输出到所述空气管道(4) 的至少一 个中。
11. 根据上述权利要求之一所述的照明装置, 其中在所述 照明装置的工作中, 来自所述空气管道(4) 中的多个的空气
(41) 穿流每个所述透气开口 (42), 或者每个所述透气开口
(42)将空气(41)输出到多个空气管道(4) 中。
12. 根据上述权利要求之一所述的照明装置,其中所述至 少一个透气开口 (42)局部地包围在所述光出射侧 (6) 上的 所述光出射面 (61)。
13. 根据上述权利要求之一所述的照明装置,具有在所述 壳体(3)的背离所述光出射侧(6)的侧上的通风机(7), 其 中所述通风机(7)在工作中将空气(41)输出到所述空气管 道(4) 中或者通过所述空气管道(4)吸取空气(41)。
14. 根据上述权利要求之一所述的照明装置,其中所述通 风机(7) 的转子 (71) 的旋转轴线 (72) 不垂直于所述光出 射侧 ( 6 )。
15. 根据上述权利要求之一所述的照明装置,其中所述壳 体(3) 弯曲地构成。
PCT/CN2012/070318 2011-01-14 2012-01-13 照明装置 WO2012095019A1 (zh)

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