WO2012089286A8 - Beschichtungsvorrichtung mit einer hipims-leistungsquelle - Google Patents

Beschichtungsvorrichtung mit einer hipims-leistungsquelle Download PDF

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Publication number
WO2012089286A8
WO2012089286A8 PCT/EP2011/000372 EP2011000372W WO2012089286A8 WO 2012089286 A8 WO2012089286 A8 WO 2012089286A8 EP 2011000372 W EP2011000372 W EP 2011000372W WO 2012089286 A8 WO2012089286 A8 WO 2012089286A8
Authority
WO
WIPO (PCT)
Prior art keywords
power source
hipims power
coating apparatus
cathodes
hipims
Prior art date
Application number
PCT/EP2011/000372
Other languages
English (en)
French (fr)
Other versions
WO2012089286A1 (de
Inventor
Frank Papa
Roel Tietema
Anthonie KALAND
Original Assignee
Hauzer Techno Coating Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hauzer Techno Coating Bv filed Critical Hauzer Techno Coating Bv
Priority to EP11701627A priority Critical patent/EP2529386A1/de
Priority to JP2013509452A priority patent/JP5647337B2/ja
Priority to US13/575,709 priority patent/US20130276984A1/en
Publication of WO2012089286A1 publication Critical patent/WO2012089286A1/de
Publication of WO2012089286A8 publication Critical patent/WO2012089286A8/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Eine Beschichtungsvorrichtung mit einer Vakuumkammer, mehreren darin angeordneten Kathoden sowie eine HIPIMS-Leistungsquelle, zeichnet sich dadurch aus, dass zusätzlich zu mindestens einer Beschichtungskathode, die mit der HIPIMS-Leistungsquelle betreibbar ist, mehrere flächenmäßig im Vergleich zu der Beschichtungskathode kleinere Ätzkathoden vorgesehen sind, die in einer vorgegebenen oder vorgebbaren Reihenfolge an der HIPIMS-Leistungsquelle anschließbar sind.
PCT/EP2011/000372 2010-01-29 2011-01-27 Beschichtungsvorrichtung mit einer hipims-leistungsquelle WO2012089286A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP11701627A EP2529386A1 (de) 2010-01-29 2011-01-27 Beschichtungsvorrichtung mit einer hipims-leistungsquelle
JP2013509452A JP5647337B2 (ja) 2010-01-29 2011-01-27 Ｈｉｐｉｍｓ電源を備えるコーティング装置
US13/575,709 US20130276984A1 (en) 2010-01-29 2011-01-27 Coating apparatus having a hipims power source

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202010001497U DE202010001497U1 (de) 2010-01-29 2010-01-29 Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle
DE202010001497.2 2010-01-29

Publications (2)

Publication Number Publication Date
WO2012089286A1 WO2012089286A1 (de) 2012-07-05
WO2012089286A8 true WO2012089286A8 (de) 2012-10-18

Family

ID=42115054

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/000372 WO2012089286A1 (de) 2010-01-29 2011-01-27 Beschichtungsvorrichtung mit einer hipims-leistungsquelle

Country Status (5)

Country Link
US (1) US20130276984A1 (de)
EP (1) EP2529386A1 (de)
JP (1) JP5647337B2 (de)
DE (1) DE202010001497U1 (de)
WO (1) WO2012089286A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
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MY183993A (en) * 2011-04-20 2021-03-17 Oerlikon Trading Ag Method for supplying sequential power impulses
DE102011018363A1 (de) * 2011-04-20 2012-10-25 Oerlikon Trading Ag, Trübbach Hochleistungszerstäubungsquelle
DE102011117177A1 (de) * 2011-10-28 2013-05-02 Oerlikon Trading Ag, Trübbach Verfahren zur Bereitstellung sequenzieller Leistungspulse
US20140262748A1 (en) 2011-07-15 2014-09-18 Ihi Hauzer Techno Coating B.V. Apparatus and method for the pretreatment and/or for the coating of an article in a vacuum chamber with a hipims power source
EP2565291A1 (de) 2011-08-31 2013-03-06 Hauzer Techno Coating BV Vakuumbeschichtungsvorrichtung und Verfahren zum Abscheiden von Nanoverbundbeschichtungen
EP2587518B1 (de) * 2011-10-31 2018-12-19 IHI Hauzer Techno Coating B.V. Vorrichtung und Verfahren zur Abscheidung wasserstofffreier ta-C-Schichten auf Werkstücken und Werkstück
DE102011117994A1 (de) 2011-11-09 2013-05-16 Oerlikon Trading Ag, Trübbach HIPIMS-Schichten
RU2632210C2 (ru) 2011-12-05 2017-10-03 Эрликон Серфиз Солюшнз Аг, Пфеффикон Способ реактивного распыления
DE102011121770A1 (de) * 2011-12-21 2013-06-27 Oerlikon Trading Ag, Trübbach Homogenes HIPIMS-Beschichtungsverfahren
DE102012021346A1 (de) * 2012-11-01 2014-08-28 Oerlikon Trading Ag, Trübbach Leistungsverteiler zur definierten sequenziellen Leistungsverteilung
DE102013106351A1 (de) * 2013-06-18 2014-12-18 Innovative Ion Coatings Ltd. Verfahren zur Vorbehandlung einer zu beschichtenden Oberfläche
DE102014205695B4 (de) * 2014-03-27 2016-01-28 Christof-Herbert Diener Niederdruckplasmaanlage mit sequentieller Steuerung
EP3056587B1 (de) * 2015-02-13 2020-11-18 Walter AG VHM-Schaftfräser mit TiAlN-ZrN-Beschichtung
JP6512577B2 (ja) * 2015-07-07 2019-05-15 日産自動車株式会社 燃料電池構成部品用表面処理部材
US10784091B2 (en) 2017-09-29 2020-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Process and related device for removing by-product on semiconductor processing chamber sidewalls
TW202340495A (zh) 2019-02-11 2023-10-16 美商應用材料股份有限公司 物理氣相沉積方法

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Also Published As

Publication number Publication date
WO2012089286A1 (de) 2012-07-05
EP2529386A1 (de) 2012-12-05
DE202010001497U1 (de) 2010-04-22
JP2013539498A (ja) 2013-10-24
US20130276984A1 (en) 2013-10-24
JP5647337B2 (ja) 2014-12-24

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