WO2012086318A1 - Substrate manufacturing line and method of generating inspection machine data - Google Patents

Substrate manufacturing line and method of generating inspection machine data Download PDF

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Publication number
WO2012086318A1
WO2012086318A1 PCT/JP2011/075433 JP2011075433W WO2012086318A1 WO 2012086318 A1 WO2012086318 A1 WO 2012086318A1 JP 2011075433 W JP2011075433 W JP 2011075433W WO 2012086318 A1 WO2012086318 A1 WO 2012086318A1
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WO
WIPO (PCT)
Prior art keywords
data
electronic component
inspection machine
board
mounting machine
Prior art date
Application number
PCT/JP2011/075433
Other languages
French (fr)
Japanese (ja)
Inventor
光孝 稲垣
郁夫 鈴木
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to CN201180061211.0A priority Critical patent/CN103283316B/en
Priority to DE112011104581T priority patent/DE112011104581T5/en
Publication of WO2012086318A1 publication Critical patent/WO2012086318A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Definitions

  • the present invention relates to a board production line including an electronic component mounting machine and a board appearance inspection machine, and an inspection machine data generation method for the board appearance inspection machine.
  • a plurality of electronic component mounting machines and a board visual inspection machine are arranged in a row on the board production line.
  • electronic components are mounted in stages on a substrate to be transported.
  • the board on which the electronic component is mounted is inspected by a board appearance inspection machine.
  • the mounting machine data for the electronic component mounting machine and the inspection machine data for the board appearance inspection machine are created separately. For this reason, the creation of the data is complicated. Further, when the type of electronic component is changed or the mounting coordinates of the electronic component on the board are changed, the mounting machine data and the inspection machine data are updated independently. The data update operation is also complicated.
  • Patent Document 1 discloses a board production line for generating inspection machine data of a board appearance inspection machine using mounting machine data of an electronic component mounting machine.
  • mounting machine data of the electronic component mounting machine mounting part data and mounting position data are exemplified.
  • inspection machine data of the board appearance inspection machine include inspection part data, mounting position data, and position tolerance data.
  • the inspection machine data is stored in the database of the board appearance inspection machine.
  • the inspection machine data is generated according to the following procedure. First, when the board production line is activated, the board appearance inspection machine accesses the electronic component mounting machine. Then, data necessary for inspection (mounting component data, mounting position data) is acquired. Next, based on the acquired data, inspection machine data corresponding to the data is extracted from the database (that is, the mounting machine data is not used as inspection machine data as it is) to generate inspection machine data. Based on the inspection machine data, the board appearance inspection machine inspects the mounting state of the components mounted on the board.
  • the inspection machine data includes the upper surface shape data of the electronic component.
  • an electronic component mounting machine when an electronic component is mounted on a substrate, the electronic component is sucked from above by a suction nozzle. And the adsorption
  • the electronic component mounter originally does not need the upper surface shape data of the electronic component.
  • the mounting machine data does not include the upper surface shape data of the electronic component. Therefore, it is not possible to acquire the top surface shape data necessary for the appearance inspection of the board from the mounting machine data.
  • patent document 1 has the example regarding inspection component data and mounting position data, there is no description regarding upper surface shape data.
  • An object of the present invention is to provide a board production line and an inspection machine data generation method capable of automatically generating top surface shape data of an electronic component.
  • the board production line of the present invention is arranged on the downstream side of the electronic component mounting machine, an electronic component mounting machine for mounting electronic components on the board based on the mounting machine data, and inspected.
  • a board production line comprising a board appearance inspection machine that inspects the appearance of the board on which the electronic component is mounted based on machine data, wherein the mounting machine data includes lower surface shape data of the electronic component, The inspection machine data includes upper surface shape data of the electronic component that is automatically generated based on the lower surface shape data.
  • the mounting machine data for the electronic component mounting machine includes the lower surface shape data of the electronic component.
  • the upper surface shape data necessary for the appearance inspection of the substrate is automatically generated from the lower surface shape data. For this reason, it is not necessary for the operator to create the upper surface shape data and the lower surface shape data separately. Therefore, data creation work is easy. Further, when the type of electronic component is changed, it is not necessary to update the lower surface shape data and the upper surface shape data independently of each other. For this reason, the data update operation is easy.
  • the upper surface shape data excludes data related to members on the inner side in the horizontal direction from the outer edge of the body of the electronic component in the lower surface shape data, and the outer edge of the body It is better to have a configuration that is generated with reference to data relating to members on the outer side in the horizontal direction than the outer edge.
  • the “body” refers to a component body of an electronic component.
  • ⁇ Members such as leads, electrode pads, and solder balls are arranged on the lower surface of the body of the electronic component. For this reason, the data on these members are included in the lower surface shape data. On the other hand, these members are not arranged on the upper surface of the body of the electronic component. Of these members, only the outer edge of the body and the member protruding outward in the horizontal direction from the outer edge of the body can be recognized when the electronic component is viewed from above. That is, only the data related to the outer edge of the body and the member on the outer side in the horizontal direction from the outer edge of the body is necessary for generating the top surface shape data. In this respect, according to the present configuration, it is possible to extract only the data related to the outer edge of the body and the member on the outer side in the horizontal direction from the outer edge of the body to generate the upper surface shape data.
  • the mounting machine data includes part type data related to a type of the electronic part, and the inspection machine data is automatically based on the part type data. It is better to have a configuration including inspection machine lighting condition data generated when an image of the electronic component is generated from above.
  • the electronic component In the visual inspection of the board, the electronic component is imaged from above. At this time, the electronic component is irradiated with light. According to this configuration, the inspection machine lighting condition data is generated from the part type data. For this reason, according to the kind of electronic component, the inspection machine lighting conditions for the visual inspection of the substrate can be automatically changed. That is, it is possible to automatically apply the optimal inspection machine lighting condition to the electronic component to be inspected.
  • the inspection machine data generation method of the present invention is arranged on the downstream side of an electronic component mounting machine for mounting an electronic component on a board based on the mounting machine data, and the electronic component mounting machine.
  • a board production line inspection machine data generation method comprising: a board appearance inspection machine that inspects the appearance of the board on which the electronic component is mounted based on inspection machine data, the inspection machine data generating method included in the mounting machine data Based on the lower surface shape data of the electronic component, the upper surface shape data of the electronic component included in the inspection machine data is automatically generated.
  • the upper surface shape data necessary for the appearance inspection of the substrate is automatically generated from the lower surface shape data. For this reason, it is not necessary for the operator to create the upper surface shape data and the lower surface shape data separately. Therefore, data creation work is easy.
  • FIG. 1 is a schematic diagram of a substrate production line according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of an electronic component mounting machine arranged on the board production line.
  • FIG. 3 is a top view of the electronic component mounting machine.
  • FIG. 4 is a top view of the substrate appearance inspection machine arranged in the substrate production line.
  • FIG. 5A is a bottom view of an electronic component having solder balls.
  • FIG. 5B is a top view of the electronic component.
  • FIG. 6A is a bottom view of an electronic component having leads.
  • FIG. 6B is a top view of the electronic component.
  • the configuration of the substrate production line of this embodiment will be described.
  • the board production line 9 includes a screen printing machine 90, a printing inspection machine 91, twelve electronic component mounting machines 1, a board appearance inspection machine 7, and a reflow furnace 92. ing.
  • the substrate is conveyed along the substrate production line 9 from the left side (upstream side) to the right side (downstream side).
  • the substrate production line 9 is controlled by the integrated control device 93.
  • the integrated control device 93 includes a printing machine side control device 900 of the screen printing machine 90, an inspection machine side control device 910 of the printing inspection machine 91, a mounting machine side control device 60 of the twelve electronic component mounting machines 1, and a board appearance inspection.
  • the inspection machine side control device 70 of the machine 7 and the furnace side control device 920 of the reflow furnace 92 are electrically connected via a communication line.
  • FIG. 2 is a perspective view of an electronic component mounting machine arranged on the board production line of the present embodiment.
  • FIG. 3 shows a top view of the electronic component mounting machine.
  • the module 3 is shown in a transparent manner.
  • the housing of the module 3 is omitted.
  • the Y-direction slider 310, the Y-direction guide rail 312, and the X-direction guide rail 313 are indicated by a one-dot chain line, and the suction nozzle 320 and the mark camera 33 are indicated by a dotted line.
  • the boards Bf, Br and the component supply position B1 are hatched.
  • the electronic component mounting machine 1 includes a base 2, a module 3, a number of tape feeders 4, a device pallet 5, a mounting machine side control device 60 (see FIG. 1), And a mounter-side image processing device 61 (see FIG. 1).
  • the base 2 is disposed on the floor F of the factory.
  • the module 3 is detachably disposed on the upper surface of the base 2.
  • the module 3 includes a substrate transfer device 30, an XY robot 31, a mounting head 32, a mark camera 33, a parts camera 34, and a substrate lifting / lowering device 35.
  • the substrate transfer device 30 includes a pair of front and rear transfer units 303f and 303r.
  • Each of the conveyance units 303f and 303r includes a pair of conveyor belts.
  • the front substrate Bf is independently transferred from the left side to the right side by the transfer unit 303f, and the rear substrate Br is independently transferred by the transfer unit 303r.
  • the front-rear direction widths of the conveyance units 303f and 303r can be changed.
  • the conveyor belt has a function as a substrate transport body for transporting the substrate.
  • the substrate elevating device 35 includes a pair of front and rear elevating parts 350f and 350r. Each of the pair of front and rear elevating parts 350f and 350r is movable in the vertical direction. The front substrate Bf is lifted and lowered independently by the lift unit 350f, and the rear substrate Br is lifted and lowered independently by the lift unit 350r.
  • the X direction corresponds to the left-right direction
  • the Y direction corresponds to the front-rear direction
  • the Z direction corresponds to the up-down direction.
  • the XY robot 31 includes a Y direction slider 310, an X direction slider 311, a pair of left and right Y direction guide rails 312, and a pair of upper and lower X direction guide rails 313.
  • the pair of left and right Y-direction guide rails 312 are arranged on the upper surface of the housing internal space of the module 3.
  • the Y-direction slider 310 is attached to a pair of left and right Y-direction guide rails 312 so as to be slidable in the front-rear direction.
  • the pair of upper and lower X-direction guide rails 313 is disposed on the front surface of the Y-direction slider 310.
  • the X-direction slider 311 is attached to a pair of upper and lower X-direction guide rails 313 so as to be slidable in the left-right direction.
  • the mounting head 32 is attached to the X-direction slider 311. For this reason, the mounting head 32 can be moved in the front-rear and left-right directions by the XY robot 31.
  • the suction nozzle 320 is attached in a replaceable manner. The suction nozzle 320 is movable downward with respect to the mounting head 32. For this reason, the suction nozzle 320 can be moved in the front-rear, left-right, up-down directions by the XY robot 31 and the mounting head 32.
  • the mark camera 33 is attached to the X-direction slider 311 together with the mounting head 32.
  • the mark camera 33 can be moved in the front-rear and left-right directions by the XY robot 31.
  • the mark camera 33 has a function as an imaging device that images the positioning marks for the substrates Bf, Br and electronic components.
  • the parts camera 34 is disposed in front of the conveyance unit 303f.
  • the suction nozzle 320 that is, the mounting head 32
  • the suction nozzle 320 that is, the mounting head 32
  • the electronic component of the suction nozzle 320 is imaged by the parts camera 34. That is, the parts camera 34 has a function as an imaging device that images the electronic components of the suction nozzle 320.
  • the device pallet 5 is attached to the front opening of the module 3.
  • a large number of tape feeders 4 are detachably mounted in slots (not shown) of the device pallet 5, respectively.
  • the tape feeder 4 includes a tape 40, a reel 41, and a reel holder 42.
  • the tape 40 is wound around the reel 41.
  • Electronic components are sealed in the tape 40 at predetermined intervals in the longitudinal direction. However, when reaching a later-described component supply position B1, the electronic component is exposed so that it can be taken out from above.
  • the reel 41 is accommodated in a reel holder 42.
  • the mounting machine side control device 60 shown in FIG. 1 can control the above-described substrate transfer device 30, XY robot 31, mounting head 32, mark camera 33, parts camera 34, substrate lifting device 35, and tape feeder 4 in an integrated manner. It is.
  • mounting machine side control devices 60 As mounting machine data, board data (board size data, board configuration data, etc.), component data (bottom surface shape data, part type data, mounting machine, respectively) Lighting condition data, mark data, mounting coordinate data, and the like.
  • a total of twelve mounting machine side image processing devices 61 shown in FIG. 1 each process an image of a positioning mark imaged by the mark camera 33.
  • a total of twelve mounting machine side image processing devices 61 each process the image of the electronic component captured by the parts camera 34.
  • FIG. 4 shows a top view of a substrate visual inspection machine arranged in the substrate production line of the present embodiment.
  • the substrate Bf is hatched.
  • the board appearance inspection machine 7 includes a base 72, a board transfer device 73, an XY robot 74, an inspection head 75, an inspection machine side control device 70, and an inspection machine side image processing device 71.
  • the base 72 is arranged on the floor F of the factory.
  • the substrate transfer device 73 is disposed on the upper surface of the base 72.
  • the substrate transfer device 73 includes a pair of front and rear conveyor belts 730f and 730r.
  • the front-rear direction position and front-rear direction width of the board transfer device 73 can be changed according to the front-rear direction positions and front-rear direction widths of the transfer units 303f and 303r of the electronic component mounting machine 1 shown in FIG.
  • the substrate Bf (or the substrate Br) is conveyed from the left side to the right side by the conveyor belts 730f and 730r.
  • the conveyor belts 730f and 730r have a function as a substrate transport body that transports a substrate.
  • the XY robot 74 includes a Y-direction slider 740, an X-direction slider 741, a pair of upper and lower Y-direction guide rails 742, a pair of front and rear X-direction guide rails 743f and 743r, an X-direction moving ball screw portion 744, Direction moving ball screw portion 745.
  • a pair of front and rear X-direction guide rails 743f and 743r are arranged on the upper surface of the base 72 so as to sandwich the substrate transfer device 73 from the front-rear direction.
  • the X-direction slider 741 is attached to a pair of front and rear X-direction guide rails 743f and 743r so as to be slidable in the left-right direction.
  • the X-direction slider 741 is driven by an X-direction moving ball screw portion 744 attached to the base 72.
  • the Y-direction slider 740 is attached to a pair of upper and lower Y-direction guide rails 742 so as to be slidable in the front-rear direction.
  • the Y-direction slider 740 is driven by a Y-direction moving ball screw portion 745 attached to the X-direction slider 741.
  • the inspection head 75 is attached to the Y direction slider 740. Therefore, the inspection head 75 can be moved in the front-rear and left-right directions by the XY robot 74.
  • the inspection head 75 is provided with an inspection camera and a light.
  • the inspection camera has a function as an imaging device that images the board Bf and electronic components on the board Bf.
  • the light has a function as an irradiation device that illuminates the imaging area of the inspection camera during imaging.
  • the inspection machine side image processing apparatus 71 shown in FIG. 1 processes the image of the board Bf and the electronic component captured by the inspection camera.
  • the board Bf and the electronic component are imaged from above by the inspection camera.
  • the inspected board passes through twelve electronic component mounting machines 1 in order.
  • the twelve electronic component mounting machines 1 are allotted one electronic component to be mounted on the board. For this reason, when passing through the twelve electronic component mounting machines 1, the electronic components are mounted step by step on the substrate.
  • any one electronic component mounting machine 1 the electronic components are mounted on the boards Bf and Br by the following procedure.
  • the electronic component of the tape 40 is sent to the component supply position B1 by the tape feeder 4.
  • the electronic component at the component supply position B ⁇ b> 1 is sucked by the suction nozzle 320.
  • the parts camera 34 that is, the imaging area of the parts camera 34.
  • an electronic component is imaged from below by the parts camera 34.
  • the image of the parts camera 34 is processed by the mounting machine side image processing device 61 shown in FIG.
  • the mounting machine lighting condition data for each electronic component is required.
  • the board on which the electronic component has been mounted passes through the board visual inspection machine 7.
  • the mounting state of the electronic component on the board is inspected.
  • the electronic component is inspected for positional deviation, direction deviation, missing item, and the like.
  • the inspection camera is arranged above the electronic component mounted on the substrate Bf.
  • an electronic component is placed in the imaging area of the inspection camera.
  • the light is turned on to irradiate the imaging area with light.
  • the electronic component is imaged from above by the inspection camera.
  • the inspection machine image processing apparatus 71 shown in FIG. 1 processes the image of the inspection camera.
  • top surface shape data for each electronic component is required.
  • inspection machine lighting condition data for each electronic component is required.
  • the inspected substrate passes through a reflow furnace. At this time, the substrate is heated and the solder is in a molten state. Thereafter, the substrate is cooled to solidify the solder. And an electronic component is soldered to a board
  • the mounter data has already been input to the storage unit of the mounter-side control device 60 when the electronic component mounter 1 is manufactured.
  • the inspection machine data is generated based on the mounting machine data at the time of board inspection by the board appearance inspection machine 7.
  • the mounting machine data includes board data (board size data, board configuration data, etc.), component data (bottom shape data, part type data, mounting machine lighting condition data, etc.), mark data, and mounting coordinate data.
  • data necessary as inspection machine data is board data (board size data, board configuration data, etc.), component data (top surface shape data, inspection machine lighting condition data, etc.), mark data, mounting coordinate data, and the like.
  • the bottom surface shape data, component type data, and mounting machine lighting condition data are dedicated to mounting machine data. Further, the upper surface shape data and the inspection machine lighting condition data are dedicated to the inspection machine data. For this reason, the lower surface shape data, component type data, and mounting machine lighting condition data of the mounting machine data cannot be used as inspection machine data as they are.
  • both the mounting machine lighting condition data and the inspection machine lighting condition data are common in terms of the lighting conditions for the electronic components during imaging. For this reason, it seems that the mounting machine lighting condition data can be diverted as inspection machine lighting condition data.
  • the electronic component mounter 1 images the electronic component from below. For this reason, it is necessary to irradiate the electronic component with illumination light from below.
  • the board appearance inspection machine 7 images the electronic component from above. For this reason, it is necessary to irradiate an electronic component with illumination light from above.
  • the mounting machine lighting condition data and the inspection machine lighting condition data differ in various settings including the illumination light irradiation direction. Therefore, the mounting machine lighting condition data cannot be diverted as the inspection machine writing condition data.
  • the upper surface shape data of the inspection machine data is generated from the lower surface shape data of the mounting machine data. Further, inspection machine lighting condition data of inspection machine data is generated from component type data of mounting machine data.
  • FIG. 5A shows a bottom view of an electronic component having solder balls.
  • FIG. 5B shows a top view of the electronic component.
  • sixteen solder balls 801 are arranged on the lower surface of the body 800 of the electronic component 80.
  • the solder ball 801 is included in the concept of “member” of the present invention.
  • the sixteen solder balls 801 are all disposed on the inner side in the horizontal direction than the outer edge of the body 800. For this reason, as shown in FIG. 5B, the solder ball 801 cannot be confirmed even when the electronic component 80 is viewed from above.
  • FIG. 6A shows a bottom view of an electronic component having a lead.
  • FIG. 6B shows a top view of the electronic component.
  • six leads 811 are arranged on the lower surface of the body 810 of the electronic component 81.
  • the lead 811 is included in the concept of “member” of the present invention.
  • the tip portions 811a of the six leads 811 protrude outward in the horizontal direction from the outer edge of the body 810. Therefore, as shown in FIG. 6B, when the electronic component 81 is viewed from above, the tip portions 811a of the six leads 811 can be confirmed.
  • the lower surface shape of the electronic components 80 and 81 in FIGS. 5A and 6A and the upper surface shape of the electronic components 80 and 81 in FIGS. The presence or absence of members on the inner sides in the horizontal direction of the outer edges of 800 and 810 is different.
  • the members (the solder ball 801 and the root part of the lead 811) that are horizontally inside the outer edges of the bodies 800 and 810 811b) is excluded. Then, data relating to the outer edges of the bodies 800 and 810 and a member (a tip portion 811a of the lead 811) on the outer side in the horizontal direction than the outer edges of the bodies 800 and 810 is referenced to generate upper surface shape data.
  • the component type data of the mounting machine data is data relating to the types of the electronic components 80 and 81.
  • the inspection device lighting conditions in the board appearance inspection machine 7 at which the images of the electronic components 80 and 81 are the clearest are different.
  • the inspection machine data generation method of this embodiment generates inspection machine lighting condition data of inspection machine data for each type of electronic components 80 and 81 based on the component type data of mounting machine data. is doing.
  • board data (board size data, board configuration data, etc.) is obtained from the mounting machine data of the electronic component mounting machine 1 during board inspection in the board appearance inspection machine 7.
  • Part data (however, data other than bottom surface shape data and part type data), mark data, and mounting coordinate data are input to the storage unit of the inspection machine side control device 70 as inspection machine data.
  • the upper surface shape data of the inspection machine data is automatically generated from the lower surface shape data of the mounting machine data.
  • inspection machine lighting condition data of inspection machine data is automatically generated from component type data of mounting machine data.
  • ⁇ Data update method> Next, the data update method of this embodiment will be described. As shown in FIG. 1, for example, when changing the type of electronic component, it is necessary to update the mounting machine data and the inspection machine data. In this case, the worker updates only the mounting machine data.
  • the update information of the mounting machine data is automatically transmitted from the mounting machine side control device 60 to the inspection machine side control device 70 via the integrated control device 93. With the update information, the inspection machine data in the storage unit of the inspection machine side control device 70 is automatically updated in correspondence with the mounting machine data.
  • the board appearance inspection machine 7 is arranged on the downstream side with respect to the electronic component mounting machine 1. For this reason, if the mounting machine data and the inspection machine data are updated at the same time, the board on which the changed electronic component is mounted may not yet reach the board appearance inspection machine 7 at the time of updating. For this reason, the update is performed by imaging the board mark (model number, identifier, symbol, etc.) with the inspection camera of the inspection head 75 of the board appearance inspection machine 7 shown in FIG. 4 and confirming that the type of electronic component has been changed. Will be executed after.
  • the substrate production line 9 and the inspection machine data generation method of this embodiment will be described.
  • the upper surface shape data necessary for the appearance inspection of the substrates Bf and Br is automatically generated from the lower surface shape data which is the mounting machine data. For this reason, it is not necessary for the operator to create the upper surface shape data and the lower surface shape data separately.
  • mounting machine data and inspection machine data are unified. For this reason, data creation work is easy. Also, compared with the case where the mounting machine data and the inspection machine data are separately input to the mounting machine side control device 60 and the inspection machine side control device 70, the mounting machine data and the inspection machine data essentially match. There is a low possibility that supposed data (for example, board size data, board configuration data, mark data, mounting coordinate data, etc.) will not match. That is, there are few data input mistakes.
  • supposed data for example, board size data, board configuration data, mark data, mounting coordinate data, etc.
  • the update information of the mounting machine data is transmitted from the mounting machine side control device 60 to the inspection machine side control device 70 via the integrated control device 93 as shown in FIG. Then, the inspection machine data is automatically updated based on the update information. For this reason, when the type and shape of the electronic component are changed, it is not necessary to update the mounting machine data and the inspection machine data independently. Therefore, the data update operation is easy.
  • members such as leads 811, solder balls 801, and electrode pads are arranged on the lower surfaces of the bodies 800 and 810 of the electronic components 80 and 81. ing. For this reason, the data on these members are included in the lower surface shape data.
  • these members are not arranged on the upper surfaces of the bodies 800 and 810 of the electronic components 80 and 81. Of these members, only the members protruding outward in the horizontal direction from the outer edges of the bodies 800 and 810 and the outer edges of the bodies 800 and 810 can be recognized when the electronic components 80 and 81 are viewed from above.
  • inspection machine lighting condition data is generated from the component type data. For this reason, according to the kind of electronic component, the inspection machine lighting conditions in the appearance inspection of the board Bf can be automatically changed. That is, it is possible to automatically apply the optimal inspection machine lighting condition to the electronic component to be inspected.
  • the mounting machine data is stored in the mounting machine side control device 60 and the inspection machine data is stored in the inspection machine side control device 70, respectively.
  • the storage location of mounting machine data and inspection machine data is not particularly limited.
  • the mounting machine data and the inspection machine data may be stored together in the mounting machine side control device 60, the inspection machine side control device 70, or the integrated control device 93.
  • the mounting machine data may be stored in the inspection machine side control device 70 and the inspection machine data may be stored in the mounting machine side control device 60, respectively. That is, it is only necessary that the mounting machine data and the inspection machine data can be unified. Moreover, it is only necessary to automatically generate inspection machine data.
  • the mounting machine data update information is transmitted from the mounting machine side control device 60 to the inspection machine side control device 70 via the integrated control device 93. It was.
  • the transmission path for the update information of the mounting machine data is not particularly limited.
  • the update information may be transmitted directly from the mounting machine side control device 60 to the inspection machine side control device 70.
  • the mounting machine data and the inspection machine data are updated at the time of exchanging the type of electronic component, but the timing of data update is not particularly limited.
  • the mounting machine data and the inspection machine data may be updated when the types of the boards Bf and Br are changed or the mounting coordinates of the electronic components on the boards Bf and Br are changed.
  • the update is performed by imaging the mark (model number, identifier, symbol, etc.) of the substrate Bf with the inspection camera of the inspection head 75 of the substrate appearance inspection machine 7 shown in FIG. Executed after confirmation.
  • the type of electronic component in the component type data is not particularly limited.
  • square chip, IC (Integrated Circuit), SOP (Small Outline Package), SOJ (Small Outline J-leaded), CFP (Ceramic Flat Package, SOT (Small OutlandQLPLC) Plastic leaded chip carrier), BGA (Ball grid array), LGA (Land grid array), LLCC (Lead less chip carrier), TCP (Tape carrier package), LLP (Lead) ual Flatpack No-leaded), etc. may be set as the type of electronic component.
  • the mounting machine data is input to the mounting machine side control device 60 when the electronic component mounting machine 1 is manufactured.
  • inspection machine data was input to the inspection machine side control device 70 at the time of board inspection by the board appearance inspection machine 7.
  • the data input timing is not particularly limited.
  • an operator of the board production line 9 may input mounting machine data, and the inspection machine data may be automatically generated from the mounting machine data.
  • the mounting machine data may be generated based on CAD data at the time of designing the boards Bf and Br.
  • the data may be generated based on the printing machine data of the screen printing machine 90 and the inspection machine data of the printing inspection machine 91 shown in FIG. In this way, data can be shared further. For this reason, data input can be performed easily.
  • substrate visual inspection machine 7 was arrange

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The present invention addresses the problem of providing a substrate manufacturing line and a method of generating inspection machine data with which it is possible to automatically generate upper face shape data of an electronic component. A substrate manufacturing line (9) comprises: an electronic component mounting machine (1), which mounts electronic components (80, 81) on substrates (Bf, Br) on the basis of mounting machine data; and a substrate exterior appearance inspection machine (7), which is positioned downstream of the electronic component mounting machine (1), and which inspects the exterior appearance of the substrates (Bf, Br) whereupon the electronic components (80, 81) have been mounted, on the basis of inspection machine data. The mounting machine data includes lower face shape data of the electronic components (80, 81). The inspection machine data includes upper face shape data of the electronic components (80, 81), which is automatically generated on the basis of the lower face shape data thereof.

Description

基板生産ラインおよび検査機データ生成方法Substrate production line and inspection machine data generation method
　本発明は、電子部品実装機と基板外観検査機とを備える基板生産ライン、および基板外観検査機の検査機データ生成方法に関する。 The present invention relates to a board production line including an electronic component mounting machine and a board appearance inspection machine, and an inspection machine data generation method for the board appearance inspection machine.
　基板生産ラインには、複数の電子部品実装機と、基板外観検査機と、が一列に配置されている。複数の電子部品実装機においては、搬送される基板に対して、段階的に電子部品が装着される。電子部品が装着された基板は、基板外観検査機により検査される。 A plurality of electronic component mounting machines and a board visual inspection machine are arranged in a row on the board production line. In a plurality of electronic component mounting machines, electronic components are mounted in stages on a substrate to be transported. The board on which the electronic component is mounted is inspected by a board appearance inspection machine.
　電子部品実装機の実装機データと、基板外観検査機の検査機データと、は別々に作成される。このため、当該データの作成作業は煩雑である。また、電子部品の種類の変更や、基板における電子部品の装着座標の変更が行われる場合、実装機データ、検査機データは各々独立して更新される。当該データの更新作業も煩雑である。 The mounting machine data for the electronic component mounting machine and the inspection machine data for the board appearance inspection machine are created separately. For this reason, the creation of the data is complicated. Further, when the type of electronic component is changed or the mounting coordinates of the electronic component on the board are changed, the mounting machine data and the inspection machine data are updated independently. The data update operation is also complicated.
　特許文献１には、電子部品実装機の実装機データを利用して、基板外観検査機の検査機データを生成する基板生産ラインが開示されている。電子部品実装機の実装機データとしては、実装部品データ、搭載位置データが例示されている。基板外観検査機の検査機データとしては、検査部品データ、搭載位置データ、位置許容値データが例示されている。検査機データは、基板外観検査機のデータベースに格納されている。 Patent Document 1 discloses a board production line for generating inspection machine data of a board appearance inspection machine using mounting machine data of an electronic component mounting machine. As the mounting machine data of the electronic component mounting machine, mounting part data and mounting position data are exemplified. Examples of inspection machine data of the board appearance inspection machine include inspection part data, mounting position data, and position tolerance data. The inspection machine data is stored in the database of the board appearance inspection machine.
　検査機データの生成は以下の手順で行われる。まず、基板生産ライン起動時に、基板外観検査機が電子部品実装機にアクセスする。そして、検査に必要なデータ（実装部品データ、搭載位置データ）を取得する。次に、取得したデータを基に、当該データに対応する検査機データをデータベースから取り出し（つまり実装機データをそのまま検査機データとして使う訳ではない）、検査機データを生成する。当該検査機データに基づいて、基板外観検査機は、基板に実装された部品の実装状態を検査する。 The inspection machine data is generated according to the following procedure. First, when the board production line is activated, the board appearance inspection machine accesses the electronic component mounting machine. Then, data necessary for inspection (mounting component data, mounting position data) is acquired. Next, based on the acquired data, inspection machine data corresponding to the data is extracted from the database (that is, the mounting machine data is not used as inspection machine data as it is) to generate inspection machine data. Based on the inspection machine data, the board appearance inspection machine inspects the mounting state of the components mounted on the board.
特開２００６－３３９２６０号公報JP 2006-339260 A
　特許文献１に記載の基板生産ラインによると、電子部品実装機の実装機データを利用して、基板外観検査機の検査機データ（検査部品データ、搭載位置データ）を生成することができる。このため、データの作成作業、更新作業が簡単である。 According to the board production line described in Patent Document 1, it is possible to generate inspection machine data (inspection part data, mounting position data) of a board appearance inspection machine using mounting machine data of an electronic component mounting machine. For this reason, data creation and updating are easy.
　ところで、基板の外観検査においては、上方から見た電子部品の形状が検査される。このため、検査機データには、電子部品の上面形状データが含まれている。一方、電子部品実装機においては、電子部品を基板に装着する際、吸着ノズルにより、上方から電子部品を吸着している。そして、下方から見た電子部品の吸着状態が撮像される。このように、電子部品実装機としては、電子部品の上面形状データは本来不要である。このため、実装機データには、電子部品の上面形状データが含まれていない。したがって、実装機データから、基板の外観検査に必要な上面形状データを取得することはできない。なお、特許文献１には、検査部品データ、搭載位置データに関する例示はあるが、上面形状データに関する記載はない。 By the way, in the appearance inspection of the substrate, the shape of the electronic component viewed from above is inspected. For this reason, the inspection machine data includes the upper surface shape data of the electronic component. On the other hand, in an electronic component mounting machine, when an electronic component is mounted on a substrate, the electronic component is sucked from above by a suction nozzle. And the adsorption | suction state of the electronic component seen from the downward direction is imaged. As described above, the electronic component mounter originally does not need the upper surface shape data of the electronic component. For this reason, the mounting machine data does not include the upper surface shape data of the electronic component. Therefore, it is not possible to acquire the top surface shape data necessary for the appearance inspection of the board from the mounting machine data. In addition, although patent document 1 has the example regarding inspection component data and mounting position data, there is no description regarding upper surface shape data.
　本発明の基板生産ラインおよび検査機データ生成方法は、上記課題に鑑みて完成されたものである。本発明は、電子部品の上面形状データを自動的に生成可能な基板生産ラインおよび検査機データ生成方法を提供することを目的とする。 The substrate production line and the inspection machine data generation method of the present invention have been completed in view of the above problems. An object of the present invention is to provide a board production line and an inspection machine data generation method capable of automatically generating top surface shape data of an electronic component.
　（１）上記課題を解決するため、本発明の基板生産ラインは、実装機データに基づいて基板に電子部品を装着する電子部品実装機と、該電子部品実装機の下流側に配置され、検査機データに基づいて該電子部品が装着された該基板の外観を検査する基板外観検査機と、を備える基板生産ラインであって、前記実装機データは、前記電子部品の下面形状データを含み、前記検査機データは、該下面形状データを基に自動的に生成される該電子部品の上面形状データを含むことを特徴とする。 (1) In order to solve the above problems, the board production line of the present invention is arranged on the downstream side of the electronic component mounting machine, an electronic component mounting machine for mounting electronic components on the board based on the mounting machine data, and inspected. A board production line comprising a board appearance inspection machine that inspects the appearance of the board on which the electronic component is mounted based on machine data, wherein the mounting machine data includes lower surface shape data of the electronic component, The inspection machine data includes upper surface shape data of the electronic component that is automatically generated based on the lower surface shape data.
　上述したように、電子部品実装機においては、電子部品を基板に装着する際、吸着ノズルにより、上方から電子部品を吸着している。当該吸着状態を下方から検査するために、電子部品実装機用の実装機データには、電子部品の下面形状データが含まれている。 As described above, in the electronic component mounting machine, when the electronic component is mounted on the substrate, the electronic component is sucked from above by the suction nozzle. In order to inspect the suction state from below, the mounting machine data for the electronic component mounting machine includes the lower surface shape data of the electronic component.
　本発明の基板生産ラインによると、基板の外観検査に必要な上面形状データは、当該下面形状データから自動的に生成される。このため、作業者が上面形状データと下面形状データとを別々に作成する必要がない。したがって、データの作成作業が簡単である。また、電子部品の種類の変更が行われる場合、下面形状データと上面形状データとを各々独立して更新する必要がない。このため、データの更新作業が簡単である。 According to the substrate production line of the present invention, the upper surface shape data necessary for the appearance inspection of the substrate is automatically generated from the lower surface shape data. For this reason, it is not necessary for the operator to create the upper surface shape data and the lower surface shape data separately. Therefore, data creation work is easy. Further, when the type of electronic component is changed, it is not necessary to update the lower surface shape data and the upper surface shape data independently of each other. For this reason, the data update operation is easy.
　（２）好ましくは、上記（１）の構成において、前記上面形状データは、前記下面形状データにおける、前記電子部品のボディの外縁よりも水平方向内側の部材に関するデータを除外し、該ボディの外縁、および該外縁よりも水平方向外側の部材に関するデータを参照して生成される構成とする方がよい。ここで、「ボディ」とは、電子部品の部品本体をいう。 (2) Preferably, in the configuration of (1) above, the upper surface shape data excludes data related to members on the inner side in the horizontal direction from the outer edge of the body of the electronic component in the lower surface shape data, and the outer edge of the body It is better to have a configuration that is generated with reference to data relating to members on the outer side in the horizontal direction than the outer edge. Here, the “body” refers to a component body of an electronic component.
　電子部品のボディの下面には、リードや、電極パッドや、はんだボールなどの部材が配置されている。このため、下面形状データには、これらの部材に関するデータが含まれている。一方、電子部品のボディの上面には、これらの部材が配置されていない。また、これらの部材のうち、電子部品を上方から見た場合に認識可能なのは、ボディの外縁、およびボディの外縁から水平方向外側に突出する部材だけである。すなわち、上面形状データの生成に必要なのは、ボディの外縁、およびボディの外縁よりも水平方向外側の部材に関するデータだけである。この点、本構成によると、ボディの外縁、およびボディの外縁よりも水平方向外側の部材に関するデータだけを抽出して、上面形状データを生成することができる。 ¡Members such as leads, electrode pads, and solder balls are arranged on the lower surface of the body of the electronic component. For this reason, the data on these members are included in the lower surface shape data. On the other hand, these members are not arranged on the upper surface of the body of the electronic component. Of these members, only the outer edge of the body and the member protruding outward in the horizontal direction from the outer edge of the body can be recognized when the electronic component is viewed from above. That is, only the data related to the outer edge of the body and the member on the outer side in the horizontal direction from the outer edge of the body is necessary for generating the top surface shape data. In this respect, according to the present configuration, it is possible to extract only the data related to the outer edge of the body and the member on the outer side in the horizontal direction from the outer edge of the body to generate the upper surface shape data.
　（３）好ましくは、上記（１）または（２）の構成において、前記実装機データは、前記電子部品の種類に関する部品タイプデータを含み、前記検査機データは、該部品タイプデータを基に自動的に生成される、該電子部品を上方から撮像する際の検査機ライティング条件データを含む構成とする方がよい。 (3) Preferably, in the configuration of (1) or (2), the mounting machine data includes part type data related to a type of the electronic part, and the inspection machine data is automatically based on the part type data. It is better to have a configuration including inspection machine lighting condition data generated when an image of the electronic component is generated from above.
　基板の外観検査においては、電子部品は上方から撮像される。この際、電子部品には光が照射される。本構成によると、部品タイプデータから検査機ライティング条件データが生成される。このため、電子部品の種類に応じて、自動的に基板の外観検査の際の検査機ライティング条件を変更することができる。すなわち、検査対象となる電子部品に最適の検査機ライティング条件を自動的に適用することができる。 In the visual inspection of the board, the electronic component is imaged from above. At this time, the electronic component is irradiated with light. According to this configuration, the inspection machine lighting condition data is generated from the part type data. For this reason, according to the kind of electronic component, the inspection machine lighting conditions for the visual inspection of the substrate can be automatically changed. That is, it is possible to automatically apply the optimal inspection machine lighting condition to the electronic component to be inspected.
　（４）好ましくは、上記（１）ないし（３）のいずれかの構成において、前記実装機データが更新された際、更新内容が自動的に前記検査機データに反映される構成とする方がよい。本構成によると、電子部品の種類の変更が行われる場合、実装機データと検査機データとを各々独立して更新する必要がない。このため、データの更新作業が簡単である。 (4) Preferably, in any one of the above configurations (1) to (3), when the mounting machine data is updated, the updated content is automatically reflected in the inspection machine data. Good. According to this configuration, when the type of electronic component is changed, it is not necessary to update the mounting machine data and the inspection machine data independently. For this reason, the data update operation is easy.
　（５）上記課題を解決するため、本発明の検査機データ生成方法は、実装機データに基づいて基板に電子部品を装着する電子部品実装機と、該電子部品実装機の下流側に配置され、検査機データに基づいて該電子部品が装着された該基板の外観を検査する基板外観検査機と、を備える基板生産ラインの検査機データ生成方法であって、前記実装機データに含まれる前記電子部品の下面形状データを基に、前記検査機データに含まれる該電子部品の上面形状データを自動的に生成することを特徴とする。 (5) In order to solve the above-described problem, the inspection machine data generation method of the present invention is arranged on the downstream side of an electronic component mounting machine for mounting an electronic component on a board based on the mounting machine data, and the electronic component mounting machine. A board production line inspection machine data generation method comprising: a board appearance inspection machine that inspects the appearance of the board on which the electronic component is mounted based on inspection machine data, the inspection machine data generating method included in the mounting machine data Based on the lower surface shape data of the electronic component, the upper surface shape data of the electronic component included in the inspection machine data is automatically generated.
　本発明の検査機データ生成方法によると、基板の外観検査に必要な上面形状データは、当該下面形状データから自動的に生成される。このため、作業者が上面形状データと下面形状データとを別々に作成する必要がない。したがって、データの作成作業が簡単である。 According to the inspection machine data generation method of the present invention, the upper surface shape data necessary for the appearance inspection of the substrate is automatically generated from the lower surface shape data. For this reason, it is not necessary for the operator to create the upper surface shape data and the lower surface shape data separately. Therefore, data creation work is easy.
　本発明によると、電子部品の上面形状データを自動的に生成可能な基板生産ラインおよび検査機データ生成方法を提供することができる。 According to the present invention, it is possible to provide a board production line and an inspection machine data generation method capable of automatically generating top surface shape data of electronic components.
図１は、本発明の一実施形態である基板生産ラインの模式図である。FIG. 1 is a schematic diagram of a substrate production line according to an embodiment of the present invention. 図２は、同基板生産ラインに配置された電子部品実装機の斜視図である。FIG. 2 is a perspective view of an electronic component mounting machine arranged on the board production line. 図３は、同電子部品実装機の上面図である。FIG. 3 is a top view of the electronic component mounting machine. 図４は、同基板生産ラインに配置された基板外観検査機の上面図である。FIG. 4 is a top view of the substrate appearance inspection machine arranged in the substrate production line. 図５（ａ）は、はんだボールを有する電子部品の下面図である。図５（ｂ）は、同電子部品の上面図である。FIG. 5A is a bottom view of an electronic component having solder balls. FIG. 5B is a top view of the electronic component. 図６（ａ）は、リードを有する電子部品の下面図である。図６（ｂ）は、同電子部品の上面図である。FIG. 6A is a bottom view of an electronic component having leads. FIG. 6B is a top view of the electronic component.
　１：電子部品実装機、２：ベース、３：モジュール、４：テープフィーダ、５：デバイスパレット、７：基板外観検査機、９：基板生産ライン、３０：基板搬送装置、３１：ＸＹロボット、３２：装着ヘッド、３３：マークカメラ、３４：パーツカメラ、３５：基板昇降装置、４０：テープ、４１：リール、４２：リールホルダ、６０：実装機側制御装置、６１：実装機側画像処理装置、７０：検査機側制御装置、７１：検査機側画像処理装置、７２：ベース、７３：基板搬送装置、７４：ＸＹロボット、７５：検査ヘッド、８０：電子部品、８１：電子部品、９０：スクリーン印刷機、９１：印刷検査機、９２：リフロー炉、９３：統合制御装置。
　３０３ｆ：搬送部、３０３ｒ：搬送部、３１０：Ｙ方向スライダ、３１１：Ｘ方向スライダ、３１２：Ｙ方向ガイドレール、３１３：Ｘ方向ガイドレール、３２０：吸着ノズル、３５０ｆ：昇降部、３５０ｒ：昇降部、７３０ｆ：コンベアベルト、７４０：Ｙ方向スライダ、７４１：Ｘ方向スライダ、７４２：Ｙ方向ガイドレール、７４３ｆ：Ｘ方向ガイドレール、７４３ｒ：Ｘ方向ガイドレール、７４４：Ｘ方向移動用ボールねじ部、７４５：Ｙ方向移動用ボールねじ部、８００：ボディ、８０１：はんだボール（部材）、８１０：ボディ、８１１：リード（部材）、８１１ａ：先端部分、８１１ｂ：根本部分、９００：印刷機側制御装置、９１０：検査機側制御装置、９２０：炉側制御装置。
　Ｂ１：部品供給位置、Ｂｆ：基板、Ｂｒ：基板、Ｆ：フロア。 1: electronic component mounting machine, 2: base, 3: module, 4: tape feeder, 5: device pallet, 7: substrate visual inspection machine, 9: substrate production line, 30: substrate transport device, 31: XY robot, 32 : Mounting head, 33: Mark camera, 34: Parts camera, 35: Substrate lifting device, 40: Tape, 41: Reel, 42: Reel holder, 60: Mounting device side control device, 61: Mounting device side image processing device, 70: Inspection machine side control device, 71: Inspection machine side image processing device, 72: Base, 73: Substrate transport device, 74: XY robot, 75: Inspection head, 80: Electronic component, 81: Electronic component, 90: Screen Printing machine, 91: printing inspection machine, 92: reflow furnace, 93: integrated control device.
303f: Conveying unit, 303r: Conveying unit, 310: Y direction slider, 311: X direction slider, 312: Y direction guide rail, 313: X direction guide rail, 320: Suction nozzle, 350f: Elevating unit, 350r: Elevating unit , 730f: conveyor belt, 740: Y direction slider, 741: X direction slider, 742: Y direction guide rail, 743f: X direction guide rail, 743r: X direction guide rail, 744: X direction moving ball screw part, 745 : Ball screw for moving in Y direction, 800: body, 801: solder ball (member), 810: body, 811: lead (member), 811a: tip portion, 811b: root portion, 900: controller on the printing press side, 910: Inspection machine side control device, 920: Furnace side control device.
B1: Component supply position, Bf: Board, Br: Board, F: Floor.
　以下、本発明の基板生産ラインおよび検査機データ生成方法の実施の形態について説明する。 Hereinafter, embodiments of the substrate production line and the inspection machine data generation method of the present invention will be described.
　＜基板生産ラインの構成＞
　まず、本実施形態の基板生産ラインの構成について説明する。図１に、本実施形態の基板生産ラインの模式図を示す。図１に示すように、基板生産ライン９は、スクリーン印刷機９０と、印刷検査機９１と、十二台の電子部品実装機１と、基板外観検査機７と、リフロー炉９２と、を備えている。基板は、基板生産ライン９を、左側（上流側）から右側（下流側）に向かって搬送される。 <Configuration of substrate production line>
First, the configuration of the substrate production line of this embodiment will be described. In FIG. 1, the schematic diagram of the board | substrate production line of this embodiment is shown. As shown in FIG. 1, the board production line 9 includes a screen printing machine 90, a printing inspection machine 91, twelve electronic component mounting machines 1, a board appearance inspection machine 7, and a reflow furnace 92. ing. The substrate is conveyed along the substrate production line 9 from the left side (upstream side) to the right side (downstream side).
　基板生産ライン９は、統合制御装置９３により制御されている。統合制御装置９３は、スクリーン印刷機９０の印刷機側制御装置９００、印刷検査機９１の検査機側制御装置９１０、十二台の電子部品実装機１の実装機側制御装置６０、基板外観検査機７の検査機側制御装置７０、リフロー炉９２の炉側制御装置９２０に、通信線を介して、電気的に接続されている。 The substrate production line 9 is controlled by the integrated control device 93. The integrated control device 93 includes a printing machine side control device 900 of the screen printing machine 90, an inspection machine side control device 910 of the printing inspection machine 91, a mounting machine side control device 60 of the twelve electronic component mounting machines 1, and a board appearance inspection. The inspection machine side control device 70 of the machine 7 and the furnace side control device 920 of the reflow furnace 92 are electrically connected via a communication line.
　＜電子部品実装機１の構成＞
　次に、電子部品実装機１の構成について説明する。図２に、本実施形態の基板生産ラインに配置された電子部品実装機の斜視図を示す。図３に、同電子部品実装機の上面図を示す。図２においては、モジュール３のハウジングを透過して示す。図３においては、モジュール３のハウジングを省略して示す。また、Ｙ方向スライダ３１０、Ｙ方向ガイドレール３１２、Ｘ方向ガイドレール３１３を一点鎖線で、吸着ノズル３２０、マークカメラ３３を点線で、それぞれ示す。また、基板Ｂｆ、Ｂｒ、部品供給位置Ｂ１にハッチングを施す。図２、図３に示すように、電子部品実装機１は、ベース２と、モジュール３と、多数のテープフィーダ４と、デバイスパレット５と、実装機側制御装置６０（図１参照）と、実装機側画像処理装置６１（図１参照）と、を備えている。 <Configuration of electronic component mounting machine 1>
Next, the configuration of the electronic component mounting machine 1 will be described. FIG. 2 is a perspective view of an electronic component mounting machine arranged on the board production line of the present embodiment. FIG. 3 shows a top view of the electronic component mounting machine. In FIG. 2, the module 3 is shown in a transparent manner. In FIG. 3, the housing of the module 3 is omitted. Further, the Y-direction slider 310, the Y-direction guide rail 312, and the X-direction guide rail 313 are indicated by a one-dot chain line, and the suction nozzle 320 and the mark camera 33 are indicated by a dotted line. Further, the boards Bf, Br and the component supply position B1 are hatched. 2 and 3, the electronic component mounting machine 1 includes a base 2, a module 3, a number of tape feeders 4, a device pallet 5, a mounting machine side control device 60 (see FIG. 1), And a mounter-side image processing device 61 (see FIG. 1).
　［ベース２、モジュール３］
　ベース２は、工場のフロアＦに配置されている。モジュール３は、ベース２の上面に着脱可能に配置されている。モジュール３は、基板搬送装置３０と、ＸＹロボット３１と、装着ヘッド３２と、マークカメラ３３と、パーツカメラ３４と、基板昇降装置３５と、を備えている。 [Base 2, Module 3]
The base 2 is disposed on the floor F of the factory. The module 3 is detachably disposed on the upper surface of the base 2. The module 3 includes a substrate transfer device 30, an XY robot 31, a mounting head 32, a mark camera 33, a parts camera 34, and a substrate lifting / lowering device 35.
　基板搬送装置３０は、前後一対の搬送部３０３ｆ、３０３ｒを備えている。搬送部３０３ｆ、３０３ｒは、各々、一対のコンベアベルトを備えている。前方の基板Ｂｆは搬送部３０３ｆにより、後方の基板Ｂｒは搬送部３０３ｒにより、各々独立して、左側から右側に向かって搬送される。搬送部３０３ｆ、３０３ｒの前後方向幅は、変更することができる。コンベアベルトは、基板を搬送する基板搬送体としての機能を有している。 The substrate transfer device 30 includes a pair of front and rear transfer units 303f and 303r. Each of the conveyance units 303f and 303r includes a pair of conveyor belts. The front substrate Bf is independently transferred from the left side to the right side by the transfer unit 303f, and the rear substrate Br is independently transferred by the transfer unit 303r. The front-rear direction widths of the conveyance units 303f and 303r can be changed. The conveyor belt has a function as a substrate transport body for transporting the substrate.
　基板昇降装置３５は、前後一対の昇降部３５０ｆ、３５０ｒを備えている。前後一対の昇降部３５０ｆ、３５０ｒは、各々、上下方向に移動可能である。前方の基板Ｂｆは昇降部３５０ｆにより、後方の基板Ｂｒは昇降部３５０ｒにより、各々独立して、昇降される。 The substrate elevating device 35 includes a pair of front and rear elevating parts 350f and 350r. Each of the pair of front and rear elevating parts 350f and 350r is movable in the vertical direction. The front substrate Bf is lifted and lowered independently by the lift unit 350f, and the rear substrate Br is lifted and lowered independently by the lift unit 350r.
　Ｘ方向は左右方向に、Ｙ方向は前後方向に、Ｚ方向は上下方向に、各々、対応している。ＸＹロボット３１は、Ｙ方向スライダ３１０と、Ｘ方向スライダ３１１と、左右一対のＹ方向ガイドレール３１２と、上下一対のＸ方向ガイドレール３１３と、を備えている。 The X direction corresponds to the left-right direction, the Y direction corresponds to the front-rear direction, and the Z direction corresponds to the up-down direction. The XY robot 31 includes a Y direction slider 310, an X direction slider 311, a pair of left and right Y direction guide rails 312, and a pair of upper and lower X direction guide rails 313.
　左右一対のＹ方向ガイドレール３１２は、モジュール３のハウジング内部空間の上面に配置されている。Ｙ方向スライダ３１０は、左右一対のＹ方向ガイドレール３１２に、前後方向に摺動可能に取り付けられている。上下一対のＸ方向ガイドレール３１３は、Ｙ方向スライダ３１０の前面に配置されている。Ｘ方向スライダ３１１は、上下一対のＸ方向ガイドレール３１３に、左右方向に摺動可能に取り付けられている。 The pair of left and right Y-direction guide rails 312 are arranged on the upper surface of the housing internal space of the module 3. The Y-direction slider 310 is attached to a pair of left and right Y-direction guide rails 312 so as to be slidable in the front-rear direction. The pair of upper and lower X-direction guide rails 313 is disposed on the front surface of the Y-direction slider 310. The X-direction slider 311 is attached to a pair of upper and lower X-direction guide rails 313 so as to be slidable in the left-right direction.
　装着ヘッド３２は、Ｘ方向スライダ３１１に取り付けられている。このため、装着ヘッド３２は、ＸＹロボット３１により、前後左右方向に移動可能である。装着ヘッド３２の下方には、吸着ノズル３２０が交換可能に取り付けられている。吸着ノズル３２０は、装着ヘッド３２に対して、下方に移動可能である。このため吸着ノズル３２０は、ＸＹロボット３１、装着ヘッド３２により、前後左右上下方向に移動可能である。 The mounting head 32 is attached to the X-direction slider 311. For this reason, the mounting head 32 can be moved in the front-rear and left-right directions by the XY robot 31. Below the mounting head 32, the suction nozzle 320 is attached in a replaceable manner. The suction nozzle 320 is movable downward with respect to the mounting head 32. For this reason, the suction nozzle 320 can be moved in the front-rear, left-right, up-down directions by the XY robot 31 and the mounting head 32.
　マークカメラ３３は、装着ヘッド３２と共に、Ｘ方向スライダ３１１に取り付けられている。マークカメラ３３は、ＸＹロボット３１により、前後左右方向に移動可能である。マークカメラ３３は、基板Ｂｆ、Ｂｒや電子部品の位置決め用のマークを撮像する撮像装置としての機能を有している。 The mark camera 33 is attached to the X-direction slider 311 together with the mounting head 32. The mark camera 33 can be moved in the front-rear and left-right directions by the XY robot 31. The mark camera 33 has a function as an imaging device that images the positioning marks for the substrates Bf, Br and electronic components.
　パーツカメラ３４は、搬送部３０３ｆの前方に配置されている。電子部品を吸着した吸着ノズル３２０（つまり装着ヘッド３２）は、パーツカメラ３４の上方を通過する。この際、吸着ノズル３２０の電子部品は、パーツカメラ３４により撮像される。すなわち、パーツカメラ３４は、吸着ノズル３２０の電子部品を撮像する撮像装置としての機能を有している。 The parts camera 34 is disposed in front of the conveyance unit 303f. The suction nozzle 320 (that is, the mounting head 32) that sucks the electronic component passes above the parts camera 34. At this time, the electronic component of the suction nozzle 320 is imaged by the parts camera 34. That is, the parts camera 34 has a function as an imaging device that images the electronic components of the suction nozzle 320.
　デバイスパレット５は、モジュール３の前部開口に装着されている。多数のテープフィーダ４は、デバイスパレット５のスロット（図略）に、各々、着脱可能に装着されている。テープフィーダ４は、テープ４０とリール４１とリールホルダ４２とを備えている。テープ４０は、リール４１に巻装されている。テープ４０には、長手方向に所定間隔ずつ離間して、電子部品が封入されている。ただし、後述する部品供給位置Ｂ１に到達する際、電子部品は、上方から取り出せるように、表出している。リール４１は、リールホルダ４２に収容されている。 The device pallet 5 is attached to the front opening of the module 3. A large number of tape feeders 4 are detachably mounted in slots (not shown) of the device pallet 5, respectively. The tape feeder 4 includes a tape 40, a reel 41, and a reel holder 42. The tape 40 is wound around the reel 41. Electronic components are sealed in the tape 40 at predetermined intervals in the longitudinal direction. However, when reaching a later-described component supply position B1, the electronic component is exposed so that it can be taken out from above. The reel 41 is accommodated in a reel holder 42.
　図１に示す実装機側制御装置６０は、上述した基板搬送装置３０、ＸＹロボット３１、装着ヘッド３２、マークカメラ３３、パーツカメラ３４、基板昇降装置３５、テープフィーダ４を、統合的に制御可能である。 The mounting machine side control device 60 shown in FIG. 1 can control the above-described substrate transfer device 30, XY robot 31, mounting head 32, mark camera 33, parts camera 34, substrate lifting device 35, and tape feeder 4 in an integrated manner. It is.
　合計十二個の実装機側制御装置６０の記憶部には、各々、実装機データとして、基板データ（基板サイズデータ、基板構成データなど）、部品データ（下面形状データ、部品タイプデータ、実装機ライティング条件データなど）、マークデータ、装着座標データなどが格納されている。 In the storage units of the total twelve mounting machine side control devices 60, as mounting machine data, board data (board size data, board configuration data, etc.), component data (bottom surface shape data, part type data, mounting machine, respectively) Lighting condition data, mark data, mounting coordinate data, and the like.
　図１に示す合計十二個の実装機側画像処理装置６１は、各々、マークカメラ３３により撮像された、位置決め用のマークの画像を処理する。また、合計十二個の実装機側画像処理装置６１は、各々、パーツカメラ３４により撮像された電子部品の画像を処理する。 A total of twelve mounting machine side image processing devices 61 shown in FIG. 1 each process an image of a positioning mark imaged by the mark camera 33. In addition, a total of twelve mounting machine side image processing devices 61 each process the image of the electronic component captured by the parts camera 34.
　＜基板外観検査機７の構成＞
　次に、基板外観検査機７の構成について説明する。図４に、本実施形態の基板生産ラインに配置された基板外観検査機の上面図を示す。なお、基板Ｂｆにハッチングを施す。基板外観検査機７は、ベース７２と、基板搬送装置７３と、ＸＹロボット７４と、検査ヘッド７５と、検査機側制御装置７０と、検査機側画像処理装置７１と、を備えている。 <Configuration of substrate visual inspection machine 7>
Next, the configuration of the board appearance inspection machine 7 will be described. FIG. 4 shows a top view of a substrate visual inspection machine arranged in the substrate production line of the present embodiment. The substrate Bf is hatched. The board appearance inspection machine 7 includes a base 72, a board transfer device 73, an XY robot 74, an inspection head 75, an inspection machine side control device 70, and an inspection machine side image processing device 71.
　ベース７２は、工場のフロアＦに配置されている。基板搬送装置７３は、ベース７２の上面に配置されている。基板搬送装置７３は、前後一対のコンベアベルト７３０ｆ、７３０ｒを備えている。基板搬送装置７３の前後方向位置、前後方向幅は、図３に示す電子部品実装機１の搬送部３０３ｆ、３０３ｒの前後方向位置、前後方向幅に応じて、変更可能である。基板Ｂｆ（または基板Ｂｒ）は、コンベアベルト７３０ｆ、７３０ｒにより、左側から右側に向かって搬送される。コンベアベルト７３０ｆ、７３０ｒは、基板を搬送する基板搬送体としての機能を有している。 The base 72 is arranged on the floor F of the factory. The substrate transfer device 73 is disposed on the upper surface of the base 72. The substrate transfer device 73 includes a pair of front and rear conveyor belts 730f and 730r. The front-rear direction position and front-rear direction width of the board transfer device 73 can be changed according to the front-rear direction positions and front-rear direction widths of the transfer units 303f and 303r of the electronic component mounting machine 1 shown in FIG. The substrate Bf (or the substrate Br) is conveyed from the left side to the right side by the conveyor belts 730f and 730r. The conveyor belts 730f and 730r have a function as a substrate transport body that transports a substrate.
　ＸＹロボット７４は、Ｙ方向スライダ７４０と、Ｘ方向スライダ７４１と、上下一対のＹ方向ガイドレール７４２と、前後一対のＸ方向ガイドレール７４３ｆ、７４３ｒと、Ｘ方向移動用ボールねじ部７４４と、Ｙ方向移動用ボールねじ部７４５と、を備えている。 The XY robot 74 includes a Y-direction slider 740, an X-direction slider 741, a pair of upper and lower Y-direction guide rails 742, a pair of front and rear X-direction guide rails 743f and 743r, an X-direction moving ball screw portion 744, Direction moving ball screw portion 745.
　前後一対のＸ方向ガイドレール７４３ｆ、７４３ｒは、基板搬送装置７３を前後方向から挟むように、ベース７２の上面に配置されている。Ｘ方向スライダ７４１は、前後一対のＸ方向ガイドレール７４３ｆ、７４３ｒに、左右方向に摺動可能に取り付けられている。Ｘ方向スライダ７４１は、ベース７２に取り付けられた、Ｘ方向移動用ボールねじ部７４４により駆動される。Ｙ方向スライダ７４０は、上下一対のＹ方向ガイドレール７４２に、前後方向に摺動可能に取り付けられている。Ｙ方向スライダ７４０は、Ｘ方向スライダ７４１に取り付けられた、Ｙ方向移動用ボールねじ部７４５により駆動される。 A pair of front and rear X-direction guide rails 743f and 743r are arranged on the upper surface of the base 72 so as to sandwich the substrate transfer device 73 from the front-rear direction. The X-direction slider 741 is attached to a pair of front and rear X-direction guide rails 743f and 743r so as to be slidable in the left-right direction. The X-direction slider 741 is driven by an X-direction moving ball screw portion 744 attached to the base 72. The Y-direction slider 740 is attached to a pair of upper and lower Y-direction guide rails 742 so as to be slidable in the front-rear direction. The Y-direction slider 740 is driven by a Y-direction moving ball screw portion 745 attached to the X-direction slider 741.
　検査ヘッド７５は、Ｙ方向スライダ７４０に取り付けられている。このため、検査ヘッド７５は、ＸＹロボット７４により、前後左右方向に移動可能である。検査ヘッド７５には、検査カメラとライトとが配置されている。検査カメラは、基板Ｂｆや、基板Ｂｆ上の電子部品を撮像する、撮像装置としての機能を有している。ライトは、撮像の際、検査カメラの撮像エリアを照らす照射装置としての機能を有している。 The inspection head 75 is attached to the Y direction slider 740. Therefore, the inspection head 75 can be moved in the front-rear and left-right directions by the XY robot 74. The inspection head 75 is provided with an inspection camera and a light. The inspection camera has a function as an imaging device that images the board Bf and electronic components on the board Bf. The light has a function as an irradiation device that illuminates the imaging area of the inspection camera during imaging.
　図１に示す検査機側制御装置７０は、上述した基板搬送装置７３、ＸＹロボット７４、検査ヘッド７５を、統合的に制御可能である。検査機側制御装置７０の記憶部には、検査機データとして、基板データ（基板サイズデータ、基板構成データなど）、部品データ（上面形状データ、検査機ライティング条件データなど）、マークデータ、装着座標データなどが格納されている。図１に示す検査機側画像処理装置７１は、検査カメラにより撮像された、基板Ｂｆや電子部品の画像を処理する。基板Ｂｆや電子部品は、検査カメラにより、上方から撮像される。 1 can integrally control the substrate transport device 73, the XY robot 74, and the inspection head 75 described above. In the storage unit of the inspection machine side control device 70, as inspection machine data, board data (board size data, board configuration data, etc.), component data (upper surface shape data, inspection machine lighting condition data, etc.), mark data, mounting coordinates Data etc. are stored. The inspection machine side image processing apparatus 71 shown in FIG. 1 processes the image of the board Bf and the electronic component captured by the inspection camera. The board Bf and the electronic component are imaged from above by the inspection camera.
　＜基板生産ラインの動き＞
　次に、本実施形態の基板生産ライン９の基板生産時の動きについて説明する。図１に示すように、まず、基板は、スクリーン印刷機９０を通過する。この際、基板のパッド上に、クリーム状のはんだが塗布される。次に、はんだが塗布された基板は、印刷検査機９１を通過する。なお、印刷検査機９１の構成は、図４に示す基板外観検査機７と同様である。印刷検査機９１を通過する際、基板に対するはんだの印刷状態が検査される。 <Board production line movement>
Next, the movement at the time of board production of the board production line 9 of this embodiment will be described. As shown in FIG. 1, first, the substrate passes through a screen printer 90. At this time, creamy solder is applied onto the pads of the substrate. Next, the substrate on which the solder is applied passes through the printing inspection machine 91. The configuration of the print inspection machine 91 is the same as that of the board appearance inspection machine 7 shown in FIG. When passing through the printing inspection machine 91, the printed state of the solder on the substrate is inspected.
　続いて、検査後の基板は、十二台の電子部品実装機１を、順に通過する。十二台の電子部品実装機１には、一台ずつ、基板に装着する電子部品が割り振られている。このため、十二台の電子部品実装機１を通過する際、基板に段階的に電子部品が実装される。 Subsequently, the inspected board passes through twelve electronic component mounting machines 1 in order. The twelve electronic component mounting machines 1 are allotted one electronic component to be mounted on the board. For this reason, when passing through the twelve electronic component mounting machines 1, the electronic components are mounted step by step on the substrate.
　任意の一台の電子部品実装機１においては、図２、図３に示すように、以下の手順で電子部品が基板Ｂｆ、Ｂｒに装着される。まず、テープフィーダ４により、テープ４０の電子部品を部品供給位置Ｂ１まで送る。次に、部品供給位置Ｂ１の電子部品を、吸着ノズル３２０で吸着する。それから、装着ヘッド３２を移動させることにより、吸着ノズル３２０に吸着された電子部品を、パーツカメラ３４の上方（つまりパーツカメラ３４の撮像エリア）に、配置する。そして、パーツカメラ３４により、下方から電子部品を撮像する。その後、図１に示す実装機側画像処理装置６１により、パーツカメラ３４の画像を処理する。画像を処理する際、電子部品ごとの下面形状データ、部品タイプデータが必要になる。また、撮像の際、電子部品の画像を鮮明にするために、電子部品ごとの実装機ライティング条件データが必要になる。 In any one electronic component mounting machine 1, as shown in FIGS. 2 and 3, the electronic components are mounted on the boards Bf and Br by the following procedure. First, the electronic component of the tape 40 is sent to the component supply position B1 by the tape feeder 4. Next, the electronic component at the component supply position B <b> 1 is sucked by the suction nozzle 320. Then, by moving the mounting head 32, the electronic component sucked by the suction nozzle 320 is arranged above the parts camera 34 (that is, the imaging area of the parts camera 34). Then, an electronic component is imaged from below by the parts camera 34. Thereafter, the image of the parts camera 34 is processed by the mounting machine side image processing device 61 shown in FIG. When processing an image, bottom surface shape data and component type data for each electronic component are required. Moreover, in order to make the image of the electronic component clear at the time of imaging, mounting machine lighting condition data for each electronic component is required.
　それから、図１に示すように、電子部品の装着が完了した基板は、基板外観検査機７を通過する。この際、基板に対する電子部品の装着状態が検査される。具体的には、電子部品の位置ずれ、方向ずれ、欠品などが検査される。まず、図４に示すように、検査ヘッド７５を移動させることにより、検査カメラを、基板Ｂｆ上に装着された電子部品の上方に配置する。そして、検査カメラの撮像エリアに電子部品を入れる。次に、ライトを点灯させ、撮像エリアに光を照射する。そして、検査カメラにより、上方から電子部品を撮像する。その後、図１に示す検査機側画像処理装置７１により、検査カメラの画像を処理する。画像を処理する際、電子部品ごとの上面形状データが必要になる。また、撮像の際、電子部品の画像を鮮明にするために、電子部品ごとの検査機ライティング条件データが必要になる。 Then, as shown in FIG. 1, the board on which the electronic component has been mounted passes through the board visual inspection machine 7. At this time, the mounting state of the electronic component on the board is inspected. Specifically, the electronic component is inspected for positional deviation, direction deviation, missing item, and the like. First, as shown in FIG. 4, by moving the inspection head 75, the inspection camera is arranged above the electronic component mounted on the substrate Bf. Then, an electronic component is placed in the imaging area of the inspection camera. Next, the light is turned on to irradiate the imaging area with light. Then, the electronic component is imaged from above by the inspection camera. Thereafter, the inspection machine image processing apparatus 71 shown in FIG. 1 processes the image of the inspection camera. When processing an image, top surface shape data for each electronic component is required. Further, in order to make the image of the electronic component clear at the time of imaging, inspection machine lighting condition data for each electronic component is required.
　最後に、図１に示すように、検査後の基板は、リフロー炉を通過する。この際、基板が加熱され、はんだが溶融状態になる。その後、基板を冷却することにより、はんだが固化する。そして、当該はんだにより、電子部品が基板にはんだ付けされる。このようにして、基板生産ライン９においては、基板の生産が行われる。 Finally, as shown in FIG. 1, the inspected substrate passes through a reflow furnace. At this time, the substrate is heated and the solder is in a molten state. Thereafter, the substrate is cooled to solidify the solder. And an electronic component is soldered to a board | substrate with the said solder. In this way, the substrate production line 9 performs substrate production.
　＜検査機データ生成方法＞
　次に、本実施形態の検査機データ生成方法について説明する。実装機側制御装置６０の記憶部には、電子部品実装機１の製造時に、既に実装機データが入力されている。検査機データは、基板外観検査機７における基板検査時に、当該実装機データを基に生成される。 <Inspection machine data generation method>
Next, the inspection machine data generation method of this embodiment will be described. The mounter data has already been input to the storage unit of the mounter-side control device 60 when the electronic component mounter 1 is manufactured. The inspection machine data is generated based on the mounting machine data at the time of board inspection by the board appearance inspection machine 7.
　すなわち、実装機データには、基板データ（基板サイズデータ、基板構成データなど）、部品データ（下面形状データ、部品タイプデータ、実装機ライティング条件データなど）、マークデータ、装着座標データが含まれている。一方、検査機データとして必要なデータは、基板データ（基板サイズデータ、基板構成データなど）、部品データ（上面形状データ、検査機ライティング条件データなど）、マークデータ、装着座標データなどである。 That is, the mounting machine data includes board data (board size data, board configuration data, etc.), component data (bottom shape data, part type data, mounting machine lighting condition data, etc.), mark data, and mounting coordinate data. Yes. On the other hand, data necessary as inspection machine data is board data (board size data, board configuration data, etc.), component data (top surface shape data, inspection machine lighting condition data, etc.), mark data, mounting coordinate data, and the like.
　実装機データと検査機データとを比較すると、基板データ（基板サイズデータ、基板構成データなど）、部品データ（ただし、下面形状データ、部品タイプデータ、上面形状データ、実装機ライティング条件データ、検査機ライティング条件データ以外のデータ）、マークデータ、装着座標データは、実装機データおよび検査機データに含まれている。このため、これらの共通するデータは、基板外観検査機７における基板検査時に、実装機データを基に生成される。 Comparing the mounting machine data with the inspection machine data, board data (board size data, board configuration data, etc.), component data (however, bottom surface shape data, component type data, top surface shape data, mounting machine lighting condition data, inspection machine) Data other than lighting condition data), mark data, and mounting coordinate data are included in mounting machine data and inspection machine data. For this reason, these common data are generated based on the mounting machine data at the time of board inspection in the board appearance inspection machine 7.
　一方、下面形状データ、部品タイプデータ、実装機ライティング条件データは、実装機データ専用である。また、上面形状データ、検査機ライティング条件データは、検査機データ専用である。このため、実装機データの下面形状データ、部品タイプデータ、実装機ライティング条件データを、そのまま検査機データとして転用することはできない。 On the other hand, the bottom surface shape data, component type data, and mounting machine lighting condition data are dedicated to mounting machine data. Further, the upper surface shape data and the inspection machine lighting condition data are dedicated to the inspection machine data. For this reason, the lower surface shape data, component type data, and mounting machine lighting condition data of the mounting machine data cannot be used as inspection machine data as they are.
　ここで、実装機ライティング条件データと検査機ライティング条件データとは、共に撮像時の電子部品に対するライティング条件という点において、共通している。このため、一見、実装機ライティング条件データを検査機ライティング条件データとして転用できそうである。 Here, both the mounting machine lighting condition data and the inspection machine lighting condition data are common in terms of the lighting conditions for the electronic components during imaging. For this reason, it seems that the mounting machine lighting condition data can be diverted as inspection machine lighting condition data.
　しかしながら、電子部品実装機１においては電子部品を下方から撮像している。このため、下方から電子部品に照明光を照射する必要がある。これに対して、基板外観検査機７においては電子部品を上方から撮像している。このため、上方から電子部品に照明光を照射する必要がある。このように、実装機ライティング条件データと検査機ライティング条件データとでは、照明光の照射方向を始めとする種々の設定が異なっている。したがって、実装機ライティング条件データを検査機ライティング条件データとして転用することはできない。 However, the electronic component mounter 1 images the electronic component from below. For this reason, it is necessary to irradiate the electronic component with illumination light from below. On the other hand, the board appearance inspection machine 7 images the electronic component from above. For this reason, it is necessary to irradiate an electronic component with illumination light from above. Thus, the mounting machine lighting condition data and the inspection machine lighting condition data differ in various settings including the illumination light irradiation direction. Therefore, the mounting machine lighting condition data cannot be diverted as the inspection machine writing condition data.
　そこで、本実施形態の検査機データ生成方法の場合、実装機データの下面形状データから検査機データの上面形状データを生成している。また、実装機データの部品タイプデータから検査機データの検査機ライティング条件データを生成している。 Therefore, in the inspection machine data generation method of the present embodiment, the upper surface shape data of the inspection machine data is generated from the lower surface shape data of the mounting machine data. Further, inspection machine lighting condition data of inspection machine data is generated from component type data of mounting machine data.
　まず、上面形状データの生成方法について説明する。図５（ａ）に、はんだボールを有する電子部品の下面図を示す。図５（ｂ）に、同電子部品の上面図を示す。図５（ａ）に示すように、電子部品８０のボディ８００の下面には、十六個のはんだボール８０１が配置されている。はんだボール８０１は、本発明の「部材」の概念に含まれる。十六個のはんだボール８０１は、全てボディ８００の外縁よりも水平方向内側に配置されている。このため、図５（ｂ）に示すように、電子部品８０を上方から見ても、はんだボール８０１を確認することはできない。 First, a method for generating top surface shape data will be described. FIG. 5A shows a bottom view of an electronic component having solder balls. FIG. 5B shows a top view of the electronic component. As shown in FIG. 5A, sixteen solder balls 801 are arranged on the lower surface of the body 800 of the electronic component 80. The solder ball 801 is included in the concept of “member” of the present invention. The sixteen solder balls 801 are all disposed on the inner side in the horizontal direction than the outer edge of the body 800. For this reason, as shown in FIG. 5B, the solder ball 801 cannot be confirmed even when the electronic component 80 is viewed from above.
　図６（ａ）に、リードを有する電子部品の下面図を示す。図６（ｂ）に、同電子部品の上面図を示す。図６（ａ）に示すように、電子部品８１のボディ８１０の下面には、六本のリード８１１が配置されている。リード８１１は、本発明の「部材」の概念に含まれる。六本のリード８１１の先端部分８１１ａは、ボディ８１０の外縁から水平方向外側にはみ出している。このため、図６（ｂ）に示すように、電子部品８１を上方から見ると、六本のリード８１１の先端部分８１１ａを確認することができる。 FIG. 6A shows a bottom view of an electronic component having a lead. FIG. 6B shows a top view of the electronic component. As shown in FIG. 6A, six leads 811 are arranged on the lower surface of the body 810 of the electronic component 81. The lead 811 is included in the concept of “member” of the present invention. The tip portions 811a of the six leads 811 protrude outward in the horizontal direction from the outer edge of the body 810. Therefore, as shown in FIG. 6B, when the electronic component 81 is viewed from above, the tip portions 811a of the six leads 811 can be confirmed.
　このように、図５（ａ）、図６（ａ）の電子部品８０、８１の下面形状と、図５（ｂ）、図６（ｂ）の電子部品８０、８１の上面形状とでは、ボディ８００、８１０の外縁の水平方向内側の部材の有無が異なる。 As described above, the lower surface shape of the electronic components 80 and 81 in FIGS. 5A and 6A and the upper surface shape of the electronic components 80 and 81 in FIGS. The presence or absence of members on the inner sides in the horizontal direction of the outer edges of 800 and 810 is different.
　この点に着目して、本実施形態の検査機データ生成方法では、実装機データの下面形状データから、ボディ８００、８１０の外縁よりも水平方向内側の部材（はんだボール８０１、リード８１１の根本部分８１１ｂ）に関するデータを除外している。そして、ボディ８００、８１０の外縁、およびボディ８００、８１０の外縁よりも水平方向外側の部材（リード８１１の先端部分８１１ａ）に関するデータを参照し、上面形状データを生成している。 Focusing on this point, in the inspection machine data generation method according to the present embodiment, from the lower surface shape data of the mounting machine data, the members (the solder ball 801 and the root part of the lead 811) that are horizontally inside the outer edges of the bodies 800 and 810 811b) is excluded. Then, data relating to the outer edges of the bodies 800 and 810 and a member (a tip portion 811a of the lead 811) on the outer side in the horizontal direction than the outer edges of the bodies 800 and 810 is referenced to generate upper surface shape data.
　次に、検査機ライティング条件データの生成方法について説明する。実装機データの部品タイプデータは、電子部品８０、８１の種類に関するデータである。電子部品８０、８１の種類ごとに、基板外観検査機７における、その電子部品８０、８１の画像が最も鮮明になる検査機ライティング条件は異なる。 Next, a method for generating inspection machine lighting condition data will be described. The component type data of the mounting machine data is data relating to the types of the electronic components 80 and 81. For each type of the electronic components 80 and 81, the inspection device lighting conditions in the board appearance inspection machine 7 at which the images of the electronic components 80 and 81 are the clearest are different.
　この点に着目して、本実施形態の検査機データ生成方法では、実装機データの部品タイプデータを基に、電子部品８０、８１の種類ごとに、検査機データの検査機ライティング条件データを生成している。 Focusing on this point, the inspection machine data generation method of this embodiment generates inspection machine lighting condition data of inspection machine data for each type of electronic components 80 and 81 based on the component type data of mounting machine data. is doing.
　以上説明したように、本実施形態の検査機データ生成方法では、基板外観検査機７における基板検査時に、電子部品実装機１の実装機データから、基板データ（基板サイズデータ、基板構成データなど）、部品データ（ただし、下面形状データ、部品タイプデータ以外のデータ）、マークデータ、装着座標データを、検査機データとして、検査機側制御装置７０の記憶部に入力している。 As described above, in the inspection machine data generation method of this embodiment, board data (board size data, board configuration data, etc.) is obtained from the mounting machine data of the electronic component mounting machine 1 during board inspection in the board appearance inspection machine 7. Part data (however, data other than bottom surface shape data and part type data), mark data, and mounting coordinate data are input to the storage unit of the inspection machine side control device 70 as inspection machine data.
　また、基板外観検査機７における基板検査時に、実装機データの下面形状データから、検査機データの上面形状データを、自動的に生成している。並びに、実装機データの部品タイプデータから、検査機データの検査機ライティング条件データを、自動的に生成している。 Also, when the substrate is inspected by the substrate appearance inspection machine 7, the upper surface shape data of the inspection machine data is automatically generated from the lower surface shape data of the mounting machine data. In addition, inspection machine lighting condition data of inspection machine data is automatically generated from component type data of mounting machine data.
　＜データ更新方法＞
　次に、本実施形態のデータ更新方法について説明する。図１に示すように、例えば電子部品の種類を変更する場合は、実装機データおよび検査機データを更新する必要がある。この場合は、作業者が実装機データだけを更新する。実装機データの更新情報は、実装機側制御装置６０から、統合制御装置９３を介して、検査機側制御装置７０に自動的に伝送される。当該更新情報により、検査機側制御装置７０の記憶部の検査機データは、実装機データに対応して、自動的に更新される。 <Data update method>
Next, the data update method of this embodiment will be described. As shown in FIG. 1, for example, when changing the type of electronic component, it is necessary to update the mounting machine data and the inspection machine data. In this case, the worker updates only the mounting machine data. The update information of the mounting machine data is automatically transmitted from the mounting machine side control device 60 to the inspection machine side control device 70 via the integrated control device 93. With the update information, the inspection machine data in the storage unit of the inspection machine side control device 70 is automatically updated in correspondence with the mounting machine data.
　図１に示すように、電子部品実装機１に対して、基板外観検査機７は下流側に配置されている。このため、実装機データと検査機データとを同時に更新すると、更新時に、基板外観検査機７に、変更後の電子部品が装着された基板がまだ到達していない場合もある。このため、更新は、図４に示す基板外観検査機７の検査ヘッド７５の検査カメラにより、基板のマーク（型番、識別子、記号など）を撮像し、電子部品の種類が変更されたことを確認した後で、実行される。 As shown in FIG. 1, the board appearance inspection machine 7 is arranged on the downstream side with respect to the electronic component mounting machine 1. For this reason, if the mounting machine data and the inspection machine data are updated at the same time, the board on which the changed electronic component is mounted may not yet reach the board appearance inspection machine 7 at the time of updating. For this reason, the update is performed by imaging the board mark (model number, identifier, symbol, etc.) with the inspection camera of the inspection head 75 of the board appearance inspection machine 7 shown in FIG. 4 and confirming that the type of electronic component has been changed. Will be executed after.
　＜作用効果＞
　次に、本実施形態の基板生産ライン９および検査機データ生成方法の作用効果について説明する。本実施形態の基板生産ライン９および検査機データ生成方法によると、基板Ｂｆ、Ｂｒの外観検査に必要な上面形状データが、実装機データである下面形状データから、自動的に生成される。このため、作業者が上面形状データと下面形状データとを別々に作成する必要がない。 <Effect>
Next, the effects of the substrate production line 9 and the inspection machine data generation method of this embodiment will be described. According to the substrate production line 9 and the inspection machine data generation method of the present embodiment, the upper surface shape data necessary for the appearance inspection of the substrates Bf and Br is automatically generated from the lower surface shape data which is the mounting machine data. For this reason, it is not necessary for the operator to create the upper surface shape data and the lower surface shape data separately.
　また、実装機データと検査機データとは一元化されている。このため、データの作成作業が簡単である。また、実装機側制御装置６０と検査機側制御装置７０とに、別々に、実装機データと検査機データとを入力する場合と比較して、実装機データと検査機データとで本来一致するはずのデータ（例えば、基板サイズデータ、基板構成データ、マークデータ、装着座標データなど）が一致しなくなるおそれが小さい。すなわち、データの入力ミスが少ない。 Also, mounting machine data and inspection machine data are unified. For this reason, data creation work is easy. Also, compared with the case where the mounting machine data and the inspection machine data are separately input to the mounting machine side control device 60 and the inspection machine side control device 70, the mounting machine data and the inspection machine data essentially match. There is a low possibility that supposed data (for example, board size data, board configuration data, mark data, mounting coordinate data, etc.) will not match. That is, there are few data input mistakes.
　また、実装機データの更新情報は、図１に示すように、実装機側制御装置６０から、統合制御装置９３を介して、検査機側制御装置７０に伝送される。そして、当該更新情報を基に、自動的に検査機データが更新される。このため、電子部品の種類、形状などの変更が行われる場合、実装機データと検査機データとを各々独立して更新する必要がない。したがって、データの更新作業が簡単である。 Also, the update information of the mounting machine data is transmitted from the mounting machine side control device 60 to the inspection machine side control device 70 via the integrated control device 93 as shown in FIG. Then, the inspection machine data is automatically updated based on the update information. For this reason, when the type and shape of the electronic component are changed, it is not necessary to update the mounting machine data and the inspection machine data independently. Therefore, the data update operation is easy.
　また、図５（ａ）、図６（ａ）に示すように、電子部品８０、８１のボディ８００、８１０の下面には、リード８１１や、はんだボール８０１や、電極パッドなどの部材が配置されている。このため、下面形状データには、これらの部材に関するデータが含まれている。一方、図５（ｂ）、図６（ｂ）に示すように、電子部品８０、８１のボディ８００、８１０の上面には、これらの部材が配置されていない。また、これらの部材のうち、電子部品８０、８１を上方から見た場合に認識可能なのは、ボディ８００、８１０の外縁、およびボディ８００、８１０の外縁から水平方向外側に突出する部材だけである。すなわち、上面形状データの生成に必要なのは、ボディ８００、８１０の外縁、およびボディ８００、８１０の外縁よりも水平方向外側の部材に関するデータだけである。この点、本実施形態の基板生産ライン９および検査機データ生成方法によると、ボディ８００、８１０の外縁、およびボディ８００、８１０の外縁よりも水平方向外側の部材に関するデータだけを抽出して、上面形状データを生成することができる。 Further, as shown in FIGS. 5A and 6A, members such as leads 811, solder balls 801, and electrode pads are arranged on the lower surfaces of the bodies 800 and 810 of the electronic components 80 and 81. ing. For this reason, the data on these members are included in the lower surface shape data. On the other hand, as shown in FIGS. 5B and 6B, these members are not arranged on the upper surfaces of the bodies 800 and 810 of the electronic components 80 and 81. Of these members, only the members protruding outward in the horizontal direction from the outer edges of the bodies 800 and 810 and the outer edges of the bodies 800 and 810 can be recognized when the electronic components 80 and 81 are viewed from above. That is, only the data relating to the outer edges of the bodies 800 and 810 and the members on the outer side in the horizontal direction than the outer edges of the bodies 800 and 810 are necessary for generating the top shape data. In this regard, according to the substrate production line 9 and the inspection machine data generation method of the present embodiment, only the data related to the outer edges of the bodies 800 and 810 and members outside in the horizontal direction from the outer edges of the bodies 800 and 810 are extracted. Shape data can be generated.
　また、図４に示すように、基板Ｂｆの外観検査においては、電子部品は上方から撮像される。この際、電子部品には光が照射される。本実施形態の基板生産ライン９および検査機データ生成方法によると、部品タイプデータから検査機ライティング条件データが生成される。このため、電子部品の種類に応じて、自動的に基板Ｂｆの外観検査の際の検査機ライティング条件を変更することができる。すなわち、検査対象となる電子部品に最適の検査機ライティング条件を自動的に適用することができる。 Further, as shown in FIG. 4, in the appearance inspection of the substrate Bf, the electronic component is imaged from above. At this time, the electronic component is irradiated with light. According to the board production line 9 and the inspection machine data generation method of the present embodiment, inspection machine lighting condition data is generated from the component type data. For this reason, according to the kind of electronic component, the inspection machine lighting conditions in the appearance inspection of the board Bf can be automatically changed. That is, it is possible to automatically apply the optimal inspection machine lighting condition to the electronic component to be inspected.
　＜その他＞
　以上、本発明の基板生産ラインおよび検査機データ生成方法の実施の形態について説明した。しかしながら、実施の形態は上記形態に特に限定されるものではない。当業者が行いうる種々の変形的形態、改良的形態で実施することも可能である。 <Others>
The embodiment of the substrate production line and the inspection machine data generation method of the present invention has been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.
　上記実施形態においては、図１に示すように、実装機データを実装機側制御装置６０に、検査機データを検査機側制御装置７０に、各々格納した。しかしながら、実装機データ、検査機データの格納場所は特に限定しない。実装機データおよび検査機データを、まとめて、実装機側制御装置６０または検査機側制御装置７０または統合制御装置９３に格納してもよい。また、実装機データを検査機側制御装置７０に、検査機データを実装機側制御装置６０に、各々格納してもよい。すなわち、実装機データと検査機データとが一元化できればよい。また、検査機データが自動的に生成できればよい。 In the above embodiment, as shown in FIG. 1, the mounting machine data is stored in the mounting machine side control device 60 and the inspection machine data is stored in the inspection machine side control device 70, respectively. However, the storage location of mounting machine data and inspection machine data is not particularly limited. The mounting machine data and the inspection machine data may be stored together in the mounting machine side control device 60, the inspection machine side control device 70, or the integrated control device 93. Further, the mounting machine data may be stored in the inspection machine side control device 70 and the inspection machine data may be stored in the mounting machine side control device 60, respectively. That is, it is only necessary that the mounting machine data and the inspection machine data can be unified. Moreover, it is only necessary to automatically generate inspection machine data.
　上記実施形態においては、実装機データおよび検査機データ更新の際、実装機データの更新情報が、実装機側制御装置６０から、統合制御装置９３を介して、検査機側制御装置７０に伝送された。しかしながら、実装機データの更新情報の伝送経路は、特に限定しない。例えば、更新情報が、実装機側制御装置６０から、直接、検査機側制御装置７０に伝送されてもよい。上記実施形態においては、電子部品の種類の交換時に、実装機データおよび検査機データを更新したが、データ更新のタイミングも特に限定しない。例えば、基板Ｂｆ、Ｂｒの種類の変更や、基板Ｂｆ、Ｂｒにおける電子部品の装着座標の変更が行われる時に、実装機データおよび検査機データを更新してもよい。この場合、更新は、図４に示す基板外観検査機７の検査ヘッド７５の検査カメラにより、基板Ｂｆのマーク（型番、識別子、記号など）を撮像し、基板Ｂｆの種類が変更されたことを確認した後で、実行される。 In the above embodiment, when the mounting machine data and the inspection machine data are updated, the mounting machine data update information is transmitted from the mounting machine side control device 60 to the inspection machine side control device 70 via the integrated control device 93. It was. However, the transmission path for the update information of the mounting machine data is not particularly limited. For example, the update information may be transmitted directly from the mounting machine side control device 60 to the inspection machine side control device 70. In the above embodiment, the mounting machine data and the inspection machine data are updated at the time of exchanging the type of electronic component, but the timing of data update is not particularly limited. For example, the mounting machine data and the inspection machine data may be updated when the types of the boards Bf and Br are changed or the mounting coordinates of the electronic components on the boards Bf and Br are changed. In this case, the update is performed by imaging the mark (model number, identifier, symbol, etc.) of the substrate Bf with the inspection camera of the inspection head 75 of the substrate appearance inspection machine 7 shown in FIG. Executed after confirmation.
　部品タイプデータの電子部品の種類は特に限定しない。例えば、角チップ、ＩＣ（Ｉｎｔｅｇｒａｔｅｄ　Ｃｉｒｃｕｉｔ）、ＳＯＰ（Ｓｍａｌｌ　Ｏｕｔｌｉｎｅ　Ｐａｃｋａｇｅ）、ＳＯＪ（Ｓｍａｌｌ　Ｏｕｔｌｉｎｅ　Ｊ－ｌｅａｄｅｄ）、ＣＦＰ（Ｃｅｒａｍｉｃ　Ｆｌａｔ　Ｐａｃｋａｇｅ）、ＳＯＴ（Ｓｍａｌｌ　Ｏｕｔｌｉｎｅ　Ｔｒａｎｓｉｓｔｏｒ）、ＱＦＰ（Ｑｕａｄ　Ｆｌａｔ　Ｐａｃｋａｇｅ）、ＰＬＣＣ（Ｐｌａｓｔｉｃ　ｌｅａｄｅｄ　ｃｈｉｐ　ｃａｒｒｉｅｒ）、ＢＧＡ（Ｂａｌｌ　ｇｒｉｄ　ａｒｒａｙ）、ＬＧＡ（Ｌａｎｄ　ｇｒｉｄ　ａｒｒａｙ）、ＬＬＣＣ（Ｌｅａｄ　ｌｅｓｓ　ｃｈｉｐ　ｃａｒｒｉｅｒ）、ＴＣＰ（Ｔａｐｅ　ｃａｒｒｉｅｒ　ｐａｃｋａｇｅ）、ＬＬＰ（Ｌｅａｄｌｅｓｓ　Ｌｅａｄｆｒａｍｅ　Ｐａｃｋａｇｅ）、ＤＦＮ（Ｄｕａｌ　Ｆｌａｔｐａｃｋ　Ｎｏ－ｌｅａｄｅｄ）などを、電子部品の種類として設定してもよい。 The type of electronic component in the component type data is not particularly limited. For example, square chip, IC (Integrated Circuit), SOP (Small Outline Package), SOJ (Small Outline J-leaded), CFP (Ceramic Flat Package, SOT (Small OutlandQLPLC) Plastic leaded chip carrier), BGA (Ball grid array), LGA (Land grid array), LLCC (Lead less chip carrier), TCP (Tape carrier package), LLP (Lead) ual Flatpack No-leaded), etc., may be set as the type of electronic component.
　上記実施形態においては、電子部品実装機１の製造時に実装機データを実装機側制御装置６０に入力した。また、基板外観検査機７における基板検査時に検査機データを検査機側制御装置７０に入力した。しかしながら、データ入力のタイミングは特に限定しない。例えば、基板生産ライン９の作業者が実装機データを入力し、当該実装機データから自動的に検査機データが生成されてもよい。 In the above embodiment, the mounting machine data is input to the mounting machine side control device 60 when the electronic component mounting machine 1 is manufactured. In addition, inspection machine data was input to the inspection machine side control device 70 at the time of board inspection by the board appearance inspection machine 7. However, the data input timing is not particularly limited. For example, an operator of the board production line 9 may input mounting machine data, and the inspection machine data may be automatically generated from the mounting machine data.
　なお、実装機データは、基板Ｂｆ、Ｂｒ設計時のＣＡＤデータを基に生成してもよい。また、図１に示すスクリーン印刷機９０の印刷機データ、印刷検査機９１の検査機データを基に生成してもよい。こうすると、さらにデータを共用化することができる。このため、データ入力を簡単に行うことができる。また、上記実施形態においては、図１に示すように、基板外観検査機７をリフロー炉９２の上流側に配置したが、リフロー炉９２の下流側に配置してもよい。また、基板外観検査機７を、隣接する任意の二台の電子部品実装機１の間に、配置してもよい。 The mounting machine data may be generated based on CAD data at the time of designing the boards Bf and Br. Alternatively, the data may be generated based on the printing machine data of the screen printing machine 90 and the inspection machine data of the printing inspection machine 91 shown in FIG. In this way, data can be shared further. For this reason, data input can be performed easily. Moreover, in the said embodiment, as shown in FIG. 1, although the board | substrate visual inspection machine 7 was arrange | positioned in the upstream of the reflow furnace 92, you may arrange | position in the downstream of the reflow furnace 92. Further, the board appearance inspection machine 7 may be disposed between any two adjacent electronic component mounting machines 1.

Claims (6)

  1. 　実装機データに基づいて基板に電子部品を装着する電子部品実装機と、
    　該電子部品実装機の下流側に配置され、検査機データに基づいて該電子部品が装着された該基板の外観を検査する基板外観検査機と、
    を備える基板生産ラインであって、
    　前記実装機データは、前記電子部品の下面形状データを含み、
    　前記検査機データは、該下面形状データを基に自動的に生成される該電子部品の上面形状データを含むことを特徴とする基板生産ライン。     An electronic component mounting machine that mounts electronic components on a substrate based on mounting machine data;
    A board appearance inspection machine arranged on the downstream side of the electronic component mounting machine and inspecting the appearance of the board on which the electronic component is mounted based on inspection machine data;
    A board production line comprising:
    The mounting machine data includes lower surface shape data of the electronic component,
    The board production line, wherein the inspection machine data includes upper surface shape data of the electronic component that is automatically generated based on the lower surface shape data.
  2. 　前記上面形状データは、前記下面形状データにおける、前記電子部品のボディの外縁よりも水平方向内側の部材に関するデータを除外し、該ボディの外縁、および該外縁よりも水平方向外側の部材に関するデータを参照して生成される請求項１に記載の基板生産ライン。 The upper surface shape data excludes data relating to members on the inner side in the horizontal direction from the outer edge of the body of the electronic component in the lower surface shape data, and includes data relating to the outer edge of the body and members on the outer side in the horizontal direction from the outer edge. The substrate production line according to claim 1, which is generated by reference.
  3. 　前記実装機データは、前記電子部品の種類に関する部品タイプデータを含み、
    　前記検査機データは、該部品タイプデータを基に自動的に生成される、該電子部品を上方から撮像する際の検査機ライティング条件データを含む請求項１に記載の基板生産ライン。     The mounting machine data includes component type data regarding the type of the electronic component,
    The board production line according to claim 1, wherein the inspection machine data includes inspection machine lighting condition data when the electronic component is imaged from above, which is automatically generated based on the component type data.
  4. 　前記実装機データは、前記電子部品の種類に関する部品タイプデータを含み、
    　前記検査機データは、該部品タイプデータを基に自動的に生成される、該電子部品を上方から撮像する際の検査機ライティング条件データを含む請求項２に記載の基板生産ライン。     The mounting machine data includes component type data regarding the type of the electronic component,
    The board production line according to claim 2, wherein the inspection machine data includes inspection machine lighting condition data when the electronic component is imaged from above, which is automatically generated based on the component type data.
  5. 　前記実装機データが更新された際、更新内容が自動的に前記検査機データに反映される請求項２に記載の基板生産ライン。 3. The board production line according to claim 2, wherein when the mounting machine data is updated, the updated content is automatically reflected in the inspection machine data.
  6. 　実装機データに基づいて基板に電子部品を装着する電子部品実装機と、
    　該電子部品実装機の下流側に配置され、検査機データに基づいて該電子部品が装着された該基板の外観を検査する基板外観検査機と、
    を備える基板生産ラインの検査機データ生成方法であって、
    　前記実装機データに含まれる前記電子部品の下面形状データを基に、前記検査機データに含まれる該電子部品の上面形状データを自動的に生成することを特徴とする検査機データ生成方法。     An electronic component mounting machine that mounts electronic components on a substrate based on mounting machine data;
    A board appearance inspection machine arranged on the downstream side of the electronic component mounting machine and inspecting the appearance of the board on which the electronic component is mounted based on inspection machine data;
    An inspection machine data generation method for a board production line comprising:
    An inspection machine data generation method comprising: automatically generating upper surface shape data of the electronic component included in the inspection machine data based on lower surface shape data of the electronic component included in the mounting machine data.
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