WO2012082917A1 - Procédé destiné à étanchéifier des fils électriques passant à travers une ouverture d'accès au moyen d'un plot de remplissage et module produit de cette façon - Google Patents

Procédé destiné à étanchéifier des fils électriques passant à travers une ouverture d'accès au moyen d'un plot de remplissage et module produit de cette façon Download PDF

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Publication number
WO2012082917A1
WO2012082917A1 PCT/US2011/064943 US2011064943W WO2012082917A1 WO 2012082917 A1 WO2012082917 A1 WO 2012082917A1 US 2011064943 W US2011064943 W US 2011064943W WO 2012082917 A1 WO2012082917 A1 WO 2012082917A1
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WO
WIPO (PCT)
Prior art keywords
laminate
encapsulant
sealing
sealing plug
layer
Prior art date
Application number
PCT/US2011/064943
Other languages
English (en)
Inventor
Charles Anthony Smith
Original Assignee
E. I. Du Pont De Nemours And Company
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Filing date
Publication date
Application filed by E. I. Du Pont De Nemours And Company filed Critical E. I. Du Pont De Nemours And Company
Publication of WO2012082917A1 publication Critical patent/WO2012082917A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10743—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing acrylate (co)polymers or salts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
    • B32B17/10816—Making laminated safety glass or glazing; Apparatus therefor by pressing
    • B32B17/10825—Isostatic pressing, i.e. using non rigid pressure-exerting members against rigid parts
    • B32B17/10834—Isostatic pressing, i.e. using non rigid pressure-exerting members against rigid parts using a fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
    • B32B17/10816—Making laminated safety glass or glazing; Apparatus therefor by pressing
    • B32B17/10871—Making laminated safety glass or glazing; Apparatus therefor by pressing in combination with particular heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • This invention relates to various methods for fabricating a photovoltaic module and for the module produced thereby.
  • PP0228 (a cognate of PP0104, PP0228 and PP0229);
  • photovoltaic module As used herein the term "photovoltaic module" or
  • module refers to a generally planar photovoltaic
  • the generating device that includes a laminated structure typically enclosed within a support frame.
  • the laminated structure, or "laminate”, is itself generally indicated by the reference character L.
  • the laminate L includes an array of photovoltaic cells operative to convert incident
  • the first step in the fabrication of a photovoltaic module is to pre-assemble, or "lay-up", the various
  • Figures 1A and IB are stylized exploded cross section views illustrating the various layers comprised within a typical laminate .
  • the laminate L comprises at least a transparent layer T, a support layer S, and a photovoltaic layer V. Both the transparent layer T and the support layer S have respective interior surfaces ⁇ , Si and respective opposed exterior surfaces T E , S E thereon. The interior surfaces Ti, Si cooperate to define an interior volume within the laminate. The interior volume is generally indicated by the reference character M. In some
  • the support layer S has an exhaust aperture A formed therein, for a purpose to be discussed.
  • the transparent layer T may be glass, polycarbonate, acrylic, a polyvinyl fluoride film such as that sold by E. I. du Pont de Nemours and Company, Wilmington, DE, under the trademark Tedlar ® or any other transparent medium which permits solar radiation to pass thereby to illuminate the cells in the active photovoltaic layer V.
  • the glass usually has a thickness that is less than ten millimeters (10 mm) and typically in the range from about one-half to about six millimeters (0.5 to about 6 mm) .
  • the support layer S may be implemented using glass, aluminum, steel, polyester, the polyvinyl fluoride film mentioned above, or other suitable material.
  • the laminate L may be formed such that the edges of the layers forming the same are all laterally coextensive.
  • the various interior layers of the laminate may be arranged such that a depletion zone D is defined about the periphery of the laminate. This arrangement is depicted in Figure IB. It is noted that the transparent and support layers need not extend equal
  • the photovoltaic layer V may be formed from a plurality of discrete solar cells. Alternatively, the photovoltaic layer V may be realized using a thin film fabrication technology in which the cells are integrated directly on one of the layers of the laminate (e.g., transparent layer T) . The cells in the photovoltaic layer V are
  • the internal interconnectors usually take the form of busbars and/or conductor ribbons.
  • busbars and/or conductor ribbons are metallic members (e.g., copper, covered with a solder coating) that are generally
  • the internal interconnectors of the laminate are shown as generally rectangular members denoted by the reference character B.
  • the members are diagrammatically illustrated only in the Figures 1 and 12 and are omitted from the other Figures of the drawings for clarity of illustration .
  • the electrical output produced by the photovoltaic layer is conducted to the exterior of the module via
  • electrical leads may be implemented in a variety of common forms, including busbars or ribbons.
  • the electrical leads are depicted diagrammatically in the Figures as curled wires and are denoted by reference
  • the leads W may extend side-wise from the laminate, i.e., from opposed lateral edges or from the same lateral edge of the photovoltaic layer V, or, perhaps more commonly, they may be conveyed through the aperture A formed in the support layer S.
  • a molded plastic junction box typically is mounted on the backside of the photovoltaic module.
  • the junction box is made weather-tight using a pottant compound, often a two-part silicone mixture.
  • a diode is also included as part of the electrical network within the junction box to prevent backflow of current into the module that may occur if the module is shaded or otherwise obstructed.
  • an encapsulant is disposed at various positions within the laminate L. As will be discussed more fully herein, the choice of the encapsulant material E has a significant bearing on the performance and longevity of the module.
  • the encapsulant E includes, at a minimum, one or more interlayer ( s ) I (usually in sheet form) that are disposed between the photovoltaic layer V and either the transparent layer T or the support layer S, or both.
  • the interlayer I also overlays and surrounds any internal interconnectors B and the electrical leads W.
  • the encapsulant E may also include edge inserts G (in suitable physical form) that are disposed to fill depletion regions D that may be defined in the laminate.
  • moisture ingress, oxygen ingress, ultraviolet degradation or other environmental factors reduce power output and/or module lifetime. Accordingly, after the laminate is laid-up it is subjected to an
  • the process of encapsulation generally follows the basic steps of air removal, application of heat and pressure, followed by cooling/depressurization (the latter performed when pressurization is utilized) .
  • cooling/depressurization the latter performed when pressurization is utilized
  • a vacuum laminator has conventionally been used in the preparation of photovoltaic modules. This technique
  • the laminator generally consists of a heated platen surface upon which the laminate assembly is placed.
  • the laminator has a large chamber in which the assembly is placed.
  • the chamber is sealed and heat is transferred into the assembly, largely through conduction. Heat is used to soften the encapsulant, allow for flow to occur and for bonding of the encapsulant with the materials within the photovoltaic module.
  • This type of equipment can be expensive, especially for large surface area modules, as the encompassing chamber is large and must be designed and constructed to withstand the pressure differential between ambient atmospheric pressure being constantly present on the outside of the
  • Vacuum bagging is a process where air removal is accomplished by surrounding the entire laminate preassembly with a membrane film creating a substantially air-tight enclosure and then withdrawing air through an access port or tube inserted through the bag.
  • These bags are generally either of the disposable type (e.g. nylon or polyester films) and are designed to be used through one process cycle of lamination and then discarded.
  • the bag may be of a reusable type made of a relatively thick, more durable material (e.g. silicone), on the order of three to five millimeters (3 to 5 mm) .
  • Such a bag can be used for many processing cycles until the material either deteriorates from repeated exposure to heat or becomes physically
  • Vacuum bagging is generally a manual process which requires significant time per unit assembly.
  • bagging material that is relatively thin (-0.01 to 0.2 millimeters) can conform readily around the periphery to minimize edge compression and edge
  • Thin films of any type will allow for the passage of infrared radiation therethrough and to be available for irradiation of the laminate below or within.
  • polyvinyl fluoride film such as that sold by E. I. du Pont de Nemours and Company sold under the trademark Tedlar ® has been found to provide sufficient infrared transparency. Any other transparent medium which permits incident radiation during processing to pass in a significant manner to
  • illuminate the cells in the active photovoltaic layer V may be used.
  • vacuum ringing Yet another type of process of air removal is vacuum ringing.
  • air removal is accomplished by surrounding the entire laminate preassembly with a flexible vacuum ring (e.g., U.S. Patents 2,948,645 and 3,074,466).
  • these rings are fabricated of silicone rubber and are made to engage with the specific geometry of the laminate preassembly.
  • the channel of the vacuum ring includes a recessed portion which is maintained in a spaced- apart relationship with the entire peripheral edge of the preassembly, to define a vacuum passage, whereas the ring extends onto the marginal edges of the outer preassembly surfaces and forms an air-tight seal.
  • Vacuum rings are currently used in the glass lamination industry for air removal and are often utilized within autoclaves, where super-atmospheric pressure and temperature completes the lamination process. In some instances, it is desirable to maintain the vacuum ring in place when the glass assembly is within the autoclave, and to apply a vacuum to the ring during at least part of the time the assembly is heated and pressurized.
  • the specific design and processing cycle should be optimized so as to prevent the significant reduction of the thickness of the interlayers around the marginal edges of the assembly, thereby creating undesirable optical distortion and/or stress in those areas.
  • the present invention is directed to methods for fabricating a photovoltaic module and to the module produced thereby .
  • the photovoltaic module includes a laminate comprising a transparent layer, a support layer, and a photovoltaic layer.
  • the transparent and support layers each have an exterior surface and an interior surface, with the interior surfaces of the layers defining an interior volume
  • the photovoltaic layer is disposed in the interior volume.
  • An encapsulant material is disposed at least between the photovoltaic layer and either the interior surface of the transparent layer or the interior surface of the support layer, or both.
  • the encapsulant material has a predetermined sealing temperature above which the
  • the encapsulant is able to flow into adhesive contact with the photovoltaic layer and the transparent layer and/or the protective layer.
  • the encapsulant material also exhibits a predetermined energy absorptivity response.
  • the encapsulant may be polyvinyl butyral ("PVB”), ethylene vinyl acetate (“EVA”), or an unfilled or filled ionomeric material.
  • the method of the present invention includes, in any operative order, the steps of: sealing the interior volume of the laminate in an air-tight manner; and, using a heating source, heating the encapsulant material within the
  • the laminate is sealed in an air-tight manner using a fixture that engages the laminate completely about its periphery while leaving the major portion of the exterior surfaces of the laminate exposed.
  • the fixture comprises a pair of complementary rigid frames.
  • the seal between the frames of the fixture may be formed in any of a variety of ways. Use of such a fixture permits extraction of air from the laminate (either through an exhaust aperture in the support layer or from the
  • the heating source is a source of infrared radiation having a peak wavelength in the range from about one (1) to about ten (10) micrometers, whereby at least thirty percent (30%), more preferably at least fifty percent (50%) and most preferably at least sixty-five percent (65%) of the
  • wavelengths of the sources may be varied.
  • Another approach is to modify the absorptivity response of the encapsulant material in those predetermined areas of the laminate in a way such that incoming energy is converted to heat at different rates, thus creating different
  • the encapsulant material may contain one or more additives that cause the encapsulant to respond to radiation.
  • the additive can take the form of any pigment or filler, such as carbon black or glass fiber. Other alternatives are also disclosed herein.
  • Wires emanating from the laminate through an exhaust aperture are sealed using a plug that is inserted into the aperture.
  • the plug when raised to its sealing temperature adhesively bonds to the leads.
  • Leads emanating from lateral sides of the laminate are sealed using a stem that collapses in the presence of a pressure differential upon heating to a softening temperature.
  • the plug or stem as the case may be, also adhesively bonds to the encapsulate. It is preferred that the plug or stem be made from the same material or a material compatible with the encapsulate so that a more intimate melding and fusing with the encapsulate can occur.
  • Figures 1A and IB are stylized diagrammatic exploded views of alternative forms of a photovoltaic laminate constructed in accordance with the prior art
  • Figures 2A through 2C are stylized diagrammatic
  • Figures 3A through 3C are stylized diagrammatic
  • Figure IB exploded views during the encapsulation of a photovoltaic laminate as shown in Figure IB using the fixture and heating arrangement in accordance with the process of the present invention, while Figure 3D illustrates the encapsulated module with an edge insert material in the depletion region;
  • Figures 4A and 4B are stylized diagrammatic exploded views during the encapsulation of a photovoltaic laminate as shown in Figure IB using a modified form of the fixture in accordance with the process of the present invention, while Figure 4C illustrates the encapsulated module with an edge insert material in the depletion region;
  • Figures 5A and 5B are stylized diagrammatic exploded views during the encapsulation of a photovoltaic laminate as shown in Figure IB using another modified form of the fixture in accordance with the process of the present invention, while Figure 5C illustrates the encapsulated module with an edge insert material in the depletion region;
  • Figures 6A and 6B are stylized diagrammatic exploded views during the encapsulation of a photovoltaic laminate as shown in Figure IB using still another modified form of the fixture in accordance with the process of the present invention, while Figure 6C illustrates the encapsulated module with an edge insert material in the depletion region;
  • Figures 7A and 7B are stylized diagrammatic exploded views during the encapsulation of a photovoltaic laminate as shown in Figure IB using yet another modified form of the fixture in accordance with the process of the present invention, while Figure 7C illustrates the encapsulated module with an edge insert material in the depletion region;
  • Figure 8 is a graphical representation of blackbody emissive power and absorptance of EVA, PVB and unfilled ionomer encapsulant materials and glass both plotted against wavelength output from an infrared heating source;
  • Figure 9 is a graphical representation similar to
  • Figures 10A and 10B are stylized diagrammatic views illustrating a first embodiment of an aspect of the
  • Figures 11A and 11B are stylized diagrammatic views illustrating a first embodiment of yet another aspect of the invention whereby electrical leads emanating laterally from the laminate are sealed against moisture and oxygen ingress;
  • Figure 11C is a stylized diagrammatic view illustrating a second embodiment of the aspect of the invention for sealing laterally emanating electrical leads as modified for use within a fixture;
  • FIGS 12A through 19B are diagrammatic views used in connection with the Examples disclosed herein.
  • pre-assembled As shown in Figure 1A or IB it is moved to a predetermined operational location where it is encapsulated.
  • predetermined operational location is intended to encompass one or more work stations or positions at which operations on the laminate are performed.
  • the operational location could be a location along an assembly line past which the laminate is movable.
  • the laminate L includes an encapsulant E disposed at various positions within the laminate L.
  • encapsulant As used herein, the terms “encapsulant”, “encapsulant material” or the like are to be construed to include all material (s) that serve (s) to encapsulate and to seal against moisture and oxygen ingress into the interior volume M of the laminate.
  • the material used for the encapsulate E exhibits an energy absorptivity response that optimizes the effective heating rate of the material (s) being heated.
  • energy absorptivity response it is meant the ability of a material under irradiation to receive incoming energy and convert it to heat energy.
  • Each material used as an encapsulant (whether for an interlayer or an edge insert) has a predetermined sealing temperature at which the encapsulant is able to flow into adhesive contact against the photovoltaic layer and an adjacent interior surface of the transparent layer and/or the support layer, or both. This arrangement is believed to best seal the module against moisture and oxygen intrusion and maximize mechanical robustness and overall durability.
  • a "sealing temperature" for a given material in a given application is not a fixed value but a situation-dependent property. Sealing
  • sealing temperatures is a function of the particular geometry and internal topography that the encapsulant must accommodate in a particular application. Generally speaking, sealing temperatures for an encapsulant lie within the range from about eighty to one hundred twenty degrees Centigrade (80 °C to 120 °C) .
  • the encapsulant material should possess low outgassing potential.
  • Outgassing potential may be determined by headspace gas chromatography (e.g., ASTM F1884-04) and/or tested after processing by reheating the laminate to an elevated temperature (e.g. 120 °C) to simulate the end use application and longevity and performance of the module for latent defects (e.g., bubble formation).
  • Low moisture within the encapsulant materials will also help to prevent and/or minimize outgassing.
  • Upper concentration limits for these various outgassing substances (volatiles) would advantageously be set for the resultant laminates to be largely free of bubble-like defects. This is particularly important since the high pressure that would be present in traditional autoclave processing is not present to suppress bubble formation.
  • PVB polyvinyl butyral
  • encapsulant material possesses thermoplastic properties such that application of heat can allow for plastic flow to occur whereby sealing/encapsulation of the laminate may be
  • a preferred polymeric material is one that provides a high degree of clarity to maximize the solar radiation reaching the photovoltaic active region
  • ionomeric materials which generally exhibit these advantageous properties, can be used as encapsulant interlayers in the present inventions.
  • Ionomers are polymers produced by partially or fully replacing the hydrogen atoms of the acid moieties of precursor (also known as "parent") acid copolymers with ionic moieties. This is generally accomplished by neutralizing the parent acid copolymers, for example copolymers comprising copolymerized units of -olefins and a, ⁇ -ethylenically unsaturated carboxylic acids. Neutralization of the carboxylic acid groups present in such parent or precursor copolymers is generally effected by reaction of the copolymer with a base, e.g.
  • the ionomers thus formed are ionic, fully or partially neutralized compositions that comprise carboxylate groups having cations derived from reaction of the carboxylic acid with the base.
  • Ionomers are well known in the art and include polymers wherein the cations of the carboxylate groups of the ionomer are metal cations,
  • alkali metal cations including alkali metal cations, alkaline earth cations and transition metal cations.
  • Commercially available ionomers include those having sodium, magnesium, potassium, zinc and lithium cations.
  • encapsulant interlayer in the present inventions are the ionomer-based encapsulants available from E. I. Du Pont de Nemours and Company) as DuPontTM PV5300 and PV5400.
  • U.S. Patent 5,476,553 discloses the use, among others, of sodium ionomers such as Surlyn ® 1601 resin as an
  • U.S. Patent 6,114,046 discloses a multi-layer metallocene polyolefin/ionomer laminate
  • ionomers are neutralized derivatives of a precursor -olefin carboxylic acid copolymer, wherein about 10% to about 60% of the total content of the
  • carboxylic acid groups present in the precursor a-olefin carboxylic acid copolymer have been neutralized with metal ions, and wherein the precursor a-olefin carboxylic acid copolymer comprises (i) copolymerized units of an a-olefin having two to ten carbons and (ii) about eighteen to about thirty weight-percent (about 18 to about 30 wt%) , based on the total weight of the ⁇ -olefin carboxylic acid copolymer, of copolymerized units of an a, ⁇ -ethylenically unsaturated carboxylic acid having three to eight carbons.
  • Suitable ⁇ -olefin comonomers may include, but are not limited to, ethylene, propylene, 1-butene, 1-pentene, 1- hexene, 1-heptene, 3 methyl-l-butene, 4-methyl-l-pentene, and the like and mixtures of two or more thereof.
  • the a-olefin is ethylene
  • Suitable a, ⁇ -ethylenically unsaturated carboxylic acid comonomers may include, but are not limited to, acrylic acids, methacrylic acids, itaconic acids, maleic acids, maleic anhydrides, fumaric acids, monomethyl maleic acids, and mixtures of two or more thereof.
  • the ⁇ , ⁇ - ethylenically unsaturated carboxylic acid is selected from acrylic acids, methacrylic acids, and mixtures of two or more thereof.
  • the precursor acid copolymers may further comprise copolymerized units of other comonomer ( s ) , such as
  • Suitable acid derivatives include acid anhydrides, amides, and esters. Esters are preferred. Specific examples of preferred esters of unsaturated carboxylic acids include, but are not limited to, methyl acrylates, methyl
  • methacrylates isobutyl acrylates, isobutyl methacrylates, tert-butyl acrylates, tert-butyl methacrylates, octyl acrylates, octyl methacrylates, undecyl acrylates, undecyl methacrylates, octadecyl acrylates, octadecyl methacrylates, dodecyl acrylates, dodecyl methacrylates, 2-ethylhexyl acrylates, 2-ethylhexyl methacrylates, isobornyl acrylates, isobornyl methacrylates, lauryl acrylates, lauryl
  • glycol ) methacrylates poly (ethylene glycol) methyl ether acrylates, poly (ethylene glycol) methyl ether methacrylates, poly (ethylene glycol) behenyl ether acrylates, poly (ethylene glycol) behenyl ether methacrylates, poly (ethylene glycol) 4-nonylphenyl ether acrylates, poly (ethylene glycol) 4- nonylphenyl ether methacrylates, poly (ethylene glycol) phenyl ether acrylates, poly (ethylene glycol) phenyl ether methacrylates, dimethyl maleates, diethyl maleates, dibutyl maleates, dimethyl fumarates, diethyl fumarates, dibutyl fumarates, dimethyl fumarates, vinyl acetates, vinyl
  • propionates and mixtures of two or more thereof.
  • suitable comonomers include, but are not limited to, methyl acrylates, methyl methacrylates , butyl acrylates, butyl methacrylates, glycidyl methacrylates, vinyl acetates, and mixtures of two or more thereof.
  • the precursor acid copolymers may be polymerized.
  • the precursor acid copolymers are polymerized under process conditions such that short chain and long chain branching is maximized.
  • the precursor acid copolymer may have a melt flow rate (MFR) of about five hundred (500) g/10 min or less,
  • the corresponding partially neutralized ionomer preferably has a MFR of about one hundred (100) g/10 min or less, more preferably about sixty (60) g/10 min or less, and most preferably about forty (40) g/10 min or less.
  • the ionomer may also preferably have a flexural modulus greater than about 10,000 psi (68.9 MPa) , more preferably greater than about 12,500 psi (86.2 MPa), and most preferably greater than about 15,000 psi (103 MPa), as determined in accordance with ASTM method D638.
  • the ionomers of the present invention may also contain one or more additives, including, but not limited to, processing aids, flow enhancing additives, lubricants, pigments, dyes, flame retardants, impact modifiers,
  • nucleating agents such as silica, thermal stabilizers, infrared (“IR”) absorbers, ultraviolet (“UV”) absorbers, ultraviolet stabilizers, dispersants, surfactants, chelating agents, coupling agents,
  • reinforcement additives such as glass fiber, fillers and the like.
  • Encapsulant Edge Inserts Materials suitable for use as encapsulant edge insert G include poly (isobutylene) , poly (urethane) , poly ( sulfides ) and silicone. Preferred materials are made using ionomeric materials, either unfilled or filled. Fillers including but not limited to pigments such as carbon black and/or glass fibers may be added to enhance the energy absorptivity response of the material for faster heating. Glass fibers and the like may be added to the encapsulant edge insert for improving creep resistance. Other additives such as EVOH, mica, dessicants (e.g. zeolites) are known in the industry to provide reduced moisture ingress may advantageously be compounded into the ionomeric resin for improved moisture ingress properties.
  • Silanes or other additives can additionally be added for enhancing adhesion to the transparent layer and/or support layer. Improved creep resistance can be achieved by using an additive which crosslinks upon heating. Various peroxides are well-known in the industry for providing this polymer modification feature. Alternatively, creep- resistance can be facilitated by adding a higher melting point polymer resin to the ionomeric resin. For example, one compounded resin was made by taking clear ionomer encapsulant and compounding in two percent (2%) carbon black, twenty percent (20%) Nucrel ® HS0411 ethylene
  • the laminate L is formed into a finished module using an air- tight fixture 20 and a heating source 40 that is operative in a coordinated manner in accordance with the present invention.
  • a heating source 40 that is operative in a coordinated manner in accordance with the present invention.
  • various aspects of the invention may be performed in which the internal volume of the laminate is sealed without the use of the fixture 20.
  • the fixture 20 used in the present invention may take any of a variety of forms, representative ones of which are illustrated in Figures 2 through 7. However, in all of its various forms the fixture 20 includes a top frame member 22T and a bottom frame member 22B, with the primary difference among the various forms being the manner in which the air ⁇ tight sealed integrity of the fixture 20 is maintained when a laminate L is received therein and is being operated thereupon.
  • the frames 22T, 22B are preferably made of machined aluminum but can be made of any material that is substantially rigid in a plane parallel to the plane of the transparent layer and support layers of the laminate L.
  • substantially rigid is used herein to mean the fixture will not deflect to an extent that it unduly pinches the peripheral edges of a laminate being fabricated therein.
  • each of the top and bottom frames 22T, 22B carries a peripheral seal 23T, 23B, respectively.
  • the seals 23T, 23B seat in air-tight abutment against selected surfaces of the laminate L such that the laminate is completely engaged about its periphery by the fixture when the laminate is received within the fixture.
  • the seals 23T, 23B may seat against the peripheral margins of the upper and lower exterior surfaces T E , S E of the respective transparent layer T and the support layer S of the laminate L.
  • the seals 23T, 23B may be disposed on the frames in such
  • each frame member 22T, 22B has a circumferential lip 24T, 24B formed thereon.
  • a gasket 25 is mounted on one of the lips, e.g., the lip 24T. In these arrangements the gasket 25 is the member that serves to maintain the sealed integrity of the interior of the fixture when the frames 22T, 22B are joined together.
  • a vacuum port 26 is formed in one of the frames (e.g., the frame 22T) .
  • the port communicates with the interior annular volume 27 that surrounds the laminate L when the frames 22T, 22B are conjoined.
  • the fixture 20 shown in Figure 4A includes a force generating member 28 disposed in the annular interior volume 27 defined within the closed fixture.
  • the force generating member 30 may implemented by any suitable pneumatic, electrical, mechanical or electro/mechanical actuator.
  • the force generating member 28 takes the form of an expandable bladder.
  • the bladder may be conveniently attached to one of the frames, e.g., the frame 22B, if desired.
  • the bladder 28 has an inflation nipple 28N that extends in any convenient manner to the exterior of the fixture 20, as through an access port 22P provided in the lower frame 22B.
  • the force generating member may take the form of a constricting belt arrangement.
  • an edge insert G may be disposed within the fixture 20 inwardly of the force generating member 28.
  • the edge insert G serves to form a peripheral seal between the layers of the laminate to further limit the ingress of moisture into the finished module.
  • the edge insert G is formed of a material having a predetermined sealing temperature above which the material is able to flow into adhesive contact with a layer of the laminate to which it is adjacent.
  • the edge insert G need not provide the primary seal between these members and hence it may take any of a variety of physical forms.
  • the encapsulant for the edge insert G may implemented as a flexible strip-like member or profile that keeps its shape at room temperature, a bead of a flexible deformable
  • a bead of a viscous liquid e.g., of toothpaste-like consistency
  • a mass of particles e.g., grains or pellets
  • peripheral margins of the frames 22T, 22B are spaced from each other, i.e., the circumferential lip regions 24T, 24B shown in Figures 2A and 3A are not provided.
  • the air-tight circumferential seal between the frames (when the fixture is closed) is provided by a force generating member or a force transmitting member that extends between the confronting surfaces of the frames.
  • This member may, if desired, be connected to one of the frames (e.g., the frame 22B) .
  • the force generating member is implemented using an inflatable bladder 28 similar to that shown in Figure 4A.
  • the bladder may be made of a suitable expandable material such as neoprene or silicone rubber.
  • the interior contoured surface 281 of bladder 28 is presented to the interior volume defined by the conjoined frames, while the exterior contoured surface 28E of the bladder 28 is directly accessible from the exterior of the fixture.
  • the bladder 28 forms a sealing interface with the frames, as suggested at reference character 28S.
  • an air-tight circumferential seal between the frames is provided by an external force transmitting member in the form of a deflectable diaphragm seal 32.
  • the interior surface 321 of the diaphragm 32 faces toward the interior volume defined by the conjoined frames, while the exterior surface 32E of the diaphragm 32 is directly
  • the diaphragm 32 has upper and lower circumferential rims 32T, 32B that abut against in sealed engagement against the edge surfaces of frames 22T, 22B, respectively.
  • the diaphragm may be
  • inventions 5 and 6 further include an edge insert G surrounding the periphery of the laminate. Similar to the situation extant in Figure 4, since the air-tight seal between frames is provided by the bladder 28 or the deflectable diaphragm 32, as the case may be, the edge insert G may take any of the physical form as discussed in connection with that Figure.
  • the air-tight seal between the frame members is provided by an externally accessible edge insert G.
  • the edge insert G must be dimensionally stable at room temperatures and exhibit a geometric shape to allow it to engage in contacting relationship with the top and bottom internal surfaces of the frame members and/or the peripheral edge of the transparent layer and support layer.
  • the shape of the edge insert G is selected such that mating surfaces with the frame and/or peripheral edges of the transparent layer and support layer will form a sealed relationship once assembled (assembly could be performed at room temperature or could be preheated) or during the primary process heating step. This step would precede the laminate reaching its sealing point, such that air removal from the internal volume of the laminate can be achieved.
  • An air withdrawal nipple (s) 33 is disposed at predetermined circumferential location (s) about the edge insert G. The nipple (s) 33 extend (s) through the edge insert G so that air may be removed from the laminate.
  • the heating source 40 serves to heat the material of the laminate to promote the development of a bond with the layers and components therein and to further soften of the encapsulant to achieve flow around busbars, leads, cells, and required conformation to surfaces within the laminate. In cases where a cross-linking of the encapsulant is desired the heating source can drive those reactions. If an edge insert G is also included within the fixture the source 40 also provides the heat energy to cause the same to soften and to flow into desired locations on the laminate, as will be discussed.
  • Several forms of heating sources are available, including convection, conduction, infrared, radio frequency, induction, or microwave.
  • the heating source 40 has an energy output
  • Energy output characteristic relates to the spectral distribution of emitted energy from the heating source.
  • tuning it is meant the matching of the emitted energy from the source to the energy
  • infrared heating is preferred.
  • Various infrared element technologies are available, each with different spectral emission
  • Heated element ceramic heaters generally operate in the five hundred to one thousand degrees Kelvin range (500 °K to 1000 °K) emitting infrared radiation in the two to ten micrometer (micron) (2 to 10 micrometer) range.
  • Quartz tube emitters generally operate around twenty-five hundred degrees Kelvin (2500 °K) and emit peak radiation in the short-infrared range around one to two micrometer (1 to 2 micrometer) .
  • Infrared lamps with tungsten-halogen filaments generally operate in a range from about twenty-six hundred to twenty-nine hundred Kelvin (2600 °K to 2900 °K) and emit peak radiation in the short- infrared range around one micrometer (1 micrometer) .
  • the benefit of these shorter wavelength emitters is their power densities are much higher (e.g. ⁇ 40W/cm 2 ) than the mid- and long-wavelength infrared emitters. Additionally, their response time (time to heat-up and reach full emitter output) is short (seconds) .
  • the useful range for heating is 0.3 micrometers to one hundred (100) micrometers, preferably 0.4 micrometers to twenty (20) micrometers, and most preferably 0.4 micrometers to ten (10) micrometers. It should be recognized that a portion of this emission is in the visible range.
  • the heating source 40 is implemented using one or more infrared lamps 40L (and any associated equipment, e.g., reflectors and the like) that are supported in any convenient positions with respect to the fixture 20 (see Figures 2A and 3A) .
  • the lamps 40L are positioned to irradiate one or both of the exposed surfaces of the laminate. If desired the sources 40 may be
  • the laminate L may be such that the various interior layers of the same are either edge-wise coextensive with the top layer T and support layer S ( Figure 1A) or recessed from those edges by a depletion zone D ( Figure IB) .
  • the first step in accordance with the method of the present invention is to seal the interior volume of the laminate from communication with the atmosphere.
  • a band of sealing material such as a tape.
  • a vacuum ring may also be utilized to seal the laminate completely about its periphery in an air-tight manner such that a major portion of the exterior surface of one or both the transparent and a support layers of the laminate is/are exposed to atmospheric pressure .
  • the laminate is sealed by engaging the laminate completely about its periphery with a selected form of air-tight fixture.
  • a selected form of air-tight fixture As earlier discussed, regardless of the form of fixture used, when mounted within the fixture the seals 23T, 23B on the respective frames 22T, 22B seat against the peripheral margins of the upper and lower exterior surfaces T E , S E or the edge surfaces of the
  • Figure 2A illustrates a laminate L having edge-wise coextensive layers received within a fixture 20 of the type having circumferential lips
  • Figure 3A shows a
  • Figure 4A shows a laminate L having a depletion zone D as received within a fixture of the type that includes an internal force generating member (the bladder 28) .
  • the edge insert G is inserted into the fixture in surrounding relationship to the laminate.
  • the insert G extends completely about the periphery of the laminate.
  • the force generating bladder 28 is then disposed in surrounding relationship to the insert G.
  • a laminate L with a depletion zone D is received within a fixture having an external force generating bladder.
  • the edge insert G is positioned between the interior surface of the force generating member and the periphery of the laminate.
  • Figures 4A through 7A illustrate a given fixture used in conjunction with a laminate L having a depletion region D
  • a laminate having edge-wise coextensive layers may be used with equal effect.
  • the next step in the process is heating the encapsulant material E within the laminate using the lamps 40L.
  • the energy output from the lamps 40L is tuned to the particular encapsulant material within the laminate so that energy is more efficiently channeled into heating of the encapsulant material.
  • Air is removed from between the layers of the laminate via the vacuum port 26.
  • the support layer S has an exhaust aperture A provided therein, air can be removed therethrough.
  • a vacuum shoe 42 may be positioned about the aperture A. If air removal is through the exhaust aperture the vacuum port 26 of the fixture need not be utilized. Air is removed until the pressure within the laminate is in the range from about zero to about fifty (50) millibar absolute.
  • the temperature of the encapsulant material is raised past its sealing temperature, it adhesively contacts against the photovoltaic layer and an adjacent interior surface (s) of the transparent layer and/or the protective layer, thereby to form a sealed composite structure. Further increase in temperature causes the encapsulant to flow to surround busbars, leads, cells, and to conform to surfaces within the laminate .
  • the finished, sealed, module ( Figures 2C, 3C) is removed from the fixture 20.
  • the depletion zone D of the finished module may then be filled with encapsulant material for the edge insert G.
  • the force generating bladder 28 is actuated to bring the same into contact with the exterior surface of the insert 29.
  • the force generating bladder 28 acts against the edge insert G to force the interior surface thereof into adhesive contact at least against the edge of the photovoltaic layer and at least the edges of the transparent and protective layers, thereby to form a sealed laminated structure. If the laminate has a depletion region D the force produced by the bladder 28 forces the edge insert G thereinto, whereby the insert also adhesively contacts against the interior surfaces of the transparent and protective layers. Similar action obtains if the arrangement of Figure 5A is used.
  • Selective absorption and heating can be accomplished by the proper selection of the materials of construction, including encapsulant and glass. There are two approaches that may be used in choosing the materials of construction, including a calculation method and a direct heating rate measurement method.
  • the calculation method allows an estimation of heating efficiency to be made by either using blackbody radiation emission as described by Plank' s Law or by using the actual emission spectra of the emission source. Integration of the spectral output coupled with the absorption spectra of each respective layer/material of the substrate and/or entire assembly provides a reasonable approach for predicting heating rates on a relative basis. Choice of emitter type and peak temperature with optimization of materials of construction can be made in this manner.
  • a second method useful in determining the preferred materials of construction is the direct measurement of their heating rate under irradiation from the infrared emitter.
  • a thermocouple is taped to the underneath side of the plaque to be tested and the sample placed onto a heat-resistant surface. It is best to avoid materials with high thermal conductivity such as metals.
  • the infrared source is placed at a distance consistent with manufacturer recommendations or how it might be positioned in the actual equipment. The infrared source is activated and the time for the plaque to heat to a given temperature (e.g. sealing temperature) is recorded or if a recording thermometer is used, the heating rate data is captured. This information can be compared between various infrared sources and
  • Figure 8 shows the blackbody emissive power as well as the absorption of encapsulants including unfilled ionomer, PVB and EVA.
  • the absorption of glass is also shown. It can be seen that employing sources having wavelength emissions of 4.5 micrometers or less allows the encapsulant materials to directly absorb the energy, while the glass will absorb much less.
  • directly absorb means that radiation is absorbed by the encapsulant material and converted to heat within the material. If radiation enters one of the layers of the laminate (e.g., the glass layer) the radiation is converted to heat within the glass and the encapsulant is heated by conduction.
  • Figure 9 shows the blackbody emissive power as well as the absorption of encapsulants that are unfilled ionomer, ionomer filled with glass fiber and ionomer filled with carbon black. The addition of glass fiber and carbon black to the ionomer increases the absorption of the emitted energy .
  • ENHANCED LOCALIZED HEATING In accordance with another aspect of this invention enhanced heating effects can be imparted to predetermined targeted zones of the laminate. Such enhanced heating effects are useful, for example, to heat the edge insert material G in the depletion region D, to heat the interlayer encapsulant material I in regions having internal interconnectors B and/or leads W, and/or in any areas where additional encapsulant flow is desirable.
  • the geometric shape and thickness of the internal interconnectors B and electrical leads W create special regions where increased encapsulant flow must occur to accommodate the volume of these members.
  • the encapsulant should flow so as to form a seal around these shapes and achieve a seal for the overall
  • thermoplastic flow This can either reduce the overall energy needed if the entire pre-assembly had to reach this temperature or can greatly reduce the time necessary for sufficient flow to occur.
  • This expedient can be accomplished by varying the distance "d" (e.g., Figure 2B) at which one or more of the sources 40 is/are positioned and/or the source intensities and/or the operating
  • the encapsulant material may contain one or more additives that cause the encapsulant to respond to radiation.
  • the additive can take the form of any pigment or filler. Carbon black is preferred.
  • this filled area would be positioned in areas where higher absorption of infrared radiation would create higher temperatures or faster heating rates. This would be useful to target areas surrounding internal
  • a removable energy absorbing mask may be placed on one or both of the transparent or support layers while the laminate is being heated. This further increases the absorption of infrared radiation in that local region as compared with the surrounding non- masked region.
  • the mask could be placed on the exterior surface of the glass on the infrared source side of the laminate ( Figures 14A, 14B) , or exterior surface of the support layer ( Figures 16A, 16B) .
  • the mask can be
  • FIGs 10A through IOC and Figures 11A through 11C illustrate additional aspects of the invention that address this challenge. As will be developed these aspects of the present invention are believed advantageous in that they extend the encapsulation of the leads beyond the geometry of the module.
  • FIGs 10A through IOC illustrate alternate versions of an aspect of the invention in which the electrical leads W that emanate from the module through the exhaust aperture A in the support layer S are sealed against moisture and oxygen ingress. It is noted that Figures 10A through IOC
  • a band 46 of sealing material e.g., tape
  • sealing material e.g., tape
  • each lead W is electrically connected to a cylindrical metallic socket 48 which thereby becomes a portion of the lead W.
  • the exhaust aperture A in the support layer S is sealed using a sealing plug 50 that is inserted into the aperture A, as suggested by the arrow 52.
  • the plug 50 whose exterior configuration corresponds to the shape of the aperture A, has at least one, but preferably a pair, of openings 50B extending therethrough.
  • the socket 48 of each lead W is inserted through a respective opening 50B in the sealing plug 50.
  • the plug 50 is formed of a material having a
  • the plug 50 should be formed of a material that is the same as or compatible with the encapsulant material, to insure more complete and intimate melding or fusing of the plug to the encapsulant, as will be described.
  • the sealing plug 50 and the encapsulant material (s) within the laminate are heated by the heating source 40.
  • the encapsulant is raised past its sealing temperature, the encapsulant adhesively contacts against the photovoltaic layer, the adjacent interior surface of the protective layer, and the portions of the leads W therein.
  • the plug 50 adhesively contacts against the socket portion 48 of the electrical leads W as well as the encapsulant material within the laminate. If the plug 50 is fabricated from the same or compatible material as used for the encapsulant the plug 50 more intimately melds together and fuses with the
  • a sealed laminated structure is formed in which the leads W (including sockets 48) are completely sealed from a point within the laminate L to the outer ends of the sockets.
  • Air may be withdrawn from within the laminate using the vacuum shoe 42 (also shown, for example, in Figures 2B, 3B) .
  • the shoe 42 has an internal evacuation channel 42C
  • the mouth of the channel 42C is surrounded by an O-ring seal 42S.
  • the shoe 42 advantageously may be provided with a pair of positioning posts 42P which assist in locating the shoe 42 against the support layer S and maintaining the relative position of the sockets with respect to the laminate.
  • the shoe 42 is brought into sealed engagement against the support layer S in a position surrounding the aperture A such that the shoe 42 is in a sealed relationship with the support layer S and the channel 42C in the vacuum shoe is in fluid communication with the aperture A.
  • the evacuation channel 42C is connected to a vacuum and, before the
  • the shoe 42 is removed.
  • the finished module has a typical multi-prong female
  • the compatible male plug typically includes cylindrical metal pins (not shown, but analogous in structure to the posts 42P) .
  • the pins of such a male plug are typically about one- quarter inch (6 mm) long, with a diameter of about four millimeters (4 mm) . It is appreciated that the female-male receptacle-plug arrangement as described may be implemented in variety of ways.
  • junction box 56 integrating the mounting of a junction box 56 to the
  • both of the leads W extend through a respective opening 50B in the plug 50 to leave relatively short lead tails 50T that project beyond the outer surface of the plug 50.
  • the sockets 42S are omitted.
  • the junction box 56 contains appropriate electrical conductors 56C and circuitry 56D to terminate the leads W.
  • the box 56 is filled with a suitable filler material 56F.
  • the filler 56F has a predetermined sealing temperature associated therewith.
  • the same material as is used to form the plug 50 may be used for the filler material 56F within the box 56.
  • the box 56 has an evacuation port 56P formed in a wall thereof.
  • a hollow evacuation stem 60 is connected, as with a grommet, in fluid communication to the evacuation port. This portion of the box is diagrammatically exaggerated in Figure IOC for illustrative clarity.
  • the conductors 56C exit the box 56 through the evacuation port 56P and the stem 60.
  • the stem 60 serves as the pathway for air removal from within the laminate during the air evacuation from the laminate, as will be developed.
  • the stem 60 is formed of a heat softenable material, again preferably the same material as used for the plug 50 and the filler material 58.
  • each conductor 56C from the junction box 56 is electrically connected to the tails 56T of a respective one of the electrical leads W passing through the sealing plug 50 the box 56 is mounted against the support layer S.
  • An 0- ring or adhesive seal 56S seals the box against the support layer S during processing so that the interior of the box 56 is in fluid communication with the aperture A. It should be appreciated that alternative electrical connections may be effected between the leads W and the conductors 56C in the junction box 56.
  • a vacuum source is connected to the evacuation stem 60 and air is withdrawn from the laminate L through the aperture A and the box 56.
  • the plug 50 adhesively contacts against the electrical leads extending therethrough.
  • the filler material 56C adhesively contacts the plug 50 thereby to seal the
  • the plug 50 is fabricated from the same or compatible material as used for the filler, the plug 50 and the filler 56C more intimately meld and fuse together. In either event a sealed laminated structure is formed in which the leads W, lead tails 56T, and conductors 56C are completely sealed from a point within the laminate L to the evacuation port 56P of the junction box 56.
  • the box 56 is itself permanently secured to the support layer S by the filler material 56F.
  • the evacuation stem 60 is also heated to its softening temperature. As air is withdrawn from the laminate the stem softens and responds to the pressure differential between the atmosphere and the
  • FIGS 11A through 11C illustrate arrangements whereby the leads emanating from the sides of the laminate L may be sealed against moisture and oxygen ingress.
  • a collapsible stem similar to that shown in Figure IOC is used to advantage.
  • FIGs 11A and 11B again illustrate a situation in which the internal volume M of the laminate L is sealed using a peripheral band 46, without the use of the fixture 20.
  • Figure 11C illustrates this aspect of the invention using any of the fixtures 20 described herein.
  • a stem 60 is provided for a single lead W emanating from different regions of the laminate L, in order to illustrate modifications of the invention. If convenient (and if the leads W are suitably electrically isolated) both of the electrical leads W from the laminate may occupy a single stem.
  • the stem(s) could extend for any desired distance.
  • each stem 60 is collapsible in response to a pressure differential once the stem has reached a predetermined softening temperature.
  • the stem 60 may be made from a material that is able to adhesively seal with the encapsulant.
  • the stem 60 should be formed of a material that is the same as or compatible with the encapsulant material, to insure more complete and intimate melding or fusing of the stem 60 to the
  • the stem 60 is positioned with respect to the laminate such that the first, inner, end 601 of the stem 60 is proximal and in fluid communication with the interior volume of the laminate L.
  • expedient for positioning the stem would be to puncture the stem through a short length of tape 62 and then to affix that length of tape to the edges of the transparent and support layers of the laminate. At least one (or both of the leads if the leads are jacketed with insulation) is (are) threaded through the stem 60. If the encapsulant includes an edge insert G the insert material assists in holding the stem in position. Thereafter, the remaining portion of the periphery of the laminate is itself sealed using a band 46.
  • the outer end 60E of one or both stem(s) 60 is (are) connected to an evacuation line 62. If only one stem 60 is connected to the evacuation line (e.g., the stem shown on the right hand side of Figure 11A) the outer end 60E of the other stem 60 is covered by a cap 63.
  • the encapsulant within the laminate L and the collapsible region 60C of the stem 60 are heated toward their respective sealing and softening
  • One suitable expedient for creating a pressure differential is to expose the stem, after evacuation, to atmospheric pressure.
  • the temperature of the encapsulant is raised past its sealing temperature the encapsulant is able to adhesively contact against the photovoltaic layer and an adjacent interior surface of the transparent layer and/or the protective layer (as described earlier) .
  • the encapsulant adhesively contacts with the inner end region of the stem, thereby to form a sealed laminated structure in which at least a portion of the electrical lead is enclosed in sealed relationship by the encapsulant and the material of the collapsible region of the stem. If an edge insert is used the stem adhesively contacts with the encapsulant material used for the edge insert. If an edge insert is omitted the stem adhesively contacts with the encapsulant material forming the
  • the stem is made from a material that is the same or compatible with the encapsulant the stem 60 is more intimately melded and fused with the encapsulant. This melded relationship is suggested at reference 65 character in the drawings .
  • the stem 60 includes a rigid portion 60R that is spaced axially from the
  • the rigid portion 60R may be conveniently implemented using a sleeve 60S that is inserted into the stem.
  • the free end W E of the lead W is inserted into the stem 60 to the extent that the free end W E is contained within and surrounded by the rigid portion 60R of the stem.
  • the rigid portion of the stem shields the collapsible region of the stem from collapsing onto the free end W E of the lead.
  • the rigid portion 60R of the stem is later cut (as along cut lines 66, Figure 11B) to expose the end W E of the electrical lead.
  • each electrical lead W may covered with a suitable release jacket 67 that prevents the collapsible portion 60C of the stem 60 from sealing to the free end W E of the electrical lead.
  • the stem is cut (as along cut lines 68) to access the free end W E of the lead.
  • the release jacket 67 is opened to expose the free end of the lead.
  • a fixture 20 may be used to insure the air-tight sealed integrity of the laminate L.
  • the laminate with stem 60 attached as shown in Figure 10A (with the evacuation tube omitted) is disposed on the interior of the fixture. Air is withdrawn from the laminate through the vent opening 26 in the fixture 20, as described earlier. In this case, since no pressure differential exists between the interior and exterior of the stem while the laminate is within the fixture, the stem does not collapse until the frames of the fixture are separated and the stem is exposed to atmospheric pressure.
  • Figure 11C illustrates an alternative whereby the stem may be held in position against the fixture within the fixture.
  • the stem has a flanged base 60F that is sized to abut against the side edges of the transparent and support layers T, S, respectively, of the laminate.
  • a biasing spring 68 positioned within the fixture. One end 681 of the spring bottoms against the flange 60F while the other end 60E of the spring abuts the interior surface of a frame of the fixture. Any suitable alternative biasing element may be utilized. Examples
  • the encapsulants were sheets with a thickness of approximately 0.38mm (15 mils) .
  • the glass was 3mm standard clear annealed glass (30 cm squares) and was washed with deionized water and dried thoroughly before use.
  • the following Examples were fabricated in one of five different primary configurations. These configurations are shown in the configuration of Figures 12A through 19B, specifically Examples shown relative to Figures 12A through 15B and Figures 17A, 17B.
  • the first configuration ( Figures 12A, 12B) utilized a uniform layer of unfilled encapsulant over the entire photovoltaic laminate surface area. This configuration was used for Examples CE40, CE41, 42-45 and 49.
  • the second configuration ( Figures 13A, 13B) utilized a clear ionomer encapsulant sheet over a major portion of the surface area of the photovoltaic laminate, but a region of filled ionomer (2% w/w carbon black) was also present as a strip (4 cm width) through the centerline of the laminate.
  • Example 51 an adhesive electrical isolation tape containing carbon black was used between the glass and the busbar. This was also found to increase the absorption of infrared radiation is that local region.
  • Table 1 used the clear ionomer encapsulant available from by E. I. du Pont de Nemours and Company, Wilmington, DE as DuPontTM PV5400.
  • Examples 46-48 used ionomer encapsulant which had a 2% w/w carbon black extruder compounded layer. Little to no effect on electrical conductivity due to this loading of carbon black but heat-up time was shortened dramatically.
  • Example 52 was prepared by using clear ionomer encapsulant within the active
  • the laminate is heated in a convection oven for a period of sixteen hours and movement of the front glass is measured. Movement less than one millimeter (1 mm) is considered to be "creep- resistant " .
  • Example CE40 Conductive heat as supplied in Example CE41 (platen setpoint @ 130 °C) provides a reduced heating period which can be further reduced by increasing the platen temperature to 160 °C (Example 42) .
  • Good process control e.g.
  • minimizing unplanned temperature variations and process cycle timing is critical when operating a non-equilibrium heating process (i.e., disparate differences between the heating source temperature and the desired laminate assembly temperature) .
  • Examples 43 through 45 show a significant further reduction in heating time which is advantageous over
  • Example 49 used a longer wavelength infrared emission (peak emission of 4um) with an effective heating rate that was slower than the infrared source (peak emission wavelength of 1.1 urn) used in Example 46.
  • the solid black inking marked on the surface facing the infrared lamp allowed for the heating time to be reduced from 2:30 (min:sec) to 1:36 (min:sec) as measured within the interlayer encapsulant.
  • the use of a fixture to support the laminate is also believed to provide significant advantages over the art.
  • Use of a fixture avoids the need for expensive autoclave equipment.
  • the fixture affords open access to heat sources from both top and bottom surfaces of the laminate.
  • the fixture is rigid in a plane parallel to the transparent and support layers, thus significantly avoiding the edge
  • the fixture encompasses a relatively low volume, thus allowing quick extraction of air remaining within the pre- assembly (rather than requiring pumping of a large chamber) . Since substantially the entire exterior surface area of the laminate is exposed, the fixture affords the ability to observe the laminate during processing for adjusting cycle time, minimizing cycle time and even targeting zonal heat for problematic areas noted (e.g., voids, defects).
  • sealing around electrical leads connections improves performance against wet current leakage/durability
  • Targeted heating of localized zones for either edge sealing and/or additional heating can be provided in busbar and lead regions and the like where additional encapsulant flow is desirable.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Sustainable Energy (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Thermal Sciences (AREA)
  • Photovoltaic Devices (AREA)

Abstract

La présente invention concerne un stratifié photovoltaïque comprenant des couches transparentes et de support, une couche photovoltaïque et un matériau encapsulant étanchéifié d'une manière étanche à l'air. L'encapsulant présente une température d'accrochage prédéfinie et une réponse au facteur d'absorption énergétique prédéterminée. Des fils apportant l'énergie produite passent latéralement du stratifié vers l'extérieur en passant par une ouverture d'accès dans une des couches. L'ouverture est étanchéifiée par un bouchon. Le stratifié et le bouchon sont chauffés par une source présentant une caractéristique de sortie d'énergie réglée sur une réponse de facteur d'absorption énergétique de l'encapsulant. Avant que l'encapsulant et le bouchon n'atteignent leurs températures d'accrochage ou de ramollissement respectives, l'air est retiré, de sorte que l'atmosphère comprime le stratifié. L'encapsulant est en contact adhésif avec la couche photovoltaïque et les couches transparentes et protectrices et le bouchon adhère aux fils. Le bouchon adhère également à l'encapsulant, ce qui permet de former une structure stratifiée étanchéifiée.
PCT/US2011/064943 2010-12-15 2011-12-14 Procédé destiné à étanchéifier des fils électriques passant à travers une ouverture d'accès au moyen d'un plot de remplissage et module produit de cette façon WO2012082917A1 (fr)

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
US42333210P 2010-12-15 2010-12-15
US61/423,332 2010-12-15
US201161548773P 2011-10-19 2011-10-19
US201161548764P 2011-10-19 2011-10-19
US201161548766P 2011-10-19 2011-10-19
US201161548769P 2011-10-19 2011-10-19
US61/548,764 2011-10-19
US61/548,769 2011-10-19
US61/548,773 2011-10-19
US61/548,766 2011-10-19
US201161568322P 2011-12-08 2011-12-08
US201161568317P 2011-12-08 2011-12-08
US201161568333P 2011-12-08 2011-12-08
US201161568339P 2011-12-08 2011-12-08
US201161568340P 2011-12-08 2011-12-08
US201161568327P 2011-12-08 2011-12-08
US61/568,340 2011-12-08
US61/568,322 2011-12-08
US61/568,333 2011-12-08
US61/568,339 2011-12-08
US61/568,317 2011-12-08
US61/568,327 2011-12-08

Publications (1)

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PCT/US2011/064943 WO2012082917A1 (fr) 2010-12-15 2011-12-14 Procédé destiné à étanchéifier des fils électriques passant à travers une ouverture d'accès au moyen d'un plot de remplissage et module produit de cette façon
PCT/US2011/064937 WO2012082913A1 (fr) 2010-12-15 2011-12-14 Procédé de fabrication d'un module photovoltaïque au moyen d'un montage présentant des éléments de production de pression ou un joint ou insert d'étanchéité transmettant une force extérieure
PCT/US2011/064978 WO2012082943A1 (fr) 2010-12-15 2011-12-14 Procédé de fabrication d'un module photovoltaïque au moyen d'un appareil et utilisation d'un chauffage localisé pour chauffer des zones de capacité de chauffage accrue et module produit par ledit procédé
PCT/US2011/064950 WO2012082923A1 (fr) 2010-12-15 2011-12-14 Procédé destiné à étanchéifier des fils électriques s'étendant à travers une tige affaissée et module produit selon ce procédé

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PCT/US2011/064937 WO2012082913A1 (fr) 2010-12-15 2011-12-14 Procédé de fabrication d'un module photovoltaïque au moyen d'un montage présentant des éléments de production de pression ou un joint ou insert d'étanchéité transmettant une force extérieure
PCT/US2011/064978 WO2012082943A1 (fr) 2010-12-15 2011-12-14 Procédé de fabrication d'un module photovoltaïque au moyen d'un appareil et utilisation d'un chauffage localisé pour chauffer des zones de capacité de chauffage accrue et module produit par ledit procédé
PCT/US2011/064950 WO2012082923A1 (fr) 2010-12-15 2011-12-14 Procédé destiné à étanchéifier des fils électriques s'étendant à travers une tige affaissée et module produit selon ce procédé

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DE102011108275A1 (de) * 2011-07-21 2013-01-24 Npc-Meier Gmbh Verfahren und Vorrichtung zum Pressen von plattenförmigen Elementen
EP2867925A1 (fr) * 2012-07-02 2015-05-06 Saint-Gobain Glass France Procédé d'étanchéisation d'un trou de contact d'un module photovoltaïque
JP6337903B2 (ja) 2013-10-24 2018-06-06 パナソニックＩｐマネジメント株式会社 太陽電池モジュールの製造方法及び太陽電池モジュールの製造装置
CN107078173B (zh) * 2014-10-27 2020-06-09 松下知识产权经营株式会社 太阳能电池组件的制造方法和太阳能电池组件的制造装置
JP6535089B2 (ja) * 2015-05-13 2019-06-26 パナソニックＩｐマネジメント株式会社 太陽電池モジュールの製造装置及び太陽電池モジュールの製造方法
CN117276383B (zh) * 2023-11-21 2024-02-27 天合光能股份有限公司 光伏组件及其密封方法

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