WO2012064051A3 - 레이저를 이용한 입체적인 도체 패턴의 제조 방법 및 이를 위한 장치 - Google Patents

레이저를 이용한 입체적인 도체 패턴의 제조 방법 및 이를 위한 장치 Download PDF

Info

Publication number
WO2012064051A3
WO2012064051A3 PCT/KR2011/008378 KR2011008378W WO2012064051A3 WO 2012064051 A3 WO2012064051 A3 WO 2012064051A3 KR 2011008378 W KR2011008378 W KR 2011008378W WO 2012064051 A3 WO2012064051 A3 WO 2012064051A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conductor pattern
laser
manufacturing
dimensional
Prior art date
Application number
PCT/KR2011/008378
Other languages
English (en)
French (fr)
Other versions
WO2012064051A2 (ko
Inventor
윤정수
김미선
Original Assignee
황기선
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황기선 filed Critical 황기선
Priority to CN201180064479XA priority Critical patent/CN103329346A/zh
Publication of WO2012064051A2 publication Critical patent/WO2012064051A2/ko
Publication of WO2012064051A3 publication Critical patent/WO2012064051A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

본 발명은 휴대용 통신기기의 내장형 안테나와 같은 입체적인 도체 패턴의 제조 방법 및 장치에 관한 것으로서, 본 발명의 입체적인 도체 패턴 제조 장치는, 입체 형상의 기재 표면에 원하는 궤적을 따라 레이저를 조사하여 상기 기재 표면을 선택적으로 가공할 수 있는 레이저 조사장치; 및 상기 레이저 조사장치에 의한 레이저 조사 중에 상기 기재를 고정 지지하는 지그로서, 상면에는 상기 기재의 앞면이 위를 향하도록 상기 기재를 고정하는 제1고정부와, 상기 기재의 뒷면이 위를 향하도록 상기 기재를 고정하는 제2고정부가 형성되어 있는 지그;를 구비한다. 본 발명에 따르면, 레이저 가공과 전해 도금 및 특정한 구조의 지그를 이용함으로써, 높은 생산성으로, 입체 형상의 기재 표면에 직접 입체 형상의 도체 패턴을 형성할 수 있다.
PCT/KR2011/008378 2010-11-09 2011-11-04 레이저를 이용한 입체적인 도체 패턴의 제조 방법 및 이를 위한 장치 WO2012064051A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201180064479XA CN103329346A (zh) 2010-11-09 2011-11-04 用于使用激光制造三维导线图案的方法以及设备

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100111075A KR101012138B1 (ko) 2010-11-09 2010-11-09 레이저를 이용한 입체적인 도체 패턴의 제조 방법 및 이를 위한 장치
KR10-2010-0111075 2010-11-09

Publications (2)

Publication Number Publication Date
WO2012064051A2 WO2012064051A2 (ko) 2012-05-18
WO2012064051A3 true WO2012064051A3 (ko) 2012-07-12

Family

ID=43777038

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/008378 WO2012064051A2 (ko) 2010-11-09 2011-11-04 레이저를 이용한 입체적인 도체 패턴의 제조 방법 및 이를 위한 장치

Country Status (3)

Country Link
KR (1) KR101012138B1 (ko)
CN (1) CN103329346A (ko)
WO (1) WO2012064051A2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140237102A1 (en) * 2013-02-15 2014-08-21 Nokia Corporation Method and Apparatus for Determining an Activity Description
KR101268113B1 (ko) 2013-03-05 2013-05-29 주식회사 유텍솔루션 내장형 안테나 제조방법
KR101328003B1 (ko) * 2013-03-14 2013-11-13 엘에스엠트론 주식회사 도금 안테나의 제조방법
KR101434423B1 (ko) * 2013-04-02 2014-08-26 전자부품연구원 도전성 패턴을 위한 소재 및 이를 이용한 도전성 패턴 형성방법
CN103260364B (zh) * 2013-04-24 2015-09-23 络派模切（北京）有限公司 一种电子设备外壳及其制造方法
CN104577301A (zh) * 2013-10-15 2015-04-29 位速科技股份有限公司 立体天线的制造方法
TWI678953B (zh) 2016-07-07 2019-12-01 美商莫仕有限公司 模塑互連元件及製造其的方法
CN106514002B (zh) * 2016-08-31 2018-06-19 广州创乐激光设备有限公司 一种应用于打标物边界的3d激光打标方法
CN106695121B (zh) * 2017-01-09 2019-12-10 上海交通大学 一种压缩空气辅助的激光熔融去除镀层的装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06164105A (ja) * 1992-11-19 1994-06-10 Polyplastics Co 成形品の表面に導電性回路を形成する方法及び導電回路形成部品
JP3159840B2 (ja) * 1993-08-26 2001-04-23 ポリプラスチックス株式会社 回路形成方法及び導電回路形成部品
JP2007180089A (ja) * 2005-12-27 2007-07-12 Auto Network Gijutsu Kenkyusho:Kk 回路導体パターンを有する樹脂成形部品の製造方法
KR20090049192A (ko) * 2007-11-13 2009-05-18 삼성중공업 주식회사 비접촉식 ｉｇｐｓ 싱글센서 고정 지그

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4276573B2 (ja) * 2004-04-09 2009-06-10 日立ビアメカニクス株式会社 レーザ加工方法、及びレーザ加工機
JP4765378B2 (ja) * 2005-04-08 2011-09-07 パナソニック株式会社 レーザ加工装置
KR20070074290A (ko) * 2006-01-09 2007-07-12 주식회사 이엠따블유안테나 Ｌｄｓ를 이용한 안테나의 제조 방법 및 그에 의해 제조된안테나
CN101752643A (zh) * 2008-12-04 2010-06-23 上海安费诺永亿通讯电子有限公司 一种天线制造的三维光刻方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06164105A (ja) * 1992-11-19 1994-06-10 Polyplastics Co 成形品の表面に導電性回路を形成する方法及び導電回路形成部品
JP3159840B2 (ja) * 1993-08-26 2001-04-23 ポリプラスチックス株式会社 回路形成方法及び導電回路形成部品
JP2007180089A (ja) * 2005-12-27 2007-07-12 Auto Network Gijutsu Kenkyusho:Kk 回路導体パターンを有する樹脂成形部品の製造方法
KR20090049192A (ko) * 2007-11-13 2009-05-18 삼성중공업 주식회사 비접촉식 ｉｇｐｓ 싱글센서 고정 지그

Also Published As

Publication number Publication date
KR101012138B1 (ko) 2011-02-07
WO2012064051A2 (ko) 2012-05-18
CN103329346A (zh) 2013-09-25

Similar Documents

Publication Publication Date Title
WO2012064051A3 (ko) 레이저를 이용한 입체적인 도체 패턴의 제조 방법 및 이를 위한 장치
WO2012125317A3 (en) Methods and apparatus for conformal doping
GB2520905A (en) Advanced handler wafer debonding method
EA201492078A1 (ru) Способ изготовления стеклянного листа с избирательным травлением
SG10201805058VA (en) Optoelectronic ball grid array package with fiber
WO2015073391A3 (en) Laser processing of a bed of powdered material with variable masking
MX2007001159A (es) Metodo para formar una grieta media en un sustrato y aparato para formar una grieta media en un sustrato.
GB201204922D0 (en) Substrate for additive manufacturing
GB2507188A (en) Method for forming bonded structures and bonded structures formed thereby
WO2012027422A3 (en) Methods and apparatus for interacting with an electronic device application by moving an object in the air over an electronic device display
WO2011100647A3 (en) Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing
MX338214B (es) Calentador de alta definicion y metodo de operacion.
WO2010077018A3 (en) Laser firing apparatus for high efficiency solar cell and fabrication method thereof
GB2505600A (en) Micro-electro-mechanical system (MEMS) and related actuator bumps method of manufacture and design structures
WO2009001497A1 (ja) レーザ加工装置
WO2012169866A3 (en) Printed circuit board and method for manufacturing the same
EP2560191A4 (en) SEMICONDUCTOR SUBSTRATE WITH POINT MARKINGS AND METHOD FOR THE PRODUCTION THEREOF
WO2013025528A3 (en) Method and apparatus for calibrating deep-reading multi-component induction tools with minimal ground effects
SG11202102573QA (en) Process for producing an advanced substrate for hybrid integration
EP3776670A4 (en) LASER-ASSISTED METALLIZATION PROCESS FOR SOLAR CELL STRING
WO2010095826A3 (ko) 레이저 빔 조사 궤적 생성방법
WO2010117201A3 (ko) 금속 촉매를 이용한 폴리 실리콘 마스크의 제조방법 및 이를 이용한 반도체 소자의 제조방법
WO2013182280A3 (de) Verfahren zur oberflächenbehandlung von gegenständen
SG10201900483XA (en) Apparatus and method for reducing substrate sliding in process chambers
MY178681A (en) Solar cell manufacturing method and solar cell

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11839735

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11839735

Country of ref document: EP

Kind code of ref document: A2