WO2012062641A3 - Halbleiteranordnung und mit dieser aufgebaute funktionseinheit sowie verfahren zur herstellung einer halbleiteranordnung - Google Patents

Halbleiteranordnung und mit dieser aufgebaute funktionseinheit sowie verfahren zur herstellung einer halbleiteranordnung Download PDF

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Publication number
WO2012062641A3
WO2012062641A3 PCT/EP2011/069272 EP2011069272W WO2012062641A3 WO 2012062641 A3 WO2012062641 A3 WO 2012062641A3 EP 2011069272 W EP2011069272 W EP 2011069272W WO 2012062641 A3 WO2012062641 A3 WO 2012062641A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor assembly
heat sink
assembly
producing
semiconductor
Prior art date
Application number
PCT/EP2011/069272
Other languages
English (en)
French (fr)
Other versions
WO2012062641A2 (de
Inventor
Matthias Bruemmer
Original Assignee
Osram Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Ag filed Critical Osram Ag
Publication of WO2012062641A2 publication Critical patent/WO2012062641A2/de
Publication of WO2012062641A3 publication Critical patent/WO2012062641A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Die Erfindung betrifft eine Halbleiteranordnung mit einem Kühlkörper und mindestens einem an einer Oberfläche des Kühlkörpers angebrachten Halbleiterbauelement, optional in Form mindestens einer Leuchtdiodenanordnung. Der Kühlkörper ist für den Einsatz der Halbleiteranordnung im Außenbereich an seiner der Atmosphäre zuwendbaren Oberfläche mit einer Beschichtung versehen, die im Wellenlängenbereich der elektromagnetischen Strahlung von 8μm bis 13μm oder 8μm bis 10μm einen Emissionsgrad von mindestens 0,8 und im Bereich unterhalb von 8μm einen Absorptionsgrad sehr viel kleiner als 0,8 aufweist. Hierdurch lässt sich eine effektive Strahlungskühlung über das atmosphärische Transmissionsfenster erreichen.
PCT/EP2011/069272 2010-11-11 2011-11-03 Halbleiteranordnung und mit dieser aufgebaute funktionseinheit sowie verfahren zur herstellung einer halbleiteranordnung WO2012062641A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010043747.6 2010-11-11
DE102010043747A DE102010043747A1 (de) 2010-11-11 2010-11-11 Halbleiteranordnung und mit dieser aufgebaute Funktionseinheit sowie Verfahren zur Herstellung einer Halbleiteranordnung

Publications (2)

Publication Number Publication Date
WO2012062641A2 WO2012062641A2 (de) 2012-05-18
WO2012062641A3 true WO2012062641A3 (de) 2012-10-04

Family

ID=45094579

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/069272 WO2012062641A2 (de) 2010-11-11 2011-11-03 Halbleiteranordnung und mit dieser aufgebaute funktionseinheit sowie verfahren zur herstellung einer halbleiteranordnung

Country Status (2)

Country Link
DE (1) DE102010043747A1 (de)
WO (1) WO2012062641A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7004597B2 (ja) * 2018-03-23 2022-01-21 大阪瓦斯株式会社 放射冷却装置
CN111447802A (zh) * 2020-05-11 2020-07-24 珠海格力电器股份有限公司 散热效率高的电器盒及空调

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100224890A1 (en) * 2006-09-18 2010-09-09 Cree, Inc. Light emitting diode chip with electrical insulation element
US20100224858A1 (en) * 2009-03-06 2010-09-09 Advanced Optoelectronic Technology Inc. Lateral thermal dissipation led and fabrication method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003309383A (ja) * 2002-04-16 2003-10-31 Ceramission Kk 放熱体
TW560703U (en) * 2002-10-25 2003-11-01 Ritdisplay Corp Organic light-emitting diode
US7109520B2 (en) * 2003-10-10 2006-09-19 E. I. Du Pont De Nemours And Company Heat sinks
US20050151555A1 (en) * 2004-01-13 2005-07-14 Cookson Electronics, Inc. Cooling devices and methods of using them
JP2008527685A (ja) * 2004-12-30 2008-07-24 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 半導体素子、とりわけオプトエレクトロニクス半導体素子を冷却するための冷却装置
JP2009245770A (ja) * 2008-03-31 2009-10-22 Sumitomo Chemical Co Ltd 有機エレクトロルミネッセンス素子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100224890A1 (en) * 2006-09-18 2010-09-09 Cree, Inc. Light emitting diode chip with electrical insulation element
US20100224858A1 (en) * 2009-03-06 2010-09-09 Advanced Optoelectronic Technology Inc. Lateral thermal dissipation led and fabrication method thereof

Also Published As

Publication number Publication date
DE102010043747A1 (de) 2012-05-16
WO2012062641A2 (de) 2012-05-18

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