WO2012060042A1 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- WO2012060042A1 WO2012060042A1 PCT/JP2011/005066 JP2011005066W WO2012060042A1 WO 2012060042 A1 WO2012060042 A1 WO 2012060042A1 JP 2011005066 W JP2011005066 W JP 2011005066W WO 2012060042 A1 WO2012060042 A1 WO 2012060042A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- support member
- piezoelectric element
- substrate
- oscillation device
- electronic device
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 230000010355 oscillation Effects 0.000 claims description 61
- 238000005259 measurement Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005520 electrodynamics Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/02—Microphones
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
- G01S15/06—Systems determining the position data of a target
- G01S15/08—Systems for measuring distance only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/521—Constructional features
Definitions
- the present invention relates to an electronic device including an oscillation device.
- Piezoelectric electroacoustic transducers have been actively developed as thin electroacoustic transducers to replace conventional electrodynamic electroacoustic transducers. Piezoelectric electroacoustic transducers reproduce sound waves using the expansion and contraction of piezoelectric elements.
- Patent Documents 1 and 2 There are various proposals for the mobile phone as described above (Patent Documents 1 and 2).
- the air filling the rear air chamber between the oscillation device and the substrate functions as a damper for the oscillation device.
- the vibration amount of the oscillation device is attenuated.
- the audio output efficiency of the oscillation device is reduced.
- the present invention has been made in view of the above-described problems, and provides an electronic apparatus including an oscillation device that can output sound with high efficiency.
- a substrate An oscillation device supported on the substrate; With The oscillator is A piezoelectric element; A vibrating member that restrains one surface of the piezoelectric element; A cylindrical support member that supports the outer edge portion of the vibration member on the inner surface and is joined onto the substrate so that the opening on one end side is closed by the substrate; Have The support member is provided with an electronic device having at least one hole for connecting a space surrounded by the substrate and the vibration member in the support member to the outside of the support member.
- FIG. 1 It is a typical exploded perspective view showing the assembly structure of the oscillation device concerning this embodiment. It is a typical vertical front view which shows the internal structure of the electronic device which concerns on this embodiment. It is a typical longitudinal section front view showing a modification of the oscillation device shown in FIG. It is a bottom view which shows the structure of the oscillation apparatus shown in FIG. It is a figure which shows operation
- FIG. 1 is a schematic exploded perspective view showing an assembly structure of the oscillation device 100 according to the present embodiment.
- a part of the support member 140 is indicated by a broken line.
- FIG. 2 is a schematic longitudinal front view showing the internal structure of the electronic apparatus 200 according to the present embodiment.
- FIG. 4 is a bottom view showing the structure of the oscillation device 100 shown in FIG.
- the electronic device 200 according to the present embodiment includes a substrate 220 and the oscillation device 100 supported on the substrate 220.
- the electronic device 200 is, for example, a mobile phone.
- the oscillation device 100 that is an electroacoustic transducer includes a piezoelectric element 110, a vibration member 120 that constrains one surface of the piezoelectric element 110, an outer surface of the vibration member 120 supported on the inner surface, and an opening on one end side of the substrate 220. And a cylindrical support member 140 joined to the substrate 220 so as to be closed by the substrate.
- the support member 140 has at least one hole 141 that connects the space 222 surrounded by the substrate 220 and the vibration member 120 in the support member 140 to the outside of the support member 140.
- the support member 140 has a cylindrical shape.
- the support member 140 is provided in a cylindrical shape.
- the shape of the support member 140 is not limited to this, and may be provided in a rectangular tube shape that is rectangular in a plan view, for example.
- the support member 140 supports the vibration member 120 by joining to the outer edge portion of the vibration member 120 on the inner side surface. Further, the opening on one end side of the support member 140 provided in a cylindrical shape is closed by the substrate 220. As a result, a space 222 surrounded by the support member 140, the substrate 220, and the vibration member 120 is formed inside the support member 140.
- the support member 140 has at least one hole 141 that connects the space 222 to the outside of the support member 140.
- the support member 140 has a plurality of holes 141.
- the air hole 141 is constituted by a concave portion provided on an end surface on one end side of the support member 140.
- the plurality of holes 141 are periodically formed at one end of the support member 140. That is, the plurality of holes 141 are arranged at regular intervals.
- the piezoelectric element 110 is provided so that the planar shape is a disc shape.
- the vibrating member 120 is formed so that the planar shape is a disk shape.
- the planar shape of the piezoelectric element 110 is not limited as described above, and may be a polygon such as a rectangle.
- the planar shape of the vibration member 120 is not limited as described above, and may be a polygon such as a rectangle.
- the support member 140 can be formed in a rectangular tube shape that is rectangular in a plan view, for example (not shown).
- the oscillation frequency of the piezoelectric element 110 is, for example, 20 kHz or more.
- the piezoelectric element 110 outputs an ultrasonic wave modulated for a parametric speaker, for example.
- the piezoelectric element 110 may be configured to output a sound wave having an audible frequency, for example.
- FIG. 3 is a longitudinal front view showing a modification of the oscillation device 100 shown in FIG.
- the oscillation device 100 may include an elastic member 130.
- the elastic member 130 is provided in an annular shape having an opening in a region including the center, for example.
- the elastic member 130 may be provided so that the planar shape is a polygon, for example.
- the elastic member 130 supports the outer peripheral portion of the vibration member 120 on the upper surface of the inner peripheral portion.
- the vibration member 120 is supported on the elastic member 130 so as to close an opening provided in the elastic member 130.
- the support member 140 supports the outer edge portion of the elastic member 130 on the inner surface.
- the elastic member 130 is made of, for example, a resin material such as urethane, PET, or polyethylene.
- the electronic device 200 includes, for example, a box-shaped housing 210 as shown in FIG.
- a substrate 220 such as a printed wiring board is disposed inside the housing 210.
- One end of a support member 140 constituting the oscillation device 100 is bonded to one surface of the substrate 220.
- a plurality of sound holes 211 are formed on one surface of the housing 210.
- the plurality of sound holes 211 are arranged at positions facing the vibration surface of the oscillation device 100.
- a driver circuit 150 that is an oscillation drive unit that causes the oscillation device 100 to output a sound wave is mounted on the substrate 220 described above.
- the driver circuit 150 is connected to the piezoelectric element 110 of the oscillation device 100 via a printed wiring or a lead wire (not shown).
- the piezoelectric element 110 to which the electric field is applied from the driver circuit 150 expands and contracts, so that the piezoelectric element 110 and the vibration member 120 vibrate in the vertical direction in FIG. Thereby, a sound wave is output from the oscillation device 100.
- the audio output efficiency of the oscillation device is reduced. Further, the resonance frequency of the oscillation device 102 is shifted to a high band. As a result, the sound quality of the oscillation device may be degraded. Furthermore, when the oscillation device 100 is mounted on a small electronic device such as a mobile phone, the volume capacity of the space 222 is reduced. For this reason, the effect as a damper which the air inside the space 222 has increases.
- the support member 140 has a hole 141 formed therein.
- the piezoelectric element 110 and the vibration member 120 vibrate in the vertical direction, air is taken in and out of the space 222 (arrows in FIG. 5A).
- the damping by the air inside the space 222 acts on the vibration of the piezoelectric element 110 and the vibration member 120 as in the electronic device having the oscillation device 102 according to the comparative example.
- the hole 141 is configured by a recess provided on the end surface on one end side of the support member 140. For this reason, formation of the air holes 141 is easy. Further, a plurality of holes 141 are periodically formed in the support member 140. That is, the plurality of holes 141 are arranged at equal intervals. For this reason, the movement of the air between the space 222 and the outside of the support member 140 is performed equally. Therefore, uneven back pressure does not act on the piezoelectric element 110.
- the present invention is not limited to the present embodiment, and various modifications are allowed without departing from the scope of the present invention.
- the oscillation device 100 having a unimorph structure in which only the upper surface of the vibration member 120 is constrained by one piezoelectric element 110 is illustrated.
- an oscillation device having a bimorph structure in which the upper surface and the lower surface of the vibration member 120 are constrained by the two piezoelectric elements 110 can also be implemented (not shown).
- the piezoelectric element 110 is composed of one piezoelectric layer 112.
- the piezoelectric element may have a laminated structure in which piezoelectric layers and electrode layers are alternately laminated (not shown).
- hole 141 was comprised by the recessed part provided in the end surface of the one end side of the supporting member 140.
- the hole 141 may be configured by a through hole formed at a position spaced from the end of the support member 140 (not shown).
- hole was formed in the supporting member 140 periodically.
- holes may be formed in the support member aperiodically (not shown).
- the electronic device 200 in which the driver circuit 150 is connected to the oscillation device 100 includes such an oscillation device 100, an oscillation driving unit that causes the oscillation device 100 to output ultrasonic waves for sensor, an ultrasonic detection unit that detects ultrasonic waves for sensor reflected by the measurement object, And a distance measuring unit that calculates the distance between the oscillation device 100 and the measurement object based on the time from when the ultrasonic waves for the sensor are output by the oscillation device 100 until the ultrasonic waves are detected by the ultrasonic detection unit. (Not shown).
- the electronic device 200 can be implemented as a sonar.
Abstract
Description
圧電型電気音響変換器とは、圧電素子の伸縮運動を利用して音波を再生するものである。
前記基板上に支持される発振装置と、
を備え、
前記発振装置は、
圧電素子と、
前記圧電素子の一面を拘束する振動部材と、
内側面において前記振動部材の外縁部を支持し、かつ一端側の開口が前記基板により塞がれるよう前記基板上に接合される筒状の支持部材と、
を有し、
前記支持部材は、前記支持部材の内部のうち前記基板および前記振動部材により囲われた空間を前記支持部材の外部につなぐ少なくとも一つの空孔を有する電子機器が提供される。
本実施形態に係る電子機器200は、基板220と、基板220上に支持される発振装置100と、を備える。電子機器200は、例えば携帯電話機等である。
支持部材140は、内側面において振動部材120の外縁部と接合することにより、振動部材120を支持している。また、筒状に設けられた支持部材140の一端側の開口は、基板220によって塞がれている。これにより、支持部材140の内部において、支持部材140、基板220および振動部材120により囲われた空間222が形成されることとなる。
図1に示すように、空孔141は、支持部材140の一端側の端面に設けられた凹部により構成されている。また、図4に示すように、複数の空孔141は、支持部材140の一端において、周期的に形成されている。すなわち、複数の空孔141は、互いに等間隔に配置される。
ただし、圧電素子110の平面形状は、上述のように限定されるものではなく、例えば矩形等の多角形であってもよい。また、振動部材120の平面形状についても、上述のように限定されるものではなく、例えば矩形等の多角形であってもよい。圧電素子110の平面形状が矩形である場合、支持部材140は、例えば平面視で矩形となる角筒状に形成されることができる(図示せず)。
圧電層112は、上部電極114と下部電極116に挟まれている。また、圧電層112は、その厚さ方向に分極している。
弾性部材130は、内周部の上面において、振動部材120の外周部を支持する。振動部材120は、弾性部材130に設けられた開口を塞ぐように、弾性部材130上に支持される。そして、支持部材140は、内側面において弾性部材130の外縁部を支持する。
弾性部材130は、例えばウレタン、PETまたはポリエチレン等の樹脂材料等により構成される。
比較例に係る発振装置102では、図5(b)に示すように、空孔141が設けられていない。このため、発振装置100が振動する際、空間222内部の空気は、発振装置102に対してダンパーとして機能することになる。これにより、発振装置102の振動量は減衰してしまう。従って、発振装置の音声出力の効率は低下してしまうこととなる。
また、発振装置102の共振周波数が高帯域にシフトしてしまう。これにより、発振装置の音質が低下してしまうおそれがある。
さらに、発振装置100が携帯電話機等の小型電子機器に搭載される場合、空間222の体積容量は小さくなる。このため、空間222内部の空気が有するダンパーとしての効果は増大してしまう。
さらに、支持部材140に複数の空孔141が周期的に形成されている。すなわち、複数の空孔141は、互いに等間隔に配置されている。このため、空間222と支持部材140の外部との間の空気の移動が均等に実行される。従って、圧電素子110に不均等な背圧が作用することがない。
また、上記形態では支持部材140に複数の空孔が周期的に形成されていることを例示した。しかし、支持部材に空孔が非周期的に形成されていてもよい(図示せず)。
Claims (9)
- 基板と、
前記基板上に支持される発振装置と、
を備え、
前記発振装置は、
圧電素子と、
前記圧電素子の一面を拘束する振動部材と、
内側面において前記振動部材の外縁部を支持し、かつ一端側の開口が前記基板に塞がれるよう前記基板上に接合される筒状の支持部材と、
を有し、
前記支持部材は、前記支持部材の内部のうち前記基板および前記振動部材により囲われた空間を前記支持部材の外部につなぐ少なくとも一つの空孔を有する電子機器。 - 前記空孔は、前記支持部材の前記一端側の端面に設けられた凹部により構成されている請求項1に記載の電子機器。
- 前記支持部材は、互いに等間隔に配置された複数の前記空孔を有する請求項1または2に記載の電子機器。
- 前記圧電素子の平面形状が円形であり、前記支持部材が円筒状に形成されている請求項1ないし3の何れか一項に記載の電子機器。
- 前記圧電素子の平面形状が矩形であり、前記支持部材が矩形の角筒状に形成されている請求項1ないし3の何れか一項に記載の電子機器。
- 前記圧電素子の発振周波数が20kHz以上である請求項1ないし5の何れか一項に記載の電子機器。
- 前記圧電素子は、圧電層と電極層とが交互に積層された積層構造からなる請求項1ないし6の何れか一項に記載の電子機器。
- 前記圧電素子は、パラメトリックスピーカ用に変調された超音波を出力する請求項1ないし7の何れか一項に記載の電子機器。
- 前記発振装置にセンサ用超音波を出力させる発振駆動部と、
測定対象物で反射した前記センサ用超音波を検知する超音波検知部と、
前記センサ用超音波が前記発振装置により出力されてから前記超音波検知部により検知されるまでの時間に基づいて、前記発振装置と前記測定対象物までの距離を算出する測距部と、
を有する請求項1ないし8の何れか一項に記載の電子機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/824,175 US20130201796A1 (en) | 2010-11-01 | 2011-09-09 | Electronic apparatus |
CN2011800509302A CN103181196A (zh) | 2010-11-01 | 2011-09-09 | 电子设备 |
JP2012541712A JPWO2012060042A1 (ja) | 2010-11-01 | 2011-09-09 | 電子機器 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-245676 | 2010-11-01 | ||
JP2010245676 | 2010-11-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012060042A1 true WO2012060042A1 (ja) | 2012-05-10 |
Family
ID=46024170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/005066 WO2012060042A1 (ja) | 2010-11-01 | 2011-09-09 | 電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130201796A1 (ja) |
JP (1) | JPWO2012060042A1 (ja) |
CN (1) | CN103181196A (ja) |
WO (1) | WO2012060042A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183098A1 (ja) * | 2012-06-06 | 2013-12-12 | Necカシオモバイルコミュニケーションズ株式会社 | スピーカ装置及び電子機器 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2568720A4 (en) * | 2010-07-23 | 2013-11-06 | Nec Corp | VIBRATING DEVICE AND ELECTRONIC DEVICE |
EP2863651A1 (en) * | 2013-10-18 | 2015-04-22 | Nxp B.V. | Acoustic coupling sensor for mobile device |
CN111479177B (zh) * | 2020-04-20 | 2022-02-01 | 京东方科技集团股份有限公司 | 用于显示装置的扬声器组件及其制备方法、显示装置 |
KR20230004190A (ko) * | 2021-06-30 | 2023-01-06 | 엘지디스플레이 주식회사 | 진동 장치와 이를 포함하는 장치 및 운송 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0165598U (ja) * | 1987-10-21 | 1989-04-26 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5183040A (en) * | 1991-03-08 | 1993-02-02 | Telectronics Pacing Systems, Inc. | Apparatus and method for detecting abnormal cardiac rhythms using an ultrasound sensor in an arrhythmia control system |
US5691478A (en) * | 1995-06-07 | 1997-11-25 | Schneider/Namic | Device and method for remote zeroing of a biological fluid pressure measurement device |
US7226417B1 (en) * | 1995-12-26 | 2007-06-05 | Volcano Corporation | High resolution intravascular ultrasound transducer assembly having a flexible substrate |
GB2315020A (en) * | 1996-07-11 | 1998-01-21 | Intravascular Res Ltd | Ultrasonic visualisation catheters |
US6835178B1 (en) * | 1999-06-23 | 2004-12-28 | Hologic, Inc. | Ultrasonic bone testing with copolymer transducers |
US7422563B2 (en) * | 1999-08-05 | 2008-09-09 | Broncus Technologies, Inc. | Multifunctional tip catheter for applying energy to tissue and detecting the presence of blood flow |
US7092539B2 (en) * | 2000-11-28 | 2006-08-15 | University Of Florida Research Foundation, Inc. | MEMS based acoustic array |
JP2003143677A (ja) * | 2001-11-05 | 2003-05-16 | Mitsubishi Electric Corp | 携帯端末用受信機器 |
JP3908624B2 (ja) * | 2002-07-25 | 2007-04-25 | シチズン電子株式会社 | 電気音響変換器 |
US6712767B2 (en) * | 2002-08-29 | 2004-03-30 | Volcano Therapeutics, Inc. | Ultrasonic imaging devices and methods of fabrication |
US7238085B2 (en) * | 2003-06-06 | 2007-07-03 | P.C.T. Systems, Inc. | Method and apparatus to process substrates with megasonic energy |
US7292704B2 (en) * | 2003-10-27 | 2007-11-06 | Wayne Lederer | Noise attenuating headset |
JP3844012B2 (ja) * | 2003-12-25 | 2006-11-08 | 株式会社村田製作所 | 圧電型電気音響変換器 |
CN101068107A (zh) * | 2006-05-01 | 2007-11-07 | 爱普生拓优科梦株式会社 | 压电振子及其制造方法 |
JP2009539498A (ja) * | 2006-06-05 | 2009-11-19 | ブロンカス テクノロジーズ, インコーポレイテッド | 通路を形成し、血管を検出するための装置 |
US8148876B2 (en) * | 2007-01-12 | 2012-04-03 | Nec Corporation | Piezoelectric actuator and electronic apparatus |
WO2009063905A1 (ja) * | 2007-11-12 | 2009-05-22 | Nec Corporation | 圧電音響素子及び電子機器 |
EP2897381A1 (en) * | 2011-03-31 | 2015-07-22 | NEC CASIO Mobile Communications, Ltd. | Oscillator and electronic device |
-
2011
- 2011-09-09 WO PCT/JP2011/005066 patent/WO2012060042A1/ja active Application Filing
- 2011-09-09 US US13/824,175 patent/US20130201796A1/en not_active Abandoned
- 2011-09-09 JP JP2012541712A patent/JPWO2012060042A1/ja active Pending
- 2011-09-09 CN CN2011800509302A patent/CN103181196A/zh active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0165598U (ja) * | 1987-10-21 | 1989-04-26 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183098A1 (ja) * | 2012-06-06 | 2013-12-12 | Necカシオモバイルコミュニケーションズ株式会社 | スピーカ装置及び電子機器 |
CN104335598A (zh) * | 2012-06-06 | 2015-02-04 | Nec卡西欧移动通信株式会社 | 扬声器设备和电子设备 |
JPWO2013183098A1 (ja) * | 2012-06-06 | 2016-01-21 | 日本電気株式会社 | スピーカ装置及び電子機器 |
EP2860988A4 (en) * | 2012-06-06 | 2016-01-27 | Nec Corp | SPEAKER APPARATUS AND ELECTRONIC APPARATUS |
Also Published As
Publication number | Publication date |
---|---|
CN103181196A (zh) | 2013-06-26 |
JPWO2012060042A1 (ja) | 2014-05-12 |
US20130201796A1 (en) | 2013-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5759641B1 (ja) | 電気音響変換装置及び電子機器 | |
JP3907616B2 (ja) | 電子機器 | |
JP4890515B2 (ja) | スピーカ | |
JP5954181B2 (ja) | 発振装置および電子機器 | |
WO2012060042A1 (ja) | 電子機器 | |
JP5939160B2 (ja) | 発振装置および電子機器 | |
JP2006165702A (ja) | 圧電発音体及び電子機器 | |
WO2012060046A1 (ja) | 電子機器 | |
JP6107138B2 (ja) | 発振装置および電子機器 | |
KR20140098670A (ko) | 음향 발생기, 음향 발생 장치 및 전자 기기 | |
JP2012142648A (ja) | 電子機器 | |
US20150139457A1 (en) | Speaker device and electronic device | |
JP5812009B2 (ja) | 発振装置および電子機器 | |
JP6020465B2 (ja) | 発振装置 | |
JP5671945B2 (ja) | 発振装置および電子機器 | |
JP2012134597A (ja) | 発振装置および電子機器 | |
JP2012217024A (ja) | 発振装置及び電子機器 | |
JP2012134592A (ja) | 発振装置および電子機器 | |
JP2012100053A (ja) | 発振装置および電子機器 | |
JP2012134594A (ja) | 発振装置および電子機器 | |
JP2012217032A (ja) | 電子機器 | |
JP2012134593A (ja) | 発振装置および電子機器 | |
JP2012134596A (ja) | 発振装置および電子機器 | |
JP2012217011A (ja) | 発振装置及び電子機器 | |
JP2014003418A (ja) | 携帯端末用スピーカ装置及び電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11837697 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2012541712 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13824175 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11837697 Country of ref document: EP Kind code of ref document: A1 |