WO2012057468A2

WO2012057468A2 - Film for testing lcd panel, test device for testing lcd panel and method for manufacturing test device for testing lcd panel

Info

Publication number: WO2012057468A2
Application number: PCT/KR2011/007803
Authority: WO
Inventors: Yi Bin Ihm; Nam Jung Her; Jun Soo Cho
Original assignee: Pro-2000 Co. Ltd.
Priority date: 2010-10-25
Filing date: 2011-10-19
Publication date: 2012-05-03
Also published as: WO2012057468A3; KR101256642B1; CN103189790A; CN103189790B; KR20120048048A; TW201227054A

Abstract

A film for testing a liquid crystal display (LCD) panel, a test device for testing a LCD panel, and a method of manufacturing the test device are provided. The test device includes a film configured to have first lines and second lines formed thereon wherein the first lines receive test signals and the second lines are disposed apart from the first lines, branch the test signals received from the first lines into n (n is a natural number) signals and transmit the branched test signals to corresponding input lines of the LCD panel; a line connection unit configured to be formed on a substrate and include metal lines to transmit signals received via the first lines to the respective corresponding second lines; and bumps configured to electrically connect the first lines and the second lines to the corresponding metal lines.

Description

FILM FOR TESTING LCD PANEL, TEST DEVICE FOR TESTING LCD PANEL AND METHOD FOR MANUFACTURING TEST DEVICE FOR TESTING LCD PANEL

The present invention relates to a film for testing a liquid crystal display (LCD) panel, a test device for testing an LCD panel, and a method of manufacturing the test device, and more particularly, to a film for testing an LCD panel, a test device for testing an LCD panel, and a method of manufacturing the test device, which can reduce manufacturing process and manufacturing costs for the test device.

With the increase in use of display devices in various fields, studies on liquid crystal display panels to be equipped on the display devices and methods for testing the LCD panels have been actively carried out. A normal LCD panel that has been tested for defects has a module mounted thereon and can be used for a display device, such as a television, a monitor, or the like.

FIG. 1 is a diagram illustrating an example of a prior art test device for testing an LCD panel. FIG. 2 is a diagram illustrating a plan view of the test device illustrated in FIG. 1.

Referring to FIGS. 1 and 2, prior art test device TD includes a driving unit DRV and a probe unit PRB, wherein the driving unit DRV includes a driving IC DIC to receive a test signal applied from a flexible printed circuit FPC and convert the received test signal into an analog voltage to be used in driving an LCD panel PAN and the probe unit PRB transmits the test signal converted into the analog voltage to input lines PILIN of the LCD panel PAN in contact with the probe units PRB. The driving unit DRV may be a TAB IC, and the probe units PRB may be needle-type or blade-type probes. The TAB IC indicates a driving IC DIC that is packaged in the form of film. The test signal that is an electrical signal is received from the flexible printed circuit FPC via the first lines LIN1 disposed on the film FIL and transmitted to the driving unit DRV, and the driving unit DRV transmits the test signal converted into the analog voltage to the probe units PRB via the second lines LIN2 disposed on the film FIL.

FIG. 3 is a diagram illustrating another prior art test device for testing an LCD panel, and FIG. 4 is a diagram illustrating a plan view of the test device illustrated in FIG. 1.

Referring to FIGS. 3 and 4, a driving unit DVR of the prior art test device TD does not include an individual driving IC, receives picture signals (analog voltages) for driving an LCD panel PAN directly from a flexible printed circuit FPC as test signals, replicates the received picture signals into signals as many as required to test the LCD panel PAN, and transmits the replicated signals to the LCD panel PAN.

FIGS. 3 and 4 especially show examples of the driving unit DRV receiving six picture signals from the flexible printed circuit FPC. The six picture signals may be color signals including R, G, B, R`, G`, and B` required for driving the LCD panel PAN. The driving unit DRV shown in FIGS. 3 and 4 has a line structure that can recursively output six test signals TET received from the flexible printed circuit FPC.

Unlike the test device illustrated in FIGS. 1 and 2, the test device TD shown in FIGS. 3 and 4 is difficult to test the defect on the LCD panel PAN with respect to a specific pattern, but may be suitable to test a defective cell by applying the same color over the entire LCD panel PAN.

FIG. 5 is a diagram showing a line structure formed on a film for use in the test device illustrated in FIGS. 3 and 4.

Referring to FIG. 5, first lines LIN1 are formed on a first surface of the film as an insulator, and second lines LIN2 are formed on a second surface of the film. The first lines LIN1 may receive the test signal from the flexible printed circuit (FPC), and the second lines LIN2 may transmit the test signal received via the first lines LIN1 to corresponding input lines of the LCD panel PAN. In this case, the first lines LIN1 and the second lines LIN2 may be electrically connected to each other through via holes VIA. However, as shown in FIG. 5, as the distance between the lines gets smaller and the number of lines increases in the film FIL having the lines formed on its both sides, the complexity of manufacturing process and manufacturing costs increase.

The present invention is to provide a film for testing a liquid crystal display (LCD) panel, a test device for testing an LCD panel, and a method of manufacturing the test device, which can simplify the costly process of manufacturing a reversible film, thereby reducing manufacturing costs.

The present invention provides a test device for testing a liquid crystal display (LCD) panel, the test device including: a film configured to have first lines and second lines formed thereon wherein the first lines receive test signals and the second lines are disposed apart from the first lines, branch the test signals received from the first lines into n (n is a natural number) signals and transmit the branched test signals to corresponding input lines of the LCD panel; a line connection unit configured to be formed on a substrate and include metal lines to transmit signals received via the first lines to the respective corresponding second lines; and bumps configured to electrically connect the first lines and the second lines to the corresponding metal lines.

Each of the first lines and the second lines may be formed on a first surface of the film. The same number of first lines may be formed as the number of test signals and the number of the second lines may be n times as many as the number of the first lines. The same number of metal lines may be formed as the number of the first lines.

Each of the metal lines may be disposed to form a closed rectangle having four sides connected to one another, the respective first lines may be connected to one side of the respective corresponding metal lines and the respective second lines may be connected to the other side of the respective corresponding metal lines. The other side may be opposite to the one side of the metal line.

A first metal line corresponding to a first test signal of the test signals may be positioned the outermost, the remaining metal lines other the first metal line may be positioned inside the first metal line and as a distance from the first metal line to each of the remaining metal line increases, the sum of lengths of four sides of each of the remaining metal lines may decrease.

A first metal line corresponding to a first test signal of the test signals may be positioned the innermost, the remaining metal lines other than the first metal line may be positioned outside of the first metal line, and as a distance from the first metal line to each of the remaining metal line increases, the sum of lengths of four sides of each of the remaining metal lines may increase. Each of the first lines may be connected to the other side.

Each of the metal lines may be disposed to form a rectangular-like shape having one side cut off, the first lines may be connected to one side of the respective corresponding metal lines and the second lines may be connected to the other side of the respective corresponding metal lines.

Each of the metal lines may be disposed to form a rectangular-like shape having the other side cut off. Each of the first lines may be branched into x (x is a natural number) with respect to a corresponding test signal.

The line connection unit may be further configured to include x sub line connection units.

The test signals which are output from the second lines, respectively, connected to the x sub line connection units may be applied to a plurality of LCD panels.

The test signals which are output from the second lines, respectively, connected to the x sub line connection units may be applied to one LCD panel. The test signals received by the first lines may be six color signals including R, G. B, R`, G`, and B` for driving the LCD panel. The test device may further include probes configured to electrically connect the branched test signals transmitted from the second lines to the corresponding input lines of the LCD panel. The second lines may be directly connected to the respective corresponding input liens of the LCD panel.

The present invention also provides a method of manufacturing a test device for testing a liquid crystal display (LCD) panel, the method including: forming first lines, second lines, and metal lines on a substrate wherein the first metal lines receives test signals, the second lines are disposed apart from the first lines, branch the test signals received from the first lines into n (n is a natural number) signals and transmit the branched test signals to corresponding input lines of the LCD panel, and the metal lines are electrically connected to each of the first and second lines via bumps; forming an insulating layer by applying an insulating material over the substrate and the metal lines; etching pad regions on the insulating layer whereby the bumps are to be bonded to the metal lines; forming the bumps in the pad regions; and bonding the bumps to the respective first lines and second lines on the film.

Additional features of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention.

According to the film and the test device for testing a liquid crystal display (LCD) panel and the method of manufacturing the test device in accordance with the exemplary embodiments of the present invention, a wiring method of the film can be improved, thereby simplifying the process of manufacturing the film and reducing manufacturing costs.

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention.

FIG. 1 is a diagram illustrating an example of a prior art test device for testing a liquid crystal display (LCD) panel.

FIG. 2 is a diagram illustrating a plan view of the test device illustrated in FIG. 1.

FIG. 3 is a diagram illustrating another prior art test device for testing an LCD panel.

FIG. 4 is a diagram illustrating a plan view of the test device illustrated in FIG. 1.

FIG. 6 is a diagram illustrating a test device for testing an LCD panel according to a first exemplary embodiment of the present invention.

FIG. 7 is a diagram illustrating in detail the connection between lines and metal lines shown in FIG. 6.

FIG. 8 is a diagram illustrating a test device TD for testing an LCD panel according to a second exemplary embodiment of the present invention.

FIG. 9 is a diagram illustrating a test device TD for testing an LCD panel according to a third exemplary embodiment of the present invention.

FIG. 10 is a diagram illustrating a test device TD for testing an LCD panel according to a fourth exemplary embodiment of the present invention.

FIG. 11 is a diagram illustrating a test device for testing an LCD panel according to a fifth exemplary embodiment of the present invention.

FIG. 12 is a diagram illustrating a test device for testing an LCD panel according to a sixth exemplary embodiment of the present invention.

FIG. 13 is a diagram illustrating a partial cross-sectional view of a test device for testing an LCD panel according to the exemplary embodiments illustrated in FIGS. 6 to 12.

FIG. 14 shows diagrams illustrating a method of manufacturing a test device for testing an LCD panel according to an exemplary embodiment of the present invention.

FIG. 15 is a diagram illustrating an example of a structure of connection between a LCD panel and second lines of the test device in accordance with the exemplary embodiments in FIGS. 6 to 12.

FIG. 16 is a diagram illustrating another example of a structure of connection between a liquid crystal pane and the second lines of the liquid crystal pane test device.

The invention is described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure is thorough, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals in the drawings denote like elements.

FIG. 6 is a diagram illustrating a test device for testing a liquid crystal display (LCD) panel according to a first exemplary embodiment of the present invention.

Referring to FIG. 6, test device (TD) may include first lines LIN1s, second lines LIN2s, and a line connection unit CNLIN. The first lines LIN1s receive test signals XTET from a flexible printed circuit (FPC), and the second lines LIN2s transmit the test signals XTET to an input line of a corresponding panel. The test signals XTET may have an analog voltage value as in the related art.

Each of the first lines LIN1s and the second lines LIN2s may be disposed on a first surface of a film FIL. The first lines LIN1s and the second lines LIN2s are arranged apart from one another on the film FIL. That is, the first lines LIN1s and the second line LIN2s are placed on the film FIL while they are electrically disconnected from one another unless the line connection unit CNLIN electrically connects one to another.

The line connection unit CNLIN includes metal lines MLs that connect the first lines LIN1s to the corresponding second lines LIN2s, respectively. The second lines LIN2s are electrically connected to the corresponding first lines LIN1s, thereby being capable of copying (branching) the test signals XTET received via the first lines LIN1s and transmitting the copied (branched) test signals XTET to the liquid crystal display (LCD) panel (PAN). Thus, the same number of the metal lines MLs may be formed as the number of the first lines LIN1s and the number of the second lines LIN2s may be n times as many as the number of the first lines LIN1s wherein n is a natural number.

However, for convenience of illustration of FIG. 6, the number of the second lines LIN2s is twice as many as the number of the first lines LIN1s. In the example illustrated in FIG. 6, there are six first lines LIN1s and the flexible printed circuit FPC applies six color signals including R, G, B, R', G' and B' to the respective first lines LIN1s as test signals. Accordingly, there may be six metal lines MLs including first to six metal lines ML1, ML2, ML3, ML4, ML5, and ML6. However, the numbers of the lines are not limited to the above and the numbers of the first lines, the second lines and the metal lines may vary.

The metal lines MLs may be connected to the respective corresponding first and second lines via bumps BUM. For example, the first metal line ML1 is connected to an eleventh line LIN11 and twenty-first lines LIN21 via a bump BUM wherein the eleventh line LIN11 receives a first test signal XTET1 and the twenty-first lines LIN21 apply the first test signal XTET1 to the LCD panel PAN. The second metal line ML2 is connected to a twelfth line LIN12 and twenty-second lines LIN22 via a bump BUM wherein the twelfth line LIN12 receives a second test signal XTET2 and the twenty-second lines LIN22 apply the second test signal XTET2 to the LCD panel PAN. The third metal line ML3 is connected to a thirteenth line LIN13 and twenty-third lines LIN23 via a bump BUM wherein the thirteenth line LIN13 receives a third test signal XTET3 and the twenty-third lines LIN23 applies the third test signal XTET3 to the LCD panel PAN. In the same manner, the fourth metal line ML4 is connected to a fourteenth line LIN14 and twenty-fourth line LIN24 via a bump BUM wherein the fourteenth line LIN14 receives a fourth test signal XTET4 and the twenty-fourth lines LIN24 applies the fourth test signal XTET4 to the LCD panel PAN. The fifth metal line ML5 is connected to a fifteenth line LIN15 and twenty-fifth lines LIN25 via a bump wherein the fifteenth line LIN15 receives a fifth test signal XTET5 and the twenty-fifth lines LIN25 apply the fifth test signal XTET5 to the LCD panel PAN. The sixth metal line ML6 is connected to a sixteenth line LIN16 and twenty-sixth lines LIN26 via a bump BUM wherein the sixteenth line LIN16 receives a sixth test signal XTET6 and the twenty-sixth lines LIN26 apply the sixth test signal XTET6 to the LCD panel PAN.

In detail, referring to FIG. 7, the bumps BUM are in contact with the respective corresponding metal lines that are electrically disconnected via an insulating layer ISO, thereby electrically connecting the metal lines to the corresponding lines.

By connecting the metal lines and the lines as described above, without having to stack a number of layers, on each of which lines are cross connected to each other by a via process and a line stacking process as performed in a prior art semiconductor FAB, the metal lines MLs disposed below the respective bumps and the lines LIN1s or LIN2s disposed above the respective bumps are allowed to be cross connected to each other via the bumps, as shown in FIGS. 6 and 7, and thereby a TAB IC(film) for use in LCD test can be fabricated, wherein the TAB IC(film) can replicate input signals into a number of signals, which are n times as many as the number of the original input signals, and output the replicated signals.

In addition, without performing a pre-process of a semiconductor FAB, the line connection unit CNLIN is fabricated only by means of a bump process that is a post-process of a semiconductor FAB, and thus the manufacturing costs can be reduced.

Further, if in replication of input signals into a number of replicated signals, which are n times as many as the number of the original input signals, a value of n is determined when fabricating the second lines LIN2s and a number of metal lines MLs, which are numerous enough to cover the number of replicated signals, are disposed, the bump process does not need to be repeatedly carried out to fabricate the TAB IC.

Consequently, when fabricating a new TAB IC that replicates signals into n-times more number of signals than the number of the original signals, a process of assembling the second lines LIN2s and the line connection unit CNLIN is only performed, thereby resulting in a drastic reduction of time and cost incurred for fabricating an additional line connection unit CNLIN.

Referring back to FIG. 6, each of the metal lines MLs may be disposed to form a closed rectangle having four sides connected to one another. In this case, each of the first lines LIN1s may be connected to one side of each corresponding metal line, and each of the second lines LIN2s may be connected to another side of each corresponding metal lines. The other side of the metal line may be in opposite to the one side of the metal line. For example, in FIG. 6, the first metal line ML1 may be disposed to form a closed rectangle having four sides 1 to 4 connected to one another, the first line LIN1 may be connected to one side 1 of the first metal line ML1 and the second lines LIN21 and LIN22 may be connected to the other side 3 of the first metal line ML1.

In FIG. 6, the first metal line ML1 is positioned outermost among the metal lines, the second metal line ML2 is disposed inside and close to the first metal line ML1, the third metal line ML3 is disposed inside and close to the second metal line ML2. In the same way, the fourth metal line ML4 is disposed inside and close to the third metal line ML3, the fifth metal line ML5 is disposed inside and close to the fourth metal line ML4, and the sixth metal line ML6 is disposed innermost among the metal lines MLs.

However, the arrangement of the metal lines MLs is not limited to the above examples. Referring to FIG. 8 that illustrates a test device TD for testing an LCD panel according to a second exemplary embodiment of the present invention, the first metal line ML1 that is connected to the eleventh line LIN11 to receive the first test signal XTET1 may be positioned innermost, and the sixth metal line ML6 that is connected to the sixteenth line LIN16 to receive the sixth test signal XTET6 may be positioned outermost.

In the example illustrated in FIG. 6 it is illustrated that each of the metal lines MLs is disposed to form a closed rectangle, but the shape of the metal lines is not limited thereto. Referring to FIG. 9 that illustrates a test device TD for testing an LCD panel according to a third exemplary embodiment of the present invention, each of the metal lines MLs is not disposed to form a closed rectangle, but a rectangular-like shape having one side cut off. Particularly, in the metal lines MLs illustrated in FIG. 9, sides opposite to the sides connected to the first lines LIN1s are cut off in consideration of noise and the like.

Also, referring to FIG. 10 that illustrates a test device TD for testing an LCD panel according to a fourth exemplary embodiment of the present invention, each of the metal lines MLs may be disposed to form a closed circular shape.

FIG. 11 is a diagram illustrating a test device for testing an LCD panel according to a fifth exemplary embodiment of the present invention. Referring to FIG. 11, the test device TD has metal lines each of which is disposed to form a closed rectangle. Each metal line has both opposing sides connected to the first lines LIN1s. For example, the eleventh line LIN11 is connected to both one side 1 and the other side 2 of the first metal line ML1 (refer to the same reference numerals for the sides of the first metal line ML1 as in the example illustrated in FIG. 6). As shown in the test device TD illustrated in FIG. 11, when the metal lines MLs and the first lines LIN1s are connected to each other, a difference is prevented from occurring due to a transmission distance between test signals to be transmitted to the second lines positioned relatively close to the first lines LIN1s (close to the first lines LIN1s on the metal lines) and test signal to be transmitted to the second lines positioned relatively distant from the first lines LIN1s (distant from the first lines on the metal lines).

FIG. 12 is a diagram illustrating a test device for testing an LCD panel according to a sixth exemplary embodiment of the present invention. Referring to FIG. 12, the test device TD may include first lines LLIN1As and LIN1Bs to branch each of test signals XTET from a flexible printed circuit FPC into x signals and connect the branched signals to metal lines MLs wherein x is a natural number and is 2 in the example illustrated in FIG. 12. A line connection unit CNLIN shown in FIG. 12 may include x sub line connection units (first sub line connection units CNLIN1 and second sub line connection units CNLIN2 in FIG. 12) to receive the branched first lines LIN1As and LIN1Bs.

In FIG. 12, test signals output from second lines LIN2s connected to the sub line connection units CNLIN1 and CNLIN2 are transmitted to either of two separated LCD panels PAN. In this case, a plurality of separated LCD panels PANs may be parts of a single LCD panel or individual LCD panels.

The configurations and operations of each sub line connection unit may be the same as those of the line connection unit illustrated in FIGS. 6 to 11, and thus the detailed description thereof will not be reiterated.

Referring to FIG. 13, as described above, the metal lines MLs in a driving unit DRV are disposed on a substrate SUB having an insulating layer ISO interposed therebetween. The metal lines MLs are connected to the first lines LIN1s and the second lines LIN2s via the bumps BUM wherein the first lines LIN1s and the second lines LIN2s are arranged on a first surface of the film FIL.

The driving unit DRV as shown in FIG. 13 may be fabricated by processes as illustrated in FIG. 14.

In manufacturing the test device TD for testing an LCD panel according to the exemplary embodiments of the present invention, as shown in (a) of FIG. 14, metal lines MLs are formed on a substrate SUB. Then, as in shown in (b) of FIG. 14, an insulating material is applied to the substrate SUB having the metal lines MLs formed thereon to produce an insulating layer ISO. The insulating layer is etched to form pads via which bumps BUM are in contact with the metal lines MLs as shown in (c) of FIG. 14. Thereafter, the bumps BUM are formed in the respective pads PAD as shown in (d) of FIG. 14, and the bumps BUM are bonded to a film FIL having lines LIN1 and LIN2 formed thereon as shown in (e) of FIG. 14.

In a prior art TAB IC fabrication method, manufacturing costs increase with the number of photo masks in use. The method of manufacturing the driving unit DRV according to the exemplary embodiment of the present invention uses only three masks: one for forming metal lines MLs on a substrate SUB; another for etching pad regions; and the other for forming bumps BUM, except for a mask for use in forming lines LIN1 and LIN2 on a film. Thus, the manufacturing process can be simplified and the manufacturing costs can be reduced.

FIG. 15 is a diagram illustrating an example of a structure of connection between a LCD panel and second lines of the test device in accordance with the exemplary embodiments in FIGS. 6 to 12. FIG. 16 is a diagram illustrating another example of a structure of connection between a liquid crystal pane and the second lines of the liquid crystal pane test device.

Referring to FIG. 15, second lines LIN2s of the test device TD are electrically connected to input lines PILIN of the LCD panel PAN via contacting means such as probes PRB. On the contrary, in the example illustrated in FIG. 16, second lines LIN2s on a film FIL of the test device TD are electrically connected directly to input lines PILIN of the LCD panel PAN without an additional contacting means, such as the probes PRB in FIG. 15. Although not illustrated in FIGS. 15 and 16, the LCD panel PAN may include pads for test signals transmitted from the second lines LIN2s to be applied to the input lines PILIN. Also, although the examples shown in FIGS. 15 and 16 are illustrated to be applied to the line connection unit CNLIN of the example in FIG. 6, the examples may be applied to the line connection unit (CNLIN) of the examples illustrated in FIGS. 8 to 12.

It will be apparent to those skilled in the art that various modifications and variation can be made in the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.

Claims

A test device for testing a liquid crystal display (LCD) panel, the test device comprising:

a film configured to have first lines and second lines formed thereon wherein the first lines receive test signals and the second lines are disposed apart from the first lines, branch the test signals received from the first lines into n (n is a natural number) signals and transmit the branched test signals to corresponding input lines of the LCD panel;

a line connection unit configured to be formed on a substrate and include metal lines to transmit signals received via the first lines to the respective corresponding second lines; and

bumps configured to electrically connect the first lines and the second lines to the corresponding metal lines.
The test device of claim 1, wherein each of the first lines and the second lines is formed on a first surface of the film.
The test device of claim 1, wherein the same number of first lines are formed as the number of the test signals and the number of second lines is n times as many as the number of the first lines.
The test device of claim 1, wherein the same number of metal lines are formed as the number of the first lines.
The test device of claim 1, wherein each of the metal lines is disposed to form a closed rectangle having four sides connected to one another, the respective first lines are connected to one side of the respective corresponding metal lines and the respective second lines are connected to the other side of the respective corresponding metal lines.
The test device of claim 5, wherein the other side is opposite to the one side of the metal line.
The test device of claim 5, wherein a first metal line corresponding to a first test signal of the test signals is positioned the outermost, the remaining metal lines other the first metal line are positioned inside the first metal line and as a distance from the first metal line to each of the remaining metal line increases, the sum of lengths of four sides of each of the remaining metal lines decreases.
The test device of claim 5, wherein a first metal line corresponding to a first test signal of the test signals is positioned the innermost, the remaining metal lines other than the first metal line are positioned outside of the first metal line, and as a distance from the first metal line to each of the remaining metal line increases, the sum of lengths of four sides of each of the remaining metal lines increases.
The test device of claim 1, wherein each of the first lines is connected to the other side.
The test device of claim 1, wherein each of the metal lines is disposed to form a rectangular-like shape having one side cut off, the first lines are connected to one side of the respective corresponding metal lines and the second lines are connected to the other side of the respective corresponding metal lines.
The test device of claim 10, wherein each of the metal lines is disposed to form a rectangular-like shape having the other side cut off.
The test device of claim 1, wherein each of the first lines is branched into x (x is a natural number) with respect to a corresponding test signal.
The test device of claim 12, wherein the line connection unit is further configured to include x sub line connection units.
The test device of claim 12, wherein the test signals which are output from the second lines, respectively, connected to the x sub line connection units are applied to a plurality of LCD panels.
The test device of claim 12, wherein the test signals which are output from the second lines, respectively, connected to the x sub line connection units are applied to one LCD panel.
The test device of claim 1, wherein the test signals received from the first lines are six color signals including R, G. B, R`, G`, and B` for driving the LCD panel.
The test device of claim 1, further comprising:

probes configured to electrically connect the branched test signals transmitted from the second lines to the corresponding input lines of the LCD panel.
The test device of claim 1, wherein the second lines are directly connected to the respective corresponding input liens of the LCD panel.
A method of manufacturing a test device for testing a liquid crystal display (LCD) panel, the method comprising:

forming first lines, second lines, and metal lines on a substrate wherein the first metal lines receives test signals, the second lines are disposed apart from the first lines, branch the test signals received from the first lines into n (n is a natural number) signals and transmit the branched test signals to corresponding input lines of the LCD panel, and the metal lines are electrically connected to each of the first and second lines via bumps;

forming an insulating layer by applying an insulating material over the substrate and the metal lines;

etching pad regions on the insulating layer whereby the bumps are to be bonded to the metal lines;

forming the bumps in the pad regions; and

bonding the bumps to the respective first lines and second lines on the film.