WO2012050443A1 - Couche d'étanchéité pour dispositifs électroniques ou photovoltaïques - Google Patents

Couche d'étanchéité pour dispositifs électroniques ou photovoltaïques Download PDF

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Publication number
WO2012050443A1
WO2012050443A1 PCT/NL2011/050694 NL2011050694W WO2012050443A1 WO 2012050443 A1 WO2012050443 A1 WO 2012050443A1 NL 2011050694 W NL2011050694 W NL 2011050694W WO 2012050443 A1 WO2012050443 A1 WO 2012050443A1
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WO
WIPO (PCT)
Prior art keywords
layer
diffusion barrier
sealing
sealing layer
electronic
Prior art date
Application number
PCT/NL2011/050694
Other languages
English (en)
Inventor
Carol Olson
Frank Lenzmann
Original Assignee
Stichting Energieonderzoek Centrum Nederland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stichting Energieonderzoek Centrum Nederland filed Critical Stichting Energieonderzoek Centrum Nederland
Publication of WO2012050443A1 publication Critical patent/WO2012050443A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a sealing layer for electronic devices. Also, the present invention relates to a method for manufacturing such a sealing layer and to electronic devices comprising such a sealing layer.
  • a sealing layer for an electronic or opto-electronic device has the purpose to seal off the electronic device from contaminants that adversely affect the quality of the electronic device.
  • the sealing layer has the purpose to prevent interaction of a contaminant with elements of the electronic device that are sensitive for chemical or physical reaction with the contaminant.
  • gaseous contaminants as oxygen or water vapor are known to react with the photoactive components of OLEDs and OLED screens (organic light emitting diodes).
  • glassy film layer or plate as sealing layer.
  • Disadvantages of using glass as protection layer are its high specific weight, brittleness and limited flexibility, which requires the processing of devices on glass to be carried out in a batch process. In some photovoltaic applications, the weight of the glass makes the device too heavy to be placed on some industrial roofs.
  • the barrier properties of more layers provide higher resistance to water vapor transmission, but the cost also increases with each layer that is deposited.
  • these layers may be brittle, which reduces the possibility for bending the layers.
  • Solar panels are also known to be sensitive to oxygen and water vapor and get damaged when exposed.
  • solar panels differ in their sizes and forms (rigid or flexible panels) as well as in the photovoltaic materials, e.g., wafer based silicon or thin film materials (amorphous and/or microcrystalline silicon, CdTe, CI(G)S).
  • Materials in development include organic polymers and small molecules as well as dye-sensitized solar cells.
  • These various types of solar panels have different requirements regarding the protection from moisture ingress. Depending on the specific designs, moisture may enter into the solar panels both through the front and back surfaces as well as from the edges of the panels.
  • the most sensitive versions of solar panels are characterized by a very low tolerance to water and require sealing concepts with water vapor transmission rates (WVTR) on the order of only 0.00001 g/m2/day.
  • WVTR water vapor transmission rates
  • Flexible forms of solar panels are typically exposed to moisture ingress much more critically than rigid forms. This is because flexible solar panels are encapsulated between flexible polymer sheets on the front and sometimes also on the back side. These polymeric materials are typically characterized by relatively high WVTRs, unlike in the rigid forms, where glass covers, through which no water can diffuse.
  • Glass plates are often used as sealing layers. Since glass covers the full light collecting area that is directed towards the sun, the weight of the glass cover is high and requires a relatively rigid construction of the solar panel. Additionally, within the solar panel, solar cells are typically encapsulated by a polymer such as ethyl vinyl acetate. It is known that such polymers have a relatively high water vapor transmission rate, which requires additional measures to keep the solar cells and the internals of the solar panel dry.
  • a polymer such as ethyl vinyl acetate. It is known that such polymers have a relatively high water vapor transmission rate, which requires additional measures to keep the solar cells and the internals of the solar panel dry.
  • Other typical materials used in sealing concepts front- or back- side covers as well as connection or lamination layers and edge seals
  • PVB polymer sheet
  • PTFE tedlar
  • a sealing layer comprising a base polymer layer, a diffusion barrier layer and a top polymer layer; the base polymer layer being arranged on a surface of the diffusion barrier layer, the top polymer layer being arranged on a surface of the diffusion barrier layer facing away from the base polymer layer, wherein the diffusion barrier layer is a molecular layer.
  • the polymers provide a simpler manipulation of the diffusion barrier layer when arranging the diffusion barrier layer on an object to be sealed.
  • the sealing layer according to the present invention has the advantage that by using two polymer layers as base and top layers, any surface incompatibility of the diffusion barrier material with a surface that is to be sealed, can be prevented.
  • the layered structure of the sealing layer according to the present invention has the advantage that the layer has flexibility which allows to wrap the layer around an object to be sealed.
  • the diffusion barrier layer comprises a molecular graphene layer.
  • Very high transparency values can be achieved with these sealing layers (up to a maximum value of 97.5%). If desired the transparency of the sealing layer can be varied to any value below the above mentioned maximum value in steps of 2.5% per monolayer.
  • the diffusion barrier layer comprises a molecular boron nitride layer.
  • the diffusion barrier graphene layer comprises one to ten monolayers, preferably one to six monolayers, more preferably one to four monolayers.
  • the graphene layer has a transparency of 75% or more in the range from about 350 nm to about 1400 nm of the electromagnetic spectrum.
  • a sealing layer as described above, wherein at least one of the base polymer layer and the top polymer layer consists of transparent polymer material.
  • a sealing layer as described above, wherein at least one of the base polymer layer and the top polymer layer consists of an opaque polymer material.
  • a sealing layer as described above, wherein the sealing layer comprises at least one additional layer selected from a group comprising an adhesion layer, a light management layer for enhancing either absorption or reflection, or a layer to incorporate either a moisture sensor or a moisture indicator.
  • a method for manufacturing a sealing layer having a base polymer layer, a diffusion barrier layer, and a top polymer layer comprising: forming the diffusion barrier layer on a precursor surface of a precursor substrate; transferring the diffusion barrier layer to the base polymer layer, wherein said transferring the diffusion barrier layer to the base polymer layer comprises either a formation by lamination or a deposition by a chemical vapor deposition process of the base polymer layer on a free exposed surface of the diffusion barrier layer; and arranging the top polymer layer on a surface of the diffusion barrier layer that faces away from the base layer, wherein the diffusion barrier layer is a molecular layer.
  • the sealing layers of this invention can be inserted between a base layer and top layer at mild processing conditions, e.g., low process temperatures of ⁇ 150C and without the need of very high or very low process pressures.
  • transferring the diffusion barrier layer to the base polymer layer comprises a formation or deposition of the base polymer layer on a free exposed surface of the diffusion barrier layer.
  • a method as described above further comprising a removal of the diffusion barrier layer from the precursor surface by either etching away the precursor substrate or by a lift off process that separates the diffusion barrier layer from the precursor surface.
  • the diffusion barrier layer is one selected from a molecular graphene layer and a molecular boron nitride layer.
  • an electronic or photovoltaic device comprising at least one sealing layer as described above, which sealing layer is arranged on one or more surfaces of the device for sealing off said one or more surfaces.
  • an electronic or photovoltaic device as described above, wherein the device comprises a display structure of OLED type or LCD type, wherein the sealing layer is arranged on a surface of the display structure that is to be sealed off.
  • an electronic or photovoltaic device as described above, wherein the device comprises a memory structure, wherein the sealing layer is arranged on a surface of the memory structure that is to be sealed off.
  • an electronic or photovoltaic device as described above, wherein the device is a solar panel comprising one or more solar cells each having its respective photoactive surface facing towards a light collecting side, wherein the sealing layer is arranged on a surface of the solar panel that is to be sealed off.
  • an electronic or photovoltaic device as described above, wherein the device is a solar panel comprising one or more solar cells each having its respective photoactive surface facing towards a light collecting side, the solar cells being encapsulated in an ethyl vinyl acetate layer, a glass plate being arranged on top of the ethyl vinyl acetate layer, wherein the sealing layer is arranged between the ethyl vinyl acetate layer and the glass plate.
  • an electronic or photovoltaic device as described above, wherein the base polymer layer and the top polymer layer consist of ethyl vinyl acetate polymer.
  • an electronic or photovoltaic device as described above, wherein the device is a solar cell having a photoactive surface facing towards a light collecting side, wherein the sealing layer is arranged on a surface of the solar cell on at least the light collecting side.
  • an electronic or photovoltaic device as described above, wherein the device is embodied as planar structure and the sealing layer wraps around an edge of the planar structure.
  • Figure 1 shows a cross-sectional view of a sealing layer in a first embodiment
  • Figure 2 shows a photovoltaic device composed of "free-standing" solar cells comprising a sealing layer according to the present invention
  • Figure 3 shows a cross-sectional view of a photovoltaic device comprising a sealing layer according to the present invention
  • Figure 4 shows a cross-sectional view of an OLED structure comprising a sealing layer according to the present invention
  • Figures 5a, 5b show a cross-sectional view of an electronic or photovoltaic device comprising a sealing layer according to the present invention
  • Figure 6 shows an exploded cross-sectional view of a solar panel comprising a sealing layer according to the present invention
  • Figure 7 shows an exploded cross-sectional view of a thin film solar panel comprising a sealing layer according to the invention.
  • Figure 1 shows a cross-section of a sealing layer according to a first embodiment of the present invention.
  • the sealing layer is a laminated layer 10 which comprises a base layer 1, a diffusion barrier layer 2 and a top layer 3. On a surface of the base layer 1 the diffusion barrier layer 2 is arranged.
  • the top layer 3 is arranged on the surface of the diffusion barrier layer 2 that is facing away from the base layer 1.
  • the base layer 1 is a polymer layer which for example, without any limitation of the invention, may consist of polyethylene, polypropylene, ethyl vinyl acetate or silicone.
  • the polymer layer can be either petroleum-based or bio-sourced material.
  • the top layer 3 is also a polymer layer and may consist of a similar or same material as the base layer 1.
  • the polymers provide a simpler manipulation of the diffusion barrier layer when arranging the diffusion barrier on an object to be sealed.
  • the sealing layer according to the present invention has the advantage that by using two polymer layers as base and top layers, any surface incompatibility of the diffusion barrier material with a surface that is to be sealed, can be prevented.
  • the laminated structure of the sealing layer according to the present invention has the advantage that the layer has flexibility which allows to wrap the layer around an object to be sealed.
  • the diffusion barrier layer 2 is a continuous mono-crystalline or polycrystalline graphene layer, i.e., a continuous molecular layer. In an alternative embodiment, the diffusion barrier layer is a continuous mono-crystalline or
  • the diffusion barrier layer 2 may consist of a layered structure comprising one or more continuous monolayers of either graphene or boron nitride.
  • Graphene has a two dimensional molecular structure i.e., a hexagonal crystal lattice structure (a honeycomb structure of carbon atoms, in sp2 bonding).
  • the bond length between closest neighbor atoms is 0.14 nm, which provide that openings within the lattice are relatively small in comparison to sizes of molecules such as water or oxygen.
  • graphene layers by CVD allows to form graphene layers with relatively high perfection, i.e., having only very small amounts of crystal (i.e., lattice) defects and/or cracks and/or voids.
  • boron nitride as diffusion barrier layer 2, it is noted that boron nitride can be obtained in a layered structure with a similar honeycomb structure and similar relatively low defect concentration as graphene. As a result, boron nitride has similar diffusion barrier properties as graphene.
  • Boron nitride is a wide band gap insulating material.
  • Graphene is a conducting material.
  • a molecular graphene layer may be combined with a molecular layer of boron nitride to form a diffusion barrier layer in the sealing layer 10.
  • one or more solar cells 23 are arranged between a front sheet 21 (at the light receiving side) and a back-sheet 25.
  • the sealing layer 10 may be arranged in either an encapsulating layer 22 either between the front sheet 21 and the solar cells 23 or between an encapsulating layer 24 and the solar cells on the side of the back sheet 25.
  • the sealing layer is arranged on the front side of photovoltaic devices, through which the light enters into the panel, the base and top polymer layers are transparent polymer layers.
  • Transparent polymer base and top layers are also required when the sealing layer is arranged on the front and/or back-side of so-called "bifacial" solar panels, where light enters into the panel through both the front and the back sides.
  • the sealing layer is arranged on the back side of photovoltaic devices, through which no light enters into the panel, the base and top layers are not limited to transparent polymer layers.
  • one or more solar cells 32 have been deposited on a substrate (not shown) or a superstate (front sheet 31 , at the light receiving side).
  • the solar cells are encapsulated by encapsulating layer 33 which is covered by a back-sheet 34.
  • the sealing layer 10 may be arranged in the encapsulating layer 33 on the free surface of the semiconductor material. If the substrate or superstrate is already transparent, then the sealing layer may or may not have transparent polymer layers, otherwise the two polymer sheets in the invention would be transparent layers.
  • the graphene layer has a thickness up to six monolayers with a transparency of at least 85 % in the range from about 350 nm to about 1400 nm of the radiation spectrum.
  • a method according to the present invention comprises a formation of the diffusion barrier layer.
  • the properties of graphene depend on the way it is fabricated.
  • the graphene layer is a molecular sheet, which is continuous in two dimensions but is not necessarily free of lattice defects. If there are more than one layer of graphene, each layer may have lattice discontinuities as long as they don't overlap with the
  • the probability of forming diffusion channels or paths through the monolayers can be very low.
  • the formation comprises an epitaxial growth of graphene or boron nitride on a precursor surface of a precursor substrate such as copper or nickel or other metals or oxides, by means of a chemical vapor deposition process.
  • the method comprises that the graphene layer is transferred from the precursor surface to the base layer.
  • the method comprises that a polymer layer is deposited (e.g., by chemical vapor deposition) and/or formed by lamination of that layer onto the free surface of the graphene layer.
  • the polymer layer forms for example the base layer of the sealing layer.
  • the method comprises that in case the base layer is produced by the deposition process, that after the formation or deposition, the base layer is submitted to a lamination process to mechanically enhance the disposition of the layer.
  • the precursor substrate may be removed by etching or by other methods, for example water-induced lift-off of the polymer and graphene layers from the precursor surface.
  • the graphene layer has a surface attached to the polymer and a free exposed surface.
  • a next polymer layer is arranged as top layer on top of the free exposed surface of the diffusion barrier layer.
  • the method comprises a step of arranging a next polymer layer on the free exposed surface of the graphene layer.
  • the sealing layer 10 may comprise more layers than the base polymer layer, the diffusion barrier layer and the top polymer layer, for example an adhesion layer, a light management layer (for enhanced absorption or reflection) or a layer to incorporate a moisture sensor or moisture indicator. Also, an (additional) insulating layer may be present, in case a back sheet is conductive.
  • the sealing layer according to the present invention is applied in various types of electronic and photovoltaic devices that each require a proper diffusion barrier against contaminants.
  • Such devices comprise but are not limited to display devices such as OLED (organic light emitting diode) and LCD (liquid crystal display) devices, solid state memory devices such as RAM, ROM, non- volatile RAM (flash) and EEPROM, organic electronics and photovoltaic devices such as solar cells and solar panels.
  • Such electronic or photovoltaic devices comprise at least an electronic circuit or a photovoltaic component with at least a surface that needs to be sealed off from external contaminants.
  • Figure 4 shows a cross-section of an OLED structure 40 comprising a sealing layer according to the present invention.
  • a basic OLED structure 40 comprises on a substrate 45, two or more organic structured layers 43 stacked on each other in between a transparent anode structure 42 and a cathode structure 44. At least one of the organic layers 43 is a light emissive layer. One or more of the other organic layers 43 is a conductive layer.
  • the OLED layers are composed of two or more organic structured layers in which at least one is a light emissive layer and the other is a conductive layer.
  • a transparent cover or scratch protective layer 41 can be arranged on a light emitting surface of the device.
  • the organic layers are patterned
  • anode structure 42 and cathode structure 44 are patterned (not shown) to allow addressing the individual pixels.
  • the sealing layer 10 could be inserted between the OLED structure 42, 43, 44 and the substrate 45 and/or between the OLED structure 42, 43, 44 and the scratch protective layer (41), which is arranged on a display surface of the OLED structure.
  • the sealing layer according to the present invention may be applied on an LCD structure.
  • Figure 5 a shows a cross-sectional view of an electronic or photovoltaic device 60 comprising a sealing layer 10 in an embodiment according to the present invention.
  • the sealing layer is provided with an closing edge portion 4 which wraps around the edge 61 of the electronic or photovoltaic device, and comprises a metal foil 5 that fixes the wrapped edge portion to the edge of the electronic or photovoltaic device.
  • the metal foil 5 is adapted as a clip to fix the edge portion 4 of the sealing layer to the edge 61 of the device.
  • Figure 5b shows a cross-sectional view of an electronic or photovoltaic device 60 comprising a sealing layer 10 in an embodiment according to the present invention.
  • both the front and rear surfaces may need to be sealed.
  • the sealing layer 10 covers both the front and rear surfaces of the electronic or photovoltaic device, warps around the front and rear surfaces and overlaps at an edge of the device 60.
  • the overlapping portions of the sealing layer at the edge of the device are fixed by a metal foil 5 or clip that covers the overlapping portions.
  • Figure 6 shows an exploded cross-sectional view of a solar panel 50 comprising a sealing layer according to the present invention.
  • the solar panel 50 comprises a support layer 51, a connection layer 52, solar cells 53, an encapsulation layer 54 and a transparent cover 55.
  • connection layer 52 On the support layer 51, the connection layer 52 is arranged.
  • the solar cells 53 are positioned on the connection layer 52.
  • the photoactive surface of each solar cell is facing upward, away from the connection layer 52.
  • the connection layer 52 provides electrical connections between the solar cells 53.
  • the solar cells 53 are encapsulated in an encapsulating layer 54, which comprises a polymer such as ethyl vinyl acetate (EVA).
  • EVA ethyl vinyl acetate
  • the transparent cover 55 is arranged at the light collecting surface of the solar panel.
  • the transparent cover 55 is a sealing layer according to the present invention, which comprises the base layer 1, the diffusion barrier layer 2 and the top layer 3, and seals off the light collecting surface.
  • the sealing layer 10 can be arranged between the EVA layer and a glass plate to improve the barrier properties against contaminants such as water and oxygen.
  • the base and top polymer layers 1 , 3 of the sealing layer consist of EVA, so as to have surface compatibility with the EVA and/or glass interface of prior art solar cells.
  • the sealing layer may attached to the electronic or
  • the glue layer may cover the full interface area between the sealing layer and the device or alternatively, the edge areas of the interface area.
  • Figure 7 shows an exploded cross-sectional view of a thin film solar panel 60.
  • the thin film solar panel 60 comprises a first cover layer 61 with integrated interconnected solar cells 64, a bonding and encapsulating layer 62 and a second cover 63.
  • the solar cells 64 are thin film devices arranged on the first cover layer which acts as a substrate.
  • the solar cells are interconnected by interconnection paths (not shown) arranged on the first cover 61 between the solar cells.
  • the first cover layer 61 is a material with inherent diffusion barrier properties, such as a steel sheet or a (thin) glass sheet.
  • the bonding and encapsulating layer 62 comprises a sealing layer according to the invention, or alternatively, the second cover layer 63 comprises the sealing layer.
  • an additional insulating layer will be arranged between the steel sheet and the solar cells.
  • the first cover layer 61 may consist of a polymer layer in which a sealing layer is incorporated to enhance the diffusion barrier properties of the first cover layer 61.
  • a molecular boron nitride layer may replace a molecular graphene layer as diffusion barrier material.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Photovoltaic Devices (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La couche d'étanchéité (10) selon l'invention comprend une couche polymère de base (1), une couche de barrière de diffusion (2) et une couche polymère supérieure (3). La couche de barrière de diffusion est agencée sur une surface de la couche polymère de base (1), la couche polymère supérieure est agencée sur une surface de la couche de barrière de diffusion (2) tournant le dos à la couche polymère de base (1). La couche de barrière de diffusion est une couche moléculaire.
PCT/NL2011/050694 2010-10-12 2011-10-12 Couche d'étanchéité pour dispositifs électroniques ou photovoltaïques WO2012050443A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2005506A NL2005506C2 (en) 2010-10-12 2010-10-12 Sealing layer for electronic or photovoltaic devices.
NL2005506 2010-10-12

Publications (1)

Publication Number Publication Date
WO2012050443A1 true WO2012050443A1 (fr) 2012-04-19

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Country Status (3)

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NL (1) NL2005506C2 (fr)
TW (1) TW201222739A (fr)
WO (1) WO2012050443A1 (fr)

Cited By (5)

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US20140370246A1 (en) * 2012-01-20 2014-12-18 Brown University Substrate with Graphene-based Layer
JP2015528179A (ja) * 2012-06-19 2015-09-24 コーニンクレッカ フィリップス エヌ ヴェ 有機エレクトロルミネッセンスデバイス
EP3246962A4 (fr) * 2015-01-15 2018-08-22 Boe Technology Group Co. Ltd. Dispositif delo, procédé et appareil d'encapsulation associés
US10361331B2 (en) 2017-01-18 2019-07-23 International Business Machines Corporation Photovoltaic structures having multiple absorber layers separated by a diffusion barrier
US10403708B2 (en) * 2016-03-09 2019-09-03 The Regents Of The University Of California Graded bandgap perovskite solar cell

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KR102586964B1 (ko) * 2022-04-05 2023-10-11 해성디에스 주식회사 반도체 패키지 기판, 이를 포함하는 반도체 패키지, 및 반도체 패키지 기판의 제조방법

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140370246A1 (en) * 2012-01-20 2014-12-18 Brown University Substrate with Graphene-based Layer
JP2015528179A (ja) * 2012-06-19 2015-09-24 コーニンクレッカ フィリップス エヌ ヴェ 有機エレクトロルミネッセンスデバイス
EP3246962A4 (fr) * 2015-01-15 2018-08-22 Boe Technology Group Co. Ltd. Dispositif delo, procédé et appareil d'encapsulation associés
US10319942B2 (en) 2015-01-15 2019-06-11 Boe Technology Group Co., Ltd. OLED device, packaging method thereof, and packaging apparatus
US10403708B2 (en) * 2016-03-09 2019-09-03 The Regents Of The University Of California Graded bandgap perovskite solar cell
US10361331B2 (en) 2017-01-18 2019-07-23 International Business Machines Corporation Photovoltaic structures having multiple absorber layers separated by a diffusion barrier
US11276796B2 (en) 2017-01-18 2022-03-15 International Business Machines Corporation Photovoltaic structures having multiple absorber layers separated by a diffusion barrier

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NL2005506C2 (en) 2012-04-16
TW201222739A (en) 2012-06-01

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