WO2012048477A1 - 共烧封接陶瓷灯及其制备方法 - Google Patents

共烧封接陶瓷灯及其制备方法 Download PDF

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WO2012048477A1
WO2012048477A1 PCT/CN2010/078257 CN2010078257W WO2012048477A1 WO 2012048477 A1 WO2012048477 A1 WO 2012048477A1 CN 2010078257 W CN2010078257 W CN 2010078257W WO 2012048477 A1 WO2012048477 A1 WO 2012048477A1
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electrode
ceramic
tube
fired
metal
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PCT/CN2010/078257
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English (en)
French (fr)
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张万镇
谢灿生
高鞠
陆镇洲
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潮州市灿源电光源有限公司
潮州市晨歌电光源有限公司
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Publication of WO2012048477A1 publication Critical patent/WO2012048477A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32Sealing leading-in conductors
    • H01J9/323Sealing leading-in conductors into a discharge lamp or a gas-filled discharge device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00Gas-discharge or vapour-discharge lamps
    • H01J61/02Details
    • H01J61/36Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00Gas-discharge or vapour-discharge lamps
    • H01J61/02Details
    • H01J61/36Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
    • H01J61/366Seals for leading-in conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/245Manufacture or joining of vessels, leading-in conductors or bases specially adapted for gas discharge tubes or lamps
    • H01J9/247Manufacture or joining of vessels, leading-in conductors or bases specially adapted for gas discharge tubes or lamps specially adapted for gas-discharge lamps

Definitions

  • the invention belongs to the field of ceramic light sources, and in particular relates to a co-fired sealing high-efficiency ceramic lamp and a preparation method thereof.
  • the structure of the ceramic lamp is directly related to the sealing process. Sealing is the key technology of ceramic discharge light source. The quality of sealing is directly related to the performance and life of arc tube.
  • the sealing technology of ceramic discharge tube is different from quartz.
  • the quartz metal halide lamp is shrink-sealed or compression-sealed by melting quartz and electrode or electrode assembly. The ceramic is not melted after molding, and the sealing of ceramic and electrode or electrode assembly is The gap between the ceramic and the electrode is filled by the glass solder, as shown in FIG. 1 , which includes a discharge chamber 6 , an electrode tube 2 disposed at both ends thereof, and an electrode assembly inserted in the electrode tube 2 , and the electrode assembly includes the electrode assembly.
  • the electrode tip 5, the molybdenum wire 3, and the manifold 1 are located in the discharge chamber, and the solder flows into the gap 4 between the electrode tube 2 and the electrode assembly to achieve welding.
  • the main sealing technology is to design the ceramic discharge tube pin as two electrode tubes, and a small gap is formed between the inner diameter and the electrode assembly.
  • the glass solder is heated together with the ceramic discharge tube and the electrode during the sealing process.
  • the melting point of the glass solder is lower than the softening point of the ceramic, and it has good fluidity after melting, and then penetrates into the gap between the ceramic electrode tube and the electrode assembly.
  • the sealing of the ceramic tube is completed after cooling. At present, almost all of the ceramic metal halide lamps use the sealing technology completed in the electrode tube.
  • the solder In the existing electrode and electrode tube, the solder is melted to melt the electrode to complete the sealing of the electrode and the electrode tube.
  • the disadvantage is that the solder material easily reacts with the metal halide in the arc tube, causing solder corrosion and seal damage.
  • the object of the present invention is to provide a co-fired and sealed high-efficiency ceramic lamp which avoids corrosion of solder and has better airtightness;
  • another object of the present invention is to provide a method for preparing a co-fired and sealed high-efficiency ceramic lamp.
  • the technical solution of the present invention is: a co-fired sealing high-efficiency ceramic lamp,
  • the utility model comprises a discharge chamber and an electrode tube arranged at an end of the discharge chamber.
  • the electrode tube is internally filled with a ceramic metal electrode, and the ceramic metal electrode is connected with a tungsten electrode at one end of the discharge chamber, and the ceramic metal electrode and the electrode tube are sealed by co-firing.
  • the ceramic metal electrode and the electrode tube are sealed by co-firing without any solder, and the reaction between the metal halide and the solder inside the discharge chamber can be effectively avoided, thereby causing corrosion of the solder, and the co-firing can be sealed. Effectively solve this problem and make air tighter.
  • the ceramic metal electrode is co-fired and sealed with the entire electrode tube; or the ceramic metal electrode end and the corresponding portion of the electrode tube are co-fired and sealed.
  • the outer diameter of the ceramic metal electrode matches the inner diameter of the electrode tube. Compared with the solder sealing method, the contact area between the co-fired arc tube and the ceramic metal electrode can be made into a micro gap or even a zero gap.
  • the expansion coefficient of the ceramic metal electrode material matches the expansion coefficient of the electrode tube material.
  • the matching degree of the ceramic metal electrode material with the electrode tube material is better than that of the solder and the ceramic metal electrode, and the matching degree between the solder and the electrode tube.
  • the ceramic metal electrode is mixed with at least one of aluminum oxide, cerium oxide, magnesium aluminum spinel, yttrium aluminum garnet, and metal: tungsten, molybdenum, chromium, niobium, tantalum, vanadium, niobium, zirconium, and titanium.
  • a metal-coated refractory oxide particle having a mass fraction of greater than or equal to 40% and less than or equal to 60% is obtained; and the discharge chamber and the electrode tube are composed of a transparent light-transmitting ceramic.
  • the bonding force between the electrode tube made of the ceramic material and the cermet electrode is generally higher than the bonding force generated by filling the solder between the electrode tube and the cermet electrode, and the airtightness of the lamp can be improved.
  • the end of the cermet electrode protrudes from the electrode tube and directly serves as a metal lead; or the cermet electrode end is further connected with a metal lead for preventing oxidation, and a soldering groove is arranged between the end of the electrode tube and the end of the cermet electrode.
  • the metal lead protrudes out of the electrode tube through the soldering groove, and the soldering groove is used to fill the glass solder.
  • an anti-oxidation metal lead is connected to the end of the cermet electrode, and the cermet electrode end is shorter than the end of the ceramic electrode tube, and the glass solder capping cermet electrode is melted at the end to prevent oxidation.
  • the metal lead is made of a highly halogen-resistant chromium-based, nickel-based, fluorenyl, fluorenyl or IrPt special alloy or NiAl intermetallic compound or ZrC, NbC, TaC, HfC, WC.
  • the present invention provides a method for preparing a co-fired sealed high-efficiency ceramic lamp.
  • the end of the ceramic metal electrode and the corresponding end of the electrode tube are sealed by a local heat source co-firing method, and the local heat source co-firing method includes low-temperature preheating. Then rapidly heating to the co-firing temperature; wherein the low temperature preheating temperature range is 200-1000 ° C, time 1-5 seconds; the rapid heating temperature is above 1600 ° C until the outer surface of the cermet electrode and the inner surface of the electrode tube are melted to complete the co-firing, time Within 0.3 to 2 seconds.
  • the low-temperature preheating and rapid heating treatment method can effectively reduce the thermal shock to the material and avoid micro-cracking, deformation and accumulation stress of the ceramic.
  • the advantages of the method include: a, the bonding force between the electrode tube and the cermet co-firing is generally higher than the bonding force generated by the solder, and the airtightness can be improved; b, the glass solder which does not react with the halide; c, the expansion coefficient More matching.
  • the local heat source is a plasma arc, a laser, a focused infrared lamp or a fiber optic lamp.
  • the ceramic metal electrode and the electrode tube are sealed by co-firing, which can effectively avoid corrosion of the solder, and make the airtightness better;
  • the co-fired arc tube and the ceramic metal electrode have a more uniform expansion coefficient.
  • FIG. 1 is a schematic structural view of a prior art solder-sealed ceramic lamp
  • Embodiment 1 is a schematic structural view of Embodiment 1 of a co-fired sealing high-efficiency ceramic lamp of the present invention
  • Embodiment 3 is a schematic structural view of Embodiment 2 of a co-fired and sealed high-efficiency ceramic lamp of the present invention
  • the present invention discloses a co-fired and sealed high-efficiency ceramic lamp. It includes a discharge chamber 11 and an electrode tube 12 disposed at an end of the discharge chamber 11.
  • the electrode tube 12 is internally provided with a ceramic metal electrode 13 connected to the end of the discharge chamber 11 with a tungsten electrode 14, wherein the ceramic metal
  • the electrode 13 and the electrode tube 12 are sealed by co-firing.
  • the end of the ceramic metal electrode 13 and the corresponding portion of the electrode tube 12 are co-fired and sealed.
  • the ceramic metal electrode 13 can also be co-fired and sealed with the entire electrode tube 12.
  • the outer diameter of the ceramic metal electrode 13 is matched with the inner diameter of the electrode tube 12. Compared with the sealing method using solder, the contact area between the co-fired arc tube and the ceramic metal electrode can be micro-gap or even zero gap.
  • the coefficient of expansion of the ceramic metal electrode 13 material matches the coefficient of expansion of the material of the arc tube 12.
  • the matching degree of the ceramic metal electrode material with the arc tube material is better than that of the solder and the ceramic metal electrode, and the matching degree between the solder and the arc tube. In this way, when the ceramic metal electrode 13 is thermally expanded, it is possible to prevent the electrode tube 12 from being broken or the existence between the electrode tube 12 and the ceramic metal electrode 13 due to the inconsistent expansion coefficient of the electrode tube 12 or the ceramic metal electrode 13. gap.
  • the material properties of the solder and the arc tube and the ceramic metal electrode are largely different, and the degree of matching is also poor, which easily causes cracking or gap generation of the electrode tube.
  • the ceramic metal electrode 13 is made of at least one of alumina, yttria, magnesium aluminate spinel, yttrium aluminum garnet, and metal: tungsten, molybdenum, chromium, niobium, tantalum, vanadium, niobium, zirconium, and titanium.
  • the materials are mixed to obtain metal-coated refractory oxide particles, the mass fraction of the metal is greater than or equal to 40%, and less than or equal to 60%;
  • the discharge chamber 11 and the electrode tube 12 are made of transparent transparent ceramic, transparent and transparent
  • the ceramic is alumina or the like.
  • the end of the cermet electrode 13 protrudes from the electrode tube 12 and directly serves as a metal lead.
  • the present invention also discloses a method for preparing a co-fired sealed high-efficiency ceramic lamp, wherein the end of the ceramic metal electrode and the corresponding end of the electrode tube are sealed by a local heat source co-firing method, and the local heat source co-firing method includes a low temperature. Preheating, and then rapidly heating to the co-firing temperature; wherein the low temperature preheating temperature range is 200-1000 ° C, time 1-5 seconds; the rapid heating temperature is above 1600 ° C until the outer surface of the cermet electrode and the inner surface of the electrode tube are melted to complete Burn, time is less than 0.3 to 2 seconds.
  • the co-fired sealed high-efficiency ceramic lamp is completed by secondary sealing, one: due to the absence of pills and mercury, it can be completed by a conventional heating furnace method. Two: Due to the presence of pills and mercury, a local heating method is used.
  • the local heating may be performed by using a heating element such as graphite or metal, an arc such as an argon arc, or a focused infrared lamp, or an optical fiber transmitting infrared source, or a laser such as a carbon dioxide laser, a YAG laser, a fiber laser, or a semiconductor laser.
  • This embodiment is similar to the structure of Embodiment 1, except that the metal lead is a separate component.
  • the cermet electrode 13 is further connected with a metal oxide lead 15 and an electrode tube 12 at the end.
  • a soldering groove 16 is further disposed between the end and the end of the cermet electrode 13, and the metal lead 15 extends out of the electrode tube 12 through the soldering groove 16, and the soldering groove 16 is used to fill the glass solder.
  • the diameter of the metal lead 15 is smaller than the diameter of the cermet electrode 13.
  • an anti-oxidation metal lead 15 is attached to the end of the cermet electrode 13, and the end of the cermet electrode 13 is shorter than the end of the electrode tube 12, and the glass solder cap cermet is melted at the end.
  • the electrode 13 prevents oxidation.
  • the metal lead 15 is made of a highly halogen-resistant chromium-based, nickel-based, fluorenyl, fluorenyl or IrPt special alloy or NiAl intermetallic compound or ZrC, NbC, TaC, HfC, WC.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)

Description

[根据细则37.2由ISA制定的发明名称] 共烧封接陶瓷灯及其制备方法
技术领域
本发明属于陶瓷光源领域,尤其涉及一种共烧封接高效陶瓷灯及其制备方法。
背景技术
陶瓷灯结构直接关系到封接工艺。封接是陶瓷放电光源的关键技术,封接的好坏直接关系到电弧管的性能和寿命。陶瓷放电管的封接技术不同于石英,石英金卤灯是通过融化石英与电极或电极组件进行收缩封接或压缩封接,陶瓷在成型后不宜融化,陶瓷与电极或电极组件的封接是通过玻璃焊料填充陶瓷与电极的缝隙完成的,见图1所示,其中包括放电腔6、设于其两端电极管2及插装于电极管2内的电极组件,电极组件包括依次连接的位于放电腔内的电极头5、钼丝3及铌管1,焊料流入电极管2与电极组件间的间隙4实现焊接。
要做到完全的气密性,目前主要的封接技术是将陶瓷放电管管脚设计为两个电极管,其内径与电极组件间形成小间隙。在封接过程中,将玻璃焊料和陶瓷放电管及电极一同加热。玻璃焊料的熔点低于陶瓷的软化点,并且在熔化后有很好的流动性,进而渗透到陶瓷电极管和电极组件的间隙中。待冷却后完成陶瓷管的封接。目前陶瓷金卤灯几乎所有全部采用这种在电极管里完成的封接技术。
现有的电极与电极管是采用加焊料,熔化焊料来完成电极与电极管的封接。缺点是焊料材料容易与电弧管中的金属卤化物反应,导致焊料腐蚀,密封破坏。
发明内容
针对现有技术的缺点,本发明的目的是提供一种避免焊料的腐蚀、气密性更佳的共烧封接高效陶瓷灯;
同时,本发明的另一目的是提供一种共烧封接高效陶瓷灯的制备方法。
为实现上述目的,本发明的技术方案为:一种共烧封接高效陶瓷灯, 其包括放电腔及设于放电腔端部的电极管,电极管内插装有陶瓷金属电极,陶瓷金属电极靠近放电腔的一端连接有钨电极,陶瓷金属电极与电极管通过共烧完成封接。
上述方案中,陶瓷金属电极与电极管通过共烧完成封接,而不需要任何焊料,能有效避免放电腔内部的金属卤化物与焊料的反应,从而造成焊料的腐蚀,而共烧封接能有效解决此问题,使气密性更佳。
进一步地,陶瓷金属电极与整个电极管完成共烧封接;或者,陶瓷金属电极末端与电极管对应部位完成共烧封接。
进一步地,该陶瓷金属电极外径与电极管内径相匹配。比起用焊料的封接方法,共烧的电弧管与陶瓷金属电极的接触区域可以做到微间隙,甚至是零间隙。
该陶瓷金属电极材料的膨胀系数与电极管材料的膨胀系数相匹配。陶瓷金属电极材料与电极管材料的匹配程度优于焊料与陶瓷金属电极,和焊料与电极管的匹配程度。
具体地,该陶瓷金属电极由氧化铝、氧化钇、镁铝尖晶石、钇铝石榴石和金属:钨、钼、铬、钽、铌、钒、铪、锆、钛中的至少一种材料混合,得到金属包覆的难熔氧化物颗粒,金属的质量分数大于或等于40%,且小于或等于60%;该放电腔及电极管由透明透光陶瓷构成。
陶瓷材料制得的电极管与金属陶瓷电极共烧产生的结合力一般比通过在电极管与金属陶瓷电极之间填充焊料产生的结合力要高,能提高灯的气密性。
该金属陶瓷电极的末端伸出电极管,并直接作为金属引线;或者,该金属陶瓷电极末端还接有一段防氧化的金属引线,且电极管末端与金属陶瓷电极末端之间还设有一焊接槽,该金属引线穿过焊接槽伸出电极管外,该焊接槽用于填充玻璃焊料。
上述方案中,为了防止金属陶瓷电极氧化,在金属陶瓷电极末端接一段防氧化的金属引线,而且金属陶瓷电极末端短于陶瓷电极管末端,再在末端熔化玻璃焊料封盖金属陶瓷电极以防止氧化。
该金属引线由高抗卤化的铬基、镍基、铪基、铼基或IrPt特种合金或NiAl金属间化合物或ZrC、NbC、TaC、HfC、WC制成。
同时,本发明提供了一种共烧封接高效陶瓷灯的制备方法,陶瓷金属电极的末端与电极管对应末端通过局部热源共烧方法完成封接,该局部热源共烧方法包括低温预热,然后急速加热至共烧温度;其中低温预热温度范围200-1000℃,时间1-5秒;急速加热温度在1600℃以上直至金属陶瓷电极外表面和电极管内表面熔化,以完成共烧,时间0.3~2秒以内。本方案通过低温预热、急速加热的处理方法可以有效减少对材料的热冲击,避免陶瓷的微裂、变形和积蓄应力。
该方法优点包括:a、电极管与金属陶瓷共烧产生的结合力一般比通过焊料产生的结合力要高,能提高气密性;b、没有与卤化物反应的玻璃焊料;c、膨胀系数更匹配。
具体地,局部热源为等离子体弧,激光,聚焦红外灯或光纤灯。
与现有技术相比,本发明的有益效果在于:
1、陶瓷金属电极与电极管通过共烧完成封接,能有效避免放焊料的腐蚀,使气密性更佳;
2、比起用焊料的封接方法,共烧的电弧管与陶瓷金属电极,其膨胀系数更为匹配。
附图说明
图1 为现有技术焊料封接的陶瓷灯的结构示意图;
图2 为本发明共烧封接高效陶瓷灯实施例1的结构示意图;
图3 为本发明共烧封接高效陶瓷灯实施例2的结构示意图
具体实施方式
以下结合实施例及附图对本发明进行详细的描述。
实施例1
如图2所示,本发明公开了一种共烧封接高效陶瓷灯, 其包括放电腔11及设于放电腔11端部的电极管12,电极管12内插装有陶瓷金属电极13,陶瓷金属电极13靠近放电腔11的一端连接有钨电极14,其中,陶瓷金属电极13与电极管12通过共烧完成封接。
本实施例中,陶瓷金属电极13末端与电极管12对应部位完成共烧封接。当然,该陶瓷金属电极13也可与整个电极管12完成共烧封接。
该陶瓷金属电极13外径与电极管12内径相匹配,比起用焊料的封接方法,共烧的电弧管与陶瓷金属电极的接触区域可以做到微间隙,甚至是零间隙。
该陶瓷金属电极13材料的膨胀系数与电弧管12材料的膨胀系数相匹配。陶瓷金属电极材料与电弧管材料的匹配程度优于焊料与陶瓷金属电极,和焊料与电弧管的匹配程度。这样一来,当陶瓷金属电极13受热膨胀时,能避免由于电极管12或陶瓷金属电极13的膨胀系数不一致,而导致的电极管12破裂或使存在电极管12与陶瓷金属电极13之间存在间隙。而现有技术中,焊料与电弧管、陶瓷金属电极的材料性质差异较大,其匹配程度也较差,容易造成电极管的破裂或间隙的产生。
本实施例中,该陶瓷金属电极13由氧化铝、氧化钇、镁铝尖晶石、钇铝石榴石和金属:钨、钼、铬、钽、铌、钒、铪、锆、钛中的至少一种材料混合,得到金属包覆的难熔氧化物颗粒,金属的质量分数大于或等于40%,且小于或等于60%;该放电腔11及电极管12由透明透光陶瓷构成,透明透光陶瓷为氧化铝等。
本实施例中,该金属陶瓷电极13的末端伸出电极管12,并直接作为金属引线。
同时,本发明还公开了一种共烧封接高效陶瓷灯的制备方法,其中,陶瓷金属电极的末端与电极管对应末端通过局部热源共烧方法完成封接,该局部热源共烧方法包括低温预热,然后急速加热至共烧温度;其中低温预热温度范围200-1000℃,时间1-5秒;急速加热温度在1600℃以上直至金属陶瓷电极外表面和电极管内表面熔化,以完成共烧,时间0.3~2秒以内。
该共烧封接高效陶瓷灯通过二次封接完成,一封:由于没有药丸和汞的存在,可以用传统的加热炉方法完成。二封:由于有药丸和汞的存在,要用局部加热方法。局部加热可以用发热体如石墨,或金属加热,也可以是电弧如氩气电弧,或聚焦红外灯,或光纤传输红外光源,或者是激光如二氧化碳激光器,YAG激光器,光纤激光器,半导体激光器等。
实施例2
本实施例与实施例1的结构类似,其区别在于,该金属引线为单独的部件,如图3所示,该金属陶瓷电极13末端还接有一段防氧化的金属引线15,且电极管12末端与金属陶瓷电极13末端之间还设有一焊接槽16,该金属引线15穿过焊接槽16伸出电极管12外,该焊接槽16用于填充玻璃焊料。其中,金属引线15的直径较金属陶瓷电极13的直径小。
上述方案中,为了防止金属陶瓷电极13氧化,在金属陶瓷电极13末端接上防氧化的金属引线15,而且金属陶瓷电极13末端短于电极管12末端,再在末端熔化玻璃焊料封盖金属陶瓷电极13以防止氧化。
进一步地,该金属引线15由高抗卤化的铬基、镍基、铪基、铼基或IrPt特种合金或NiAl金属间化合物或ZrC、NbC、TaC、HfC、WC制成。

Claims (10)

  1. 一种共烧封接高效陶瓷灯, 其包括放电腔及设于放电腔端部的电极管,电极管内插装有陶瓷金属电极,陶瓷金属电极靠近放电腔的一端连接有钨电极,其特征在于,陶瓷金属电极与电极管通过共烧完成封接。
  2. 根据权利要求1所述的共烧封接高效陶瓷灯,其特征在于,陶瓷金属电极与整个电极管完成共烧封接。
  3. 根据权利要求1所述的共烧封接高效陶瓷灯,其特征在于,陶瓷金属电极末端与电极管对应部位完成共烧封接。
  4. 根据权利要求1所述的共烧封接高效陶瓷灯,其特征在于,该陶瓷金属电极外径与电极管内径相匹配。
  5. 根据权利要求1所述的共烧封接高效陶瓷灯,其特征在于,该陶瓷金属电极材料的膨胀系数与电极管材料的膨胀系数相匹配。
  6. 根据权利要求5所述的共烧封接高效陶瓷灯,其特征在于,该陶瓷金属电极由氧化铝、氧化钇、镁铝尖晶石、钇铝石榴石和金属:钨、钼、铬、钽、铌、钒、铪、锆、钛中的至少一种材料混合,得到金属包覆的难熔氧化物颗粒,金属的质量分数大于或等于40%,且小于或等于60%;该放电腔及电极管由透明透光陶瓷构成。
  7. 根据权利要求6所述的共烧封接高效陶瓷灯,其特征在于,该金属陶瓷电极的末端伸出电极管,并直接作为金属引线;或者,该金属陶瓷电极末端还接有一段防氧化的金属引线,且电极管末端与金属陶瓷电极末端之间还设有一焊接槽,该金属引线穿过焊接槽伸出电极管外,该焊接槽用于填充玻璃焊料。
  8. 根据权利要求7所述的共烧封接高效陶瓷灯,其特征在于,该金属引线由高抗卤化的铬基、镍基、铪基、铼基或IrPt特种合金或NiAl金属间化合物或ZrC、NbC、TaC、HfC、WC制成。
  9. 一种权利要求1所述的共烧封接高效陶瓷灯的制备方法,其特征在于,陶瓷金属电极的末端与电极管对应末端通过局部热源共烧方法完成封接,该局部热源共烧方法包括低温预热,然后急速加热至共烧温度;其中低温预热温度范围200-1000℃,时间1-5秒;急速加热温度在1600℃以上直至金属陶瓷电极外表面和电极管内表面熔化,以完成共烧,时间0.3~2秒以内。
  10. 根据权利要求9所述的制备方法,其特征在于,该局部热源为等离子体弧,激光,聚焦红外灯或光纤灯。
PCT/CN2010/078257 2010-10-14 2010-10-29 共烧封接陶瓷灯及其制备方法 WO2012048477A1 (zh)

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