WO2012039551A3 - 퍼즐형 인쇄회로기판 - Google Patents

퍼즐형 인쇄회로기판 Download PDF

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Publication number
WO2012039551A3
WO2012039551A3 PCT/KR2011/005985 KR2011005985W WO2012039551A3 WO 2012039551 A3 WO2012039551 A3 WO 2012039551A3 KR 2011005985 W KR2011005985 W KR 2011005985W WO 2012039551 A3 WO2012039551 A3 WO 2012039551A3
Authority
WO
WIPO (PCT)
Prior art keywords
puzzle
circuit board
printed circuit
type printed
sub
Prior art date
Application number
PCT/KR2011/005985
Other languages
English (en)
French (fr)
Other versions
WO2012039551A2 (ko
Inventor
민경환
Original Assignee
주식회사 미르엠케이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 미르엠케이 filed Critical 주식회사 미르엠케이
Priority to CN201180045229.1A priority Critical patent/CN103120036B/zh
Publication of WO2012039551A2 publication Critical patent/WO2012039551A2/ko
Publication of WO2012039551A3 publication Critical patent/WO2012039551A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Telephone Set Structure (AREA)
  • Toys (AREA)

Abstract

본 발명은 복수의 측면들 중 적어도 하나의 측면에는 한 개 이상의 함입된 삽입홈이 형성되고, 삽입홈에는 상호 대향되는 면 중에 적어도 한 면에 가이드홈이 형성되는 제 1 서브PCB; 및 측면에 가이드홈과 대응되는 돌기가 형성되고, 가이드홈과 돌기가 결합되어 삽입홈 내부로 슬라이딩되도록 삽입되는 제 2 서브PCB;를 포함하여 구성되는 퍼즐형 인쇄회로기판에 관한 것이다. 본 발명에 따른 퍼즐형 인쇄회로기판은 기능별로 블록화된 서브PCB들에는 돌기와 걸림부를 구비함으로써 서브PCB들을 서로 끼워 맞출 때 체결이 견고해지기 때문에 인쇄회로기판이 수평 또는 수직방향으로 분리되는 것을 방지할 수 있는 효과가 있다.
PCT/KR2011/005985 2010-09-20 2011-08-14 퍼즐형 인쇄회로기판 WO2012039551A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201180045229.1A CN103120036B (zh) 2010-09-20 2011-08-14 拼接式印刷电路基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100092470A KR101026529B1 (ko) 2010-09-20 2010-09-20 퍼즐 ｐｃｂ
KR10-2010-0092470 2010-09-20

Publications (2)

Publication Number Publication Date
WO2012039551A2 WO2012039551A2 (ko) 2012-03-29
WO2012039551A3 true WO2012039551A3 (ko) 2012-05-18

Family

ID=44049517

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/005985 WO2012039551A2 (ko) 2010-09-20 2011-08-14 퍼즐형 인쇄회로기판

Country Status (3)

Country Link
KR (1) KR101026529B1 (ko)
CN (1) CN103120036B (ko)
WO (1) WO2012039551A2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101402617B1 (ko) 2013-03-18 2014-06-03 (주)지로엠케이 솔더링 타입 하이브리드 인쇄회로기판
CN107770956A (zh) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 电路板结构
CN107484335A (zh) * 2017-08-01 2017-12-15 杭州乐荣电线电器有限公司 一种测试双密度qsfp接口的测试pcb板
CN107645832A (zh) * 2017-09-27 2018-01-30 王朝 一种高可靠性pcb续接结构
CN114828404B (zh) * 2021-01-21 2024-04-12 欣兴电子股份有限公司 电路板结构与拼接式电路板
CN113380474A (zh) * 2021-05-17 2021-09-10 贵州航天电器股份有限公司 一种绝缘体及电连接器
CN113438800B (zh) * 2021-06-29 2023-04-07 展讯通信（上海）有限公司 终端设备
CN113597096B (zh) * 2021-08-24 2022-11-15 深圳市博敏电子有限公司 T型孔树脂塞孔板及其制备方法
WO2023168412A1 (en) * 2022-03-04 2023-09-07 Weathered Security, Llc Multi-dock printed circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6288334U (ko) * 1985-11-22 1987-06-05
JPS6350184U (ko) * 1986-09-19 1988-04-05
JPS63188955U (ko) * 1987-05-27 1988-12-05
JPH01145170U (ko) * 1988-03-28 1989-10-05
JPH0310569U (ko) * 1989-06-15 1991-01-31

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9008930D0 (en) * 1990-04-20 1990-06-20 Int Computers Ltd Printed circuit board assemblies
JPH0590727A (ja) * 1991-09-30 1993-04-09 Toyo Commun Equip Co Ltd メイン基板に対するサブ基板の取付け構造
JPH05251834A (ja) * 1992-03-05 1993-09-28 Fujitsu Ltd 配線用複合基板
MY114883A (en) * 1994-11-14 2003-02-28 Ibm Method and apparatus for providing a remotely located outrigger card electrically coupled to a control card
JPH10209594A (ja) 1997-01-17 1998-08-07 Fuji Photo Optical Co Ltd フレキシブルプリント回路基板と硬質プリント回路基板との接続構造
TW468927U (en) * 1999-12-23 2001-12-11 Asustek Comp Inc Computer motherboard and its expanding plate for increasing the expanding slots
DE10109571A1 (de) * 2001-02-28 2002-09-05 Fujitsu Siemens Computers Gmbh Leiterplattenanordnung
JP2003317830A (ja) * 2002-04-25 2003-11-07 Nec Corp プリント基板間の接続構造
TW586253B (en) * 2003-04-25 2004-05-01 Quanta Comp Inc A PCB joint structure and manufacturing method thereof
KR101103920B1 (ko) * 2005-05-12 2012-01-12 엘지전자 주식회사 인쇄회로기판의 연결 구조 및 이를 가지는 인쇄회로기판조립체
US20100134995A1 (en) * 2008-12-02 2010-06-03 Raytheon Company Electrical Interconnection System

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6288334U (ko) * 1985-11-22 1987-06-05
JPS6350184U (ko) * 1986-09-19 1988-04-05
JPS63188955U (ko) * 1987-05-27 1988-12-05
JPH01145170U (ko) * 1988-03-28 1989-10-05
JPH0310569U (ko) * 1989-06-15 1991-01-31

Also Published As

Publication number Publication date
CN103120036A (zh) 2013-05-22
CN103120036B (zh) 2015-09-02
KR101026529B1 (ko) 2011-04-01
WO2012039551A2 (ko) 2012-03-29

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