WO2012039103A1 - 封止部材およびこれを用いたコンデンサ - Google Patents
封止部材およびこれを用いたコンデンサ Download PDFInfo
- Publication number
- WO2012039103A1 WO2012039103A1 PCT/JP2011/005041 JP2011005041W WO2012039103A1 WO 2012039103 A1 WO2012039103 A1 WO 2012039103A1 JP 2011005041 W JP2011005041 W JP 2011005041W WO 2012039103 A1 WO2012039103 A1 WO 2012039103A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- barrier layer
- gas barrier
- rubber material
- sealing member
- hole
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 85
- 239000003990 capacitor Substances 0.000 title claims abstract description 41
- 229920001971 elastomer Polymers 0.000 claims abstract description 88
- 230000004888 barrier function Effects 0.000 claims abstract description 82
- 239000000463 material Substances 0.000 claims abstract description 79
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 12
- 230000035699 permeability Effects 0.000 claims abstract description 8
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000003792 electrolyte Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 230000035882 stress Effects 0.000 description 7
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920005549 butyl rubber Polymers 0.000 description 3
- 230000006355 external stress Effects 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003811 curling process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- -1 polyethylene naphthalate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
Definitions
- the present invention relates to capacitors used in various electronic devices, electric devices, industrial devices, automotive devices and the like, and more particularly to a capacitor using an electrolytic solution and a sealing member used therefor.
- FIG. 10 is a cross-sectional view of a conventional aluminum electrolytic capacitor.
- the capacitor element 2 is accommodated in the metal case 3 after being impregnated with the electrolytic solution.
- a pair of lead terminals 4 and 5 drawn out of the capacitor element 2 penetrates the lead holes 7 of the sealing member 6A disposed in the opening of the metal case 3 and is drawn out to the outside. Further, the sealing member 6A is pressed by the drawing process in the vicinity of the opening of the metal case 3 and the curling process of the opening end, and seals the opening of the metal case 3.
- a rubber material 8 made of butyl rubber generally having low gas permeability is used as the sealing member 6A. Sealing with a material having low gas permeability makes it difficult for the sealing member 6A to permeate even if the solvent component of the electrolytic solution is vaporized, so that it is possible to suppress the deterioration of the electrical characteristics of the capacitor.
- FIG. 11 is a cross-sectional view of another conventional aluminum electrolytic capacitor.
- a film 9 made of a fluorine resin having a gas permeability lower than that of the rubber material 8 is inserted at the center of the rubber material 8 in the thickness direction. A configuration to enhance the sealing performance has been considered.
- the adhesion between the film 9 and the rubber material 8 is low.
- the film 9 peels off from the rubber material 8 and a sufficient repulsive stress does not occur in the sealing member 6B.
- the sealing performance may be lowered.
- the film 9 peels from the rubber material 8 due to external stress when drawing the metal case 3 from the outer periphery of the sealing member 6B or inserting the lead terminals 4 and 5, and a gap is formed. Thereby, the repulsive stress generated in the sealing member 6B is reduced, and a gap is generated between the metal case 3 and the sealing member 6B or the lead terminals 4 and 5 and the sealing member 6B. Then, the electrolytic solution is easily evaporated from the gap, and the sealing performance is lowered.
- Patent Documents 1 and 2 are known as prior art documents related to the invention of this application.
- the sealing member of the present invention has a gas barrier layer in which lead holes and through holes are formed, and a rubber material sandwiching the gas barrier layer.
- the gas barrier layer is made of a material having lower gas permeability than the rubber material.
- the through holes are filled with a rubber material.
- FIG. 1 is a cross-sectional view of a capacitor according to a first embodiment of the present invention.
- FIG. 2A is a schematic top view of a sealing member according to Embodiment 1 of the present invention.
- FIG. 2B is a cross-sectional view taken along line 2B-2B of FIG. 2A.
- FIG. 2C is a cross-sectional view taken along line 2C-2C of FIG. 2A.
- FIG. 3 is a top view of a resin film used for the gas barrier layer of the sealing member in Embodiment 1 of the present invention.
- FIG. 4A is a schematic cross sectional view showing a manufacturing step of the sealing member in the first embodiment of the present invention.
- FIG. 4A is a schematic cross sectional view showing a manufacturing step of the sealing member in the first embodiment of the present invention.
- FIG. 4B is a schematic cross sectional view showing the state of primary crosslinking of the rubber material in Embodiment 1 of the present invention.
- FIG. 4C is a schematic cross-sectional view showing the state of secondary crosslinking of the rubber material in Embodiment 1 of the present invention.
- FIG. 5 is a schematic top view of the sealing member in the manufacturing process according to Embodiment 1 of the present invention.
- FIG. 6 is a characteristic diagram showing the gas permeation amount of the sealing member in Embodiment 1 of the present invention.
- FIG. 7A is a schematic top view of a sealing member according to Embodiment 2 of the present invention.
- 7B is a cross-sectional view taken along line 7B-7B of FIG. 7A.
- FIG. 7C is a cross-sectional view taken along line 7C-7C of FIG. 7A.
- FIG. 8 is a top view of a resin film used for the gas barrier layer of the sealing member in Embodiment 2 of the present invention.
- FIG. 9 is a cross-sectional view of a capacitor in a third embodiment of the present invention.
- FIG. 10 is a cross-sectional view of a conventional aluminum electrolytic capacitor.
- FIG. 11 is a cross-sectional view of another conventional aluminum electrolytic capacitor.
- FIG. 1 is a cross-sectional view of a capacitor according to a first embodiment of the present invention.
- Electrolytic capacitor 10 includes a capacitor element 11 formed by winding a pair of positive and negative electrode foils through a separator, an electrolytic solution impregnated in capacitor element 11, and a bottomed cylindrical case containing capacitor element 11 and the electrolytic solution. 12 and a sealing member 13 sealing the opening of the case 12.
- the case 12 is formed of a metal such as aluminum or stainless steel.
- the case 12 is cylindrical with a diameter of 10 mm and a height of 10 mm.
- the thickness of the sealing member 13 is about 2 mm.
- water, ethylene glycol, ⁇ -butyrolactone or the like can be used as a solvent, and boric acid, adipic acid, phthalic acid or the like can be used as an electrolyte.
- the positive and negative electrode foils are connected to the lead terminals 14 and 15, respectively.
- the lead terminals 14 and 15 pass through the sealing member 13 and are drawn to the outside.
- the sealing member 13 is made of a rubber material 17 in which the gas barrier layer 16 is interposed in the middle in the thickness direction. That is, the sealing member 13 has the gas barrier layer 16 in which the through holes 19 and the lead holes 20 are formed, and the rubber material 17 for sandwiching the gas barrier layer 16.
- the gas barrier layer 16 is made of a material having lower gas permeability than the rubber material 17, and the through holes 19 are filled with the rubber material 17.
- Two lead holes 20 are formed.
- the lead terminals 14, 15 are inserted into the respective lead holes 20.
- the lead terminals 14 and 15 are not inserted into the through holes 19.
- the sealing member 13 After the sealing member 13 is disposed at the opening of the case 12, the outer periphery of the case 12 is drawn inward to form a protruding portion 18 projecting inward.
- the open end of the case 12 is curled and the capacitor element 11 is sealed in the case 12.
- the gas barrier layer 16 is disposed at the center of the sealing member 13 horizontally to the opening of the case 12.
- the gas barrier layer 16 of the present embodiment is made of a resin film such as polyphenylene sulfide or polyethylene naphthalate and has a thickness of 0.02 mm or more and 0.2 mm or less.
- a vapor deposition film such as an aluminum vapor deposition film or a silica vapor deposition film, or a metal film made of aluminum foil or copper foil may be used as the gas barrier layer 16.
- the rubber material 17 may be butyl rubber, silicone rubber, fluororubber, ethylene propylene rubber, nitrile rubber, or the like.
- the gas barrier layer 16 made of resin or metal is less likely to be elastically deformed than rubber, and therefore, preferably 30% or less of the total thickness of the sealing member 13. Further, the diameter of the gas barrier layer 16 is substantially equal to the diameter of the rubber material 17.
- FIG. 2A is a schematic top view of the sealing member 13.
- FIG. 2B is a cross-sectional view taken along line 2B-2B of FIG. 2A.
- FIG. 2C is a cross-sectional view taken along line 2C-2C of FIG. 2A.
- a plurality of through holes 19 and two lead holes 20 are formed in the gas barrier layer 16.
- the through holes 19 and the lead holes penetrate the gas barrier layer 16 in the thickness direction.
- the shape and size of the through holes 19 are not limited to those in the present embodiment, but if the total area of the openings of the through holes 19 is too large, the effect of suppressing the permeation of gas described later will not be sufficient. Therefore, the size and number of the through holes 19 are set such that the area of the horizontal cross section of the gas barrier layer 16 (excluding the areas of the through holes 19 and the lead holes 20) is 50% or more of the area of the horizontal cross section of the rubber material 17 Is preferred. This is because a certain area is required to suppress gas permeation as the gas barrier layer 16.
- the inner walls of the two lead holes 20 are covered with a rubber material 17, and the inside is hollow.
- the cavity is also formed in the rubber material 17.
- the lead terminals 14 and 15 shown in FIG. 1 pass through the lead holes 20, pass through the sealing member 13 and are drawn to the outside. Since the inner wall of the lead hole 20 is covered with the rubber material 17, the outer periphery of the lead terminals 14 and 15 in the lead hole 20 is entirely covered with the rubber material 17. As a result, the stress load from the lead terminals 14 and 15 is absorbed by the rubber material 17, and the gas barrier layer 16 in the vicinity of the lead terminals 14 and 15 becomes difficult to peel off.
- a rubber material 17 is filled in the through hole 19 into which the lead terminals 14 and 15 are not inserted.
- the through holes 19 may be formed on the outer periphery of the gas barrier layer 16.
- the through holes 19 formed on the outer periphery of the gas barrier layer 16 are covered with the rubber material 17. Therefore, a part of the outer periphery of the gas barrier layer 16 is filled with the rubber material 17.
- the upper rubber material 17A and the lower rubber material 17B in the through hole 19 are also crosslinked on the outer periphery of the sealing member 13 The layer 16 is less likely to peel off from the rubber material 17.
- the rubber material 17 covers 50% or more and less than 100% of the outer periphery of the gas barrier layer 16. Thereby, even if external stress is applied from the side surface of the case 12, peeling of the gas barrier layer 16 can be suppressed.
- FIG. 3 is a top view of a resin film used for the gas barrier layer of the sealing member in Embodiment 1 of the present invention.
- FIG. 4A is a schematic cross sectional view showing a manufacturing step of the sealing member in the first embodiment of the present invention.
- FIG. 4B is a schematic cross sectional view showing the state of primary crosslinking of the rubber material in Embodiment 1 of the present invention.
- FIG. 4C is a schematic cross-sectional view showing the state of secondary crosslinking of the rubber material in Embodiment 1 of the present invention.
- FIG. 5 is a schematic top view of the sealing member in the manufacturing process according to Embodiment 1 of the present invention.
- the through holes 19 and the lead holes 20 are formed on the resin film 21 to be the gas barrier layer 16 or a metal film by punching or die molding.
- the uncrosslinked lower rubber sheet 24 and the gas barrier layer 16 to be the lower rubber material 17B are sequentially stacked.
- the pin 22 is disposed so as to pass through the inside of the lead hole 20 of the resin film 21.
- the lower mold 23 and the upper mold 26 are combined and heated to crosslink the upper rubber sheet 25 and the lower rubber sheet 24 (primary crosslinking).
- the upper rubber sheet 25 and the lower rubber sheet 24 respectively enter the inside of the through hole 19 and are connected via the through hole 19.
- the lower mold 23 and the upper mold 26 are removed, and heating is performed again to crosslink the upper rubber sheet 25 and the lower rubber sheet 24 (secondary crosslinking).
- the upper rubber sheet 25 and the lower rubber sheet 24 are strongly chemically bonded and integrated in the through holes 19 of the resin film 21. Therefore, the adhesion between the resin film 21 and the upper rubber sheet 25 and the lower rubber sheet 24, that is, the adhesion between the gas barrier layer 16 of the sealing member 13 shown in FIG. 1, and the upper rubber material 17A and the lower rubber material 17B. Increase.
- the plurality of sealing members 13 are integrally formed. When this is punched into pieces, the sealing member 13 is obtained.
- FIG. 6 is a characteristic diagram showing the gas permeation amount of the sealing member in Embodiment 1 of the present invention. The relationship between the amount of gas permeation and time of the sealing member 13 of this embodiment and the conventional sealing member is shown.
- a conventional example as shown in FIG. 10 as Comparative Example 1, using a sealing member 6A of only the rubber material 8 without the gas barrier layer 16, as a Comparative Example 2 with a gas barrier layer without a through hole 19 as shown in FIG. A sealing member in which a certain film 9 was sandwiched was used.
- the characteristic of the present embodiment is indicated by a solid line
- the characteristic of comparative example 1 is indicated by a broken line
- the characteristic of comparative example 2 is indicated by an alternate long and short dash line.
- the amount of gas permeation was calculated from the amount of decrease of the electrolyte (the solvent is ⁇ -butyrolactone) over time by charging a capacitor using each sealing member into a high temperature tank at 135 ° C.
- the present embodiment having the gas barrier layer 16 and the comparative example 2 can reduce the gas permeation amount as compared with the comparative example 1 having no gas barrier layer 16.
- the samples in this case are one by one.
- the peeling test of the gas barrier layer was performed using the sealing member in the present embodiment and the comparative example 2.
- each sealing member was immersed in ⁇ -butyrolactone and left at 135 ° C. for 24 hours to observe the interface between the gas barrier layer and the rubber material.
- Comparative Example 2 the exfoliation occurred in four out of five samples, whereas in the present embodiment, no exfoliation occurred in the five samples. Therefore, in the sealing member 13 of the present embodiment, the gas permeation amount is low, and the gas barrier layer 16 is not easily peeled off.
- the sample in which peeling occurred in Comparative Example 2 also increases the gas permeation amount in FIG. That is, in Comparative Example 2, the amount of gas transmission can be reduced when peeling does not occur, but variation is large because the adhesion between the film 9 and the rubber material 8 is low. Therefore, there is a high possibility that peeling will occur, and if peeling occurs, the amount of gas permeation will increase.
- the gas barrier layer 16 peels off from the rubber material 17, a gap is formed due to a reduction in repulsive stress, the electrolytic solution is easily evaporated from the gap, and the sealing performance is reduced.
- the upper rubber material 17 A and the lower rubber material 17 B are crosslinked in the through holes 19 to suppress peeling between the gas barrier layer 16 and the rubber material 17. it can. Therefore, the dry-up of the electrolytic solution can be suppressed, and the capacitor 10 has high reliability in the long term even when used under high temperature conditions.
- the outer circumferences of the lead terminals 14 and 15 are covered with the rubber material 17, it is possible to reduce the stress load on the gas barrier layer 16 when the lead terminals 14 and 15 are inserted. Therefore, peeling between the gas barrier layer 16 and the rubber material 17 in the vicinity of the lead terminals 14 and 15 can be suppressed. Therefore, the leakage of the electrolytic solution transmitted through the lead terminals 14 and 15 can be suppressed, and high reliability can be realized.
- FIG. 7A is a schematic top view of a sealing member according to Embodiment 2 of the present invention.
- 7B is a cross-sectional view taken along line 7B-7B of FIG. 7A.
- FIG. 7C is a cross-sectional view taken along line 7C-7C of FIG. 7A.
- FIG. 8 is a top view of a resin film used for the gas barrier layer of the sealing member in Embodiment 2 of the present invention.
- the main difference between the present embodiment and the first embodiment is the configuration of the through hole 19 as shown in FIG. 7A. Description of the same configuration and effects as those of the first embodiment will be omitted. That is, in the present embodiment, the sealing member 33 is used instead of the sealing member 13 of the capacitor 10 in FIG. The sealing member 13 and the sealing member 33 differ in the configuration of the through hole 19 of the gas barrier layer 16.
- the shape and position of the through hole 19 are designed such that 75% or more of the outer periphery of the gas barrier layer 16 is covered with the rubber material 17. Thereby, the outer periphery of the gas barrier layer 16 is covered with the rubber material 17 also in any cross section of FIG. 7B and FIG. 7C.
- the gas barrier layer 16 In order to cover the entire outer periphery of the gas barrier layer 16 with the rubber material 17, the gas barrier layer 16 smaller than the diameter of the rubber material 17 is used, and the gas barrier layer 16 divided into individual sealing members 33 is inserted. Need to lower productivity. Therefore, in the present embodiment, the side surface outer periphery of the gas barrier layer 16 is covered with the rubber material 17 as wide as possible, and a through hole as shown in FIG. 8 is formed in order to collectively form the plurality of sealing members 33.
- a resin film 121 in which 19 is formed is used.
- the resin film 121 has a shape in which a part of the resin film 121 is left as the connecting bar 27 and the individual gas barrier layers 16 are integrated.
- the outer periphery of each of the sealing members 33 other than the connecting bar 27 of the gas barrier layer 16 is made of a rubber material. With such a configuration, peeling at the outer periphery of the sealing member 33 can be further suppressed.
- the outer periphery of the gas barrier layer 16 is covered with the rubber material 17, but by covering at least 50% or more, external stress from the side such as drawing of the case 12 may be applied. And peeling of the gas barrier layer 16 can be suppressed.
- FIG. 9 is a cross-sectional view of capacitor 50 in accordance with the third exemplary embodiment of the present invention.
- the main difference between the present embodiment and the first embodiment is the position of the gas barrier layer 16.
- the gas barrier layer 16 is disposed at the center in the thickness direction of the sealing member 13, whereas the sealing member 43 is located below the center (Z-Z line) in the thickness direction (on the capacitor element 11 side) It is arranged to be biased). That is, the outer peripheral end of the gas barrier layer 16 is disposed offset from the center in the thickness direction of the sealing member 43, and the plane including the forefront portion 30 of the protrusion 18 and the plane connecting the outer peripheral end of the gas barrier layer 16 are It is placed out of alignment.
- the gas barrier layer 16 In the sealing member 43, stress is likely to be concentrated on a portion of the protruding portion (protruding portion 18) of the case 12 which abuts on the distal end portion 30 by drawing processing. Therefore, if the outer peripheral end of the gas barrier layer 16 is on the same plane as the distal end portion 30 of the projecting portion 18, the gas barrier layer 16 receives a large stress from the side and is easily peeled off. Since the foremost end 30 of the protrusion 18 often abuts on the center of the sealing member 43 in the thickness direction, the gas barrier layer 16 can be displaced from the center of the sealing member 43 in the thickness direction. 16 peeling can be suppressed. In the present embodiment, the gas barrier layer 16 is biased downward from the center, but may be biased upward.
- only the outer peripheral end of the gas barrier layer 16 may be curved or bent downward or upward so as not to be in the same plane as the foremost end 30 of the projection 18. Peeling can be suppressed by shifting at least the outer peripheral end from the foremost end 30 of the protrusion 18.
- the position of the gas barrier layer 16 is protruded so that the foremost end 30 of the projecting portion 18 and the gas barrier layer 16 do not collide. It may be displaced upward or downward from the leading end 30 of the portion 18.
- the electrolytic capacitors 10 and 50 have been exemplified as the capacitors, but the present invention can be applied to capacitors such as electric double layer capacitors.
- gas barrier layer Although only one gas barrier layer is provided in the first to third embodiments, a plurality of gas barrier layers may be provided.
- the capacitor according to the present invention can suppress dry-up by enhancing the sealing performance of the sealing member. Therefore, it is useful as a capacitor which is required to be used in a high temperature environment.
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Abstract
Description
図1は、本発明の実施の形態1におけるコンデンサの断面図である。電解コンデンサ10は、正負一対の電極箔を、セパレータを介して巻回したコンデンサ素子11と、コンデンサ素子11に含浸された電解液と、コンデンサ素子11および電解液を収容した有底筒状のケース12と、ケース12の開口部を封止した封止部材13とを有する。
図7Aは、本発明の実施の形態2における封止部材の上面模式図である。図7Bは、図7Aの7B-7B線における断面図である。図7Cは、図7Aの7C-7C線における断面図である。図8は、本発明の実施の形態2における封止部材のガスバリア層に用いる樹脂フィルムの上面図である。
図9は、本発明の実施の形態3におけるコンデンサ50の断面図である。本実施の形態と実施の形態1との主な違いは、ガスバリア層16の位置である。実施の形態1では封止部材13の厚み方向の中央にガスバリア層16が配置されているのに対し、封止部材43では厚み方向の中央(Z―Z線)よりも下方(コンデンサ素子11側)に偏るように配置されている。すなわちガスバリア層16の外周端部は封止部材43の厚み方向の中央からずれて配置されており、突出部18の最先端部30を含む平面と、ガスバリア層16の外周端部を結ぶ平面がずれて配置されている。
11 コンデンサ素子
12 ケース
13,33,43 封止部材
14,15 リード端子
16 ガスバリア層
17 ゴム材
17A 上のゴム材
17B 下のゴム材
18 突出部
19 貫通孔
20 リード孔
21,121 樹脂フィルム
22 ピン
23 下金型
24 下ゴムシート
25 上ゴムシート
26 上金型
27 つなぎ桟
30 最先端部
Claims (9)
- リード孔および貫通孔が形成されたガスバリア層と
前記ガスバリア層を挟み込むゴム材を有し、
前記ガスバリア層は、前記ゴム材よりもガス透過性の低い材料からなり、
前記貫通孔に前記ゴム材が充填されている
封止部材。 - 前記ガスバリア層の外周の50%以上が前記ゴム材で被覆されている
請求項1に記載の封止部材。 - 前記リード孔および前記貫通孔を除く前記ガスバリア層の水平断面の面積は、前記ゴム材の水平断面の面積の50%以上である
請求項1に記載の封止部材。 - 前記ガスバリア層の外周端部は前記封止部材の厚み方向の中央からずれて配置されている
請求項1に記載の封止部材。 - 前記ゴム材は、前記貫通孔内で架橋している
請求項1に記載の封止部材。 - 前記リード孔は前記ゴム材を貫通し、前記リード孔の内壁が前記ゴム材で被覆されている
請求項1に記載の封止部材。 - コンデンサ素子と、
前記コンデンサ素子に含浸された電解液と、
前記コンデンサ素子および前記電解液を収容した有底筒状のケースと、
リード孔および貫通孔が形成されたガスバリア層と
前記ガスバリア層を挟み込むゴム材を有した
前記ケースの開口部を封止する封止部材と、
を備え、
前記ガスバリア層は、前記ゴム材よりもガス透過性の低い材料からなり、
前記貫通孔に前記ゴム材が充填されている、
コンデンサ。 - 前記ケースは、内側へ突出する突出部を有し、
前記突出部の最先端部を含む平面と、前記ガスバリア層の外周端部を結ぶ平面がずれて配置されている請求項7に記載のコンデンサ。 - 正負一対の電極箔とそれぞれ接続されるリード端子をさらに有し、前記リード孔は二つ形成され、
前記リード端子は、前記リード孔を通り、前記封止部材を貫通して外部に引き出され、
前記リード孔内において、前記リード端子の外周は、前記ゴム材で覆われている
請求項7に記載のコンデンサ。
Priority Applications (3)
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JP2012534917A JPWO2012039103A1 (ja) | 2010-09-22 | 2011-09-08 | 封止部材およびこれを用いたコンデンサ |
US13/818,020 US20130148267A1 (en) | 2010-09-22 | 2011-09-08 | Sealing member and capacitor using same |
CN2011800449693A CN103119672A (zh) | 2010-09-22 | 2011-09-08 | 密封部件及使用了该密封部件的电容器 |
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JP2010-211773 | 2010-09-22 | ||
JP2010211773 | 2010-09-22 |
Publications (1)
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WO2012039103A1 true WO2012039103A1 (ja) | 2012-03-29 |
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PCT/JP2011/005041 WO2012039103A1 (ja) | 2010-09-22 | 2011-09-08 | 封止部材およびこれを用いたコンデンサ |
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US (1) | US20130148267A1 (ja) |
JP (1) | JPWO2012039103A1 (ja) |
CN (1) | CN103119672A (ja) |
WO (1) | WO2012039103A1 (ja) |
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CN105244178A (zh) * | 2015-10-28 | 2016-01-13 | 王彦博 | 一种超级电容器及其制备方法 |
EP4105955A4 (en) * | 2020-02-14 | 2024-03-27 | Ls Mat Co Ltd | ENERGY STORAGE DEVICE |
KR20210153949A (ko) * | 2020-06-11 | 2021-12-20 | 엘에스머트리얼즈 주식회사 | 에너지 저장장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08293444A (ja) * | 1995-04-24 | 1996-11-05 | Matsushita Electric Ind Co Ltd | チップ形アルミ電解コンデンサの製造方法 |
JPH11162796A (ja) * | 1997-11-28 | 1999-06-18 | Nippon Chemicon Corp | 電解コンデンサとその製造方法 |
JP2001284190A (ja) * | 2000-03-31 | 2001-10-12 | Nippon Chemicon Corp | 固体電解コンデンサ |
JP2009088278A (ja) * | 2007-09-28 | 2009-04-23 | Nippon Chemicon Corp | 電解コンデンサ用封口体及び該封口体を用いた電解コンデンサ |
Family Cites Families (2)
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---|---|---|---|---|
KR20050088284A (ko) * | 2002-11-08 | 2005-09-05 | 니폰 케미콘 가부시키가이샤 | 전해콘덴서 |
WO2006025306A1 (ja) * | 2004-08-30 | 2006-03-09 | Nisshinbo Industries, Inc. | 密閉型蓄電装置 |
-
2011
- 2011-09-08 CN CN2011800449693A patent/CN103119672A/zh active Pending
- 2011-09-08 JP JP2012534917A patent/JPWO2012039103A1/ja not_active Withdrawn
- 2011-09-08 WO PCT/JP2011/005041 patent/WO2012039103A1/ja active Application Filing
- 2011-09-08 US US13/818,020 patent/US20130148267A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08293444A (ja) * | 1995-04-24 | 1996-11-05 | Matsushita Electric Ind Co Ltd | チップ形アルミ電解コンデンサの製造方法 |
JPH11162796A (ja) * | 1997-11-28 | 1999-06-18 | Nippon Chemicon Corp | 電解コンデンサとその製造方法 |
JP2001284190A (ja) * | 2000-03-31 | 2001-10-12 | Nippon Chemicon Corp | 固体電解コンデンサ |
JP2009088278A (ja) * | 2007-09-28 | 2009-04-23 | Nippon Chemicon Corp | 電解コンデンサ用封口体及び該封口体を用いた電解コンデンサ |
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CN103119672A (zh) | 2013-05-22 |
JPWO2012039103A1 (ja) | 2014-02-03 |
US20130148267A1 (en) | 2013-06-13 |
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