WO2012026221A1 - Dispositif de transport de chaleur de type en boucle - Google Patents

Dispositif de transport de chaleur de type en boucle Download PDF

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Publication number
WO2012026221A1
WO2012026221A1 PCT/JP2011/065557 JP2011065557W WO2012026221A1 WO 2012026221 A1 WO2012026221 A1 WO 2012026221A1 JP 2011065557 W JP2011065557 W JP 2011065557W WO 2012026221 A1 WO2012026221 A1 WO 2012026221A1
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WO
WIPO (PCT)
Prior art keywords
liquid
loop
transport device
heat
heat transport
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PCT/JP2011/065557
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English (en)
Japanese (ja)
Inventor
加藤　健次
一法師　茂俊
幸夫 中嶋
孝介 安井
利一 狩田
野田　秀夫
Original Assignee
三菱電機株式会社
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2012530582A priority Critical patent/JPWO2012026221A1/ja
Publication of WO2012026221A1 publication Critical patent/WO2012026221A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Definitions

  • the present invention relates to a heat transport device, and more particularly to a loop heat transport device using a bubble pump that does not require external power.
  • the circulating solution for heat exchange is circulated using the density difference with the density of the circulating solution for heat exchange in the circulating solution transport pipe in the same height section.
  • the high temperature heat transferred from the heating heat exchanger is transported to the sensible heat release heat exchanger and the radiator, and heat is required from the sensible heat release heat exchanger and the radiator. Try to transport heat to another device or low heat source.
  • the heating heat exchanger (evaporator) is made of a block-shaped metal, and a flow path is formed inside the metal block so that the circulating fluid flows in the flow path.
  • a loop heat transport device that has high strength and good heat dissipation characteristics (for example, Patent Document 2).
  • Patent Document 3 there is a cooling system described in Patent Document 3 as a cooling system having a configuration different from that of the loop heat transport device described in Patent Document 1 or Patent Document 2.
  • Patent Document 3 describes a cooling system that transports heat by connecting a heat receiving portion, a bubble pump, a radiator condenser, and a pipe portion in a loop shape.
  • a pipe-shaped bubble pump is provided above the heat receiving portion.
  • the outlet of the bubble pump is arranged to be higher than the liquid level of the radiator in order to prevent the backward flow.
  • the conventional loop heat transport device described in Patent Document 1 is configured with a gas-liquid two-phase fluid feed pipe that feeds and feeds the circulating fluid to and from the heating heat exchanger (evaporator) by piping, There was a problem of low strength.
  • the cooling system described in Patent Document 3 is not clear about the overall detailed structure, but from the drawing, like the one described in Patent Document 1, the cooling system has a structure mainly composed of pipes and is still strong. There is a problem that is low.
  • Patent Document 3 there is also a problem that the liquid is more likely to flow backward than the loop heat transport device described in Patent Document 1 and Patent Document 2. Further, in the loop heat transport device described in Patent Document 1 or Patent Document 2, there is no restriction on the installation position of the radiator, but in the cooling system described in Patent Document 3, the radiator must be installed on the upper part of the device. There is also a restriction that must be done.
  • the conventional loop type heat transport device described in Patent Document 2 is made of a block-shaped metal in which a hole is formed in a metal such as copper, the strength is high and the heat dissipation characteristics are good. There was a problem that the weight was large.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a loop-type heat transport device that is difficult to reverse flow of liquid, is light and has high strength.
  • a plurality of evaporator internal flow paths through which circulating fluid flows from below to above are formed, a metal evaporation plate having a heating element installed outside, and a position below the evaporator internal flow path
  • An evaporator composed of an evaporator header pipe to which a preheating liquid inlet is connected, a radiator having a high temperature liquid inlet, an internal flow path, and a low temperature liquid outlet for the circulating liquid and releasing the heat of the circulating liquid
  • a heat exchanger inlet header having a cryogenic liquid inlet into which the circulating liquid discharged from the cryogenic liquid outlet of the radiator is sent, and preheating in which the circulating liquid is sent to the evaporator header pipe through the preheating liquid channel
  • a heat exchanger outlet header having a liquid outlet, a heat exchanger tube serving as a heat exchanger internal channel connecting the heat exchanger inlet header and the heat exchanger outlet header, and an evaporator located around the heat exchanger tube
  • FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, showing the configuration of the loop heat transport device according to the first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along the line BB in FIG. 1, showing the configuration of the loop heat transport device according to Embodiment 1 of the present invention.
  • It is a partial expanded sectional view which expands and shows the part of the evaporation pipe
  • FIG. 6 is a cross-sectional view taken along the line AA of FIG. 5, showing the configuration of the loop heat transport device according to the second embodiment of the present invention. It is sectional drawing which shows the structure of the loop type heat transport apparatus by Embodiment 3 of this invention.
  • FIG. 8 is a cross-sectional view taken along the line AA in FIG. 7, showing the configuration of the loop heat transport device according to the third embodiment of the present invention. It is sectional drawing which shows the structure of the principal part of the loop type heat transport apparatus by Embodiment 4 of this invention. It is a schematic diagram explaining the effect of the loop type heat transport apparatus by Embodiment 4 of this invention.
  • FIG. 15 is a cross-sectional view taken along the line AA of FIG. 14 showing the configuration of the loop heat transport device according to the seventh embodiment of the present invention. It is sectional drawing which shows the structure of the principal part of the loop type heat transport apparatus by Embodiment 8 of this invention.
  • FIG. 1 is a cross-sectional view showing a configuration of a loop heat transport device according to Embodiment 1 of the present invention
  • FIG. 2 is a cross-sectional view taken along the line AA shown in FIG. 1, and FIG. It is sectional drawing in a -B cross section.
  • the loop heat transport device 1 has an evaporator 2, a radiator 5, and a heat exchanger 12, each of which is connected by a pipe so that the flow path is in a loop shape, and the circulating liquid 25 circulates inside. It is configured to transport heat.
  • the evaporator 2 has an evaporation pipe 3 serving as an evaporator internal flow path inside the evaporation plate 4.
  • the evaporation tube 3 is joined to the evaporation plate 4 using a brazing filler metal or the like.
  • the same number of holes as the number of the evaporation tubes 3 are formed in the evaporation plate 4, and the evaporation tubes 3 are inserted and joined by the fixing material 29. Any configuration that can be fixed is acceptable.
  • the preheating liquid inlet 22 which is the lower end of the evaporation pipe 3 is joined to the evaporator header pipe 23 provided with the same number of holes as the number of the evaporation pipes 3 by using brazing, welding or the like.
  • a plurality of heating elements 24 are provided on the outer surface of the evaporation plate 4.
  • the radiator 5 is connected between a radiator inlet header 7 having a high-temperature liquid inlet 6 and a radiator outlet header 9 having a low-temperature liquid outlet 10 by a radiator internal channel 8.
  • a plurality of radiating fins 11 are provided between them. Note that the radiator 5 is not limited to the shape shown in FIG. 1, and it is sufficient that the heat of the circulating fluid 25 can be released to the outside, and the shape, size, and structure are not particularly limited.
  • the heat exchanger 12 is a cylindrical container in which the heat exchanger inlet header 14, the housing portion 18, and the heat exchanger outlet header 17 are joined.
  • the heat exchanger inlet header 14 and the heat exchanger outlet header 17 exchange heat. They are connected by a plurality of heat transfer tubes 15 that serve as internal flow paths.
  • the heat exchanger inlet header 14 has a cryogenic liquid inlet 13 and is joined to the cryogenic liquid outlet 10 of the radiator 5.
  • the heat exchanger outlet header 17 has a preheating liquid delivery port 16, and is joined to the evaporator header pipe 23 via the preheating liquid channel 21.
  • the container 18 has a high temperature liquid delivery port 19 and is connected to the high temperature liquid delivery port 6 of the radiator via a high temperature liquid flow path 20.
  • the evaporator 2 is disposed below the storage unit 18, and the same number of holes as the number of the evaporation tubes 3 are provided below the storage unit 18, and joined to the two-phase fluid delivery port 28 above the evaporation tube 3.
  • brazing, welding, etc. are used as a joining method.
  • An attachment plate 27 is provided between the radiator 5 and the heat exchanger 12 and can be attached to a predetermined location.
  • the operation principle is shown below.
  • the inside of the loop heat transport device is evacuated and filled with a circulating fluid 25.
  • the circulating fluid 25 flowing through the evaporation pipe 3 is heated by the heat generated in the heating element 24 to increase the temperature, and a part of the circulating fluid 25 becomes the steam 26, and the high-temperature circulating fluid 25 and the steam 26 are heated.
  • a gas-liquid two-phase fluid is generated (see FIG. 2).
  • the gas-liquid two-phase fluid is raised by the buoyancy generated from the difference between the apparent density of the gas-liquid two-phase fluid and the density of the circulating fluid 25, and the gas-liquid two-phase fluid exchanges heat from the two-phase fluid delivery port 28. It is fed into the container 18 of the container 12.
  • the phase is changed to a liquid and becomes a liquid single phase together with the high-temperature circulating liquid 25 and is sent out from the high-temperature liquid delivery port 19.
  • the high-temperature circulating liquid 25 passes through the high-temperature liquid flow path 20 and is sent from the high-temperature liquid inlet 6 to the radiator inlet header 7 of the radiator 5.
  • the radiator inlet header 7 has a function of distributing the high-temperature circulating fluid 25 to the radiator internal flow path.
  • the distributed high-temperature circulating fluid 25 flows through the plurality of radiator internal flow paths 8 and releases heat from the radiation fins 11 to become a low-temperature circulating fluid 25 and merges at the radiator outlet header 9, It is delivered from the liquid delivery port 10.
  • the low-temperature circulating liquid 25 is fed from the cryogenic liquid inlet 13 to the heat exchanger inlet header 14 of the heat exchanger 12 and distributed to the heat transfer tube 15.
  • the low-temperature circulating fluid 25 exchanges heat between the steam 26 in the housing portion 18 and the wall surface of the heat transfer tube 15, and the circulating fluid 25 flowing through the heat transfer tube 15 is heated.
  • the heated circulating fluid 25 joins at the heat exchanger outlet header 17 and is sent out from the preheating liquid outlet 16.
  • the circulating fluid 25 sent out from the heat exchanger outlet header 17 flows through the preheating liquid channel 21 and flows into the evaporator header pipe 23.
  • the evaporator header pipe 23 has a function of distributing the circulating liquid 25 to the evaporation pipe 3.
  • the circulating fluid 25 is fed from the preheated liquid feed port 22 to the evaporation pipe 3 to form a series of loops.
  • the vapor 26 of the gas-liquid two-phase fluid of the circulating liquid 25 delivered from the two-phase fluid outlet 28 is heat-exchanged through the wall of the heat transfer tube 15 in the accommodating portion 18 of the heat exchanger 12. Since it becomes a liquid, the pressure inside the container 18 (around the two-phase fluid delivery port 28 of the evaporation pipe 3) is kept low, and the circulating liquid 25 is difficult to flow back to the evaporation pipe 3.
  • the circulating liquid 25 it is preferable to use a fluid having a high thermal conductivity and specific heat and a good thermal property or a fluid having a low viscosity coefficient and a good fluidity.
  • a fluid having a large ratio of the liquid density to the gas density is preferable, and a fluid composed of a single component such as distilled water, alcohol or liquid metal, or a multi-component fluid such as an antifreeze liquid or an alcohol aqueous solution is used.
  • a multi-component fluid there are components that are vaporized and components that are not vaporized, but the liquid component produced by condensing the vapor 26 in the container 18 is agitated and mixed in the container 18, and the circulating fluid 25 is sent out from the high temperature liquid outlet 19.
  • the evaporator is composed of a block-shaped metal body in which holes are processed.
  • the entire evaporator, which is a block-shaped metal body, needs to be made of copper in order to suppress the generation of non-condensable gas when using circulating liquids containing water such as distilled water and antifreeze liquid, which increases the weight. It was.
  • the evaporator 2 is configured by the evaporation pipe 3 that is in contact with the circulating liquid 25 and the evaporation plate 4 that is not in contact with the circulating liquid 25.
  • the entire evaporator 2 can be reduced in weight.
  • the evaporation pipe 3 may be made of a metal pipe other than copper such as aluminum, and the inner surface may be plated with copper.
  • the evaporation plate 4 is made of aluminum and the others are made of copper.
  • the circulating liquid 25 containing water such as distilled water or antifreeze is used, the generation of non-condensable gas can be suppressed by making the wetted part copper, and deterioration of cooling performance can be prevented.
  • the material of all the parts of the loop heat transport device 1 may be aluminum.
  • the circulating fluid 25 containing water such as distilled water or antifreeze is used as the circulating fluid 25, the generation of non-condensable gas is suppressed by copper-plating the wetted surface of the aluminum part, thereby reducing the cooling performance. Can be prevented.
  • the evaporation plate 4 is made of an aluminum plate without providing the evaporation tube 3, a through hole is formed in the aluminum plate, and the inner surface of the through hole is plated with copper, thereby allowing the through hole itself to flow inside the evaporator. It is good.
  • the inner surface in contact with the circulating fluid 25 in the evaporator internal flow path is preferably formed of a metal that hardly corrodes the circulating fluid 25.
  • the circulating liquid 25 is a liquid containing water such as distilled water or antifreeze liquid, it is preferable to select a metal having a higher standard electrode potential (smaller ionization tendency) than hydrogen as a metal that hardly corrodes.
  • the evaporation plate 4 is preferably made of a light metal, that is, a metal material having a density lower than that of the metal forming the inner surface that contacts the circulating fluid 25 of the evaporator internal flow path.
  • the heating element 24 may be provided on both sides of the evaporation plate 4 as shown in FIGS. 2 and 3, or may be provided on one side.
  • the tubular evaporation tube 3 is arranged inside the evaporation plate 4, even if the heating element 24 is provided on both sides, the heat of the heating element 24 can be efficiently transferred to the circulating fluid 25. It is possible to cool a plurality of heating elements at the same time.
  • a heating element 240 that needs to be cooled more efficiently such as a heating element that generates a large amount of heat or a heating element that requires a lower temperature
  • the heating element 240 installed near the center is a heating element that requires higher efficiency cooling than the heating element 24 installed in the vicinity. Since the flow characteristic of the evaporator tube 3 is good near the center of the evaporator 2, it is possible to improve the heat dissipation characteristics by arranging the heating element 240 that requires high-efficiency cooling near the center.
  • FIG. FIG. 5 is a cross-sectional view showing a configuration of a loop heat transport device according to Embodiment 2 of the present invention.
  • FIG. 6 is a cross-sectional view taken along the line AA of FIG. 5 and 6, the same reference numerals as those in FIGS. 1 and 2 indicate the same or corresponding parts.
  • the two-phase fluid delivery port 28 of the evaporation tube 3 has a protruding height h from the lower surface of the housing portion 18 of 3 mm or more. It is arranged to be.
  • the two-phase fluid delivery port 28 of the evaporation pipe 3 is filled with the circulating fluid 25, so that the flow resistance of the two-phase fluid of the circulating fluid 25 delivered to the storage unit 18 is large and the circulating flow rate is reduced.
  • the heat dissipation characteristics deteriorate.
  • the outer peripheral portion of the evaporation pipe 3 on the lower surface of the housing portion 18 becomes a high-temperature circulating fluid passage 34, and the two-phase fluid delivery port 28 of the evaporation pipe 3 is the circulating fluid 25.
  • the flow resistance of the two-phase fluid of the circulating fluid 25 sent from the evaporation pipe 3 to the accommodating portion 18 is reduced, the circulation flow rate is improved, and the heat dissipation characteristics are improved.
  • the present loop heat transport device 1 since a plurality of the evaporation pipes 3 are arranged in parallel, by providing the high-temperature circulating liquid dedicated passage 34, until the high-temperature circulating liquid 25 reaches the high-temperature liquid flow path 20. Is not easily disturbed by the gas-liquid two-phase fluid of the circulating fluid 25 ejected from the evaporation pipe 3, and the circulating flow rate is improved. In addition, backflow from the evaporator tube 3 can be suppressed when the amount of heat generated is extremely small or where the heating element 24 is not attached. Furthermore, if h is increased, even when the main body is inclined, the two-phase fluid delivery port 28 is not filled with the circulating fluid 25 and the circulating flow rate does not decrease, so that the heat radiation characteristics are improved.
  • the protruding height h of the evaporation tube 3 to the accommodating portion 18 is 3 mm or more, the heat dissipation characteristics are improved, and the loop heat transport device can be reduced in size and weight.
  • FIG. 7 is a cross-sectional view showing the configuration of the loop heat transport device according to the third embodiment.
  • FIG. 8 is a cross-sectional view taken along the line AA of FIG. 7 and 8, the same reference numerals as those in FIGS. 1 and 2 denote the same or corresponding parts.
  • guides 35 are provided on both sides of the two-phase fluid delivery port 28 of the evaporation pipe 3, and the space that does not include the two-phase fluid delivery port 28 in the space separated by the guide 35 is hot. It was formed as a circulating fluid dedicated passage 34.
  • the heat dissipation characteristics are improved as in the second embodiment, and the loop heat transport device can be reduced in size and weight.
  • FIG. 9 is a cross-sectional view showing a configuration of a main part of the loop heat transport device according to the fourth embodiment, which corresponds to FIG. 2 in the first embodiment. 9, the same reference numerals as those in FIG. 2 denote the same or corresponding parts.
  • the gap s between adjacent heat transfer tubes 15 in the accommodating portion 18 of the heat exchanger 12 is 3 mm or more. Has been placed.
  • the gap s is small, the condensate formed on the outside of the adjacent heat transfer tube 15 is connected, and a condensate bridge that prevents the movement of the vapor 26 is formed around the heat transfer tube 15. Therefore, the heat exchange area where the steam 26 and the heat transfer tube 15 are in contact with each other is reduced, and the heat dissipation characteristics are deteriorated.
  • FIG. 11 is a partial enlarged cross-sectional view showing a configuration in the vicinity of the evaporation pipe 3 of the loop heat transport device according to the fifth embodiment, which corresponds to FIG. 4 in the first embodiment. 11, the same reference numerals as those in FIG. 4 denote the same or corresponding parts.
  • fins 33 are provided inside the evaporation pipe 3.
  • the loop heat transport device configured as described above, by providing the fins 33 inside the evaporation pipe 3, it becomes easy to form bubble nuclei, and boiling is promoted even when the heat is low, and the circulating fluid is circulated appropriately. Is possible. Further, by providing the fins 33 inside the evaporation pipe 3, the heat transfer area is enlarged, the heat resistance of the evaporation part can be reduced, and the cooling performance is improved, so that the loop heat transport device can be reduced in size and reduced in weight. It becomes possible.
  • FIG. 12 and 13 are cross-sectional views showing the configuration of the loop heat transport device according to the sixth embodiment.
  • FIG. 12 shows a state before the radiator 5, the heat exchanger 12, and the high-temperature liquid channel 20 are attached to the attachment plate 27, and
  • FIG. 13 shows a state after the attachment. 12 and 13, the same reference numerals as those in FIG. 1 denote the same or corresponding parts.
  • the pipe 30, through the attachment plate 27 penetrates the high temperature liquid inlet 6 and the low temperature liquid outlet 10 of the radiator 5. 31 is attached, and the high temperature liquid inlet pipe 30 is connected to the high temperature liquid flow path 20 and the low temperature liquid outlet pipe 31 is connected to the low temperature liquid inlet 13 of the heat exchanger inlet header 14.
  • the component to which the evaporator 2 and the heat exchanger 12 are joined and the radiator 5 are separately manufactured, and finally the high-temperature liquid inlet pipe 30 is used.
  • a mounting plate 27 provided with a hole through which the low-temperature liquid delivery pipe 31 passes. After sandwiching the mounting plate 27, the high temperature liquid inlet pipe 30 and the high temperature liquid flow path 20 can be joined by brazing or welding, and the low temperature liquid delivery pipe 31 and the low temperature liquid inlet 13 can be joined by brazing or welding. Therefore, manufacture becomes easy.
  • the mounting plate 27 is also in contact with the loop heat transport device of FIG. 1, when using a circulating fluid 25 such as an aqueous solution of distilled water or antifreeze, it is necessary to use a copper material for the mounting plate 27. Therefore, there is a problem that the weight increases. Since the attachment plate 27 does not come into contact with the configuration of the sixth embodiment, it is possible to use a light material such as aluminum, and it is possible to reduce the weight of the entire loop heat transport device.
  • a circulating fluid 25 such as an aqueous solution of distilled water or antifreeze
  • FIG. 14 is a cross-sectional view showing a configuration of a loop heat transport device according to the seventh embodiment.
  • FIG. 15 is a cross-sectional view taken along the line AA of FIG. 14 and 15, the same reference numerals as those in FIGS. 1 and 2 denote the same or corresponding parts.
  • a fixing member 32 is provided between the evaporator plate 4 and the evaporator header pipe 23. The fixing member 32 is provided so as to support at least the evaporation plate 4.
  • FIG. 14 is a cross-sectional view showing a configuration of a loop heat transport device according to the seventh embodiment.
  • FIG. 15 is a cross-sectional view taken along the line AA of FIG. 14 and 15, the same reference numerals as those in FIGS. 1 and 2 denote the same or corresponding parts.
  • a fixing member 32 is provided between the evaporator plate 4 and the evaporator header pipe 23. The fixing member 32 is provided so as to support at least the evaporation plate 4.
  • the evaporator plate 4 of the evaporator 2 is only joined to the outer peripheral surface of the evaporator tube 3 by a fixing material 29 such as solder or brazing material.
  • a fixing material 29 such as solder or brazing material.
  • the fixing member 32 is provided so as to support the evaporation plate 4 at the lower part of the evaporator 2 as well as being joined by the fixing material 29 such as solder or brazing material, the upper surface of the fixing member 32.
  • the fixing material 29 such as solder or brazing material
  • FIG. 16 to 19 are cross-sectional views showing a part of the configuration of the loop heat transport device according to the eighth embodiment, and show the portions of the evaporator 2 and the heat exchanger 12. 16 to 19, the same reference numerals as those in FIG. 1 denote the same or corresponding parts.
  • a circulating fluid sealing pipe 36 is provided in the loop heat transport device according to the eighth embodiment.
  • the sealing pipe 36 is disposed in the accommodating portion 18, in FIG. 17, in the heat exchanger inlet header 14, in FIG. 18, in the heat exchanger outlet header 17, and in FIG. 21 is provided.
  • the inside of the loop heat transport device is evacuated from the sealing pipe 36, and an appropriate amount of the circulating fluid 25 is sealed and temporarily operated with a valve or the like temporarily sealed. It can be performed.
  • the sealing pipe 36 is arranged as shown in FIGS. 17 to 19, since the attachment portion of the sealing pipe 36 is a place filled with the circulating fluid 25, the heat dissipation characteristics can be obtained by temporary operation from low heat generation to high heat generation. It is possible to stably operate by adjusting the amount of liquid while confirming and finally sealing off the sealing pipe 36. In addition, the optimum value of the liquid amount can be determined thereby.
  • the residual gas inside the apparatus, the residual gas contained in the circulating liquid 25, and the non-condensable gas generated inside after circulating liquid 25 injection are stored in the storage unit 18,
  • the sealing pipe 36 at the top of the accommodating portion 18 as in FIG. 16 the internal gas can be evacuated from the sealing pipe 36 after the circulating fluid 25 is sealed.
  • a sealing pipe 36 for adjusting the liquid amount as shown in FIGS. 17 to 19 and a sealing pipe 36 for evacuating the internal gas as shown in FIG. 16 may be combined.
  • Loop type heat transport device 2 Evaporator 3: Evaporator tube (evaporator internal flow path) 4: Evaporator plate 5: Radiator 6: High temperature liquid inlet 7: Radiator inlet header 8: Radiator internal flow path 9 : Heater outlet header 10: Cryogenic liquid outlet 11: Radiation fin 12: Heat exchanger 13: Cryogenic liquid inlet 14: Heat exchanger inlet header 15: Heat transfer pipe 16: Preheated liquid outlet 17: Heat exchanger outlet header 18: Container 19: High temperature liquid outlet 20: High temperature liquid flow path 21: Preheated liquid flow path 22: Preheated liquid inlet 23: Evaporator header pipe 24: Heating element 25: Circulating liquid 26: Steam 27: Mounting plate 28 : Two-phase fluid outlet 29: Fixing material 30: High temperature liquid inlet pipe 31: Low temperature liquid outlet pipe 32: Solid Fixed member 33: Fin 34: High temperature liquid passage 35: Guide 36: Sealing pipe

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

La présente invention a pour objet de proposer un dispositif de transport de chaleur de type en boucle qui est configuré de telle sorte qu'il y ait moins de risque qu'un ne reflue et de telle sorte que le dispositif de transport de chaleur ait un poids réduit et une résistance élevée. Le dispositif de transport de chaleur de type en boucle est pourvu : d'un évaporateur (2) comprenant une plaque d'évaporation métallique (4) qui a formé à l'intérieur des canaux internes d'évaporateur (3) pour amener un liquide de circulation (25) à circuler du bas vers le haut et qui présente un corps de génération de chaleur (24) disposé à l'extérieur de ce dernier ; d'un radiateur (5) pour libérer la chaleur du liquide de circulation ; et d'un échangeur de chaleur (12) pourvu de tubes de transfert de chaleur (15) faisant office de canaux internes d'échangeur de chaleur et pourvu également d'une section de contenance (18) qui est située autour des tubes de transfert de chaleur (15) et qui contient le liquide de circulation et la vapeur du liquide de circulation, le liquide de circulation étant distribué depuis une ouverture de distribution de fluide en deux phases (28) située au niveau des parties supérieures des canaux internes d'évaporateur (3), l'échangeur de chaleur (12) effectuant un échange de chaleur entre le liquide de circulation se trouvant dans les tubes de transfert de chaleur (15) et la vapeur se trouvant dans la section de contenance (18). Les surfaces internes des canaux internes d'évaporateur, les surfaces internes étant en contact avec le liquide de circulation, se composent d'un métal qui est différent du métal de la plaque d'évaporation (4).
PCT/JP2011/065557 2010-08-24 2011-07-07 Dispositif de transport de chaleur de type en boucle WO2012026221A1 (fr)

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JPH06137775A (ja) * 1992-10-22 1994-05-20 Furukawa Electric Co Ltd:The 半導体装置用放熱器
JP2005195226A (ja) * 2004-01-06 2005-07-21 Mitsubishi Electric Corp ポンプレス水冷システム
JP2007513506A (ja) * 2003-12-08 2007-05-24 ノイズ リミット エーピーエス バブルポンプを有する冷却システム
WO2007119783A1 (fr) * 2006-04-13 2007-10-25 Mitsubishi Electric Corporation Appareil de refroidissement et convertisseur de puissance
JP2010164260A (ja) * 2009-01-16 2010-07-29 Mitsubishi Heavy Ind Ltd 熱交換器の製造方法、熱交換器用伝熱管、熱交換器

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Publication number Priority date Publication date Assignee Title
WO2007058063A1 (fr) * 2005-11-17 2007-05-24 Konica Minolta Holdings, Inc. Element d'affichage et procede de production associe

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Publication number Priority date Publication date Assignee Title
JPH06137775A (ja) * 1992-10-22 1994-05-20 Furukawa Electric Co Ltd:The 半導体装置用放熱器
JP2007513506A (ja) * 2003-12-08 2007-05-24 ノイズ リミット エーピーエス バブルポンプを有する冷却システム
JP2005195226A (ja) * 2004-01-06 2005-07-21 Mitsubishi Electric Corp ポンプレス水冷システム
WO2007119783A1 (fr) * 2006-04-13 2007-10-25 Mitsubishi Electric Corporation Appareil de refroidissement et convertisseur de puissance
JP2010164260A (ja) * 2009-01-16 2010-07-29 Mitsubishi Heavy Ind Ltd 熱交換器の製造方法、熱交換器用伝熱管、熱交換器

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