WO2012008783A3 - 차단부재를 구비하는 에어 나이프 챔버 - Google Patents

차단부재를 구비하는 에어 나이프 챔버 Download PDF

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Publication number
WO2012008783A3
WO2012008783A3 PCT/KR2011/005204 KR2011005204W WO2012008783A3 WO 2012008783 A3 WO2012008783 A3 WO 2012008783A3 KR 2011005204 W KR2011005204 W KR 2011005204W WO 2012008783 A3 WO2012008783 A3 WO 2012008783A3
Authority
WO
WIPO (PCT)
Prior art keywords
air knife
shield member
knife chamber
water
chamber
Prior art date
Application number
PCT/KR2011/005204
Other languages
English (en)
French (fr)
Other versions
WO2012008783A2 (ko
Inventor
박수찬
임예훈
민경훈
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to EP11807068.9A priority Critical patent/EP2595178B1/en
Priority to CN201180034690.7A priority patent/CN103003922B/zh
Priority to JP2013519602A priority patent/JP5664986B2/ja
Publication of WO2012008783A2 publication Critical patent/WO2012008783A2/ko
Publication of WO2012008783A3 publication Critical patent/WO2012008783A3/ko
Priority to US13/735,625 priority patent/US8667704B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Abstract

본 발명에 따른 에어 나이프 챔버는 격벽을 타고 흘러내린 물이 슬릿보다 전방부쪽에 떨어지도록 하여 에어 나이프에 의해 효과적으로 제거되도록 하고, 이에 따라 기판의 불량률을 줄일 수 있도록 한다.
PCT/KR2011/005204 2010-07-14 2011-07-14 차단부재를 구비하는 에어 나이프 챔버 WO2012008783A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP11807068.9A EP2595178B1 (en) 2010-07-14 2011-07-14 Air knife chamber including blocking member
CN201180034690.7A CN103003922B (zh) 2010-07-14 2011-07-14 包含阻挡件的气刀腔
JP2013519602A JP5664986B2 (ja) 2010-07-14 2011-07-14 遮断部材を備えるエアナイフチャンバー
US13/735,625 US8667704B2 (en) 2010-07-14 2013-01-07 Air knife chamber including blocking member

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20100067948 2010-07-14
KR10-2010-0067948 2010-07-14
KR10-2011-0069965 2011-07-14
KR1020110069965A KR101227079B1 (ko) 2010-07-14 2011-07-14 차단부재를 구비하는 에어 나이프 챔버

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/735,625 Continuation US8667704B2 (en) 2010-07-14 2013-01-07 Air knife chamber including blocking member

Publications (2)

Publication Number Publication Date
WO2012008783A2 WO2012008783A2 (ko) 2012-01-19
WO2012008783A3 true WO2012008783A3 (ko) 2012-05-03

Family

ID=45612797

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/005204 WO2012008783A2 (ko) 2010-07-14 2011-07-14 차단부재를 구비하는 에어 나이프 챔버

Country Status (6)

Country Link
US (1) US8667704B2 (ko)
EP (1) EP2595178B1 (ko)
JP (1) JP5664986B2 (ko)
KR (1) KR101227079B1 (ko)
CN (1) CN103003922B (ko)
WO (1) WO2012008783A2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101227079B1 (ko) * 2010-07-14 2013-01-28 주식회사 엘지화학 차단부재를 구비하는 에어 나이프 챔버
CN104588351A (zh) * 2014-12-02 2015-05-06 深圳市华星光电技术有限公司 基板清洗装置和使用其清洗基板的方法
CN108022864B (zh) * 2016-10-28 2020-06-30 盟立自动化股份有限公司 湿式制程装置
CN106738400A (zh) * 2016-12-12 2017-05-31 惠科股份有限公司 玻璃碎屑清洁结构及搬运机
CN107065433B (zh) * 2017-05-08 2021-01-26 京东方科技集团股份有限公司 干燥装置
CN108847398B (zh) * 2018-05-16 2021-01-01 武汉华星光电半导体显示技术有限公司 用于干燥基板的风刀装置
CN112939109B (zh) * 2021-01-28 2022-08-30 重庆海纳川环保科技有限公司 一种污水处理用格栅除渣装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11204489A (ja) * 1998-01-12 1999-07-30 Dainippon Screen Mfg Co Ltd 基板乾燥装置及び基板乾燥方法
KR20060027597A (ko) * 2004-09-23 2006-03-28 주식회사 케이씨텍 기판세정장치 및 기판세정방법
KR20060073079A (ko) * 2004-12-24 2006-06-28 주식회사 케이씨텍 기판건조장치
JP2009088442A (ja) * 2007-10-03 2009-04-23 Hitachi High-Technologies Corp 基板乾燥装置、フラットパネルディスプレイの製造装置及びフラットパネルディスプレイ

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Publication number Priority date Publication date Assignee Title
JPH11204489A (ja) * 1998-01-12 1999-07-30 Dainippon Screen Mfg Co Ltd 基板乾燥装置及び基板乾燥方法
KR20060027597A (ko) * 2004-09-23 2006-03-28 주식회사 케이씨텍 기판세정장치 및 기판세정방법
KR20060073079A (ko) * 2004-12-24 2006-06-28 주식회사 케이씨텍 기판건조장치
JP2009088442A (ja) * 2007-10-03 2009-04-23 Hitachi High-Technologies Corp 基板乾燥装置、フラットパネルディスプレイの製造装置及びフラットパネルディスプレイ

Also Published As

Publication number Publication date
EP2595178A2 (en) 2013-05-22
WO2012008783A2 (ko) 2012-01-19
EP2595178B1 (en) 2019-09-04
US8667704B2 (en) 2014-03-11
KR20120007470A (ko) 2012-01-20
US20130180079A1 (en) 2013-07-18
EP2595178A4 (en) 2017-05-03
KR101227079B1 (ko) 2013-01-28
CN103003922A (zh) 2013-03-27
JP2013531900A (ja) 2013-08-08
JP5664986B2 (ja) 2015-02-04
CN103003922B (zh) 2016-11-02

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