WO2012007659A1 - Dispositif d'identification radio fréquence en polycarbonate et son procédé de fabrication - Google Patents
Dispositif d'identification radio fréquence en polycarbonate et son procédé de fabrication Download PDFInfo
- Publication number
- WO2012007659A1 WO2012007659A1 PCT/FR2011/000414 FR2011000414W WO2012007659A1 WO 2012007659 A1 WO2012007659 A1 WO 2012007659A1 FR 2011000414 W FR2011000414 W FR 2011000414W WO 2012007659 A1 WO2012007659 A1 WO 2012007659A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- antenna
- turns
- chip
- layer
- polycarbonate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 229920000515 polycarbonate Polymers 0.000 title claims abstract description 15
- 239000004417 polycarbonate Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000003989 dielectric material Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000004804 winding Methods 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 2
- 239000003292 glue Substances 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 230000032798 delamination Effects 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000014510 cooky Nutrition 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
- H01Q9/27—Spiral antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
Definitions
- Radio frequency identification device made of polycarbonate and its method of manufacture
- the present invention relates to the field of documents, valuables and security containing an electronic device for contactless data exchange and concerns in particular a radio frequency identification device (RFID) and its manufacturing method.
- RFID radio frequency identification
- a radiofrequency identification device (RFID) without contact is a device consisting mainly of an antenna embedded in a support of the device and a chip connected to the connection pads of the antenna. These devices allow the exchange of information with the outside by electromagnetic coupling at a distance and therefore without contact, between its antenna and a second antenna located in the associated reading device. These devices are used today in a large number of applications and in particular for the identification of people traveling in areas with controlled access or transit from one area to another.
- the device is generally formed on a flat and flexible support in the format of a bank card or in a format adapted to be inserted into a security document or value.
- Such RFID devices are commonly called “inlay”.
- the chip is connected directly to the pads of the antenna by "flip-chip”. However, the chip may also be encapsulated in a module to be better protected.
- Information is exchanged between the RFID device and the reader and in particular the information stored in the chip relating to the identification of the owner of the object on which the device is located. RFID and its authorization to enter a controlled access area for example.
- RFID devices can be manufactured according to several manufacturing processes.
- One of the methods is to laminate together several layers of different material such as paper for the antenna support and thermoplastic for the upper and lower layers.
- the disadvantage of the RFID device obtained by such a method lies in the fact that it delaminates in its thickness and is therefore unsuitable for use over several years as may be the case for identity cards.
- the use of the same material for the three layers such as thermoplastic does not solve the problem of delamination and poses more problems at the time of laminating. Indeed, the lack of flexibility and elasticity of the superimposed layers together can crack the antenna and consequently break the electrical connection between the antenna and the chip during pressure rises.
- the rise in temperature during the lamination step generates deformations of the support which can also lead to cracking of the antenna aggravated by the large thickness at the crossing point of the turns due to the double thickness of material conductive forming turns and insulating material to separate and isolate the turns between them.
- RFID devices made from wire antenna do not have the same disadvantages since the copper wire does not break under the effect of pressure but has a tendency to mold into the thermoplastic.
- the copper wire because of its small thickness of the order of 25 ⁇ m and the fact that the copper wire is sheathed thus isolated, its use makes it possible to avoid the insulating layer between the superimposed turns and to obtain a overthickness at the crossing of the turns of the order of 50 ⁇ , so little constraining.
- the object of the invention is to provide a method of manufacturing an RFID device whose antenna is produced by printing on a thermoplastic material, which solves the problems of cracking of the antenna printed at the time of printing. laminating step.
- Another object of the invention is to provide an RFID device which does not present a risk of delamination over time.
- the object of the invention is therefore a method of manufacturing a radio frequency identification device (RFID) comprising a planar substrate provided with an antenna and a chip connected to the antenna, the antenna formed by the winding of several turns comprises a crossing zone of the turns, an insulating strip of dielectric material separating the superposed antenna turns at the crossing, the method comprising the following steps:
- FIG. 1 represents a front view of the layer supporting the radio frequency device
- FIG. 2 represents a sectional view along the axis A-A of the layer supporting the radiofrequency device of FIG. 1,
- FIG. 3 represents a front view of the second layer of the RFID device support according to the invention
- FIG. 4 represents a sectional view of the radiofrequency device according to the invention.
- a substrate 10 in the credit card format is shown seen from above.
- this substrate is designated antenna support.
- the support has an ISO format but it could have other dimensions, and for example be in the form of strips or boards with several support to be cut in ISO format.
- An underlayer 12 of thickness 5 ⁇ is deposited on the antenna support 10 on an area shown in gray in FIG. 1.
- this underlayer is produced by printing an ink, a resin or a varnish.
- the underlayer 12 is made from a tinted transparent ink to facilitate visual identification.
- the antenna support 10 is made of polycarbonate (PC).
- An antenna 11 comprising a winding of several turns, two connection pads 17 and 18 located at both ends of the winding and an electric bridge 13 is printed on the antenna support 10 on the sub-layer 12 and so that not leave the area defined by the sublayer.
- the size of the underlayer zone 12 is preferably slightly greater than the footprint of the antenna as can be seen in FIG. 1. The shape of the zone is thus determined directly by the shape of the antenna.
- the turns of the antenna and the connection pads are produced by screen printing, flexo, gravure, offset or inkjet printing using epoxy ink conductive ink loaded with conductive particles such as, for example, silver. or gold or from a conductive polymer.
- the antenna is directly printed on the antenna support without underlayer 12.
- the antenna is printed in several passes. The first pass is to print the two connection pads 17 and 18 of the antenna and the electric bridge 13, commonly called "cross-over".
- the second pass consists of printing an insulating strip 16 of dielectric material superimposed on the crossover.
- the third printing passage consists of printing the winding of the turns whose inner end 14 and the outer end 15 intersect the electrical bridge 13 so as to be electrically connected together.
- the insulating strip 16 thus makes it possible to obtain a crossing zone of the antenna where the electrical bridge 13 and the turns of the antenna intersect without any risk of a short circuit.
- the superposition of the crossed turns and the dielectric reaches a thickness between 70 and 75 ⁇ .
- an integrated circuit module 29 comprises a chip 25, at least two connection pads 23 and 24.
- the connection between the chip and the strips 23 and 24 is formed by conducting wires or connection cables 26, called commonly "wire bonding".
- the chip 25 and the wires are encapsulated in a protective resin 27 based on a resistant material and not conducting electricity.
- the encapsulation 27 (or "molding") is a kind of rigid shell that includes the chip and its wiring so as to make it less fragile and more manipulable.
- the encapsulation has a thickness of between 200 and 240 ⁇ .
- the module thus has on its upper face a flat surface corresponding to the upper part of one encapsulation 27 and on its lower face contact pads 23 and 24 intended to connect to a circuit.
- the tracks 23 and 24 are made of a conductive material such as aluminum and their thickness is between 70 and 100 ⁇ .
- the module 29 is glued to the antenna support layer 10 by two pads of adhesive material 33 and 34 placed next to the antenna connection pads or straddling the antenna connection pads 17 and 18.
- module is positioned so that the connection pads 17 and 18 are opposite the contact pads 23 and 24 of the module and that the encapsulated portion of the module or encapsulation 27 is in the cavity 19. And in particular, a portion of the pads of connection 17 and 18 comes to bear against part of the contact pads 23 and 24 not covered with adhesive material.
- the adhesive material used for the pads 33 and 34 is an adhesive which fixes only the module to the support layer 10 and as this adhesive is not conductive it does not participate directly in the electrical connection between the module and the antenna.
- the adhesive used is epoxy type not loaded with conductive particles and heat-crosslinkable.
- the glue pads are placed on the support layer 10 to proximity of the antenna pads so that when the module 29 is placed in the cavity 19, the glue pads is crushed by a small portion of the contact pads of the module until another part of contact pads come into contact with the antenna pads.
- the glue pads then reach the same thickness as the antenna pads or substantially the same and come touching the antenna pads.
- the operation which consists of placing the module in the cavity is accompanied by a heating phase of the contact pads of the module which allows the adhesive to be cured.
- the glue pads harden under the effect of heat and thus maintain the areas of the module 23 and 24 in contact against the connection pads.
- This glue baking step is carried out locally by applying a heating resistor without pressure to the contact pads of the module.
- the tight contact of the contact pads 23, 24 of the module and the connection pads 17, 18 of the antenna guarantees the reliability of the electrical connection.
- the electrical connection is made by the part of the contact pads 23, 24 of the module in direct contact with the connection pads 17 and 18 of the antenna.
- the support thus obtained is an antenna support provided with a module secured to the support and electrically connected to the antenna.
- the electrical connection has the advantage of being carried out without welding or adding material.
- connection pads 17 and 18 of the antenna have a concave or hollow shape or else recessed in the manner of a ring so that the pads of adhesive material 33 and 34 are placed inside the hollow of the concave shape or inside the recess.
- the antenna pads are U-shaped so that the pads of adhesive material are placed inside the U.
- a second layer 20 is shown from above. This second layer is a layer of polycarbonate (PC) with a thickness of between 50 and 60 ⁇ and of width and length identical to the first layer of the antenna support 10. In this layer two laser perforations 26 and 39 are produced. well using a cookie cutter. These two perforations are cavities through the entire thickness of the layer 20.
- PC polycarbonate
- the perforation 26 is located on the layer 20 so that when the layer 20 covers the layer 10 by overlapping edge to edge, the insulating strip 16 appears in the space left by the perforation 26. In this way, the perforation 26 is centered on the insulating strip.
- the perforation 39 is located on the layer 20 so that when the layer 20 overlaps the layer 10 by overlapping edge to edge, the portion between the connection pads and a portion of the connection pads appears in the space left free by the perforation 39. In this way, the perforation 39 is centered on the module 29.
- FIG. 4 shows in section the antenna support 10 along the axis AA of FIG. 1, the second layer 20 and a third layer 30.
- the layer 20 is positioned on the support 10 so that the external face of the module, therefore that including the contact pads of the module is housed in the perforation 39.
- a third layer 30 is also positioned on the layer 20.
- the layer 30 is a sheet of polycarbonate (PC) of identical dimensions to those of the other two layers and of thickness between 90 and 120 ⁇ and preferably equal to 100 ⁇ .
- FIG. 5 shows in section the antenna support 10 along the axis BB of FIG. 2 and the second and third layers 20 and 30.
- the insulating strip 16 is housed in the perforation 26.
- the next step is to laminate layers 10, 20 and 30 together.
- the three layers thus undergo a temperature rise up to 180 ° C and a rise in pressure.
- the intermediate layer 20 softens at lower temperatures than the lower and upper layers 10 and 30. Due to the pressure exerted during the lamination step, air trapped between the layers and in particular in the perforations 26 and 39 is removed and replaced by softened polycarbonate). In this way, the polycarbonate of the intermediate layer 20 fills the perforations during the lamination step.
- the layer 20 provided with these two perforations avoids and compensates the extra thicknesses due firstly to the crossing zone of the antenna and secondly to the module.
- the three layers 10, 20 and 30 are welded together as can be seen in FIG. 6.
- the polycarbonate layers are no longer distinguished in the thickness RFID device obtained so that there is no possibility of delamination in the thickness.
- the antenna 11 comprising the turns, the two connection pads 17 and 18 and the electrical bridge 13 is completely embedded in the polycarbonate of the three layers 10, 20 and 30 welded together.
- the edges of the RFID device according to the invention are uniform and do not have parallel demarcation lines at the upper edges 62 and lower 61 which could assume an assembly of several layers together; which makes it impossible to attempt delamination of the device in its thickness.
- the integrated circuit module is replaced by a bare chip of the type of the chip 25 encapsulated in the module.
- the steps of producing the antenna and the step of laminating the layers together are the same as for the embodiment described with an integrated circuit module.
- the perforation 19 is not necessary in the case of a chip.
- the perforations 26 and 39 are made in the same way in the layer 20; the perforation 39 being centered on the chip.
- the connection of the chip to the antenna is carried out according to a method of the type described in FR2 826 153 of the Applicant.
- Adhesive dielectric material is deposited on the antenna support 10 between the connection pads 17, 18 of the antenna and the chip is positioned on the antenna support so that the contacts of the chip are against the connection pads of the antenna. The adhesive material is then heat-treated to cure.
- the pressure exerted on the chip when it is connected to the antenna enables the contacts of the chip, commonly known as "bumps", to penetrate into the connecting terminals of the antenna which deform and thus guarantee better connection between the chip and the antenna.
- the RFID device forms a plan support that can be integrated into a security document such as an identity card, an identity book, a driver's license, an access card, etc.
- the RFID device according to the invention has a thickness of between 0.38 and 0.41 mm and has the advantage of supporting laser etching.
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MX2013000427A MX2013000427A (es) | 2010-07-12 | 2011-07-12 | Dispositivo de identificacion de radiofrecuencia de policarbonato y metodo de manufactura del mismo. |
JP2013519124A JP2013537663A (ja) | 2010-07-12 | 2011-07-12 | ポリカーボネート製無線周波数識別装置及びその製造方法 |
CA2805201A CA2805201A1 (fr) | 2010-07-12 | 2011-07-12 | Dispositif d'identification radio frequence en polycarbonate et son procede de fabrication |
BR112013000823A BR112013000823A2 (pt) | 2010-07-12 | 2011-07-12 | processo de fabricação de um dispositivo de identificação por radiofrequência e dispositivo de identificação por radiofrequência |
EP11752255.7A EP2609544A1 (fr) | 2010-07-12 | 2011-07-12 | Dispositif d'identification radio fréquence en polycarbonate et son procédé de fabrication |
KR1020137000855A KR20130095720A (ko) | 2010-07-12 | 2011-07-12 | 폴리카보네이트로 된 무선주파수 인식장치 및 이의 제조방법 |
CN2011800428409A CN103119616A (zh) | 2010-07-12 | 2011-07-12 | 聚碳酸酯制射频识别设备及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1002929 | 2010-07-12 | ||
FR1002929A FR2962579A1 (fr) | 2010-07-12 | 2010-07-12 | Dispositif d'identification radio frequence en polycarbonate et son procede de fabrication |
Publications (1)
Publication Number | Publication Date |
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WO2012007659A1 true WO2012007659A1 (fr) | 2012-01-19 |
Family
ID=42937507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2011/000414 WO2012007659A1 (fr) | 2010-07-12 | 2011-07-12 | Dispositif d'identification radio fréquence en polycarbonate et son procédé de fabrication |
Country Status (11)
Country | Link |
---|---|
US (1) | US8616455B2 (fr) |
EP (1) | EP2609544A1 (fr) |
JP (1) | JP2013537663A (fr) |
KR (1) | KR20130095720A (fr) |
CN (1) | CN103119616A (fr) |
BR (1) | BR112013000823A2 (fr) |
CA (1) | CA2805201A1 (fr) |
FR (1) | FR2962579A1 (fr) |
MX (1) | MX2013000427A (fr) |
TW (1) | TW201218087A (fr) |
WO (1) | WO2012007659A1 (fr) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102012203251B8 (de) * | 2012-03-01 | 2013-11-07 | Bundesdruckerei Gmbh | Kontaktlose Datenübertragungseinrichtung, diese enthaltendes Sicherheits- bzw. Wertdokument |
FR3000822A1 (fr) * | 2013-01-08 | 2014-07-11 | Ask Sa | Dispositif radiofrequence en plastique pour carte a puce sans contact ou document de securite ou de valeur sans contact et son procede de fabrication pour eviter les fissures |
FR3002108A1 (fr) * | 2013-02-14 | 2014-08-15 | Ask Sa | Procede de fabrication d'une antenne pour dispositif radiofrequence sur support mince et dispositif comprenant une antenne ainsi obtenue |
FR3009410B1 (fr) * | 2013-07-31 | 2015-08-28 | Oberthur Technologies | Entite electronique a couplage integre entre un microcircuit et une antenne et procede de fabrication |
JP6347607B2 (ja) * | 2013-12-27 | 2018-06-27 | キヤノン株式会社 | 電子機器 |
CN107567633A (zh) * | 2015-02-20 | 2018-01-09 | 恩爱的有限公司 | 用于制造包括与基底或天线相关联的至少一个电子元件的装置的方法 |
JP6315145B2 (ja) * | 2015-02-27 | 2018-04-25 | 株式会社村田製作所 | Rficデバイス及びrficデバイスを含む樹脂成型体の製造方法 |
US9418895B1 (en) | 2015-03-14 | 2016-08-16 | International Business Machines Corporation | Dies for RFID devices and sensor applications |
EP3182507A1 (fr) * | 2015-12-15 | 2017-06-21 | Gemalto Sa | Module antenne simple face avec composant cms |
CN106485311A (zh) * | 2016-09-13 | 2017-03-08 | 上海商格信息科技有限公司 | 一种新型电子标签生产工艺 |
CN107423801A (zh) * | 2017-03-31 | 2017-12-01 | 深圳市文鼎创数据科技有限公司 | 智能卡及其制造方法 |
DE102017004499A1 (de) * | 2017-05-10 | 2018-11-15 | Giesecke+Devrient Mobile Security Gmbh | Elastischer Trägerfilm |
CN109502159A (zh) * | 2018-12-10 | 2019-03-22 | 福建省德鑫泉物联网科技有限公司 | 一种基于rfid电子标签的茶叶袋 |
CN110808448B (zh) * | 2019-10-15 | 2021-02-26 | 元彰精密科技(扬州)有限公司 | 一种基于透明柔性基材的rfid高频天线及制备工艺 |
CN111160507A (zh) * | 2019-12-31 | 2020-05-15 | 重庆沛能电子材料有限公司 | 一种防拆型电子标签材料及其制成方法、使用方法 |
CN112781482B (zh) * | 2020-08-21 | 2022-10-14 | 哈尔滨工业大学(威海) | 可变形曲面的空间曲率的测量方法以及电感式空间曲率测量敏感元件的制作方法 |
KR20230069229A (ko) * | 2020-09-18 | 2023-05-18 | 랑셍 홀딩 | 스마트 카드의 프리램 본체, 스마트 카드, 프리램 본체의 형성 방법 및 스마트 카드의 형성 방법 |
US20240101357A1 (en) * | 2022-09-22 | 2024-03-28 | Contitech Ag | Generation of laminated printed sensor loop stack |
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FR2826153A1 (fr) | 2001-06-14 | 2002-12-20 | A S K | Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact |
WO2010060755A1 (fr) * | 2008-11-03 | 2010-06-03 | Ksw Microtec Ag | Procédé de fabrication d’un produit de transpondeur rfid et produit de transpondeur fabriqué selon le procédé |
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FR2853115B1 (fr) * | 2003-03-28 | 2005-05-06 | A S K | Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede |
JP4567988B2 (ja) * | 2004-02-05 | 2010-10-27 | 株式会社日立製作所 | 紙状rfidタグおよびその製造方法 |
FR2868987B1 (fr) * | 2004-04-14 | 2007-02-16 | Arjo Wiggins Secutity Sas Soc | Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur |
US20100026442A1 (en) * | 2004-08-31 | 2010-02-04 | Koninklijke Philips Electronics N.V. | Method of manufacturing an RFID antenna |
FR2881252A1 (fr) | 2005-01-24 | 2006-07-28 | Ask Sa | Dispositif d'idenfication radiofrequence resistant aux milieux et son procede de fabrication |
AU2006222414B2 (en) * | 2005-03-09 | 2011-03-03 | Delta Dansk Elektronik, Lys Og Akustik | A three-dimensional adhesive device having a microelectronic system embedded therein |
EP1742173A3 (fr) * | 2005-06-21 | 2007-08-22 | VisionCard PersonalisierungsgmbH | Carte et procédé de fabrication |
US7777317B2 (en) * | 2005-12-20 | 2010-08-17 | Assa Abloy Identification Technologies Austria GmbH (Austria) | Card and manufacturing method |
ES2376760T3 (es) * | 2006-10-12 | 2012-03-16 | Hid Global Gmbh | Transpondedor empotrado en un soporte multicapa flexible |
FR2908541B1 (fr) * | 2006-11-06 | 2009-01-16 | Id3S Identification Solutions | Dispositif d'identification par radiofrequence et procede de realisation d'un tel dispositif |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
US8056814B2 (en) * | 2008-02-27 | 2011-11-15 | Tagsys Sas | Combined EAS/RFID tag |
DE102009005570B4 (de) * | 2009-01-21 | 2012-11-29 | Mühlbauer Ag | Verfahren zum Herstellen einer Antenne auf einem Substrat |
-
2010
- 2010-07-12 FR FR1002929A patent/FR2962579A1/fr not_active Withdrawn
-
2011
- 2011-07-12 KR KR1020137000855A patent/KR20130095720A/ko not_active Application Discontinuation
- 2011-07-12 MX MX2013000427A patent/MX2013000427A/es active IP Right Grant
- 2011-07-12 EP EP11752255.7A patent/EP2609544A1/fr not_active Withdrawn
- 2011-07-12 JP JP2013519124A patent/JP2013537663A/ja active Pending
- 2011-07-12 CN CN2011800428409A patent/CN103119616A/zh active Pending
- 2011-07-12 TW TW100124561A patent/TW201218087A/zh unknown
- 2011-07-12 CA CA2805201A patent/CA2805201A1/fr not_active Abandoned
- 2011-07-12 BR BR112013000823A patent/BR112013000823A2/pt not_active Application Discontinuation
- 2011-07-12 US US13/181,368 patent/US8616455B2/en active Active
- 2011-07-12 WO PCT/FR2011/000414 patent/WO2012007659A1/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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FR2826153A1 (fr) | 2001-06-14 | 2002-12-20 | A S K | Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact |
WO2010060755A1 (fr) * | 2008-11-03 | 2010-06-03 | Ksw Microtec Ag | Procédé de fabrication d’un produit de transpondeur rfid et produit de transpondeur fabriqué selon le procédé |
Also Published As
Publication number | Publication date |
---|---|
CA2805201A1 (fr) | 2012-01-19 |
BR112013000823A2 (pt) | 2016-05-17 |
EP2609544A1 (fr) | 2013-07-03 |
TW201218087A (en) | 2012-05-01 |
JP2013537663A (ja) | 2013-10-03 |
FR2962579A1 (fr) | 2012-01-13 |
US20120175422A1 (en) | 2012-07-12 |
KR20130095720A (ko) | 2013-08-28 |
US8616455B2 (en) | 2013-12-31 |
CN103119616A (zh) | 2013-05-22 |
MX2013000427A (es) | 2013-08-27 |
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