WO2012005470A3 - 듀얼 레인 스크린 프린터 - Google Patents

듀얼 레인 스크린 프린터 Download PDF

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Publication number
WO2012005470A3
WO2012005470A3 PCT/KR2011/004779 KR2011004779W WO2012005470A3 WO 2012005470 A3 WO2012005470 A3 WO 2012005470A3 KR 2011004779 W KR2011004779 W KR 2011004779W WO 2012005470 A3 WO2012005470 A3 WO 2012005470A3
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
solder
laterally
conveyor
units
Prior art date
Application number
PCT/KR2011/004779
Other languages
English (en)
French (fr)
Other versions
WO2012005470A2 (ko
Inventor
고형래
Original Assignee
주식회사 이에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=43939462&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2012005470(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 주식회사 이에스이 filed Critical 주식회사 이에스이
Publication of WO2012005470A2 publication Critical patent/WO2012005470A2/ko
Publication of WO2012005470A3 publication Critical patent/WO2012005470A3/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
    • B41F19/002—Apparatus or machines for carrying out printing operations combined with other operations with means for applying specific material other than ink
    • B41F19/005—Apparatus or machines for carrying out printing operations combined with other operations with means for applying specific material other than ink with means for applying metallic, conductive or chargeable material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)

Abstract

본 발명은 듀얼 레인 스크린 프린터에 관한 것으로, 인쇄회로기판(PCB)과, 본체프레임(1)과, 상기 본체프레임(1)의 얼레인유닛(2)상에 구비되는 컨베이어로 형성되되, 상기 컨베이어에 의해 인쇄회로기판(PCB)을 이송 투입받아 인쇄회로기판(PCB) 상에 마스크에 형성된 패턴으로 스퀴지에 의해 솔더를 도포하도록 형성되며, 솔더가 도포 인쇄된 상기 인쇄회로기판(PCB)을 컨베이어의 후단측으로 배출이송하도록 마련된 스크린 프린터에 있어서, 상기 컨베이어는 인쇄회로기판(PCB)을 투입받아 마스크측으로 이송 대기하도록 마련되고, 상기 인쇄회로기판(PCB)의 크기에 대응되도록 좌우 확장축소되며, 좌우 대칭구비된 복수의 투입대기부(100,100')와; 상기 투입대기부(100,100')에 인쇄회로기판이 대기된 후 이송받아 인쇄회로기판(PCB) 상에 솔더를 도포하고, 배출하며, 상기 인쇄회로기판(PCB)의 크기에 대응되도록 중심을 기준으로 좌우 확장축소되고, 좌우 대칭구비된 복수의 솔더인쇄부(200,200')와; 상기 솔더인쇄부(200,200')로부터 솔더가 도포된 인쇄회로기판이 이송받아 배출대기되도록 마련되고, 상기 인쇄회로기판(PCB)의 크기에 대응되도록 좌우 확장축소되며, 좌우 대칭구비된 복수의 배출대기부(300,300');로 형성된 것을 특징으로 하는 듀얼 레인 스크린 프린터에 관한 것이다.
PCT/KR2011/004779 2010-07-06 2011-06-30 듀얼 레인 스크린 프린터 WO2012005470A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0064939 2010-07-06
KR1020100064939A KR101025129B1 (ko) 2010-07-06 2010-07-06 듀얼 레인 스크린 프린터

Publications (2)

Publication Number Publication Date
WO2012005470A2 WO2012005470A2 (ko) 2012-01-12
WO2012005470A3 true WO2012005470A3 (ko) 2012-03-01

Family

ID=43939462

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/004779 WO2012005470A2 (ko) 2010-07-06 2011-06-30 듀얼 레인 스크린 프린터

Country Status (2)

Country Link
KR (1) KR101025129B1 (ko)
WO (1) WO2012005470A2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7315787B2 (ja) 2020-03-31 2023-07-26 株式会社Fuji 印刷制御装置および印刷制御方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101092990B1 (ko) * 2011-05-04 2011-12-12 주식회사 에스제이이노테크 듀얼레인 스크린프린터
KR101390147B1 (ko) * 2012-09-03 2014-05-27 주식회사이에스이 직렬인쇄가 가능한 스크린 프린터 및 이를 이용한 인쇄회로기판의 직렬인쇄방법
JP6209742B2 (ja) * 2014-03-18 2017-10-11 パナソニックＩｐマネジメント株式会社 スクリーン印刷システム、スクリーン印刷装置及び部品実装ライン
CN104555514B (zh) * 2014-12-31 2018-05-15 东莞市科立电子设备有限公司 一种轨道可调式双工位多功能在线式分板机
KR101857203B1 (ko) 2017-12-01 2018-05-11 주식회사 이노티스 이종패턴 인쇄가 가능한 마스킹유닛이 구비된 스크린 프린터
CN109109471A (zh) * 2018-09-21 2019-01-01 深圳市微印科技有限公司 一种双工位喷印设备
KR102253792B1 (ko) 2019-12-27 2021-05-20 주식회사 엘에이티 듀얼 스테이지 유닛 및 이를 포함하는 웨이퍼 로딩/언로딩 장치, 그리고 이를 이용한 웨이퍼 로딩/언로딩 방법
CN115748146B (zh) * 2022-11-29 2024-06-18 石狮市锦东织造股份有限公司 一种环保型高档织物面料织染装置
CN118342884B (zh) * 2024-06-17 2024-09-10 苏州昊岳科技有限公司 一种适用于多规格电池片的印刷设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002503161A (ja) * 1997-02-21 2002-01-29 スピードライン・テクノロジーズ・インコーポレーテッド はんだ収集ヘッドを備えた二重トラックステンシル印刷装置
KR200272306Y1 (ko) * 2002-01-24 2002-04-17 이주영 회로기판 이송용 가이드레일
JP2007190714A (ja) * 2006-01-17 2007-08-02 Yamaha Motor Co Ltd スクリーン印刷装置
KR20080061788A (ko) * 2006-12-28 2008-07-03 삼성테크윈 주식회사 부품실장기용 인쇄회로기판 이송장치 및 이를 이용한인쇄회로기판 이송방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002503161A (ja) * 1997-02-21 2002-01-29 スピードライン・テクノロジーズ・インコーポレーテッド はんだ収集ヘッドを備えた二重トラックステンシル印刷装置
KR200272306Y1 (ko) * 2002-01-24 2002-04-17 이주영 회로기판 이송용 가이드레일
JP2007190714A (ja) * 2006-01-17 2007-08-02 Yamaha Motor Co Ltd スクリーン印刷装置
KR20080061788A (ko) * 2006-12-28 2008-07-03 삼성테크윈 주식회사 부품실장기용 인쇄회로기판 이송장치 및 이를 이용한인쇄회로기판 이송방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7315787B2 (ja) 2020-03-31 2023-07-26 株式会社Fuji 印刷制御装置および印刷制御方法

Also Published As

Publication number Publication date
KR101025129B1 (ko) 2011-03-25
WO2012005470A2 (ko) 2012-01-12

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