WO2011159003A1 - 마이크로폰 - Google Patents

마이크로폰 Download PDF

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Publication number
WO2011159003A1
WO2011159003A1 PCT/KR2010/008453 KR2010008453W WO2011159003A1 WO 2011159003 A1 WO2011159003 A1 WO 2011159003A1 KR 2010008453 W KR2010008453 W KR 2010008453W WO 2011159003 A1 WO2011159003 A1 WO 2011159003A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
case
microphone
sound hole
Prior art date
Application number
PCT/KR2010/008453
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
심용현
이상호
허형용
Original Assignee
주식회사 비에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이 filed Critical 주식회사 비에스이
Publication of WO2011159003A1 publication Critical patent/WO2011159003A1/ko

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to a microphone, and more particularly, to a microphone capable of improving acoustic characteristics by providing an acoustic path that can prevent light through sound holes from directly reaching a MEMS chip.
  • a condenser microphone widely used in a mobile communication terminal or an audio device includes a voltage bias element, a diaphragm / back plate pair forming a capacitor C that changes in response to sound pressure, and an electric field for buffering an output signal.
  • Effect transistor JFET
  • the diaphragm, spacer ring, insulation ring, back plate, and conduction ring are sequentially inserted in one case, and finally, the printed circuit board mounted with circuit parts is inserted, and the end of the case is printed circuit. It was bent to the substrate side to complete one assembly.
  • MEMS Micro Electro Mechanical System
  • a microphone with a mass chip manufactured using such a micromachining technology is a miniaturized, high-performance, multifunctional, conventional micro-machined parts such as diaphragm, spacer ring, insulation ring, back plate, conduction ring, etc. There is an advantage that can be integrated to improve the stability and reliability.
  • the silicon condenser microphone 100 includes a printed circuit board 110, an amplifier 130 mounted on the printed circuit board 110, an amplifier 130, also called a special purpose semiconductor (ASIC) chip, and a sound hole 140.
  • the case 150 is formed.
  • a sound hole 140 is provided in an upper case, and a MEMS chip 120 is mounted in a printed circuit board provided in a lower part thereof.
  • the lower side of the printed circuit board 110 is provided with a connection terminal for electrical coupling with an external device.
  • the external sound flows into the sound hole 140 formed in the case 150, is transferred to the MEMS chip 120, and is converted into an electrical signal.
  • the electrical signal is transferred to the amplifier 130 and amplified.
  • FIG. 2 is another embodiment of the MEMS microphone 200 using the MEMS chip 220 is shown as a cross-sectional view.
  • the microphone 200 is composed of a printed circuit board 210, a MEMS chip 220 mounted on the printed circuit board 210, an amplifier 130, and a case 150.
  • the sound hole 240 of the microphone 200 is provided in the printed circuit board 210 instead of the case. External sound flows into the sound hole 240 formed in the substrate 210 and is transferred to the MEMS chip 220.
  • the microphone of such a configuration also has a slightly different configuration from the conventional microphone 100 of the foregoing configuration, but still the sound from the outside through the sound hole 240, as well as light from the outside, such as visible light, infrared rays, ultraviolet rays, etc. There is a possibility that the transmission, and the acoustic path is not formed, there is a problem that the adjustment of the high frequency band is difficult.
  • the present invention has been proposed to solve the above problems, and an object of the present invention is to provide a microphone capable of blocking the generation of light noise by providing an acoustic path to prevent external light from being directly introduced into the inside. .
  • Microphone of the present invention one side is open case; A printed circuit board mounted inside the case; MEMS chips mounted on the printed circuit board; And an amplifier electrically connected to the MEMS chip and mounted on the printed circuit board, wherein the microphone has an acoustic path formed to allow external sound to reach the MEMS chip.
  • the acoustic path is characterized in that it is formed so that the MEMS chip and the amplifier is not directly exposed to the external space.
  • an external sound hole is formed in the case, and the printed circuit board is formed of first and second printed circuit boards, and the first printed circuit board is coupled to the other side of the case and communicates with the external sound holes.
  • a first printed circuit board having sound holes, wherein the second printed circuit board is coupled to one side of the case, is spaced apart from the first printed circuit board, and has a plurality of connection terminals formed on an outer surface thereof 2 is a printed circuit board, wherein the MEMS chip is mounted on an inner surface of the first printed circuit board, and is mounted to face the inner sound hole, and the outer sound hole and the inner sound hole do not face each other, and the sound path And a space formed between the other side of the case and the first printed circuit board, the space configured to interconnect the external sound holes and the internal sound holes. Is preferred.
  • the first printed circuit board is tightly coupled to the other side surface of the case, and a plating layer is provided on an outer surface of the first printed circuit board tightly coupled to the other side surface of the case. 1 It is preferable that a part of the plating layer on the outer surface of the printed circuit board includes an inner path space formed by corrosion.
  • the inner path space may be formed along a straight line or a curve.
  • the printed circuit board is coupled to one side of the case, the printed circuit board is provided with an external sound hole, a substrate inner path space and an internal sound hole, the external sound hole and the outer space on the outer surface of the printed circuit board
  • the groove is formed to face, the inner sound hole is a groove formed to face the inner space of the case, the substrate inner path space is preferably a space formed inside the printed circuit board to communicate the outer sound and the inner sound hole.
  • the printed circuit board may include at least one double-sided printed circuit board, and the external sound holes may be formed in an outer layer facing the outside of the printed circuit board, and the internal sound holes may form an inner space of the printed circuit board. It is formed in the inner layer facing, the substrate inner path space is preferably formed in at least one intermediate layer located in the middle of the printed circuit board.
  • the substrate internal path space is preferably formed along a straight line or curve.
  • the microphone according to the present invention it is possible to obtain an effect that direct exposure of the MEMS chip to the light flowing from the sound hole can be prevented.
  • the microphone according to the present invention by providing an acoustic path, it is possible to obtain an effect that a high specification acoustic characteristics can be obtained.
  • 1 is a schematic cross-sectional view of a conventional microphone
  • FIG. 3 is a schematic cross-sectional view of a microphone of an embodiment according to the present invention.
  • FIG. 4 is an exploded perspective view of the microphone of FIG. 3;
  • 5 and 6 are respectively a perspective view and an exploded perspective view of the microphone of FIG. 3 from below;
  • Fig. 7 is a schematic cross sectional view of a microphone of another exemplary embodiment according to the present invention.
  • the microphone 1 of the present embodiment is a device for converting sound waves such as voice, sound, sound, etc. into electrical signals, and includes a case 10, a printed circuit board, a MEMS chip 30, an amplifier 50, and an acoustic path 60. ) Is configured to include.
  • the case 10 forms an external appearance of the microphone. Various components are mounted in the inside. One side of the case 10 is open, and the other side 11 is formed with an external sound hole 12. Since the external sound hole 12 is penetrated, external sound flows into the case.
  • the case 10 is a hexahedron whose surface is rectangular.
  • the overall shape of the case may be variously modified. That is, the case may have a cylindrical shape, or may have a columnar shape having an elliptical cross section in the horizontal direction.
  • the case 10 has four side surfaces 14 extending downward from the other side 11.
  • the lower end of each side 14 is provided with a curling portion 16.
  • the curling unit 16 is fixed as the shape shown in FIG. 5 after the other parts shown inside the case are inserted to fix the internal parts.
  • the interior parts are fixed and assembled by curing the curling portion 16 at the lower end of the case side. Therefore, there is no need for a fixing means such as a separate adhesive for fixing between internal parts.
  • the case 10 is formed of a conductive material such as nickel, copper, aluminum, copper, or an alloy thereof having excellent noise blocking characteristics.
  • the printed circuit board is composed of a first printed circuit board 20 and a second printed circuit board 40.
  • the printed circuit board may be provided as one, not provided separately.
  • the first printed circuit board 20 is coupled to the inside of the other side 11 of the case 10.
  • the first printed circuit board 20 is mounted with an amplifier 50, also referred to as a MEMS chip 30 and a special purpose semiconductor (ASIC) chip, on its lower side with reference to the directions of FIGS. 4 and 6.
  • the first printed circuit board 20 is also called a die (DIE) printed circuit board because various electrical components are mounted thereon.
  • DIE die
  • the outer sound hole 12 and the inner sound hole 22 are configured not to face each other, as shown in FIG. That is, the outer sound hole 12 and the inner sound hole 22 are positioned so as to shift from each other.
  • the second printed circuit board 40 is coupled to one open side of the case 10. While coupled to the open side of the case 10, it defines an inner space 82 with the case 10. The second printed circuit board 40 is spaced apart from the first printed circuit board 20.
  • connection terminals 42 are provided on the outer surface of the second printed circuit board 40.
  • connection terminal is also called a connection terminal or pad.
  • the second printed circuit board 40 is also called a pad printed circuit board.
  • the connection terminal 42 is electrically connected to the MEMS chip 30 and the amplifier 50 therein, and is configured to connect with an external device.
  • the number of connection terminals 42 can be increased or decreased as needed, and the provided position can be changed as needed.
  • the MEMS chip 30 is mounted on the inner surface of the first printed circuit board 20.
  • the inner surface refers to the surface facing the inner space 62.
  • the MEMS chip 30 is mounted to face the internal sound hole 22.
  • the MEMS chip 30 is mounted to face the internal sound hole so that the MEMS chip 30 can receive the sound signal introduced through the internal sound hole 22. 22) is mounted on the formed portion.
  • the MEMS chip 30 converts the received acoustic signal into an electrical signal.
  • the amplifier 50 is mounted on the inner surface of the first printed circuit board 20 together with the MEMS chip 30.
  • the amplifier 50 receives an electrical signal from the MEMS chip 30 and amplifies the signal. Although not shown in detail, the MEMS chip 30 and the amplifier 50 are interconnected by a gold bonding wire. The amplifier 50 is electrically connected to the first printed circuit board 20.
  • the microphone 1 of the present embodiment further includes a conductive connection member 70 electrically connecting the first printed circuit board 20 and the second printed circuit board 40 to each other.
  • Each conductive connecting member 70 is a spring in which a conductive metal wire is bent in a coil form. Because of the spring, even if the assembly tolerance is not precise, the electrical connection between the first and second printed circuit boards 20, 40 is made simple and reliable.
  • the conductive connecting member may be variously modified in a shape, a material, and the like within a range that satisfies the electrical connection between the first and second printed circuit boards in addition to the spring shape formed by bending the conductive metal wire.
  • the conductive connecting member 70 may not necessarily be a metal in the material thereof, but may be conductive silicon, or may be formed of a non-conductive material and provided with a conductive layer by plating on its outer surface.
  • the conductive connecting member may also be a simple cylinder or pin shape instead of a spring.
  • the first and second printed circuit boards are provided with grooves for fixing both ends of the conductive connecting member, without the help of any other configuration. Can be directly fixed to the first and second printed circuit boards.
  • the first printed circuit board 20 and the second printed circuit board 40 maintain a mutual gap. And it is further provided with a space supporting member 80 that can be supported.
  • the spaced support member 80 has a rectangular frame shape so as to correspond to the shapes of the first printed circuit board 20 and the second printed circuit board 40.
  • the spaced apart supporting member 80 has an empty center portion to define the inner space 82 together with the first and second printed circuit boards 20 and 40.
  • the portion surrounding the inner space 82 is the edge portion 84.
  • the spaced support member 80 has a thickness corresponding to a distance from which the first and second printed circuit boards 20 and 40 are spaced apart from each other.
  • the spaced support member 80 is provided with an accommodation portion 86 in which each of the plurality of conductive connection members 70 is accommodated and supported.
  • Receiving portion 86 is a cylindrical shape with a portion of the open side, the spring-shaped conductive connecting member 70 is simply fitted in the vertical direction after being prevented from being separated in the horizontal direction.
  • Receiving portion 86 is provided with all four, one for each corner. After inserting the spring-shaped conductive connecting member 70 into each of the receiving portions 86, and then inserting with the other components in the case and the curling portion 16 is cured, the assembly of the microphone 1 is completed easily. .
  • the acoustic path 60 refers to a path formed so that external sound can reach the MEMS chip 30.
  • the external sound is introduced through the external sound hole 12, and then passes through the internal path space 24 formed between the case 10 and the first printed circuit board, and then through the internal sound hole 22. It is delivered up to the MEMS chip 30.
  • the acoustic path 60 is composed of the outer sound hole 12, the inner path space 24 and the inner sound hole 22. Referring to FIG. 3, in this embodiment, the acoustic path 60 is formed to be refracted. Therefore, the MEMS chip 30 is not directly exposed to the external space. However, in the present exemplary embodiment, the acoustic path is refracted once, but in another embodiment, the acoustic path may be formed to be refracted twice or more as necessary.
  • the amplifier 50 is not directly exposed to the outside because the MEMS chip 30 is mounted to cover the inner sound hole 22 as a whole even if the acoustic path 60 is not refracted.
  • the amplifier 50 is not directly exposed to the outside due to the refracted acoustic path.
  • a copper plating layer 26 is provided on the outer surface of the first printed circuit board 20.
  • the middle portion of the plating layer 26 is partially removed by corrosion to form the inner path space 24.
  • the inner path space 24 is formed along a straight line, but in another embodiment, may be formed in a curved shape.
  • the length, direction, shape, or height of the inner path space constituting the sound path may be variously modified according to a user's needs.
  • the acoustic path is configured to be refracted.
  • the method of forming the acoustic path can be formed by a method such as cutting, mold, injection, etc., in addition to the method of forming a corrosive copper layer as in the above-described embodiment.
  • the acoustic path is not limited to that formed in the first printed circuit board as in the present embodiment, and may be formed in the case as long as the external sound hole and the internal sound hole communicate with each other. You may.
  • the acoustic path may include a space formed between the other side of the case and the first printed circuit board. That is, the inner space formed between the other side of the case and the first printed circuit board interconnects the outer sound hole and the inner sound hole, and the inner space and the outer sound hole and the inner space are combined to form an acoustic path.
  • the other side 11 of the case and the first printed circuit board 20 are arranged to be spaced apart from each other, and an internal space is formed therebetween. It is configured as possible. This internal space forms part of the sound path.
  • a member for maintaining a distance between the other side 11 of the case and the first printed circuit board 20 may be further provided.
  • the added member may be configured in various shapes and volumes of the inner space for connecting the outer and inner sound holes.
  • the microphone 1 of this embodiment is configured so that external sound reaches the MEMS chip via the refracted acoustic path, there is an advantage that generation of light noise is prevented. That is, an electronic component such as an internal MEMS chip or an amplifier may be prevented from being directly exposed to various types of external light such as visible light, ultraviolet light, infrared light, or the like.
  • the inner path space which is part of the acoustic path is formed by corrosion of a part of the plating layer, it is easy to manufacture, and there is an advantage that the shape can be modified.
  • a microphone 1a of another embodiment according to the present invention is shown in a schematic sectional view.
  • the acoustic path 60a is refracted as in the previous embodiment. Therefore, by having the acoustic path refracted, the MEMS chip 30a is prevented from being directly exposed to the outside. Actions and effects obtained in the present embodiment can be obtained in the same or appropriately modified manner as in the previous embodiment.
  • the difference from the configuration with the foregoing embodiment is that the acoustic path 60a is formed on a single printed circuit board 20a provided on one side of the case.
  • the difference of the following structure is demonstrated.
  • one printed circuit board 20a is provided and is coupled to one side of the case 10a.
  • the printed circuit board 20a is provided with an external sound hole 22a, a substrate internal path space 24a, and an internal sound hole 26a.
  • the external sound hole 22a is a space formed to face the external space of the printed circuit board 20a.
  • the inner sound hole 26a is a space formed to face the inner space of the case 10a.
  • the substrate inner path space 24a is a space formed inside the printed circuit board 20a to communicate the external sound holes 22a and the internal sound holes 24a.
  • the printed circuit board 20a includes at least one double-sided printed circuit board.
  • the double-sided printed circuit board 20a is formed of an inner insulating layer 21a disposed in the middle and copper plate layers 23a and 42a provided on upper and lower portions of the inner insulating layer 21a, respectively.
  • the double-sided printed circuit board further includes an upper insulating layer 25a thereon. If it is, the lower copper plate layer 42a leaves the connection terminals 42a by the etching method and other portions are removed.
  • the outer layer facing the outside of the printed circuit board refers to the inner insulating layer 21a, not the lower copper plate layer 42a. Therefore, in the present embodiment, the outer sound hole 22a is formed in the inner insulating layer 21a, the inner sound hole 26a is formed in the upper insulating layer 25a, and the substrate inner path space 24a is formed of the copper plate layer ( It is formed in 23a).
  • the substrate inner path space 24a may be formed in various shapes as desired along a straight line or curve.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)
PCT/KR2010/008453 2010-06-17 2010-11-26 마이크로폰 WO2011159003A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100057564A KR101116308B1 (ko) 2010-06-17 2010-06-17 마이크로폰
KR10-2010-0057564 2010-06-17

Publications (1)

Publication Number Publication Date
WO2011159003A1 true WO2011159003A1 (ko) 2011-12-22

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ID=45348375

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Application Number Title Priority Date Filing Date
PCT/KR2010/008453 WO2011159003A1 (ko) 2010-06-17 2010-11-26 마이크로폰

Country Status (4)

Country Link
KR (1) KR101116308B1 (zh)
CN (2) CN202135312U (zh)
TW (1) TW201216726A (zh)
WO (1) WO2011159003A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3964808A1 (en) * 2020-09-03 2022-03-09 Hosiden Corporation Detection sensor and detection device including the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101116308B1 (ko) * 2010-06-17 2012-03-14 주식회사 비에스이 마이크로폰
KR101480615B1 (ko) 2013-05-29 2015-01-08 현대자동차주식회사 지향성 마이크로폰 장치 및 그의 동작방법
KR101369464B1 (ko) 2013-06-27 2014-03-06 주식회사 비에스이 멤스 마이크로폰

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100737726B1 (ko) * 2006-07-10 2007-07-10 주식회사 비에스이 멤스 마이크로폰 패키징 구조체
KR20080005778U (ko) * 2007-05-26 2008-12-01 고어텍 인크 먼지 방지 사운드 홀을 갖는 실리콘 마이크로 폰
KR20080005779U (ko) * 2007-05-26 2008-12-01 고어텍 인크 실리콘 콘덴서 마이크로 폰
KR20080106717A (ko) * 2007-06-04 2008-12-09 주식회사 비에스이 콘덴서 마이크로폰

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201042078Y (zh) * 2007-05-26 2008-03-26 歌尔声学股份有限公司 具有防尘声孔的硅麦克风
CN201042077Y (zh) * 2007-05-26 2008-03-26 歌尔声学股份有限公司 硅电容麦克风
KR101116308B1 (ko) * 2010-06-17 2012-03-14 주식회사 비에스이 마이크로폰

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100737726B1 (ko) * 2006-07-10 2007-07-10 주식회사 비에스이 멤스 마이크로폰 패키징 구조체
KR20080005778U (ko) * 2007-05-26 2008-12-01 고어텍 인크 먼지 방지 사운드 홀을 갖는 실리콘 마이크로 폰
KR20080005779U (ko) * 2007-05-26 2008-12-01 고어텍 인크 실리콘 콘덴서 마이크로 폰
KR20080106717A (ko) * 2007-06-04 2008-12-09 주식회사 비에스이 콘덴서 마이크로폰

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3964808A1 (en) * 2020-09-03 2022-03-09 Hosiden Corporation Detection sensor and detection device including the same
US11788881B2 (en) 2020-09-03 2023-10-17 Hosiden Corporation Detection sensor and detection device including the same

Also Published As

Publication number Publication date
CN102316393A (zh) 2012-01-11
TW201216726A (en) 2012-04-16
CN202135312U (zh) 2012-02-01
KR101116308B1 (ko) 2012-03-14
KR20110137559A (ko) 2011-12-23

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