WO2011150691A1 - 汽车通用压力传感器 - Google Patents
汽车通用压力传感器 Download PDFInfo
- Publication number
- WO2011150691A1 WO2011150691A1 PCT/CN2011/070245 CN2011070245W WO2011150691A1 WO 2011150691 A1 WO2011150691 A1 WO 2011150691A1 CN 2011070245 W CN2011070245 W CN 2011070245W WO 2011150691 A1 WO2011150691 A1 WO 2011150691A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor
- silicon
- automotive
- core
- silicon piezoresistive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L23/00—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
- G01L23/08—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically
- G01L23/18—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically by resistance strain gauges
Definitions
- the invention relates to a general-purpose pressure sensor for automobiles, in particular to a universal pressure sensor for automobiles based on silicon-based MEMS technology, which can be used for oil pressure, air pressure, fuel, refrigerant, hydraulic medium and the like on various automobiles and various vehicle systems. Pressure measurement. Background technique
- automotive universal pressure sensors are key components of automotive electronic control systems and one of the core contents of automotive electronics technology. Automotive universal pressure sensors are used in automobiles for pressure measurement control of brake systems, automatic transmissions, air conditioning systems, suspension systems, engine oil pressure, power switching transmission systems, direct engine injection pressure, LPG and CNG systems.
- the sputtered film type universal pressure sensor derived from the strain type solves the shortcomings of the front strain type.
- the use of the temperature zone can also meet the requirements of the automotive grade, the sensitivity output can reach 5mV/V, and the impact pressure overload is 2 times.
- the present invention provides a universal pressure sensor for a vehicle, which has the characteristics of high measurement accuracy and low cost, and can meet the measurement requirements of oil pressure, air pressure, fuel, refrigerant, hydraulic pressure, etc., and is convenient and reliable to install.
- a general-purpose automobile pressure sensor comprising a sensor housing, a silicon piezoresistive sensitive core body, a sensor core holder, a signal conditioning circuit, and an automotive electrical interface, the silicon piezoresistive sensitive core body and the sensor core
- the seat and signal conditioning circuit is located in an inner chamber of the sensor housing, and the sensor housing is mounted to the automotive electrical interface.
- the silicon piezoresistive sensitive core comprises a silicon piezoresistive sensing element and a glass ring piece.
- the silicon piezoresistive sensing element includes a silicon film whose surface is sequentially covered with a silicon dioxide layer and a silicon nitride layer.
- the silicon piezoresistive sensing element is provided with a Wheatstone bridge in the middle of the front surface, and after the silicon film is exposed on the front side of the front surface, it is tamped on the side of the glass ring sheet having a similar thermal expansion coefficient as silicon.
- the strain resistor on the Wheatstone bridge is led out by splicing the inner leads.
- the silicon piezoresistive sensing element and the front surface of the glass ring sheet form an insulating oxide layer.
- the other side of the glass ring piece is sealingly fixed to the annular pit surface provided on the sensor core seat.
- the sensor core seat seals a pressure port that is screwed onto the sensor housing.
- the inner lead on the silicon piezoresistive sensitive core passes through one end of the central hole on the annular pit surface of the sensor core seat, is introduced into the adapter plate disposed at the other end of the central hole, and is then subjected to the signal conditioning circuit.
- the automotive electrical interface is brought out.
- the sensor housing includes a sensor base and a sensor cover that is screwed to the sensor base to form an inner chamber.
- the sensor cover is mounted on the automotive electrical interface.
- the sensor base has a stepped hole as a pressure inlet port in the middle of the sensor base.
- the sensor core seat is screwed to the stepped hole on the sensor base by a thread sealant.
- the circumferential surface of the stepped hole has a ring-shaped groove, and the annular groove An O-ring is disposed.
- the sensor core seat is screwed to the stepped hole on the sensor base, and the sensor core seat presses the O-ring to ensure the sensor core seat is sealed and fixed to the sensor base.
- the signal conditioning circuit board provided with the signal conditioning circuit is fixed in the inner chamber of the sensor housing, and the signal conditioning circuit has signal amplification, zero and full output conditioning, zero position and sensitivity temperature. Coefficient compensation and nonlinear trimming circuit.
- the senor has a pressure range of 0 to 0.5 MPa to 0 to 100 MPa
- the round silicon film has a diameter of 2 mm to 4 mm and a thickness of 0.22 to 0.91 mm.
- the inner wall of the glass ring piece and the inner wall of the center hole of the sensor core seat are provided with an adhesive silicone rubber as an insulating surface.
- the sensor cover is screwed to the automotive electrical interface by a sealant, a ring-shaped connecting seam between the sensor core seat and the sensor base, and between the sensor cover and the sensor base Ring-shaped joints, sealed by laser or electron beam seals.
- the sensor core holder, the sensor base and the sensor housing are made of stainless steel.
- the glass ring sheet is a Pyrex 7740 or GG-17 glass ring sheet.
- An advantageous technical effect of the present invention is that: the silicon piezoresistive sensing element is provided with a Wheatstone bridge on the front side, and the reverse side is used as a pressure receiving surface, so that the external medium pressure is introduced through the pressure inlet port, and the reverse side of the silicon piezoresistive sensing element is pressed , reducing the impact of external media.
- the silicon piezoresistive sensing element is sealed and fixed to the sensor core seat by a glass ring piece, and the sensor core seat is sealed and fixed to the inner side of the pressure inlet port of the sensor housing, and the sensor housing is fixed by the sensor base and the sensor base
- the sensor base is formed by a sensor cover body forming an inner chamber, the sensor cover body is mounted on the automotive electrical interface, and the sensor base has a stepped hole as a pressure inlet port in the middle of the sensor base, and the sensor core seat is screwed by a thread sealant
- the stepped hole on the sensor base ensures the sealing reliability between the glass ring piece, the sensor core seat, the sensor base and the sensor cover by means of multiple measures, thereby ensuring measurement reliability.
- the silicon piezoresistive sensing element and the front surface of the glass ring form an insulating oxide layer, which improves the measurement accuracy.
- the introduction of the signal conditioning circuit realizes amplification signal amplification, zero and full-scale output conditioning, zero position and sensitivity temperature coefficient compensation, and non- Linear adjustment, fully meet the requirements of automotive high pressure measurement.
- FIG. 1 is a schematic structural view of a silicon piezoresistive sensing element according to an embodiment of the present invention
- FIG. 2 is a schematic structural view of a silicon piezoresistive sensitive core according to an embodiment of the present invention
- FIG. 3 is a schematic view showing the assembly of a silicon piezoresistive sensitive core and a sensor core holder according to an embodiment of the present invention
- FIG. 4 is a schematic view showing the structure of the sensor core holder and the sensor base after assembly according to an embodiment of the present invention
- FIG. 5 is a schematic structural view of a general-purpose automobile pressure sensor according to an embodiment of the present invention.
- Automotive universal pressure sensor including sensor housing, silicon piezoresistive sensitive core, sensor core holder, signal conditioning circuit, automotive electrical interface.
- the silicon piezoresistive sensitive core, the sensor core block and the signal conditioning circuit are located in the inner chamber of the sensor housing.
- the sensor housing is mounted on the automotive electrical interface and is equipped with signal conditioning
- the signal conditioning circuit board 101 of the road is fixed to the inner chamber of the sensor.
- the silicon piezoresistive sensitive core is composed of a silicon piezoresistive sensing element 1 and a glass ring sheet 2.
- the silicon piezoresistive sensing element 1 comprises a circular and planar silicon film 11, the front side of which is sequentially covered with a silicon dioxide (; SiO 2 ) layer 12 and a silicon nitride (Si 3 N 4 ) layer 13 . .
- the front middle portion of the silicon piezoresistive sensing element 1 i.e., the surface of the silicon nitride layer 13
- the glass ring having a similar thermal expansion coefficient to silicon is occluded.
- the strain resistor 14 on the Wheatstone bridge is led out by splicing the inner wire 15 of the gold wire, and the reverse side is pressed to reduce the influence of the external medium.
- the front surface of the silicon piezoresistive sensing element 1 and the glass ring sheet 2 is subjected to semiconductor low temperature anodization insulation treatment to form an insulating oxide layer.
- the other side of the glass ring piece 2 (unpolished surface, viewed from the perspective of Fig. 3) is fixed to the annular pit surface provided on the sensor core holder 3 by epoxy sealing.
- the sensor core holder 3 seals the pressure inlet port that is screwed onto the sensor housing.
- the gold wire inner lead 15 on the piezoresistive sensitive core passes through one end of the central hole of the annular groove surface of the sensor core seat 3, and is introduced into the adapter plate 4 provided at the other end of the center hole of the sensor core seat, and then The signal conditioning circuit is taken up by the automotive electrical interface 7.
- the adapter plate 4 is bonded to the annular concave surface at the other end of the center hole of the sensor core holder 3, and is connected to the output of the signal conditioning circuit board 101 via the lead cable core 8.
- the sensor housing is comprised of a sensor base 5 and a sensor cover 6.
- the sensor cover 6 is screwed to the sensor base 5 to form an inner chamber.
- the sensor core holder 3, the sensor base 5 and the sensor cover are made of stainless steel.
- the sensor cover 6 is mounted on the automotive electrical interface 7.
- the middle of the sensor base 5 has a stepped hole as a pressure inlet port, and the external thread of the sensor core seat 3 is screwed to the threaded groove in the stepped hole of the sensor base 5 through the thread sealant 10.
- the stepped bore ring has a ring-shaped groove on its circumference, and the ring-shaped groove is provided with an O-ring 51.
- the sensor core seat 3 While the sensor core seat 3 is screwed to the stepped hole on the sensor base 5, the sensor core seat 3 presses the O-ring 51 (can be screwed in with a fixed torque wrench until it is tightly sealed) to realize the sensor core seat 3 is fixed to the seal of the sensor base 5.
- the inner wall of the glass ring piece 2 and the inner wall of the central hole on the sensor core seat 3 are provided with an adhesive silicone rubber as an insulating surface, and a ring connection between the sensor core seat 3 and the sensor base 5
- the slit 91, and the annular connecting slit 92 between the sensor base 5 and the sensor cover 6, are sealed by laser or electron beam to form a highly reliable triple multi-pass seal structure.
- a signal conditioning circuit board 101 provided with a signal conditioning circuit is fixed to the inner chamber of the sensor.
- the signal conditioning circuit has signal amplification, zero and full output conditioning, zero and sensitivity temperature coefficient compensation, and a nonlinear trimming circuit.
- the silicon The diaphragm 11 has a diameter of 2 mm to 4 mm and a thickness of 0.22 to 0.91 mm.
- the sealing of the structure is particularly important, and the sensor cover 6 is screwed to the automotive electrical interface 7 by means of a sealant.
- the annular connecting seam 91 between the sensor core base 3 and the sensor base 5, and the annular connecting seam 92 between the sensor cover 6 and the sensor base 5 are connected by laser or electron beam sealing to form a high Reliable multi-channel sealing structure.
- the glass ring sheet 2 is a Pyrex 7740 or GG-17 glass ring sheet.
- the Pyrex glass ring is a product of Coming. It is designed for semiconductor packaging and has physical properties close to silicon.
- the alternative product is GG-17 borosilicate glass.
- the Wheatstone bridge portion of the silicon piezoresistive sensing element is fabricated by a Chinese patent "a miniature dynamic piezoresistive universal pressure sensor and its manufacturing method" (Patent No. ZL2003101063298).
- the above described embodiments combine semiconductor planar integrated circuit technology, MEMS technology and digital intelligent circuit technology to create a universal automotive pressure sensor with low cost, high precision, high reliability and long life.
- the main performance index of the automobile universal pressure sensor based on the technology of the present invention is:
- Power supply and signal Power supply 5VDC ⁇ 0.5, signal 0 ⁇ 5V between any ratio output;
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Measuring Fluid Pressure (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013512730A JP5671134B2 (ja) | 2010-05-31 | 2011-01-14 | 自動車用の汎用圧力センサ |
BR112012030407-0A BR112012030407B1 (pt) | 2010-05-31 | 2011-01-14 | Sensor de pressão geral para automóvel |
EP11789070.7A EP2579014B1 (en) | 2010-05-31 | 2011-01-14 | Universal pressure sensor for automobile |
KR1020127034395A KR101659528B1 (ko) | 2010-05-31 | 2011-01-14 | 차량용 범용 압력 센서 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101878941A CN102023066B (zh) | 2010-05-31 | 2010-05-31 | 汽车通用压力传感器 |
CN201010187894.1 | 2010-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011150691A1 true WO2011150691A1 (zh) | 2011-12-08 |
Family
ID=43864634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2011/070245 WO2011150691A1 (zh) | 2010-05-31 | 2011-01-14 | 汽车通用压力传感器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8459124B2 (zh) |
EP (1) | EP2579014B1 (zh) |
JP (1) | JP5671134B2 (zh) |
KR (1) | KR101659528B1 (zh) |
CN (1) | CN102023066B (zh) |
BR (1) | BR112012030407B1 (zh) |
WO (1) | WO2011150691A1 (zh) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102901600A (zh) * | 2011-07-28 | 2013-01-30 | 上海朝辉压力仪器有限公司 | 汽车用传感器 |
DE102011081638A1 (de) * | 2011-08-26 | 2013-02-28 | Zf Friedrichshafen Ag | Gehäuseteil für ein Gehäuse eines Sensors für ein Fahrzeuggetriebe, Gehäuse für einen Sensor für ein Fahrzeuggetriebe, Sensor für ein Fahrzeuggetriebe und Verfahren zum Herstellen eines Sensors für ein Fahrzeuggetriebe |
US8806925B2 (en) * | 2011-11-23 | 2014-08-19 | S3C, Inc. | Mechanical packaging technique of attaching MEMS and flex circuit |
CN103185606B (zh) * | 2011-12-30 | 2016-12-07 | 浙江盾安禾田金属有限公司 | 传感器芯体的封装结构及芯体和传感器 |
CN103376179B (zh) * | 2012-04-12 | 2016-08-10 | 浙江三花股份有限公司 | 一种压力传感器 |
CN102661822A (zh) * | 2012-04-28 | 2012-09-12 | 无锡永阳电子科技有限公司 | 硅应变片金属封装传感器 |
CN103376180B (zh) * | 2012-04-28 | 2016-08-03 | 浙江三花股份有限公司 | 一种热交换设备及其压力传感器 |
CN102853964B (zh) * | 2012-07-27 | 2014-01-08 | 浙江盾安人工环境股份有限公司 | 一种压力传感器的组装结构 |
DE102012111001A1 (de) * | 2012-11-15 | 2014-05-15 | Endress + Hauser Gmbh + Co. Kg | Dichtring und Druckmessaufnehmer mit mindestens einem solchen Dichtring |
CN103852104B (zh) * | 2012-12-03 | 2017-08-25 | 上海文襄汽车传感器有限公司 | 基于阳极键合的温度压力复合传感器 |
CN104155048B (zh) * | 2013-05-13 | 2016-07-06 | 上海朝辉压力仪器有限公司 | 地暖用变送器 |
CN103308217B (zh) * | 2013-06-06 | 2015-05-20 | 清华大学 | 一种高温压力传感器的封装结构 |
CN203490024U (zh) * | 2013-08-02 | 2014-03-19 | 上海保隆汽车科技股份有限公司 | 轮胎压力监测传感器 |
CN103615530B (zh) * | 2013-11-28 | 2017-01-11 | 盛瑞传动股份有限公司 | 一种变速器用油压传感器 |
RU2649042C1 (ru) | 2014-04-25 | 2018-03-29 | Роузмаунт Инк. | Коррозионностойкий модуль давления для измерительного преобразователя давления технологической текучей среды |
CN104132767B (zh) * | 2014-07-25 | 2016-06-01 | 北京控制工程研究所 | 一种基于mems的压力传感器 |
CN104483048A (zh) * | 2014-10-16 | 2015-04-01 | 大连睿科电子有限公司 | 一种绝缘金属硅电阻压力传感器 |
CN104848983A (zh) * | 2014-11-24 | 2015-08-19 | 重庆斯凯力科技有限公司 | 电子压力传感器 |
CN105136377A (zh) * | 2015-08-18 | 2015-12-09 | 熊辉 | 溅射薄膜锤击由壬压力传感器 |
CN105806520A (zh) * | 2016-05-18 | 2016-07-27 | 北京科技大学 | 一种电阻应变式压力传感器及其测试方法 |
CN106767977A (zh) * | 2016-12-29 | 2017-05-31 | 无锡盛邦电子有限公司 | 一种密封性能可靠的传感器封装结构 |
CN107144391A (zh) * | 2017-07-10 | 2017-09-08 | 深圳瑞德感知科技有限公司 | 一种集成式mems充油压力传感器 |
WO2019041122A1 (en) | 2017-08-29 | 2019-03-07 | Rosemount Inc. | PROCESS TRANSMITTER HAVING ROTARY COUPLING |
CN107631835A (zh) * | 2017-09-13 | 2018-01-26 | 中国电子科技集团公司第四十九研究所 | 一种应用于无引线封装mems绝压型芯片的压力测试装置 |
CN108151948A (zh) * | 2017-12-20 | 2018-06-12 | 中航电测仪器股份有限公司 | 一种宽温度范围压力传感器及其补偿方法 |
CN108583201B (zh) * | 2018-04-05 | 2021-08-06 | 浙江好亚汽车配件有限公司 | 汽车空调压力传感器 |
CN109236403B (zh) * | 2018-09-21 | 2024-02-23 | 浙江科丰传感器股份有限公司 | 汽车机油压力传感器 |
CN109990942A (zh) * | 2019-04-30 | 2019-07-09 | 芜湖天波光电技术研究院有限公司 | 一种高压共轨压力传感器 |
CN110557543B (zh) * | 2019-09-26 | 2021-06-29 | 高新兴科技集团股份有限公司 | 兼容性机芯外壳和具有其的摄像机 |
KR102245198B1 (ko) | 2019-11-28 | 2021-04-27 | 대양전기공업 주식회사 | 레이저 스캐터링을 적용한 센서 제조방법 및 센서 |
DE102020107481B3 (de) * | 2020-03-18 | 2021-08-05 | Tdk Electronics Ag | Verbindungselement für Funktionsteile eines elektrischen Bauelements und Verfahren |
CN111307365B (zh) * | 2020-03-24 | 2021-06-15 | 东莞市迈沃科技发展有限公司 | 一种压力传感器 |
CN112781780A (zh) * | 2020-12-30 | 2021-05-11 | 上海文襄汽车传感器有限公司 | 一种汽车油压压力传感器 |
CN113370920B (zh) * | 2021-05-12 | 2024-04-30 | 重庆新民康科技有限公司 | 一种具有数据线束定位保护的汽车传感器 |
CN113551826A (zh) * | 2021-07-22 | 2021-10-26 | 西人马联合测控(泉州)科技有限公司 | 一种压力传感器及其制备方法 |
CN114112182B (zh) * | 2021-11-05 | 2024-04-09 | 天津航空机电有限公司 | 一种带支架结构的高可靠性压力传感器结构 |
CN114112179B (zh) * | 2021-11-05 | 2024-04-09 | 天津航空机电有限公司 | 一种带隔热结构的电流型高精度压力传感器 |
CN114636506A (zh) * | 2022-03-22 | 2022-06-17 | 厦门乃尔电子有限公司 | 一种双余度差压传感器 |
CN114719903A (zh) * | 2022-03-28 | 2022-07-08 | 河北美泰电子科技有限公司 | 基于金属玻璃烧结基座焊接密封的温压复合传感器 |
CN115112287A (zh) * | 2022-07-07 | 2022-09-27 | 东风柳州汽车有限公司 | 一种具有冻结保护的汽车用水压传感装置 |
CN116558704B (zh) * | 2023-07-06 | 2023-10-10 | 中汇瑞德传感科技(苏州)有限公司 | 压力传感器和液压制动系统 |
CN116625559B (zh) * | 2023-07-24 | 2023-10-13 | 昆山灵科传感技术有限公司 | 压力传感器及压力复合传感器 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2047014U (zh) * | 1989-02-14 | 1989-11-01 | 于海波 | 硅自封闭压力传感器 |
CN1231030A (zh) * | 1996-09-16 | 1999-10-06 | Trw车辆电气与零件有限两合公司 | 压力传感装置,特别是用于汽车技术的压力传感装置 |
US6070469A (en) * | 1997-09-30 | 2000-06-06 | Matsushita Electric Works, Ltd. | Pressure sensor |
CN1544901A (zh) * | 2003-11-12 | 2004-11-10 | 王文襄 | 一种微型动态压阻压力传感器及其制造方法 |
CN1828247A (zh) * | 2005-03-04 | 2006-09-06 | 昆山双桥传感器测控技术有限公司 | 压阻式高频动态高压传感器 |
CN1834602A (zh) * | 2005-03-14 | 2006-09-20 | 昆山双桥传感器测控技术有限公司 | 压阻式高频动态低压传感器 |
CN2867323Y (zh) * | 2006-01-10 | 2007-02-07 | 昆山双桥传感器测控技术有限公司 | 车用压力传感器 |
CN101000271A (zh) * | 2006-01-10 | 2007-07-18 | 昆山双桥传感器测控技术有限公司 | 抗腐蚀的压力传感器 |
CN101493371A (zh) * | 2008-01-21 | 2009-07-29 | 昆山双桥传感器测控技术有限公司 | 抗辐射压力传感器 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6255141U (zh) * | 1985-09-26 | 1987-04-06 | ||
JP2645475B2 (ja) * | 1987-04-24 | 1997-08-25 | 日本電装株式会社 | 半導体式圧力検出装置 |
US5186055A (en) * | 1991-06-03 | 1993-02-16 | Eaton Corporation | Hermetic mounting system for a pressure transducer |
US5264820A (en) * | 1992-03-31 | 1993-11-23 | Eaton Corporation | Diaphragm mounting system for a pressure transducer |
DE4213857C2 (de) * | 1992-04-27 | 1995-10-19 | Endress Hauser Gmbh Co | Vorrichtung zum Messen von Druck und Differenzdruck |
JP3481326B2 (ja) * | 1994-11-30 | 2003-12-22 | 松下電工株式会社 | 半導体圧力センサー及びその製造方法 |
DE69528775T2 (de) * | 1994-12-20 | 2003-07-03 | Foxboro Co | AC Speisung eines Polysilizium Druckwandlers |
US6247369B1 (en) * | 1995-04-04 | 2001-06-19 | The United States Of America As Represented By The Administrator Of The National Aeronautics Of Space Administration | Multi-channel electronically scanned cryogenic pressure sensor and method for making same |
JPH0979928A (ja) * | 1995-09-12 | 1997-03-28 | Nagano Keiki Seisakusho Ltd | 半導体圧力センサ装置 |
JP3684724B2 (ja) * | 1996-12-12 | 2005-08-17 | 株式会社デンソー | 圧力検出器 |
JP2000283868A (ja) * | 1999-03-30 | 2000-10-13 | Hitachi Ltd | 半導体圧力センサとそれを用いたエンジン |
JP3498695B2 (ja) * | 2000-10-03 | 2004-02-16 | 松下電工株式会社 | 半導体圧力センサー |
JP2002246854A (ja) * | 2001-02-22 | 2002-08-30 | Nippon Seiki Co Ltd | 圧力検出装置 |
JP2002310827A (ja) * | 2001-04-11 | 2002-10-23 | Denso Corp | 圧力センサ |
US6588281B2 (en) * | 2001-10-24 | 2003-07-08 | Kulite Semiconductor Products, Inc. | Double stop structure for a pressure transducer |
JP2003254845A (ja) * | 2001-12-28 | 2003-09-10 | Fuji Koki Corp | 圧力センサ |
US6877380B2 (en) * | 2002-10-01 | 2005-04-12 | Honeywell International Inc. | Diaphragm for bonded element sensor |
ITTO20030444A1 (it) * | 2003-06-13 | 2004-12-14 | Olivetti Jet Spa | Sensore di pressione a struttura integrata. |
JP4774678B2 (ja) * | 2003-08-29 | 2011-09-14 | 富士電機株式会社 | 圧力センサ装置 |
DE102004006201B4 (de) * | 2004-02-09 | 2011-12-08 | Robert Bosch Gmbh | Drucksensor mit Siliziumchip auf einer Stahlmembran |
US7131334B2 (en) * | 2004-04-19 | 2006-11-07 | Celerity, Inc. | Pressure sensor device and method |
JP4839648B2 (ja) * | 2005-03-23 | 2011-12-21 | 富士電機株式会社 | 圧力センサ装置 |
JP2006226756A (ja) * | 2005-02-16 | 2006-08-31 | Denso Corp | 圧力センサ |
CN100335879C (zh) * | 2005-03-11 | 2007-09-05 | 江苏大学 | 一种改良耐高温微型低成本压力传感器的方法 |
JP4556784B2 (ja) * | 2005-06-27 | 2010-10-06 | 株式会社デンソー | 圧力センサ |
CN2888426Y (zh) * | 2006-01-10 | 2007-04-11 | 昆山双桥传感器测控技术有限公司 | 高精度智能压力传感器 |
CN201116891Y (zh) * | 2007-08-31 | 2008-09-17 | 上海飞恩微电子有限公司 | 硅压阻压力传感器密封总成 |
US7775119B1 (en) * | 2009-03-03 | 2010-08-17 | S3C, Inc. | Media-compatible electrically isolated pressure sensor for high temperature applications |
-
2010
- 2010-05-31 CN CN2010101878941A patent/CN102023066B/zh active Active
-
2011
- 2011-01-14 BR BR112012030407-0A patent/BR112012030407B1/pt active IP Right Grant
- 2011-01-14 JP JP2013512730A patent/JP5671134B2/ja active Active
- 2011-01-14 EP EP11789070.7A patent/EP2579014B1/en active Active
- 2011-01-14 KR KR1020127034395A patent/KR101659528B1/ko active IP Right Grant
- 2011-01-14 WO PCT/CN2011/070245 patent/WO2011150691A1/zh active Application Filing
- 2011-05-11 US US13/105,261 patent/US8459124B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2047014U (zh) * | 1989-02-14 | 1989-11-01 | 于海波 | 硅自封闭压力传感器 |
CN1231030A (zh) * | 1996-09-16 | 1999-10-06 | Trw车辆电气与零件有限两合公司 | 压力传感装置,特别是用于汽车技术的压力传感装置 |
US6070469A (en) * | 1997-09-30 | 2000-06-06 | Matsushita Electric Works, Ltd. | Pressure sensor |
CN1544901A (zh) * | 2003-11-12 | 2004-11-10 | 王文襄 | 一种微型动态压阻压力传感器及其制造方法 |
CN1828247A (zh) * | 2005-03-04 | 2006-09-06 | 昆山双桥传感器测控技术有限公司 | 压阻式高频动态高压传感器 |
CN1834602A (zh) * | 2005-03-14 | 2006-09-20 | 昆山双桥传感器测控技术有限公司 | 压阻式高频动态低压传感器 |
CN2867323Y (zh) * | 2006-01-10 | 2007-02-07 | 昆山双桥传感器测控技术有限公司 | 车用压力传感器 |
CN101000271A (zh) * | 2006-01-10 | 2007-07-18 | 昆山双桥传感器测控技术有限公司 | 抗腐蚀的压力传感器 |
CN101493371A (zh) * | 2008-01-21 | 2009-07-29 | 昆山双桥传感器测控技术有限公司 | 抗辐射压力传感器 |
Also Published As
Publication number | Publication date |
---|---|
JP2013531230A (ja) | 2013-08-01 |
BR112012030407B1 (pt) | 2020-03-31 |
CN102023066B (zh) | 2012-07-18 |
US8459124B2 (en) | 2013-06-11 |
CN102023066A (zh) | 2011-04-20 |
EP2579014A4 (en) | 2017-12-13 |
EP2579014A1 (en) | 2013-04-10 |
EP2579014B1 (en) | 2019-10-02 |
KR101659528B1 (ko) | 2016-09-23 |
BR112012030407A2 (pt) | 2016-08-09 |
US20110290032A1 (en) | 2011-12-01 |
KR20130118754A (ko) | 2013-10-30 |
JP5671134B2 (ja) | 2015-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2011150691A1 (zh) | 汽车通用压力传感器 | |
US3697917A (en) | Semiconductor strain gage pressure transducer | |
US8499642B2 (en) | Hermetically sealed pressure sensing device | |
US9054222B2 (en) | Pressure resistently encapsulated, pressure difference sensor | |
US10768069B2 (en) | Pressure measuring device for protection of pressure sensor from thermomechanical stress | |
CN107436205A (zh) | 一种片内温度补偿石墨烯压力传感器 | |
US20100263452A1 (en) | Pressure Sensor for Hydraulic Media in Motor Vehicle Brake Systems | |
US10837855B2 (en) | Pressure measuring system | |
US20140123765A1 (en) | Flat Covered Leadless Pressure Sensor Assemblies Suitable for Operation in Extreme Environments | |
CN110595672A (zh) | 一种新型高准确度差压变送器 | |
WO2015014199A1 (zh) | 轮胎压力监测传感器 | |
CN201107149Y (zh) | 高可靠电子式汽车压力传感器 | |
Ngo et al. | Liquid-free, piezoresistive, SOI-based pressure sensor for high temperature measurements up to 400 C | |
CN211978201U (zh) | 一种医疗设备用压力变送器 | |
CN109238525A (zh) | 金属薄膜式压力-温度复合传感器及其制作方法 | |
CN108195503A (zh) | 圆膜片电阻应变式压力、压差传感器 | |
CN104344923A (zh) | 一种汽车压力传感器及其制作方法 | |
TWI516386B (zh) | General pressure sensor for automobiles | |
CN207197705U (zh) | 一种片内温度补偿石墨烯压力传感器 | |
CN112985653A (zh) | 压力传感器的芯片封装单元及压力传感器 | |
CN220690340U (zh) | 一种压力传感器内部封装结构 | |
Li et al. | A Differential Split-Type Pressure Sensor for High-Temperature Applications | |
JPS62291533A (ja) | 圧力検出器 | |
JP2547950Y2 (ja) | 厚膜圧力センサ | |
CN215178314U (zh) | 一种压力传感器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11789070 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013512730 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011789070 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20127034395 Country of ref document: KR Kind code of ref document: A |
|
REG | Reference to national code |
Ref country code: BR Ref legal event code: B01A Ref document number: 112012030407 Country of ref document: BR |
|
ENP | Entry into the national phase |
Ref document number: 112012030407 Country of ref document: BR Kind code of ref document: A2 Effective date: 20121129 |