WO2011134282A1 - Antenna device and manufacturing method thereof - Google Patents

Antenna device and manufacturing method thereof Download PDF

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Publication number
WO2011134282A1
WO2011134282A1 PCT/CN2011/000760 CN2011000760W WO2011134282A1 WO 2011134282 A1 WO2011134282 A1 WO 2011134282A1 CN 2011000760 W CN2011000760 W CN 2011000760W WO 2011134282 A1 WO2011134282 A1 WO 2011134282A1
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WO
WIPO (PCT)
Prior art keywords
metal
plastic body
antenna
antenna device
electroless plating
Prior art date
Application number
PCT/CN2011/000760
Other languages
French (fr)
Chinese (zh)
Inventor
毛利坚
Original Assignee
上海莫仕连接器有限公司
莫列斯公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海莫仕连接器有限公司, 莫列斯公司 filed Critical 上海莫仕连接器有限公司
Priority to JP2013506455A priority Critical patent/JP5897550B2/en
Publication of WO2011134282A1 publication Critical patent/WO2011134282A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/40Radiating elements coated with or embedded in protective material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456Antennas, e.g. radomes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105Using an electrical field; Special methods of applying an electric potential

Definitions

  • the present invention relates to an antenna device and a method of fabricating the same, and more particularly to an antenna device capable of preventing a metal layer deposited by electroless plating from being partially exposed to a metal piece of the plastic body and a method of fabricating the same. Background technique
  • Plastics are widely used in the outer casing of electronic products, and their advantages are that they are easy to mold and can be mass-produced. For example, most of the housings of portable electronic devices are made of plastic.
  • Taiwan Patent Publication No. 200917570 discloses a protective casing for a wireless transmission device, which comprises a plurality of metal sheets to increase the strength of the protective casing.
  • the above-mentioned publication No. 570 discloses that providing a plurality of metal sheets in the protective casing has the following advantages: (1) can be used as a decorative feature; (2) can be used as a functional feature, For example, a metal button or the like; in other words, the metal piece is structurally exposed to the protective casing to achieve a metallic luster decorative or operation interface key function.
  • LDS laser-direct-stmcturing
  • the laser direct molding manufacturing process is: firstly, an injection molded outer casing is provided, which is formed by solidifying a thermoplastic material by one injection molding; then, an activation region is formed by laser on the inner wall surface of the outer casing, and the activation region has a metal
  • the activated core that is, the activated core of the activated region can be used to catalyze a physical or chemical reaction; next, a metal formation process, such as electroless plating, is used to form a metal in the activated region to form a line.
  • the adhesion between the electroless metal layer and the surface of the metal sheet exposed to the plastic case is poor, so that the electroless metal layer may form a wrinkled, rough or peeled surface.
  • the inventor of the present invention has invented a structure which is reasonable in design and effective in improving the above problems, in view of the defects of the above-mentioned prior art in actual application, and accumulating the experience of individuals engaged in relevant industry development practice for many years, and meticulously researching. Summary of the invention
  • the main object of the present invention is to provide an antenna device and a manufacturing method thereof, which utilizes the concept of reverse reaction of electroplating to connect a positive electrode of an external power source to a metal piece embedded in a partially exposed plastic body to apply a positive voltage to the metal piece. Therefore, the problem of depositing the metal material on the bare portion of the metal sheet during the electroless plating of the metal layer can be avoided; in other words, the metal sheet partially exposed to the plastic body does not deposit the electroless metal layer, so The metal sheet can still maintain its decorative properties. Moreover, the present invention can also solve the short circuit problem caused by the peeled metal layer mentioned in the prior art.
  • the present invention provides an antenna device, comprising: a plastic body having an antenna pattern thereon; a metal sheet embedded in the plastic body to form a housing member, and the metal sheet portion is exposed a plastic body; and a metal layer deposited on the antenna pattern by electroless plating to form an antenna; wherein, during electroless deposition of the metal layer, a portion of the metal piece exposed to the plastic body is connected to a positive electrode of a power source And applying a positive voltage to the metal piece to prevent the metal layer from being deposited on the surface of the metal piece.
  • the invention also provides a method for fabricating an antenna device, comprising the following steps: Step 1: embedding a metal piece in a plastic body by insert molding, and exposing the metal piece to the plastic body Forming a case member; Step 2: forming an antenna pattern for depositing metal on the plastic body; and Step 3: placing the case member in an electroless plating solution having metal ions to reduce metal ions and Depositing on the antenna pattern to form a metal layer antenna; at the same time, providing a power source, connecting the anode of the power source to the metal piece partially exposed to the plastic body, and connecting the negative electrode of the power source to the chemical An electrode in the plating solution to apply a positive voltage to the metal piece, thereby preventing the metal layer reduced by the metal ions from depositing on the surface of the metal piece.
  • the invention has the following beneficial effects: using an external power source to provide a positive voltage to the metal piece partially exposed to the plastic body, so that when the electroless metal ion is subjected to a reduction reaction, only the antenna pattern deposited on the plastic body is The metal piece exposed on the plastic body may be deposited in the above part, so that the decorative form provided by the metal piece can be maintained, and the problem of adhesion between the metal layer and the metal piece deposited by electroless plating can be avoided. Short circuit and other defects.
  • Figure 1 is a perspective view showing the metal piece of the present invention embedded in the plastic body to form a housing member.
  • Fig. 1A shows a perspective view of an antenna pattern on a plastic body of the present invention having a metal depositable.
  • Fig. 1B is a schematic perspective view showing the metal layer of the present invention formed on the antenna pattern.
  • FIG. 2 is an exploded perspective view showing the antenna device of the present invention, together with a circuit board and a conductive element.
  • FIG. 3 is a schematic diagram showing the combination of the antenna device, the circuit board and the conductive component of the present invention.
  • Fig. 4 is a schematic view showing the electroless plating of the casing member of the present invention, wherein the positive electrode of the power source is connected to the metal piece.
  • the invention provides an antenna device and a manufacturing method thereof, which can solve the problems caused by depositing an electroless metal layer on a bare portion of a metal piece embedded in a plastic body in a conventional process, such as a metal layer deposited by electroless plating.
  • a metal layer deposited by electroless plating The adhesion between the metal sheets is poor, and the metal layer is peeled off to cause a short circuit of the circuit or a problem of internal contamination of the apparatus.
  • the method for fabricating the antenna device according to the first embodiment of the present invention includes the following steps. First, in step 1, a metal piece 11 is embedded in a plastic body 10 by insert molding, and the metal is made. The sheet 11 is partially exposed to the plastic body 10 to form a housing member 1 (please refer to FIG. 1).
  • the housing member 1 can be a back cover of a mobile communication device, such as a mobile phone back cover, but not limited to the above, which first embeds and exposes the metal sheet 11 by embedding molding.
  • the plastic body 10 is formed into the above-mentioned mobile phone back cover; in other words, the metal piece 11 is firmly fitted into the plastic body 10 by embedding molding, and the metal piece 11 may be stainless steel or other corrosion-resistant metal to form
  • the housing part 1 has a high strength, a decorative, or an electromagnetic shielding effect.
  • the plastic body 10 is a metal-containing, metal-containing metal.
  • an antenna pattern 101 for depositing metal is formed on the plastic body 10 (please refer to FIG. 1A).
  • this step is to use a laser to modify a predetermined area of the surface of the plastic body 10 to form an active area (ie, the antenna pattern 101), so that the conductive metal material of the next step is directly deposited and attached to the plastic body.
  • An active area of 10 is formed to form an antenna that can receive signals.
  • the antenna pattern 101 is not in contact with the metal piece 11 to prevent the subsequent step of applying a positive voltage to affect the reaction of the electroless plating metal on the antenna pattern 101.
  • step 3 is to place the housing member 1 into an electroless plating solution 40 having metal ions to reduce and deposit metal ions in the antenna pattern 101 .
  • the electrode 301 in the plating solution 40 is applied with a positive voltage to the metal piece 11, thereby preventing the metal layer 12 reduced by the metal ions from being deposited on the surface of the metal piece 11.
  • the metal deposition technique such as electroless plating
  • the metal deposition technique is used to directly deposit the conductive metal material on the antenna pattern 101 of the plastic body 10 to form a metal capable of receiving signals.
  • the electroless plating solution 40 may contain at least copper ions, so that the copper metal layer 12 may be deposited to form an antenna for receiving signals; for example, the electroless plating solution 40 may contain at least nickel ions, so that a nickel metal layer may be deposited. 12, to form an antenna for receiving signals, but not limited to the above.
  • the present invention utilizes a power source during the electroless plating process.
  • 30 providing a positive voltage to the metal sheet 11 partially exposed to the plastic body 10, such that the metal sheet 11 exposed to the plastic body 10 may cause a reverse reaction of electroplating.
  • the present invention connects the positive electrode of the power source 30.
  • the metal piece 11 exposed to the plastic body 10 is partially exposed, and the negative electrode of the power source 30 is connected to the electrode 301 located in the electroless plating solution 40 to load a positive voltage of about 0.4 V to partially expose the plastic body 10.
  • the metal sheet 11 is subjected to an oxidation reaction on the metal sheet 11 partially exposed to the plastic body 10, so that the electroless plating is deposited on the metal layer 12 partially exposed on the surface of the metal sheet 11 of the plastic body 10. And again reduced to an ionic state, so that the metal layer 12 formed by electroless plating is not deposited on the surface of the metal sheet 11 partially exposed to the plastic body 10.
  • the present invention can utilize the bracket 302 to sub-assemble eight housing members 1, and connect the end of the bracket 302 to the positive pole of the power source 30, thereby enabling batch production.
  • a first embodiment of the present invention is to fabricate an antenna device using laser-direct-structuring (LDS).
  • the housing member 1 is a laser direct molding (LDS) housing.
  • LDS laser direct molding
  • the plastic body 10 and the metal sheet 11 molded by the embedded molding method are included, and an activation region (ie, the antenna pattern 101) is formed on the plastic body 10 by laser, and the metal material is further formed by an electroless plating method.
  • An antenna is formed on the active region to form a metal layer 12; further, while electroless plating is applied, a positive voltage is applied to the metal sheet 11 by the external power source 30 to prevent the metal deposited by the electroless plating from covering the metal sheet 11. surface.
  • the antenna device of the second embodiment of the present invention is formed by molding the antenna pattern 101 on the plastic body 10 by two-shot molding (two-shot molding), which includes the following steps:
  • a metal sheet 11 may be embedded in a plastic body 10 by insert molding, and the metal sheet 11 is partially exposed to the plastic body 10 to form a casing member 1 (please cooperate with the figure) 1)), which differs from the first embodiment in that the plastic material formed by this step is a non-conductor plastic material, and does not need to contain a metal composition, in other words, a common industrial plastic material. Can be applied to this step.
  • the housing member 1 can be a back cover of a mobile communication device, such as a mobile phone back cover or the like.
  • an antenna pattern 101 for depositing metal is formed on the plastic body 10 (please be shown in FIG. 1A).
  • this step is to form a conductive plastic material on the plastic body 10 by a two-shot molding method to form an antenna pattern 101 for depositing metal; in other words, this step is to conduct electricity by using two-color injection molding.
  • a plastic material is formed on a predetermined area of the surface of the plastic body 10 to form an antenna pattern 101, so that the conductive metal material of the next step is directly attached to the antenna pattern 101 on the plastic body 10 to form an antenna capable of receiving signals.
  • the antenna pattern 101 is not in contact with the metal piece 11 to prevent the subsequent step of applying a positive voltage from affecting the reaction of the electroless plating metal on the antenna pattern 101.
  • the third step is to place the case member 1 into an electroless plating solution 40 having metal ions (such as copper ions or nickel ions) to reduce and deposit the metal ions.
  • the antenna pattern 101 is formed to form an antenna of the metal layer 12; at the same time, a power source 30 is provided, and the anode of the power source is connected to the metal piece 11 partially exposed to the plastic body 10, and the negative electrode of the power source 30
  • the electrode 301 is placed in the electroless plating solution 40 to apply a positive voltage to the metal piece 11, thereby preventing the metal layer 12 reduced by the metal ions from being deposited on the surface of the metal piece 11.
  • the metal ions in the electroless plating solution 40 can be directly deposited on the antenna pattern 101 of the plastic body 10 to form an antenna of the metal layer 12 that can receive the signal.
  • the power source 30 is used to provide a positive voltage to the metal sheet 11 partially exposed to the plastic body 10, so that the metal sheet 11 partially exposed to the plastic body 10 is produced.
  • the reverse reaction of the electroplating causes the electroless plating to deposit on the metal layer 12 partially exposed on the surface of the metal piece 11 of the plastic body 10, and is again reduced to an ionic state, so that the metal piece partially exposed to the plastic body 10 can be maintained. 11
  • the metal layer 12 formed by electroless plating is not deposited on the surface.
  • a second embodiment of the present invention is to fabricate an antenna device using a two-shot molding technique.
  • the housing member 1 includes a plastic body 10 molded by a buried molding method. Forming another conductive plastic material on the plastic body 10 by two-color injection molding to form an antenna pattern 101; and depositing a metal material on the active region by an electroless plating method to form an antenna having a metal layer 12; Further, at the same time as the electroless plating, a positive voltage is applied to the metal piece 11 by the external power source 30 to prevent the metal deposited by the electroless plating from covering the surface of the metal piece 11.
  • the present invention provides an antenna device according to the manufacturing method of the first and second embodiments, which comprises a plastic body 10, a metal sheet 11 and a metal layer 12, and the metal sheet 11 is embedded in the plastic.
  • the body 10 is formed to form a housing member 1 , and the metal sheet 11 is partially exposed to the plastic body 10 , and the plastic body 10 has an antenna pattern 101 thereon.
  • the metal layer 12 is deposited on the antenna pattern 101 by electroless plating. Forming an antenna; wherein when the metal layer 12 is deposited by electroless plating, the metal piece 11 partially exposed to the plastic body 10 is connected to the positive electrode of a power source 30 to apply a positive voltage to the metal piece 11 to avoid the metal layer. 12 is deposited on the surface of the metal sheet 11.
  • the housing member 1 can be a back cover of a mobile communication device, such as a mobile phone back cover, and the plastic body 10 includes an inner surface 102 and an outer surface 103 opposite the inner surface 102.
  • the metal sheet 11 is partially exposed at the same time to the inner surface 102 and the outer surface 103 of the back cover of the mobile communication device.
  • the metal sheet 11 may be only partially exposed to the inner surface 102 of the back cover of the mobile communication device, or only partially exposed to the outer surface 103 of the back cover of the mobile communication device.
  • FIG. 1A shows the plastic body 10 having an antenna pattern for depositing metal.
  • the antenna pattern 101 is continuously extended from the outer surface 103 of the plastic body 10 to the inner surface 102 of the plastic body 10, and the antenna pattern 101 can utilize the laser direct forming technique (laser-direct-) described above.
  • the laser modification step of stmcturing, LDS) or the two-shot molding technique is not described here; further, the antenna pattern 101 is not in contact with the metal piece 11.
  • the metal layer 12 is formed on the antenna pattern 101 to form an antenna for receiving/transmitting signals.
  • the structure of the metal layer 12 corresponds to the antenna pattern 101 and also extends continuously from the outer surface 103 of the plastic body 10 to the inner surface 102 of the plastic body 10; it is noted that due to the electroless plating deposition of the metal layer 12
  • the metal piece 11 partially exposed to the plastic body 10 is connected to the positive electrode of a power source 30 to apply a positive voltage to the metal piece 11 , so that the metal piece 11 barely exposed on the plastic body 10 has no metal layer.
  • FIG. 2 is an exploded view showing the antenna device of the embodiment and the circuit board 20 and the conductive element 21; and FIG. 3 shows the antenna device and the circuit board 20 and the conductive element 21 group.
  • a combination view wherein the plastic body 10 of the antenna device includes an inner surface 102 and an outer surface 103 opposite the inner surface 102, and the metal layer 12 extends continuously from the outer surface 103 of the plastic body 10 to the plastic body 10.
  • the inner surface 102, the two ends of the conductive element 21 are electrically connected to the metal layer 12 on the inner surface 102 of the plastic body 10 and the line 201 on the circuit board 20, respectively.
  • the wireless signal received by the metal layer 12 can be transferred to the line 201 on the circuit board 20 by the conductive element 21, and vice versa, to achieve signal reception/transmission.
  • the metal sheet 11 is tightly fitted to the plastic body 10 to enhance the structural strength of the housing member 1 (ie, the back cover of the mobile communication device), or to increase the decorative function, or to enhance the electromagnetic shielding effect.
  • the function and the manufacturing method proposed by the present invention can effectively prevent the electroless plating metal from being deposited on the metal sheet 11 to solve the problem caused by the conventional process of depositing the electroless metal on the metal sheet 11.
  • the present invention has the following advantages:
  • the positive electrode of the external power source is connected to the metal piece embedded in the plastic body to apply a positive voltage to the metal piece, so that the problem of depositing the metal material on the metal piece during the electroless plating of the metal layer can be avoided. Therefore, in the case of applying electroless plating, the present invention can still embed and expose the metal piece to the plastic body, so that it can maintain the function of decorative function or button action.
  • the present invention can prevent the metal material from being deposited on the metal sheet during the electroless plating of the metal layer, to solve the short circuit problem caused by the stripped deposited metal layer mentioned in the prior art, and to make the plastic body and the metal
  • the housing member composed of the sheets has a good structural strength.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Chemically Coating (AREA)
  • Telephone Set Structure (AREA)
  • Details Of Aerials (AREA)

Abstract

Disclosed are an antenna device and a manufacturing method thereof. The manufacturing method of the antenna device comprises the following steps: Step One, burying a metal sheet into a plastic body by using insert molding, and making the metal sheet partly exposed to the atmosphere outside the plastic body, for producing a casing member; Step Two, on the plastic body, forming an antenna pattern which can be used to deposit metal; and Step Three, putting the casing member into chemic plating liquid containing metal ions, and making the metal ions reduced and deposited on the antenna pattern so as to form an antenna composed by a metal layer; at the same time, providing a power supply, connecting the positive pole of the power supply to the metal sheet part which is exposed to the atmosphere outside the plastic body and connecting the negative pole of the power supply to an electrode in the chemic plating liquid, and then applying a positive voltage to the metal sheet so as to prevent the metal layer reduced from the metal ions from being deposited on the surface of the metal sheet.

Description

天线装置及其制作方法 技术领域  Antenna device and manufacturing method thereof
本发明涉及一种天线装置及其制作方法, 尤指一种可避免化学镀的金属 层沉积于部分裸露于该塑料本体的金属片的天线装置及其制作方法。 背景技术  The present invention relates to an antenna device and a method of fabricating the same, and more particularly to an antenna device capable of preventing a metal layer deposited by electroless plating from being partially exposed to a metal piece of the plastic body and a method of fabricating the same. Background technique
塑料大量地运用于电子产品的外壳, 其优势在于易于成型, 且可大量生 产。 例如, 可携式电子装置的外壳大多均利用塑料所制造。  Plastics are widely used in the outer casing of electronic products, and their advantages are that they are easy to mold and can be mass-produced. For example, most of the housings of portable electronic devices are made of plastic.
然而, 随着电子产品的尺寸日益缩小, 其外壳的厚度也随着减小, 因此, 为了提高塑料外壳的结构强度, 目前大多在塑料外壳中嵌合有金属片, 以提 升塑料外壳抵抗外力冲击的强度。  However, as the size of electronic products is shrinking, the thickness of the outer casing is also reduced. Therefore, in order to improve the structural strength of the plastic outer casing, metal sheets are often fitted in the plastic outer casing to enhance the plastic outer casing against external impact. Strength of.
例如, 中国台湾专利公开号第 200917570号, 其揭露一种无线传输装置 的防护外壳, 该防护外壳中即包含多个金属片, 以提高防护外壳的强度。 除 此的外, 上述 570号公开专利中亦揭露在防护外壳中设有多个金属片更可具 有以下优点: (1 )可用以作为装饰性的特征; (2)可用以作为功能性特征, 例如金属材质的按钮等; 换言之, 上述金属片在结构上会裸露于该防护外壳, 以达成金属光泽的装饰性或操作接口的按键功能。  For example, Taiwan Patent Publication No. 200917570 discloses a protective casing for a wireless transmission device, which comprises a plurality of metal sheets to increase the strength of the protective casing. In addition, the above-mentioned publication No. 570 discloses that providing a plurality of metal sheets in the protective casing has the following advantages: (1) can be used as a decorative feature; (2) can be used as a functional feature, For example, a metal button or the like; in other words, the metal piece is structurally exposed to the protective casing to achieve a metallic luster decorative or operation interface key function.
再一方面, 激光直接成型技术 (laser-direct-stmcturing, LDS ) 已逐渐应 用于塑料外壳上的线路的制作。 激光直接成型的制作流程为; 首先提供一射 出模造的外壳, 该外壳为利用一次射出成型将热塑性材料加以固化成型; 接 着, 以激光于该外壳的内壁面形成活化区域, 该活化区域会具有金属化的活 化核心, 亦即, 该活化区域的活化核心可用以催化物理或化学反应; 接下来, 利用一金属化制程, 例如化学镀, 将金属形成于上述的活化区域, 以形成线 路。  On the other hand, laser-direct-stmcturing (LDS) has been increasingly applied to the fabrication of circuits on plastic housings. The laser direct molding manufacturing process is: firstly, an injection molded outer casing is provided, which is formed by solidifying a thermoplastic material by one injection molding; then, an activation region is formed by laser on the inner wall surface of the outer casing, and the activation region has a metal The activated core, that is, the activated core of the activated region can be used to catalyze a physical or chemical reaction; next, a metal formation process, such as electroless plating, is used to form a metal in the activated region to form a line.
因此, 当利用具有金属片的塑料外壳进行上述激光直接成型制程时, 由 于化学镀中的金属离子会在裸露于塑料外壳的金属片的表面产生还原反应, 致使裸露于塑料外壳的金属片的表面上会沉积化学镀的金属层, 而造 ^¾以下 问题:  Therefore, when the above laser direct forming process is performed using a plastic case having a metal piece, since the metal ions in the electroless plating cause a reduction reaction on the surface of the metal piece exposed to the plastic case, the surface of the metal piece exposed to the plastic case is caused. Electroless plating of metal layers is deposited on the surface, creating the following problems:
( 1 ) 化学镀的金属层与裸露于塑料外壳的金属片的表面之间附着力不 佳, 故沉积的金属层会由金属片的表面上剥离、 脱落, 而导致金属颗粒、 粉 末会散布在电子产品的内部空间, 这些金属颗粒、 粉末即可能会导致电子产 品内部的电路板的线路发生短路的情况。 (1) The adhesion between the metallized metal layer and the surface of the metal sheet exposed to the plastic outer casing is poor, so the deposited metal layer will be peeled off and peeled off from the surface of the metal sheet, resulting in metal particles and powder. At the end, it will be scattered in the internal space of the electronic product. These metal particles and powder may cause short circuit of the circuit board inside the electronic product.
(2 ) 如上述 (1 ) 的观点, 化学镀的金属层与裸露于塑料外壳的金属片 的表面之间附着力不佳, 故化学镀的金属层会形成皱折、粗糙或剥离的表面, 导致金属片失去装饰性的功能。  (2) As in the above (1), the adhesion between the electroless metal layer and the surface of the metal sheet exposed to the plastic case is poor, so that the electroless metal layer may form a wrinkled, rough or peeled surface. The function of causing the metal piece to lose its decorative properties.
本案发明人有鉴于上述现有技术于实际施用时的缺陷, 且积累个人从事 相关产业开发实务上多年的经验, 精心研究, 终于提出一种设计合理且有效 改善上述问题的结构。 发明内容  The inventor of the present invention has invented a structure which is reasonable in design and effective in improving the above problems, in view of the defects of the above-mentioned prior art in actual application, and accumulating the experience of individuals engaged in relevant industry development practice for many years, and meticulously researching. Summary of the invention
本发明的主要目的在于提供一种天线装置及其制作方法, 其利用电镀的 逆反应的概念, 将外接电源的正极连接至埋设而部分裸露于塑料本体的金属 片, 以向该金属片加载正电压, 故可避免进行金属层的化学镀时将金属材料 沉积于上述金属片的裸露部分上所造成的问题; 换言之, 部分裸露于该塑料 本体的金属片不会沉积有化学镀的金属层, 故金属片仍可保持其装饰性, 再 者,本发明亦可解决现有技术所提及的剥离的金属层所导致的电路短路问题。  The main object of the present invention is to provide an antenna device and a manufacturing method thereof, which utilizes the concept of reverse reaction of electroplating to connect a positive electrode of an external power source to a metal piece embedded in a partially exposed plastic body to apply a positive voltage to the metal piece. Therefore, the problem of depositing the metal material on the bare portion of the metal sheet during the electroless plating of the metal layer can be avoided; in other words, the metal sheet partially exposed to the plastic body does not deposit the electroless metal layer, so The metal sheet can still maintain its decorative properties. Moreover, the present invention can also solve the short circuit problem caused by the peeled metal layer mentioned in the prior art.
为了达到上述目的, 本发明提供一种天线装置, 包含: 一塑料本体, 其 上具有一天线图案; 一金属片, 其埋设于该塑料本体以形成一壳体件, 且该 金属片部分裸露于该塑料本体; 以及一金属层, 其利用化学镀沉积于该天线 图案以形成天线; 其中, 在该金属层的化学镀沉积时, 部分裸露于该塑料本 体的该金属片连接于一电源的正极, 以向该金属片加载正电压, 进而避免该 金属层沉积于该金属片的表面。  In order to achieve the above object, the present invention provides an antenna device, comprising: a plastic body having an antenna pattern thereon; a metal sheet embedded in the plastic body to form a housing member, and the metal sheet portion is exposed a plastic body; and a metal layer deposited on the antenna pattern by electroless plating to form an antenna; wherein, during electroless deposition of the metal layer, a portion of the metal piece exposed to the plastic body is connected to a positive electrode of a power source And applying a positive voltage to the metal piece to prevent the metal layer from being deposited on the surface of the metal piece.
本发明还提供一种天线装置的制作方法, 包含以下步骤: 步骤一: 利用 埋入模铸 (insert molding) 将一金属片埋设于一塑料本体, 且使该金属片部 分裸露于该塑料本体以形成一壳体件; 步骤二: 在该塑料本体上成型一可供 沉积金属的天线图案; 以及步骤三: 将该壳体件置入一具有金属离子的化学 镀液中, 使金属离子还原且沉积于该天线图案上, 以成型一金属层的天线; 同时, 提供一电源, 并将该电源的正极连接至部分裸露于该塑料本体的该金 属片, 及将该电源的负极连接至位于化学镀液中的电极, 以向该金属片加载 正电压, 进而避免金属离子所还原的该金属层沉积于该金属片的表面。 本发明具有以下有益的效果: 利用外接电源提供正电压于部分裸露于该 塑料本体的该金属片, 使化学镀的金属离子进行还原反应时, 仅沉积于该塑 料本体上的天线图案,而不会沉积于上述部分裸露于该塑料本体的该金属片, 故可保持该金属片所提供的装饰性形态, 亦可避免化学镀所沉积的金属层与 金属片的间的附着力问题所衍生出的电路短路等缺陷。 The invention also provides a method for fabricating an antenna device, comprising the following steps: Step 1: embedding a metal piece in a plastic body by insert molding, and exposing the metal piece to the plastic body Forming a case member; Step 2: forming an antenna pattern for depositing metal on the plastic body; and Step 3: placing the case member in an electroless plating solution having metal ions to reduce metal ions and Depositing on the antenna pattern to form a metal layer antenna; at the same time, providing a power source, connecting the anode of the power source to the metal piece partially exposed to the plastic body, and connecting the negative electrode of the power source to the chemical An electrode in the plating solution to apply a positive voltage to the metal piece, thereby preventing the metal layer reduced by the metal ions from depositing on the surface of the metal piece. The invention has the following beneficial effects: using an external power source to provide a positive voltage to the metal piece partially exposed to the plastic body, so that when the electroless metal ion is subjected to a reduction reaction, only the antenna pattern deposited on the plastic body is The metal piece exposed on the plastic body may be deposited in the above part, so that the decorative form provided by the metal piece can be maintained, and the problem of adhesion between the metal layer and the metal piece deposited by electroless plating can be avoided. Short circuit and other defects.
为使能更进一步了解本发明的特征及技术内容, 请参阅以下有关本发明 的详细说明与附图, 然而附图仅提供参考与说明, 并非用来对本发明加以限 制。 附图说明  For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings. DRAWINGS
图 1 显示本发明的金属片埋设于该塑料本体以形成壳体件的立体示意 图。  BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing the metal piece of the present invention embedded in the plastic body to form a housing member.
图 1A显示本发明的塑料本体上具有可供沉积金属的天线图案的立体示 意图。  Fig. 1A shows a perspective view of an antenna pattern on a plastic body of the present invention having a metal depositable.
图 1B显示本发明的金属层成型于该天线图案上的立体示意图。  Fig. 1B is a schematic perspective view showing the metal layer of the present invention formed on the antenna pattern.
图 2为本发明的天线装置与电路板、导电元件组设在一起的分解示意图。 图 3为本发明的天线装置与电路板、导电元件组设在一起的组合示意图。 图 4为本发明的壳体件进行化学镀的示意图, 其中电源的正极连接于金 属片。  2 is an exploded perspective view showing the antenna device of the present invention, together with a circuit board and a conductive element. FIG. 3 is a schematic diagram showing the combination of the antenna device, the circuit board and the conductive component of the present invention. Fig. 4 is a schematic view showing the electroless plating of the casing member of the present invention, wherein the positive electrode of the power source is connected to the metal piece.
其中 附图标记说明如下:  The reference numerals are as follows:
1 壳体件  1 housing parts
10 塑料本体 101  10 plastic body 101
102 内表面  102 inner surface
103 外表面  103 outer surface
11 金属片  11 metal sheet
12  12
20 电路板 201 线路  20 circuit board 201 line
21 导电元件  21 conductive components
30 电源 301 电极  30 power supply 301 electrode
302 支架 40 化学镀液 具体实施方式 302 bracket 40 Electroless plating solution
本发明提出一种天线装置及其制作方法, 其可解决传统制程将化学镀的 金属层沉积于埋设于塑料本体中的金属片的裸露部分所导致的问题, 例如化 学镀所沉积的金属层与金属片间的附着性不佳, 而使金属层脱落导致电路短 路或装置内部污染的问题等等。  The invention provides an antenna device and a manufacturing method thereof, which can solve the problems caused by depositing an electroless metal layer on a bare portion of a metal piece embedded in a plastic body in a conventional process, such as a metal layer deposited by electroless plating. The adhesion between the metal sheets is poor, and the metal layer is peeled off to cause a short circuit of the circuit or a problem of internal contamination of the apparatus.
本发明的第一具体实施例的天线装置的制作方法包括以下步骤: 首先, 在步骤一中, 利用埋入模铸(insert molding)将一金属片 11埋设 于一塑料本体 10, 且使该金属片 11部分裸露于该塑料本体 10以形成一壳体 件 1 (请配合图 1所示) 。  The method for fabricating the antenna device according to the first embodiment of the present invention includes the following steps. First, in step 1, a metal piece 11 is embedded in a plastic body 10 by insert molding, and the metal is made. The sheet 11 is partially exposed to the plastic body 10 to form a housing member 1 (please refer to FIG. 1).
在本具体实施例中, 该壳体件 1可为一移动通讯装置的背盖, 例如移动 电话背盖,但不以上述为限,其先利用埋入模铸将金属片 11埋设且裸露于塑 料本体 10 而成型为上述的移动电话背盖; 换言之, 利用埋入模铸将金属片 11牢固地嵌合于塑料本体 10中, 而该金属片 11可为不锈钢或其它耐腐蚀金 属, 以形成具有高强度、 具装饰性、 或具有电磁遮蔽效果的壳体件 1。  In this embodiment, the housing member 1 can be a back cover of a mobile communication device, such as a mobile phone back cover, but not limited to the above, which first embeds and exposes the metal sheet 11 by embedding molding. The plastic body 10 is formed into the above-mentioned mobile phone back cover; in other words, the metal piece 11 is firmly fitted into the plastic body 10 by embedding molding, and the metal piece 11 may be stainless steel or other corrosion-resistant metal to form The housing part 1 has a high strength, a decorative, or an electromagnetic shielding effect.
另一方面, 为了使塑料本体 10可被激光所改质, 以使塑料本体 10上成 型可供沉积金属的天线图案 (请配合图 1A所示) , 该塑料本体 10为一种含 金属、 金属催化物或其有机物的塑性材料, 其可被激光所改质而形成活化区 域, 该活化区域具有金属化的活化核心, 因此, 该活化区域的活化核心会催 化物理或化学反应。  On the other hand, in order to make the plastic body 10 be modified by a laser to form an antenna pattern for depositing metal on the plastic body 10 (please be shown in FIG. 1A), the plastic body 10 is a metal-containing, metal-containing metal. A plastic material of a catalytic material or an organic material thereof, which can be modified by a laser to form an activated region having a metalized activated core, whereby the activated core of the activated region catalyzes a physical or chemical reaction.
接着, 步骤二为在该塑料本体 10上成型一可供沉积金属的天线图案 101 (请配合图 1A所示) 。 具体而言, 本步骤为使用激光将该塑料本体 10的表 面的一预定区域改质形成一活化区域 (即天线图案 101 ) , 使下一步骤的导 电金属材料得以直接沉积且附着于该塑料本体 10 的活化区域上以形成可接 收信号的天线。值得注意的是, 该天线图案 101与该金属片 11不相接触, 以 避免后续外加正电压的步骤影响到化学镀沉积金属于天线图案 101 上的反 应。  Next, in the second step, an antenna pattern 101 for depositing metal is formed on the plastic body 10 (please refer to FIG. 1A). Specifically, this step is to use a laser to modify a predetermined area of the surface of the plastic body 10 to form an active area (ie, the antenna pattern 101), so that the conductive metal material of the next step is directly deposited and attached to the plastic body. An active area of 10 is formed to form an antenna that can receive signals. It should be noted that the antenna pattern 101 is not in contact with the metal piece 11 to prevent the subsequent step of applying a positive voltage to affect the reaction of the electroless plating metal on the antenna pattern 101.
接下来, 请参考图 1B, 并配合图 4所示, 步骤三为将该壳体件 1置入一 具有金属离子的化学镀液 40 中, 使金属离子还原且沉积于该天线图案 101 上, 以成型一金属层 12的天线; 同时, 提供一电源 30, 并将该电源的正极 连接至部分裸露于该塑料本体 10的该金属片 11, 及将该电源 30的负极连接 至位于化学镀液 40中的电极 301, 以向该金属片 11加载正电压, 进而避免 金属离子所还原的该金属层 12沉积于该金属片 11的表面。 Next, referring to FIG. 1B , and in conjunction with FIG. 4 , step 3 is to place the housing member 1 into an electroless plating solution 40 having metal ions to reduce and deposit metal ions in the antenna pattern 101 . Forming an antenna of the metal layer 12; at the same time, providing a power source 30, connecting the anode of the power source to the metal piece 11 partially exposed to the plastic body 10, and connecting the negative electrode of the power source 30 to the chemical The electrode 301 in the plating solution 40 is applied with a positive voltage to the metal piece 11, thereby preventing the metal layer 12 reduced by the metal ions from being deposited on the surface of the metal piece 11.
以此,本步骤为利用金属沉积技术,例如化学镀(亦称无电镀, electroless plating),使导电金属材料得以直接沉积附着于该塑料本体 10的天线图案 101 上, 以形成可接收信号的金属层 12的天线。 例如, 化学镀液 40可至少包含 有铜离子, 故可沉积铜的金属层 12, 以形成接收信号的天线; 又例如, 化学 镀液 40可至少包含有镍离子, 故可沉积镍的金属层 12, 以形成接收信号的 天线, 但不以上述为限。  Therefore, in this step, the metal deposition technique, such as electroless plating, is used to directly deposit the conductive metal material on the antenna pattern 101 of the plastic body 10 to form a metal capable of receiving signals. The antenna of layer 12. For example, the electroless plating solution 40 may contain at least copper ions, so that the copper metal layer 12 may be deposited to form an antenna for receiving signals; for example, the electroless plating solution 40 may contain at least nickel ions, so that a nickel metal layer may be deposited. 12, to form an antenna for receiving signals, but not limited to the above.
再一方面, 由于化学镀液 40中的金属离子在进行还原的过程中,亦会沉 积在部分裸露于该塑料本体 10的该金属片 11的表面, 故本发明在化学镀的 过程中利用电源 30提供正电压于部分裸露于该塑料本体 10的该金属片 11, 使部分裸露于该塑料本体 10的该金属片 11会产生电镀的逆反应,具体而言, 本发明将该电源 30的正极连接至部分裸露于该塑料本体 10的该金属片 11, 及将该电源 30的负极连接至位于化学镀液 40中的电极 301, 以载入约 0.4V 的正电压至部分裸露于该塑料本体 10的该金属片 11, 使沉积在部分裸露于 该塑料本体 10的该金属片 11进行一氧化反应, 使化学镀所沉积在部分裸露 于该塑料本体 10的该金属片 11表面上的金属层 12, 再次还原成离子态, 故 可保持部分裸露于该塑料本体 10的该金属片 11表面不会沉积有化学镀所成 型的金属层 12。 如图 4所示, 本发明可利用支架 302—次性地装配八个壳体 件 1, 并将支架 302的末端连接于电源 30的正极, 以此可进行批次化的量产 作业。  On the other hand, since the metal ions in the electroless plating solution 40 are deposited on the surface of the metal piece 11 exposed to the plastic body 10 during the reduction process, the present invention utilizes a power source during the electroless plating process. 30 providing a positive voltage to the metal sheet 11 partially exposed to the plastic body 10, such that the metal sheet 11 exposed to the plastic body 10 may cause a reverse reaction of electroplating. Specifically, the present invention connects the positive electrode of the power source 30. The metal piece 11 exposed to the plastic body 10 is partially exposed, and the negative electrode of the power source 30 is connected to the electrode 301 located in the electroless plating solution 40 to load a positive voltage of about 0.4 V to partially expose the plastic body 10. The metal sheet 11 is subjected to an oxidation reaction on the metal sheet 11 partially exposed to the plastic body 10, so that the electroless plating is deposited on the metal layer 12 partially exposed on the surface of the metal sheet 11 of the plastic body 10. And again reduced to an ionic state, so that the metal layer 12 formed by electroless plating is not deposited on the surface of the metal sheet 11 partially exposed to the plastic body 10. As shown in Fig. 4, the present invention can utilize the bracket 302 to sub-assemble eight housing members 1, and connect the end of the bracket 302 to the positive pole of the power source 30, thereby enabling batch production.
因此, 本发明的第一具体实施例为利用激光直接成型技术 (laser-direct-structuring, LDS)制作一种天线装置, 换言之, 该壳体件 1为 一激光直接成型 (LDS)的外壳, 其包含一利用埋入模铸方法所模制成型的塑 料本体 10与金属片 11,并以激光于该塑料本体 10上形成一活化区域(即 天线图案 101 ) , 再利用化学镀方法将金属材料沉积于该活化区域而形 成有一金属层 12的天线; 再者, 在化学镀的同时, 利用外接电源 30将正电 压加载于金属片 11,以避免化学镀所沉积的金属覆盖于金属片 11的表面。 本发明的第二具体实施例的天线装置的制作方法则是利用双色注塑 (2 shot molding, 又称双料射出成型) 将天线图案 101成型于塑料本体 10上, 其包括以下步骤: Therefore, a first embodiment of the present invention is to fabricate an antenna device using laser-direct-structuring (LDS). In other words, the housing member 1 is a laser direct molding (LDS) housing. The plastic body 10 and the metal sheet 11 molded by the embedded molding method are included, and an activation region (ie, the antenna pattern 101) is formed on the plastic body 10 by laser, and the metal material is further formed by an electroless plating method. An antenna is formed on the active region to form a metal layer 12; further, while electroless plating is applied, a positive voltage is applied to the metal sheet 11 by the external power source 30 to prevent the metal deposited by the electroless plating from covering the metal sheet 11. surface. The antenna device of the second embodiment of the present invention is formed by molding the antenna pattern 101 on the plastic body 10 by two-shot molding (two-shot molding), which includes the following steps:
步骤一, 同样可利用埋入模铸(insert molding)将一金属片 11埋设于一 塑料本体 10, 且使该金属片 11部分裸露于该塑料本体 10以形成一壳体件 1 (请配合图 1所示) , 而与第一具体实施例不同之处在于, 本步骤所射出成 型的塑材为一种非导体的塑材, 且其中不需含有金属组成, 换言之, 一般常 见的工业塑材均可应用于本步骤中。  Step 1 Similarly, a metal sheet 11 may be embedded in a plastic body 10 by insert molding, and the metal sheet 11 is partially exposed to the plastic body 10 to form a casing member 1 (please cooperate with the figure) 1)), which differs from the first embodiment in that the plastic material formed by this step is a non-conductor plastic material, and does not need to contain a metal composition, in other words, a common industrial plastic material. Can be applied to this step.
另外, 同于第一具体实施例, 该壳体件 1可为一移动通讯装置的背盖, 例如移动电话背盖等。  In addition, as with the first embodiment, the housing member 1 can be a back cover of a mobile communication device, such as a mobile phone back cover or the like.
接着, 步骤二是在该塑料本体 10上成型一可供沉积金属的天线图案 101 (请配合图 1A所示) 。 具体而言, 本步骤为利用双色注塑 (2 shot molding) 方法将一导电塑材成型于该塑料本体 10上,以形成可供沉积金属的天线图案 101; 换言之, 本步骤为利用双色注塑将导电塑材成型在该塑料本体 10的表 面的预定区域, 以形成天线图案 101, 使下一步骤的导电金属材料得以 直接附着于该塑料本体 10上的天线图案 101 上以形成可接收信号的天 线。  Next, in the second step, an antenna pattern 101 for depositing metal is formed on the plastic body 10 (please be shown in FIG. 1A). Specifically, this step is to form a conductive plastic material on the plastic body 10 by a two-shot molding method to form an antenna pattern 101 for depositing metal; in other words, this step is to conduct electricity by using two-color injection molding. A plastic material is formed on a predetermined area of the surface of the plastic body 10 to form an antenna pattern 101, so that the conductive metal material of the next step is directly attached to the antenna pattern 101 on the plastic body 10 to form an antenna capable of receiving signals.
另外, 与第一具体实施例相同, 该天线图案 101与该金属片 11不相接 触, 以避免后续外加正电压的步骤影响到化学镀沉积金属于天线图案 101上 的反应。  Further, as in the first embodiment, the antenna pattern 101 is not in contact with the metal piece 11 to prevent the subsequent step of applying a positive voltage from affecting the reaction of the electroless plating metal on the antenna pattern 101.
接下来, 同样参考图 1B与图 4所示, 步骤三是将该壳体件 1置入一具 有金属离子(如铜离子或镍离子)的化学镀液 40中, 使金属离子还原且沉积 于该天线图案 101上, 以成型一金属层 12的天线; 同时, 提供一电源 30, 并将该电源的正极连接至部分裸露于该塑料本体 10的该金属片 11, 及将该 电源 30的负极连接至位于化学镀液 40中的电极 301, 以向该金属片 11加载 正电压,进而避免金属离子所还原的该金属层 12沉积于该金属片 11的表面。 因此,通过步骤二所使用的导电塑材, 化学镀液 40中的金属离子可直接沉积 附着于该塑料本体 10的天线图案 101上, 以形成可接收信号的金属层 12的 天线。再者, 在化学镀的过程中, 利用电源 30提供正电压于部分裸露于该塑 料本体 10的该金属片 11, 使部分裸露于该塑料本体 10的该金属片 11会产 生电镀的逆反应, 使化学镀所沉积在部分裸露于该塑料本体 10 的该金属片 11表面上的金属层 12,再次还原成离子态, 故可保持部分裸露于该塑料本体 10的该金属片 11表面不会沉积有化学镀所成型的金属层 12。 Next, referring to FIG. 1B and FIG. 4, the third step is to place the case member 1 into an electroless plating solution 40 having metal ions (such as copper ions or nickel ions) to reduce and deposit the metal ions. The antenna pattern 101 is formed to form an antenna of the metal layer 12; at the same time, a power source 30 is provided, and the anode of the power source is connected to the metal piece 11 partially exposed to the plastic body 10, and the negative electrode of the power source 30 The electrode 301 is placed in the electroless plating solution 40 to apply a positive voltage to the metal piece 11, thereby preventing the metal layer 12 reduced by the metal ions from being deposited on the surface of the metal piece 11. Therefore, by the conductive plastic material used in the second step, the metal ions in the electroless plating solution 40 can be directly deposited on the antenna pattern 101 of the plastic body 10 to form an antenna of the metal layer 12 that can receive the signal. Furthermore, in the electroless plating process, the power source 30 is used to provide a positive voltage to the metal sheet 11 partially exposed to the plastic body 10, so that the metal sheet 11 partially exposed to the plastic body 10 is produced. The reverse reaction of the electroplating causes the electroless plating to deposit on the metal layer 12 partially exposed on the surface of the metal piece 11 of the plastic body 10, and is again reduced to an ionic state, so that the metal piece partially exposed to the plastic body 10 can be maintained. 11 The metal layer 12 formed by electroless plating is not deposited on the surface.
因此, 本发明的第二具体实施例为利用双色注塑 (2 shot molding) 技术 制作一种天线装置, 换言之, 该壳体件 1包含一利用埋入模铸方法所模制成 型的塑料本体 10与金属片 11, 并利用双色注塑将另一导电塑材成型于该塑 料本体 10上以形成天线图案 101 ; 再利用化学镀方法将金属材料沉积于 该活化区域而形成有一金属层 12的天线; 再者, 在化学镀的同时, 利用外 接电源 30将正电压加载于金属片 11, 以避免化学镀所沉积的金属覆盖于 金属片 11的表面。  Accordingly, a second embodiment of the present invention is to fabricate an antenna device using a two-shot molding technique. In other words, the housing member 1 includes a plastic body 10 molded by a buried molding method. Forming another conductive plastic material on the plastic body 10 by two-color injection molding to form an antenna pattern 101; and depositing a metal material on the active region by an electroless plating method to form an antenna having a metal layer 12; Further, at the same time as the electroless plating, a positive voltage is applied to the metal piece 11 by the external power source 30 to prevent the metal deposited by the electroless plating from covering the surface of the metal piece 11.
综上所述, 本发明依据上述第一与第二具体实施例的制作方法, 制作出 一种天线装置, 其包括塑料本体 10、金属片 11及金属层 12, 金属片 11为埋 设于该塑料本体 10以形成一壳体件 1, 且该金属片 11部分裸露于该塑料本 体 10, 而塑料本体 10上具有一天线图案 101, 金属层 12则是利用化学镀沉 积于该天线图案 101上以形成天线;其中当该金属层 12的化学镀沉积时,部 分裸露于该塑料本体 10的该金属片 11连接于一电源 30的正极,以向该金属 片 11加载正电压, 进而避免该金属层 12沉积于该金属片 11的表面。  In summary, the present invention provides an antenna device according to the manufacturing method of the first and second embodiments, which comprises a plastic body 10, a metal sheet 11 and a metal layer 12, and the metal sheet 11 is embedded in the plastic. The body 10 is formed to form a housing member 1 , and the metal sheet 11 is partially exposed to the plastic body 10 , and the plastic body 10 has an antenna pattern 101 thereon. The metal layer 12 is deposited on the antenna pattern 101 by electroless plating. Forming an antenna; wherein when the metal layer 12 is deposited by electroless plating, the metal piece 11 partially exposed to the plastic body 10 is connected to the positive electrode of a power source 30 to apply a positive voltage to the metal piece 11 to avoid the metal layer. 12 is deposited on the surface of the metal sheet 11.
请参考图 1, 其显示金属片 11埋设于该塑料本体 10以形成一壳体件 1 的立体图。 在一实施例中, 该壳体件 1可为一移动通讯装置的背盖, 例如移 动电话背盖, 而该塑料本体 10包含一内表面 102及一相对于该内表面 102 的外表面 103, 该金属片 11为部分地同时裸露于该移动通讯装置的背盖的内 表面 102与外表面 103。 然而, 在一变化实施例中, 该金属片 11可仅部分裸 露于该移动通讯装置的背盖的内表面 102, 或是仅部分裸露于该移动通讯装 置的背盖的外表面 103。  Referring to Figure 1, there is shown a perspective view of the metal sheet 11 embedded in the plastic body 10 to form a housing member 1. In one embodiment, the housing member 1 can be a back cover of a mobile communication device, such as a mobile phone back cover, and the plastic body 10 includes an inner surface 102 and an outer surface 103 opposite the inner surface 102. The metal sheet 11 is partially exposed at the same time to the inner surface 102 and the outer surface 103 of the back cover of the mobile communication device. However, in a variant embodiment, the metal sheet 11 may be only partially exposed to the inner surface 102 of the back cover of the mobile communication device, or only partially exposed to the outer surface 103 of the back cover of the mobile communication device.
请参考图 1A, 其显示该塑料本体 10 上具有可供沉积金属的天线图案 Please refer to FIG. 1A, which shows the plastic body 10 having an antenna pattern for depositing metal.
101, 具体而言, 该天线图案 101由塑料本体 10的外表面 103连续地延伸至 塑料本体 10的内表面 102, 而该天线图案 101可利用前文所述的激光直接成 型技术 (laser-direct-stmcturing, LDS ) 的激光改质步骤或双色注塑 (2 shot molding)技术所制作, 在此不予赘述; 再者, 该天线图案 101与该金属片 11 不相接触。 请参考图 1B, 其显示金属层 12成型于该天线图案 101上, 以形成一接 收 /发送信号的天线。金属层 12的结构对应于该天线图案 101,且同样由塑料 本体 10的外表面 103连续地延伸至塑料本体 10的内表面 102; 值得注意的 是, 由于在该金属层 12的化学镀沉积时, 部分裸露于该塑料本体 10的该金 属片 11连接于一电源 30的正极, 以向该金属片 11加载正电压, 因此, 部分 裸露于该塑料本体 10的该金属片 11上并无金属层 12的沉积。 101. Specifically, the antenna pattern 101 is continuously extended from the outer surface 103 of the plastic body 10 to the inner surface 102 of the plastic body 10, and the antenna pattern 101 can utilize the laser direct forming technique (laser-direct-) described above. The laser modification step of stmcturing, LDS) or the two-shot molding technique is not described here; further, the antenna pattern 101 is not in contact with the metal piece 11. Referring to FIG. 1B, the metal layer 12 is formed on the antenna pattern 101 to form an antenna for receiving/transmitting signals. The structure of the metal layer 12 corresponds to the antenna pattern 101 and also extends continuously from the outer surface 103 of the plastic body 10 to the inner surface 102 of the plastic body 10; it is noted that due to the electroless plating deposition of the metal layer 12 The metal piece 11 partially exposed to the plastic body 10 is connected to the positive electrode of a power source 30 to apply a positive voltage to the metal piece 11 , so that the metal piece 11 barely exposed on the plastic body 10 has no metal layer. The deposition of 12.
请参考图 2与图 3, 图 2显示本实施例的天线装置与电路板 20、 导电元 件 21组设在一起的分解图; 而图 3显示上述的天线装置与电路板 20、 导电 元件 21组设在一起的组合图,其中,天线装置的塑料本体 10包含内表面 102 及相对于该内表面 102的外表面 103,金属层 12由塑料本体 10的外表面 103 连续地延伸至塑料本体 10的内表面 102, 导电元件 21的两端分别电性连接 于位于塑料本体 10的内表面 102的金属层 12以及电路板 20上的线路 201。 以此, 该金属层 12所接收的无线信号则可利用导电元件 21传递至该电路板 20上的线路 201, 反之亦然, 以达到信号的接收 /传送。  Referring to FIG. 2 and FIG. 3, FIG. 2 is an exploded view showing the antenna device of the embodiment and the circuit board 20 and the conductive element 21; and FIG. 3 shows the antenna device and the circuit board 20 and the conductive element 21 group. A combination view, wherein the plastic body 10 of the antenna device includes an inner surface 102 and an outer surface 103 opposite the inner surface 102, and the metal layer 12 extends continuously from the outer surface 103 of the plastic body 10 to the plastic body 10. The inner surface 102, the two ends of the conductive element 21 are electrically connected to the metal layer 12 on the inner surface 102 of the plastic body 10 and the line 201 on the circuit board 20, respectively. Thus, the wireless signal received by the metal layer 12 can be transferred to the line 201 on the circuit board 20 by the conductive element 21, and vice versa, to achieve signal reception/transmission.
另一方面, 金属片 11紧密地嵌合于该塑料本体 10, 以达到提升该壳体 件 1 (即移动通讯装置的背盖) 的结构强度、 或增加装饰性功用、 或加强电 磁遮蔽效果的功能, 并且本发明所提出的制作方法可有效避免化学镀的金属 沉积于金属片 11上, 以解决传统制程将化学镀的金属沉积于金属片 11上所 造成的问题。  On the other hand, the metal sheet 11 is tightly fitted to the plastic body 10 to enhance the structural strength of the housing member 1 (ie, the back cover of the mobile communication device), or to increase the decorative function, or to enhance the electromagnetic shielding effect. The function and the manufacturing method proposed by the present invention can effectively prevent the electroless plating metal from being deposited on the metal sheet 11 to solve the problem caused by the conventional process of depositing the electroless metal on the metal sheet 11.
综上所述, 本发明具有下列诸项优点:  In summary, the present invention has the following advantages:
1、将外接电源的正极连接至埋设于塑料本体的金属片, 以向该金属片加 载正电压, 故可避免进行金属层的化学镀时将金属材料沉积于金属片上所造 成的问题。 以此, 在应用化学镀的情况下, 本发明仍可将金属片嵌设并裸露 于塑料本体, 使其可维持装饰性功用或按键作用的功能。  1. The positive electrode of the external power source is connected to the metal piece embedded in the plastic body to apply a positive voltage to the metal piece, so that the problem of depositing the metal material on the metal piece during the electroless plating of the metal layer can be avoided. Therefore, in the case of applying electroless plating, the present invention can still embed and expose the metal piece to the plastic body, so that it can maintain the function of decorative function or button action.
2、另外, 本发明可避免进行金属层的化学镀时将金属材料沉积于金属片 上, 以解决现有技术所提及的剥离的沉积金属层所导致的电路短路问题, 且 使塑料本体与金属片所组成的壳体件具有较佳的结构强度。  2. In addition, the present invention can prevent the metal material from being deposited on the metal sheet during the electroless plating of the metal layer, to solve the short circuit problem caused by the stripped deposited metal layer mentioned in the prior art, and to make the plastic body and the metal The housing member composed of the sheets has a good structural strength.
以上所述仅为本发明的较佳可行实施例, 并非因此局限本发明的专利范 围,故凡运用本发明说明书及附图内容所为的等效技术变化, 均包含于本发明 的范围内。  The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalents of the present invention are included in the scope of the present invention.

Claims

权利要求 Rights request
1、 一种天线装置, 包含:  1. An antenna device comprising:
一塑料本体, 其上具有一天线图案;  a plastic body having an antenna pattern thereon;
一金属片, 其埋设于该塑料本体以形成一壳体件, 且该金属片为部分地 裸露于该塑料本体; 以及  a metal sheet embedded in the plastic body to form a housing member, and the metal sheet is partially exposed to the plastic body;
一金属层, 其利用化学镀沉积于该天线图案以形成天线;  a metal layer deposited on the antenna pattern by electroless plating to form an antenna;
其中, 在该金属层的化学镀沉积时, 部分裸露于该塑料本体的该金属片 连接于一电源的正极, 以向该金属片加载正电压, 进而避免该金属层沉积于 该金属片的表面。  Wherein, in the electroless plating deposition of the metal layer, the metal piece partially exposed to the plastic body is connected to the positive electrode of a power source to apply a positive voltage to the metal piece, thereby preventing the metal layer from being deposited on the surface of the metal piece. .
2、 如权利要求 1 所述的天线装置, 其中该壳体件为一移动通讯装置的 目盖  2. The antenna device according to claim 1, wherein the housing member is a cover of a mobile communication device
3、 如权利要求 2所述的天线装置, 其中该金属片部分裸露于该移动通 讯装置的背盖的内表面。  3. The antenna device according to claim 2, wherein the metal piece portion is exposed to an inner surface of the back cover of the mobile communication device.
4、 如权利要求 2所述的天线装置, 其中该金属片部分裸露于该移动通 讯装置的背盖的外表面。  4. The antenna device according to claim 2, wherein the metal piece portion is exposed to an outer surface of the back cover of the mobile communication device.
5、 如权利要求 2所述的天线装置, 其中该金属片部分地同时裸露于该 移动通讯装置的背盖的内表面与外表面。  The antenna device according to claim 2, wherein the metal piece is partially exposed at the same time to the inner surface and the outer surface of the back cover of the mobile communication device.
6、 如权利要求 3至 5中任一项所述的天线装置, 其中该金属片与该天 线图案不相接触。  The antenna device according to any one of claims 3 to 5, wherein the metal piece is not in contact with the antenna pattern.
7、 一种天线装置的制作方法, 包含以下步骤:  7. A method of fabricating an antenna device, comprising the steps of:
步骤一: 利用埋入模铸将一金属片埋设于一塑料本体, 且使该金属片部 分裸露于该塑料本体以形成一壳体件;  Step 1: embedding a metal piece in a plastic body by embedding molding, and exposing the metal piece to the plastic body to form a casing piece;
步骤二: 在该塑料本体上成型一可供沉积金属的天线图案; 以及 步骤三: 将该壳体件置入一具有金属离子的化学镀液中, 使金属离子还 原且沉积于该天线图案上, 以成型一金属层的天线; 同时, 提供一电源, 并 将该电源的正极连接至部分裸露于该塑料本体的该金属片, 及将该电源的负 极连接至位于化学镀液中的电极, 以向该金属片加载正电压, 进而避免金属 离子所还原的该金属层沉积于该金属片的表面。  Step 2: forming an antenna pattern for depositing metal on the plastic body; and step 3: placing the housing member in an electroless plating solution with metal ions to reduce and deposit metal ions on the antenna pattern Forming a metal layer antenna; at the same time, providing a power source, connecting the anode of the power source to the metal piece partially exposed to the plastic body, and connecting the negative electrode of the power source to the electrode located in the electroless plating solution, The metal layer is loaded with a positive voltage to prevent the metal layer reduced by the metal ions from depositing on the surface of the metal sheet.
8、 如权利要求 7所述的天线装置的制作方法, 其中, 在步骤一中, 该 金属片为不锈钢或耐腐蚀金属。 8. The method of fabricating an antenna device according to claim 7, wherein in the first step, the metal piece is stainless steel or a corrosion-resistant metal.
9、 如权利要求 8所述的天线装置的制作方法, 其中在步骤二中, 利用 激光直接活化将该可供沉积金属的天线图案成型于该塑料本体上。 · 9. The method of fabricating an antenna device according to claim 8, wherein in the second step, the antenna pattern for depositing the metal is directly molded by the laser onto the plastic body. ·
10、 如权利要求 8所述的天线装置的制作方法, 其中在步骤二中, 利用 双色注塑将该可供沉积金属的天线图案成型于该塑料本体上。  10. The method of fabricating an antenna device according to claim 8, wherein in the second step, the metal pattern for depositing the metal is molded on the plastic body by two-color injection molding.
11、 如权利要求 7至 10中任一项所述的天线装置的制作方法, 其中在 步骤三中, 该化学镀液中的金属离子为铜离子, 而该金属层为铜层。  The method of fabricating an antenna device according to any one of claims 7 to 10, wherein in the third step, the metal ion in the electroless plating solution is copper ion, and the metal layer is a copper layer.
12、 如权利要求 7至 10中任一项所述的天线装置的制作方法, 其中在 步骤三中, 该化学鍍液中的金属离子为镍离子, 而该金属层为镍层。  The method of fabricating an antenna device according to any one of claims 7 to 10, wherein in the third step, the metal ion in the electroless plating solution is nickel ion, and the metal layer is a nickel layer.
PCT/CN2011/000760 2010-04-30 2011-04-29 Antenna device and manufacturing method thereof WO2011134282A1 (en)

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