TW201507275A - An antenna structure with ceramic substrate material and method for fabricating - Google Patents
An antenna structure with ceramic substrate material and method for fabricating Download PDFInfo
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本發明是有關於一種天線及其製作方法,特別是一種以陶瓷為基底的天線結構及其製作方法。 The invention relates to an antenna and a manufacturing method thereof, in particular to an antenna structure based on ceramics and a manufacturing method thereof.
由於無線通訊技術的發展,電子通訊產品對於訊號的接收品質要求越來越重視;而消費者對於電子通訊產品要求體積小、質量輕、便於攜帶及收訊良好等特點,加上高度整合的晶片要求以達成小型化的目的。而天線的效能為影響無線通訊品質重要的一環;各種無線通訊系統的天線,依照不同的應用而有不同的特性需求,例如,無線通訊產品的天線有外露型及內建型,其中外露型係將天線外露於無線通訊產品機體外,而內建型天線則是將平板天線裝設於殼體上,再將殼體與平板式天線一同裝設於無線通訊產品中,提供產品接收訊號。但傳統的晶片型天線,在製作上會有許多缺點,例如,傳統的天線製程係以印刷的方式將天線線路製作在陶瓷體上,但由於陶瓷體係為立體的結構,因此天線線路在轉角連接處的精確度非常不易控制。緣此,本發明人乃潛心研究並配合學理的運用,而提出一種設計合理且有效改善上述問題的本發明。 Due to the development of wireless communication technology, electronic communication products pay more and more attention to the receiving quality requirements of signals; and consumers require small size, light weight, portability and good reception for electronic communication products, and highly integrated chips. It is required to achieve the goal of miniaturization. The performance of the antenna is an important part of affecting the quality of wireless communication; the antennas of various wireless communication systems have different characteristics according to different applications. For example, the antennas of wireless communication products are exposed and built-in, of which the exposed type is The antenna is exposed outside the wireless communication product, and the built-in antenna is mounted on the casing, and then the casing and the planar antenna are installed together in the wireless communication product to provide product receiving signals. However, the conventional wafer type antenna has many disadvantages in production. For example, the conventional antenna process is to fabricate the antenna circuit on the ceramic body in a printed manner, but since the ceramic system has a three-dimensional structure, the antenna line is connected at a corner. The accuracy is very difficult to control. Accordingly, the inventors have diligently studied and cooperated with the application of the theory, and proposed a present invention which is rational in design and effective in improving the above problems.
本發明的主要目的在於提供一種以陶瓷為基底的天線結構及其製作方法,以提高天線製作的精度,以得到較佳天線品質及接收訊號的特性。 The main object of the present invention is to provide a ceramic-based antenna structure and a manufacturing method thereof to improve the accuracy of antenna fabrication to obtain better antenna quality and received signal characteristics.
為了實現上述目的,本發明提供一種以陶瓷為基底的天線結構,其包含:一陶瓷基板及一金屬層。金屬層設置於陶瓷基板的外表面,且金屬層為一天線圖案。 In order to achieve the above object, the present invention provides a ceramic-based antenna structure comprising: a ceramic substrate and a metal layer. The metal layer is disposed on the outer surface of the ceramic substrate, and the metal layer is an antenna pattern.
進一步地,陶瓷基板可以為三氧化二鋁材料;金屬層可以為銅材料;絕緣層可以為環氧樹酯材料或聚亞醯胺材料。 Further, the ceramic substrate may be an aluminum oxide material; the metal layer may be a copper material; and the insulating layer may be an epoxy resin material or a polyamidite material.
為了實現上述目的,本發明更提供一種製作以陶瓷為基底的天線結構的方法,包含有下列步驟:提供一陶瓷基板;於陶瓷基板的外表面形成一金屬層;鏤空該金屬層的一預定區域,以使金屬層形成一天線圖案。 In order to achieve the above object, the present invention further provides a method for fabricating a ceramic-based antenna structure, comprising the steps of: providing a ceramic substrate; forming a metal layer on an outer surface of the ceramic substrate; and hollowing out a predetermined region of the metal layer So that the metal layer forms an antenna pattern.
進一步地,於陶瓷基板的外表面形成金屬層的步驟前,更包含下列步驟:一粗化步驟,利用化學清洗方式,使陶瓷基板表面粗糙;一敏化步驟,於陶瓷基板表面吸附一易氧化的金屬離子層;一活化步驟,於陶瓷基板表面沉積一具有催化活性的催化金屬。其中,易氧化的金屬離子層可以為金屬層的還原劑;金屬層可以為銅材料。另外,於陶瓷基板的外表面形成一金屬層的步驟後,更包含一鈍化步驟:於金屬層表面形成一氧化物保護層。 Further, before the step of forming a metal layer on the outer surface of the ceramic substrate, the method further comprises the steps of: a roughening step, using a chemical cleaning method to roughen the surface of the ceramic substrate; and a sensitizing step, adsorbing an easy oxidation on the surface of the ceramic substrate a metal ion layer; an activation step of depositing a catalytically active catalytic metal on the surface of the ceramic substrate. Wherein, the easily oxidizable metal ion layer may be a reducing agent of the metal layer; the metal layer may be a copper material. In addition, after the step of forming a metal layer on the outer surface of the ceramic substrate, a passivation step is further included: forming an oxide protective layer on the surface of the metal layer.
為了實現上述目的,本發明更提供一種製作以陶瓷為基底的天線結構的方法,其包含下列步驟:提供一陶瓷基板;使一絕緣層包覆於陶瓷基板的外表面;於絕緣層形成一鏤空部,以裸露陶瓷基板;使一金屬層包覆絕緣層及其鏤空部;清除該陶瓷基板上的該絕緣層,以及附著於該絕緣層的該金屬層,以使該陶瓷基板上形成具有天線圖案的金屬層。 In order to achieve the above object, the present invention further provides a method for fabricating a ceramic-based antenna structure, comprising the steps of: providing a ceramic substrate; coating an insulating layer on an outer surface of the ceramic substrate; forming a hollow in the insulating layer a bare ceramic substrate; a metal layer covering the insulating layer and the hollow portion thereof; removing the insulating layer on the ceramic substrate, and the metal layer attached to the insulating layer to form an antenna on the ceramic substrate Patterned metal layer.
為了實現上述目的,本發明又提供一種手持式通訊裝置,其內埋有一以陶瓷為基底的天線結構,手持式通訊裝置包含:一通訊模組及一背蓋結構。通訊模組背面具有至少兩個導電端子;背蓋結構由一絕緣材質組成,其包含:一陶瓷基板及一金屬層。陶瓷基板內埋於該背蓋結構中;金屬層為一天線圖案,設置於陶瓷基板上,且金屬層具有一饋入部。其中背蓋結構組裝於通訊模組 的背面,且背蓋結構的金屬層的該饋入部連接通訊模組的二導電端子。 In order to achieve the above object, the present invention further provides a handheld communication device in which a ceramic-based antenna structure is embedded, and the handheld communication device comprises: a communication module and a back cover structure. The back of the communication module has at least two conductive terminals; the back cover structure is composed of an insulating material, and comprises: a ceramic substrate and a metal layer. The ceramic substrate is embedded in the back cover structure; the metal layer is an antenna pattern disposed on the ceramic substrate, and the metal layer has a feeding portion. The back cover structure is assembled in the communication module The back portion of the metal layer of the back cover structure is connected to the two conductive terminals of the communication module.
本發明的以陶瓷為基底的天線結構及其製作方法,具有以下有益的優點為:本發明先於絕緣層形成有鏤空部,再使金屬包覆於整個絕緣層外表面,再將絕緣層及附著於絕緣層的金屬層清除,藉此可於陶瓷基板上形成具有複雜的結構的金屬天線圖案,進而可以解決傳統印刷製程的缺點,而達成具有較佳精度的天線結構。 The ceramic-based antenna structure of the present invention and the manufacturing method thereof have the following advantageous advantages: the present invention forms a hollow portion before the insulating layer, and then covers the entire outer surface of the insulating layer, and then the insulating layer and The metal layer attached to the insulating layer is removed, thereby forming a metal antenna pattern having a complicated structure on the ceramic substrate, thereby solving the shortcomings of the conventional printing process and achieving an antenna structure with better precision.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
1‧‧‧天線結構 1‧‧‧Antenna structure
10‧‧‧陶瓷基板 10‧‧‧Ceramic substrate
100‧‧‧天線圖案 100‧‧‧Antenna pattern
11‧‧‧金屬層 11‧‧‧metal layer
12‧‧‧絕緣層 12‧‧‧Insulation
121‧‧‧鏤空部 121‧‧‧镂空部
2‧‧‧手持式通訊裝置 2‧‧‧Handheld communication device
20‧‧‧通訊模組 20‧‧‧Communication Module
21‧‧‧背蓋結構 21‧‧‧Back cover structure
S1~S3‧‧‧流程步驟 S1~S3‧‧‧ Process steps
SS1~SS5‧‧‧流程步驟 SS1~SS5‧‧‧ Process Steps
圖1為本發明的以陶瓷為基底的天線結構的剖面結構示意圖。 1 is a schematic cross-sectional view showing a ceramic-based antenna structure of the present invention.
圖2為本發明的製作以陶瓷為基底的天線結構的方法的第一實施例的第一流程示意圖。 2 is a first flow diagram of a first embodiment of a method of fabricating a ceramic-based antenna structure of the present invention.
圖3為本發明的製作以陶瓷為基底的天線結構的方法的第一實施例的第二流程示意圖。 3 is a second flow diagram of a first embodiment of a method of fabricating a ceramic-based antenna structure of the present invention.
圖4為本發明的製作以陶瓷為基底的天線結構的方法的第二實施例的流程示意圖。 4 is a flow chart showing a second embodiment of a method of fabricating a ceramic-based antenna structure of the present invention.
圖5為本發明的製作以陶瓷為基底的天線結構的方法的第三實施例的第一流程示意圖。 5 is a first flow diagram of a third embodiment of a method of fabricating a ceramic-based antenna structure of the present invention.
圖6為本發明的製作以陶瓷為基底的天線結構的方法的第三實施例的第二流程示意圖。 6 is a second flow diagram of a third embodiment of a method of fabricating a ceramic-based antenna structure of the present invention.
圖7為本發明的以陶瓷為基底的天線結構應用於手持式通訊裝置的示意圖。 7 is a schematic view of a ceramic-based antenna structure applied to a handheld communication device of the present invention.
請參閱圖1,其為本發明的以陶瓷為基底的天線結構的實施例 的剖面結構示意圖。如圖所示,以陶瓷為基底的天線結構1,其包含有:一陶瓷基底10及一金屬層11。金屬層11設置於陶瓷基底10的外表面。金屬層11為一天線圖案100,其為天線的輻射本體,且形狀外型可以依據使用者需求加以變更設計,於此並不加以限制。在較佳地實施態樣中,陶瓷基板可以是氧化鋁材料(例如:三氧化二鋁);金屬層11可以是銅材料。 Please refer to FIG. 1 , which is an embodiment of a ceramic-based antenna structure of the present invention. Schematic diagram of the cross section structure. As shown, the ceramic-based antenna structure 1 includes a ceramic substrate 10 and a metal layer 11. The metal layer 11 is disposed on the outer surface of the ceramic substrate 10. The metal layer 11 is an antenna pattern 100, which is a radiation body of the antenna, and the shape of the shape can be changed according to the needs of the user, and is not limited herein. In a preferred embodiment, the ceramic substrate can be an aluminum oxide material (e.g., aluminum oxide); the metal layer 11 can be a copper material.
請一併參閱圖2及圖3本發明更進一步提出製作上述以陶瓷為基底的天線結構的方法。該製作方法包含下列步驟:步驟S1:提供一陶瓷基板;步驟S2:於陶瓷基板的外表面形成一金屬層;步驟S3:鏤空金屬層的一預定區域,以使金屬層形成一天線圖案。 Referring to Figures 2 and 3 together, the present invention further proposes a method of fabricating the above-described ceramic-based antenna structure. The manufacturing method comprises the following steps: step S1: providing a ceramic substrate; step S2: forming a metal layer on the outer surface of the ceramic substrate; and step S3: hollowing out a predetermined region of the metal layer to form the metal layer to form an antenna pattern.
特別說明的是,於步驟S3中所述的預定區域,即為對應於所欲成形的天線圖案的反向圖案;具體地說,使用者於金屬層形成天線圖案時,所需要鏤空的部份即為所步驟S3中所述的預定區域。在實際應用中,步驟S2中所述形成一金屬層於陶瓷基板的製作方法,可以依據實際需求加以選擇,例如可以是利用化學鍍或是電鍍等方式;步驟S3中可以是應用雷射燒除的方式,以形成具有天線圖案的金屬層,於此並不多加限制。 Specifically, the predetermined area described in the step S3 is a reverse pattern corresponding to the antenna pattern to be formed; specifically, when the user forms the antenna pattern on the metal layer, the hollow portion is required. That is, the predetermined area described in step S3. In practical applications, the method for forming a metal layer on the ceramic substrate in the step S2 can be selected according to actual needs, for example, by electroless plating or electroplating; in step S3, laser burning can be applied. The way to form a metal layer having an antenna pattern is not limited thereto.
請參閱圖4,其為製作上述本發明的以陶瓷為基底的天線結構的另一製作方法,與上述製作方法不同的是:於上一實施例的步驟S1與步驟S3之間,更可包含下列步驟:步驟S11:一表面粗化步驟,使該陶瓷基板表面粗糙,藉以增加陶瓷基板於後續程序中的附著性;步驟S12:一表面敏化步驟,於該陶瓷基板表面吸附一易氧化的金屬離子層,藉以可使在後續化學鍍或電鍍金屬 層時,可以使化學液中的金屬離子易於沉積於陶瓷基板表面;步驟S13:一表面活化步驟,於該陶瓷基板表面沉積一具有催化活性的催化金屬,藉以提高金屬層的沉積速率及其均勻性;步驟S2:於陶瓷基板的外表面形成一金屬層;步驟S21:一表面鈍化步驟,於金屬層表面形成一氧化物保護層。 Referring to FIG. 4, another method for fabricating the above-described ceramic-based antenna structure of the present invention is different from the above manufacturing method, and may further include between step S1 and step S3 of the previous embodiment. The following steps: Step S11: a surface roughening step to roughen the surface of the ceramic substrate, thereby increasing the adhesion of the ceramic substrate in a subsequent process; Step S12: a surface sensitizing step of adsorbing an easily oxidizable surface on the surface of the ceramic substrate Metal ion layer, which can be used for subsequent electroless plating or electroplating of metals In the layer, the metal ions in the chemical liquid can be easily deposited on the surface of the ceramic substrate; Step S13: a surface activation step depositing a catalytically active catalytic metal on the surface of the ceramic substrate, thereby increasing the deposition rate and uniformity of the metal layer Step S2: forming a metal layer on the outer surface of the ceramic substrate; and step S21: a surface passivation step to form an oxide protective layer on the surface of the metal layer.
其中,上述步驟S11在實際應用中,可以是依據金屬層屬性利用化學液進行粗化。 In the actual application, the above step S11 may be roughening by using a chemical liquid according to the properties of the metal layer.
請一併參閱圖5及圖6,本發明更進一步提出製作上述以陶瓷為基底的天線結構的方法。該製作方法包含下列步驟:步驟SS1:提供一陶瓷基板;步驟SS2:使一絕緣層包覆於該陶瓷基板的外表面;步驟SS3:於該絕緣層形成一鏤空部,以裸露該陶瓷基板;步驟SS4:使一金屬層包覆於該絕緣層以及該絕緣層的該鏤空部;步驟SS5:清除陶瓷基板上的絕緣層,以及附著於絕緣層上的金屬層,藉以使陶瓷基板上形成具有天線圖案的金屬層。 Referring to FIG. 5 and FIG. 6, the present invention further proposes a method for fabricating the above-described ceramic-based antenna structure. The manufacturing method comprises the following steps: step SS1: providing a ceramic substrate; step SS2: coating an insulating layer on the outer surface of the ceramic substrate; step SS3: forming a hollow portion on the insulating layer to expose the ceramic substrate; Step SS4: coating a metal layer on the insulating layer and the hollow portion of the insulating layer; step SS5: removing the insulating layer on the ceramic substrate and the metal layer attached to the insulating layer, thereby forming the ceramic substrate The metal layer of the antenna pattern.
其中上述步驟SS2至SS4中,在實際應用中,可以是利用自動化設備以模內射出方法將絕緣材料固定且包覆於陶瓷基板以形成該絕緣層,同時該模具上可以具有天線圖案設計,因此可使該絕緣層上形成有該鏤空部。 In the above steps SS2 to SS4, in practical applications, the insulating material may be fixed and coated on the ceramic substrate by an in-mold injection method using an automated device to form the insulating layer, and the mold may have an antenna pattern design. The hollow portion may be formed on the insulating layer.
請參閱圖7,上述本發明的以陶瓷為基底的天線結構,可以應用於手持式通訊裝置(較佳地可以是智慧型手機)。如圖所示,手持 式通訊裝置2包含:一通訊模組20及一背蓋結構21。上述以陶瓷為基底的天線結構1內埋設置於背蓋結構21中,且其具有一饋入部(圖未示),用以連接通訊模組20背面相對應的兩個導電端子(圖未示)。 Referring to FIG. 7, the ceramic-based antenna structure of the present invention described above can be applied to a handheld communication device (preferably a smart phone). As shown, hand held The communication device 2 comprises: a communication module 20 and a back cover structure 21. The ceramic-based antenna structure 1 is embedded in the back cover structure 21, and has a feeding portion (not shown) for connecting two conductive terminals corresponding to the back surface of the communication module 20 (not shown) ).
惟以上所述僅為本發明的較佳實施例,非意欲侷限本發明的專利保護範圍,故舉凡運用本發明說明書及圖式內容所為的等效變化,均同理皆包含於本發明的權利保護範圍內,合予陳明。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalents of the present invention and the equivalents of the drawings are all included in the present invention. Within the scope of protection, it is given to Chen Ming.
1‧‧‧天線結構 1‧‧‧Antenna structure
10‧‧‧陶瓷基板 10‧‧‧Ceramic substrate
11‧‧‧金屬層 11‧‧‧metal layer
100‧‧‧天線圖案 100‧‧‧Antenna pattern
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TWI584713B (en) * | 2015-10-29 | 2017-05-21 | Huang-Chieh Metal Composite Material Tech Co Ltd | The structure of a metal housing of a radio wave communication device and a method of manufacturing the same |
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TWI584713B (en) * | 2015-10-29 | 2017-05-21 | Huang-Chieh Metal Composite Material Tech Co Ltd | The structure of a metal housing of a radio wave communication device and a method of manufacturing the same |
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