WO2011125191A1 - プローブ及びその製造方法 - Google Patents
プローブ及びその製造方法 Download PDFInfo
- Publication number
- WO2011125191A1 WO2011125191A1 PCT/JP2010/056322 JP2010056322W WO2011125191A1 WO 2011125191 A1 WO2011125191 A1 WO 2011125191A1 JP 2010056322 W JP2010056322 W JP 2010056322W WO 2011125191 A1 WO2011125191 A1 WO 2011125191A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- probe
- magnet
- magnets
- anisotropic conductive
- Prior art date
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Definitions
- a probe for establishing electrical connection with an electronic device under test (hereinafter also referred to as an IC device) such as an integrated circuit element formed on a semiconductor wafer, an electronic component test apparatus equipped with the probe,
- the present invention relates to a substrate used for the probe and a method for manufacturing the probe.
- Stacked membrane, first anisotropic conductive rubber, first wiring board, second anisotropic conductive rubber, and second wiring board as probes used for testing IC devices in the wafer state Is known (see, for example, Patent Document 1).
- the above probe requires high positioning accuracy when the membrane, the first anisotropic conductive rubber, the first wiring board, the second anisotropic conductive rubber, and the second wiring board are stacked. Therefore, there is a problem that a lot of assembly steps are required.
- the problem to be solved by the present invention is to provide a probe capable of improving the assembly workability, an electronic component test apparatus including the probe, a substrate used for the probe, and a method of manufacturing the probe. is there.
- a probe according to the present invention is a probe for establishing an electrical connection with an electronic component to be tested, and includes a plurality of substrates each having a plurality of magnets, And a second substrate stacked on the first substrate, wherein the plurality of magnets includes a plurality of first magnets provided on the first substrate, and the second substrate.
- a plurality of second magnets arranged to face each of the plurality of first magnets, and the first magnet and the second magnet facing each other are different from each other.
- the magnetic poles are provided so as to face each other (see claim 1).
- the first substrate is formed on a membrane substrate having a contact and an insulating sheet for holding the contact, or on the first insulating base and the first insulating base.
- the magnet may be a permanent magnet (see claim 3).
- the magnet may be inserted into a through hole formed in the substrate (see claim 4).
- the adjacent magnets may be provided such that different magnetic poles face the same direction (see claim 5).
- the plurality of magnets may be arranged in a ring on the substrate (see claim 6).
- the magnet may be a magnet formed by magnetizing a magnetic body attached to the substrate (see claim 7).
- An electronic component testing apparatus depressurizes a sealed space formed between the probe, a test head electrically connected to the probe, and the electronic component to be tested and the probe.
- a pressure reducing means for bringing the electronic device under test and the probe into electrical contact with each other is provided (see claim 8).
- a board according to the present invention is a board used for a probe for establishing an electrical connection with an electronic device under test, and includes a plurality of magnets, and the adjacent magnets are different from each other.
- the magnetic poles are provided so as to face in the same direction (see claim 9).
- the probe manufacturing method according to the present invention is the above-described probe manufacturing method, wherein the first substrate and the second magnet are made to face each other by causing the first magnet and the second magnet to face each other. And a second step of laminating the first and second substrates to each other (refer to claim 10).
- an attaching step of attaching a magnetic body to the substrate and a magnetizing step of forming the magnet by magnetizing the magnetic body attached to the substrate may be provided (see claim 11).
- the magnetic body in the attaching step, may be inserted into a through hole formed in the substrate (see claim 12).
- the magnetic bodies adjacent to each other may be magnetized such that different magnetic poles are directed in the same direction (see claim 13).
- a plurality of the magnetic bodies may be arranged in a ring on the substrate (see claim 14).
- the plurality of magnetic bodies in the attaching step, may be arranged in a ring on the substrate, and in the magnetization step, the substrate may be rotated to sequentially magnetize the plurality of magnetic bodies ( (See claim 15).
- the first substrate is formed on a membrane substrate having a contact and an insulating sheet for holding the contact, or on the first insulating base and the first insulating base.
- An anisotropic conductive substrate having an anisotropic conductive elastic body and a frame for holding the anisotropic conductive elastic body.
- it may be a second wiring board having a second insulating base and a second terminal formed on the second insulating base (see claim 16). Note that the second substrate only needs to be directly stacked with the first substrate, and may be stacked on the first substrate or may be stacked below the first substrate.
- the assembly workability of the probe can be improved.
- FIG. 1 is a schematic side view showing a semiconductor wafer testing apparatus in an embodiment of the present invention.
- FIG. 2 is a cross-sectional view of the probe in the embodiment of the present invention.
- FIG. 3 is an exploded view of the probe in the embodiment of the present invention.
- FIG. 4 is a plan view showing a layout of the first magnet in the membrane substrate according to the embodiment of the present invention.
- FIGS. 5A and 5B are a plan view and a bottom view showing a layout of the second magnet in the first anisotropic conductive substrate of the probe according to the embodiment of the present invention.
- FIG. 6 is a cross-sectional view showing the relationship between the repulsive forces of the first magnet and the second magnet in the embodiment of the present invention.
- FIGS. 7A and 7B are a plan view and a bottom view showing a layout of the third magnet in the pitch conversion board of the probe according to the embodiment of the present invention.
- FIGS. 8A and 8B are a plan view and a bottom view showing a layout of the fourth magnet in the second anisotropic conductive substrate of the probe according to the embodiment of the present invention.
- FIG. 9 is a bottom view showing the layout of the fifth magnet in the probe performance board according to the embodiment of the present invention.
- FIG. 10 is a schematic side view showing a state in which the semiconductor wafer test apparatus in the embodiment of the present invention is testing an IC device.
- 11 is an enlarged cross-sectional view of a portion XI in FIG. FIG.
- FIG. 12 is a flowchart showing a method for manufacturing a probe according to an embodiment of the present invention.
- FIG. 13 is a diagram illustrating a method of magnetizing a magnetic material embedded in a substrate in the embodiment of the present invention.
- FIG. 14 is an exploded perspective view of the probe in the embodiment of the present invention.
- FIG. 15 is a cross-sectional view showing a modification of the probe according to the present invention.
- FIG. 16 is sectional drawing which shows the modification of the attachment method of the magnetic body in embodiment of this invention.
- FIG. 1 is a schematic side view showing a semiconductor wafer test apparatus in the present embodiment.
- a semiconductor wafer test apparatus 1 (electronic component test apparatus) in this embodiment is an apparatus for testing an IC device formed on a semiconductor wafer 100. As shown in FIG. 1, a test head 2 and a probe 10 (probe card). , A wafer tray 3, and a decompression device 4.
- the semiconductor wafer testing apparatus 1 When testing an IC device, the semiconductor wafer testing apparatus 1 causes the semiconductor wafer 100 held on the wafer tray 3 to face the probe 10 and decompresses the sealed space 80 (see FIG. 10) by the decompression device 4 in this state. . As a result, the semiconductor wafer 100 is pressed against the probe 10 and electrical continuity between components in the probe 10 is ensured. In this state, a tester (not shown) inputs / outputs a test signal to / from the IC device via the test head 2 to test the IC device.
- the semiconductor wafer 100 may be pressed against the probe 10 by a method other than the decompression method (for example, a pressing method).
- 2 and 3 are a sectional view and an exploded view of the probe in the present embodiment.
- the probe 10 in this embodiment includes a membrane substrate 20 having bumps 22 that are in electrical contact with electrodes 110 (see FIG. 11) of an IC device built in the semiconductor wafer 100.
- the performance board 60 electrically connected to the test head 2, the pitch conversion board 40 for converting the pitch of the conduction path between the membrane board 20 and the performance board 60, and the membrane board 20 and the pitch conversion board 40.
- a first anisotropic conductive substrate 30 that is electrically connected, and a second anisotropic conductive substrate 50 that is electrically connected to the pitch conversion substrate 40 and the performance board 60 are provided.
- These substrates 20 to 60 are laminated in the order of the membrane substrate 20, the first anisotropic conductive substrate 30, the pitch conversion substrate 40, the second anisotropic conductive substrate 50, and the performance board 60.
- the membrane substrate 20, the first anisotropic conductive substrate 30, the pitch conversion substrate 40, the second anisotropic conductive substrate 50, and the performance board 60 in this embodiment correspond to an example of the substrate in the present invention.
- the membrane substrate 20, the pitch conversion substrate 40, and the performance board 60 in the present embodiment correspond to an example of the first substrate in the present invention
- the first anisotropic conductive substrate 30 and the second in the present embodiment correspond to an example of the second substrate in the present invention.
- FIG. 4 is a plan view showing the layout of the magnets on the membrane substrate of the probe according to this embodiment, and is a view of the membrane substrate 20 as viewed from above (from the top to the bottom on the paper surface of FIG. 2). .
- the membrane substrate 20 is a substantially circular plate-like substrate, and as shown in FIGS. 2 and 3, a sheet member 21 having flexibility and electrical insulation, and a large number of bumps provided on the lower surface of the sheet member 21. 22 and a conductive pattern 23 provided on the upper surface of the sheet member 21.
- seat member 21 a polyimide, an aramid fiber, etc. can be illustrated, for example.
- the bump 22 is made of, for example, a conductive material such as nickel, and has a convex shape protruding downward from the sheet member 21.
- the bumps 22 are disposed on the lower surface of the sheet member 21 so as to correspond to the electrodes 110 (see FIG. 11) on the semiconductor wafer 100.
- the bumps 22 are formed, for example, by growing nickel by plating in through holes formed in the sheet member 21 by laser processing.
- the conductive pattern 23 is formed, for example, by plating the upper surface of the sheet member 21, printing a copper paste, or etching.
- the conductive pattern 23 is disposed so as to correspond to the bump 22, and the bump 22 and the conductive pattern 23 are electrically connected.
- the membrane substrate 20 of the present embodiment has a large number (24 in this example) of first magnets 25 as shown in FIGS.
- Each first magnet 25 is, for example, a permanent magnet having a diameter of about 0.2 mm to 3 mm.
- the first magnet 25 is fitted in a through hole 21 a formed in the sheet member 21 and embedded in the sheet member 21.
- the first magnets 25 are arranged on the outer peripheral portion of the sheet member 21 at substantially equal intervals along the circumferential direction.
- the size of the first magnet 25 is not particularly limited.
- the adjacent first magnets 25 are provided on the sheet member 21 so that different magnetic poles face in the same direction.
- every other first magnet 25a with the north pole facing upward is arranged between the first magnets 25a, with the south pole facing upward.
- 25b is interposed. That is, in the outer peripheral part of the sheet member 21, the first magnets 25a whose N poles are directed upward and the first magnets 25b whose S poles are directed upward are alternately arranged in a ring shape.
- FIG. 5A and 5B are a plan view and a bottom view showing the arrangement of the magnets on the first anisotropic conductive substrate of the probe according to this embodiment, and FIG. 6 shows the repulsion between the first magnet and the second magnet in this embodiment. It is sectional drawing which shows the relationship of force.
- the left figure is a plan view of the first anisotropic conductive substrate 30 as viewed from above (from the top to the bottom on the paper surface of FIG. 2), and the right figure is the first figure.
- FIG. 3 is a bottom view of one anisotropic conductive substrate 30 as viewed from below (from the bottom to the top on the paper surface of FIG. 2).
- the first anisotropic conductive substrate 30 is a substantially circular plate-shaped substrate smaller than the membrane substrate 20, and as shown in FIG. 3, a first anisotropic conductive rubber 31 having conductivity only in the thickness direction. And a first frame 34 that holds the first anisotropic conductive rubber 31.
- the first anisotropic conductive rubber 31 is composed of a particle dispersion part 32 in which conductive particles are locally dispersed in an insulator, and the periphery of the particle dispersion part 32, and only from the insulator. And an insulating portion 33.
- the particle dispersion portion 32 is disposed so as to correspond to the conductive pattern 23 of the membrane substrate 20.
- Examples of the material constituting the conductive particles of the particle dispersion portion 32 include iron, copper, zinc, chromium, nickel, silver, aluminum, and alloys thereof.
- the insulating material which has elasticity such as silicone rubber, urethane rubber, natural rubber, can be illustrated, for example.
- anisotropic conductive rubber for example, PCR (registered trademark) manufactured by JSR Microtech Co., Ltd. can be used.
- the material constituting the first frame 34 for example, iron, copper, nickel, chromium, cobalt, magnesium, manganese, molybdenum, indium, lead, palladium, titanium, tungsten, aluminum, gold, platinum, silver, Or these alloys etc. can be illustrated.
- a large number (24 in this example) of second magnets 35 are provided.
- the second magnet 35 is a permanent magnet similar to the first magnet 25, and is fitted in a through hole 34 a formed in the first frame 34.
- the second magnets 35 are arranged at substantially equal intervals along the circumferential direction on the outer peripheral portion of the first anisotropic conductive substrate 30 so as to face the first magnet 25 of the membrane substrate 20. Yes.
- the first magnet 25 and the second magnet 35 are used to facilitate the positioning of the membrane substrate 20 and the first anisotropic conductive substrate 30.
- the second magnets 35 adjacent to each other are provided on the first frame 34 so that the different magnetic poles face the same direction as the membrane substrate 20 described above. ing. Specifically, as shown in FIG. 5, a second magnet 35a with the N pole facing upward and the S pole facing downward, and the second magnet 35a with the S pole facing upward and the N pole facing downward. Magnets 35b are alternately arranged.
- the second magnet 35a is disposed on the first anisotropic conductive substrate 30, and the second magnet 35b is disposed at a position facing the first magnet 25b (see FIG. 14).
- the first magnet 25 and the second magnet 35 facing each other face each other with different magnetic poles, and the magnetic poles of the adjacent first magnets 25 in the membrane substrate 20 are reversed.
- the adjacent second magnets 35 are also arranged on the first anisotropic conductive substrate 30 so that the magnetic poles are reversed from each other.
- FIG. 7 is a plan view and a bottom view showing the layout of the third magnet in the pitch conversion board of the probe according to the present embodiment.
- the left figure is a plan view of the pitch conversion board 40 as viewed from above (from the top to the bottom on the paper surface of FIG. 2), and the right figure is a view of the pitch conversion board 40 below.
- FIG. 3 is a bottom view seen from above (viewed from bottom to top on the paper surface of FIG. 2).
- the pitch conversion substrate 40 is a substantially circular plate-like substrate smaller than the membrane substrate 20, and is made of, for example, a ceramic substrate, a silicon nitride substrate, a substrate woven with aramid fibers, a core material in which aramid fibers are impregnated with a resin, or 42 alloy. It is a rigid substrate such as a substrate in which polyimide is laminated on a core material to be formed.
- the first terminal 41 is formed on the lower surface of the pitch conversion substrate 40 (the surface facing the first anisotropic conductive substrate 30) so as to correspond to the first anisotropic conductive rubber 31. Is provided.
- a second terminal 42 is provided on the upper surface of the pitch conversion substrate 40 (the surface facing the second anisotropic conductive substrate 50) so as to correspond to a second anisotropic conductive rubber 51 (described later). Is provided.
- These terminals 41 and 42 are electrically connected via wiring 43 provided on the pitch conversion board 40, and the pitch between the second terminals 42 is larger than the pitch between the first terminals 41. It has become.
- the third magnet 45 is a permanent magnet similar to the first and second magnets 25 and 35, and is fitted into a through hole 40 a formed in the pitch conversion board 40.
- the third magnets 45 are arranged at substantially equal intervals along the circumferential direction on the outer peripheral portion of the pitch conversion substrate 40 so as to face the second magnets 35 of the first anisotropic conductive substrate 30. Has been. In the present embodiment, positioning of the first anisotropic conductive substrate 40 and the pitch conversion substrate 40 is facilitated by using the second magnet 35 and the third magnet 45.
- the third magnets 45 adjacent to each other change the pitch so that different magnetic poles are directed in the same direction. It is provided on the substrate 40. Specifically, as shown in FIG. 7, a third magnet 45a with the N pole facing upward and the S pole facing downward, and the third magnet 45a with the S pole facing upward and the N pole facing downward. Magnets 45b are alternately arranged.
- the third magnet is located at a position facing the second magnet 35a on the pitch conversion board 40 so that the second magnet 35 and the third magnet 45 attract each other when the probe 10 is assembled.
- 45a is disposed
- the third magnet 45b is disposed at a position facing the second magnet 35b on the pitch conversion board 40 (see FIG. 14).
- the second magnetic pole 35 and the third magnetic pole 45 facing each other face each other with different magnetic poles, and the adjacent second magnet 35 on the first anisotropic conductive substrate 30 is replaced with the magnetic pole.
- the adjacent third magnets 45 are also arranged on the pitch conversion substrate 40 so that the magnetic poles are reversed with respect to each other.
- the repulsive force generated between the third magnet 45a (45b) and the fourth magnet 55b (55a) adjacent to the fourth magnet 55a (55b) facing the third magnet 45a (45b) The repulsive force generated between the fourth magnet 55a (55b) facing the third magnet 45a (45b) and the third magnet 45b (45a) adjacent to the third magnet 45a,
- the positioning accuracy of the one anisotropic conductive substrate 30 and the pitch conversion substrate 40 is further improved.
- FIG. 8 is a plan view and a bottom view showing the layout of the fourth magnet in the second anisotropic conductive substrate of the probe according to the present embodiment.
- the left figure is a plan view of the second anisotropic conductive substrate 50 as viewed from above (from the top to the bottom on the paper surface of FIG. 2), and the right figure is the first figure.
- FIG. 3 is a bottom view of two anisotropic conductive substrates 50 as viewed from below (from the bottom to the top on the paper surface of FIG. 2).
- the second anisotropic conductive substrate 50 is a substantially circular plate-shaped substrate smaller than the membrane substrate 20, and as shown in FIG. 3, the particle dispersion portion 52 is the same as the first anisotropic conductive substrate 30. And a second anisotropic conductive rubber 51 composed of the insulating portion 53 and a second frame 54 that holds the second anisotropic conductive rubber 51.
- the second anisotropic conductive rubber 51 has the same configuration as the first anisotropic conductive rubber 31 described above, and is disposed so as to correspond to the first terminal 41 of the pitch conversion board 40.
- the same materials as those listed for the first frame 34 can be used, but those having a larger thermal expansion coefficient than the material constituting the first frame 34. Is preferred.
- the second anisotropic conductive substrate 50 of the present embodiment has a large number (24 in this example) of fourth magnets 55 as shown in FIGS.
- the fourth magnet 55 is a permanent magnet similar to the first to third magnets 25 to 45, and is fitted into a through hole 54a formed in the second frame 54.
- the fourth magnets 55 are arranged at substantially equal intervals along the circumferential direction on the outer peripheral portion of the second anisotropic conductive substrate 50 so as to face the third magnet 45 of the pitch conversion substrate 40.
- the third magnet 45 and the fourth magnet 55 are used to facilitate positioning of the pitch conversion substrate 40 and the second anisotropic conductive substrate 50.
- the adjacent fourth magnets 55 are provided such that different magnetic poles face the same direction. Specifically, as shown in FIG. 8, a fourth magnet 55a with the N pole facing upward and the S pole facing downward, and the fourth magnet 55a with the S pole facing upward and the N pole facing downward. Magnets 55b are alternately arranged.
- the fourth magnet 55b is disposed at a position opposite to the third magnet 45b on the second anisotropic conductive substrate 50 (see FIG. 14).
- the third magnet 45 and the fourth magnet 55 facing each other face each other with different magnetic poles, and the magnetic poles of the adjacent third magnets 45 on the pitch conversion substrate 40 are reversed.
- the adjacent fourth magnets 55 are arranged so that the magnetic poles are reversed from each other.
- FIG. 9 is a bottom view showing the layout of the fifth magnet in the performance board of the probe according to the present embodiment, as seen from the bottom (viewed from bottom to top on the paper surface of FIG. 2).
- FIG. 9 is a bottom view showing the layout of the fifth magnet in the performance board of the probe according to the present embodiment, as seen from the bottom (viewed from bottom to top on the paper surface of FIG. 2).
- the performance board 60 is a substantially rectangular plate-like substrate as a whole, and is a rigid substrate made of a synthetic resin material such as glass epoxy resin. As shown in FIG. 3, the third terminal 61 is disposed on the lower surface of the performance board 60 (the surface facing the second anisotropic conductive substrate 50) so as to correspond to the second terminal 42. .
- the third terminal 61 is formed by performing a copper plating process, printing a copper paste, etching a copper foil, or the like.
- the performance board 60 is electrically connected to a pin electronics card housed in the test head 2 via a connector or a cable, although not particularly shown.
- the performance board 60 of the present embodiment has a large number (24 in this example) of fifth magnets 65 as shown in FIGS.
- the fifth magnet 65 is a permanent magnet similar to the first to fourth magnets 25 to 55, and is fitted into an insertion hole 60a formed in the performance board 60.
- the fifth magnets 65 are arranged at substantially equal intervals along the circumferential direction on the outer peripheral portion of the performance board 60 so as to face the fourth magnets 55 of the second anisotropic conductive substrate 50. Yes.
- the second anisotropic conductive substrate 50 and the performance board 60 are easily positioned by using the fourth magnet 55 and the fifth magnet 65.
- the adjacent fifth magnets 65 are provided such that different magnetic poles face the same direction. Specifically, as shown in FIG. 9, fifth magnets 65a with the south pole facing downward and fifth magnets 65b with the north pole facing downward are alternately arranged.
- the fifth magnet 65a is positioned on the performance board 60 at a position facing the fourth magnet 55a so that the fourth magnet 55 and the fifth magnet 65 attract each other when the probe 10 is assembled. Is arranged, and a fifth magnet 65b is arranged at a position facing the fourth magnet 55b on the performance board 60 (see FIG. 14).
- the fourth magnet 55 and the fifth magnet 65 facing each other face each other with different magnetic poles, and the adjacent fourth magnet 55 on the second anisotropic conductive substrate 50 is changed to the magnetic pole.
- the adjacent fifth magnets 65 are arranged so that the magnetic poles are reversed with respect to each other.
- the repulsive force generated between the fourth magnet 55a (55b) and the fifth magnet 65b (65a) adjacent to the fifth magnet 65a (65b) facing the fourth magnet 55a (55b) is utilized.
- the positioning accuracy between the second anisotropic conductive substrate 50 and the performance board 60 is improved.
- an annular first sealing member 70 is provided so as to cover the space between the peripheral edge of the upper surface of the membrane substrate 20 and the lower surface of the performance board 60.
- the first sealing member 70 is made of a material that can be elastically deformed and has excellent sealing properties, such as silicone rubber, for example, and includes the first anisotropic conductive substrate 30, the pitch conversion substrate 40, and the second.
- the anisotropic conductive substrate 50 is wrapped.
- the probe 10 having the above configuration is electrically connected to the test head 2 via a connector and a cable (both not shown) as shown in FIG.
- the wafer tray 3 holding the wafer 100 to be tested by suction is located below the probe 10.
- the wafer tray 3 can be moved in the XYZ directions by a moving device (not shown) and can be rotated around the Z axis.
- the held semiconductor wafer 100 can be moved to a position facing the probe 10. It is possible.
- a second sealing member 3 a is provided on the entire periphery of the peripheral portion of the wafer tray 3.
- the second sealing member 3a is made of a material that can be elastically deformed, such as silicone rubber, and has excellent sealing properties.
- the wafer tray 3 approaches the probe 10 and the second sealing member 3a becomes the membrane substrate. 20, the wafer tray 4, the sealing members 70, 3 a, the membrane substrate 20, and the performance board 60, the sealed space 80 (see FIG. 10) is formed.
- the space defined by the first sealing member 70 and the space defined by the second sealing member 3a are through holes 21b, 34b, 40b, 54b (see FIG. 3) formed in the probe 10. Communicated through.
- a communication path 3b is formed inside the wafer tray 3 with one end opening in the sealed space 80 and the other end opening in the side surface of the wafer tray 3.
- the other end of the communication path 3b Is connected to a decompression device 4 via a pipe 3c.
- FIG. 10 is a schematic side view showing a state in which the semiconductor wafer test apparatus in this embodiment is testing an IC device
- FIG. 11 is an enlarged cross-sectional view of a portion XI in FIG.
- the decompression device 4 decompresses the inside of the sealed space 80 with the wafer tray 3 facing the probe 10 and the second sealing member 3a in close contact with the lower surface of the membrane substrate 20, the first The sealing member 70 is deformed to compress the anisotropic conductive rubbers 31 and 51 of the first and second anisotropic conductive substrates 30 and 50, respectively, and the bumps 22 of the membrane substrate 20 become the first anisotropic conductive members. Conduction is conducted to the third terminal 61 of the performance board 60 through the substrate 30, the pitch conversion substrate 40, and the second anisotropic conductive substrate 50.
- the second sealing member 3a is deformed by the decompression of the sealed space 80 by the decompression device 4, and the wafer tray 3 and the probe 10 are further brought closer to each other, as shown in FIG. 22 contacts the electrode 110 on the wafer under test 100.
- the tester inputs / outputs a test signal to / from the IC device via the test head 2 to execute the IC device test.
- the pressure in the sealed space 80 is reduced by the decompression device 4 so that the pressure in the sealed space 80 is about ⁇ 10 [kPa] to ⁇ 100 [kPa] compared to the atmospheric pressure. The pressure is reduced.
- FIG. 12 is a flowchart showing a method of manufacturing a probe in the present embodiment
- FIG. 13 is a diagram showing a method of magnetizing a magnetic material embedded in a substrate in the present embodiment
- FIG. 14 is an exploded perspective view of the probe in the present embodiment. is there.
- the non-magnetized magnetic body 12 is inserted into each of the plurality of insertion holes 11a formed in the substrate 11 (see FIG. 13).
- the material constituting the magnetic body 12 include ferromagnetic materials such as iron, nickel, and cobalt, alloys including ferromagnetic materials, materials including oxides such as ferrite, and materials including rare earth such as neodymium. can do.
- substrate 11 is the concept containing all the board
- the substrate 11 in the present embodiment corresponds to an example of the substrate in the present invention.
- the insertion hole 11a is a concept including insertion holes 21a, 34a, 40a, 54a, 60a formed in the substrates 10 to 60, respectively.
- the insertion holes 21a, 34a, 40a, 54a, 60a of the substrates 20 to 60 are formed in the outer peripheral portion of the substrates 20 to 60 at substantially equal intervals along the circumferential direction.
- the magnetizing circuit 90 includes a pair of electromagnets 91 and 92, a power supply 93 that supplies power to the electromagnets 91 and 92, and power supply from the power supply 93 to the electromagnets 91 and 92 on / off.
- four switches 94 to 97 for reversing the magnetic poles of the electromagnets 91 and 92 are provided.
- the magnetism device 90 is used to magnetize the magnetic body 12 embedded in the substrate 11 as follows.
- the substrate 11 is interposed between the pair of electromagnets 91 and 92, and the magnetic body 12 is positioned between the electromagnets 91 and 92.
- the first and second switches 94 and 95 are turned on. Thereby, a magnetic field is generated between the electromagnets 91 and 92, and the magnetic body 12 is magnetized.
- the substrate 11 is rotated by a predetermined amount, and the adjacent magnetic body 12 is positioned between the electromagnets 91 and 92.
- the third and fourth switches 96 and 97 are turned on. As a result, a magnetic field in the opposite direction is generated between the electromagnets 91 and 92, and the magnetic body 12 is magnetized.
- the substrate 11 is rotated by a predetermined amount, and the adjacent magnetic body 12 is positioned between the electromagnets 91 and 92.
- the first and second switches 94 and 95 are turned on. As a result, a magnetic field in the opposite direction to the previous direction is generated between the electromagnets 91 and 92, and the magnetic body 12 is magnetized.
- the substrates 20 to 60 are stacked as shown in step S30 of FIG. At this time, as shown in FIG. 14, since the first and second magnets 25 and 35 attract each other, the membrane substrate 20 and the first anisotropic conductive substrate 30 are positioned with high accuracy almost automatically.
- the first anisotropic conductive substrate 30 and the pitch conversion substrate 40 are positioned by the second and third magnets 35, 45, and the pitch conversion substrate 40 is positioned by the third and fourth magnets 45, 55.
- the second anisotropic conductive substrate 50 are positioned, and the second anisotropic conductive substrate 50 and the performance board 60 are positioned by the fourth and fifth magnets 55 and 65.
- the substrates 20 to 60 when the substrates 20 to 60 are stacked, the substrates 20 to 60 can be automatically positioned by the magnets 25 to 65, so that the assembly workability of the probe 10 is improved. be able to.
- the number of magnets 25 to 65 provided on the substrates 20 to 60 is not limited. However, as the number of the magnets 25 to 65 increases, the influence of the placement accuracy of the magnets 25 to 65 on the positioning accuracy of the substrates 20 to 60 becomes smaller. can do.
- the magnetic body 12 since the magnetic body 12 is magnetized after the magnetic body 12 is attached to the substrate 11, the magnetic body 12 can be attached to the substrate 11 without worrying about the magnetic pole of the magnet. Productivity is further improved.
- the magnets 25 to 65 are provided on all the substrates 20 to 60.
- the present invention is not particularly limited to this. Positioning may be performed in the same manner as in the past.
- the first to fifth magnets 25 to 65 are all configured by permanent magnets, but are not particularly limited.
- the first to fifth magnets 25 to 65 may be composed of electromagnets.
- the magnets of some substrates may be configured by electromagnets, and the magnets of other substrates may be permanent magnets.
- some magnets may be formed of permanent magnets on the same substrate, and other magnets may be formed of electromagnets (that is, permanent magnets and electromagnets may be mixed on a single substrate).
- the arrangement of the magnets 25 to 65 on the substrates 20 to 60 is not particularly limited to the circular annular arrangement as long as the different magnetic poles are arranged on the adjacent substrates 20 to 60 so as to face the same direction.
- the magnets may be arranged in a polygonal annular shape, the magnets may be arranged in a multiple annular shape, or the magnets may be arranged in a lattice shape.
- the layer structure of the probe 10 is not particularly limited to this.
- a four-layer structure including the membrane substrate 20, the first anisotropic conductive substrate 30, the pitch conversion substrate 40, and the performance board 60B may be used.
- a conical spring coil 66 (spiral contact) is connected to the third terminal 61 of the performance board 60B. Is fixed.
- the membrane substrate 20, the first anisotropic conductive substrate 30, the pitch conversion substrate 40, and the performance board 60B correspond to an example of the substrate in the present invention.
- the membrane substrate 20 and the pitch conversion substrate 40 in the present embodiment correspond to an example of the first substrate in the present invention
- the first anisotropic conductive substrate 30 and the performance board 60 in the present embodiment are the present invention.
- the bump 22 is exemplified as the contactor (contactor) that contacts the electrode 110 of the semiconductor wafer 100.
- the present invention is not particularly limited thereto.
- a cantilever type probe needle or pogo pin may be used as the contact.
- the insertion hole is formed in the substrate 11 and the magnetic body 12 is embedded in the insertion hole.
- the present invention is not particularly limited to this.
- the magnetic body 12 may be provided on the upper surface 11 a of the substrate 11 and another magnetic body 12 may be provided on the lower surface 11 b of the substrate 11.
- the magnetic body 12 is magnetized using the electromagnets 91 and 92.
- the present invention is not limited to this, and the magnetic body 12 may be magnetized using a permanent magnet.
- the plurality of magnetic bodies 12 are sequentially magnetized by the pair of electromagnets 91 and 92 by rotating the substrate 11. These magnetic bodies 12 may be magnetized simultaneously.
- the direction of the lines of magnetic force generated between the electromagnets 91 and 92 is switched by switching the four switches 95 to 97.
- the present invention is not limited to this.
- the polarity of the power supply 93 itself may be changed.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
2…テストヘッド
3…ウェハトレイ
4…減圧装置
10…プローブ
11…基板
12…磁性体
20…メンブレン基板
25,25a,25b…第1の磁石
30…第1の異方導電性基板
35,35a,35b…第2の磁石
40…ピッチ変換基板
45,45a,45b…第3の磁石
50…第2の異方導電性基板
55,55a,55b…第4の磁石
60…パフォーマンスボード
65,65a,65b…第5の磁石
90…磁化回路
100…半導体ウェハ
Claims (16)
- 被試験電子部品との電気的な接続を確立するためのプローブであって、
複数の磁石をそれぞれ有する複数の基板を備え、
複数の前記基板は、
第1の基板と、
前記第1の基板に積層された第2の基板と、を含み、
複数の前記磁石は、
前記第1の基板に設けられた複数の第1の磁石と、
前記第2の基板に設けられ、複数の前記第1の磁石にそれぞれ対向するように配置された第2の磁石と、を含んでおり、
相互に対向する前記第1の磁石と前記第2の磁石は、互いに異なる磁極が向かい合うように設けられていることを特徴とするプローブ。 - 請求項1に記載のプローブであって、
前記第1の基板は、
接触子と前記接触子を保持する絶縁性シートとを有するメンブレン基板、又は、
第1の絶縁性基材と前記第1の絶縁性基材上に形成された第1の端子とを有する第1の配線基板、であり、
前記第2の基板は、
異方導電性弾性体と前記異方導電性弾性体を保持するフレームとを有する異方導電性基板、又は、
第2の絶縁性基材と前記第2の絶縁性基材上に形成された第2の端子とを有する第2の配線基板であることを特徴とするプローブ。 - 請求項1又は2に記載のプローブであって、
前記磁石は、永久磁石であることを特徴とするプローブ。 - 請求項1~3の何れかに記載のプローブであって、
前記磁石は、前記基板に形成された貫通孔に挿入されていることを特徴とするプローブ。 - 請求項1~4の何れかに記載のプローブであって、
隣り合う前記磁石は、互いに異なる磁極が同一方向を向くように設けられていることを特徴とするプローブ。 - 請求項1~5の何れかに記載のプローブであって、
複数の前記磁石は、前記基板において環状に並んで配置されていることを特徴とするプローブ。 - 請求項6に記載のプローブであって、
前記磁石は、前記基板に取り付けられた磁性体を磁化してなる磁石であることを特徴とするプローブ。 - 被試験電子部品の試験を行う電子部品試験装置であって、
請求項1~7の何れかに記載のプローブと、
前記プローブと電気的に接続されたテストヘッドと、
前記被試験電子部品と前記プローブとの間に形成された密閉空間を減圧することで、前記被試験電子部品と前記プローブとを電気的に接触させる減圧手段と、を備えたことを特徴とする電子部品試験装置。 - 被試験電子部品との電気的な接続を確立するためのプローブに用いられる基板であって、複数の磁石を備えており、隣り合う前記磁石は、互いに異なる磁極が同一方向を向くように設けられていることを特徴とする基板。
- 請求項1に記載のプローブの製造方法であって、
前記第1の磁石と前記第2の磁石を相互に対向させることで、前記第1の基板と前記第2の基板とを互いに位置決めして、前記第1及び前記第2の基板同士を積層する積層工程を備えたことを特徴とするプローブの製造方法。 - 請求項10に記載のプローブの製造方法であって、
前記基板に磁性体を取り付ける取付工程と、
前記基板に取り付けられた前記磁性体を磁化させることで、前記磁石を形成する磁化工程と、を備えたことを特徴とするプローブの製造方法。 - 請求項11に記載のプローブの製造方法であって、
前記取付工程において、前記基板に形成された貫通孔に前記磁性体を挿入することを特徴とするプローブの製造方法。 - 請求項10又は11に記載のプローブの製造方法であって、
前記磁化工程において、相互に隣り合う前記磁性体を、互いに異なる磁極が同一方向を向くように磁化することを特徴とするプローブの製造方法。 - 請求項13に記載のプローブの製造方法であって、
前記取付工程において、複数の前記磁性体を前記基板に環状に並べて配置することを特徴とするプローブの製造方法。 - 請求項10又は11に記載のプローブの製造方法であって、
前記取付工程において、複数の前記磁性体を前記基板に環状に並べて配置し、
前記磁化工程において、前記基板を回転させることで、複数の前記磁性体を順次磁化することを特徴とするプローブの製造方法。 - 請求項10~15の何れかに記載のプローブの製造方法であって、
前記第1の基板は、
接触子と前記接触子を保持する絶縁性シートとを有するメンブレン基板、又は、
第1の絶縁性基材と前記第1の絶縁性基材上に形成された第1の端子とを有する第1の配線基板であり、
前記第2の基板は、
異方導電性弾性体と前記異方導電性弾性体を保持するフレームとを有する異方導電性基板、又は、
第2の絶縁性基材と前記第2の絶縁性基材上に形成された第2の端子とを有する第2の配線基板であることを特徴とするプローブの製造方法。
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US13/124,030 US8779791B2 (en) | 2010-04-07 | 2010-04-07 | Method of manufacturing probe having boards connected by magnets |
JP2011507729A JP5557836B2 (ja) | 2010-04-07 | 2010-04-07 | プローブ及びその製造方法 |
PCT/JP2010/056322 WO2011125191A1 (ja) | 2010-04-07 | 2010-04-07 | プローブ及びその製造方法 |
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US11733269B2 (en) * | 2020-02-19 | 2023-08-22 | SK Hynix Inc. | Semiconductor fabricating apparatus including a probe station |
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JP2008042028A (ja) * | 2006-08-08 | 2008-02-21 | Advantest Corp | 配線基板 |
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JP4018313B2 (ja) | 2000-03-01 | 2007-12-05 | Ntn株式会社 | 磁気エンコーダの製造方法 |
JP3631451B2 (ja) * | 2001-02-05 | 2005-03-23 | 松下電器産業株式会社 | 半導体集積回路の検査装置および検査方法 |
US6684483B2 (en) | 2001-09-14 | 2004-02-03 | General Motors Corporation | Method of fabricating a rotor for an electric traction motor |
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