WO2011122438A1 - Module d'entraînement, dispositif électronique et procédé de commande de module d'entraînement - Google Patents

Module d'entraînement, dispositif électronique et procédé de commande de module d'entraînement Download PDF

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Publication number
WO2011122438A1
WO2011122438A1 PCT/JP2011/057165 JP2011057165W WO2011122438A1 WO 2011122438 A1 WO2011122438 A1 WO 2011122438A1 JP 2011057165 W JP2011057165 W JP 2011057165W WO 2011122438 A1 WO2011122438 A1 WO 2011122438A1
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WO
WIPO (PCT)
Prior art keywords
memory alloy
shape memory
temperature
lens frame
alloy body
Prior art date
Application number
PCT/JP2011/057165
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English (en)
Japanese (ja)
Inventor
彩子 野邉
哲也 野邉
Original Assignee
セイコーインスツル株式会社
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Filing date
Publication date
Application filed by セイコーインスツル株式会社 filed Critical セイコーインスツル株式会社
Publication of WO2011122438A1 publication Critical patent/WO2011122438A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/065—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like using a shape memory element
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32—Means for focusing
    • G03B13/34—Power focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10—Power-operated focusing

Definitions

  • the present invention relates to a drive module, an electronic device, and a drive module control method for performing autofocus for automatically focusing by driving a lens frame that holds a lens.
  • an imaging apparatus having a lens such as a camera
  • Many imaging apparatuses having an autofocus function for automatically performing (focus) are provided.
  • the drive module includes a support, a lens frame that can reciprocate along a certain direction with respect to the support, a spring member that elastically holds the lens frame, and a lens frame that resists the restoring force of the spring member.
  • Driving means for driving in this manner includes a rotatable arm portion engaged with the lens frame, and a shape memory alloy wire wound around the arm portion and fixed at both ends.
  • the shape memory alloy wire when the shape memory alloy wire is energized, the shape memory alloy wire is contracted and deformed by the heat generated by the energization.
  • the shape memory alloy wire contracts and deforms, the arm portion rotates, the lens frame is pressed by the arm portion, and the lens frame moves to one side along a certain direction.
  • the temperature of the shape memory alloy wire is lowered and the shape memory alloy wire is stretched and deformed.
  • the shape memory alloy wire expands and deforms, the arm portion rotates in the return direction, and the lens frame moves to the other side along a certain direction by the biasing force of the spring member.
  • the lens frame can be moved to the in-focus position by controlling energization to the shape memory alloy wire while monitoring the temperature of the shape memory alloy wire based on the electric resistance value of the shape memory alloy wire.
  • the above-described conventional driving module is operated as shown in FIGS. 13A and 13B, for example. That is, first, by energizing the shape memory alloy wire to gradually increase the temperature of the shape memory alloy wire, the shape memory alloy wire is gradually contracted and deformed to move the lens frame over the entire movement range. At this time, the focal point where the harmonic component becomes the largest is searched. Subsequently, the shape memory alloy wire is stretched and deformed by lowering the temperature of the shape memory alloy wire to the above-described focus temperature. As a result, the lens frame moves to the in-focus position, and the lens is focused.
  • the shape memory alloy wire is energized to shrink and deform the shape memory alloy wire to near the limit. Subsequently, by gradually lowering the temperature of the shape memory alloy wire, the shape memory alloy wire is gradually extended and deformed to move the lens frame over the entire movement range. At this time, the focal point where the harmonic component becomes the largest is searched. Subsequently, the shape memory alloy wire is shrunk and deformed by raising the temperature of the shape memory alloy wire to the temperature of the focal point. As a result, the lens frame moves to the in-focus position, and the lens is focused.
  • the electric resistance value of the shape memory alloy described above changes with a curve as shown in FIG. 15 with respect to the temperature change. More specifically, as the temperature rises from the initial temperature T 0 , the electrical resistance value gradually rises. Then, when the deformation of the shape memory alloy is started (temperature T 1 ), the electric resistance value starts to decrease and gradually decreases, the deformation of the shape memory alloy reaches the limit, and the deformation of the shape memory alloy is settled. At the time (temperature T 2 ), the electric resistance value starts to increase again and gradually increases. That is, the electric resistance value R max when the deformation of the shape memory alloy is started becomes the maximum value, and the electric resistance value R min when the deformation of the shape memory alloy is stopped becomes the minimum value.
  • the shape memory alloy wire is energized to contract and deform the shape memory alloy wire to the limit. Thereby, the maximum electric resistance value R max and the minimum electric resistance value R min are detected, and the operable range by the drive module is detected.
  • the shape memory alloy wire described above expands and contracts due to a temperature change, when the environmental temperature is high, it takes time for cooling, the convergence time when the shape memory alloy wire is deformed in the extension direction becomes long, and the environmental temperature is low. In this case, heating takes time, and the convergence time when the shape memory alloy wire is deformed in the shrinking direction becomes long. Therefore, in the above-described conventional technology, there is a problem that the operation time of autofocus may become long depending on the environmental temperature. Specifically, for example, when the drive module is operated as shown in FIGS. 13A and 13B, the lens frame is aligned by lowering the temperature of the shape memory alloy wire after the focus search as described above. Move to the focal position. Therefore, when the environmental temperature is low, as shown in FIG.
  • the temperature of the shape memory alloy wire decreases to the temperature of the in-focus position in a short time, and the autofocus operation time becomes relatively short.
  • the environmental temperature is high, as shown in FIG. 13 (b), it takes time to lower the temperature of the shape memory alloy wire to the temperature of the in-focus position, and the operation time of the autofocus is correspondingly increased. Becomes longer.
  • the lens frame is moved to the in-focus position by increasing the temperature of the shape memory alloy wire after searching for the focus as described above.
  • the environmental temperature is high, as shown in FIG. 14B, the temperature of the shape memory alloy wire rises to the temperature of the in-focus position in a short time, and the operation time of the autofocus is relatively short.
  • the environmental temperature is low, as shown in FIG. 14 (a), it takes time to raise the temperature of the shape memory alloy wire to the temperature of the in-focus position, and the operation time of the autofocus is correspondingly increased. Becomes longer.
  • the present invention has been made in consideration of the above-described conventional problems, and provides a drive module, an electronic apparatus, and a drive module control method capable of preventing an autofocus operation time from being increased due to an environmental temperature. It is an object.
  • the drive module according to the present invention is provided with a support, a lens frame that is reciprocally movable along a fixed direction with respect to the support and holds a lens, and a spring member that elastically holds the lens frame. And having a shape memory alloy body that can be deformed by heat generated by energization, and energizing the shape memory alloy body to deform the shape memory alloy body to drive the lens frame against the restoring force of the spring member A drive module, and a control means for controlling the drive means by controlling energization to the shape memory alloy body, wherein a drive mode of the drive module is used for the shape memory alloy body.
  • the environmental temperature is detected, the first driving mode is selected when the detected environmental temperature is lower than the threshold temperature, and the second driving mode is selected when the environmental temperature is higher than the threshold temperature.
  • the drive means is driven by controlling energization to the shape memory alloy body.
  • a drive module includes a support, a lens frame that is reciprocally movable along a fixed direction with respect to the support and holds a lens, and a spring that elastically holds the lens frame. And a shape memory alloy body that can be deformed by heat generated by energization, and the shape memory alloy body is energized to deform the shape memory alloy body to resist the restoring force of the spring member.
  • Drive module and a control module that controls the drive module by controlling energization to the shape memory alloy body, wherein the shape memory alloy body is used as a drive mode of the drive module.
  • the shape memory alloy body is energized to lower the temperature of the shape memory alloy body to move the lens frame to investigate the focal point, and after the focal point is detected, the shape memory alloy is obtained by a hill climbing method.
  • a first driving mode in which the position of the lens frame is finely adjusted while moving the temperature up and down to move the lens frame to the in-focus position, and the temperature of the shape memory alloy body by energizing the shape memory alloy body
  • the lens frame is moved by moving the lens frame to explore the focal point, and after the focal point is detected, the position of the lens frame is finely adjusted by raising and lowering the temperature of the shape memory alloy body by a hill climbing method.
  • a second driving mode for moving the lens frame to the in-focus position and the control means detects the environmental temperature, and the first driving mode when the detected environmental temperature is lower than the threshold temperature. And selecting the second drive mode when the environmental temperature is higher than the threshold temperature, and controlling the energization to the shape memory alloy body according to the selected drive mode to drive the drive means. Moyo .
  • the drive mode is selected according to the environmental temperature, the drive means is driven according to the drive mode, and the lens frame moves to the in-focus position and is focused.
  • the time (deformation convergence time) until the shape memory alloy body is stretched and deformed to a desired shape after energizing or stopping energization does not become longer due to the influence of the environmental temperature.
  • the drive means when the environmental temperature is low, the drive means is driven in the first drive mode in which the temperature of the shape memory alloy body is lowered. At this time, since the environmental temperature is low and the temperature of the shape memory alloy body is likely to decrease, the shape memory alloy body expands and deforms to a desired shape in a short time after the power supply to the shape memory alloy body is stopped.
  • the drive means is driven in the second drive mode in which the temperature of the shape memory alloy body is increased.
  • the shape memory alloy body shrinks and deforms into a desired shape in a short time after the shape memory alloy body is energized. Therefore, the lens frame moves to the in-focus position in a short time and is immediately focused.
  • the control means includes a graph of a function of the environmental temperature at the time of temperature rise of the shape memory alloy body and the deformation convergence time of the shape memory alloy body, and the shape memory alloy body. It is preferable that the temperature at the intersection of the environmental temperature during the temperature drop and the graph of the function of the deformation convergence time of the shape memory alloy body is the threshold temperature. As a result, a time-efficient drive mode is surely selected, so that the time for the lens frame to move to the in-focus position is reliably prevented.
  • an electronic apparatus is characterized by including the drive module described above.
  • the drive module control method includes a support, a lens frame that is reciprocally movable along a fixed direction with respect to the support, and a lens frame that holds the lens, and the lens frame is elastic.
  • the shape memory alloy body In the drive mode of the drive module, the shape memory alloy body is energized and the temperature of the shape memory alloy body is gradually increased to move the lens frame over the entire movement range.
  • the drive module control method includes a support, a lens frame that is reciprocally movable along a fixed direction with respect to the support, and a lens frame that holds the lens, and the lens frame is elastic.
  • the drive mode of the drive module is to search the focal point by moving the lens frame by energizing the shape memory alloy body and lowering the temperature of the shape memory alloy body.
  • the lens frame is moved to search for the focal point, and after the focal point is detected, the shape memory alloy body is obtained by a hill climbing method.
  • a second drive mode for finely adjusting the position of the lens frame while moving the temperature up and down to move the lens frame to the in-focus position, and a temperature detection step for detecting an environmental temperature A mode selection step of selecting the first drive mode when the environmental temperature detected in the detection step is lower than a threshold temperature and selecting the second drive mode when the environmental temperature is higher than the threshold temperature; A driving step of driving said drive means to control the energization of the shape memory alloy member in accordance with the selected driving mode over mode selection step, it may be provided with a.
  • the deformation convergence time of the shape memory alloy body does not become long due to the influence of the environmental temperature, and the lens frame moves to the in-focus position in a short time and is immediately focused.
  • the drive mode according to the environmental temperature is selected, and the lens frame is moved to the in-focus position in a short time, so that the focus is immediately adjusted. It is possible to prevent the autofocus operation time from becoming longer due to the environmental temperature.
  • FIG. 5 is a cross-sectional view taken along line AA in FIG. 4.
  • a symbol M in the figure is a virtual axis line of the drive module 1 that coincides with the optical axis of the lens 50 shown in FIG. 5, and indicates the drive direction of the lens frame 4 described later.
  • the position and direction may be referred to based on the positional relationship with the axis M at the time of assembly.
  • the direction along the axis M is simply referred to as “axial direction”, and the direction perpendicular to the axis M is simply “radial direction”.
  • the direction around the axis M may be simply referred to as “circumferential direction”.
  • a control board 32 side to be described later in the axial direction is referred to as “downward”, and the opposite side is referred to as “upward”.
  • the drive module 1 of the present embodiment is a drive module for reciprocating the lens 12 (lens unit 12) shown in FIG. 5 along the axial direction, and is mounted on an electronic device or the like. It is what is done.
  • the drive module 1 is disposed so as to cover the drive unit 31, a control board 32 serving as control means, an adapter 30 positioned on the control board 32, a drive unit 31 disposed on the adapter 30. And a cover 11.
  • the drive unit 31 includes a lens frame 4 as a driven body, a module frame 5 as a support, an upper leaf spring 6 and a lower leaf spring 7 as spring members, a module lower plate 8, and a power feeding member. 9, and a shape memory alloy (Shape Memory Alloy, hereinafter abbreviated as SMA) wire 10 which is a shape memory alloy body, which is a main constituent member. Configure the actuator.
  • SMA Shape Memory Alloy
  • the lens frame 4 described above is inserted inside the module frame 5 so as to be movable in the axial direction, and an upper leaf spring 6 is arranged at the upper ends of the lens frame 4 and the module frame 5.
  • the lower plate spring 7 is disposed at the lower ends of the lens frame 4 and the module frame 5, and the lens frame 4 and the module frame 5 are sandwiched between the upper plate spring 6 and the lower plate spring 7. Yes.
  • the upper leaf spring 6 is fixed to the upper ends of the lens frame 4 and the module frame 5 by caulking.
  • a module lower plate 8 is stacked below the lower plate spring 7, and a power supply member 9 is stacked below the module lower plate 8.
  • the lower plate spring 7, the module lower plate 8, and the power supply are stacked.
  • the members 9 are fixed to the lower end of the module frame 5 by caulking, and the lower leaf spring 7 is fixed to the lower end of the lens frame 4 by caulking.
  • the cover 11 is placed and fixed on the upper surface of the module lower plate 8.
  • the lens frame 4 described above is a substantially cylindrical tubular member extending along the axial direction with the axis M as the central axis, and as shown in FIG. A female screw is formed on the inner peripheral surface 4F of the portion 4A.
  • the lens unit 12 is screwed onto the inner peripheral surface 4F of the housing portion 4A, whereby the lens unit 12 is held by the lens frame 4.
  • the lens unit 12 includes a cylindrical tube portion 51 having a male screw formed on the outer peripheral surface, and a lens 50 fitted inside the tube portion 51.
  • a protruding portion 4C (convex portion) that protrudes radially outward with an interval of approximately 90 degrees in the circumferential direction extends in the axial direction.
  • An upper fixing pin 13A and a lower fixing pin 13B are erected on the upper end surface 4a and the lower end surface 4b of the portion 4C, respectively.
  • the upper fixing pin 13 ⁇ / b> A holds the upper leaf spring 6, and the lower fixing pin 13 ⁇ / b> B holds the lower leaf spring 7.
  • the insertion positions of the upper fixing pin 13A and the lower fixing pin 13B in the upper leaf spring 6 and the lower leaf spring 7 are standardized.
  • the positions of the upper fixing pin 13A and the lower fixing pin 13B in plan view may be different.
  • the upper fixing pin 13A is attached to each upper end surface 4a of the two protruding portions 4C out of the four protruding portions 4C.
  • the lower fixing pins 13B may be erected on the upper end surfaces 4a of the remaining two protrusions 4C.
  • the lens frame 4 is provided with a guide protrusion 4D on which the SMA wire 10 can be hung.
  • the guide projection 4D is integrally joined to the outer peripheral surface of the lower end of one of the plurality of protrusions 4C, and a distal end key portion (locking portion) 4D1 is formed to be hooked and locked by the SMA wire 10.
  • the distal end key portion 4D1 is for lifting the lens frame 4 upward and moving it upward along the axial direction by contraction of the SMA wire 10 hung thereon.
  • the lens frame 4 is provided with a spring holding portion 33 for holding the coil spring 34 shown in FIG. 2 that urges the lens frame 4 downward.
  • the spring holding portion 33 is a columnar convex portion erected on the upper end surface of the guide protrusion 4D, and the coil spring 34 shown in FIG. Accordingly, it is possible to suppress the movement of the SMA wire 10 that is contracted due to the influence of the surrounding environment and the like to raise the lens frame 4.
  • the lens frame 4 is integrally formed of a thermoplastic resin that can be heat-clamped or ultrasonically-clamped, such as polycarbonate (PC) or liquid crystal polymer (LCP) resin.
  • the module frame 5 is a cylindrical member extending along the axial direction with the axis M as the central axis, and the outer shape in plan view is formed in a substantially rectangular shape as a whole, and penetrates in the central portion in the axial direction.
  • An accommodating portion 5A having a circular shape in cross section is formed.
  • the lens frame 4 described above is accommodated in the accommodating portion 5A.
  • Flat upper and lower end surfaces 5a and 5b formed along a virtual perpendicular to the axis M are formed at the upper and lower corners of the module frame 5, respectively, and upper fixing pins 14A are directed upward on the upper end surfaces 5a.
  • the lower fixing pins 14B protrude downward from the lower end surfaces 5b.
  • the upper fixing pin 14A holds the upper leaf spring 6, and the lower fixing pin 14B holds the lower leaf spring 7, the module lower plate 8, and the power supply member 9.
  • the position of the upper fixing pin 14A in plan view may be different from the arrangement of the lower fixing pin 14B, but in this embodiment, they are arranged at coaxial positions parallel to the axis M, respectively. For this reason, the insertion positions of the upper fixing pin 14A and the lower fixing pin 14B in the upper leaf spring 6 and the lower leaf spring 7 are made common.
  • the distance between the upper and lower end surfaces 5 a and 5 b described above is set to be substantially the same distance as the distance between the upper and lower end surfaces 4 a and 4 b of the lens frame 4.
  • a notch 5B having a size in which a groove width in a plan view is fitted to the guide projection 4D of the lens frame 4 so as to be movable in the axial direction is formed at a lower portion of one corner of the module frame 5.
  • the notch 5B penetrates the guide projection 4D of the lens frame 4 in a state in which the lens frame 4 is inserted and accommodated in the module frame 5 from below, and the tip key portion 4D1 of the guide projection 4D is inserted into the diameter of the module frame 5. This is for projecting outward in the direction and positioning the lens frame 4 in the circumferential direction.
  • the SMA wire 10 is held at the two corners adjacent to the notch 5B of the module frame 5 on the side surface in the same direction as the corner provided with the notch 5B.
  • a pair of locking grooves 5C for attaching the wire holding members (holding terminals) 15A, 15B to be formed are formed.
  • the pins 35A and 35B are formed at positions where the wire holding members 15A and 15B are arranged on the side surface of the module frame 5, respectively. Further, a groove portion 36 that is filled with an adhesive and fixes the module frame 5 and the wire holding members 15A and 15B is formed below the pins 35A and 35B. And when fixing wire holding member 15A, 15B to the module frame 5, the wall part 35C which can suppress that wire holding member 15A, 15B rotates is formed.
  • the wall portion 35 ⁇ / b> C extends laterally (perpendicular to the side surface) from the side surface of the module frame 5.
  • the module frame 5 is integrally formed of a thermoplastic resin that can be heat-clamped or ultrasonically caulked, such as polycarbonate (PC), liquid crystal polymer (LCP) resin, and the like, in the same manner as the lens frame 4. ing.
  • a thermoplastic resin that can be heat-clamped or ultrasonically caulked, such as polycarbonate (PC), liquid crystal polymer (LCP) resin, and the like, in the same manner as the lens frame 4. ing.
  • the wire holding member 15A is attached to the side surface on the side where the pair of terminal portions 9C of the power supply member 9 protrudes from the drive module 1, and the wire holding member 15B is connected to the pair of terminal portions 9C of the power supply member 9 from the drive module 1. It is attached to the side of the side that does not protrude.
  • the wire holding members 15A and 15B are conductive members such as a metal plate formed in a key shape formed by caulking the end portion of the SMA wire 10 to the wire holding portion 15b.
  • the wire holding members 15A and 15B are formed with through holes 36A and 36B that fit into the pins 35A and 35B of the module frame 5, respectively. Further, through holes 37A and 37B for pouring the adhesive are formed below the through holes 36A and 36B in the axial direction. Then, when the module frame 5 and the wire holding members 15A and 15B are fixed, the arm portions 38A and 38B for contacting the wall portion 35C of the module frame 5 and suppressing the rotation of the wire holding members 15A and 15B. Are formed respectively.
  • the end portion of the SMA wire 10 is positioned and held by fitting the locking portion 5C and the pins 35A and 35B from the side and bringing the wall portion 35C and the arm portions 38A and 38B into contact with each other.
  • the wire holding members 15 ⁇ / b> A and 15 ⁇ / b> B are provided with a piece-like terminal portion 15 a on the opposite side of the wire holding portion 15 b (clamping position) of the SMA wire 10, and the terminal portion 15 a is attached to the module frame 5 when attached to the module frame 5. It protrudes slightly below the module lower plate 8 stacked below.
  • the SMA wire 10 held at both ends by the pair of wire holding members 15A and 15B is locked from below to the front end key portion 4D1 of the guide projection 4D of the lens frame 4 protruding from the notch 5B of the module frame,
  • the lens frame 4 is urged upward by the tension of the SMA wire 10 via the distal end key portion 4D1.
  • an upper leaf spring 6 and a lower leaf spring 7 are laminated on the upper and lower portions of the module frame 5 and the lens frame 4 inserted into the module frame 5, respectively.
  • the upper leaf spring 6 and the lower leaf spring 7 are flat plate spring members punched into substantially the same shape, and are made of a metal plate such as a stainless steel (SUS) steel plate.
  • the shape of the upper leaf spring 6 (lower leaf spring 7) has a substantially rectangular shape in plan view, similar to the upper (lower) end of the module frame 5, and is coaxial with the axis M at the center.
  • a circular opening 6C (7C) that is slightly larger than the inner peripheral surface 4F of the frame 4 is formed, and has a ring shape as a whole.
  • the upper fixing pins 14A (lower fixing pins 14B) formed in the vicinity of the corners of the module frame 5 correspond to the positions of the upper fixing pins 14A.
  • the upper plate spring 6 (lower plate spring 7) has upper fixing pins 13A (lower fixing pins) corresponding to the positions of the upper fixing pins 13A (lower fixing pins 13B) formed on the lens frame 4.
  • upper fixing pins 13A lower fixing pins
  • Four through holes 6A (7A) that can be respectively inserted into the pins 13B) are formed.
  • a ring portion 6F (7F) is formed on the outer side in the radial direction of the opening 6C (7C), and in the circumferential direction from a position in the vicinity of the through holes 6A (7A) that face each other diagonally across the axis M.
  • Four slits 6D (7D) extending in a substantially semicircular arc shape are formed so as to overlap each other in the radial direction by a substantially quadrant arc.
  • the outer shape of the upper leaf spring 6 (lower leaf spring 7) is provided in a rectangular shape substantially matching the outer shape of the module frame 5, and the spring portion 6E (7E) and the ring portion 6F (7F) are formed in the opening 6C ( 7C) is formed in a ring-shaped region.
  • a through-hole that is a fixed portion is provided at a corner having a sufficient space. Since the hole 6B (7B) is provided, the shape of the through-hole 6B (7B) can be separated from the spring portion 6E (7E), so that manufacturing by precise punching or etching is easy.
  • the module lower plate 8 allows the lower fixing pins 14B of the module frame 5 to pass through the through holes 7B of the lower leaf spring 7, and the lower fixing pins 13B of the lens frame 4 accommodated in the module frame 5 are lower plates.
  • the lower plate spring 7 is stacked between the module frame 5 with the lower plate spring 7 sandwiched from the lower side in a state of passing through the through hole 7A of the spring 7, and the rectangular outer frame of the lower plate spring 7 is attached to the end surface of the module frame 5. It fixes to a pressing state with respect to 5b.
  • the shape of the module lower plate 8 is a plate-like member having a rectangular outer shape that is substantially the same as the outer shape of the module frame 5, and a substantially circular opening 8 ⁇ / b> A centering on the axis M penetrates in the center in the thickness direction. Is formed. Then, on the side of the upper surface 8a laminated on the lower leaf spring 7 at the time of assembly, a position 4 corresponding to the position of the lower fixing pin 13B of the lens frame 4 is used to avoid interference with a caulking portion described later. Two U-shaped concave portions 8B are formed.
  • through holes 8C through which the lower fixing pins 14B are inserted are formed at the corners located on the periphery of the module lower plate 8 corresponding to the positions of the lower fixing pins 14B of the module frame 5.
  • the material of the module lower plate 8 is, for example, a synthetic resin having electrical insulation and light shielding properties. Further, since the module lower plate 8 has electrical insulation, it is an insulating member that fixes the power supply member 9 to the lower plate spring 7 in an electrically insulated state.
  • the power supply member 9 includes a pair of electrodes 9a and 9b each made of a plate-shaped metal plate.
  • Each of the electrodes 9a and 9b includes a substantially L-shaped wiring portion 9B that follows the outer shape of the module lower plate 8, and a terminal portion 9C that protrudes outside the outer shape of the module lower plate 8 from the end of the wiring portion. It consists of a polygonal metal plate.
  • Each of the wiring portions 9B has two lower fixing pins adjacent to each other along the outer shape of the module lower plate 8 out of the lower fixing pins 14B of the module frame 5 protruding downward from the lower surface of the module lower plate 8. Two through holes 9A for positioning the electrodes 9a and 9b with respect to the module frame 5 by inserting the pins 14B, respectively, are provided.
  • the terminal portions 9C of the pair of electrodes 9a and 9b are provided so as to protrude in parallel downward in the axial direction from the side surface of the module frame 5 on which the wire holding member 15A is attached. It has been.
  • one electrode 9a is notched in a concave shape to electrically connect the terminal portion 15a of the wire holding member 15A to the side surface on the wiring portion 9B between the through hole 9A and the terminal portion 9C.
  • a conductive connection portion 9D is provided.
  • the other electrode 9b is formed with a conductive connection portion 9D that is notched at a connection location with the terminal portion 15a of the wire holding member 15B on the side surface of the wiring portion 9B. In the conductive connection portion 9D, the other electrode 9b and the wire holding member 15B are electrically connected.
  • each conductive connection portion 9D to the terminal portion 15a
  • soldering or adhesion with a conductive adhesive can be employed.
  • the cover 11 is a member in which a side wall portion 11 ⁇ / b> D that covers the module frame 5 is extended from the outer edge portion of the upper surface 11 ⁇ / b> E to the lower side, and a rectangular opening 11 ⁇ / b> C is formed on the lower side.
  • a circular opening 11A centering on the axis M is provided at the center of the upper surface 11E. The size of the opening 11A is set so that the lens unit 12 can be taken in and out.
  • the control board 32 is a control board that supplies a control signal and power to the drive unit 31, and is a printed wiring that is electrically connected to each terminal portion 9C of the pair of electrodes 9a and 9b.
  • a printed circuit board 39 and 39 are formed on the surface, and a control circuit (not shown) mounted on the printed circuit board. More specifically, the control board 32 is a control means for energizing the pair of electrodes 9a and 9b via the printed wirings 39 and 39 to appropriately expand and contract the SMA wire 10, and by extending and contracting the SMA wire 10, the lens frame 4 is moved along the axial direction relative to the module frame 5 to place the lens frame 4 at a desired position (in-focus position).
  • the lens frame 4 is inserted into the housing portion 5A of the module frame 5 from below, and the upper end surface 5a of the module frame 5 and the upper end surface 4a of the lens frame 4 are aligned at the same height.
  • the upper fixing pins 14A of the module frame 5 and the upper fixing pins 13A of the lens frame 4 are inserted through the through holes 6B and 6A of the upper leaf spring 6, respectively.
  • the tips of the upper fixing pins 13A and 14A protruding through the through holes 6A and 6B of the upper leaf spring 6 are heat-clamped by a heater chip (not shown), as shown in FIGS. In this way, a caulking portion 16 that is a first fixing portion and a caulking portion 17 that is a second fixing portion are formed.
  • the upper end surface 4a of the lens frame 4 and the upper end surface 5a of the module frame 5 are aligned on the same plane, and the plate-like upper leaf spring 6 is arranged without being deformed, and heat caulking is performed. It can be carried out. Therefore, it is not necessary to hold down the upper plate spring 6 that is deformed, so that the caulking work can be easily performed. Further, the occurrence of floating or the like due to the deformation of the upper leaf spring 6 can be prevented.
  • each heater chip can be made common, even if both the crimping portions 16 and 17 are formed at the same time, variations in the crimping accuracy can be reduced.
  • the lower fixing pins 13B of the lens frame 4 are inserted into the through holes 7A of the lower leaf spring 7, respectively.
  • the lower fixing pins 14B of the module frame 5 are simultaneously inserted into the through holes 7B of the lower plate spring 7, the through holes 8C of the module lower plate 8, and the through holes 9A of the power supply member 9.
  • the front end portion of each lower fixing pin 13B penetrating through each through-hole 7A of the lower leaf spring 7 is heat-clamped with a heater chip (not shown), and the first end as shown in FIG.
  • a caulking portion 18 that is a fixing portion is formed.
  • the lower end surfaces 4b and 5b are on the same plane. Since the module lower plate 8 can be stacked and heat-clamped without deforming the flat plate-like lower leaf spring 7, the occurrence of floating due to the deformation of the lower leaf spring 7 can be prevented. can do.
  • each heater chip can be made common, even if the caulking portion 18 is formed at the same time, variations in caulking accuracy can be reduced.
  • each lower fixing pin 14B penetrating through the through-holes 7B, 8C, 9A is heat-clamped with a heater chip (not shown) and shown in FIG.
  • the caulking portion 19 that is the second fixing portion is formed.
  • the crimped portion 18 formed in the second step does not contact the module lower plate 8.
  • the upper plate spring 6, the lower plate spring 7, the module lower plate 8, and the power supply member 9 are laminated and fixed to both ends of the lens frame 4 and the module frame 5. Since the upper fixing pin 13A and the lower fixing pin 13B, and the upper fixing pin 14A and the lower fixing pin 14B are provided coaxially, the caulking portion 16 is used in caulking in the first to third steps. , 18 and the caulking portions 17, 19 have the same position on the plane of the heater chip. Therefore, since it is not necessary to change the heater chip position in each caulking, the caulking work can be performed efficiently.
  • the pair of wire holding members 15A and 15B to which the SMA wire 10 is attached are fixed to the module frame 5.
  • the through holes 36A and 36B of the wire holding members 15A and 15B are fitted to the two pins 35A and 35B formed on the module frame 5, and the wire holding members 15A and 15B are fitted to the locking grooves 5C. Lock each one.
  • the center portion of the SMA wire 10 is engaged with the distal end key portion 4D1 of the guide protrusion 4D, and the distal end key portion 4D1 is supported so as to be supported from below.
  • the terminal portions 15a of the wire holding members 15A and 15B protrude below the module lower plate 8, and are respectively connected to the conductive connection portions 9D of the electrodes 9a and 9b, which are power supply members 9 fixed to the module lower plate 8. Locked or placed close together.
  • thermosetting adhesive is poured into the through holes 37 ⁇ / b> A and 37 ⁇ / b> B to fill the groove portion 36 of the module frame 5.
  • the groove 36 is filled with the thermosetting adhesive, it is placed in a heating furnace in order to cure the adhesive.
  • the heating furnace for example, by heating at about 100 ° C. for about 20 to 30 minutes, the adhesive is cured and the module frame 5 and the wire holding members 15A and 15B are bonded and fixed.
  • each terminal portion 15a is electrically connected to the conductive connection portion 9D using, for example, soldering or a conductive adhesive.
  • the cover 11 is covered from above the module frame 5, and the side wall portion 11D and the module lower plate 8 are joined.
  • an engaging claw or the like is provided on the side wall part 11D and joined by fitting, or the side wall part 11D and the module lower plate 8 are bonded or welded to join.
  • the caulking portions 16 and 17 are in a state of being separated from the back surface of the upper surface 11E of the cover 11, respectively.
  • the adapter 30 is attached below the drive unit 31 and then mounted on the substrate.
  • fixing means such as adhesion and fitting can be employed.
  • the substrate may be an independent member attached to the drive module 1 or a member connected to and disposed on an electronic device or the like.
  • the lens unit 12 is screwed into the lens frame 4 through the opening 11A of the cover 11 and attached. As described above, the lens unit 12 is attached last because the lens of the lens unit 12 is not soiled or dust is attached by the assembling work.
  • the drive module 1 is attached to the lens unit 12. This process is performed at an early stage (sixth stage) when the product is shipped in a product state where the lens is attached, or when the opening 11A of the cover 11 is desired to be smaller than the outer shape of the lens unit 12, for example, when the aperture stop is also used. It may be carried out before the process).
  • the drive module 1 In the state where electric power is not supplied to the terminal portion 9 ⁇ / b> C, the drive module 1 has the tension from the SMA wire 10 and the urging force of the coil spring 34, and the restoring force from the upper leaf spring 6 and the lower leaf spring 7 at the crimping portions 16 and 18.
  • the forces acting on the lens frame 4 are balanced, and the lens frame 4 to which the lens unit 12 is attached is held at a fixed position in the axial direction.
  • the coil spring 34, the upper leaf spring 6, and the lower leaf spring 7 are deformed, and an elastic restoring force corresponding to the amount of deformation is urged to the lens frame 4. Then, the lens frame 4 stops at a position where this elastic restoring force is balanced with the tension of the SMA wire 10.
  • the lens frame 4 since the upper leaf spring 6 and the lower leaf spring 7 constitute a parallel spring, the lens frame 4 accurately moves along the axis M without being along an axial guide member or the like. Is done. For this reason, it is possible to reduce the number of parts and reduce the size. Further, since no sliding load is generated on the guide member, low power consumption can be realized.
  • the SMA wire 10 can be extended, and the lens frame 4 moves to the lower balance position.
  • the lens frame 4 is driven in the direction of the axis M by controlling the power supply amount by the control board 32.
  • temperature hysteresis appears between when the temperature is raised and when it is lowered, but this can be dealt with by correcting with software or the like.
  • the driving module 1 having the above-described configuration can be controlled by the control board 32 by the method shown in FIGS.
  • the environmental temperature is detected (temperature detection step). More specifically, as shown in FIGS. 7A and 7B, each time the electronic device is turned on, the SMA wire 10 is energized to contract and deform the SMA wire 10 to the limit. As a result, the maximum electric resistance value R max (shown in FIG. 15) and the minimum electric resistance value R min (shown in FIG. 15) of the SMA wire 10 are detected, and the operable range by the drive module 1 (of the SMA wire 10). (Expansion / contraction range) and environmental temperature are detected.
  • the environmental temperature includes the initial electrical resistance value R 0 (shown in FIG. 15), the initial temperature T 0 (shown in FIG. 15), the initial electrical resistance value R 0, and the maximum electrical resistance value R of the SMA wire 10. It can be detected based on the difference from max , etc., or may be measured by a temperature sensor.
  • one of the first drive mode shown in FIG. 7A and the second drive mode shown in FIG. 7B is selected based on the detected environmental temperature.
  • Mode selection step More specifically, when the detected environmental temperature is lower than the threshold temperature, the first drive mode is selected, and when the environmental temperature is higher than the threshold temperature, the second drive mode is selected.
  • the above-described threshold temperature is a preset temperature.
  • a graph G1 of a function of the environmental temperature and the deformation convergence time of the SMA wire 10 when the temperature of the SMA wire 10 is raised, The environmental temperature T X at the intersection of the graph G2 of the function of the environmental temperature at the time of temperature drop and the deformation convergence time of the SMA wire 10 is the threshold temperature.
  • the above-mentioned graph G1 is a graph when the temperature of the SMA wire 10 is increased and contracted and deformed, and conversely, the above-described graph G2 is when the temperature of the SMA wire 10 is decreased and expanded and deformed. It is a graph.
  • the energization of the SMA wire 10 is controlled according to the selected drive mode to cause the SMA wire 10 to expand and contract and move the lens frame 4 to the in-focus position (drive step).
  • the energization of the SMA wire 10 in the contracted state as described above is stopped.
  • the temperature of the SMA wire 10 is lowered, the SMA wire 10 is stretched and deformed, and the lens frame 4 is returned to the original reference position (lower reference position).
  • the SMA wire 10 is energized again to gradually increase the temperature of the SMA wire 10.
  • the SMA wire 10 is heated minutely and stepwise by energizing the stretched SMA wire 10 intermittently. Thereby, the SMA wire 10 is gradually contracted and deformed, and the lens frame 4 is gradually raised. Then, while moving the lens frame 4 over the entire movement range, a focus where the harmonic component becomes the largest is searched, and the temperature (electric resistance value) of the SMA wire 10 when the focus is achieved is recorded.
  • the energization to the SMA wire 10 is stopped, and the temperature of the SMA wire 10 is lowered to the focus temperature. Specifically, by continuously stopping energization to the SMA wire 10, the temperature of the SMA wire 10 is roughly lowered to cool down to the target temperature (focus temperature) at once. As a result, the SMA wire 10 extends and deforms, the lens frame 4 moves down, the lens frame 4 moves to the in-focus position, and the lens 50 is focused.
  • the SMA wire 10 is stopped, and the temperature of the SMA wire 10 is gradually decreased. Specifically, the SMA wire 10 is cooled finely stepwise by intermittently stopping energization to the SMA wire 10. Thereby, the SMA wire 10 is gradually extended and deformed, and the lens frame 4 is gradually lowered. Then, while moving the lens frame 4 over the entire movement range, a focus where the harmonic component becomes the largest is searched, and the temperature (electric resistance value) of the SMA wire 10 when the focus is achieved is recorded.
  • the SMA wire 10 is energized again to raise the temperature of the SMA wire 10 to the focus temperature. Specifically, by continuously energizing the SMA wire 10, the temperature of the SMA wire 10 is increased roughly and heated to the target temperature (focus temperature) at once. Thereby, the SMA wire 10 is contracted and deformed, the lens frame 4 is raised, the lens frame 4 is moved to the in-focus position, and the lens 50 is focused.
  • the drive module 1 having the above-described configuration can also be controlled by the method shown in FIGS.
  • the ambient temperature is detected (temperature detection step). More specifically, similar to the control method described above (shown in FIGS. 6 and 7), as shown in FIGS. 9A and 9B, each time the electronic device is turned on, the SMA wire 10 is connected. The SMA wire 10 is contracted and deformed to the limit by energization, and the operable range by the drive module 1 is detected and the environmental temperature is detected.
  • either one of the first drive mode shown in FIG. 10A and the second drive mode shown in FIG. 10B is selected based on the detected environmental temperature. (Mode selection step). More specifically, when the detected environmental temperature is lower than the threshold temperature, the first drive mode is selected, and when the environmental temperature is higher than the threshold temperature, the second drive mode is selected.
  • the energization of the SMA wire 10 is controlled according to the selected drive mode to expand and contract the SMA wire 10, and the lens frame 4 is moved to the in-focus position (drive step).
  • the environmental temperature is lower than the threshold temperature and the driving is performed in the first drive mode
  • first as shown in FIG. 10A, first, the temperature of the SMA wire 10 in the contracted state as described above is slightly decreased. Then, the lens frame 4 is moved to the reference position (upper reference position).
  • energization to the SMA wire 10 is stopped, and the temperature of the SMA wire 10 is roughly lowered (rapidly lowered). Specifically, energization to the SMA wire 10 is stopped intermittently or continuously to cool the SMA wire 10. Thereby, the SMA wire 10 is quickly stretched and deformed, and the lens frame 4 is quickly lowered. At this time, the focal point with the highest harmonic component is searched, and the temperature of the SMA wire 10 is lowered until the focal point is detected, and the lens frame 4 is lowered.
  • the position of the lens frame 4 is finely adjusted by moving the temperature of the SMA wire 10 up and down by the hill climbing method, and the lens frame 4 is moved to the in-focus position. More specifically, energization of the SMA wire 10 is started when the focus is detected. As a result, the lowering lens frame 4 is folded back and turned up. Then, by intermittently energizing the SMA wire 10, the SMA wire 10 is heated minutely stepwise to gradually increase the temperature of the SMA wire 10. Thereby, the SMA wire 10 is gradually contracted and deformed, and the lens frame 4 is gradually raised. At this time, the focal point where the harmonic component becomes the largest is searched, and the temperature of the SMA wire 10 is raised until the focal point is detected, and the lens frame 4 is raised.
  • the energization to the SMA wire 10 is stopped. As a result, the rising lens frame 4 is turned back and lowered. Then, by intermittently stopping energization of the SMA wire 10, the SMA wire 10 is finely and gradually cooled to gradually decrease the temperature of the SMA wire 10. Thereby, the SMA wire 10 is gradually extended and deformed, and the lens frame 4 is gradually lowered. At this time, the focal point with the highest harmonic component is searched, and the temperature of the SMA wire 10 is lowered until the focal point is detected, and the lens frame 4 is lowered.
  • the lens frame 4 is gradually brought closer to the in-focus position by repeatedly heating and cooling the SMA wire 10 described above, and finally the lens frame 4 is stopped at the in-focus position. Thereby, the lens 50 is focused.
  • the energization to the SMA wire 10 in the contracted state as described above is stopped.
  • the temperature of the SMA wire 10 is lowered, the SMA wire 10 is stretched and deformed, and the lens frame 4 is returned to the original reference position (lower reference position).
  • the SMA wire 10 is energized to raise the temperature of the SMA wire 10 roughly (rapid increase).
  • the SMA wire 10 is heated by energizing the SMA wire 10 intermittently or continuously. Thereby, the SMA wire 10 is rapidly contracted and deformed, and the lens frame 4 is quickly raised. At this time, the focal point where the harmonic component becomes the largest is searched, and the temperature of the SMA wire 10 is raised until the focal point is detected, and the lens frame 4 is raised.
  • the position of the lens frame 4 is finely adjusted by moving the temperature of the SMA wire 10 up and down by the hill climbing method, and the lens frame 4 is moved to the in-focus position.
  • energization to the SMA wire 10 is stopped when the focus is detected. As a result, the rising lens frame 4 is turned back and lowered. Then, by intermittently stopping energization of the SMA wire 10, the SMA wire 10 is finely and gradually cooled to gradually decrease the temperature of the SMA wire 10. Thereby, the SMA wire 10 is gradually extended and deformed, and the lens frame 4 is gradually lowered. At this time, the focal point with the highest harmonic component is searched, and the temperature of the SMA wire 10 is lowered until the focal point is detected, and the lens frame 4 is lowered.
  • the lens frame 4 is gradually brought closer to the in-focus position by repeatedly heating and cooling the SMA wire 10 described above, and finally the lens frame 4 is stopped at the in-focus position. Thereby, the lens 50 is focused.
  • the drive mode is selected according to the environmental temperature
  • the energization to the SMA wire 10 is controlled according to the drive mode
  • the SMA wire 10 expands and contracts
  • the lens frame 4 moves to the in-focus position. Therefore, the time (deformation convergence time) from when the SMA wire 10 is energized or de-energized until the SMA wire 10 expands or contracts to a desired shape is affected by the environmental temperature. It will not be long.
  • energization to the SMA wire 10 is controlled in the first drive mode in which the temperature of the SMA wire 10 is roughly lowered (rapidly lowered). At this time, since the environmental temperature is low and the temperature of the SMA wire 10 is likely to decrease, the SMA wire 10 expands and deforms into a desired shape in a short time after the energization of the SMA wire 10 is stopped. In addition, when the environmental temperature is higher than the threshold temperature, energization of the SMA wire 10 is controlled in the second drive mode in which the temperature of the SMA wire 10 is roughly increased (rapidly increased). At this time, since the environmental temperature is high and the temperature of the SMA wire 10 is likely to rise, the SMA wire 10 contracts and deforms into a desired shape in a short time after the SMA wire 10 is energized.
  • the SMA wire 10 is controlled in a time efficient mode according to the environmental temperature, and the lens frame 4 moves to the in-focus position in a short time and is immediately focused. It is possible to prevent the focus operation time from becoming long.
  • FIGS. 11A and 11B are perspective external views of the front surface and the back surface of the electronic apparatus according to the embodiment of the present invention.
  • FIG.11 (c) is FF sectional drawing in FIG.11 (b).
  • a camera-equipped mobile phone 20 according to the present embodiment shown in FIGS. 11A and 11B is an example of an electronic apparatus including the drive module 1 according to the above-described embodiment.
  • the camera-equipped mobile phone 20 includes a known mobile phone device configuration inside and outside the cover 22 such as a reception unit 22a, a transmission unit 22b, an operation unit 22c, a liquid crystal display unit 22d, an antenna unit 22e, and a control circuit unit (not shown). ing.
  • a window 22A through which external light is transmitted is provided in the cover 22 on the back surface side on which the liquid crystal display unit 22d is provided, and as shown in FIG. 11 (c), The drive module 1 of the first embodiment is installed so that the opening 11A of the drive module 1 faces the window 22A of the cover 22 and the axis M is along the normal direction of the window 22A.
  • the deformation convergence time of the SMA wire 10 does not become long due to the influence of the environmental temperature, and the lens frame 4 moves to the in-focus position in a short time and is immediately focused. It is possible to provide a high-performance camera-equipped mobile phone 20 with high responsiveness of operation.
  • the upper fixing pins 13A and 14A and the lower fixing pins 13B and 14B are inserted through the upper plate spring 6 and the lower plate spring 7 that are plate spring members for urging the lens frame 4,
  • the fixing method of a spring member is not limited to this.
  • it may be fixed by ultrasonic caulking or the like, or a spring member may be bonded to the lens frame 4 or the module frame 5. According to this structure, a large bonding area can be secured, so that a large strength can be obtained even if an adhesive is used.
  • the spring member in the present invention is not limited to a leaf spring, and may be a spring member having another shape.
  • the module frame 5 has been described as a substantially rectangular member as a whole, but is not limited to a substantially rectangular shape, and may be a polygonal shape.
  • the SMA wire 10 is provided as a shape memory alloy body.
  • the shape memory alloy body in the present invention is not limited to a wire shape, and for example, a shape memory of another shape such as a plate shape. An alloy body may be sufficient.
  • the example of the camera-equipped mobile phone is described as the electronic device using the drive module, but the type of the electronic device is not limited to this.
  • it can be used for other optical devices such as a digital camera and a camera built in a personal computer.
  • it is possible to replace suitably the component in above-mentioned embodiment with a well-known component, and you may combine the above-mentioned modification suitably.

Abstract

La présente invention se rapporte à un module d'entraînement doté de plusieurs modes d'entraînement. Dans un premier mode d'entraînement, après qu'un foyer a été détecté grâce au déplacement d'une monture d'objectif sur l'intégralité de son amplitude de mouvement par l'envoi d'électricité dans un corps en alliage à mémoire de forme et par l'augmentation progressive de la température de ce corps, la température dudit corps en alliage à mémoire de forme diminue et la monture d'objectif se déplace vers l'emplacement de mise au point ; et dans un second mode d'entraînement, après que la mise au point a été détectée grâce au déplacement de la monture d'objectif sur l'intégralité de son amplitude de mouvement par l'envoi d'électricité dans l'alliage à mémoire de forme et par la diminution progressive de la température de cet alliage, la température dudit alliage à mémoire de forme augmente et la monture d'objectif se déplace vers l'emplacement du foyer. Un moyen de commande détecte la température ambiante, sélectionne le premier mode d'entraînement si la température ambiante est inférieure à une température limite, sélectionne le second mode d'entraînement si la température ambiante est supérieure à la température limite, et commande l'envoi d'électricité vers le corps en alliage à mémoire de forme conformément au mode d'entraînement sélectionné, ce qui permet d'entraîner un moyen d'entraînement.
PCT/JP2011/057165 2010-03-29 2011-03-24 Module d'entraînement, dispositif électronique et procédé de commande de module d'entraînement WO2011122438A1 (fr)

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JP2010076359A JP2011209468A (ja) 2010-03-29 2010-03-29 駆動モジュール、電子機器及び駆動モジュールの制御方法

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ITMI20122099A1 (it) * 2012-12-10 2014-06-11 Getters Spa Dispositivo per auto-focus con attuatore a memoria di forma
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WO2018203173A1 (fr) 2017-05-04 2018-11-08 Actuator Solutions GmbH Actionneur de mise au point automatique pour module de caméra
WO2019008522A1 (fr) 2017-07-04 2019-01-10 Actuator Solutions GmbH Actionneur de mise au point automatique pour module de caméra
US10901173B2 (en) 2017-07-04 2021-01-26 Actuator Solutions GmbH Camera module autofocus actuator
IT201700074728A1 (it) * 2017-07-04 2019-01-04 Actuator Solutions GmbH Attuatore per auto-focus di modulo di fotocamera
WO2019109929A1 (fr) * 2017-12-08 2019-06-13 宁波舜宇光电信息有限公司 Ensemble optique, module de prise d'image et dispositif intelligent pourvu du module de prise d'image
CN109901347A (zh) * 2017-12-08 2019-06-18 宁波舜宇光电信息有限公司 光学组件、摄像模组和具有摄像模组的智能设备
CN109901347B (zh) * 2017-12-08 2020-12-11 宁波舜宇光电信息有限公司 光学组件、摄像模组和具有摄像模组的智能设备
CN108303779A (zh) * 2018-04-13 2018-07-20 湖南新视电子技术有限公司 一种适于摄像头驱动马达的镜头座组件
CN112782824A (zh) * 2020-04-07 2021-05-11 北京可利尔福科技有限公司 透镜模组控制系统及其控制方法
CN112782824B (zh) * 2020-04-07 2023-10-03 北京可利尔福科技有限公司 透镜模组控制系统及其控制方法
WO2022227811A1 (fr) * 2021-04-29 2022-11-03 荣耀终端有限公司 Appareil d'entraînement, module photographique et dispositif électronique

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