WO2011120752A1 - Dispositif de refroidissement et procédé pour le réaliser - Google Patents

Dispositif de refroidissement et procédé pour le réaliser Download PDF

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Publication number
WO2011120752A1
WO2011120752A1 PCT/EP2011/053145 EP2011053145W WO2011120752A1 WO 2011120752 A1 WO2011120752 A1 WO 2011120752A1 EP 2011053145 W EP2011053145 W EP 2011053145W WO 2011120752 A1 WO2011120752 A1 WO 2011120752A1
Authority
WO
WIPO (PCT)
Prior art keywords
foam
fluid
foam material
plate
side parts
Prior art date
Application number
PCT/EP2011/053145
Other languages
German (de)
English (en)
Inventor
Norbert Huber
Harald Müller
Andreas SCHRÖTER
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2011120752A1 publication Critical patent/WO2011120752A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a device for cooling power-electric components and machines in the manner of a cooling plate and to a method for the production thereof.
  • Devices for cooling of power electrical components and machines are known from the prior art, for example in the form of cooling plates. These cooling plates generally have cooling channels in the interior, which are formed, inter alia, by meander-shaped or branched tube coils. From DE 10 2006 036 833 AI a cooling plate is known, which is composed of a plate stack with overlapping, y-shaped recesses. The structure is complicated and leads to a costly manufacturing process.
  • Object of the device according to the invention and of the method for producing the device is to provide a cost-effective, particularly easy to manufacture device, which is characterized in particular by a low weight, low height and good heat transfer and allows uniform cooling.
  • An object in the method for Her ⁇ position is to be able to produce with as few and inexpensive, simple process steps, the device. The stated object is with respect to the device for
  • the inventive device for cooling of power ⁇ electrical components and machines in the manner of a cooling plate comprises open-cell foam material.
  • the open pores of the foam material form continuous channels through which a fluid can flow.
  • a fluid can enter on one side of the foam material and emerge again on an opposite side.
  • heat exchange takes place between the foam material and the fluid.
  • the Schaummate ⁇ rial can be cooled and the fluid absorbs a quantity of heat, which depends on the type of fluid and its Strömungsge ⁇ speed in the foam material.
  • a good thermal conductivity ⁇ ability of the foam material thus favors the heat ⁇ exchange properties of the device.
  • the open-cell foam material may be partially full text or ⁇ dig be formed of metal foam and / or plastic foam.
  • Metal foam has the usual high thermal conductivity for metals. However, for certain applications, such as in magnetic coils, the use of metals is not possible.
  • plastic foam made of a suitable plastic or a suitable plastic mixture can be used. There are also mixtures of metallic material and plastics as open-cell foam material ⁇ possible.
  • the foam material may be in the form of at least one plate before ⁇ .
  • the foam material may also be in the form of a stack of sheets of individual stacked foam sheets.
  • the at least one foam plate and / or the plate stacks may have a top and a bottom, which are covered with a fluid-tight material.
  • the at least one Foam plate and / or the plate stack can be completely covered with fluid-tight material, in particular on the top and the bottom. As a result, a fluid flow in the open-cell foam material is formed substantially parallel to the top and the bottom.
  • the at least one foam plate and / or the plate stacks can be completely surrounded by a casing made of a fluid-tight material.
  • the sheath may have at least one inflow and / or outflow for a fluid. This allows fluid to the foam material and / or from
  • the sheath may be in the form of plates, in particular metal sheets or plastic plates.
  • the sheath may further comprise side parts, which are formed in particular in profile shape.
  • the side parts in Pro ⁇ filform may be constructed from metal and / or plastic or include these materials.
  • the foam material may be formed with fluid-tight material on its top and bottom as a laminate. As a result, a high mechanical stability of the device is achieved.
  • a method of manufacturing the device described above may include a fabrication step of welding, brazing, pressing, and / or laminating.
  • Laminating in particular is a known production method, which is simple and inexpensive to carry out. Welding of fluid-tight material on the top and the bottom as well as side parts with the material on the top and bottom and side parts with each other, resulting in a mechanically stable, fluid-tight connection, which is inexpensive to manufacture. Side parts may alternatively also be made by pressing in between the top and bottom sides. mechanically stable and fluid tight to the fluid-tight material on the top and bottom are attached.
  • the fluid-tight material on the top and bottom of the foam material (2) can also be applied by brazing.
  • Fig. 1 is a sectional view of a laminated foam sheet according to the invention.
  • Fig. 2 is a sectional view of a completely sheathed
  • Foam plate with connection channels for a fluid Foam plate with connection channels for a fluid
  • FIG. 3 shows a sectional view of a section of a laminated foam board with welded-on side parts
  • Fig. 4 is a sectional view analogous to dargestell ⁇ th in Fig. 3, with a square profile of a side portion and an alternative arrangement of welds and
  • Fig. 5 is a sectional view corresponding to the presented in Fig. 3 Darge ⁇ , with U-shaped profile of a side part
  • Fig. 6 is a sectional view analogous to that in Fig. 4 dargestell ⁇ th, with the alternative arrangement of welds, but with a U-shaped profile of a side part
  • FIG. 7 is a sectional view of a fragment of a lamination ⁇ th foam sheet having pressed side portions
  • FIG. 8 is a sectional view corresponding to that in Fig. 7 ge ⁇ showed laminated foam sheet, to form a channel with side panel as a wall
  • Fig. 9 is a sectional view of a portion of a Laminier ⁇ th foam plate with side panels, which are formed by connecting laminate layers.
  • Open-pore foam ⁇ material 2 for example made of metal foam is formed in a plate shape.
  • On the top and bottom of the foam material plate 2 is in each case a plate with a fluid-tight Mate ⁇ rial as a cover plate 3, 3 'laminated.
  • the foam material plate 2 and the two cover plates 3, 3 ' have the same size and shape in the plane of the plate, perpendicular to the sectional plane shown in Fig. 1.
  • Open pores of the foam material form continuous channels through which a fluid can strö ⁇ men.
  • a gas such as air or a liquid such as an oil, water or liquid nitrogen may be used. Preference is given to using liquids having a high heat capacity. These exchange heat with the foam material 2, ie absorb heat, for example, and thus lead to cooling of the foam material 2 and thus of the device 1 according to the invention.
  • Fig. 2 is a sectional view of a completely jacketed ⁇ th foam material plate 2 with connection channels 5, 5 'and an inlet 6 and a drain 7 for a fluid Darge ⁇ provides.
  • the inventive device 1 is in each case by a cover plate 3, 3 'on its top and bottom and by side parts 4, 4' on each side of the foam material 2 be ⁇ limits.
  • a fluid can be supplied into the box, which can flow through the open-pored foam material 2 to the outlet 7, and can be discharged via the outlet 7 out of the box.
  • inventive device 1 acts as a heat exchanger, wherein the fluid cools the device 1 and heats up.
  • the device 1 according to the invention can absorb heat via its cover plates 3, 3 'and side parts 4, 4' and thus act as a cooling device.
  • connection channels 5, 5' may be formed in or adjacent to the side parts 4, 4 'channels in the form of connection channels 5, 5'. These lead to an improved fluid flow, in particular a more uniform fluid flow through the foam material 2. Additionally or alternatively, channels in the form of connecting channels 5, 5 'can also be formed in or adjacent to the cover plates 4, 4'.
  • FIG. 3 shows a side region of the device 1 according to the invention without connection channels 5, 5 'as an exemplary embodiment.
  • the side parts 4 4 ' are' welded, wherein the foam material 2 completely from the side parts 4, 4 'in this example from ⁇ guide on the cover plates 3, 3 is enclosed and cover plates 3, 3' enveloping respectively.
  • the side parts 4, 4 ' may also be welded together or made of one piece.
  • welds at or adjacent to the contact ⁇ places of side parts 4, 4 'with each other and / or with cover plates 3, 3' are in the form of welds 8, 8 'ausge- leads.
  • the profiles can, as shown in Fig. 3 can be welded, or the cover plates 3, 3 'may, as shown in Fig. 4, project beyond the Randbe ⁇ area of the foam material plates 2 addition.
  • the side parts 4, 4 'in profile form can be arranged between the cover plates 3, 3' in the region in which the cover plates 3, 3 'protrude beyond the edge region of the foam material plates 2.
  • chamfers may be provided, on which the cover plates 3, 3 'and side parts 4, 4' are welded together.
  • FIG. 5 shows a U-shaped side part 4, which, analogously to the side part 4 shown in FIG. 3, is welded to the cover plates 3, 3 '. Due to the U-shaped profile of the side part 4, a connection channel 5 is formed in conjunction with the foam material 2. Fluid can flow into the connection channel 5 via an inlet 6 and can enter the foam material 2 uniformly there, or be collected from the foam material 2 on leaving it, and can flow away or be discharged via an outlet 7.
  • 5 may be of the weld in the embodiment of Fig.
  • Analogue welded represents the square profile in Fig.
  • connection channel 5 is formed analogously to the connection channel 5 shown in FIG. 5.
  • Fig. 7 shows an alternative embodiment of the connection of side parts 4, 4 'with the cover plates 3, 3'.
  • the side parts 4, 4 ' are fixed in a fluid-tight manner by pressing between the cover plates 3, 3'.
  • the Be ⁇ tenmaschine 4, 4 ' can be, for example T-shaped, with za- ckenförmiger or wave-shaped surface in the center region of the T-shape.
  • the side parts 4a in profile form can be arranged between the cover plates 3, 3 'in the region in which the cover plates 3, 3' protrude beyond the edge region of the foam material plates 2, with the serrated or wavy surface.
  • the middle region of the T-shaped side parts 4a is thereby pressed into the intermediate space between the cover plates 3, 3 '. If the diameter D of the middle region of the T-shape has the same or preferably a slightly greater value than the distance of the cover plates 3, 3 'from one another, which are generally arranged parallel to one another, then the middle region exercises the T-shape of the side part 4a a compressive force on the inner sides of the cover plates 3, 3 'from. Thereby result is a mechanically stable, fluid-tight connection Zvi ⁇ rule the cover plates 3, 3 'and the side portion 4a.
  • the side part 4a is in direct, in particular mechanical contact with the
  • the first case is shown with direct contact.
  • the second case a distance between side part 4a and
  • connection channel 5 is formed with the side part 4 a as a wall.
  • the Ranka ⁇ nal 5 is formed by the foam material 2, the cover plates 3, 3 'and the side part 4a limited.
  • Fluid for example coming from an inlet 6, can flow through the connection channel 5 and penetrate uniformly into the foam material 2 or escape from the foam material 2, be collected in the connection channel 5, and then leave the device 1 according to the invention via a drain 7, for example ,
  • a good uniform Strö ⁇ mung by the foam material 2 can be generated so where ⁇ by results in a good heat-exchange effect.
  • connection channels 5, 5 'on side parts 4, 4', 4a are shown in Fig. 9, an alternative to the formation of connection channels 5, 5 'on side parts 4, 4', 4a is shown. at
  • cover plates 3, 3 'or differently shaped cover material in particular cover films which project beyond the edge of the foam material 2, the edges of the Deckma ⁇ terials 3, 3' are fluid-tightly connected to each other, eg welded.
  • the cover material 3, 3 'in the edge region of the foam material plate or the foam material 2 are directly mechanically in contact with the foam material 2, analogous to the embodiment of Fig. 7 with pressed soentei ⁇ len 4a.
  • the cover material 3, 3 'in the edge region of the foam material plate or the foam material 2 form a connection channel 5, 5', with a boundary by the cover material 3, 3 'and the edge of the foam material 2, analogous to the embodiment of FIG. 8 with compressed side parts 4a.
  • a particularly high stability of the inventive device 1, in particular as shown in the figures and described above, can be achieved by laminating the cover plates 3, 3 'on the foam material 2.
  • cover plates 3, 3 ' it is also possible to use other shapes, such as cover foils or cover sheets, in particular of fluid-tight metal or plastic materials.
  • the foam material 2 may also be in the form of plates, but also in the form of films or sheets, wherein the open-pore material in particular metal or plastic material ⁇ contained or may be made completely from it.
  • welds 8, 8 ' it is also possible to use other compounds, for example bonds.
  • the exemplary embodiments illustrated in the figures can result, individually or in combinations, in the device 1 according to the invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un dispositif (1) pour refroidir des machines et des composants électriques de puissance à la manière d'une plaque de refroidissement, ainsi qu'un procédé pour le réaliser. Le dispositif (1) comprend une matière expansée (2) à pores ouverts constituée par ex. d'une mousse métallique et/ou d'une mousse plastique.
PCT/EP2011/053145 2010-03-31 2011-03-03 Dispositif de refroidissement et procédé pour le réaliser WO2011120752A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010013734.0 2010-03-31
DE102010013734A DE102010013734A1 (de) 2010-03-31 2010-03-31 Vorrichtung zur Kühlung und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
WO2011120752A1 true WO2011120752A1 (fr) 2011-10-06

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WO (1) WO2011120752A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9693487B2 (en) 2015-02-06 2017-06-27 Caterpillar Inc. Heat management and removal assemblies for semiconductor devices
EP3392906A1 (fr) * 2017-04-19 2018-10-24 Siemens Aktiengesellschaft Procédé de fabrication d'une plaque de refroidissement pour un semi-conducteur de puissance
US20200107601A1 (en) * 2018-09-17 2020-04-09 Omius Inc. Dermal heatsink exhibiting hydrophilic and contaminant resistant properties and method for fabricating a dermal heatsink
WO2020200721A1 (fr) * 2019-04-04 2020-10-08 Siemens Aktiengesellschaft Dispositif pour le refroidissement de composants électriques et/ou électroniques

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DE102013000213B4 (de) * 2012-01-18 2016-11-10 Glatt Systemtechnik Gmbh System zur Temperierung von elektronischen oder optoelektronischen Bauelementen oder Baugruppen
DE102012201612B3 (de) * 2012-02-03 2013-06-13 Siemens Aktiengesellschaft Kühlelement für Leistungshalbleiter-Bauelemente
ES2533316T3 (es) 2012-07-10 2015-04-09 Pfo Private Family Office Gmbh Cuerpo de soporte de conducción con núcleo metálico espumado y procedimiento para su fabricación

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Publication number Priority date Publication date Assignee Title
EP0471552A1 (fr) * 1990-08-14 1992-02-19 Texas Instruments Incorporated Module de transport de chaleur pour des applications à très haute densité et à empaquetage silicium sur silicium
WO1999006782A1 (fr) * 1997-07-31 1999-02-11 Motorola Inc. Appareil et procede de refroidissement d'un composant electronique au moyen d'un materiau poreux
US6367544B1 (en) * 2000-11-21 2002-04-09 Thermal Corp. Thermal jacket for reducing condensation and method for making same
EP1225633A1 (fr) * 2001-01-22 2002-07-24 ABB Schweiz AG Dissipateur de chaleur pour dispositif semi-conducteur de puissance et procédé de fabrication d'un tel dissipateur de chaleur
DE10123456A1 (de) * 2001-05-14 2002-11-21 Pore M Gmbh Wärmetauscher
DE10244805A1 (de) * 2002-09-26 2004-04-08 Sma Regelsysteme Gmbh Offenporig poröser Kühlkörper eines Wärmetauschers
DE102006036833A1 (de) 2006-08-07 2008-02-21 Siemens Ag Gradientenspulensystem und Magnetresonanztomograph
WO2011028924A2 (fr) * 2009-09-02 2011-03-10 University Of Washington Mousses thermoplastiques poreuses servant de matériaux de transfert de chaleur

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9693487B2 (en) 2015-02-06 2017-06-27 Caterpillar Inc. Heat management and removal assemblies for semiconductor devices
EP3392906A1 (fr) * 2017-04-19 2018-10-24 Siemens Aktiengesellschaft Procédé de fabrication d'une plaque de refroidissement pour un semi-conducteur de puissance
US20200107601A1 (en) * 2018-09-17 2020-04-09 Omius Inc. Dermal heatsink exhibiting hydrophilic and contaminant resistant properties and method for fabricating a dermal heatsink
US10820652B2 (en) * 2018-09-17 2020-11-03 Omius Inc. Dermal heatsink exhibiting hydrophilic and contaminant resistant properties and method for fabricating a dermal heatsink
WO2020200721A1 (fr) * 2019-04-04 2020-10-08 Siemens Aktiengesellschaft Dispositif pour le refroidissement de composants électriques et/ou électroniques

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