TWM245479U - Improved supporting structure of tablet type heat pipe - Google Patents

Improved supporting structure of tablet type heat pipe Download PDF

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Publication number
TWM245479U
TWM245479U TW92217637U TW92217637U TWM245479U TW M245479 U TWM245479 U TW M245479U TW 92217637 U TW92217637 U TW 92217637U TW 92217637 U TW92217637 U TW 92217637U TW M245479 U TWM245479 U TW M245479U
Authority
TW
Taiwan
Prior art keywords
hollowed
hollow
areas
heat pipe
shell
Prior art date
Application number
TW92217637U
Other languages
Chinese (zh)
Inventor
Chin-Wen Wang
Chin-Jang Wang
Pai-Chiou Wang
Original Assignee
Chin-Wen Wang
Chin-Jang Wang
Pai-Chiou Wang
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Filing date
Publication date
Application filed by Chin-Wen Wang, Chin-Jang Wang, Pai-Chiou Wang filed Critical Chin-Wen Wang
Priority to TW92217637U priority Critical patent/TWM245479U/en
Priority to JP2004050382A priority patent/JP4095969B2/en
Priority to DE200420007195 priority patent/DE202004007195U1/en
Publication of TWM245479U publication Critical patent/TWM245479U/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00Reinforcing means
    • F28F2225/04Reinforcing means for conduits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a support structure for transmitting more heat, by improving the connection strength and temperature uniformity of a heat pipe. <P>SOLUTION: The support structure for flat heat pipes comprises a housing 1; and a support member 2 arranged at the housing 1. The housing 1 has an upper lid 10 and a lower lid 11. The upper and lower lids 10, 11 are engaged each other to form a hollow chamber 12. The hollow chamber 12 is filled with working fluid. The support member 2 has a flat member, having a plurality of punched holes. The support member 2 is sintered along with the upper and lower lids 10, 11 in the hollow chamber 12, and the housing 1 and the support member 2 are integrated. <P>COPYRIGHT: (C)2005,JPO&amp;NCIPI

Description

M245479 沒、創作說明(1) 【新型所屬之技術領域— 指-= = 板式熱管之支撐結構改良,尤 式熱管之支撐結構改良。且具有良好整體強度之平板 【先前技術】 产之:子由2電巧產業快速的升、級,已發展出許多高精密 ί功r辦=、、’廷些電子元件隨著技術水準的提昇,其不 ,® I,曰I給f作之速度加快,更伴隨著熱量的大幅提昇 μ #速i;衿夺電子兀件於其許可之溫度下繼續運作,如 ^的課題之1性的散熱已成為現今研發人員最迫切急需解 航爲it ΐ ,所7^ ’揭示有—種f知的平板式熱管1 a,該 i I 一彳φ I«糸用以裝設於如中央處理器(cpu) 3a等電子 德# 、 由一上盍11&amp;與一下蓋12a相互蓋合所 # 1 ϋ Γ ^ a ,該上、下蓋11 a、1 2a相互蓋合後係於殼 壯一中空容室13&amp;,於該中空容室13&amp;之内壁上 、,阁日#,:汲織1 ,並填充有適量之工作流體(圖略) ,/9、巩:避免該熱管18於抽真空作業時,上、下蓋lla ϋ A凹陷之虞,故於其殼體1〇&amp;内更設有支撐體15a ,,^ ώ: 盖11 a、1 2 a之間’以增加熱管ι a整體之 結構強度。 “:、1ΐ於熱管la之中空容室13a β必須供工作流體於 '口此,上述支撐體15a並非完全與上、下蓋 a a 4接觸,以致該熱管1 a仍會因抽真空作業之影響M245479 No. Creation Instructions (1) [Technical field to which the new type belongs — refers to the improvement of the support structure of plate heat pipes, and the improvement of the support structure of the special heat pipes. Tablets with good overall strength [Previous technology] Production: Ziyou 2 has been rapidly upgraded and upgraded in the electronics industry, and has developed many high-precision electronic components. With the improvement of technical standards It doesn't, ® I, said that the speed of I to work faster, and accompanied by a large increase in heat μ # 速 i; rob electronic components to continue to operate at their permitted temperature, such as The heat dissipation has become the most urgent need for developers today. It is revealed that there is a flat-plate heat pipe 1 a of the type known, and the i I 彳 φ I «装 is used to be installed in, for example, a central processing unit. (Cpu) 3a and other electronic German #, by a top 盍 11 &amp; and a lower cover 12a mutually cover the place # 1 ϋ Γ ^ a, the upper and lower cover 11 a, 1 2a are covered with each other and tied to the shell and a hollow Container 13 &amp; on the inner wall of the hollow container 13 &amp;, Ge Ri # ,: Jizhi 1, and filled with an appropriate amount of working fluid (not shown), / 9, Gong: Avoid the heat pipe 18 under vacuum During operation, the upper and lower covers lla ϋ A may be recessed. Therefore, a support 15a is provided in the housing 10 &amp; ^: between the covers 11 a and 1 2 a To increase the overall structural strength of the heat pipe. ": 1, the hollow chamber 13a β in the heat pipe la must be used for working fluid. The above support 15a is not completely in contact with the upper and lower covers a a 4, so that the heat pipe 1 a will still be affected by the vacuuming operation.

M245479 四、創作說明(2) - ,而使其上、下蓋lla、12a向中空容室13a内凹陷,如此 ,將使得該熱管la與一散熱器2a作整合時,無法與該散熱 器2a之底面完整接觸(如第二圖所示),而於二者之間形 成熱阻,影響散熱效果甚巨,同理,該熱管丨^盥中央處理 器3a之接觸亦有不完整之虞。 … 有鑑於此,本創作人係為改善並解決上述之缺失,乃 特潛心研究並配合學理之運用,終於提出一種設計合理且 有效改善上述缺失之本創作。 【新型内容】 本創作之主要目的,在於可提供一種平板式熱管之支 撐結構改良,其係為增加該支撐體與上、下蓋間之接合強 度,使熱管於抽真空作業中更容易維持殼體外表面之平整 度’同時’亦可防止熱管於相變化的過程中,因蒸氣壓力 所造成之膨脹問題,以達到抗張力與抗變形之效果。 為了達成上述之目的,本創作係提供一種平板式熱管 之支撐結構改良,包括一殼體以及一配合設於該殼體内部 之支撐體;其中,該殼體係為一内部中空之封閉殼體,包 含相互蓋合之上蓋與下蓋,以於該上、下蓋之 閉且位於該殼體内部之中空容室,並填充有工作流體,而 該支撐體為一具有複數鏤空區之板狀體,其係以粉末户八 之燒結方式結合於上、下蓋之間,並配合對應而位於^鉍 體之中空容室内;藉此,即可令該殼體與支撐體結合^ 一體,而能增強支撐體與上、下蓋間之接合強度。战為 【實施方式】M245479 IV. Creation Instructions (2)-and the upper and lower covers 11a and 12a are recessed into the hollow container 13a. In this way, when the heat pipe 1a is integrated with a radiator 2a, it cannot be integrated with the radiator 2a. The bottom surface is in complete contact (as shown in the second figure), and the formation of thermal resistance between the two has a huge effect on heat dissipation. Similarly, the contact between the heat pipe and the central processing unit 3a may be incomplete. … In view of this, in order to improve and solve the above-mentioned shortcomings, the author has devoted himself to researching and cooperating with the application of theories, and finally proposed a rationally designed and effective improvement of the above-mentioned shortcomings. [New content] The main purpose of this creation is to provide an improved support structure for a flat-type heat pipe, which is to increase the joint strength between the support and the upper and lower covers, so that the heat pipe can more easily maintain the shell during the vacuuming operation. The flatness of the external surface at the same time can also prevent the expansion of the heat pipe due to the vapor pressure during the phase change process to achieve the effects of anti-tension and deformation. In order to achieve the above object, the present invention provides an improved support structure of a flat-type heat pipe, which includes a shell and a supporting body cooperatingly disposed inside the shell; wherein the shell is a closed inner shell, The cover comprises an upper cover and a lower cover which are closed with each other, so that the upper and lower covers are closed and located in the hollow space inside the casing and filled with working fluid, and the support is a plate-shaped body with a plurality of hollowed-out areas. It is combined between the upper and lower covers by the powder sintering method, and it is located in the ^ bismuth body empty space in accordance with the corresponding; by this, the shell and the support body can be combined ^ Enhance the bonding strength between the support and the upper and lower covers. Warfare [Implementation]

M245479M245479

四、創作說明(3) 為了使貴審查委貝能更進一步瞭解本創作之特徵及 技術内容,請參閱以下有關本創作之詳細說明與附圖,缺 而所附圖式僅提供參考與說明用,並非用來對本創作加二 請參閱第三圖、第四圖及第五圖,係分別為本創作 立體分解圖、俯視剖視圖及第四圖之5_5斷面剖視圖。 創作係提供一種平板式熱管之支撐結構改良,包括一殼 1以及一配合設於該殼體丨内部之支撐體2 ;其中: 該殼體1係為一内部中空之封閉殼體,其包含一上叢 10與一下蓋11,該上、下蓋10、u皆以導熱性良好之材質 所^,如銅等,且該上、下蓋丨〇、丨丨係彼此相對並相互 緊#蓋合’以於二者之間形成一封閉且位於該殼體1内部 之中空容室12,並填充有適量之工作流體(圖略)。 人該支撐體2係為一具有複數鏤空區之板狀體,其係配 合對應上述殼體1而設於該殼體1之中空容室12内,且該支 撐體2係以粉末冶金之燒結方式結合於該殼體1上、下蓋j 〇 、11之間’以令殼體1與支撐體2結合成為一體,而能增強 支撐體2與上、下蓋1 0、11間之接合強度;此外,如第四 圖所不’在本創作所舉之實施例中,該支撐體2之鏤空區 包含至少一第一鏤空區21、以及複數第二鏤空區22與第三 鎮空區23,其中之第一鏤空區21係位於支撐體2之中央部 位’而各第二鏤空區22則分佈於該第一鏤空區2丨周緣,並 延伸至該支撐體2近外緣處,最後之各第三鏤空區23係分 佈於各第二鏤空區22之間,同時,各該第一、二及三鏤空Fourth, the creation description (3) In order to allow your review committee to better understand the characteristics and technical content of this creation, please refer to the following detailed descriptions and drawings of this creation. The drawings are for reference and explanation only. It is not intended to add two to this creation. Please refer to the third, fourth, and fifth drawings, which are respectively a three-dimensional exploded view, a top cross-sectional view, and a 5_5 cross-sectional view of the fourth drawing. The creation system provides an improved support structure for a flat-type heat pipe, including a shell 1 and a support body 2 provided inside the shell; wherein: the shell 1 is a closed inner shell, which includes a Upper cover 10 and lower cover 11, the upper and lower covers 10, u are made of materials with good thermal conductivity, such as copper, etc., and the upper and lower covers 丨 〇, 丨 丨 are opposite to each other and tightly each other # 盖 合'As a result, a closed hollow space 12 is formed between the two, and is filled with an appropriate amount of working fluid (not shown). The support body 2 is a plate-shaped body having a plurality of hollowed-out areas, which is arranged in the hollow volume 12 of the housing 1 corresponding to the above-mentioned shell 1, and the support body 2 is sintered by powder metallurgy. The method is combined between the upper and lower covers j 0 and 11 of the casing 1 to combine the housing 1 and the support body 2 into one body, thereby enhancing the joint strength between the support body 2 and the upper and lower covers 10 and 11. In addition, as shown in the fourth figure, in the embodiment cited in this creation, the hollowed-out area of the support 2 includes at least a first hollowed-out area 21, a plurality of second hollowed-out areas 22, and a third town hollowed-out area 23 Among them, the first hollowed-out area 21 is located at the center of the support 2 and each second hollowed-out area 22 is distributed on the periphery of the first hollowed-out area 2 and extends to the near outer edge of the support 2. Each of the third hollowed-out areas 23 is distributed between the second hollowed-out areas 22, and at the same time, each of the first, second, and third hollowed-out areas

M245479 9、創作說明(4) 區21、22、23之間係彼 肋條24上穿設有可供工 體可,各第一、二及三 &gt;是以,藉由上述之 熱管之支撐結構改良。 據此,如第六圖所 之燒結方式所製成,故 而能供工作流體於相變 通;再者,又因該支撐 、11之間,藉此而得以 ’並使熱管於抽真空作 之壁厚平整度,以令熱 器4接觸時,能較近似 之散熱霄(圖略)作平 同時,請一併參閱 ’係於中央處理器4 等 之中央部位所吸收時, 相變化而遍佈上蓋1 〇内 1 0外側上方處之散熱器 而回復成液態後,再經 道25流至第二鏤空區22 肋條24上之通道25,以 ,藉以不斷地循環而達 綜上所述,本創作 由 示 其為一 化時, 體2以 透過該 業中更 管之外 面與面 補,進 第四圖 電子發 使工作 壁處, 3所吸 由第三 ’抑或 令工作 到熱傳 實為不 此間隔設置而形成有肋條24,且各 作流體流過之通道2 5,以令工作流 鏤空區21、22、23之間互通。 構造組成’即可得到本創作平板式 於該支撐體2係以粉末冶金 具有多孔性結構之特性者, 在該殼體1之各鏤空區間流 燒結方式結合於上、下蓋1 〇 支撐體2來增加殼體1之強度 容易維持該上、下蓋J i i 表面與散熱器3或中央處理 之接觸,而僅需藉由極少量 而維持良好的散熱效果。 所示’本創作於熱傳過程中 f70件所產生之熱量為熱管 流體於第一鏤空區2 1内產生 如此’熱量即被貼附於上蓋 收’以使工作流體冷卻凝結 鏤空區23之各肋條24上的通 直接透過第二鏤空區22導入 流體流回至第一鏤空區21處 及散熱之目的。 可多得之新型創作產品,其M245479 9. Creation instructions (4) Between zones 21, 22, and 23, ribs 24 are provided on the ribs 24 for workers, each of the first, second, and third &gt; Yes, with the support structure of the above heat pipe Improvement. According to this, it is made by the sintering method as shown in the sixth figure, so that the working fluid can be changed in the phase. Furthermore, because of the support and the 11, the heat pipe can be evacuated. Thick flatness, so that when the heater 4 is in contact, it can be leveled more similarly (the figure is omitted). At the same time, please also refer to 'When it is absorbed by the central part of the central processing unit 4, etc., the phase changes and spreads over the cover. After the radiator at the upper side of the inside of 10 is restored to a liquid state, it flows through the channel 25 to the channel 25 on the second hollowed-out area 22 on the rib 24, so as to continuously circulate to achieve the above-mentioned summary. This creation When it is shown as a normalization, the body 2 passes through the outer tube and the surface of the industry, and enters the fourth picture to send the electronic work to the working wall. The 3 is absorbed from the third or the work to the heat transfer. The ribs 24 are formed at this interval, and each of the channels 25 through which the fluid flows is formed, so that the workflow hollowed-out areas 21, 22, and 23 communicate with each other. Structural composition 'can be obtained by the creation of the flat plate on the support 2 is a powder metallurgy with a porous structure, the flow sintering method in each hollow section of the shell 1 is combined with the upper and lower covers 1 〇 support 2 To increase the strength of the casing 1, it is easy to maintain the surface of the upper and lower covers J ii in contact with the heat sink 3 or the central processing, and only a small amount is required to maintain a good heat dissipation effect. Shown 'The heat generated by f70 pieces during the heat transfer process is the heat pipe fluid generated in the first hollowed area 21 so that the' heat is attached to the upper cover and closed 'to make the working fluid cool and condense each of the hollowed area 23 The through holes on the ribs 24 directly introduce the fluid through the second hollowed area 22 to flow back to the first hollowed area 21 and for the purpose of heat dissipation. A great new creative product, which

第9頁 M245479 四、創作說明(5) - 確可達到預期之使用目的,而解決習知之缺失,又因極且 新穎性及進步性,完全符合新型專利申請要件,爰依專&amp; 出申請,敬請詳查並賜准本案專利,以保障創作人 權利。 惟以上所述僅為本創作之姑 :限本創作之專利範圍,:仃實施例,:因此即 内容所為之等效結構變化,·二;;運用本創作說明書及圖式 内,合予陳明。 =同理皆包含於本創作之範圍 M245479 圖式簡單說明 【圖式簡單說明】 第一圖 係習知平板式熱管之使用狀態示意圖。 第二圖 係第一圖之A部份放大詳圖。 第三圖 係本創作之立體分解圖。 第四圖 係本創作之俯視剖視圖。 第五圖 係第四圖之5-5斷面剖視圖。 第六圖 係本創作之使用狀態示意圖。Page 9 M245479 IV. Creation Instructions (5)-It can indeed achieve the intended use, and solve the lack of knowledge, and because it is extremely novel and progressive, it fully meets the requirements for new patent applications. , Please check and grant the patent in this case to protect the rights of the creator. However, the above is only the guilty of this creation: the scope of patents that limit this creation: 仃 Examples: Therefore, the equivalent structural changes that the content does, ·; Bright. = The same reason is included in the scope of this creation. M245479 Simple illustration of the drawing [Simplified illustration of the drawing] The first picture is a schematic diagram of the state of use of the conventional flat heat pipe. The second picture is an enlarged detailed view of part A of the first picture. The third picture is a three-dimensional exploded view of this creation. The fourth figure is a top sectional view of this creation. The fifth figure is a sectional view taken along the 5-5 section of the fourth figure. The sixth figure is a schematic diagram of the use status of this creation.

第11頁 件代表符號〕 &lt;習知&gt; 熱管 1 a 殼體 10a 上蓋 11a 下蓋 12a 中空容室 13a 毛細組織 14a 支撐體 15a 散熱器 2a 中央處理器 3a &lt;本創作&gt; 殼體 1 上蓋 10 下蓋 11 中空容室 12 M245479 圖式簡單說明 支撐體 2 第一鏤空區 21 第二鏤3 ^區 22 第三鏤空區 23 肋條 24 通道 25 散熱器 3 中央處理器 4 第12頁Representative symbols on page 11] &lt; Knowledge &gt; Heat pipe 1 a Housing 10a Upper cover 11a Lower cover 12a Hollow container 13a Capillary tissue 14a Support body 15a Radiator 2a Central processor 3a &lt; This creation &gt; Housing 1 Upper cover 10 Lower cover 11 Hollow container 12 M245479 Brief description of the support 2 First hollow area 21 Second hollow 3 ^ area 22 Third hollow area 23 Ribs 24 Channel 25 Radiator 3 CPU 4 Page 12

IIII

Claims (1)

M245479 五、申請專利範圍 一殼體 上蓋與一 一種平板式熱管 為一内部中 以於該 下蓋, 該殼體内部之中空 一支撐 末冶金之燒 對應而位於 2、 如 結構改良, 互通。 3、 如 結構改良, 、以及複數 三鏤空區係 4 、如 結構改良, ’各該第二 該支撐體近 空區之間, 置而形成有 該第一、二 體,為 結方式 該殼體 申請專 其中該 申請專 其中該 第二鏤 分佈於 申請專 其中該 鏤空區 外緣處 且各該 肋條, 及三鏤 容室, 一具有 結合於 之中空 利範圍 支撐體 利範圍 支撐體 空區與 該支撐 利範圍 第一鏤 則分佈 ,另該 第一、 並於各 空區之 之支撐結構改良,' t ^ 民包括: 空之封閉殼體,為人 务 u ^ .. 包含相互蓋合之 上、下蓋之間形古、 ,古士士 心成—封閉且位於 並填充有工作流靜 及 複數鏤空區之此&amp; 該殼體之上、^體’其係以粉 容室内。 盍之間,並配合 第1項所述之伞4 卞板式敎管之支禮 之各該鏤空區之門:、、、二之叉捉 &lt;間係設有通道而 第1項 之鏤空 第三鏤 體之各 第3項 空區係 於該第 等第三 二及三 該肋條 間互$ 所述之 區包含 空區, 部位處 所述之 位於該 一鏤空 鏤空區 鏤空區 上係穿 平板式熱管之支撐 至少一第一鏤空區 且該等第一、二及 〇 平板式熱管之支撐 支撐體之中央部位 區周緣,並延伸至 分佈於各該第二鏤 之間係彼此間隔設 設有通道,以令各M245479 5. Scope of patent application The upper cover of a casing and a flat-type heat pipe are internal to the lower cover. The interior of the casing is hollow and supported by metallurgical burners. It is located in 2. If the structure is improved, they can communicate with each other. 3. If the structure is improved, and a plurality of hollowed-out areas 4, if the structure is improved, 'the first and second bodies are formed between the second and the near-empty areas of the support body, and the shell is a knot-type shell. The application form includes the application form wherein the second cutout is distributed at the outer edge of the application form and each of the ribs, and three cutout chambers, one has a hollow body supporting area and a hollow body supporting area. The first frame is distributed with the support range, and the first, and the support structure in each empty area is improved. The 't ^ min includes: an empty closed shell for human affairs u ^ .. includes mutual cover The upper and lower covers are shaped anciently, and the ancient scholars are heart-closed and located and filled with the quiet and plural hollowed-out areas of the workflow. The upper body of the shell is enclosed in a powder container. Between the cymbals, and in cooperation with the umbrella described in item 1, each of the hollowed-out areas of the door of the slab-shaped stern tube: ,,, and the fork of the two &#; there are passages and the hollowed out item of the first Each of the three hollow spaces of the three hollow bodies is between the third and second ribs. The areas described above include hollow areas, and the flats are located on the hollow areas of the one hollowed out area. Type heat pipe supports at least one first hollowed-out area and the peripheral edge of the central part of the support body of the first, second and zero flat-type heat pipes, and extends to be distributed between each of the second hollowed-out spaces. Channel to make each $ 13頁$ 13 pages
TW92217637U 2003-10-01 2003-10-01 Improved supporting structure of tablet type heat pipe TWM245479U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW92217637U TWM245479U (en) 2003-10-01 2003-10-01 Improved supporting structure of tablet type heat pipe
JP2004050382A JP4095969B2 (en) 2003-10-01 2004-02-25 Support structure for flat plate heat pipe
DE200420007195 DE202004007195U1 (en) 2003-10-01 2004-05-06 Connection construction of a heat conducting plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92217637U TWM245479U (en) 2003-10-01 2003-10-01 Improved supporting structure of tablet type heat pipe

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DE (1) DE202004007195U1 (en)
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
US8534348B2 (en) 2005-09-01 2013-09-17 Molex Incorporated Heat pipe and method for manufacturing same
EP1930682A4 (en) * 2005-09-01 2011-04-06 Fuchigami Micro Co Heat pipe and method of manufacturing the same
DE202007007568U1 (en) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington A flat heatpipe (heat pipe) and heat sink using them
DE102010013734A1 (en) * 2010-03-31 2011-10-06 Siemens Aktiengesellschaft Device for cooling and method for its production
CN101846471B (en) * 2010-05-15 2012-10-17 中山伟强科技有限公司 Soaking plate
CN113983841A (en) * 2021-11-25 2022-01-28 福建强纶新材料股份有限公司 Novel heat pipe and manufacturing process thereof

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DE202004007195U1 (en) 2004-09-16
JP2005106451A (en) 2005-04-21
JP4095969B2 (en) 2008-06-04

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