WO2011118905A3 - 스마트 카드 제조방법 - Google Patents

스마트 카드 제조방법 Download PDF

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Publication number
WO2011118905A3
WO2011118905A3 PCT/KR2010/009429 KR2010009429W WO2011118905A3 WO 2011118905 A3 WO2011118905 A3 WO 2011118905A3 KR 2010009429 W KR2010009429 W KR 2010009429W WO 2011118905 A3 WO2011118905 A3 WO 2011118905A3
Authority
WO
WIPO (PCT)
Prior art keywords
antenna coil
sheet
chip
board
positioning hole
Prior art date
Application number
PCT/KR2010/009429
Other languages
English (en)
French (fr)
Other versions
WO2011118905A2 (ko
Inventor
진영범
김선희
노재승
류석훈
Original Assignee
금오공과대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금오공과대학교 산학협력단 filed Critical 금오공과대학교 산학협력단
Publication of WO2011118905A2 publication Critical patent/WO2011118905A2/ko
Publication of WO2011118905A3 publication Critical patent/WO2011118905A3/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

스마트 카드 제조방법을 제공한다. 본 발명은 접속단자(154)를 갖는 보드(153)에 칩(151)이 탑재된 COB모듈(150)을 구비하는 스마트 카드(100)를 제조하는 방법에 있어서, 일 측면에 가장자리를 따라 일정길이의 안테나 코일(131)을 루프형태로 배선하고, 상기 COB모듈(150)의 칩(151)이 배치되는 칩배치공(132)을 관통형성한 안테나코일 시트(130)를 제공하는 단계; 상기 칩배치공(132)에 인접하도록 상기 안테나코일 시트(130)의 일측면에 배치된 안테나 코일(131)의 안테나 단자(134)에 도전성 접착제(B)를 디스펜싱한 다음 상기 칩배치공(132)에 칩(151)을 삽입배치하면서 상기 도전성 접착제(B)를 매개로 상기 안테나 코일(131)의 안테나 단자(134)와 상기 보드(153)의 접속단자(154)를 접속하는 단계; 상기 COB모듈(150)의 보드(153)가 삽입배치되는 보드배치공(122)을 관통형성한 모듈시트(120)를 안테나코일 시트(130)에 적층하는 단계; 및 상기 모듈시트(120)의 외부면에 제1외부시트(110)를 적층하고, 상기 안테나코일(130)의 외부면에 제2외부시트(140)를 적층하는 단계를 포함한다.
PCT/KR2010/009429 2010-03-25 2010-12-28 스마트 카드 제조방법 WO2011118905A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100026770A KR100987250B1 (ko) 2010-03-25 2010-03-25 스마트 카드 제조방법
KR10-2010-0026770 2010-03-25

Publications (2)

Publication Number Publication Date
WO2011118905A2 WO2011118905A2 (ko) 2011-09-29
WO2011118905A3 true WO2011118905A3 (ko) 2011-11-17

Family

ID=43135366

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/009429 WO2011118905A2 (ko) 2010-03-25 2010-12-28 스마트 카드 제조방법

Country Status (3)

Country Link
KR (1) KR100987250B1 (ko)
MY (1) MY160238A (ko)
WO (1) WO2011118905A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101249137B1 (ko) * 2011-11-30 2013-04-01 김선희 콤비카드 제조방법
KR101904257B1 (ko) * 2016-10-28 2018-10-04 주식회사 아이씨케이 입출력 소자를 갖는 카드의 제조 방법
WO2019068068A1 (en) * 2017-09-29 2019-04-04 Avery Dennison Retail Information Services, Llc STRAP MOUNTING TECHNIQUES FOR WIRED FORMAT ANTENNAS

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002312749A (ja) * 2001-04-16 2002-10-25 Nec Tokin Corp コンビ型ｉｃカードの製造方法
KR100363657B1 (ko) * 1999-09-10 2002-12-12 주식회사 쓰리비 시스템 집적회로칩카드 및 이의 제조방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100412930B1 (ko) 2001-05-09 2003-12-31 전경호 콤비카드의 루프코일 접점구조 및 그 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100363657B1 (ko) * 1999-09-10 2002-12-12 주식회사 쓰리비 시스템 집적회로칩카드 및 이의 제조방법
JP2002312749A (ja) * 2001-04-16 2002-10-25 Nec Tokin Corp コンビ型ｉｃカードの製造方法

Also Published As

Publication number Publication date
WO2011118905A2 (ko) 2011-09-29
KR100987250B1 (ko) 2010-10-12
MY160238A (en) 2017-02-28

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