MY160238A - Method of manufacturing smart card - Google Patents
Method of manufacturing smart cardInfo
- Publication number
- MY160238A MY160238A MYPI2011001313A MYPI2011001313A MY160238A MY 160238 A MY160238 A MY 160238A MY PI2011001313 A MYPI2011001313 A MY PI2011001313A MY PI2011001313 A MYPI2011001313 A MY PI2011001313A MY 160238 A MY160238 A MY 160238A
- Authority
- MY
- Malaysia
- Prior art keywords
- sheet
- antenna coil
- chip
- board
- accommodation hole
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
THE INVENTION RELATES TO A METHOD OF MANUFACTURING A SMART CARD (100) COMPRISING A CHIP ON BOARD (COB) MODULE (150) INCLUDING A CHIP (151) MOUNTED ON A BOARD (153) HAVING CONNECTION TERMINALS (154) .THE METHOD COMPRISES PROVIDING AN ANTENNA COIL SHEET (130) BY DISPOSING AN ANTENNA COIL (131) HAVING A PREDETERMINED LENGTH IN A LOOP ALONG AN EDGE PORTION OF AN EXTERNAL SURFACE OF THE ANTENNA COIL SHEET (130), AND FORMING A CHIP ACCOMMODATION HOLE (132) FOR ACCOMMODATING THE CHIP (151) OF THE COB MODULE (150); DISPENSING CONDUCTIVE ADHESIVES B TO AN ANTENNA TERMINAL (134) OF THE ANTENNA COIL (131) DISPOSED ON THE EXTERNAL SURFACE OF THE ANTENNA COIL SHEET (130) SO AS TO BE ADJACENT TO THE CHIP ACCOMMODATION HOLE (132), AND THEN CONNECTING THE ANTENNA TERMINAL (134) OF THE ANTENNA COIL (131) AND A CONNECTION TERMINAL (154) OF THE BOARD (153) BY USING THE CONDUCTIVE ADHESIVES AS AN AGENT WHILE INSERTING HE CHIP (151) INTO THE CHIP ACCOMMODATION HOLE (132); STACKING ON A MODULE SHEET (120) THROUGH WHICH A BOARD ACCOMMODATION HOLE (122) IS FORMED ON THE ANTENNA COIL SHEET 130, WHEREIN THE BOARD 153 OF THE COB MODULE 150 IS INSERTED INTO THE BOARD ACCOMMODATION HOLE (122); AND STACKING A FIRST EXTERNAL SHEET (110) ON AN EXTERNAL SURFACE OF THE MODULE SHEET (120), AND STACKING A SECOND EXTERNAL SHEET (140) ON AN EXTERNAL SURFACE OF THE ANTENNA COIL SHEET (130).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100026770A KR100987250B1 (en) | 2010-03-25 | 2010-03-25 | Method for fabricating a smart card |
Publications (1)
Publication Number | Publication Date |
---|---|
MY160238A true MY160238A (en) | 2017-02-28 |
Family
ID=43135366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2011001313A MY160238A (en) | 2010-03-25 | 2011-03-24 | Method of manufacturing smart card |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100987250B1 (en) |
MY (1) | MY160238A (en) |
WO (1) | WO2011118905A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101249137B1 (en) * | 2011-11-30 | 2013-04-01 | 김선희 | Method for fabricating the combi card |
KR101904257B1 (en) * | 2016-10-28 | 2018-10-04 | 주식회사 아이씨케이 | A method for fabrication of a card having input/output device |
EP4092575A1 (en) * | 2017-09-29 | 2022-11-23 | Avery Dennison Retail Information Services LLC | Strap mounting techniques for wire format antennas |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100363657B1 (en) * | 1999-09-10 | 2002-12-12 | 주식회사 쓰리비 시스템 | Ic card and manufacturing method for ic card |
JP2002312749A (en) * | 2001-04-16 | 2002-10-25 | Nec Tokin Corp | Method for manufacturing combination type ic card |
KR100412930B1 (en) | 2001-05-09 | 2003-12-31 | 전경호 | loop coil contact structure and manufacturing process for combination IC card |
-
2010
- 2010-03-25 KR KR1020100026770A patent/KR100987250B1/en active IP Right Grant
- 2010-12-28 WO PCT/KR2010/009429 patent/WO2011118905A2/en active Application Filing
-
2011
- 2011-03-24 MY MYPI2011001313A patent/MY160238A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2011118905A3 (en) | 2011-11-17 |
KR100987250B1 (en) | 2010-10-12 |
WO2011118905A2 (en) | 2011-09-29 |
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