WO2011105141A1 - Composant électroluminescent organique et procédé de fabrication - Google Patents

Composant électroluminescent organique et procédé de fabrication Download PDF

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Publication number
WO2011105141A1
WO2011105141A1 PCT/JP2011/051079 JP2011051079W WO2011105141A1 WO 2011105141 A1 WO2011105141 A1 WO 2011105141A1 JP 2011051079 W JP2011051079 W JP 2011051079W WO 2011105141 A1 WO2011105141 A1 WO 2011105141A1
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electrode
organic
layer
flexible
silver
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PCT/JP2011/051079
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English (en)
Japanese (ja)
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雄史 小野
邦雅 檜山
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コニカミノルタホールディングス株式会社
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Priority to JP2012501703A priority Critical patent/JP5960047B2/ja
Publication of WO2011105141A1 publication Critical patent/WO2011105141A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/826—Multilayers, e.g. opaque multilayers

Definitions

  • the present invention relates to an organic electroluminescence device and a method for producing the same, and more specifically, a flexible organic electroluminescence device having high luminous efficiency, long life, excellent storage stability at high temperature, and excellent driving stability during bending, and It relates to the manufacturing method.
  • EL devices electroluminescent devices
  • inorganic electroluminescent elements hereinafter referred to as “inorganic EL elements”
  • organic electroluminescent elements hereinafter referred to as “organic EL elements”
  • the inorganic EL element generally applies a high electric field to the light emitting portion, accelerates electrons in the high electric field to collide with the light emission center, thereby exciting the light emission center to emit light.
  • the organic EL element injects electrons and holes from the electron injection electrode and the hole injection electrode, respectively, into the light emitting layer, and combines the injected electrons and holes in the light emitting layer.
  • Light is emitted when the organic material returns to the ground state from the excited state in the excited state, and there is an advantage that it can be driven at a lower voltage than the inorganic EL element. Taking advantage of the fact that it emits light on its surface, it is expected as a thin display and lighting application. In particular, development of flexible organic EL elements suitable for mass production is expected.
  • Organic EL elements are weak against moisture and oxygen and are generally sealed for the purpose of preventing them from moisture and oxygen. Sealing is classified into casing type sealing (can sealing) and close contact type sealing (solid sealing), but solid sealing is preferable from the viewpoint of thinning. Moreover, when producing a flexible organic EL element, since sealing is also required for the sealing member, solid sealing is preferable.
  • Solid sealing is gaining sufficient sealing performance due to technological advances.
  • can sealing makes it easy to put a desiccant
  • solid sealing makes it difficult.
  • the actual situation is that the influence of moisture is greater than that in can sealing.
  • the difference in sealing performance becomes large during high temperature storage or high temperature high humidity storage.
  • the reflectivity of the reflective electrode is better.
  • a light extraction member such as a light diffusion sheet or a microlens sheet
  • the reflectance of the reflective electrode is high, it is effective for improving the light emission efficiency.
  • a common reflective electrode is aluminum.
  • Silver is an example of a higher reflectivity material than aluminum, but silver is known to be largely affected by deterioration factors such as water, oxygen, or heat and lack stability. In particular, ion migration may occur due to moisture, and silver may diffuse into the organic layer, resulting in a short circuit. Therefore, an organic EL element using silver instead of aluminum is required to have a high level of sealing performance.
  • Patent Document 1 describes that when an active metal such as moisture or oxygen is used as an electrode material, a cap layer that protects the metal is laminated. However, when a flexible substrate is used, driving when bending is performed. It was found that the stability was low.
  • the present invention has been made in view of the above problems, and its purpose is to provide a flexible organic electroluminescence device having high luminous efficiency, long life, excellent high-temperature storage stability, and excellent driving stability during bending. Is to provide.
  • organic electroluminescence element having a first electrode, an organic compound layer including at least one light emitting layer made of an organic compound, a second electrode, and a flexible sealing member in this order on a flexible support substrate, An organic electroluminescence element having a heat conductive layer and a sealing adhesive in this order between two electrodes and the flexible sealing member and sealed tightly, wherein the second electrode is made of silver or silver
  • organic electroluminescence element characterized by being a silver alloy having a main component.
  • the organic electroluminescent element which has a 1st electrode, the organic compound layer which contains at least 1 light emitting layer which consists of an organic compound, a 2nd electrode, and the flexible sealing member in this order on a flexible support substrate.
  • the organic electroluminescence device is disposed between the second electrode and the flexible sealing member in this order, and a heat conductive layer and a sealing adhesive are arranged in this order, and the sealing adhesive is used for tightly sealing.
  • the said 2nd electrode is silver or the silver alloy which has silver as a main component, The manufacturing method of the organic electroluminescent element characterized by the above-mentioned.
  • FIG. 1 A cross-sectional schematic diagram showing a configuration of an organic electroluminescence element having a first electrode, an organic compound layer, a second electrode, a heat conductive layer, a sealing adhesive, and a flexible sealing member in this order on a flexible support substrate.
  • FIG. 1 A cross-sectional schematic diagram showing a configuration of an organic electroluminescence element having a first electrode, an organic compound layer, a second electrode, a heat conductive layer, a sealing adhesive, and a flexible sealing member in this order on a flexible support substrate.
  • the present inventors have made a second electrode.
  • a heat conductive layer and a sealing adhesive between the flexible sealing member and the flexible sealing member it is possible to improve luminous efficiency using silver or silver alloy electrodes while satisfying high temperature storage stability and driving stability.
  • the inventors have found out that the present invention can be achieved.
  • a heat conductive layer having a high thermal conductivity is laminated on the second electrode, and heat dissipation is promoted, so that the temperature rise of the organic EL element is alleviated and silver diffusion is suppressed. Further, the diffusion of silver is suppressed by the heat conduction layer mitigating the influence of the residual moisture of the sealing adhesive. Furthermore, it has been found that the driving stability at the time of bending is improved by adopting this configuration.
  • FIG. 1 is a schematic cross-sectional view showing the configuration of the organic EL device of the present invention.
  • the organic EL device of the present invention includes a first electrode 2, an organic compound layer 3 including at least one light emitting layer made of an organic compound, a second electrode 4, a heat conductive layer 5, a sealing, on a flexible support substrate 1. Adhesive 6 and flexible sealing member 7 in this order.
  • the flexible support substrate according to the present invention is not particularly limited as long as it has flexibility, and it may be transparent or opaque.
  • the opaque flexible support substrate examples include metal plates / films such as aluminum and stainless steel, opaque resin substrates, ceramic substrates, and the like.
  • the substrate When extracting light from the flexible support substrate side, the substrate is preferably transparent.
  • the transparent substrate preferably used include flexible thin film glass and transparent resin film.
  • a particularly preferred substrate is a resin film.
  • polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane, cellulose diacetate, cellulose triacetate, cellulose acetate butyrate, cellulose acetate propionate (CAP), Cellulose esters such as cellulose acetate phthalate (TAC) and cellulose nitrate or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate, norbornene resin, polymethylpentene, polyether ketone, polyimide , Polyethersulfone (PES), polyphenylene sulfide, polysulfone , Polyether imide, polyether ketone imide, polyamide, fluororesin, nylon, polymethyl methacrylate, acrylic or polyarylate, cycloolefin resin such as Arton (manufactured by JSR) or
  • an inorganic film, an organic film, or a hybrid film of both may be formed on the surface of the resin film.
  • Water vapor permeability 25 ⁇ 0.5 ° C., measured by a method according to JIS K 7129-1992
  • the relative humidity (90 ⁇ 2)% RH) is a barrier film of 1 ⁇ 10 ⁇ 3 g / (m 2 ⁇ 24 h) or less, and further measured by a method according to JIS K 7126-1987.
  • the oxygen permeability is 1 ⁇ 10 ⁇ 3 ml / (m 2 ⁇ 24 h ⁇ atm) or less, and the water vapor permeability (25 ⁇ 0.5 ° C., relative humidity (90 ⁇ 2)% RH) is 1 ⁇ 10 ⁇
  • a high barrier film of 3 g / (m 2 ⁇ 24 h) or less is preferable.
  • the material for forming the barrier film formed on the surface of the resin film may be any material that has a function of suppressing intrusion of water or oxygen that causes panel deterioration. Silicon oxide, silicon dioxide, silicon nitride, or the like can be used. Further, in order to improve the brittleness of the film, it is more preferable to have a laminated structure of these inorganic layers and organic material layers. Although there is no restriction
  • the method for forming the barrier film is not particularly limited.
  • the vacuum deposition method, the sputtering method, the reactive sputtering method, the molecular beam epitaxy method, the cluster ion beam method, the ion plating method, the plasma polymerization method, the atmospheric pressure plasma weight A combination method, a plasma CVD method, a laser CVD method, a thermal CVD method, a coating method, and the like can be used, but an atmospheric pressure plasma polymerization method as described in JP-A-2004-68143 is particularly preferable.
  • first electrode an electrode material made of a metal, an alloy, an electrically conductive compound and a mixture thereof having a high work function (4 eV or more) is preferably used.
  • electrode materials include metals such as Au, and conductive transparent materials such as CuI, indium tin oxide (ITO), SnO 2 , and ZnO.
  • conductive transparent materials such as CuI, indium tin oxide (ITO), SnO 2 , and ZnO.
  • an amorphous material capable of forming a transparent conductive film such as IDIXO (In 2 O 3 —ZnO) may be used.
  • a thin film may be formed by depositing these electrode materials by a method such as vapor deposition or sputtering, and a pattern having a desired shape may be formed by a photolithography method, or when the pattern accuracy is not so high (100 ⁇ m As described above, a pattern may be formed through a mask having a desired shape when the electrode material is deposited or sputtered. Or when using the substance which can be apply
  • the sheet resistance as the first electrode is preferably several hundred ⁇ / ⁇ or less.
  • the film thickness depends on the material, it is usually selected in the range of 10 to 1000 nm, preferably 10 to 200 nm.
  • Organic compound layer in the present invention has a configuration in which functional layers made of various organic compounds, such as a hole injection / transport layer / light emitting layer / electron injection / transport layer, are laminated as necessary. Most simply, it has a structure consisting only of a light emitting layer.
  • Examples of organic compound materials used for the hole injection / transport layer include phthalocyanine derivatives, heterocyclic azoles, aromatic tertiary amines, polyvinyl carbazole, polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT: PSS), and the like.
  • a polymer material such as a conductive polymer is used.
  • Examples of the light emitting material or host compound used for the light emitting layer include carbazole-based materials such as 4,4′-dicarbazolylbiphenyl and 1,3-dicarbazolylbenzene, (di) azacarbazoles, Examples thereof include low molecular materials typified by pyrene-based materials such as 1,3,5-tripyrenylbenzene, and polymer materials typified by polyphenylene vinylenes, polyfluorenes, polyvinyl carbazoles, and the like. Among these, a low molecular weight material having a molecular weight of 10,000 or less is preferably used as the light emitting material or the host compound.
  • the light emitting layer may contain about 0.1 to 20% by mass of a dopant compound.
  • the dopant compound include known fluorescent dyes such as perylene derivatives and pyrene derivatives, and phosphorescent dyes such as tris ( Complex compounds such as ortho-metalated iridium complexes represented by 2-phenylpyridine) iridium, bis (2-phenylpyridine) (acetylacetonato) iridium, bis (2,4-difluorophenylpyridine) (picolinato) iridium, etc. Can be mentioned.
  • Electrode injection / transport layer Examples of the electron injecting / transporting layer material include metal complex compounds such as 8-hydroxyquinolinate lithium and bis (8-hydroxyquinolinato) zinc, and the following nitrogen-containing five-membered ring derivatives. That is, oxazole, thiazole, oxadiazole, thiadiazole or triazole derivatives are preferred.
  • each functional layer As the organic compound material used for these light emitting layers and each functional layer, a material having a polymerization reactive group such as a vinyl group in the molecule is used, and a cross-linked / polymerized film is formed after film formation to form each functional layer. May be.
  • an injection layer may be formed between the electrode and the organic layer in order to reduce the drive voltage and improve the light emission luminance as necessary.
  • the injection layer includes a hole injection layer (anode buffer layer) and a cathode buffer layer (electron injection layer).
  • phthalocyanine buffer layer typified by copper phthalocyanine
  • oxide buffer layer typified by vanadium oxide
  • amorphous carbon buffer layer typified by vanadium oxide
  • polyaniline (emeraldine) polythiophene, etc.
  • examples thereof include a polymer buffer layer using molecules.
  • the cathode buffer layer is a metal buffer layer typified by strontium, aluminum, calcium or magnesium, an alkali metal compound buffer layer typified by lithium fluoride, or an alkaline earth metal typified by magnesium fluoride. Examples thereof include a compound buffer layer and an oxide buffer layer typified by aluminum oxide.
  • the buffer layer (injection layer) is preferably a very thin film, and the film thickness is preferably in the range of 0.1 to 5 nm, depending on the material.
  • the injection layer may be a single layer or a plurality of layers.
  • the injection layer adjacent to the second electrode is preferably a metal buffer layer, more preferably calcium or magnesium, and still more preferably calcium.
  • each functional layer may be formed by a vacuum method, a dry method such as a sputtering method, or may be formed by a wet method such as a coating method or a printing method.
  • the second electrode in the present invention is silver or a silver alloy containing silver as a main component, preferably silver or a silver alloy having a silver content of 90 atomic percent or more, and a silver content of 95 atomic percent or more. More preferably, it is an alloy.
  • the second electrode can be formed by a method such as vapor deposition or sputtering.
  • the heat conductive layer in the present invention is a layer having a heat conductivity larger than that of the sealing adhesive, preferably the heat conductivity is 1 W / (m ⁇ K) or more, more preferably 10 W / ( m ⁇ K) or more, more preferably 100 W / (m ⁇ K) or more.
  • the thermal conductivity of the heat conductive layer in the present invention is preferably 100 W / (m ⁇ K) or more higher than the heat conductivity of the sealing adhesive.
  • the material used for the heat conductive layer according to the present invention is a material containing a metal such as metal, metal oxide, or metal oxide, but is preferably a metal such as aluminum, copper, or gold, more preferably Aluminum.
  • the thickness of the heat conductive layer according to the present invention is 20 nm to 50 ⁇ m, preferably 50 nm to 1 ⁇ m, more preferably 100 nm to 500 nm.
  • the heat conductive layer according to the present invention may be a single layer or a multilayer structure of two or more layers.
  • the second electrode can be formed by a method such as vapor deposition or sputtering.
  • thermosetting adhesive an ultraviolet curable resin, or the like
  • a thermosetting adhesive such as an epoxy resin, an acrylic resin, or a silicone resin, more preferably moisture resistant. It is an epoxy thermosetting adhesive resin that is excellent in water resistance and water resistance and has little shrinkage during curing.
  • the water content of the sealing adhesive according to the present invention is preferably from 0.01 to 300 ppm, more preferably from 0.01 to 200 ppm, and most preferably from 0.01 to 100 ppm.
  • the moisture content may be measured by any method.
  • a volumetric moisture meter Karl Fischer
  • an infrared moisture meter a microwave transmission moisture meter
  • a heat-dry weight method e.g., a GC / MS, IR, DSC (Differential scanning calorimeter) and TDS (temperature programmed desorption analysis).
  • a precision moisture meter AVM-3000 manufactured by Omnitech or the like, moisture can be measured from a pressure increase caused by evaporation of moisture, and moisture content of a film or solid film can be measured.
  • the water content of the sealing adhesive can be adjusted by, for example, placing it in a nitrogen atmosphere with a dew point temperature of ⁇ 80 ° C. or lower and an oxygen concentration of 1 ppm or lower and changing the time. Further, it can be dried in a vacuum state of 100 Pa or less while changing the time. Further, the sealing adhesive can be dried only with an adhesive, but can also be placed in advance on a flexible sealing member and dried.
  • the flexible sealing member examples include stainless steel, aluminum, magnesium alloy and other metals, polyethylene terephthalate, polycarbonate, polystyrene, nylon, polyvinyl chloride, and the like, and composites thereof, glass and the like.
  • gas barrier layers such as aluminum, aluminum oxide, silicon oxide, and silicon nitride as in the case of the flexible support substrate.
  • the gas barrier layer can be formed by sputtering, vapor deposition or the like on both sides or one side of the flexible sealing member before molding the flexible sealing member, or after sealing, the gas barrier layer can be formed on the both sides or one side of the sealing member by the same method. May be formed.
  • the oxygen permeability is 1 ⁇ 10 ⁇ 3 ml / (m 2 ⁇ 24 h ⁇ atm) or less
  • the water vapor permeability (25 ⁇ 0.5 ° C., relative humidity (90 ⁇ 2)% RH) is 1 ⁇ It is preferably 10 ⁇ 3 g / (m 2 ⁇ 24 h) or less.
  • the flexible sealing member may be a film laminated with a metal foil such as aluminum.
  • a method for laminating the polymer film on one side of the metal foil a generally used laminating machine can be used.
  • the adhesive polyurethane-based, polyester-based, epoxy-based, acrylic-based adhesives and the like can be used. You may use a hardening
  • a hot melt lamination method, an extrusion lamination method and a coextrusion lamination method can also be used, but a dry lamination method is preferred.
  • the metal foil is formed by sputtering or vapor deposition, or is formed from a fluid electrode material such as a conductive paste
  • the polymer foil is used as a base material and the metal foil is formed on the substrate. May be.
  • the flexible sealing member for example, a 50 ⁇ m thick PET (polyethylene terephthalate) laminated with an aluminum foil (30 ⁇ m thick) is used. Using this as a flexible sealing member, it is uniformly applied to the aluminum surface using a dispenser, a sealing adhesive is placed in advance, the resin substrate 1 and the sealing member 5 are aligned, and then both are crimped together. (0.1 to 3 MPa), tightly bonded and bonded (adhered) at a temperature of 80 to 180 ° C., and tightly sealed (solid sealed).
  • Heating or pressure bonding time varies depending on the type, amount, and area of the sealing adhesive, but temporary bonding is performed at a pressure of 0.1 to 3 MPa, and the heat curing time is 5 seconds to 10 minutes at a temperature of 80 to 180 ° C. Select within the range.
  • a heated pressure-bonding roll because pressure bonding (temporary bonding) and heating can be performed simultaneously, and internal voids can be eliminated at the same time.
  • a dispenser a coating method such as roll coating, spin coating, screen printing method, spray coating, or the like can be used depending on the material.
  • Solid sealing is a form of covering with a cured resin with no space between the flexible sealing member and the organic EL element substrate as described above.
  • Light extraction member In the present invention, it is preferable to have a light extraction member between the flexible support substrate and the second electrode or on the opposite side of the flexible support substrate from the first electrode.
  • Examples of the light extraction member used in the present invention include a prism sheet, a lens sheet, and a diffusion sheet. Further, a diffraction grating or a diffusion structure introduced into an interface that causes total reflection or any medium may be used.
  • an organic EL device that emits light from a flexible support substrate
  • a part of the light emitted from the light emitting layer causes total reflection at the interface between the flexible support substrate and air, and light is lost.
  • the surface of the flexible support substrate is processed into a prism or lens shape, or the prism sheet, the lens sheet, and the diffusion sheet are pasted on the surface of the flexible support substrate, whereby total reflection is achieved. To improve the light extraction efficiency.
  • a flexible film flexible support substrate
  • a polyethylene naphthalate film a film made by Teijin DuPont Co., Ltd., hereinafter abbreviated as PEN
  • PEN polyethylene naphthalate film
  • an inorganic gas barrier film made of SiOx is continuously formed on a flexible film so as to have a thickness of 500 nm, and an oxygen permeability of 0.001 ml / (m 2 ⁇ day) or less, to produce a water vapor permeability of 0.001 g / (m 2 ⁇ day) or less of the gas barrier of the flexible film.
  • first electrode layer A 120 nm thick ITO (indium tin oxide) film was formed by sputtering on the prepared gas barrier flexible film, and patterned by photolithography to form a first electrode layer. The pattern was such that the light emitting area was 50 mm 2 .
  • the following light emitting layer coating solution was formed by spin coating at 2000 rpm for 30 seconds, and then dried at 120 ° C. for 30 minutes to provide a light emitting layer having a thickness of 40 nm.
  • the following electron transport layer coating solution was formed by spin coating at 2000 rpm for 30 seconds, and then dried at 120 ° C. for 30 minutes. An electron transport layer having a thickness of 35 nm was provided.
  • an electron injection layer was formed on the formed electron transport layer.
  • the substrate was put into a vacuum chamber and the pressure was reduced to 5 ⁇ 10 ⁇ 4 Pa.
  • potassium fluoride prepared in a tantalum vapor deposition boat was heated in a vacuum chamber and laminated to a thickness of 2 nm.
  • 1 nm of calcium prepared in advance in a tantalum vapor deposition boat was laminated in a vacuum chamber to form an electron injection layer.
  • a polyethylene terephthalate (PET) film (12 ⁇ m thickness) is bonded to a flexible aluminum foil (manufactured by Toyo Aluminum Co., Ltd.) with a thickness of 30 ⁇ m (two-component reactive type). (Urethane type adhesive)) (adhesive layer thickness 1.5 ⁇ m) was used.
  • thermosetting adhesive as a sealing adhesive was uniformly applied to the aluminum surface with a thickness of 20 ⁇ m along the adhesive surface (shiny surface) of the aluminum foil using a dispenser. This was dried under a vacuum of 100 Pa or less for 12 hours. Furthermore, it moved to a nitrogen atmosphere with a dew point temperature of ⁇ 80 ° C. or lower and an oxygen concentration of 0.8 ppm, dried for 12 hours or longer, and adjusted the water content of the sealing adhesive to 100 ppm or lower.
  • thermosetting adhesive an epoxy adhesive mixed with the following (A) to (C) was used.
  • A Bisphenol A diglycidyl ether (DGEBA)
  • B Dicyandiamide (DICY)
  • C Epoxy adduct-based curing accelerator
  • the organic EL element 3 of the present invention was produced in the same manner except that the conditions for drying the sealing adhesive applied to the flexible sealing member were changed as follows. The drying was carried out in a nitrogen atmosphere having a dew point temperature of ⁇ 80 ° C. or lower and an oxygen concentration of 0.8 ppm, and dried for about 4 hours, so that the moisture content of the sealing adhesive was adjusted to 200 to 300 ppm.
  • the organic EL element 4 of the present invention was produced in the same manner except that the electron injection layer was formed to be 2 nm of potassium fluoride and then formed to be 1 nm of magnesium.
  • the organic EL element 5 of the comparative example was produced in the same manner except that the second electrode was aluminum and the heat conductive layer was not provided.
  • the second electrode is a silver alloy formed by co-evaporation so that silver is 97.4 atomic%, palladium is 0.91 atomic%, and copper is 1.69 atomic%.
  • the organic EL element 7 of the comparative example was produced in the same manner except that the heat conductive layer was not provided.
  • the organic EL device was stored at 85 ° C. for 300 hours, and the rectification ratio was similarly evaluated.
  • ⁇ Black spot generation rate of 1% or more and less than 5%
  • ⁇ Black spot generation rate of 5% or more and less than 10%
  • X Black spot generation rate of 10% or more
  • Table 1 shows the evaluation results.
  • the organic EL element was wound around a cylinder with a radius of 5 cm, and continuously driven for 300 hours in a bent state, and the rectification ratio and black spot were compared with those before continuous driving by the above method.
  • the driving condition was set to a current value of 4000 cd / m 2 at the start of continuous driving.
  • the residual luminance was expressed as a relative value with the organic EL element 5 as 100.
  • Table 2 shows the evaluation results.
  • the organic EL of the present invention has a higher external extraction quantum efficiency than that of the comparative example, a long lifetime, excellent high-temperature storage stability, and excellent driving stability during bending.

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  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un composant électroluminescent organique flexible possédant une efficacité lumineuse élevée, une longue durée de vie et une bonne stabilité de stockage à température élevée, ainsi qu'une excellente stabilité fonctionnelle lorsqu'il est plié. Le composant électroluminescent organique comprend une première électrode, une couche de composé organique contenant au moins une couche émettrice de lumière composée de composants organiques, une seconde électrode et un élément de scellage flexible, le tout disposé dans cet ordre sur un substrat de support flexible. Le composant électroluminescent organique est scellé par adhésif et comprend une couche thermo-conductrice et un adhésif de scellage disposés dans cet ordre entre la seconde électrode et l'élément de scellage flexible. La seconde électrode est faite d'argent ou d'un alliage d'argent, l'argent étant le constituant principal.
PCT/JP2011/051079 2010-02-23 2011-01-21 Composant électroluminescent organique et procédé de fabrication WO2011105141A1 (fr)

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
WO2013073301A1 (fr) * 2011-11-14 2013-05-23 コニカミノルタ株式会社 Élément d'électroluminescence organique et corps émetteur de lumière plan
JP2015518287A (ja) * 2012-05-31 2015-06-25 エルジー・ケム・リミテッド 有機発光素子
JP2019533291A (ja) * 2016-10-20 2019-11-14 武漢華星光電技術有限公司Ｗｕｈａｎ Ｃｈｉｎａ Ｓｔａｒ Ｏｐｔｏｅｌｅｃｔｒｏｎｉｃｓ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ Ｏｌｅｄディスプレイ及びその製造方法

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