WO2011096371A1 - Polymère fluoré et composition de résine fluorée durcissable - Google Patents

Polymère fluoré et composition de résine fluorée durcissable Download PDF

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WO2011096371A1
WO2011096371A1 PCT/JP2011/051956 JP2011051956W WO2011096371A1 WO 2011096371 A1 WO2011096371 A1 WO 2011096371A1 JP 2011051956 W JP2011051956 W JP 2011051956W WO 2011096371 A1 WO2011096371 A1 WO 2011096371A1
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fluoropolymer
group
carbon atoms
cured product
curable resin
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PCT/JP2011/051956
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English (en)
Japanese (ja)
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徳英 杉山
雅博 大倉
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旭硝子株式会社
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Priority to JP2011552770A priority Critical patent/JP5765237B2/ja
Publication of WO2011096371A1 publication Critical patent/WO2011096371A1/fr

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F259/00Macromolecular compounds obtained by polymerising monomers on to polymers of halogen containing monomers as defined in group C08F14/00
    • C08F259/08Macromolecular compounds obtained by polymerising monomers on to polymers of halogen containing monomers as defined in group C08F14/00 on to polymers containing fluorine
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18Monomers containing fluorine
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18Monomers containing fluorine
    • C08F214/182Monomers containing fluorine not covered by the groups C08F214/20 - C08F214/28

Definitions

  • the present invention relates to a fluoropolymer, a fluorinated curable resin composition and a cured product thereof, and a method for producing the fluoropolymer, and more specifically, a fluoropolymer capable of obtaining a cured product having excellent thermal stability and adhesiveness,
  • the present invention relates to a fluorine-containing curable resin composition containing the fluoropolymer, a cured product obtained by curing the fluorine-containing curable resin composition, and a method for producing a fluoropolymer.
  • Photoelectric conversion elements used as solar cells, as well as compound semiconductors such as Si and GaAs.
  • Epoxy resins, ionomer resins, ethylene-vinyl acetate copolymers, etc. are used as sealing materials for these photoelectric conversion element modules depending on the configuration of each module (Non-Patent Document 1), but they are resistant to moisture and chemicals. Development of materials that achieve both sealing reliability and simplification of the sealing process is desired.
  • Patent Document 1 a method using a curable perfluoro resin is disclosed (Patent Document 1).
  • the curable perfluoro resin is fluid without containing a volatile component such as a solvent, and is applied by a dispenser or a screen printing method, and then cured by heat or UV irradiation, so that the light-emitting element can be transparently sealed. It can be done easily.
  • a cured product of the curable perfluororesin has high translucency, excellent heat resistance and light resistance, and the curable perfluororesin is useful not only as a light emitting element but also as a sealing material for the above photoelectric conversion element. .
  • curable perfluororesins described above are required to have improved thermal stability and adhesion to various substrates, and are peeled off in reliability tests such as temperature cycle tests of modules sealed with the curable perfluororesins. It was necessary to deal with problems such as that sometimes occurred.
  • an object of the present invention is to provide a fluoropolymer capable of obtaining a cured product excellent in thermal stability and adhesiveness, a fluorine-containing curable resin composition containing the fluoropolymer, and a method for producing the fluoropolymer. It is in.
  • the present invention is the following [1] to [15].
  • a fluoropolymer having a polymerizable double bond The fluoropolymer is a copolymer having repeating units derived from fluoromonoene (a) and unsaturated side chain-remaining fluorodiene (b), and having an amide group at the end of the main chain polymer.
  • the fluoromonoene (a) is tetrafluoroethylene, chlorotrifluoroethylene, and CF 2 ⁇ CFO—Rf (wherein Rf represents a fluoroalkyl group having 1 to 6 carbon atoms.
  • Rf is a C 1-6 perfluoroalkyl group which may have an etheric oxygen atom between carbon atoms.
  • the fluorodiene (b) is CF 2 ⁇ CFO—Q—OCF ⁇ CF 2 (wherein Q represents a fluoroalkylene group having 3 to 8 carbon atoms, wherein carbon atoms in the fluoroalkylene group)
  • Q represents a fluoroalkylene group having 3 to 8 carbon atoms, wherein carbon atoms in the fluoroalkylene group
  • a fluoropolymer having a polymerizable double bond obtained by copolymerizing fluoromonoene (a) and unsaturated side chain-remaining fluorodiene (b) is characterized in that [1] ] To [9] for producing a fluoropolymer.
  • a curable resin comprising the fluoropolymer of [1] to [9].
  • a fluorine-containing curable resin composition comprising the fluoropolymer of the above [1] to [9].
  • the fluoropolymer of the present invention is a curable polymer, and a cured product having good thermal stability and adhesiveness can be obtained.
  • the fluorine-containing curable resin composition of the present invention containing the fluoropolymer of the present invention as a curable component can provide a cured product with improved thermal stability and adhesiveness.
  • the cured product of the present invention is the cured product having good thermal stability and adhesiveness.
  • the fluoropolymer production method of the present invention can produce a fluoropolymer that can improve the thermal stability and adhesiveness of the fluorine-containing curable resin composition.
  • the number average molecular weight is denoted by Mn
  • the mass average molecular weight is denoted by Mw
  • the molecular weight distribution is denoted by Mw / Mn.
  • the mass average molecular weight (Mw) and number average molecular weight (Mn) in the present invention are gel permeation using CF 2 ClCF 2 CHClF (manufactured by Asahi Glass Co., Ltd., trade name: AK225cb, hereinafter referred to as AK225cb) as a solvent. It means what was calculated as a PMMA (polymethyl methacrylate) equivalent molecular weight by chromatography (GPC).
  • GPC polymethyl methacrylate equivalent molecular weight by chromatography
  • the fluoropolymer of the present invention is referred to as a fluoropolymer (PA).
  • the fluoropolymer before amidation is referred to as fluoropolymer (P).
  • the fluoropolymer (PA) is a fluoropolymer obtained by amidating the fluoropolymer (P). Further, a cured product of a fluoropolymer (PA) cured product and a fluorine-containing curable resin composition containing the fluoropolymer (PA) is also simply referred to as a cured product unless otherwise specified.
  • the fluoropolymer (PA) of the present invention has a polymerizable double bond (carbon-carbon double bond). Since the fluoropolymer (PA) has a polymerizable double bond in the molecule, the polymerizable double bond can be crosslinked and cured by light or heat. Generally, in fluoropolymers, it is known that the thermal stability of fluoropolymers is improved by amidation of the main chain ends. The present inventors have newly found that, in a curable fluoropolymer having a polymerizable double bond, the adhesion of the fluoropolymer to various substrates is also improved by amidating the main chain terminal.
  • the fluoropolymer (PA) of the present invention is a fluoropolymer in which the main chain terminal of the fluoropolymer (P) having a polymerizable double bond is amidated.
  • a fluoropolymer obtained by polymerizing fluoromonoene or fluorodiene tends to generate an unstable group at the end of a molecular chain due to a termination reaction or a chain transfer reaction.
  • acid fluoride —COF
  • This acid fluoride (—COF) is hydrolyzed to carboxylic acid (—COOH) by moisture in the air.
  • carboxylic acid —COOH
  • the fluoropolymer (PA) of the present invention is prepared by reacting a fluoropolymer (P) having a polymerizable double bond with ammonia or an amine to amidate, thereby converting an unstable group at the end of the main chain to a stable group ( Amide group).
  • an amide group is introduced at the end of the main chain by a reaction mechanism such as -COF + 2NH 3 ⁇ -CONH 2 + NH 4 F or -COF + 2NH 2 R ⁇ -CONHR + NH 3 RF.
  • the amide group in the present invention is a group represented by —CONRR ′, and —NRR ′ is a residue obtained by removing a hydrogen atom from a compound having an amino group represented by HNRR ′.
  • R and R ′ each independently represent a hydrogen atom or a monovalent organic group, or R and R ′ together represent a divalent organic group.
  • the organic group is preferably a monovalent hydrocarbon group such as an alkyl group.
  • an organic group having 10 or less carbon atoms is preferable, and an organic group having 4 or less carbon atoms is more preferable.
  • At least one of R and R ′ is preferably a hydrogen atom, and most preferably a hydrogen atom.
  • Fluoromonoene (a) is a fluorine-containing compound having one polymerizable double bond in the molecule.
  • the fluoromonoene (a) include fluoroethylenes such as tetrafluoroethylene, trifluoroethylene, chlorotrifluoroethylene, vinylidene fluoride, hexafluoropropylene, CF 2 ⁇ CFO—Rf (where Rf is carbon A fluoroalkyl group represented by the formula 1 to 6.
  • a fluorovinyl ether represented by the following formula (a-1), which may have an etheric oxygen atom between carbon atoms in the fluoroalkyl group examples thereof include a cyclic fluoromonomer represented by the following formula (a-2). Among them, CF 2 ⁇ CFO—Rf (wherein Rf represents a fluoroalkyl group having 1 to 6 carbon atoms. Note that an etheric oxygen atom may be present between carbon atoms in the fluoroalkyl group.) Is used as the fluoromonoene (a), the viscosity of the resulting fluoropolymer (PA) is reduced, and the flexibility of the resulting cured product is increased.
  • the fluoromonoene (a) is preferably a perfluoromonomer and more preferably tetrafluoroethylene from the viewpoint of thermal stability.
  • the fluoropolymer (PA) is most excellent in fluidity and thermal stability.
  • tetrafluoroethylene and CF 2 ⁇ CFO—Rf (wherein Rf represents a fluoroalkyl group having 1 to 6 carbon atoms.
  • Rf represents a fluoroalkyl group having 1 to 6 carbon atoms.
  • an etheric oxygen atom is present between carbon atoms in the fluoroalkyl group. It is more preferable to use the fluorovinyl ether represented by the above in combination in order to further improve the fluidity.
  • Rf 1 represents a perfluoroalkyl group having 1 to 6 carbon atoms.
  • an etheric oxygen atom between carbon atoms in the perfluoroalkyl group It may be used together with perfluorovinyl ether represented by
  • chlorotrifluoroethylene is used as the fluoromonoene (a)
  • the refractive index can be increased.
  • the refractive index can be increased by about 0.03 to 0.1. Thereby, the light extraction efficiency of LED improves.
  • the ratio of the repeating units derived from tetrafluoroethylene to the total amount of the repeating units derived from fluoromonoene (a) and the repeating units derived from fluorodiene (b) is 1 to It is preferably 80 mol%, particularly preferably 50 to 70 mol%. Within the above range, the heat stability and transparency of the cured product and the fluidity of the fluoropolymer (PA) are good.
  • the ratio of the repeating unit derived from CF 2 ⁇ CFO—Rf 1 to the total amount of repeating units derived from both is 1 to 49 mol%. It is preferably 10 to 40% by mole.
  • R 1 and R 2 are each independently a fluorine atom or an OCF 3 group
  • R 3 and R 4 are each independently a fluorine atom or a CF 3 group
  • R 5 and R 6 are each independently a fluorine atom, a perfluoroalkyl group, a perfluoroalkoxy group or a perfluoro (alkoxyalkyl) group.
  • Fluorodiene (b) is a fluorine-containing compound having two polymerizable double bonds in the molecule.
  • the fluorodiene (b) By using the fluorodiene (b), unsaturated side chains remain in the fluoropolymer (P), and thus a cured product is obtained by a curing reaction of the fluoropolymer (PA) using the unsaturated side chains.
  • the fluorodiene (b) include perfluorodienes composed of only carbon atoms and fluorine atoms, or composed of only carbon atoms, fluorine atoms and oxygen atoms.
  • the fluorodiene by which the 1 or 2 fluorine atom of the said perfluoro diene was substituted by the hydrogen atom is mentioned.
  • the fluorodiene (b) is preferably perfluorodiene from the viewpoint of thermal stability. From the viewpoint of fluidity and thermal stability, a perfluorodiene composed only of carbon atoms, fluorine atoms and oxygen atoms is more preferred.
  • the number of atoms of a linking chain connecting two polymerizable double bonds is preferably 5 to 10, and particularly preferably 5 to 8. If the number of atoms of the linking chain is not less than the lower limit of the above range, it is possible to suppress intramolecular cyclization by reacting these two polymerizable double bonds during the polymerization reaction, and in the fluoropolymer (P). It is easy to leave an unsaturated side chain having a polymerizable double bond.
  • the fluorodiene (b) may be a fluorocyclic diene having an aliphatic ring structure in the molecule or a fluoro acyclic diene having no aliphatic ring structure.
  • the fluorodiene (b) is preferably a fluoro acyclic diene having no aliphatic ring structure from the viewpoint that the effect of imparting flexibility to the cured product is large and the fluidity is not excessively lowered.
  • a fluoro acyclic diene is a compound having no aliphatic ring structure as described above. Moreover, it is preferable that the connection chain which connects two polymerizable double bonds is a linear structure which does not have a ring structure from the point which prevents that fluidity
  • the fluoro acyclic diene a compound represented by the following formula is preferable.
  • Q F1 , Q F2 , Q F3 and Q F4 are each independently a fluoroalkylene group which may have a side chain of a fluoroalkyl group.
  • the number of carbon atoms in the fluoroalkylene group represented by Q F1 and Q F3 is 3 to 8, preferably 3 to 6.
  • the number of carbon atoms in the fluoroalkylene group represented by Q F2 is 2 to 6, preferably 2 to 4.
  • the number of carbon atoms in the fluoroalkylene group represented by Q F4 is 1 to 6, preferably 2 to 5.
  • CF 2 CFO- from the viewpoint of having an appropriate polymerizing property in order to leave a polymerizable double bond in the side chain in the synthesis of the fluoropolymer (P) and the thermal stability of the cured product.
  • Q—OCF ⁇ CF 2 (wherein Q represents a fluoroalkylene group having 3 to 8 carbon atoms.
  • it is a fluoroalkylene group having 3 to 6 carbon atoms.
  • a compound represented by may have an etheric oxygen atom between them) is more preferred.
  • Q 1 represents a perfluoroalkylene group having a carbon number of 3-8.
  • the carbon number of perfluoroalkylene group 3-6 is particularly preferred.
  • fluoro acyclic diene examples include compounds represented by the following formulae.
  • a fluorocyclic diene is a compound having one or two aliphatic ring structures.
  • the aliphatic ring structure in the fluorocyclic diene is composed only of carbon atoms or composed of carbon atoms and oxygen atoms.
  • the number of atoms constituting the aliphatic ring structure is preferably 4 to 8, and more preferably 5 or 6.
  • Particularly preferred aliphatic ring structures are 5 or 6 membered rings containing one or two oxygen atoms.
  • these aliphatic rings may be connected to each other by a single bond or a divalent or higher valent linking group, and condensed (in the case of sharing one carbon bond) May also be included).
  • the linking group include an oxygen atom, a perfluoroalkylene group (preferably having 8 or less carbon atoms), one or both ends, or a perfluoroalkylene group having an etheric oxygen atom between carbon atoms (8 carbon atoms). The following are preferable.
  • a substituent other than a fluorine atom may be bonded to the carbon atom constituting the aliphatic ring structure.
  • the substituent include a perfluoroalkyl group having 15 or less carbon atoms, a perfluoroalkyl group having 15 or less carbon atoms having one or more etheric oxygen atoms between carbon atoms, a perfluoroalkoxy group having 15 or less carbon atoms, carbon A perfluoroalkoxy group having 15 or less carbon atoms having one or more etheric oxygen atoms between atoms is preferred.
  • one or both carbon atoms in at least one polymerizable double bond are carbon atoms constituting the aliphatic ring structure. That is, in the fluorocyclic diene, a polymerizable double bond is formed between adjacent carbon atoms constituting the aliphatic ring structure, or one carbon atom constituting the aliphatic ring structure and the carbon atom A polymerizable double bond is formed between the bonding carbon atoms.
  • the fluorocyclic diene has two aliphatic ring structures
  • the two polymerizable double bonds each have an aliphatic ring structure.
  • the total number of carbon atoms of the fluorocyclic diene is preferably 8 to 24 and more preferably 10 to 18 from the viewpoint of the boiling point and the thermal stability of the cured product.
  • the fluorocyclic diene is preferably a compound having two aliphatic ring structures, each of the aliphatic rings having a polymerizable double bond.
  • Perfluoro (2-methylene-1,3- A compound having two (dioxolane) structures is more preferred.
  • it has two perfluoro (2-methylene-1,3-dioxolane) structures represented by the following formula (b-1), and the aliphatic rings are connected to each other with a single bond or divalent group at the 4-position as a linking position.
  • Q F5 is a single bond, an oxygen atom, or a perfluoroalkylene group having 1 to 10 carbon atoms which may have an etheric oxygen atom.
  • Q F6 and Q F7 are each independently a perfluoroalkylene group having 1 to 5 carbon atoms which may have a single bond, an oxygen atom, or an etheric oxygen atom.
  • the polymerizable double bond remaining in the side chain in the repeating unit derived from the compound (b-1) has high radical polymerizability. Therefore, it is possible to sufficiently react during the curing reaction of the fluorine-containing curable resin composition, and it is suppressed that the side chain having a polymerizable double bond remains in the cured product. The thermal stability of is improved.
  • Specific examples of the compound (b-1) include compounds represented by the following formulae.
  • Compound (b-1) is preferably produced by the method described in International Publication No. 2005/085303.
  • CF 2 CFO-Rf 1 (wherein, Rf 1 may have a representative.
  • Rf 1 an etheric oxygen atom between carbon atoms in the perfluoroalkyl group of the perfluoroalkyl group having 1 to 6 carbon atoms.
  • Q 1 represents a perfluoroalkylene group having a carbon number of 3-8.
  • the ratio of the repeating unit derived from the fluorodiene (b) in the fluoropolymer (P) is 1 with respect to the total amount of the repeating unit derived from the fluoromonoene (a) and the repeating unit derived from the fluorodiene (b). It is preferably ⁇ 95 mol%, more preferably 1 to 30 mol%, particularly preferably 5 to 15 mol%.
  • the fluoropolymer (PA) is sufficiently crosslinked, and the thermal stability of the cured product becomes good. Since it is suppressed that the side chain which has a polymerizable double bond of fluoropolymer (PA) remains below the upper limit of the said range, the thermal stability of hardened
  • the fluoropolymer (P) is obtained by copolymerizing the fluoromonoene (a) and the fluorodiene (b).
  • the polymerization method for copolymerizing the fluoromonoene (a) and the fluorodiene (b) is not particularly limited, and a known polymerization method such as suspension polymerization, solution polymerization, emulsion polymerization, bulk polymerization, etc. can be employed, Solution polymerization is particularly preferred because it can be polymerized in a diluted state with a polymer and can suppress cross-linking reaction between molecules due to polymerizable double bonds remaining in the side chain.
  • Solution polymerization is a polymerization method in which the fluoromonoene (a) and the fluorodiene (b) are added to a polymerization initiator in a polymerization solvent and copolymerized.
  • a chain transfer agent may be added.
  • the polymerization medium in the solution polymerization is preferably a fluorine-containing solvent in which the generated fluoropolymer (P) can be dissolved.
  • fluorine-containing solvent examples include dichloropentafluoropropane (HCFC-225), CF 3 CH 2 CF 2 H (HFC-245fa), CF 3 CF 2 CH 2 CF 2 H (HFC-365mfc), perfluorohexane, perfluoro octane, perfluoro (2-butyl tetrahydrofuran), perfluoro (tributylamine), CF 3 CF 2 CF 2 CF 2 CF 2 CF 2 H, CF 3 CH 2 OCF 2 CF 2 H, CF 3 CH 2 OCH 2 CF 3, CF 3 CF 2 OCF 2 CF 2 OCF 2 CF 3 and the like.
  • the total amount of fluoromonoene (a) and fluorodiene (b) is not reacted at one time, but a part of the total amount used is previously stored in the reaction vessel.
  • a production method comprising a step of starting a polymerization reaction by injecting the polymer and polymerizing the remaining fluoromonoene (a) and fluorodiene (b) while the polymerization reaction is in progress.
  • the molecular weight distribution and composition distribution of the obtained fluoropolymer (P) can be narrowed, and the content of low molecular weight components having a molecular weight of less than 1,000 in the fluoropolymer (P) is set to less than 10% by mass. And the yield of the fluoropolymer (P) is improved.
  • the fluoropolymer (P) includes a component that has a particularly low fluorodiene (b) content and that does not substantially become a polymerizable compound. Can be easily reduced.
  • the molar ratio of the fluoromonoene (a) and the fluorodiene (b) is preferably 40:60 to 95: 5.
  • the molar ratio of fluoroethylenes to fluorodiene is preferably 50:50 to 95: 5, and preferably 70:30 to 95: 5. Particularly preferred. If the charging ratio of fluoroethylenes becomes too large, the molecular weight of the fluoropolymer (P) becomes too high, and the fluidity of the fluoropolymer (PA) decreases. Moreover, there exists a tendency for transparency of hardened
  • ⁇ Polymerization initiator> As the polymerization initiator used in the polymerization reaction, many organic peroxides having a 10-hour half-temperature of 20 to 120 ° C. can be used. However, the reaction rate decreases due to the extraction reaction of hydrogen atoms in the polymerization initiator. From the viewpoint of preventing this, it is preferable to use a fluorine-containing peroxide such as fluorine-containing diacyl peroxide.
  • the concentration of the polymerization initiator in the reaction solution is preferably from 0.1 to 5% by mass, more preferably from 0.5 to 2% by mass.
  • the polymerization temperature is preferably 20 to 120 ° C, more preferably 40 to 90 ° C, although it varies depending on the 10-hour half-life temperature of the initiator and the polymerization rate of the monomer.
  • Chain transfer agent In the polymerization reaction, it is preferable to use a chain transfer agent.
  • the chain transfer agent include chlorine compounds such as CCl 4 , CH 3 Cl, SO 2 Cl 2 , and CHFCl 2 , and hydrocarbon compounds such as methanol, ethanol, isopropanol, hexane, and diethyl ether.
  • SO 2 Cl 2 is preferable because the chain transfer efficiency is high and the fluoropolymer (P) can be obtained in a high yield.
  • the amount of the chain transfer agent used varies depending on the chain transfer constant, but when SO 2 Cl 2 is used, the molar ratio relative to the total amount of the mixture of fluoromonoene (a) and fluorodiene (b) is 0.00. It is preferably 001 to 0.1, and more preferably 0.001 to 0.05. If the molar ratio is at least the lower limit of the above range, the molecular weight of the polymer will not be too high. Moreover, if the said molar ratio is below the upper limit of the said range, the molecular weight of a fluoropolymer (P) will not fall too much.
  • the fluoropolymer (PA) in the present invention can be obtained by amidating the end of the fluoropolymer (P).
  • the resulting fluoropolymer (P) is amidated.
  • Amidation results in amidation of such unstable terminal groups present in the fluoropolymer (P).
  • the amidation includes a method via an ester (method 1) and a direct amidation method (method 2), but direct amide is preferable from the viewpoint of ease of procedure and reaction rate. It is a method to convert.
  • amidating agent for amidating the end of the main chain of the fluoropolymer (P) include ammonia represented by the above-mentioned NRRR ′ and various amines. In order to improve the adhesion of the cured product to the substrate, it is preferable that active hydrogen atoms bonded to nitrogen at the end of the main chain remain.
  • the amines primary amines, secondary amines, or compounds having a primary amino group or a secondary amino group are preferably used.
  • the compound having a primary amino group or a secondary amino group is preferably a polyfunctional amine having a primary or secondary amino group in a plurality of molecules.
  • amines examples include alkylamines represented by NH 2 R ′ or NHR ′ 2 (where R ′ represents an alkyl group having 1 to 10 carbon atoms), ethylenediamine, polyethylenediamine, aminosilane, methylene. Examples include diaminosilane and tetraaminosilane.
  • Most preferred as an amidating agent is ammonia.
  • a particularly preferred amidation method is a method in which ammonia is directly blown into a solution containing the fluoropolymer (P) after polymerization. (Direct amidation). By direct amidation, the main chain end of the resulting fluoropolymer (PA) becomes —COONH 2 .
  • the amidation rate of the main chain terminal of the fluoropolymer (PA) of the present invention is preferably 70 to 100%, particularly preferably 80 to 100%.
  • the amidation rate is calculated from the absorbance of amide groups such as —COONH 2 with respect to the sum of absorbances of —COF, —COOH, —COOCH 3 and the like based on the infrared absorption spectrum of C ⁇ O at the end of the fluoropolymer. Is the amidation rate.
  • the amidation rate is at least the lower limit of the above range, the thermal stability and adhesiveness of the cured product will be good.
  • the amide group content of the fluoropolymer (PA) is preferably 0.01 to 0.3 mmol / g, particularly preferably 0.03 to 0.2 mmol / g.
  • the main chain terminal group other than the amide group is a main chain terminal group having high thermal stability such as —CF 3 , —CF 2 H, —CF 2 Cl derived from a polymerization initiator or a chain transfer agent.
  • a method for removing low molecular weight components having a molecular weight of less than 1,000 a method of removing fluoropolymer (PA) by heating under reduced pressure, a method of extracting low molecular weight components from fluoropolymer (PA) with supercritical carbon dioxide, Using a method of dropping a fluoropolymer (PA) solution into a poor solvent, precipitating a fluoropolymer (PA) having a molecular weight of 1,000 or more, and removing low molecular weight components that do not precipitate, using gel permeation chromatography, Examples include a method of dividing and removing low molecular weight components.
  • a preferred method for removing low molecular weight components is a method of removing by heating under reduced pressure.
  • the pressure is preferably 1 to 100 hPa, more preferably 1 to 20 hPa, and particularly preferably 1 to 10 hPa.
  • the temperature is preferably from 100 to 150 ° C., particularly preferably from 120 to 150 ° C. The lower the pressure (the higher the degree of vacuum), the better. However, as the apparatus size increases, it is generally not easy to reduce the pressure. When the temperature is at least the lower limit of the above range, it does not take a long time to remove the low molecular weight component. Further, when the temperature is not more than the upper limit of the above range, gelation reaction does not occur during heating.
  • the extraction solvent is further reduced using a supercritical state. This is a method for removing a molecular weight body.
  • the extraction solvent in the extraction is a medium that can separate the low molecular weight body from the fluoropolymer (PA) by dissolving the low molecular weight body.
  • the extraction solvent is not particularly limited as long as it can extract the above-mentioned low molecular weight substance at a temperature not lower than the critical temperature of the extraction solvent to be used and lower than 130 ° C. and at a pressure not lower than the critical pressure of the extraction solvent.
  • fluorocarbons having 1 to 3 carbon atoms such as fluoroform (CF 3 H; R23), perfluoroethane (C 2 F 6 ; R116), and the like can be given.
  • carbon dioxide, fluoroform, or perfluoroethane is preferable, and carbon dioxide is more preferable in that it can be easily brought into a supercritical state and has excellent extraction efficiency.
  • the extraction solvent only one kind may be used, or two or more kinds may be mixed and used.
  • Carbon dioxide, fluoroform, and perfluoroethane may be sufficiently fluoropolymers even if only one kind is used. (PA) can be purified.
  • the temperature of the extraction solvent in the extraction is not lower than the critical temperature of the extraction solvent and lower than 130 ° C., and is under a pressure not lower than the critical pressure of the extraction solvent. That is, it is preferable to perform the said extraction by making the extraction solvent to be used into a supercritical fluid below 130 degreeC, and making it contact with fluoropolymer (PA). If the said temperature is in the said range, it can set suitably according to the extraction solvent to be used, However, a preferable minimum is a temperature 0.1 degreeC higher than a critical temperature, A preferable upper limit is 100 degreeC, and more A preferred upper limit is 80 ° C.
  • the said pressure is in the said range, it can set suitably according to the extraction solvent to be used, However, a preferable minimum is a pressure 10,000 Pa higher than a critical pressure, and a preferable upper limit is 70 MPa higher than a critical pressure. Pressure.
  • the extraction efficiency of the low molecular weight substance can be improved by increasing the density of the extraction solvent such as carbon dioxide or fluoroform.
  • the density of the extraction solvent such as carbon dioxide and fluoroform is 0.2 g / cm 3 or more and 1.3 g / cm 3 or less in the extraction field, that is, under the condition that the extraction solvent is the temperature and pressure described above. It is preferable.
  • a halogenated hydrocarbon solvent or a hydrocarbon solvent may be used in combination with an extraction solvent in a supercritical state.
  • a fluorine-containing solvent is preferable from the viewpoint of solubility.
  • the entrainer to be used may be used alone or in combination.
  • Specific examples of the fluorine-containing solvent to be used include the following compounds. CF 3 CF 2 CHCl 2 , CF 2 ClCF 2 CHClF, CF 3 CF 2 CHCl 2 , CFC1 2 CF 2 Cl, CCl 4 , CF 3 CHFCHFCF 2 CF 3 , CF 3 CH 2 OCF 2 CF 2 H and the like.
  • the hydrocarbon solvent include methanol, ethanol, propanol, isopropanol, dimethyl ether and the like.
  • the purification method described above performs extraction using an extraction solvent in a supercritical state, low molecular weight substances can be efficiently reduced, and the resulting fluoropolymer (PA) has a molecular weight distribution. It can be obtained as a narrow dispersion. Since the above-described purification method can reduce the low molecular weight product, the obtained fluoropolymer (PA) has a number average molecular weight (Mn) and a mass average molecular weight (Mw) measured by GPC. The molecular weight distribution represented by the ratio Mw / Mn can be made smaller and narrowly dispersed.
  • the mass average molecular weight (Mw) of the fluoropolymer (PA) is preferably 3,000 to 20,000. From the viewpoint of fluidity and adhesiveness, 3,000 to 10,000 is more preferable, and 5,000 to 15,000 is particularly preferable.
  • the mass average molecular weight of the fluoropolymer (PA) can be calculated as (Mw) and a molecular weight in terms of PMMA (polymethyl methacrylate) by gel permeation chromatography (GPC).
  • GPC gel permeation chromatography
  • molding will be ensured.
  • the concentration of the main chain end groups in the fluoropolymer (PA) increases, and the effect of improving the thermal stability and adhesiveness due to the amidation of the main chain ends increases. If the molecular weight is too high and the fluidity is poor, it cannot be molded into a desired shape, or the flow becomes non-uniform and the characteristics of the molded product are biased.
  • cured material which has higher thermal stability is easy to be obtained by setting high the mass mean molecular weight (Mw) of a fluoropolymer (PA) in the said range.
  • the content of polymerizable double bonds remaining in the side chains in the molecule is preferably 0.1 to 2 mmol / g, and preferably 0.2 to 0.5 mmol / g. More preferably.
  • the content of the polymerizable double bond can be calculated by measurement by F 19 -NMR. If content of the said polymerizable double bond is more than the lower limit of the said range, it will be easy to prevent that bridge
  • Fluoropolymer (PA) is a high-viscosity liquid at room temperature because of its high molecular weight, but when heated, the viscosity decreases and fluidity can be obtained.
  • the fluoropolymer (PA) preferably has a viscosity of 1 to 100 Pa ⁇ s at 50 to 100 ° C. Further, the fluoropolymer (PA) is not substantially thermally cured at 100 ° C. or lower.
  • the thermosetting temperature is preferably 100 to 200 ° C, more preferably 150 to 200 ° C.
  • the fluorine-containing curable resin composition of the present invention is a curable composition containing a fluoropolymer (PA) having a polymerizable double bond.
  • the composition contains additives such as a curing agent or a photoinitiator for curing, a polymerizable compound (Y) other than the fluoropolymer (PA), and the like as necessary.
  • the fluorine-containing curable resin composition of the present invention may contain other polymerizable compound (Y) as the polymerizable compound in addition to the fluoropolymer (PA).
  • the polymerizable compound (Y) is a monomer having a molecular weight of 1,000 or more as a single substance, or is polymerized to have a molecular weight of 1,000 or more.
  • the polymerizable compound (Y) is preferably a fluoropolymer or fluorooligomer having a polymerizable double bond, and more preferably a perfluoropolymer or perfluorooligomer having a polymerizable double bond.
  • the polymerizable double bond in the perfluoropolymer or perfluoro oligomer is preferably one polymerizable double bond in the repeating unit derived from the unsaturated side chain-remaining perfluorodiene.
  • Rf 2 and Rf 3 are a perfluoroalkylene group which may have a perfluoroalkyl group in the side chain, or a group having an etheric oxygen atom between carbon atoms in the perfluoroalkylene group.
  • Rf 2 and Rf 3 for example, -CF 2 -, - CF 2 O -, - CF 2 CF 2 O -, - CF 2 CF 2 CF 2 O -, - CF (CF 3) CF 2
  • Rf 2 and Rf 3 include perfluoropolyethers containing repeating units such as O-.
  • the perfluorodiene and perfluoromonoene are polymerized to obtain a fluoropolymer or fluorooligomer having a polymerizable double bond.
  • the fluorine-containing curable resin composition of the present invention may contain a curing agent or photoinitiator for curing, and other additives as necessary.
  • the fluoropolymer (PA) of this invention can perform thermosetting and photocuring, without using together the hardening
  • other additives include silane coupling agents such as amino silane and epoxy silane, and heat stabilizers such as polyfunctional thiol compounds and phosphites.
  • additives in applications requiring heat resistance and chemical resistance other than optical materials include various inorganic fillers, glass fibers, and PTFE (polytetrafluoroethylene) particles.
  • PTFE polytetrafluoroethylene
  • the refractive index can be increased by about 0.05 to 0.15 depending on the addition amount while maintaining transparency.
  • the cured product of the present invention is a cured product obtained by curing the fluoropolymer (PA) or the fluorine-containing curable resin composition.
  • the cured product of the present invention has high light resistance (particularly durability against short-wavelength light having a wavelength of 200 to 500 nm) and transparency, and is excellent in thermal stability and adhesiveness.
  • the cured product of the present invention can be obtained by curing the fluoropolymer (PA) or the fluorine-containing curable resin composition with heat or ultraviolet rays (UV).
  • a cured product obtained by UV-curing the fluoropolymer (PA) or fluorine-containing curable resin composition of the present invention has a characteristic that it is difficult to thermally decompose even when exposed to high temperatures for a long time. Therefore, the fluoropolymer (PA) and fluorine-containing curable resin composition of the present invention are preferably UV cured.
  • the curing temperature is preferably 100 to 250 ° C, more preferably 125 to 220 ° C, and particularly preferably 150 to 200 ° C.
  • thermosetting is not particularly limited, and a method in which a fluoropolymer (PA) or a fluorine-containing curable composition is heated and flowed at 50 to 100 ° C. and applied after being applied, or is applied using a solvent.
  • the method of hardening after doing, etc. are mentioned, The former is preferable.
  • Heating in thermosetting may be performed in multiple stages so that the temperature increases stepwise.
  • the curing temperature may be set so that at least the maximum temperature is within the above range.
  • a curing agent such as a fluorine-containing organic peroxide may be used. From the viewpoint of the thermal stability of the cured product, it is preferable not to use a curing agent. Even when the fluoropolymer (PA) and the fluorine-containing curable resin composition of the present invention are not used with the curing agent, they can be cured by heating.
  • the fluorine-containing organic peroxide include (C 6 F 5 C (CO) O) 2 , ((CF 3 ) 3 CO) 2 , C 6 F 5 C (CO) OOC (CH 3 ) 3, and the like. Can be mentioned.
  • the wavelength of UV is preferably 150 to 400 nm, more preferably 193 to 365 nm, and particularly preferably 248 to 365 nm.
  • UV of 150 to 300 nm curing can be performed without using a photoinitiator, and when UV of 300 to 400 nm is used, it is desirable to use a photoinitiator.
  • the light source is not particularly limited.
  • a metal halide lamp or an electrodeless lamp is used at 250 to 400 nm, and a high pressure mercury lamp or a low pressure mercury lamp is used for 254 nm, 313 nm, and 365 nm.
  • a KrF excimer laser is used for 248 nm, an ArF excimer laser is used for 193 nm, and an F 2 laser is used for 157 nm.
  • Irradiation intensity and irradiation time vary depending on the presence or absence of a photoinitiator and the wavelength of UV.
  • the irradiation intensity is preferably 0.1 to 500 mW / cm 2 and the irradiation time is preferably 1 minute to 10 hours.
  • an end group having a carbonyl group present at the end of the main chain of the fluoropolymer (PA) causes de-CO 2 due to ultraviolet rays, or a trace amount of O 2 reacts with —CF ⁇ CF 2 group. It is considered that the —COF group produced in this way causes a de-COF group by ultraviolet rays to generate radicals (J. Fluorine Chemistry, (1987) Vol. 36, 449).
  • Photoinitiators include acetophenone series, benzoin ether series, benzyl ketal series, benzophenone, benzyl and other ketone series, acyl phosphooxide series, O-acyl oxime series, titanocene series, 2,4,6-tris (trichloromethyl). ) Various halomethyltriazine compounds such as 1,3,5-triazine.
  • a fluorine-containing photoinitiator in which a part of hydrogen is substituted with fluorine or a fluoroalkyl group is preferable.
  • the amount used when using the photoinitiator is 0.01 to 10 parts by mass with respect to 100 parts by mass of the fluoropolymer (PA) (100 parts by mass in total when the polymerizable compound (Y) is used in combination). Part is preferred, and 0.1 to 1 part by weight is particularly preferred. If the usage-amount of a photoinitiator exists in the said range, a transparent hardened material with little coloring will be obtained, without reducing a cure rate.
  • 0.01 to 1 part by mass of polyfunctional thiol compound or mercaptoalkoxysilane is added to 100 parts by mass of fluoropolymer (PA) and the like, and the thermal stability of the cured product is improved. There is also. In this case, there is a synergistic effect that the adhesiveness is not affected and the adhesiveness is increased depending on the type of the base material such as when gold is used as the wiring material.
  • a cured product obtained by curing the fluoropolymer (PA) or fluorine-containing curable resin composition of the present invention has high adhesion and chemical resistance, and excellent heat resistance and weather resistance. It is useful as a sealing material for photoelectric conversion elements. In particular, when used as a sealing material for dye-sensitized solar cells, it is necessary to prevent leakage of electrolytes such as nitriles contained in solar cell elements over a long period of time, and adhesion and chemical resistance are required. Therefore, the cured product of the present invention having excellent adhesion and chemical resistance is useful.
  • the cured product of the present invention is also useful as an optical material because it has high light resistance (particularly durability against short-wavelength light having a wavelength of 200 to 500 nm), high transparency, and excellent thermal stability.
  • Optical materials include optical fiber core material or cladding material, optical waveguide core material or cladding material, pellicle material, display (for example, PDP (Plasma Display Panel), LCD (Liquid Crystal Display), FED (Field Emission Display), organic Surface protection material for EL, etc., surface protection material for lens (for example, condensing lens for light emitting element, artificial crystalline lens, contact lens, low refractive index lens, etc.), lens (for example, condensing lens for light emitting element, artificial crystalline lens) Examples thereof include materials for lenses, contact lenses, low refractive index lenses, etc.) and sealing materials for elements (for example, light emitting elements, solar cell elements, semiconductor elements, etc.).
  • the fluoropolymer (PA) or fluorine-containing curable composition of the present invention functions as a sealing material by being easily cured by UV irradiation or heating after a film such as a coating film is formed on the periphery of the solar cell or the element surface.
  • a film such as a coating film is formed on the periphery of the solar cell or the element surface.
  • a method for forming a curable film when the fluoropolymer (PA) or the fluorinated curable composition is in a liquid state, the liquid polymer or the fluorinated curable composition is used as a solution or dispersion using a solvent when in a liquid or solid state.
  • a film can be formed by a dispenser, screen printing, a die coating method, or the like.
  • the solvent is removed after forming a film containing the solvent.
  • a method of forming a film of fluoropolymer (PA) or a fluorine-containing curable resin composition on a film base material such as polyethylene terephthalate (PET) in advance, transferring it to the element module, and then curing the film is also possible.
  • the fluoropolymer (PA) or the fluorine-containing curable resin composition is cured in a mold having an arbitrary shape to form an arbitrary shape (for example, a plate shape, a tubular shape, a rod shape). Or a film of the fluoropolymer (PA) or fluorine-containing curable resin composition is formed on an arbitrary substrate (for example, the display, lens, element, etc.). Then, it is preferable to use the film of the cured product formed by curing for optical use.
  • a film used for an optical application an application in which a cured film adheres to a substrate and light passes through the film is preferable.
  • this is used as a so-called translucent sealing material that seals a light-emitting chip in a base material and allows light emitted from the light-emitting chip to be emitted from the element through the sealing material. It is preferable to use the cured product of the invention.
  • the optical material used as the molded article is preferably an optical fiber core material or cladding material, an optical waveguide core material or cladding material, or a lens material.
  • the cured product in the present invention is used for a sealing material for translucently sealing a short wavelength light emitting device from the viewpoint of having the above properties. Examples of the short wavelength light emitting element include white LEDs and UV-LEDs.
  • the fluoropolymer (PA) and the fluorinated curable composition of the present invention can be cured at room temperature by UV irradiation and a cured product can be obtained without applying temperature, the heat resistance of a dye-sensitized solar cell is high. Even a non-element can be sufficiently sealed.
  • the fluoropolymer (PA) and the fluorine-containing curable resin composition of the present invention are caused by volume shrinkage during the curing reaction. And the fall of the dimensional stability of hardened
  • the present invention will be described in detail with reference to Examples and Comparative Examples. However, the present invention is not limited by the following description.
  • the double bond content in the fluoropolymer (PA) was measured by 19 F-NMR.
  • the mass average molecular weight (Mw) and the number average molecular weight (Mn) were determined by PMMA (gel permeation chromatography (GPC)) using CF 2 ClCF 2 CHClF (manufactured by Asahi Glass Co., Ltd., trade name: AK225cb) as a solvent. Polymethylmethacrylate) calculated molecular weight.
  • a transparent glass plate made of soda lime glass having a low iron content having a high ultraviolet light transmittance of 300 to 400 nm was used.
  • TFE total charge 75 g
  • C4DVE total charge 35 g
  • the composition and double bond content of the fluoropolymer (P1) were measured by 19 F-NMR, the molar ratio of the repeating unit based on TFE, the repeating unit based on C4DVE, and the repeating unit based on PPVE was 67/6.
  • the double bond content was 0.23 mmol / g.
  • the viscosity of the fluoropolymer (P1) was measured with a rotational viscometer, it was 45 Pa ⁇ s at 80 ° C.
  • Example 1 A frame prepared by cutting out a silicone rubber sheet on a glass plate is placed and adhered, and the fluoropolymer (P1) obtained in Synthesis Example 1 is heated and flowed to 100 ° C. to flow into the inner surface of the frame, followed by degassing under reduced pressure. And cooled. This is cured by UV irradiation using a low-pressure mercury lamp UVB-40 (device name, manufactured by Sen Special Light Source Co., Ltd., main wavelength: 254 nm), so that it is colorless on a glass plate with a width of 1 cm, a length of 3 cm, and a thickness of 1 mm. A transparent strip-shaped cured product was obtained. The following evaluation was performed using the strip-shaped cured product.
  • UVB-40 device name, manufactured by Sen Special Light Source Co., Ltd., main wavelength: 254 nm
  • ⁇ Adhesion test> The edge of the strip-shaped cured product adhered on the glass plate is peeled off from the glass plate at a speed of 15 mm / min, and then peeled off from the glass plate by a 90-degree peel tester (device name, manufactured by Nisshin Kagaku Co.). The strength was measured.
  • ⁇ 200 ° C heating test> The strip-shaped cured product adhered on the glass plate was held in a 200 ° C. oven for 1,000 hours, and the weight reduction rate (%) was confirmed. It can be said that the smaller the weight reduction rate (%), the better the thermal stability.
  • ⁇ Solvent resistance test> The strip-shaped cured product adhered on the glass plate was immersed in 23 ° C.
  • Example 2 A frame prepared by cutting out a silicone rubber sheet on a glass plate is placed and adhered, and 100 parts by mass of the fluoropolymer (P1) obtained in Synthesis Example 1 is added to TEMPIC (trade name, manufactured by SC Organic Chemical Co., Ltd.). ) was heated and mixed at 100 ° C., poured into the inside of the above frame, degassed under reduced pressure and cooled. This was cured by UV irradiation using a low-pressure mercury lamp UVB-40 (device name, manufactured by Sen Special Light Company, Ltd .: main wavelength 254 nm), so that it was colorless on a glass plate with a width of 1 cm, a length of 3 cm, and a thickness of 1 mm. A transparent strip-shaped cured product was obtained. Using the strip-like cured product, an adhesion test, a 200 ° C. heating test, and a solvent resistance test were performed. The results are shown in Table 1.
  • Example 1 and Example 2 exhibited good adhesion, thermal stability, and solvent resistance because the fluoropolymer (P1) having an amidated main chain end was used as the fluoropolymer. .
  • the cured product obtained in Comparative Example 1 could not be obtained because the fluoropolymer (P2) having a main chain terminal group of —COOH was used as the fluoropolymer.
  • the cured product obtained in Comparative Example 2 used a fluoropolymer (P3) having a main chain terminal group of —COOCH 3 as a fluoropolymer, the adhesiveness, thermal stability and solvent resistance were insufficient. .
  • Example 3 The LED element was sealed using the fluoropolymer (P1) obtained in Synthesis Example 1. Specifically, a fluoropolymer (P1) heated and fluidized is applied to an LED element in which a GaN-based LED (emission wavelength: 460 nm) is wire-bonded to a circuit board in which silver wiring is performed on an aluminum substrate with an epoxy insulating layer, The pressure was reduced at 100 ° C. for 3 minutes to remove bubbles (air). After cooling to room temperature, it is irradiated for 1 hour using a low-pressure mercury lamp UVB-40 (device name, manufactured by Sen Special Light Source Co., Ltd .: main wavelength 254 nm), and heated at 150 ° C.
  • UVB-40 low-pressure mercury lamp
  • the obtained LED element was subjected to a temperature cycle test in which one cycle was ⁇ 40 ° C. for 15 minutes and 125 ° C. for 15 minutes. When the voltage-current characteristics of the LED were measured every 100 temperature cycles, the initial characteristics were maintained even after 500 times because the fluoropolymer (P1) having an amidated main chain end was used.
  • Example 4 The LED element was sealed using a mixture of the fluoropolymer (P1) obtained in Synthesis Example 1 and TEMPIC (trade name, manufactured by SC Organic Chemical Co., Ltd.) which is a thiol compound. Specifically, the mixture is heated to 100 ° C. and poured into a recess of a cup-type LED element (housing: made of alumina, electrode: gold) to which a GaN-based LED (emission wavelength: 460 nm) is connected by wire bonding. Bubbled and cooled. The LED element was sealed by UV irradiation and curing using a low pressure mercury lamp UVB-40 (device name, manufactured by Sen Special Light Source Co., Ltd .: main wavelength 254 nm).
  • UVB-40 low pressure mercury lamp
  • the obtained LED element was subjected to a temperature cycle test in which one cycle was ⁇ 40 ° C. for 15 minutes and 125 ° C. for 15 minutes.
  • the initial characteristics were maintained even after 1,000 times because the fluoropolymer (P1) and thiol compound having an amidated main chain end were used. It was.
  • Example 3 In Example 3, except that the fluoropolymer used was changed to the fluoropolymer (P3) obtained in Synthesis Example 3, an LED element was produced in the same manner as in Example 3, and a temperature cycle test was performed. As a result, since the fluoropolymer (P3) having a methyl ester group at the end of the main chain was used, it was found that no current flowed after 100 temperature cycles, and that the bonding wire was detached from the LED element due to peeling of the sealing resin. It was.
  • Example 5 A frame prepared by cutting out a silicone rubber sheet on a glass plate is placed and adhered, and the fluoropolymer (P1) obtained in Synthesis Example 1 is heated at 100 ° C. and poured into the inside of the frame, followed by depressurization. Bubbled and cooled. This is cured by UV irradiation using a low-pressure mercury lamp UVB-40 (device name, manufactured by Sen Special Light Source Co., Ltd., main wavelength: 254 nm), thereby forming a colorless and transparent strip of 4 cm square and 1 mm thickness on a glass plate. A cured product was obtained. The following evaluation was performed using the strip-shaped cured product. The results are shown in Table 2.
  • the cured product of the present invention has a low degree of swelling with respect to a nitrile solvent, and when used as a sealing agent for a battery such as a dye-sensitized solar cell, it has excellent solvent resistance to an electrolyte solvent. Confirmed that.
  • cured material which is excellent in thermal stability and adhesiveness, and is excellent in chemical resistance and a weather resistance, and a fluorine-containing curable composition containing the same can be provided.
  • a cured product obtained from the fluoropolymer or fluorine-containing curable composition can provide a highly reliable optical element, and in particular, an LED sealing agent and a dye-sensitized solar cell sealing material.

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Abstract

L'invention porte sur un polymère fluoré durcissable qui présente des caractéristiques de thermostabilité et des caractéristiques d'adhésion thermique supérieures lorsqu'il est durci et sur une composition de résine fluorée durcissable qui contient ledit polymère fluoré. De façon spécifique, l'invention porte sur un polymère fluoré qui a une double liaison polymérisable, ledit polymère fluoré étant caractérisé en ce qu'il est un copolymère comportant un motif répété issu d'un monoène fluoré (a) et un motif répété issu d'un diène fluoré (b) qui a une chaîne latérale insaturée résiduelle et en ce qu'un groupe amide est présent à l'extrémité de la chaîne principale. L'invention porte également sur une composition de résine fluorée durcissable qui comprend le polymère fluoré.
PCT/JP2011/051956 2010-02-05 2011-01-31 Polymère fluoré et composition de résine fluorée durcissable WO2011096371A1 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150063102A (ko) * 2012-09-28 2015-06-08 이 아이 듀폰 디 네모아 앤드 캄파니 퍼플루오로에테르 펜던트 기를 갖는 퍼플루오로알킬-가교결합된 플루오로중합체
WO2016125795A1 (fr) * 2015-02-05 2016-08-11 旭硝子株式会社 Composition de résine photosensible, procédé de production de film de résine, procédé de production d'élément semi-conducteur organique, et polymère contenant du fluor
WO2017010425A1 (fr) * 2015-07-14 2017-01-19 ダイキン工業株式会社 Résine fluorée et article moulé
JP2020139092A (ja) * 2019-02-28 2020-09-03 東ソー株式会社 フッ素樹脂の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198709A (ja) * 1984-10-18 1986-05-17 イー・アイ・デユポン・デ・ニモアス・アンド・カンパニー 熱安定性テトラフルオロエチレン/パーフルオロ(アルキルビニルエーテル)コポリマー
JPH01115933A (ja) * 1987-10-28 1989-05-09 Daikin Ind Ltd テトラフルオロエチレン系共重合体の安定化方法
JPH0420507A (ja) * 1990-05-14 1992-01-24 Daikin Ind Ltd テトラフルオロエチレン共重合体およびその製法
JPH06248026A (ja) * 1993-02-24 1994-09-06 Asahi Glass Co Ltd 硬化性含フッ素共重合体組成物
JPH09183812A (ja) * 1995-12-21 1997-07-15 Dyneon Gmbh 熱可塑性フルオロポリマーの後処理方法
WO2002088227A1 (fr) * 2001-04-26 2002-11-07 Daikin Industries, Ltd. Poudre de polymere contenant du fluor, procede de production associe et article revetu
WO2009096342A1 (fr) * 2008-01-28 2009-08-06 Asahi Glass Company, Limited Composition durcissable, produit durci contenant du fluor, matériau optique utilisant le produit durci, et dispositif émettant de la lumière

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198709A (ja) * 1984-10-18 1986-05-17 イー・アイ・デユポン・デ・ニモアス・アンド・カンパニー 熱安定性テトラフルオロエチレン/パーフルオロ(アルキルビニルエーテル)コポリマー
JPH01115933A (ja) * 1987-10-28 1989-05-09 Daikin Ind Ltd テトラフルオロエチレン系共重合体の安定化方法
JPH0420507A (ja) * 1990-05-14 1992-01-24 Daikin Ind Ltd テトラフルオロエチレン共重合体およびその製法
JPH06248026A (ja) * 1993-02-24 1994-09-06 Asahi Glass Co Ltd 硬化性含フッ素共重合体組成物
JPH09183812A (ja) * 1995-12-21 1997-07-15 Dyneon Gmbh 熱可塑性フルオロポリマーの後処理方法
WO2002088227A1 (fr) * 2001-04-26 2002-11-07 Daikin Industries, Ltd. Poudre de polymere contenant du fluor, procede de production associe et article revetu
WO2009096342A1 (fr) * 2008-01-28 2009-08-06 Asahi Glass Company, Limited Composition durcissable, produit durci contenant du fluor, matériau optique utilisant le produit durci, et dispositif émettant de la lumière

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9567419B2 (en) * 2012-09-28 2017-02-14 E I Du Pont De Nemours And Company Perfluoroalkyl-crosslinked fluoropolymer with perfluoroether pendant groups
US20150210794A1 (en) * 2012-09-28 2015-07-30 E.I. Du Pont De Nemours And Company Perfluoroalkyl-crosslinked fluoropolymer with perfluoroether pendant groups
JP2015530467A (ja) * 2012-09-28 2015-10-15 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company パーフルオロエーテル基を持ったパーフルオロアルキル架橋フルオロポリマー
KR102143875B1 (ko) * 2012-09-28 2020-08-12 이 아이 듀폰 디 네모아 앤드 캄파니 퍼플루오로에테르 펜던트 기를 갖는 퍼플루오로알킬-가교결합된 플루오로중합체
KR20150063102A (ko) * 2012-09-28 2015-06-08 이 아이 듀폰 디 네모아 앤드 캄파니 퍼플루오로에테르 펜던트 기를 갖는 퍼플루오로알킬-가교결합된 플루오로중합체
US10241404B2 (en) 2015-02-05 2019-03-26 AGC Inc. Photosensitive resin composition, production method for resin film, production method for organic semiconductor element, and fluorine-containing polymer
US20170322488A1 (en) * 2015-02-05 2017-11-09 Asahi Glass Company, Limited Photosensitive resin composition, production method for resin film, production method for organic semiconductor element, and fluorine-containing polymer
JPWO2016125795A1 (ja) * 2015-02-05 2017-11-16 旭硝子株式会社 感光性樹脂組成物、樹脂膜の製造方法、有機半導体素子の製造方法および含フッ素重合体
CN107430341A (zh) * 2015-02-05 2017-12-01 旭硝子株式会社 感光性树脂组合物、树脂膜的制造方法、有机半导体元件的制造方法以及含氟聚合物
EP3255495A4 (fr) * 2015-02-05 2018-04-04 Asahi Glass Company, Limited Composition de résine photosensible, procédé de production de film de résine, procédé de production d'élément semi-conducteur organique, et polymère contenant du fluor
WO2016125795A1 (fr) * 2015-02-05 2016-08-11 旭硝子株式会社 Composition de résine photosensible, procédé de production de film de résine, procédé de production d'élément semi-conducteur organique, et polymère contenant du fluor
CN107430341B (zh) * 2015-02-05 2021-03-05 Agc株式会社 感光性树脂组合物、树脂膜的制造方法、有机半导体元件的制造方法
JPWO2017010425A1 (ja) * 2015-07-14 2017-12-28 ダイキン工業株式会社 フッ素樹脂及び成形体
CN107835824A (zh) * 2015-07-14 2018-03-23 大金工业株式会社 氟树脂和成型体
WO2017010425A1 (fr) * 2015-07-14 2017-01-19 ダイキン工業株式会社 Résine fluorée et article moulé
JP2020139092A (ja) * 2019-02-28 2020-09-03 東ソー株式会社 フッ素樹脂の製造方法
JP7338169B2 (ja) 2019-02-28 2023-09-05 東ソー株式会社 フッ素樹脂の製造方法

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