WO2011093934A8 - Procédé pour améliorer le dépôt de substrats non conducteurs - Google Patents

Procédé pour améliorer le dépôt de substrats non conducteurs Download PDF

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Publication number
WO2011093934A8
WO2011093934A8 PCT/US2010/056121 US2010056121W WO2011093934A8 WO 2011093934 A8 WO2011093934 A8 WO 2011093934A8 US 2010056121 W US2010056121 W US 2010056121W WO 2011093934 A8 WO2011093934 A8 WO 2011093934A8
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conductive substrates
plating
improving plating
laser
Prior art date
Application number
PCT/US2010/056121
Other languages
English (en)
Other versions
WO2011093934A1 (fr
Inventor
Robert Hamilton
Ernest Long
Andrew M. Krol
Original Assignee
Macdermid Acumen, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Acumen, Inc. filed Critical Macdermid Acumen, Inc.
Priority to EP10844919.0A priority Critical patent/EP2529395B1/fr
Priority to JP2012549985A priority patent/JP5612127B2/ja
Priority to CN2010800622688A priority patent/CN102714163A/zh
Priority to ES10844919T priority patent/ES2742198T3/es
Publication of WO2011093934A1 publication Critical patent/WO2011093934A1/fr
Publication of WO2011093934A8 publication Critical patent/WO2011093934A8/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un procédé de traitement d'un substrat thermoplastique activé par laser dans lequel est dispersé un composé métallique. Le substrat est au contact d'une composition aqueuse comprenant : (i) un composé organique fonctionnel de thiol; (ii) un agent de surface à base d'alcool éthoxylé; et (iii) une gomme xanthique. L'utilisation de la composition de traitement, lorsque le substrat est ensuite activé par laser puis subit un dépôt par placage anélectrolytique, permet d'éliminer sensiblement le dépôt parasite du substrat.
PCT/US2010/056121 2010-01-26 2010-11-10 Procédé pour améliorer le dépôt de substrats non conducteurs WO2011093934A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP10844919.0A EP2529395B1 (fr) 2010-01-26 2010-11-10 Procédé pour améliorer le dépôt de substrats non conducteurs
JP2012549985A JP5612127B2 (ja) 2010-01-26 2010-11-10 非伝導性基材の改善されためっき方法
CN2010800622688A CN102714163A (zh) 2010-01-26 2010-11-10 非导体基材镀敷的改良方法
ES10844919T ES2742198T3 (es) 2010-01-26 2010-11-10 Procedimiento para mejorar la galvanización en sustratos no conductores

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/693,548 2010-01-26
US12/693,548 US8974869B2 (en) 2010-01-26 2010-01-26 Method for improving plating on non-conductive substrates

Publications (2)

Publication Number Publication Date
WO2011093934A1 WO2011093934A1 (fr) 2011-08-04
WO2011093934A8 true WO2011093934A8 (fr) 2012-08-23

Family

ID=44309157

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/056121 WO2011093934A1 (fr) 2010-01-26 2010-11-10 Procédé pour améliorer le dépôt de substrats non conducteurs

Country Status (7)

Country Link
US (2) US8974869B2 (fr)
EP (1) EP2529395B1 (fr)
JP (1) JP5612127B2 (fr)
CN (1) CN102714163A (fr)
ES (1) ES2742198T3 (fr)
TW (1) TW201129714A (fr)
WO (1) WO2011093934A1 (fr)

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KR20130033091A (ko) * 2011-09-26 2013-04-03 에더트로닉스코리아 (주) 무선통신기기에 설치되는 내장형 안테나 모듈 및 이의 제조방법
EP2581469B1 (fr) * 2011-10-10 2015-04-15 Enthone, Inc. Solution d'activation aqueuse et procédé pour le dépôt autocatalytique de cuivre sur des substrats structurés directement par laser
KR20160021107A (ko) * 2013-06-18 2016-02-24 가부시끼가이샤 제이씨유 무전해 금속 도금의 브릿지 방지액 및 이를 이용한 프린트 배선판의 제조방법
JP6230625B2 (ja) * 2014-01-14 2017-11-15 太陽インキ製造株式会社 立体回路基板およびこれに用いるソルダーレジスト組成物
KR101737566B1 (ko) 2014-09-11 2017-05-18 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
WO2016043540A1 (fr) * 2014-09-17 2016-03-24 주식회사 엘지화학 Composition pour la formation de tracés conducteurs, et structure en résine présentant un tracé conducteur
WO2016043542A1 (fr) * 2014-09-17 2016-03-24 주식회사 엘지화학 Composition pour la formation d'un motif conducteur, et structure en résine possédant un motif conducteur
KR101774041B1 (ko) 2014-09-17 2017-09-01 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 가지는 수지 구조체
KR101698160B1 (ko) * 2014-09-17 2017-01-19 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
WO2016043541A1 (fr) * 2014-09-17 2016-03-24 주식회사 엘지화학 Composition pour la formation d'un motif conducteur, et structure en résine possédant un motif conducteur
US9777380B2 (en) 2015-07-07 2017-10-03 Board Of Regents, The University Of Texas System Multi-layered 3D printed laser direct structuring for electrical interconnect and antennas
US9970114B2 (en) 2016-09-13 2018-05-15 Rohm And Haas Electronic Materials Llc Shielding coating for selective metallization
US9850578B1 (en) 2016-09-13 2017-12-26 Rohm And Haas Electronic Materials Llc Shielding coating for selective metallization
US9797043B1 (en) 2016-09-13 2017-10-24 Rohm And Haas Electronic Materials Llc Shielding coating for selective metallization

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Also Published As

Publication number Publication date
EP2529395A1 (fr) 2012-12-05
US20130136869A1 (en) 2013-05-30
ES2742198T3 (es) 2020-02-13
US20110183082A1 (en) 2011-07-28
US9067238B2 (en) 2015-06-30
EP2529395A4 (fr) 2015-05-06
WO2011093934A1 (fr) 2011-08-04
JP5612127B2 (ja) 2014-10-22
JP2013518180A (ja) 2013-05-20
US8974869B2 (en) 2015-03-10
CN102714163A (zh) 2012-10-03
EP2529395B1 (fr) 2019-08-07
TW201129714A (en) 2011-09-01

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