WO2016043541A1 - Composition pour la formation d'un motif conducteur, et structure en résine possédant un motif conducteur - Google Patents

Composition pour la formation d'un motif conducteur, et structure en résine possédant un motif conducteur Download PDF

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Publication number
WO2016043541A1
WO2016043541A1 PCT/KR2015/009785 KR2015009785W WO2016043541A1 WO 2016043541 A1 WO2016043541 A1 WO 2016043541A1 KR 2015009785 W KR2015009785 W KR 2015009785W WO 2016043541 A1 WO2016043541 A1 WO 2016043541A1
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WIPO (PCT)
Prior art keywords
resin
conductive pattern
composition
conductive
forming
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Application number
PCT/KR2015/009785
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English (en)
Korean (ko)
Inventor
전신희
이대기
손세희
정한나
박철희
박치성
김재현
이하나
Original Assignee
주식회사 엘지화학
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Publication date
Priority claimed from KR1020150130983A external-priority patent/KR101698160B1/ko
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to US15/504,268 priority Critical patent/US10297363B2/en
Priority to JP2017507764A priority patent/JP6491318B2/ja
Priority to EP15842308.7A priority patent/EP3154066B1/fr
Priority to CN201580049719.7A priority patent/CN106716554B/zh
Publication of WO2016043541A1 publication Critical patent/WO2016043541A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Definitions

  • a resin structure having a composition for forming a conductive pattern and a conductive pattern
  • the present invention enables to form a fine conductive pattern in a simplified process on a variety of polymer resin products or resin layers, and a conductive pattern forming composition and conductive to enable more effective stratification of the needs of the art, such as various colors It relates to a resin structure having a pattern.
  • a method of forming a conductive pattern by forming a metal layer on a surface of a polymer resin substrate and then applying photolithography or printing a conductive paste may be considered.
  • a conductive pattern according to this technique there is a disadvantage that the required process or equipment is too complicated, or difficult to form a good and fine conductive pattern. Therefore, the development of a technology that can more effectively form a fine conductive pattern on the surface of the polymer resin substrate in a simplified process has been required before.
  • Incorporating special inorganic additives into Hanarose resin a technique capable of satisfying the needs of the art, irradiating electromagnetic waves such as a laser to a portion to form a conductive pattern, and then performing plating or the like on the electromagnetic radiation irradiated area to surface the polymer resin substrate. It is known to simply form a conductive pattern on the substrate.
  • the present invention enables to form a fine conductive pattern in a simplified process on a variety of polymer resin products or resin layers, and provides a composition for forming a conductive pattern to more effectively meet the needs of the art, such as the implementation of various colors It is.
  • the present invention also provides a resin structure having a conductive pattern formed through the conductive pattern forming method from the composition for forming a conductive pattern.
  • One embodiment of the present invention provides a polymer resin; And a non-conductive metal compound represented by Chemical Formula 1 having a P 1 space group having a triclinic structure or a Cc or C 2 / c space group having a monoclinic structure, wherein the metal nucleus is separated from the non-conductive metal compound by electromagnetic radiation.
  • a composition for forming a conductive pattern by electromagnetic wave radiation to be formed is provided.
  • a in Formula 1 is at least one metal selected from the group consisting of Li, Na, Cu, Ag, and Au, and B is Sn, Ti, Zr, and
  • the conductive pattern forming composition may further include a non-conductive metal compound represented by Chemical Formula 1 having an R> C space group having a trigonal structure.
  • the polymer resin may be a thermosetting resin or a thermoplastic resin, more specific examples thereof, ABS (Acryloni tile poly-butadiene styrene) resin, polyalkylene terephthalate And at least one selected from the group consisting of resins, polycarbonate resins, polypropylene resins, and polyphthalamide resins.
  • ABS Acryloni tile poly-butadiene styrene
  • polyalkylene terephthalate And at least one selected from the group consisting of resins, polycarbonate resins, polypropylene resins, and polyphthalamide resins.
  • the non-conductive metal compound in the composition for forming a conductive pattern, may be included in an amount of about 0.1 to 15 wt 3 ⁇ 4> based on the total composition.
  • composition for forming a conductive pattern may further include one or more additives selected from the group consisting of flame retardants, heat stabilizers, UV stabilizers, lubricants, antioxidants, inorganic layer agents, color additives, layer reinforcing agents and functional reinforcing agents.
  • the present invention also provides a resin structure in which a conductive metal layer (conductive pattern) is formed on the surface of a polymer resin substrate using the above-described composition for forming a conductive pattern.
  • Resin structure having such a conductive pattern _ ⁇ is a polymer resin substrate;
  • An adhesive active surface comprising a metal nucleus exposed to a surface of a polymer resin substrate in a predetermined region; And it may include a conductive metal layer formed on the adhesive active surface.
  • a predetermined region in which the adhesive active surface and the conductive metal layer are formed may correspond to a region in which electromagnetic waves are irradiated onto the polymer resin substrate.
  • the resin structure may have a layer strength measured by Izod notched type by the ASTM D256 method of about 4. 1 / cm or more.
  • a composition for forming a conductive pattern which enables to form a fine conductive pattern on a polymer resin substrate such as various polymer resin products or resin layers by a very simplified process of irradiating electromagnetic waves such as a laser, and formed therefrom A resin structure having a conductive pattern is provided.
  • composition for forming a conductive pattern when used, a good conductive pattern is formed on the resin structure while more effectively satisfying the needs of the art to realize various colors of the resin structure (various polymer resin products or resin layers, etc.). It can be formed easily.
  • FIG. 1 is a view schematically showing a structure of a non-conductive metal compound having an R3c space group having a trigonal structure included in a composition for forming a conductive pattern according to an embodiment of the present invention.
  • FIG. 2 is a diagram schematically illustrating a structure of a non-conductive metal compound having a P 1 space group having a triclinic structure included in a composition for forming a conductive pattern according to another embodiment of the present invention.
  • FIG. 3 is a view briefly showing an example of a method of forming a conductive pattern using a composition according to an embodiment of the present invention in process steps.
  • FIG. 4 is a diagram showing an XRD pattern of a non-conductive metal compound synthesized in Preparation Example 1.
  • FIG. 5 is a diagram showing an XRD pattern of a non-conductive metal compound synthesized in Preparation Example 2.
  • a composition for forming a conductive pattern according to a specific embodiment of the present invention, and a resin structure having the conductive pattern formed therefrom will be described.
  • a polymer resin; And triclinic structure (tr icl ini c PI space group of the structure or! "Cc or C2 / c space group of" monocl inic structure ", and includes a non-conductive metal compound represented by the formula (1), by the electromagnetic wave irradiation Provided is a composition for forming a conductive pattern by electromagnetic wave irradiation in which a metal nucleus is formed from a non-conductive metal compound.
  • Formula 1 A and ⁇ each independently represent a different metal, X is a free number between 0.5 and 1.
  • Formula 1 may also be represented by A x B 2 (P0 4 ) 3 .
  • A may be at least one metal selected from the group consisting of Li, Na, Cu, Ag, and Au
  • B may represent at least one metal selected from the group consisting of Sn, Ti, Zr, and Hf. have.
  • the non-conductive metal compound represented by Chemical Formula 1 is a space group of various crystal structures depending on the position of A metal in a three-dimensionally connected basic structure in which P0 4 tetrahedron and B0 6 octahedron share oxygen at each corner. ) In general, when a non-conductive metal compound represented by Chemical Formula 1 is synthesized,
  • element A is located in a channel surrounded by six oxygens in a crystal lattice formed by four PO 4 tetrahedra and two B 6 octahedrons.
  • the non-conductive metal compound having such a trigonal structure may have a tr icl inic or a monoclinic structure by phase transition, which is illustrated in FIG. 2. It was.
  • the center of the channel formed by two P0 4 tetrahedrons and four B0 6 octahedrons is 0 0 0.
  • 4 4 4 442 44 442 element A can be located sharing four oxygen. However, not all A elements exist in these positions, and may exist only in some positions. ⁇
  • the crystal structure becomes Cc, symmetry due to 2-fold disappears.
  • the seat becomes Ml si te which can share two oxygens,
  • the site may be M2 si te that shares four oxygen as in the case of C2 / c.
  • the A element is positioned only in a part of M 2 si te.
  • the A element is a transition metal element such as Cu, the oxidation number may be changed from monovalent to divalent.
  • X in Formula 1 will have a value between 0.5 and 1.
  • the crystal structure of the non-conductive metal compound represented by Chemical Formula 1 may be determined according to the type of metal included in the compound and the phase transition that occurs according to the firing temperature when the compound is synthesized.
  • non-conductive metal compound of Formula 1 when firing at a low temperature of about 100 CTC or less in order to synthesize the non-conductive metal compound of Formula 1, it belongs to the P 1 space group of the triclinic structure (tr i cl ini c structure) having a lower symmetry than the trigonal structure A nonconductive metal compound of Formula 1 may be obtained or a nonconductive metal compound of Formula 1 belonging to a Cc or C2 / c space group of a monoclinic structure.
  • non-conductive metal compounds having a ⁇ 3C space group of some trigonal structure may be synthesized, or P 1 space group of some triclinic structure or single yarn when high temperature firing is used.
  • the composition for forming a conductive pattern further includes a non-conductive metal compound of Formula 1 having a R?> C space group having a trigonal structure in addition to the non-conductive metal compound of Formula 1 having a P 1 , Cc, or ⁇ lc space group. It may include. _
  • metal nuclei may be formed from the non-conductive metal compound.
  • the non-conductive metal compound of Chemical Formula 1 having the ri , Cc, or C2 / c space group is chemically stable in a general environment, but in a region exposed to electromagnetic waves of a specific wavelength, the metal or ion thereof in the Si te It can be easily separated from the material. Therefore, the metal nucleus can be more easily formed by the irradiation of the electromagnetic waves.
  • the metal core thus formed may be selectively exposed in a predetermined region irradiated with electromagnetic waves to form an adhesive active surface of the polymer resin substrate surface. Subsequently, when the metal core separated from the non-conductive metal compound or a metal nucleus including the ions thereof is subjected to chemical reduction treatment, or the seed is electrolessly plated with a plating solution containing conductive metal ions, the metal nucleus is included. A conductive metal layer may be formed on the adhesively active surface.
  • the P 1 . The non-conductive metal compound of Chemical Formula 1 having a Cc or C2 / c space group not only exhibits non-conductive properties before electromagnetic wave irradiation, but also has excellent compatibility with the polymer resin, and chemically reacts with a solution used for the reduction or plating treatment. It is stable and has a characteristic of maintaining non-conductivity. _
  • the non-conductive metal compound of Formula 1 having such a P 1 , Cc, or C 2 / c space group is chemically stable in a uniformly dispersed state in the polymer resin substrate in a region where electromagnetic waves are not irradiated, thereby making it non-conductive. Can be represented.
  • metals or ions thereof can easily be generated from the non-conductive metal compound to form metal nuclei and fine conductive patterns based on the above-described principles.
  • composition of the above-described embodiment it is possible to form a fine conductive pattern in a very simplified process of irradiating electromagnetic waves, such as a laser, on various polymer resin products or polymer resin substrates such as resin layers, in particular, Since the metal nucleus which promotes the formation of the conductive pattern can be formed very easily, a better conductive pattern can be formed more easily than the composition of the same kind previously known. ⁇
  • Metallic compounds typically compounds such as Cu x Sn 2 (P0 4 ) 3 (0.5 ⁇ x ⁇ l) can exhibit a bright color that is nearly white or nearly blue in heat, and can be used in various polymer resin products or resin layers. May hardly color. Therefore, the use of the composition of one embodiment comprising the same can more effectively meet the needs of the art to implement a variety of colors, such as various polymer resin products with the addition of a relatively small amount of color additives.
  • any thermosetting resin or thermoplastic resin capable of forming various polymer resin products or resin layers may be used without particular limitation.
  • the specific non-conductive metal compound described above may exhibit excellent compatibility and uniform dispersibility with various polymer resins, and the composition of one embodiment may be molded into various resin products or resin layers including various polymer resins.
  • Specific examples of such polymer resins include polyalkylene terephthalate resins such as ABS resins, polybutylene terephthalate resins, and polyethylene terephthalate resins, polycarbonate resins, polypropylene resins, and polyphthalamide resins.
  • Various polymer resins can be included. _
  • the non-conductive metal compound of Formula 1 having the P 1 , Cc or C 2 / c space group is about 0.1 to 15% by weight, or about 3 to 13% by weight based on the total composition It may be included, and the remaining amount of polymer resin may be included. According to this content range, while maintaining the basic physical properties such as the mechanical properties of the polymer resin product or the resin layer formed from the composition, it can preferably exhibit the characteristics of forming a conductive pattern in a certain region by electromagnetic wave irradiation.
  • the composition for forming a conductive pattern may include a flame retardant, a heat stabilizer, a UV stabilizer, a lubricant, an antioxidant, an inorganic filler, a color additive, an impact modifier, and a functional reinforcement agent, in addition to the polymer resin and the predetermined non-conductive metal compound. It may further comprise one or more additives selected. The addition of these additives can be appropriately reinforce the physical properties of the resin structure, resulting from one embodiment the composition i. Among these additives, in the case of the color additive, for example, pigment, etc., it is included in an amount of about 0.1 to 10% by weight, and the desired color is applied to the resin structure. It can be given.
  • color additives such as pigments include white pigments such as ZnO, ZnS, Talc, Ti0 2 , Sn0 2 ( CaCO 3 , Sb 2 0 3 , BaS0 4, or clay), and can be used in polymer resin compositions.
  • white pigments such as ZnO, ZnS, Talc, Ti0 2 , Sn0 2 ( CaCO 3 , Sb 2 0 3 , BaS0 4, or clay
  • color additives such as pigments of various kinds and colors known to be used.
  • the flame retardant may include a phosphorus-based flame retardant and an inorganic flame retardant. More specifically, the phosphorus-based flame retardant may include triphenyl phosphate (TPP), trixylenyl phosphate (TXP), tricresyl phosphate (TCP), or triisophenyl phosphate.
  • TPP triphenyl phosphate
  • TXP trixylenyl phosphate
  • TCP tricresyl phosphate
  • TCP triisophenyl phosphate
  • Phosphate ester flame retardants including RE0F0S
  • Aromatic polyphosphate-based flame retardants including RE0F0S
  • Aromatic polyphosphate-based flame retardants Polyphosphate flame retardants
  • red phosphorus-based flame retardants may be used, and various phosphorus-based flame retardants known to be usable in the resin composition may be used without any particular limitation.
  • the inorganic flame retardant may include aluminum hydroxide, magnesium hydroxide, zinc borate, molybdenum oxide (Mo), molybdenum peroxide salt (Mo 2 0 7 2 ⁇ ), calcium-zinc-molybdate, antimony trioxide (Sb 2 0 3 ) Or antimony pentoxide (Sb 2 0 5 ) and the like.
  • examples of the inorganic flame retardant are not limited thereto, and various inorganic flame retardants known to be usable in other resin compositions may be used without any particular limitation.
  • a heat stabilizer in the case of an impact modifier, a heat stabilizer, a UV stabilizer, a lubricant or an antioxidant, it is included in an amount of about 0.01 to 5% by weight, or about 0.05 to 3% by weight, so as to properly express desired physical properties in the resin structure. Can be.
  • the method for forming the conductive pattern may include forming the resin layer by molding the above-described composition for forming a conductive pattern into a resin product or by applying it to another product; Irradiating an electromagnetic wave to a predetermined region of the resin product or the resin layer to generate a metal nucleus containing metals or ions thereof from the non-conductive metal compound particles of Formula 1 having the P1 , Cc, or C2 / c space group; And a region where the metal nucleus is generated Chemically reducing or plating to form a conductive metal layer.
  • FIG. 3 an example of the method of forming the conductive pattern is shown in a simplified step by step.
  • the above-described composition for forming a conductive pattern may be molded into a resin product or applied to another product to form a resin layer.
  • a product molding method or a resin layer forming method using the phosphorus polymer resin composition may be applied without particular limitation.
  • the composition for forming a conductive pattern is extruded and engraved, and then formed into pellets or particles, and then injection molded into a desired form to produce various polymer resin products. Can be.
  • the polymer resin product or the resin layer thus formed may have a form in which the above-mentioned special non-conductive metal compound is uniformly dispersed on the resin substrate formed from the polymer resin.
  • the non-conductive metal compound of Formula 1 having the P 1 , Cc or C 2 / c space group has excellent compatibility and chemical stability with various polymer resins, it is uniformly dispersed throughout the entire area on the resin substrate It can be maintained in a state of malleability.
  • electromagnetic waves such as ray ⁇ may be irradiated to a predetermined region of the resin product or resin layer to form the conductive pattern.
  • the metal or its ions may be released from the non-conductive metal compound of Formula 1 having the P 1 , Cc, or C 2 / c space group, and may generate a metal core including the same. (See second drawing in FIG. 3).
  • the metal nucleus generation step by the electromagnetic wave irradiation proceeds, a portion of the non-conductive metal compound of Formula 1 having the ri , Cc or C2 / c space group to the surface of the predetermined region of the resin product or resin layer Metal nuclei are generated from this when exposed, and the adhesion activity is activated to have higher adhesion.
  • the surface can be formed.
  • the adhesion-activated surface is selectively formed only in a predetermined region irradiated with electromagnetic waves, when the plating step described below is performed, chemical reduction and / or electroless reduction of the metal core and the conductive metal ions included in the adhesion-activated surface are performed.
  • the conductive metal layer may be selectively formed on the polymer resin substrate in a predetermined region. More specifically, in the electroless plating, when the metal nucleus acts as a kind of seed, when the conductive metal ions contained in the plating solution are chemically reduced, strong bonds may be formed. As a result, the conductive metal layer can be selectively formed more easily.
  • laser electromagnetic waves may be irradiated among electromagnetic waves, for example, about 248 nm, about 308 nm, about 355 nm, about 532 nm, about 585 nm, about 755 nm, about 1064 nm, and about 1550 nm. Or laser electromagnetic waves having a wavelength of about 2940 nm. In another example, laser electromagnetic waves having a wavelength in the infrared (IR) region may be irradiated. In addition, the laser electromagnetic wave can be irradiated under normal conditions or power.
  • IR infrared
  • metal nuclei By irradiation of such a laser, metal nuclei can be generated more effectively from a non-conductive metal compound of Formula 1 having the P 1 , Cc or C 2 / c space group, and selectively generate an adhesive active surface including the same in a predetermined region, and May be exposed.
  • the step of chemically reducing or plating the region generating the metal nucleus may be performed to form a conductive metal layer. .
  • the conductive metal layer may be selectively formed in a predetermined region where the metal nucleus and the adhesive active surface are exposed, and the chemically stable non-conductive metal compound may maintain the non-conductivity as it is. have. Accordingly, a fine conductive pattern may be selectively formed only in a predetermined region on the polymer resin substrate.
  • the forming of the conductive metal layer may be performed by electroless plating, and thus a good conductive metal layer may be formed on the adhesively active surface.
  • the metal nucleus is generated.
  • the resin product or the resin layer in a predetermined area may be treated with an acidic or basic solution including a reducing agent, which is a reducing agent such as formaldehyde, hypophosphite, dimethylaminoborate (DMAB) and diethylaminoborate (DEAB). And it may include one or more selected from the group consisting of hydrazine.
  • a reducing agent which is a reducing agent such as formaldehyde, hypophosphite, dimethylaminoborate (DMAB) and diethylaminoborate (DEAB).
  • DMAB dimethylaminoborate
  • DEAB diethylaminoborate
  • the conductive metal layer may be formed by the electroless plating by treating with the above-described reducing agent and the electroless plating solution including the conductive metal ions.
  • the conductive metal ions contained in the metal core are reduced, or the conductive metal ions contained in the electroless plating solution are chemically reduced by using the seed as a seed in a region where the metal core is formed.
  • a good conductive pattern can be formed in a predetermined region.
  • the metal nucleus and the adhesion-activated surface may form strong bonds with the chemically reduced conductive metal ions, and as a result, a conductive pattern may be more easily formed in a predetermined region.
  • the non-conductive metal compound of Formula 1 having the P 1 , Cc or C 2 / c space group is uniformly dispersed in the resin structure.
  • a resin structure having a conductive pattern obtained by the above-described composition for forming a conductive pattern and a conductive pattern forming method includes a polymer resin substrate; A non-conductive metal compound dispersed in a polymer resin substrate, having a P 1 space group having a triclinic structure or a Cc or C 2 / c space group having a monoclinic structure, and represented by Chemical Formula 1; An adhesive active surface comprising a metal nucleus exposed to a surface of a polymer resin substrate in a predetermined region; And it may include a conductive metal worm formed on the adhesive active surface.
  • a predetermined region where the adhesive active surface and the conductive metal layer are formed may correspond to a region where electromagnetic waves are irradiated onto the polymer resin substrate.
  • the metal or its ions contained in the metal nucleus of the adhesion-activated surface may be derived from a non-conductive metal compound of Formula 1 having the P 1 , Cc or C 2 / c space group.
  • the conductive metal layer has the ri , Cc or C2 / c space group It may be derived from a metal contained in the non-conductive metal compound of Formula l or from a conductive metal ion contained in an electroless plating solution.
  • the resin structure may further include a residue derived from the non-conductive metal compound.
  • a residue may have a structure in which at least some of the metals included in the non-conductive metal compound are released, and vacancy is formed in at least a portion of the site.
  • the resin structure may have a layer strength of 4.0 J / cm or more measured in the Izod notched type by the ASTM D256 method despite the addition of the non-conductive metal compound described above. Therefore, by using this, while the conductive pattern is formed on the polymer resin substrate, it is possible to provide a polymer resin product and the like maintaining excellent mechanical properties.
  • the resin structure described above may be various resin products or resin layers, such as a mobile phone or tablet PC case having a conductive pattern for an antenna, or various resin products or resin layers having conductive patterns, such as other RFID tags, various sensors, or MEMS structures. have.
  • Copper carbonate hydrate (CuC (VCu (0H) 2 ), tin chloride ( ⁇ 4 ⁇ 5 ⁇ 2 0) and phosphoric acid (3 ⁇ 4 ⁇ 0 4 ) were quantitatively dissolved in dist il led water, 60 °
  • the mixture was stirred for 2 hours at C to form a mixed solution of copper and tin.
  • the mixed solution was then centrifuged and oven dried (80 ° C.) to remove the solvent from the mixed solution, followed by 900 ° C. Heat treatment for 2 hours at.
  • the bottom XRD pattern of FIG. 4 is an XRD pattern of pure CuSn 2 (P0 4 ) 3 having a P 1 space group, and the top XRD pattern is an XRD pattern of a compound synthesized under the same conditions.
  • CuSn 2 (P0 4 ) 3 is a non-conductive metal compound having a P 1 space group of triclinic structure.
  • the bottom XRD pattern of FIG. 5 is an XD pattern of pure CuSn 2 (P0 4 ) 3 having a space group, and the top XRD pretty turn is an XD pattern of a compound synthesized under the above conditions.
  • CuSn 2 (P0 4 ) 3 is a non-conductive metal compound having a trispace structure of ri space group.
  • additives include heat stabilizers (IR1076, PEP36), UV stabilizers (UV329), lubricants
  • CuSn 2 (P0 4 ) 3 prepared in Preparation Example 1 was added to 85 wt% 3 ⁇ 4 of the polycarbonate resin. 10% by weight, 4% by weight of impact modifier, and 1% by weight of other additives were mixed to obtain a composition, which was extruded through an extruder at a temperature of 260-28 CTC.
  • the composition in the form of extruded pellets was injection molded at about 260 to 270 ° C. in the form of a 100 mm diameter, 2 mm thick substrate and ASTM izod bar.
  • the surface was activated by irradiating a laser under 40 kHz conditions, and the electroless plating process was performed as follows.
  • the plating solution (hereinafter PA solution) was prepared by dissolving 3 g of copper sulfate, 14 g of lotel salt, and 4 g of sodium hydroxide in 100 ml of deionized water. To 40 ml of the prepared PA solution, 1.6 ml of formaldehyde was added as a reducing agent. The resin structure whose surface was activated by the laser was immersed in the plating solution for 4 to 5 hours, and then washed with distilled water. By the method mentioned above, the resin structure in which the electroconductive pattern of Example 1 was formed was formed.
  • Example 1 the content of polycarbonate resin was 80% by weight, the content of CiiSn 2 (P0 4 ) 3 prepared in Preparation Example 1 was 10 weight 3 ⁇ 4, and an additional Ti0 2 5 increase 3 ⁇ 4 was used as the pigment. Except that, a composition for forming a conductive pattern was prepared in the same manner as in Example 1, and a resin structure having a conductive pattern was prepared therefrom. Comparative Example 1: Formation of a Conductive Pattern by Laser Direct Irradiation
  • Example 1 the content of the polycarbonate resin was 90 weight 3 ⁇ 4,
  • a composition for forming a conductive pattern was prepared in the same manner as in Example 1, except that CuCr 2 0 4 5 wt% was used instead of 10 wt% of CuSn 2 (P0 4 ) 3 prepared in FIG. The resin structure was prepared. Comparative Example 2: Formation of Conductive Pattern by Laser Direct Irradiation
  • Example 1 The content of the polycarbonate resin in Example 1 was 91% by weight, except that Cu 2 (0H) (P0 4 ) 4% by weight instead of 10% by weight of CuSn 2 (P0 4 ) 3
  • Preparation Example 1 A composition for forming a conductive pattern was produced in the same manner as in Example 1, and a resin structure having a conductive pattern was prepared therefrom. Comparative Example 3 Formation of Conductive Pattern by Laser Direct Irradiation
  • Example 1 the content of the polycarbonate resin was 90% by weight, and Preparation Example
  • a conductive pattern forming composition was prepared in the same manner as in Example 1, except that Sb / Sn0 2 5 wt% was used instead of 10 wt% of CuSn 2 (P0 4 ) 3 prepared in Example 1, and the conductive pattern was The resin structure was prepared.
  • the impact strengths of the conductive patterns (black plating layer) formed on the resin structures of Examples 1 to 2 and Comparative Examples 1 to 4 were measured in I zod notched type by the ASTM D256 method.
  • the adhesion performance of the electroconductive pattern (black-plated layer) formed in the resin structures of Examples 1-2 and Comparative Examples 1-4 was evaluated using the ISO 2409 standard method.
  • the cl ass 0 rating means that the peeling area of the conductive pattern is 03 ⁇ 4 of the conductive pattern area to be evaluated
  • the cl ass 1 rating indicates that the peeling area of the conductive pattern is the area of the conductive pattern to be evaluated. It means more than 0% and less than 5%.
  • the cl ass 2 grade means that the peeling area of the conductive pattern is greater than 5% and 15% or less of the conductive pattern area to be evaluated.
  • the cl ass 3 grade means that the peeling area of the conductive pattern is more than 15% and 35% or less of the conductive pattern area to be evaluated.
  • the cl ass 4 grade means that the conductive pattern and the peeling area are greater than 35% and less than or equal to 65% of the conductive pattern area to be evaluated.
  • the cl ass 5 grade means that the peeling area of the conductive pattern is greater than 65% of the conductive pattern area to be evaluated.
  • the MFR of the resin structures of Examples 1-2 and Comparative Examples 1-4 were measured under a temperature of 300 ° C. and a load of 1.2 kg according to the method of ASTMD1238.
  • the layer structure strength of the resin structure tends to decrease as the content of the non-conductive metal compound increases.
  • the resin structure prepared in Examples 1 and 2 maintains an excellent impact strength even though it contains a large amount of non-conductive metal compound. Showed results.
  • the resin structures of Examples 1 and 2 showed sufficient layer strength to be utilized in resin products in which the built-in antennas were formed.
  • a high adhesive conductive pattern is formed through a simple process of irradiating electromagnetic waves to the polymer resin while maintaining the excellent physical properties of the polymer resin It is confirmed that it can be done.

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Abstract

La présente invention concerne une composition pour la formation d'un motif conducteur et une structure de résine ayant un motif conducteur, dans lequel la composition permet de former un motif conducteur fin sur divers produits de résine polymère ou couches de résine par un procédé simple, et peuvent plus efficacement répondre aux besoins de la technique, de telle sorte que pour afficher diverses couleurs.
PCT/KR2015/009785 2014-09-17 2015-09-17 Composition pour la formation d'un motif conducteur, et structure en résine possédant un motif conducteur WO2016043541A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US15/504,268 US10297363B2 (en) 2014-09-17 2015-09-17 Composition for forming conductive pattern and resin structure having conductive pattern
JP2017507764A JP6491318B2 (ja) 2014-09-17 2015-09-17 導電性パターン形成用組成物および導電性パターンを有する樹脂構造体
EP15842308.7A EP3154066B1 (fr) 2014-09-17 2015-09-17 Composition pour la formation d'un motif conducteur, et structure en résine possédant un motif conducteur
CN201580049719.7A CN106716554B (zh) 2014-09-17 2015-09-17 用于形成导电图案的组合物和具有导电图案的树脂结构

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KR20140123650 2014-09-17
KR10-2014-0123650 2014-09-17
KR10-2015-0130983 2015-09-16
KR1020150130983A KR101698160B1 (ko) 2014-09-17 2015-09-16 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체

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US20130106659A1 (en) * 2011-10-31 2013-05-02 Ticona Llc Thermoplastic Composition for Use in Forming a Laser Direct Structured Substrate
US20130136869A1 (en) * 2010-01-26 2013-05-30 Macdermid Acumen, Inc. Method for Improving Plating on Non-Conductive Substrates
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KR20150079416A (ko) * 2013-12-30 2015-07-08 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체

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KR100716486B1 (ko) * 2001-07-05 2007-05-10 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 도체 트랙 구조물 및 그 구조물의 제조 방법
KR20110112860A (ko) * 2009-12-17 2011-10-13 비와이디 컴퍼니 리미티드 표면 금속화 방법, 플라스틱 제품 제조 방법 및 이로부터 제조된 플라스틱 제품
US20130136869A1 (en) * 2010-01-26 2013-05-30 Macdermid Acumen, Inc. Method for Improving Plating on Non-Conductive Substrates
US20130106659A1 (en) * 2011-10-31 2013-05-02 Ticona Llc Thermoplastic Composition for Use in Forming a Laser Direct Structured Substrate
KR101434423B1 (ko) * 2013-04-02 2014-08-26 전자부품연구원 도전성 패턴을 위한 소재 및 이를 이용한 도전성 패턴 형성방법
KR20150079416A (ko) * 2013-12-30 2015-07-08 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체

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