WO2011084126A2 - Uv lamp assembly of degas chamber having rotary shutters - Google Patents
Uv lamp assembly of degas chamber having rotary shutters Download PDFInfo
- Publication number
- WO2011084126A2 WO2011084126A2 PCT/US2010/003090 US2010003090W WO2011084126A2 WO 2011084126 A2 WO2011084126 A2 WO 2011084126A2 US 2010003090 W US2010003090 W US 2010003090W WO 2011084126 A2 WO2011084126 A2 WO 2011084126A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lamps
- lamp assembly
- rotary
- degas chamber
- shutters
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H10P70/12—Cleaning before device manufacture, i.e. Begin-Of-Line process by dry cleaning only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0436—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Definitions
- a UV lamp assembly of a degas chamber comprising a plurality of parallel UV lamps and rotary shutters, each rotary shutter comprising a concave wall surrounding a UV lamp and two flanges extending outwardly from longitudinal edges of the concave wall, the rotary shutters configured to rotate between an open position and a closed position, wherein the rotary shutters at the open position are arranged above the UV lamps so as to not block UV light of the UV lamps from passing into the degas chamber; and the rotary shutters at the closed position, at which the flanges of adjacent rotary shutters overlap to prevent UV light leakage, are arranged below the UV lamps so as to block UV light of the UV lamps from passing into the degas chamber.
- Fig. 1 shows a schematic cross section of a degas chamber comprising a UV lamp assembly.
- Fig. 2a shows a perspective view of a rotary shutter.
- Fig. 2b shows an enlarged top view of an end portion of the rotary shutter in Fig. 2a.
- Fig. 3 shows a schematic cross section of the UV lamp assembly of Fig. 1, wherein the rotary shutters are in an open position.
- Fig. 4 shows a schematic cross section of the UV lamp assembly of Fig. 1, wherein the rotary shutters are in an closed position.
- Fig. 5a shows a perspective view of a UV lamp assembly wherein the rotary shutters are in the open position.
- Fig. 5b shows a perspective view of a UV lamp assembly wherein the rotary shutters are in the closed position.
- Fig. 6 shows a partial exploded view of a UV lamp assembly according to one embodiment.
- Fig. 7 shows a partial exploded view of a UV lamp assembly according to another embodiment.
- Fig. 8 shows a perspective view of the UV lamp assembly of Fig. 7, wherein rotary shutters are in a closed position.
- Fig. 9 shows a perspective view of the UV lamp assembly of Fig. 7, wherein rotary shutters are in an open position.
- Fig. 1 shows a schematic cross section of an exemplary degas chamber 100.
- the degas chamber 100 comprises a chamber wall 10, made of a metallic material such as aluminum.
- a quartz window 30 is clamped to a top of the chamber wall 10 by a plurality of clamps 40.
- the quartz window 30 is preferably made of synthetic quartz for its high transmission of UV light. Synthetic quartz is typically untwined and produced in an autoclave via the hydrothermal process.
- a continuous O-ring 35 between the quartz window 30 and the chamber wall 10 provides a vacuum seal.
- a UV lamp assembly 80 is disposed above the quartz window 30, preferably with a gap therebetween.
- a vacuum pump 60 is connected to the degas chamber 100 through an exhaust port which can be closed by a valve 65.
- a gas source 70 is connected to the degas chamber 100 through a gas line which can be closed by another valve 75.
- the quartz window 30 is configured to be mounted on the top of the degas chamber 100 in which UV light from the UV lamp assembly 80 is transmitted through the quartz window 30 while a gas such as ozone or oxygen is flowed in the degas chamber 100 to remove halogen-containing residues such as etch byproducts from a semiconductor substrate 50 such as a 300 mm wafer supported in the degas chamber 100.
- a gas such as ozone or oxygen
- halogen-containing residues such as etch byproducts from a semiconductor substrate 50 such as a 300 mm wafer supported in the degas chamber 100.
- Details of the quartz window 30 are disclosed in a commonly assigned U.S. Patent Application No. 12/607,659, which is hereby incorporated by reference.
- the UV lamp assembly 80 can be used with degas chamber systems other than that shown in Fig. 1.
- the semiconductor substrate 50 is transferred through a loading door 20 in the chamber wall 10 and placed on a plurality of substrate support pins 55.
- the degas chamber 100 is evacuated by the vacuum pump 60 and ozone gas or 0 2 gas from the gas source 70 flows into the degas chamber 100.
- Gas pressure in the degas chamber 100 is preferably maintained from 10 mTorr to 10 Torr.
- the UV lamp assembly 80 irradiates the semiconductor substrate 50 through the quartz window 30 with UV light preferably of a wavelength of 254 nm and intensity between 0.05 and 5 W/cm , for a period of 10 seconds to 1 minute.
- Ozone gas or 0 2 gas absorbs UV light and decomposes into O radicals (atomic oxygen) which react with halogen-containing residue on the semiconductor substrate 50.
- the reaction products are gaseous and are evacuated from the degas chamber 100 by the vacuum pump 60.
- UV light of the UV lamp assembly 80 is desirable to prevent UV light of the UV lamp assembly 80 from escaping the degas chamber 100, in order to protect human operators and equipment nearby.
- UV lamps 85 in the UV lamp assembly 80 remain powered rather than being switched on and off during each substrate transport.
- the UV lamp assembly 80 includes rotary shutters 90 which can be rotated to a closed position to block UV light from the UV lamps 85 when UV light is not needed in the degas chamber 100, such as during the process of transporting the substrate 50 into and out from the degas chamber 100.
- the rotary shutters 90 in the UV lamp assembly 80 can be rotated to an open position and allow UV light to reach the substrate 50 in the degas chamber 100.
- Fig. 2a shows a perspective view of a rotary shutter 90 according to an embodiment.
- the rotary shutter 90 comprises a concave (e.g. semi-cylindrical, semi-prismatic) wall 95 and two preferably co-planar flanges 93 and 94 extending outwardly along longitudinal edges of the concave wall 95.
- the flanges 93 and 94 preferably have a width of about 0.07 to 0.09 inch.
- the rotary shutter 90 is made of a material opaque to UV light, such as aluminum.
- a concave surface 91 of the concave wall 95 is preferably a reflective surface (such as a polished bare aluminum surface).
- Interior surfaces of the degas chamber 100 exposed to UV light of the UV lamp assembly 80 are preferably blackened (e.g. by anodization on aluminum surfaces) to reduce undesirable reflection of UV light.
- the flanges 93 and 94 stop short of the ends of the concave wall 95 to provide a gap in the longitudinal direction by at least about 0.1 inch from each end edge of the concave wall 95 which allows the concave wall 95 to be received in a groove of a support member.
- Fig. 2b shows an enlarged top view of an end portion the rotary shutter 90.
- Fig. 3 shows a cross sectional schematic of the UV lamp assembly 80, wherein rotary shutters 90 are in an open position, according to an embodiment.
- the UV lamp assembly 80 comprises a plurality of UV lamps 85 disposed parallel to each other.
- the UV lamps 85 can be arranged parallel with each other and preferably cover substantially the entire area of the quartz window 30 to achieve uniform UV light intensity above a substrate in the chamber.
- the UV lamps 85 can have identical or different lengths sized to overlay the quartz window 30.
- a single rotary shutter 90 surrounds each UV lamp 85.
- Each UV lamp 85 can have a tubular shape, a dual-tubular shape or other suitable shape.
- Fig. 4 shows a cross sectional schematic of the UV lamp assembly 80, wherein rotary shutters 90 are in a closed position, according to an embodiment. In the closed position, the rotary shutters 90 are arranged below the UV lamps 85 and block a substantial portion (preferably more than 99%) of UV light from the UV lamps 85 from passing through he window 30.
- a lower side of a flange 93 of one rotary shutter 90 overlaps an upper side of a flange 94 of an adjacent rotary shutter preferably by about 0.03 to 0.05 inch, more preferably by about 0.04 inch to minimize UV light leakage.
- the rotary shutters 90 can be rotated from the open position to the closed position by simultaneously rotating all the rotary shutters 90 around the UV lamps 85 by about 180°.
- the rotary shutters 90 can be rotated from the closed position to the open position by simultaneously rotating all the rotary shutters 90 in the opposite direction by about 180°.
- the rotary shutters 90 can be driven between the open and closed positions by any suitable mechanism.
- the UV lamps 85 are preferably held stationary and do not rotate when the rotary shutters 90 move from the closed position to the open position.
- the outermost UV lamps 85a can be angled such that one of the dual tubes is located closer to the quartz window 30 and the other one of the dual tubes is located farther from the quartz window 30.
- Fig. 5a shows a perspective view of an exemplary UV lamp assembly 80 comprising six UV lamps 85 positioned parallel to each other.
- the rotary shutters 90 are in the open position.
- the UV lamps 85 can be any tubular UV lamps, such as White-Rodgers UVP-06207 Germicidal UV Lamps.
- Two outermost UV lamps 85a can be shorter in length to accommodate the particular shape of the quartz window 30 (not shown). For example, the outermost lamps can extend 30 to 90% of the length of the other four lamps therebetween.
- Fig. 5b shows a perspective view of the UV lamp assembly 80 of Fig. 5a wherein the rotary shutters 90 are in the closed position.
- FIG. 6 shows a UV lamp assembly 80 according to one embodiment.
- One end of a rotary shutter 90 is attached (adhered, fastened, soldered, or the like) to a smaller outer diameter surface 601a of a rotatable annular shutter support 601 and an opposite end of the shutter 90 is attached to an outer periphery 602a of a stemmed shutter support 602.
- a larger diameter outer surface 601b of the shutter support 601 is rotatably mounted in a cylindrical recess (not shown) in an inner surface of a bearing block 603 which includes a plurality of laterally spaced apart mounting holes 603a to fixedly support a series of parallel UV lamps 85.
- a flanged bearing 605 having a center hole 605a is mounted in one of a plurality of laterally spaced apart holes 604a in a bearing block 604 arranged parallel to and spaced from the bearing block 603.
- a stem 602b of the stemmed shutter support 602 is rotatably supported in the center hole 605a of the flanged bearing 605.
- the UV lamp 85 is disposed through a mounting hole 603a in the bearing block 603 and passes through the center of the shutter support 601.
- An opposite end of the lamp 85 is supported by one axial end of a support pin 608.
- the support pin 608 has a stem rotatably supported in a center hole 602c of the stemmed shutter support 602.
- each UV lamp 85 remains stationary while the rotary shutter 90 rotates between the open and closed positions.
- An electrical socket 620 is connected to the UV lamp 85 to provide electrical power thereto.
- the stem 602b is attached to a drive pulley 606 located on an outer surface of the bearing block 604 and an outer surface of the drive pulley 606 engages a drive belt (not shown).
- the drive belt is moved back and forth by a suitable drive mechanism such that the drive pulley 606 effects rotation of the stemmed shutter support 602 by movement of the drive belt to rotate the shutter to the open and closed positions.
- the bearing block 603 and the flanged bearing 605 can be made of a heat resistant polymer material such as Torlon ® .
- the bearing block 604 and the shutter support 602 can be made of a metallic material such as aluminum.
- each UV lamp 85 has electrical connections for receiving electricity from a socket 620. This end is supported through one of a plurality of laterally spaced apart holes 661 in a socket plate 651 made of Torlon ® . The other end of the UV lamp 85 is supported by a stemmed support pin 653 made of Teflon ® .
- the pin 653 includes a fitting which has curved surfaces mating with outer surfaces of the dual-tubular shaped UV lamp.
- the rotary shutter 90 surrounding the UV lamp 85 is attached to an annular bearing 652 made of Torlon ® and a drive spindle 655 having a stem 655b and a center hole 655a.
- the UV lamp 85 passes through a center hole of the bearing 652 and the bearing 652 is rotatably mounted in a cylindrical recess in an inner surface of the socket plate 651.
- a flanged bearing 656 having a center hole 656a is mounted in one of a plurality of laterally spaced apart holes 662 in a support plate 654 arranged parallel to the socket plate 651.
- the stem 655b of the drive spindle 655 extends through and is rotatably mounted in the center hole 656a of the flanged bearing 656.
- a stem 653a of the stemmed support pin 653 is rotatably supported in the center hole 655a of the drive spindle 655.
- a cantilevered drive arm 657 is fixedly attached to the stem 655b of each of the drive spindles 655 outwardly of an outer surface of the support plate 654. Ends of the drive arms 657 are rotatably attached to vertical arms of a horizontally extending arm linkage 672 which moves laterally back and forth to simultaneously rotate the drive arms 657 clockwise and counterclockwise to open and close the rotary shutters.
- the arm linkage 672 has a vertical actuator arm 671 rotatably attached to an end of a revolving arm 681 of a rotary actuator 680 which rotates the revolving arm 681 between laterally offset positions.
- the rotary actuator 680 is operable to drive the arm linkage 672 such that ends 673 of the arm linkage 672 engage two stops (shown in Figs. 8-9 respectively). At each stop, an end 673 of the arm linkage 672 triggers a position switch 670 which signals the rotary actuator 680 to stop rotation and prevent over-driving the arm linkage 672.
- UV lamp assembly and the rotary shutters have been described in detail with reference to specific embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made, and equivalents employed, without departing from the scope of the appended claims.
- UV lamps can be replaced by other types of lamps.
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- Physical Or Chemical Processes And Apparatus (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
- Apparatus For Disinfection Or Sterilisation (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Water Treatments (AREA)
Abstract
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201080057454.2A CN102656669B (en) | 2009-12-17 | 2010-12-06 | UV lamp assembly of degassing chamber having rotary shutters |
| KR1020127015679A KR101719389B1 (en) | 2009-12-17 | 2010-12-06 | Uv lamp assembly of degas chamber having rotary shutters |
| SG2012044806A SG181778A1 (en) | 2009-12-17 | 2010-12-06 | Uv lamp assembly of degas chamber having rotary shutters |
| JP2012544472A JP5726897B2 (en) | 2009-12-17 | 2010-12-06 | Degas chamber UV lamp assembly with rotating shutter |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/640,910 US8584612B2 (en) | 2009-12-17 | 2009-12-17 | UV lamp assembly of degas chamber having rotary shutters |
| US12/640,910 | 2009-12-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2011084126A2 true WO2011084126A2 (en) | 2011-07-14 |
| WO2011084126A3 WO2011084126A3 (en) | 2011-11-03 |
Family
ID=44149364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2010/003090 Ceased WO2011084126A2 (en) | 2009-12-17 | 2010-12-06 | Uv lamp assembly of degas chamber having rotary shutters |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8584612B2 (en) |
| JP (1) | JP5726897B2 (en) |
| KR (1) | KR101719389B1 (en) |
| CN (1) | CN102656669B (en) |
| SG (1) | SG181778A1 (en) |
| TW (1) | TWI524449B (en) |
| WO (1) | WO2011084126A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3237857A4 (en) * | 2014-12-22 | 2019-02-27 | Elevated Health Systems, LLC | GERMICID DISINFECTION SYSTEM WITH ULTRAVIOLET LIGHT |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005003802A1 (en) * | 2004-12-10 | 2006-06-14 | Nütro Maschinen- und Anlagenbau GmbH & Co. KG | Radiation apparatus and powder application station and arrangement for coating temperature-sensitive materials and method thereof |
| US8603292B2 (en) * | 2009-10-28 | 2013-12-10 | Lam Research Corporation | Quartz window for a degas chamber |
| US8492736B2 (en) * | 2010-06-09 | 2013-07-23 | Lam Research Corporation | Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substrates |
| JP5934665B2 (en) * | 2013-02-22 | 2016-06-15 | 東京エレクトロン株式会社 | Film forming method, program, computer storage medium, and film forming system |
| US20150087220A1 (en) * | 2013-09-23 | 2015-03-26 | Vinylast, Inc. | Barrel-style coil-actuated vent |
| CN104733274B (en) * | 2013-12-19 | 2017-10-27 | 北京北方华创微电子装备有限公司 | Reaction chamber and plasma processing device |
| CN103962346B (en) * | 2014-05-21 | 2016-08-24 | 深圳市华星光电技术有限公司 | The method of the ultraviolet rays cleaning substrate of adjustable ultraviolet radiation energy |
| CN104624568B (en) * | 2014-12-18 | 2016-07-27 | 深圳市华星光电技术有限公司 | A kind of cleaning equipment |
| US9370600B1 (en) * | 2014-12-22 | 2016-06-21 | Elevated Health System, LLC | Ultraviolet light germicidal sanitizing system ulitilizing various room sanitizing modes |
| US10240236B2 (en) * | 2015-03-06 | 2019-03-26 | Lam Research Corporation | Clean resistant windows for ultraviolet thermal processing |
| US10043667B2 (en) | 2016-09-15 | 2018-08-07 | Applied Materials, Inc. | Integrated method for wafer outgassing reduction |
| WO2018052474A2 (en) * | 2016-09-16 | 2018-03-22 | Applied Materials, Inc. | Uv radiation system and method for arsenic outgassing control in sub 7nm cmos fabrication |
| CN107871681B (en) * | 2016-09-27 | 2019-10-08 | 北京北方华创微电子装备有限公司 | One kind going to gas chamber and semiconductor processing device |
| JP6899217B2 (en) | 2016-12-28 | 2021-07-07 | 株式会社Screenホールディングス | Board processing equipment, board processing method and board processing system |
| WO2018132671A1 (en) | 2017-01-12 | 2018-07-19 | UD Innovations, LLC | Fixed position hybrid germicidal irradiation apparatus, method, and system |
| CA3050002A1 (en) | 2017-01-12 | 2018-07-19 | UD Innovations, LLC | Portable uv-c disinfection apparatus, method, and system |
| CA3050717A1 (en) | 2017-02-03 | 2018-08-09 | UD Innovations, LLC | Apparatus and method for reducing dosage time in uv-c germicidal irradiation |
| JP2020038931A (en) | 2018-09-05 | 2020-03-12 | キオクシア株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
| US11348784B2 (en) | 2019-08-12 | 2022-05-31 | Beijing E-Town Semiconductor Technology Co., Ltd | Enhanced ignition in inductively coupled plasmas for workpiece processing |
| KR102769067B1 (en) * | 2019-09-05 | 2025-02-18 | 삼성전자주식회사 | Ultraviolet ray irrdiation apparatus and method of manufacturing a semiconductor package using the apparatus |
| US20220202984A1 (en) * | 2020-03-16 | 2022-06-30 | UL Med Inc. | Germicidal devices and applications of same |
| US11430671B2 (en) * | 2020-07-30 | 2022-08-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ozone wafer cleaning module having an ultraviolet lamp module with rotatable reflectors |
| EP4252277A4 (en) * | 2020-12-22 | 2025-01-08 | Mattson Technology, Inc. | Workpiece processing apparatus with vacuum anneal reflector control |
| CN112735994B (en) * | 2021-04-06 | 2021-06-04 | 亚电科技南京有限公司 | Semiconductor wafer cleaning device and cleaning method based on heating and drying mechanism |
| DE102021112174A1 (en) * | 2021-05-10 | 2022-11-10 | Robert Bürkle GmbH | UV irradiation device for coating systems and methods for quality assurance |
| WO2023011923A1 (en) * | 2021-08-05 | 2023-02-09 | Signify Holding B.V. | Disinfecting luminaire using switchable mirrors |
| US20230343615A1 (en) * | 2022-04-22 | 2023-10-26 | Applied Materials, Inc. | In-situ low temperature measurement of low emissivity substrates |
| KR20240085529A (en) * | 2022-12-08 | 2024-06-17 | 삼성전자주식회사 | Apparatus for cleaning and method for cleaning |
| WO2025207276A1 (en) * | 2024-03-27 | 2025-10-02 | Applied Materials, Inc. | Lamp configurations for uv energy activation in processing chambers, and related chamber kits and methods |
| KR102925134B1 (en) * | 2025-04-08 | 2026-02-09 | 주식회사 원익큐엔씨 | Sliding Type Ultraviolet Excimer Lamp for Chamber Degassing |
Family Cites Families (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2497676A (en) * | 1946-03-27 | 1950-02-14 | Ralph W Lashells | Infrared ray equipment |
| US2560808A (en) * | 1948-11-26 | 1951-07-17 | James C Maccallum | Germicidal hair drier or the like |
| US3733709A (en) * | 1971-05-06 | 1973-05-22 | Sun Chemical Corp | Reflector and cooling means therefor |
| US3894343A (en) * | 1972-06-15 | 1975-07-15 | Thermogenics Of New York | Ink curing and drying apparatus |
| US3819929A (en) * | 1973-06-08 | 1974-06-25 | Canrad Precision Ind Inc | Ultraviolet lamp housing |
| US3836751A (en) * | 1973-07-26 | 1974-09-17 | Applied Materials Inc | Temperature controlled profiling heater |
| CH586666A5 (en) * | 1973-09-11 | 1977-04-15 | Ciba Geigy Ag | |
| US3967385A (en) * | 1974-08-26 | 1976-07-06 | National-Standard Company, Wagner-Litho Machinery Division | Utilization of heat pipes for cooling radiation curing systems |
| US4005135A (en) * | 1975-04-07 | 1977-01-25 | Sun Chemical Corporation | Rotatable ultraviolet lamp reflector and heat sink |
| US4025795A (en) * | 1975-05-27 | 1977-05-24 | Ppg Industries, Inc. | Ultraviolet light processor having rotating shutters |
| US4010374A (en) * | 1975-06-02 | 1977-03-01 | Ppg Industries, Inc. | Ultraviolet light processor and method of exposing surfaces to ultraviolet light |
| US4015340A (en) * | 1975-08-20 | 1977-04-05 | Tec Systems, Inc. | Ultraviolet drying apparatus |
| US4049987A (en) * | 1976-06-04 | 1977-09-20 | The Perkin-Elmer Corporation | Ozone absorbance controller |
| US4319125A (en) * | 1979-07-20 | 1982-03-09 | Prince Fred J | Infra-red radiant heater system |
| JPS63244741A (en) * | 1987-03-31 | 1988-10-12 | Toshiba Electric Equip Corp | Apparatus for decomposing organic compound |
| JPH0228322A (en) * | 1988-04-28 | 1990-01-30 | Mitsubishi Electric Corp | Preliminary treatment of semiconductor substrate |
| JP2732450B2 (en) * | 1988-09-14 | 1998-03-30 | ウシオ電機株式会社 | Light irradiator |
| US5262902A (en) * | 1990-06-28 | 1993-11-16 | Ebara Corporation | Filter for a low-pressure mercury vapor lamp |
| JPH04239131A (en) * | 1991-01-11 | 1992-08-27 | Ebara Res Co Ltd | Wafer cleaning method and device |
| US6012304A (en) * | 1991-09-30 | 2000-01-11 | Loxley; Ted A. | Sintered quartz glass products and methods for making same |
| JPH0620938A (en) * | 1992-06-30 | 1994-01-28 | Kawasaki Steel Corp | Quick thermal oxidizing apparatus for semiconductor substrate |
| JP2511393B2 (en) * | 1992-09-15 | 1996-06-26 | パテント−トロイハント−ゲゼルシヤフト フユア エレクトリツシエ グリユーランペン ミツト ベシユレンクテル ハフツング | Metal halide lamp |
| JP3367167B2 (en) * | 1993-10-26 | 2003-01-14 | 株式会社ニコン | Illumination optical device, discharge lamp used in the device, and exposure device |
| JPH0864559A (en) * | 1994-06-14 | 1996-03-08 | Fsi Internatl Inc | How to remove unwanted substances from the substrate surface |
| US6015503A (en) * | 1994-06-14 | 2000-01-18 | Fsi International, Inc. | Method and apparatus for surface conditioning |
| US5534107A (en) * | 1994-06-14 | 1996-07-09 | Fsi International | UV-enhanced dry stripping of silicon nitride films |
| US6355587B1 (en) * | 1994-06-30 | 2002-03-12 | Ted A. Loxley | Quartz glass products and methods for making same |
| DE59604303D1 (en) * | 1995-04-27 | 2000-03-02 | Metronic Geraetebau | METHOD AND DEVICE FOR HARDENING UV PRINTING INKS |
| KR100363846B1 (en) | 1995-12-23 | 2003-02-19 | 주식회사 하이닉스반도체 | Method for removing photoresist in semiconductor device |
| US5781693A (en) * | 1996-07-24 | 1998-07-14 | Applied Materials, Inc. | Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween |
| US5788940A (en) * | 1996-10-23 | 1998-08-04 | Tetra Laval Holdings & Finance Sa | Method and apparatus for sterilizing cartons through ultraviolet irradiation |
| US5922219A (en) * | 1996-10-31 | 1999-07-13 | Fsi International, Inc. | UV/halogen treatment for dry oxide etching |
| US6065481A (en) * | 1997-03-26 | 2000-05-23 | Fsi International, Inc. | Direct vapor delivery of enabling chemical for enhanced HF etch process performance |
| JPH10289890A (en) * | 1997-04-15 | 1998-10-27 | Samuko Internatl Kenkyusho:Kk | Semiconductor manufacturing device and substrate cleaning apparatus |
| US6393211B1 (en) * | 1997-04-28 | 2002-05-21 | Les Importations Dmd Inc. | Heat radiator assembly |
| US5983827A (en) * | 1997-05-06 | 1999-11-16 | Delco Electronics Corporation | Tip to tail illuminated pointer assembly |
| US20020157686A1 (en) * | 1997-05-09 | 2002-10-31 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
| US5861633A (en) * | 1997-08-04 | 1999-01-19 | Con-Trol-Cure, Inc. | Irradiator apparatus |
| US6465374B1 (en) * | 1997-10-21 | 2002-10-15 | Fsi International, Inc. | Method of surface preparation |
| US6015759A (en) * | 1997-12-08 | 2000-01-18 | Quester Technology, Inc. | Surface modification of semiconductors using electromagnetic radiation |
| US6187133B1 (en) * | 1998-05-29 | 2001-02-13 | Applied Materials, Inc. | Gas manifold for uniform gas distribution and photochemistry |
| US6191428B1 (en) * | 1998-06-30 | 2001-02-20 | Joseph J. Gilberti | Ultraviolet shutter |
| US6228173B1 (en) * | 1998-10-12 | 2001-05-08 | Tokyo Electron Limited | Single-substrate-heat-treating apparatus for semiconductor process system |
| US6156079A (en) * | 1998-10-21 | 2000-12-05 | Ho; Henry | Window support member for a semiconductor processing system |
| US6465799B1 (en) * | 1999-03-01 | 2002-10-15 | Johnson & Johnson Vision Care, Inc. | UV radiation system having materials for selectively attenuating radiation |
| JP4540796B2 (en) * | 2000-04-21 | 2010-09-08 | 東京エレクトロン株式会社 | Quartz window, reflector and heat treatment equipment |
| JP2002016033A (en) | 2000-06-29 | 2002-01-18 | Tokyo Cathode Laboratory Co Ltd | Apparatus and method of substrate dry cleaning |
| JP3468215B2 (en) * | 2000-08-08 | 2003-11-17 | ウシオ電機株式会社 | Processing equipment using a dielectric barrier discharge lamp |
| GR1003634B (en) * | 2000-10-26 | 2001-07-30 | Pilux & Danpex Ae | System of reflectors and base for parabolic fluorescent illumination |
| US6797966B2 (en) * | 2001-01-26 | 2004-09-28 | Engineering Dynamics, Ltd. | Quick-install irradiation unit and method of making same |
| US6497734B1 (en) * | 2002-01-02 | 2002-12-24 | Novellus Systems, Inc. | Apparatus and method for enhanced degassing of semiconductor wafers for increased throughput |
| KR100913116B1 (en) * | 2002-04-04 | 2009-08-19 | 토소가부시키가이샤 | Quartz glass spraying parts and manufacturing method |
| JP4133062B2 (en) * | 2002-07-19 | 2008-08-13 | 大日本スクリーン製造株式会社 | Heat treatment equipment |
| US6649921B1 (en) * | 2002-08-19 | 2003-11-18 | Fusion Uv Systems, Inc. | Apparatus and method providing substantially two-dimensionally uniform irradiation |
| US6720566B2 (en) * | 2002-08-20 | 2004-04-13 | Miltec Corporation | Shutter for use with a light source |
| US6832844B2 (en) * | 2002-12-03 | 2004-12-21 | Field Controls, L.L.C. | Ultraviolet lamp assembly |
| US7374696B2 (en) * | 2003-02-14 | 2008-05-20 | Applied Materials, Inc. | Method and apparatus for removing a halogen-containing residue |
| US7045746B2 (en) * | 2003-11-12 | 2006-05-16 | Mattson Technology, Inc. | Shadow-free shutter arrangement and method |
| US20050268467A1 (en) * | 2004-06-05 | 2005-12-08 | Jackie Woods-Hunter | Plant deleafing tool |
| KR200365992Y1 (en) | 2004-08-13 | 2004-10-28 | (주)오엘케이 | Natrium lamp shutter for macro inspection machine |
| US7365037B2 (en) * | 2004-09-30 | 2008-04-29 | Shin-Etsu Quartz Products Co., Ltd. | Quartz glass having excellent resistance against plasma corrosion and method for producing the same |
| US20060196525A1 (en) * | 2005-03-03 | 2006-09-07 | Vrtis Raymond N | Method for removing a residue from a chamber |
| US7777198B2 (en) * | 2005-05-09 | 2010-08-17 | Applied Materials, Inc. | Apparatus and method for exposing a substrate to a rotating irradiance pattern of UV radiation |
| US7566891B2 (en) * | 2006-03-17 | 2009-07-28 | Applied Materials, Inc. | Apparatus and method for treating a substrate with UV radiation using primary and secondary reflectors |
| US7692171B2 (en) * | 2006-03-17 | 2010-04-06 | Andrzei Kaszuba | Apparatus and method for exposing a substrate to UV radiation using asymmetric reflectors |
| US7589336B2 (en) * | 2006-03-17 | 2009-09-15 | Applied Materials, Inc. | Apparatus and method for exposing a substrate to UV radiation while monitoring deterioration of the UV source and reflectors |
| JP4994074B2 (en) * | 2006-04-20 | 2012-08-08 | 東京エレクトロン株式会社 | Substrate cleaning apparatus, substrate cleaning method, substrate processing apparatus |
| US7978964B2 (en) * | 2006-04-27 | 2011-07-12 | Applied Materials, Inc. | Substrate processing chamber with dielectric barrier discharge lamp assembly |
| EP2122237B1 (en) * | 2006-12-11 | 2011-04-06 | Air Motion Systems, Inc. | Uv module |
| US20090045714A1 (en) * | 2007-08-13 | 2009-02-19 | Claeys Michael L | Uv module shutter extrusion with internal cooling fins |
| US8603292B2 (en) * | 2009-10-28 | 2013-12-10 | Lam Research Corporation | Quartz window for a degas chamber |
| US8492736B2 (en) * | 2010-06-09 | 2013-07-23 | Lam Research Corporation | Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substrates |
-
2009
- 2009-12-17 US US12/640,910 patent/US8584612B2/en not_active Expired - Fee Related
-
2010
- 2010-12-06 KR KR1020127015679A patent/KR101719389B1/en not_active Expired - Fee Related
- 2010-12-06 CN CN201080057454.2A patent/CN102656669B/en active Active
- 2010-12-06 SG SG2012044806A patent/SG181778A1/en unknown
- 2010-12-06 JP JP2012544472A patent/JP5726897B2/en not_active Expired - Fee Related
- 2010-12-06 WO PCT/US2010/003090 patent/WO2011084126A2/en not_active Ceased
- 2010-12-16 TW TW099144321A patent/TWI524449B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3237857A4 (en) * | 2014-12-22 | 2019-02-27 | Elevated Health Systems, LLC | GERMICID DISINFECTION SYSTEM WITH ULTRAVIOLET LIGHT |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201142973A (en) | 2011-12-01 |
| JP5726897B2 (en) | 2015-06-03 |
| US20110146705A1 (en) | 2011-06-23 |
| JP2013514658A (en) | 2013-04-25 |
| KR20120102085A (en) | 2012-09-17 |
| US8584612B2 (en) | 2013-11-19 |
| WO2011084126A3 (en) | 2011-11-03 |
| CN102656669A (en) | 2012-09-05 |
| CN102656669B (en) | 2015-02-04 |
| KR101719389B1 (en) | 2017-03-23 |
| TWI524449B (en) | 2016-03-01 |
| SG181778A1 (en) | 2012-07-30 |
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