WO2011078674A1 - Procédé et appareil permettant d'appliquer une perforation dans un substrat stratifié initialement plat, le substrat étant plat après l'irradiation et un éventuel post-traitement - Google Patents

Procédé et appareil permettant d'appliquer une perforation dans un substrat stratifié initialement plat, le substrat étant plat après l'irradiation et un éventuel post-traitement Download PDF

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Publication number
WO2011078674A1
WO2011078674A1 PCT/NL2010/050884 NL2010050884W WO2011078674A1 WO 2011078674 A1 WO2011078674 A1 WO 2011078674A1 NL 2010050884 W NL2010050884 W NL 2010050884W WO 2011078674 A1 WO2011078674 A1 WO 2011078674A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
heating
laser
irradiation
flat
Prior art date
Application number
PCT/NL2010/050884
Other languages
English (en)
Inventor
Johannes Ignatius Marie Cobben
Original Assignee
Iai Industrial Systems B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iai Industrial Systems B.V. filed Critical Iai Industrial Systems B.V.
Publication of WO2011078674A1 publication Critical patent/WO2011078674A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
    • B26F1/31—Perforating by non-mechanical means, e.g. by fluid jet by radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D15/00—Printed matter of special format or style not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/41—Marking using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/43—Marking by removal of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/24—Passports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/346—Perforations

Definitions

  • the present invention relates to a method and an apparatus for applying a perforation in an initially flat laminated substrate having a thickness of at least 0.2 mm by irradiating the substrate by laser.
  • EP-A-0 936 975 discloses documents provided with such features and the apparatuses and methods for personalising these documents.
  • the perforations are applied in a card of laminated material, having a thickness of at least 0.2 mm.
  • This card is also provided with other personalized features like the name, address, date and place of birth and a passport photograph of the bearer.
  • This card may form the personalized document on itself, but it may also form part of a bigger document, like a passport booklet comprising several pages of which the personalized card is one of the pages. It is noted that such a laminated card can be protected against falsification and forgery by applying personalized features in the card in the form of perforations.
  • a perforation is applied by laser to a card, the cards are often warped, leading to handling problems in the next processing steps of the card. Also, a deformed warped card is not considered to be a high quality product which conflicts with the very nature of identification documents.
  • the aim of the invention is to provide a method and an apparatus to avoid these problems.
  • a corresponding apparatus for applying a perforation in an initially flat laminated substrate having a thickness of at least 0.2 mm comprises an irradiation support member for supporting the substrate during irradiation, a laser unit for irradiating the substrate to apply the perforation in the substrate, wherein the apparatus is adapted to deliver a flat perforated substrate.
  • a substrate forms a part of a booklet. In such a situation it is preferred when the that the remaining pages of the booklet are folded such that the substrate is accessible from at least one side.
  • the apparatus is adapted to perforate a substrate which forms part of the booklet and that the apparatus comprises holding means to maintain the remaining pages of the booklet folded over when the substrate is on the substrate carrier such that the substrate is accessible from at least one side.
  • a first possibility for reaching this aim is by application of a laser irradiation process wherein the properties of the laser are chosen such that the substrate is flat after the irradiation and by a corresponding apparatus.
  • the same embodiment provides an apparatus of the kind referred to above wherein the laser has a wavelength of substantially 9.3 ⁇ when the substrate is polycarbonate.
  • a more specialized embodiment provides the feature that the wavelength of the laser is substantially 9.3 ⁇ when the substrate is polycarbonate.
  • An alternative possibility is to use a method wherein the substrate is flattened after the irradiating by laser.
  • the substrate is flattened by heating the substrate.
  • the embodiment also provides an apparatus wherein the heating station comprises at least one heated temperature controlled plate, which is moveable between an inactive position and a heating position in which it is adapted to be contacted to a substrate on the heating support member.
  • the substrate is preferably heated by bringing at least one side of the substrate into contact with a heated temperature controlled body, however, it may also be possible that the substrate is heated by bringing both sides of the substrate into contact with a heated temperature controlled body.
  • the heating station comprises at least one heated temperature controlled plate, which is moveable between an inactive position and a heating position in which it is adapted to be contacted to a substrate on the heating support member., or, as an alternative wherein the heating station comprises two heated temperature controlled plates, which are each moveable between an inactive position and an active position wherein a substrate on the heating support member is clamped between both plates.
  • the substrate is heated by IR irradiation.
  • the heating station comprises an IR-source adapted to irradiate a substrate on the heating support. It is not excluded that the heating takes place on the same location as the irradiation by laser, but to increase throughput, it is preferred if the substrate is transported between the irradiation by laser and the heating.
  • the heating member comprises two flat, temperature controlled plates, which are moveable between an inactive position and a heating position and in which a substrate is clamped between both plates
  • transport means are adapted for transporting the substrate from the support to the heating location and that the holding means are adapted to maintain the pages of the booklet not being the substrate folded over when the substrate is in the heating location such that the substrate is accessible for the heating plates from both sides.
  • Figure 1 shows a cross-sectional view of a laser perforating apparatus according to the prior art
  • Figure 2 shows an elevated view of a laser perforating apparatus is depicted in figure 1, to which a heating apparatus according to the invention is added;
  • Figure 3 shows a side view of the apparatus depicted in figure 2.
  • Figure 4 shows a cross sectional view of the apparatus depicted in figures 2 and 3.
  • the apparatus depicted in figure 1 shows a longitudinal support 1 over which
  • the apparatus further comprises a laser unit 5, which is depicted by a rectangle. It will be clear to a skilled man that the laser unit 5 comprises both a laser source and means for deflecting and control of a laser beam 6 emerging from the laser source 5. Further the apparatus comprises a control unit not depicted in the drawings, but which is adapted to control the movement of the belts 3 and hence of the document 2 and the laser unit 5.
  • the apparatus so far belongs to the prior art.
  • the problem arises that the document 2 after being perforated by laser is not completely flat anymore. Expressed otherwise it may be forced to a flat shape, but it may incorporate internal stresses which make the document return to a warped shape when the document 2 is not submitted to external forces. These stresses are generated by the thermal energy supplied by the laser to the document during the perforation by the laser.
  • the properties and the control of the laser are amended such that the transfer of heat to the document is minimised, so that only the energy needed to make the actual perforation is transferred to the document.
  • a laser with a wavelength which is optimally absorbed by the material to be processed. For instance, when using a polycarbonate substrate the wavelength of 9.3 ⁇ is far better absorbed than the more common wavelength of 10.6 ⁇ . As a result the 9.3 ⁇ wavelength does not warp the substrate whereas the 10.6 ⁇ does.
  • the document can be a single card, for instance a driving licence, but it may also be formed by a card being part of a booklet, like a passport.
  • the transport means comprising the longitudinal support, and the belts must be adapted to the transport of the document of the booklet type.
  • the pages of the booklet different from the card will be folded over to allow the laser to reach the card for perforation, so that the transport means must be adapted to transport such a document.
  • a second embodiment of the invention comprises a heating member to heat the card to smooth out the stresses caused by the local application of heat of the perforating laser.
  • FIG. 2 A corresponding embodiment is shown in figure 2.
  • the support 1 appears to consist of three support rails la, lb and lc, over which the document 2 can be transported.
  • the outer rails have a substantial L-shape to allow a proper guiding of the document 2.
  • the document 2 is composed of the actual document 2a, which is to be provided with a personalized perforation and pages 2b, which are folded over to allow the card 2a to be reached by the laser beam 6.
  • three belts 3a, 3b , 3 c are located over the rails 2 to transport the documents in the longitudinal direction of the support.
  • the location of the belts 3a, 3b, 3c in the width of the support is chosen to make the card 2 accessible for the laser beam 6.
  • the folded document 2 is further transported along the support 1 in its longitudinal direction.
  • a heating member comprising two heating plates 10, of which only the upper heating plate 10a is visible in figure 2.
  • both heating plates 10a 10b are visible, together with a document 2 located between the two heating plates 10a, 10b.
  • the lower heating plate 10b is fixed relative to the support 1, but the upper heating plate 10a is swivably connected to the support 1.
  • This swivable connection allows the upper heating plate 10a to swivel between its inactive position wherein movement of the document 2 is possible and a an active, heating position wherein the document 2 is enclosed between the two heating plates 10a, 10b to allow intimate contact between the document 2 and each of the heating plates 10a, 10b.
  • the laser perforated document 2 is transported to the location in between the two heating plates, when the heating plate 10a is in its upper, inactive position.
  • the upper heating plate 10a When the document has arrived in this position, the upper heating plate 10a is moved to its lower position and the document is clamped between the heating plates 10a, 10b
  • the heating plates are constantly kept at a certain adjustable temperature which is controlled by a control loop consisting of a temperature sensor, a heating element and control electronics.
  • the heating and subsequent cooling of the document 2 leads to a release of the internal mechanical stresses in the material of the document 2, so that it retakes its flat shape.
  • the upper heating plate After the heating of the document, the upper heating plate is raised to its upper, inactive position and the document 2 is transported further for further processing. During this further transport it is cooled down.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Electromagnetism (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un procédé et un appareil permettant d'appliquer une perforation dans un substrat stratifié plat, comme par exemple une carte présentant une épaisseur d'au moins 0,2 mm, par irradiation laser du substrat. Lorsqu'une perforation est appliquée au laser sur ladite carte, celle-ci est souvent voilée, ce qui provoque des problèmes de manipulation dans les étapes de traitement ultérieures. L'invention peut concerner un substrat faisant partie d'une brochure comme un passeport. Selon l'invention, le substrat est plat après l'irradiation et un éventuel post-traitement. Selon un premier mode de réalisation, les propriétés du procédé d'irradiation laser sont choisies de manière à ce que le substrat soit plat après l'irradiation. Selon un second mode de réalisation, le substrat est aplati après l'irradiation laser, par exemple par chauffage du substrat.
PCT/NL2010/050884 2009-12-24 2010-12-23 Procédé et appareil permettant d'appliquer une perforation dans un substrat stratifié initialement plat, le substrat étant plat après l'irradiation et un éventuel post-traitement WO2011078674A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2004015 2009-12-24
NL2004015A NL2004015C2 (en) 2009-12-24 2009-12-24 Method and apparatus for applying a perforation in an initially flat laminated substrate wherein the substrate is flat after irradiation and a possible posttreatment.

Publications (1)

Publication Number Publication Date
WO2011078674A1 true WO2011078674A1 (fr) 2011-06-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2010/050884 WO2011078674A1 (fr) 2009-12-24 2010-12-23 Procédé et appareil permettant d'appliquer une perforation dans un substrat stratifié initialement plat, le substrat étant plat après l'irradiation et un éventuel post-traitement

Country Status (3)

Country Link
KR (1) KR20120107505A (fr)
NL (1) NL2004015C2 (fr)
WO (1) WO2011078674A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015112105A1 (fr) * 2014-01-21 2015-07-30 Общество С Ограниченной Ответственностью "Специализированное Предприятие "Голография"" Procédé de fabrication de paquet monolithique perforé de feuilles de polycarbonate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0936975A1 (fr) 1996-11-05 1999-08-25 Industrial Automation Integrators (Iai) B.V. Dispositif de securite comportant un motif perfore
WO2002033652A1 (fr) * 2000-10-20 2002-04-25 Datacard Corporation Procede de verification d'un modele de perforation servant de caracteristique de securite
DE102004055495A1 (de) * 2004-11-17 2006-05-24 Bundesdruckerei Gmbh Personaldokument in Heftform
WO2006066803A1 (fr) * 2004-12-17 2006-06-29 Giesecke & Devrient Gmbh Support de donnees en forme de carte
DE102007018450A1 (de) * 2007-04-19 2008-10-30 Bundesdruckerei Gmbh Laminiertes Sicherheitsdokument

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0936975A1 (fr) 1996-11-05 1999-08-25 Industrial Automation Integrators (Iai) B.V. Dispositif de securite comportant un motif perfore
EP0936975B1 (fr) * 1996-11-05 2003-07-02 Industrial Automation Integrators (Iai) B.V. Dispositif de securite comportant un motif perfore
WO2002033652A1 (fr) * 2000-10-20 2002-04-25 Datacard Corporation Procede de verification d'un modele de perforation servant de caracteristique de securite
DE102004055495A1 (de) * 2004-11-17 2006-05-24 Bundesdruckerei Gmbh Personaldokument in Heftform
WO2006066803A1 (fr) * 2004-12-17 2006-06-29 Giesecke & Devrient Gmbh Support de donnees en forme de carte
DE102007018450A1 (de) * 2007-04-19 2008-10-30 Bundesdruckerei Gmbh Laminiertes Sicherheitsdokument

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015112105A1 (fr) * 2014-01-21 2015-07-30 Общество С Ограниченной Ответственностью "Специализированное Предприятие "Голография"" Procédé de fabrication de paquet monolithique perforé de feuilles de polycarbonate

Also Published As

Publication number Publication date
NL2004015C2 (en) 2011-06-27
KR20120107505A (ko) 2012-10-02

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