Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
  • H05K3/308—Adaptations of leads
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/50—Fixed connections
  • H01R12/51—Fixed connections for rigid printed circuits or like structures
  • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
  • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
  • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/70—Coupling devices
  • H01R12/71—Coupling devices for rigid printing circuits or like structures
  • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
  • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
  • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
  • H01R13/6581—Shield structure
  • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
  • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0237—High frequency adaptations
  • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
  • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0237—High frequency adaptations
  • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
  • H05K2201/09845—Stepped hole, via, edge, bump or conductor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10189—Non-printed connector
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/1059—Connections made by press-fit insertion
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
  • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49126—Assembling bases

Definitions

• the invention is based on a multi-pole relief connector for
• the invention further relates to a manufacturing method for the multilayer board.
• a backplane is described, which is realized as a multilayer board.
• the board can have multiple contact area areas for
• CONFIRMATION COPY Contact elements for example, a first contact area area in the middle of the backplane and a second contact area surface on the edge of the backplane.
• Layers of the multilayer board are provided so that the contact area areas form a staircase-shaped structure. 'This is arranged in the central region of the circuit board contact area on both sides with step-shaped configurations and arranged at the edge of the contact area is for instance provided with a unidirectional stepped configuration.
• the contact areas can be realized with exclusively falling or rising, but also both rising and falling stairs.
• Different contact areas can be connected by cables which have corresponding stepped contact areas for contacting the step-shaped contact areas provided in the backplane.
• relief connectors which are provided for contacting contact surfaces arranged on the contact area surfaces. The contacting portions of the contact elements of the relief connector are pressed onto the arranged on the contact area surfaces contact surfaces for the preparation of the contact. Alternatively, the contacting sections of the contact elements can also be soldered to the contact surfaces arranged on the individual stairs.
• leading contact element is associated with a screening or ground potential leading contact element.
• the patent US Pat. No. 6,976,886 B2 describes a connector in which a high shielding effect of the signal-carrying lines relative to one another and of the connector as a whole is to be achieved by a special arrangement and alignment of the signal-carrying and shielding or ground potential-carrying contact elements.
• the known connector is particularly suitable for high-frequency signals, the arrangement of the signal leading and ground potential leading contact elements is also specifically specified to achieve a certain characteristic impedance.
• the invention is based on the object, a multi-pole relief connector for contacting with a multilayer board, a
• Multilayer board for equipping with a multi-pole relief connector a combination of a multi-pole relief connector and a provided for mounting the multi-pole relief connector multilayer board and a manufacturing process for the multilayer board indicate each allow reliable contact with low manufacturing costs.
• the multi-pole relief connector for contacting with a multilayer board is based on a plurality of contact elements, which are arranged in height-offset contact area surfaces.
• the relief connector according to the invention is characterized in that the contacting portions of the contact elements are formed as press-in contacts for pressing in press-contact recordings of a multilayer board.
• the relief connector according to the invention can be contacted in a particularly simple and, in particular, cost-effective manner with the multilayer circuit board with the measure provided for in accordance with the invention.
• a previously proposed soldering and the associated thermal stress on both the relief connector and the multilayer boards are completely eliminated.
• the press-fit contacts can be produced particularly simply by punching, wherein a resilient element is formed in the contacting section, which forms the press-in contact.
• An advantageous embodiment provides that the contacting sections of the contact elements are of the same length.
• the uniform design allows a particularly efficient production of press-fit contacts.
• press-in contacts are arranged side by side in an imaginary connecting line and preferably each adjacently arranged signal press-contact pairs. Due to the resulting symmetrical structure, the signal press-in contact pairs are particularly suitable for guiding differential signals.
• a development of this embodiment provides that the press-in contact pairs at least one adjacently arranged Absen irm-press-contact is assigned.
• the at least one shield press-in contact is laterally offset with respect to the respective associated signal press-in contact pairs such that it is not on the signal press-in contact pair connection line.
• the resulting structure can be realized by predetermined geometrical conditions and including the intended dielectric at least approximately with a given characteristic impedance. Achieves a high signal integrity, whereby the relief connector according to the invention is particularly suitable for guiding high-frequency signals well into the GHz range.
• the multilayer board according to the invention for equipping with a multi-pole relief connector assumes that the multilayer board has a plurality of height-offset contact area surfaces.
• Multilayer board is characterized in that in the contact area surfaces each contact receptacles are arranged, which are formed as press-contact receptacles.
• the multilayer board according to the invention is designed to be suitable for mounting with the connector according to the invention.
• One embodiment provides that in the press-contact contact receptacles electrically conductive sleeves for electrical contact with the press-in contacts of the relief connector are introduced.
• the sleeves are mechanically very robust and allow both a secure mechanical and electrical contact.
• One embodiment provides that at least some sleeves extend over the entire height of the multilayer board.
• the comparatively large electrically conductive surface leads to a good shielding effect, which is why these sleeves are provided in particular for contacting with the shield press-in contacts of the relief connector.
• An embodiment provides that the lengths of the sleeves are set to predetermined values.
• the sleeves are provided in particular for contacting with signal press-in contact pairs, wherein the symmetrical wiring is in the foreground.
• the short sleeves minimize the undesirable capacities occurring between the press-fit contacts.
• the inventive combination of at least one multi-pole relief connector and a multilayer board assumes that the relief connector has a plurality of contact elements whose
• Contacting sections are arranged in height-offset contact area surfaces, and that the multilayer board also has a plurality of height-offset contact area surfaces.
• the combination is characterized in that the contact elements of the relief connector in the contacting section are formed as press-in contact elements for pressing into press-contact receptacles of the multilayer board and that in the contact area surfaces of the multilayer board contact receptacles are arranged are formed as press-contact recordings.
• the combination according to the invention combines the advantages already described individual components of the combination.
• the furthermore provided inventive method for producing a multilayer board for assembly with at least one relief connector wherein the multilayer board has a plurality of offset height contact surface areas, provides that in the contact area surfaces press-contact receptacles are arranged, which are produced by means of holes in that electrically conductive sleeves are introduced into the bores, that the sleeves are drilled from the component side of the multilayer board to the heights of the respectively provided contact area surfaces, and that subsequently the contact area surfaces of the multilayer board which are located at different heights are produced.
• the manufacturing method according to the invention enables a rational production of the multilayer board according to the invention.
• An embodiment of the manufacturing method according to the invention provides that at least some sleeves are additionally drilled from the back of the multilayer board opposite to the mounting direction of the multilayer board, so that the sleeves have a predetermined length which is less than the height of the respective contact area area of the multilayer board. This procedure is used in particular for the sleeves, which are provided for contacting with the signal press-in contact pairs.
• Figure 1 is a view of relief connectors according to the invention before
• FIG. 2 shows a longitudinal section through an IVIultilayerplatine invention, which is contacted with a designed as a spring bar relief invention according to the invention
• FIG. 3 shows a longitudinal section through an IVIultilayerplatine invention, which is contacted with a designed as a male connector relief according to the invention according to the invention,
• FIG. 4 shows a detailed view in the region of the contacting of a multi-cut IVIultilayer board according to the invention, which is equipped with a relief connector according to the invention
• FIG. 5 shows a first step of a production method according to the invention of an IVIultilayer board according to the invention
• FIG. 6 shows a second step of a production method according to the invention of an IVIultilayer board according to the invention
• Figure 7 shows a first embodiment of contact area surfaces of a IVIultilayerplatine invention
• FIG. 8 shows a second embodiment of contact area surfaces of a IVIultilayerplatine invention.
• FIG. 1 shows a view of relief connectors 10a, 10b according to the invention prior to contacting with multilayer boards 12a, 12b according to the invention.
• an inventive relief connector 10a is realized as a spring bar and a corresponding relief connector 10b as a male connector, both of which are shown in the inserted state.
• the multilayer board 12a is implemented as a daughter card, for example, and the multilayer board 12b as a backplane.
• the relief connectors 10a, 10b according to the invention each have a multiplicity of contact elements 14a, 14b, the contacting sections 16a, 16b of which are arranged in contact-area surfaces 18a, 18b arranged offset in height, respectively.
• the multilayer boards 12a, 12b according to the invention each have the contact area surfaces 18a, 18b of the relief connectors 10a, 10b corresponding contact area surfaces 20a, 20b.
• the height-offset arranged contact area surfaces 18a, 18b, 20a, 20b form stair-like arrangements that give the visual impression of a relief, which is why the connector 10a, 10b are referred to as relief connector 10a, 10b.
• Figure 2 shows a longitudinal section through the multilayer board 12a, 12b according to the invention, which is contacted with the designed as a female connector relief connector 10a according to the invention
• Figure 3 shows a longitudinal section through the multilayer board 12b according to the invention, which contacted with the designed as a male connector relief connector according to the invention 10b is.
• Both sections through the multilayer board 12a, 12b show that the contacting sections 16a, 16b of the relief connectors 10a, 10b are realized according to the invention as press-fit contacts 22a, 22b.
• FIGS. 2 and 3 which correspond to the parts shown in FIG. 1, bear the same reference numerals. This agreement also applies to the following figures.
• FIG. 4 shows a greatly enlarged view of the press-in contacts 22,
• Figure 4 exemplifies the combination of the relief connector 10 according to the invention with the multilayer board 12 according to the invention.
• the distinction between the reference numerals "a” and “b” is omitted. However, the description is intended to apply to both the connector designed as a female connector 10a, whose components are to be designated by the reference numeral "a”, as well as designed as a male connector plug connector 10b, whose components are denoted by the reference numerals supplement "b” should be. This agreement also applies mutatis mutandis to the following figures or the further description.
• the press-in contacts 22 can be produced for example by punching, wherein a resilient element is formed, which can be pressed into the press-in contact receptacle 24 of the multilayer board 12.
• Figure 4 shows an embodiment in which the contacting portions 16 of the press-in contacts 22 have the same length.
• the contact elements 14 can be inexpensively manufactured with the press-in contacts 22 in a series production.
• Figure 4 shows a further embodiment, according to the signal-press-contact pairs 26 are provided, which may be adjacent to a preferably predetermined distance from each other. Furthermore, shield press-in contacts 28 may be provided, which are provided for example for contacting electrically conductive, present in the connector 10 Ablelamellen 30. Of course, in addition to or instead of signal press-in contact pairs 26, individual signal press-in contacts may also be provided.
• the electrical contact in the press-contact receptacles 24 is made for example by means of electrically conductive sleeves 32, 34. Shown is an advantageous embodiment in which the leading the signal contact elements 14, for example, the signal press-in contact pairs 26 shorter sleeves 34 and the shield press-in contacts 28 longer sleeves 32 may be assigned.
• the sleeves 32, 34 therefore have predetermined lengths 36.
• the signal-press-contact pairs 26 allow a symmetrical cable routing not only within the connector 10, but in particular in the contacting portion 16 of the press-in contacts 22, 26, 28 and in the press-contact receptacles 24. This can be extremely low Realize runtime differences between the signals. Particularly important are low transit time differences when the signal press-contact pairs 26 lead differential signals, such as digital signals in the range up to 40 Gbit / s, which should still be transmitted error-free with the widest possible open eye pattern.
• a specific differential characteristic impedance for example 100 ohms, plays a role for a signal press-in contact pair 26, the characteristic impedance whose definition can be taken from the reference book already mentioned by Meincke and Gundlach, by the geometric configuration of the contact elements 14 , So the shape and distance from each other, as well as by the present between the signal press-in contact pair 26 dielectric is significantly affected. Significance also comes to the shield press-in contact 28, which ensures a high signal integrity together with the Ableamelle 30.
• FIG. 5 illustrates the arrangement of the signal-press-in contact pairs 26 (not illustrated) on the basis of the arrangement of the associated press-fit contact pairs.
• One or preferably a plurality of signal press-in contact pairs 26 are arranged adjacent to each other on an imaginary connecting line 40.
• a predetermined distance 42 is provided in each case between individual signal press-in contacts of the signal press-in contact pairs 26.
• the shield press-in contacts 28, not shown, or the corresponding shield press-in contact receptacles 44 preferably lie with an offset 46 next to the connecting line 40.
• a plurality of shield press-in contact receptacles 44 are provided, which then also preferably on one imaginary connecting line are arranged.
• the manufacturing process is based on a multilayer display 12 with a certain height 48.
• the press-contact receptacles 24, 38, 44 are by means of a drill 50 in the loading direction 52 through the entire height 48 of
• the sleeves 32, 34 in the press-in contact receptacles 24, 38, 44 are preferably produced by a galvanic deposition process. From the assembly side, the sleeves 32, 34 are then drilled at least up to a height 54, which can later at least approximately correspond to the height 54 of the respective contact area surface 20.
• At least some sleeves 34 can be drilled out of the rear side 56 of the multilayer display 12, counter to the placement direction 52, up to the predetermined length 36.
• the signal-leading press-in contacts 22, 26 are preferably later pressed.
• the undesirable occurring between the press-contact receptacles 38 capacities are reduced.
• Some sleeves 32 are not drilled from the back. In these sleeves 32, whose height 58 later corresponds to the height of the contact area surface 20 at least approximately, the shield press-in contacts 28 are preferably later pressed. The larger metallic surface of the un-shortened sleeves 32 assists the shielding effect.
• the contact area surfaces 20 in the various heights 58 of the multilayer board 12 are preferably produced by milling.
• FIGS. 7 and 8 show different possibilities for the realization of the contact area surfaces 20.
• a constantly rising or constantly falling staircase is provided.
• Further different heights 60, 62 are shown.
• a short sleeve 32 is shown a long sleeve 34.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Details Of Connecting Devices For Male And Female Coupling (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)
• Combinations Of Printed Boards (AREA)

Priority Applications (9)

Applications Claiming Priority (2)

Publications (1)

Family

ID=43798432

Family Applications (1)

Country Status (12)

Cited By (1)

Families Citing this family (5)

Citations (9)

Family Cites Families (16)

• 2009
  • 2009-12-08 DE DE102009057260A patent/DE102009057260A1/de not_active Withdrawn
• 2010
  • 2010-12-03 BR BR112012013827A patent/BR112012013827A2/pt not_active Application Discontinuation
  • 2010-12-03 WO PCT/DE2010/001405 patent/WO2011069485A1/de active Application Filing
  • 2010-12-03 CA CA2782482A patent/CA2782482C/en not_active Expired - Fee Related
  • 2010-12-03 KR KR1020127017679A patent/KR20120105503A/ko not_active Application Discontinuation
  • 2010-12-03 US US13/514,347 patent/US9131632B2/en not_active Expired - Fee Related
  • 2010-12-03 DK DK10809224.8T patent/DK2510586T3/da active
  • 2010-12-03 ES ES10809224T patent/ES2727578T3/es active Active
  • 2010-12-03 CN CN201080056206.6A patent/CN102834979B/zh not_active Expired - Fee Related
  • 2010-12-03 EP EP10809224.8A patent/EP2510586B1/de not_active Not-in-force
  • 2010-12-03 JP JP2012542361A patent/JP2013513211A/ja active Pending
• 2012
  • 2012-06-03 IL IL220119A patent/IL220119A/en active IP Right Grant
• 2015
  • 2015-06-24 JP JP2015003184U patent/JP3199883U/ja not_active Expired - Lifetime

Patent Citations (11)

Non-Patent Citations (1)

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