WO2011068060A1 - アンテナマッチング装置、アンテナ装置及び移動体通信端末 - Google Patents
アンテナマッチング装置、アンテナ装置及び移動体通信端末 Download PDFInfo
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- WO2011068060A1 WO2011068060A1 PCT/JP2010/070886 JP2010070886W WO2011068060A1 WO 2011068060 A1 WO2011068060 A1 WO 2011068060A1 JP 2010070886 W JP2010070886 W JP 2010070886W WO 2011068060 A1 WO2011068060 A1 WO 2011068060A1
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- antenna
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- resonance circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
- H01P1/2135—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using strip line filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
- H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
Definitions
- the present invention relates to an antenna matching device, an antenna device, and a mobile communication terminal, and in particular, an antenna matching device, an antenna device, and a mobile communication terminal equipped with the antenna device that are optimal for an antenna of a mobile communication terminal such as a mobile phone.
- a mobile communication terminal such as a mobile phone.
- a matching circuit for matching the impedance between an antenna and a power feeding unit (including an RF circuit) connected thereto is used.
- a technique for integrating elements constituting the matching circuit into a multilayer substrate is known.
- Patent Document 2 describes a technique for coupling two radiating elements constituting a dipole antenna via a coupling coil element in order to form a broadband antenna.
- the elements constituting the matching circuit and the coupling coil element are mounted as independent components, the mounting space becomes large, which is used for mobile communication terminals that are required to be downsized. hard.
- the antenna is composed of a ground plane, a feeding point, and a monopole antenna radiating element, or FIG.
- the inverted F antenna described in FIG. 16 was known. However, these antennas have a narrow frequency band and are difficult to use in a wide frequency band.
- JP 2004-336250 A Japanese Utility Model Publication No. 62-24510 JP 2007-282091 A
- An antenna matching device is A first antenna terminal connected to the first radiating element, a second antenna terminal connected to the second radiating element, a feeding terminal connected to the feeding section; An antenna coupling circuit connected in series between the first antenna terminal and the second antenna terminal; A matching circuit connected between the first and second antenna terminals and the feeding terminal; With The antenna coupling circuit and the matching circuit are integrally formed on a predetermined substrate; It is characterized by.
- the antenna matching device includes an antenna coupling circuit for realizing a wide band by combining the first radiating element and the second radiating element, and a matching circuit for realizing impedance matching between the antenna unit and the power feeding unit. Since they are integrally formed on a predetermined substrate, they can be reduced in size, and the impedance characteristics can be easily designed.
- the antenna device is An antenna device comprising an antenna unit and a matching unit connected to the antenna unit,
- the antenna unit includes a first radiating element and a second radiating element connected to a pair of signal lines, respectively, and a coupling element that couples the first and second radiating elements;
- the matching unit includes a first resonance circuit and a second resonance circuit which are connected in series to the pair of signal lines, have different resonance frequencies, and are coupled to each other; It is characterized by.
- the mobile communication terminal is A mobile communication terminal incorporating an antenna device including an antenna unit and a matching unit connected to the antenna unit,
- the antenna unit includes a first radiating element and a second radiating element connected to a pair of signal lines, respectively, and a coupling element that couples the first and second radiating elements;
- the matching unit includes a first resonance circuit and a second resonance circuit that are connected in series to the pair of signal lines, have different resonance frequencies, and are coupled to each other;
- the matching unit is connected to a power supply circuit having an RF circuit; It is characterized by.
- the antenna unit has a large gain in a wide band because a first radiating element and a second radiating element respectively connected to a pair of signal lines are coupled by a coupling element (preferably an inductance element).
- the matching unit includes a first resonance circuit and a second resonance circuit that are connected in series to a pair of signal lines, have different resonance frequencies, and are coupled to each other. Is matched to the impedance of the feeder circuit in a wide band.
- the antenna device according to the present invention can be used in a wide frequency band by providing the broadband antenna unit and the matching unit capable of matching the impedance in a wide band.
- the antenna matching device of the first embodiment it is possible to achieve downsizing and to easily design impedance characteristics.
- communication in a wide frequency band is possible by providing the broadband antenna unit and the matching unit capable of matching impedance in a wide band. It becomes possible.
- FIG. 1 shows a perspective view which shows the said antenna matching apparatus. It is sectional drawing which shows the said antenna matching apparatus. It is a top view which shows the example 2 of a module provided with the antenna matching apparatus. 3 shows a module example 3 of the antenna device, where (A) is a plan view and (B) is a cross-sectional view of the main part. 4 shows a module example 4 of the antenna device, where (A) is a plan view and (B) is a cross-sectional view.
- Fig. 5 shows a module example 5 of the antenna device, in which (A) is a plan view, (B) is a cross-sectional view of the flexible substrate portion, and (C) is a cross-sectional view showing a modification of the flexible substrate portion.
- the antenna device shown in FIG. 1 includes an antenna matching device 5, and generally includes an antenna unit A and a matching unit B connected to the antenna unit A.
- the matching unit B includes a feeding unit C. Is connected.
- the power feeding unit C is incorporated in a mobile communication terminal such as a mobile phone.
- the antenna device including the antenna part A and the matching part B is modularized (see FIGS. 9 to 12) and mounted on the mobile communication terminal as described below.
- the antenna unit A includes a first radiating element 15 and a second radiating element 16 connected to the pair of signal lines 11 and 12, respectively, and a coupling circuit (coupling inductance for coupling the first and second radiating elements 15 and 16).
- Element L The antenna unit A includes a first radiating element 15 and a second radiating element 16 connected to the pair of signal lines 11 and 12, respectively, and a coupling circuit (coupling inductance for coupling the first and second radiating elements 15 and 16).
- the matching unit B includes a first resonance circuit 21 including a first inductance element L1 and a first capacitance element C1, and a second resonance circuit 22 including a second inductance element L2 and a second capacitance element C2.
- the first and second resonance circuits 21 and 22 are connected in series to the pair of signal lines 11 and 12, have different resonance frequencies, and the first and second inductance elements L1 and L2 have mutual inductances. Are magnetically coupled to each other.
- Each of the inductance elements L1 and L2 is configured by a coil conductor wound so that a magnetic flux generated by these inductance elements forms a closed magnetic circuit. Accordingly, the degree of coupling between the inductance elements L1 and L2 is extremely high, 0.7 to 1.0.
- first inductance element L1 is connected to one end of the second inductance element L2, and the other end of the first inductance element L1 is the first capacitance element C1 at the other end of the second inductance element L2.
- One end of each of the first and second inductance elements L 1 and L 2 is connected to the second radiating element 16 via a terminal 32.
- the other end of the second inductance element L2 is connected to the first radiation element 15 via the second capacitance element C2 and the terminal 31.
- a third capacitance element C3 is connected between the first resonance circuit 21 and the power feeding unit.
- the power feeding unit C includes a power feeding circuit 40 having an RF circuit (not shown). One end of the power supply circuit 40 is connected to the third capacitance element C3 via the terminal 33, and the other end is dropped to the ground GND and connected to one end of the first and second inductance elements L1 and L2 via the terminal 34. Has been. In other words, the power feeding unit C is unbalanced, and the size of the ground GND is finite.
- the numerical value of each element is exemplified.
- the coupling inductance element L is 12 nH
- the first inductance element L1 is 11 nH
- the second inductance element L2 is 12 nH
- the first capacitance element C1 is 4 pF
- the second capacitance is 3.5 pF
- the third capacitance element C3 is 1 pF.
- the antenna unit A has a wide band because the first radiating element 15 and the second radiating element 16 connected to the pair of signal lines 11 and 12 are coupled by the coupling element, that is, the inductance element L.
- the gain is large. Specifically, as shown in FIG. 2, it has a good gain over 900 MHz to 2.0 GHz.
- the frequency f 0 is a resonance frequency when there is no coupling element (inductance element L). Degeneration is solved by the coupling element, and the resonance frequencies f 1 and f 2 appear, thereby realizing a wide band.
- the shape of the first and second radiation elements 15 and 16 is arbitrary, but the radiation directivity can be a preferable characteristic depending on the shape.
- the impedance in the region where the gain of the antenna part A is positive varies widely as shown in the Smith chart of FIG. 3, and is usually 5 to 30 ⁇ .
- the impedance of the power feeding circuit 40 is usually 50 ⁇ .
- the matching section B is connected in series to the pair of signal lines 11 and 12, has a resonance frequency different from each other, and has a first resonance circuit 21 and a second resonance circuit 22 coupled to each other.
- the impedance of the antenna part A and the impedance of the power feeding circuit 40 are matched in a wide band.
- the matching part B can match the real part of the impedance of the antenna part A to 50 ⁇ as shown in the Smith chart of FIG. Further, as shown in FIG. 5, the matching portion B has good reflection characteristics over 900 MHz to 2.0 GHz.
- the matching part B does not affect the imaginary part of the impedance, and the imaginary part has various values.
- the antenna device shown in FIG. 1 can be used in a wide frequency band by including the broadband antenna section A and the matching section B capable of matching impedance in a wide band.
- the electrical length of the antenna part A is preferably ⁇ / 2 ( ⁇ is a used frequency) or less from the viewpoint of impedance matching. This is an effective method for preventing having an anti-resonance point (a point that does not function as an antenna) in a specific band that appears when the impedance of the antenna changes greatly.
- the number of stages of the LC resonance circuit may be configured to be more than two, and if configured to be multistage, impedance matching can be easily achieved. This also applies to the first and second modifications shown below.
- the matching section B may connect one end of the first and second inductance elements L1 and L2 to the signal line 12 via the fourth capacitance element C4, as shown in FIG.
- the matching portion B may be one in which the third capacitance element C3 and the fourth capacitance element C4 are omitted, as shown as Modification 2 in FIG.
- the antenna device shown in FIG. 8 includes the antenna matching device 5 and the power feeding unit C is a balanced type, and other configurations are the same as those of the antenna device shown in FIG. Therefore, the operational effects of the antenna device shown in FIG. 8 are the same as those of the antenna device shown in FIG.
- FIG. 9 shows Example 1 in which the antenna device is modularized.
- a ground electrode 61 built in a printed wiring board 60 mounted on a mobile communication terminal such as a mobile phone is also used as the second radiating element (16).
- the first radiating element 15 is formed as a conductor film on the surface of the substrate 70, and is connected to the connector 55 via a conductor 66 formed on the flexible substrate 65.
- the antenna matching device 5 is mounted on the printed wiring board 60.
- the antenna matching device 5 is configured by a multilayer substrate 62 made of a dielectric layer such as ceramic or resin in which matching portions B and coupling inductance elements L are formed in multiple layers.
- the antenna device is modularized in advance in this way, the work of mounting the antenna device on a mobile communication terminal such as a mobile phone is easy, and the matching portion B and the like are only partially redesigned. Therefore, it can be adapted to mobile communication terminals of various specifications, and the antenna device itself can be easily designed.
- a first inductance element L1 and a first capacitance element C1 formed in a coil shape as the first resonance circuit 21 are respectively provided in the upper stage of the multilayer substrate 62 constituting the antenna matching device 5 as internal conductors.
- the second inductance element L2 and the second capacitance element C2 formed in a coil shape as the second resonance circuit 22 are respectively incorporated as internal conductors.
- a third capacitance element C3 is incorporated as an internal conductor.
- a coupling inductance element L is incorporated as an internal conductor in the lower part of the multilayer substrate 62.
- the internal conductor is connected to external terminals 33 to 36 (see FIG. 10) arranged on the surface of the multilayer substrate 62. That is, the first resonance circuit 21 and the second resonance circuit 22 are connected to the external terminal 33 via the third capacitance element C3 and to the external terminal 34 (refer to FIG. 1 for the connection relationship in the equivalent circuit), The power supply unit 3 is connected. Further, the coupling inductance element L is connected to the first radiating element 15 through the external terminal 35 and is connected to the second radiating element 16 through the external terminal 36.
- the antenna matching device 5 includes a first antenna terminal 35 connected to the first radiating element 15, a second antenna terminal 36 connected to the second radiating element 16, and power feeding terminals 33 and 34 connected to the power feeding unit C.
- An antenna coupling circuit (coupling inductance element L) connected in series between the first antenna terminal 35 and the second antenna terminal 36, the first and second antenna terminals 35 and 36, and the power feeding terminals 33 and 34.
- a matching section B connected to each other.
- the antenna matching device 5 configured as described above includes an antenna coupling circuit (coupling inductance element L) for coupling the first radiating element 15 and the second radiating element 16 to realize a wide band, and an antenna unit A and a power feed. Since the matching circuit (matching part B) for realizing the impedance matching with the part C is integrally formed on the predetermined multilayer substrate 62, it can be reduced in size and the design of the impedance characteristic is facilitated.
- the dielectric layer having the first capacitance element C1 and the second capacitance element C2 is provided between the first inductance element L1 and the second inductance element L2 and the coupling inductance element L, the inductance element Magnetic coupling between L1 and L2 and the inductance element L can be eliminated as much as possible.
- FIG. 12 shows Example 2 in which the antenna device is modularized.
- the ground electrode 71 built in the printed wiring board 70 mounted on a mobile communication terminal such as a mobile phone is also used as the second radiating element (16).
- the first radiating element 15 is formed as a conductor film on the surface of the substrate 80.
- the antenna matching device 5 and the connector 56 are mounted on the substrate 80. This antenna matching device 5 is shown in FIGS.
- an IC component constituting various circuits of a mobile communication terminal such as a cellular phone, various chip-type elements, a connector 55 for connecting to a power feeding unit C, and the like are disposed.
- the connector 55 connects the antenna matching device 5 and the second radiating element 16, and the connector 56 connects the antenna matching device 5 and the matching portion B.
- the effect of configuring the antenna device as the module example 2 is as described in the module example 1.
- the operational effects of the antenna matching device 5 are as described with reference to FIGS. 10 and 11.
- FIGS. 13A and 13B show Example 3 in which the antenna device is modularized.
- This module example 3 uses a substrate 50 made of a liquid crystal polymer and an epoxy resin, and the substrate 50 includes rigid substrate portions 50a and 50b and a flexible substrate portion 50c.
- the rigid board portion 50a is provided with the first radiating element 15, the matching portion B, and the coupling inductance element L. Further, a connector 55 for connecting the matching portion B and the like to the power feeding portion C is provided.
- the inductance elements L, L1, and L2 are formed in multiple layers in a state of being incorporated in the area 51 of the board portion 50a, and the capacitance elements C1, C2, and C3 are mounted on the area 51 on the surface of the board portion 50a. Has been.
- Another rigid substrate portion 50b is formed with the second radiating element 16 built therein.
- the second radiating element 16 is connected to the connector 55 via a conductor portion 56 formed on the flexible substrate portion 50c.
- the antenna device is modularized in advance in this way, the work of mounting the antenna device on a mobile communication terminal such as a mobile phone is easy, and the matching portion B and the like are only partially redesigned. Therefore, it can be adapted to mobile communication terminals of various specifications, and the antenna device itself can be easily designed.
- FIG. 14A shows Example 4 in which the antenna device is modularized.
- the ground electrode 61 built in the printed wiring board 60 mounted on a mobile communication terminal such as a mobile phone is also used as the second radiating element (16).
- the first radiation element 15 is formed as a conductor film on the surface of the substrate 70, and is connected to the connector 55 via a conductor 66 formed on the flexible substrate 65.
- an IC component constituting various circuits of a mobile communication terminal such as a mobile phone, various chip-type elements, a connector 55 for connecting to a power feeding unit C, and the like are disposed.
- a multilayer substrate 62 made of ceramic or resin in which the matching portion B and the coupling inductance element L are formed in multiple layers is mounted.
- a first inductance element L1 and a first capacitance element C1 formed in a coil shape as the first resonance circuit 21 are incorporated in the upper part of the multilayer substrate 62 as internal conductors.
- a second inductance element L2 and a second capacitance element C2 formed in a coil shape as the second resonance circuit 22 are incorporated as internal conductors.
- a third capacitance element C3 is incorporated as an internal conductor.
- a coupling inductance element L is incorporated as an internal conductor in the lower part of the multilayer substrate 62.
- FIG. 15A illustrates a module example 5 of the antenna device.
- the ground electrode 71 built in the printed wiring board 70 mounted on a mobile communication terminal such as a mobile phone is also used as the second radiating element (16).
- the first radiating element 15 is formed as a conductor film on the surface of the substrate 80. Further, on the substrate 80, the multilayer substrate 62 in which the matching portion B and the coupling inductance element L are built is mounted.
- an IC component constituting various circuits of a mobile communication terminal such as a cellular phone, various chip-type elements, a connector 55 for connecting to a power feeding unit C, and the like are disposed.
- the matching part B and the coupling inductance element L built in the multilayer board 62 are first radiated through an internal conductor 85 built in a rigid board part 80a of the board 80. It is connected to the element 15 and is connected to the connector 55 and the ground electrode 71 (second radiating element 16) via an internal conductor 86 formed on the flexible substrate 80b.
- the matching portion B and the coupling inductance element L may be built in multiple layers as internal conductors on the rigid substrate portion 80a.
- the antenna matching device, the antenna device, and the mobile communication terminal according to the present invention are not limited to the above-described embodiments, and can be variously changed within the scope of the gist.
- the present invention is useful for an antenna matching device, an antenna device, and a mobile communication terminal.
- the present invention can be reduced in size and can be easily designed for impedance characteristics, or used in a wide frequency band. Excellent in that it can.
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Abstract
Description
第1放射エレメントに接続される第1アンテナ端子、第2放射エレメントに接続される第2アンテナ端子、給電部に接続される給電端子と、
前記第1アンテナ端子と前記第2アンテナ端子との間に直列に接続されたアンテナ結合回路と、
前記第1及び第2アンテナ端子と前記給電端子との間に接続された整合回路と、
を備え、
前記アンテナ結合回路と前記整合回路とが所定の基板に一体的に形成されていること、
を特徴とする。
アンテナ部と、該アンテナ部に接続された整合部とを備えたアンテナ装置であって、
前記アンテナ部は、一対の信号ラインにそれぞれ接続された第1放射エレメント及び第2放射エレメントと、該第1及び第2放射エレメントを結合する結合素子とを有し、
前記整合部は、前記一対の信号ラインに対して直列に接続され、互いに異なる共振周波数を有し、かつ、互いに結合した第1共振回路及び第2共振回路を有すること、
を特徴とする。
アンテナ部と、該アンテナ部に接続された整合部とを備えたアンテナ装置を内蔵した移動体通信端末であって、
前記アンテナ部は、一対の信号ラインにそれぞれ接続された第1放射エレメント及び第2放射エレメントと、該第1及び第2放射エレメントを結合する結合素子とを有し、
前記整合部は、前記一対の信号ラインに対して直列に接続され、互いに異なる共振周波数を有し、かつ、互いに結合した第1共振回路及び第2共振回路を有し、
前記整合部はRF回路を有する給電回路に接続されていること、
を特徴とする。
図1に示すアンテナ装置は、アンテナマッチング装置5を備えたもので、概略、アンテナ部Aと、該アンテナ部Aに接続された整合部Bとを備えており、整合部Bには給電部Cが接続されている。給電部Cは携帯電話などの移動体通信端末に組み込まれている。アンテナ部Aと整合部Bとからなるアンテナ装置は以下に説明するようにモジュール化(図9~図12参照)されて移動体通信端末に搭載される。
前記整合部Bは、図6に変形例1として示すように、第1及び第2インダクタンス素子L1,L2の一方端を第4キャパシタンス素子C4を介して信号ライン12に接続してもよい。
前記整合部Bは、図7に変形例2として示すように、第3キャパシタンス素子C3及び第4キャパシタンス素子C4を省略したものであってもよい。
図8に示すアンテナ装置は、アンテナマッチング装置5を備え、給電部Cを平衡型としたもので、他の構成は図1に示したアンテナ装置と同様である。従って、図8に示すアンテナ装置の作用効果は図1に示したアンテナ装置と同様である。
図9に、前記アンテナ装置をモジュール化した例1を示す。このモジュール例1は、携帯電話などの移動体通信端末に搭載されているプリント配線基板60に内蔵されているグランド電極61を第2放射エレメント(16)として兼用したものである。第1放射エレメント15は基板70の表面に導体膜として形成されており、フレキシブル基板65に形成した導体66を介してコネクタ55に接続されている。
図11に示すように、アンテナマッチング装置5を構成する多層基板62の上段部には、第1共振回路21としてコイル状に形成された第1インダクタンス素子L1と第1キャパシタンス素子C1がそれぞれ内部導体として内蔵され、第2共振回路22としてコイル状に形成された第2インダクタンス素子L2と第2キャパシタンス素子C2がそれぞれ内部導体として内蔵されている。また、第3キャパシタンス素子C3が内部導体として内蔵されている。さらに、多層基板62の下段部には、結合用インダクタンス素子Lが内部導体として内蔵されている。
図12に、前記アンテナ装置をモジュール化した例2を示す。このモジュール例2は、携帯電話などの移動体通信端末に搭載されているプリント配線基板70に内蔵されているグランド電極71を第2放射エレメント(16)として兼用したものである。第1放射エレメント15は基板80の表面に導体膜として形成されている。さらに、この基板80上には、アンテナマッチング装置5やコネクタ56が搭載されている。このアンテナマッチング装置5は図10及び図11に示したものである。
図13(A),(B)に、前記アンテナ装置をモジュール化した例3を示す。このモジュール例3は、液晶ポリマー、エポキシ系樹脂からなる基板50を用いており、基板50はリジッドな基板部50a,50bとフレキシブルな基板部50cとで構成されている。リジッドな基板部50aには、第1放射エレメント15及び整合部Bや結合用インダクタンス素子Lが配置され、さらに、整合部Bなどを給電部Cに接続するためのコネクタ55が配置されている。インダクタンス素子L,L1,L2は基板部50aの領域51に内蔵した状態で多層に形成されており、キャパシタンス素子C1,C2,C3はチップタイプのものが基板部50aの表面の領域51上に実装されている。
図14(A)に、前記アンテナ装置をモジュール化した例4を示す。このモジュール例4は、携帯電話などの移動体通信端末に搭載されているプリント配線基板60に内蔵されているグランド電極61を第2放射エレメント(16)として兼用したものである。第1放射エレメント15は基板70の表面に導体膜として形成されており、フレキシブル基板65に形成した導体66を介してコネクタ55に接続されている。
図15(A)に、前記アンテナ装置のモジュール例5を示す。このモジュール例5は、携帯電話などの移動体通信端末に搭載されているプリント配線基板70に内蔵されているグランド電極71を第2放射エレメント(16)として兼用したものである。第1放射エレメント15は基板80の表面に導体膜として形成されている。さらに、この基板80上には、整合部Bや結合用インダクタンス素子Lを内蔵した前記多層基板62が搭載されている。
なお、本発明に係るアンテナマッチング装置、アンテナ装置及び移動体通信端末は前記実施例に限定するものではなく、その要旨の範囲内で種々に変更できることは勿論である。
B…整合部
C…給電部
5…アンテナマッチング装置
11,12…信号ライン
15…第1放射エレメント
16…第2放射エレメント
21…第1共振回路
22…第2共振回路
33,34,35,36…外部端子
40…給電回路
62…多層基板
L…結合用インダクタンス素子
L1,L2…インダクタンス素子
C1,C2,C3…キャパシタンス素子
50,60,62,70,80…基板
Claims (18)
- 第1放射エレメントに接続される第1アンテナ端子、第2放射エレメントに接続される第2アンテナ端子、給電部に接続される給電端子と、
前記第1アンテナ端子と前記第2アンテナ端子との間に直列に接続されたアンテナ結合回路と、
前記第1及び第2アンテナ端子と前記給電端子との間に接続された整合回路と、
を備え、
前記アンテナ結合回路と前記整合回路とが所定の基板に一体的に形成されていること、
を特徴とするアンテナマッチング装置。 - 前記アンテナ結合回路は結合用インダクタンス素子を含むこと、を特徴とする請求項1に記載のアンテナマッチング装置。
- 前記整合回路は第1共振回路及び第2共振回路を含み、第1共振回路と第2共振回路は互いに磁気的に結合されていること、を特徴とする請求項1又は請求項2に記載のアンテナマッチング装置。
- 第1共振回路は第1インダクタンス素子を含み、第2共振回路は第2インダクタンス素子を含み、該第1及び第2インダクタンス素子は互いに磁気結合していること、を特徴とする請求項3に記載のアンテナマッチング装置。
- 第1共振回路はさらに第1キャパシタンス素子を含んで第1インダクタンス素子とでLC共振回路を構成し、
第2共振回路はさらに第2キャパシタンス素子を含んで第2インダクタンス素子とでLC共振回路を構成していること、
を特徴とする請求項4に記載のアンテナマッチング装置。 - 第1共振回路及び第2共振回路は互いに異なる共振周波数を有していること、を特徴とする請求項3ないし請求項5のいずれかに記載のアンテナマッチング装置。
- 前記アンテナ結合回路及び前記整合回路は複数の誘電体層を積層してなる多層基板に内蔵されていること、を特徴とする請求項1ないし請求項6のいずれかに記載のアンテナマッチング装置。
- 第1インダクタンス素子及び第2インダクタンス素子と、結合用インダクタンス素子とは異なる誘電体層に形成されていることを特徴とする請求項7に記載のアンテナマッチング装置。
- 第1インダクタンス素子及び第2インダクタンス素子と、結合用インダクタンス素子との間には第1キャパシタンス素子及び第2キャパシタンス素子を有する誘電体層が設けられていること、を特徴とする請求項8に記載のアンテナマッチング装置。
- アンテナ部と、該アンテナ部に接続された整合部とを備えたアンテナ装置であって、
前記アンテナ部は、一対の信号ラインにそれぞれ接続された第1放射エレメント及び第2放射エレメントと、該第1及び第2放射エレメントを結合する結合素子とを有し、
前記整合部は、前記一対の信号ラインに対して直列に接続され、互いに異なる共振周波数を有し、かつ、互いに結合した第1共振回路及び第2共振回路を有すること、
を特徴とするアンテナ装置。 - 前記整合部は平衡給電型又は不平衡給電型の給電部に接続されていること、を特徴とする請求項10に記載のアンテナ装置。
- 第1共振回路は第1インダクタンス素子を含み、第2共振回路は第2インダクタンス素子を含み、該第1及び第2インダクタンス素子は互いに磁気結合していること、を特徴とする請求項10又は請求項11に記載のアンテナ装置。
- 第1共振回路はさらに第1キャパシタンス素子を含んで第1インダクタンス素子とでLC共振回路を構成し、
第2共振回路はさらに第2キャパシタンス素子を含んで第2インダクタンス素子とでLC共振回路を構成していること、
を特徴とする請求項12に記載のアンテナ装置。 - 第1インダクタンス素子の一方端は第2インダクタンス素子の一方端に接続されており、第1インダクタンス素子の他方端は第2インダクタンス素子の他方端に第1キャパシタンス素子を介して接続されていること、を特徴とする請求項13に記載のアンテナ装置。
- 第1キャパシタンス素子は第1インダクタンス素子と第2インダクタンス素子との間に接続され、第2キャパシタンス素子は第2インダクタンス素子と第1放射エレメントとの間に接続されていること、を特徴とする請求項13に記載のアンテナ装置。
- さらに、第1共振回路と前記給電部との間に第3キャパシタンス素子が接続されていること、を特徴とする請求項10ないし請求項15のいずれかに記載のアンテナ装置。
- 第1及び第2放射エレメントを結合する結合素子はインダクタンス素子であること、を特徴とする請求項10ないし請求項16のいずれかに記載のアンテナ装置。
- アンテナ部と、該アンテナ部に接続された整合部とを備えたアンテナ装置を内蔵した移動体通信端末であって、
前記アンテナ部は、一対の信号ラインにそれぞれ接続された第1放射エレメント及び第2放射エレメントと、該第1及び第2放射エレメントを結合する結合素子とを有し、
前記整合部は、前記一対の信号ラインに対して直列に接続され、互いに異なる共振周波数を有し、かつ、互いに結合した第1共振回路及び第2共振回路を有し、
前記整合部はRF回路を有する給電回路に接続されていること、
を特徴とする移動体通信端末。
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CN201080053981.6A CN102648551B (zh) | 2009-12-01 | 2010-11-24 | 天线匹配装置、天线装置及移动通信终端 |
JP2011521402A JP5310855B2 (ja) | 2009-12-01 | 2010-11-24 | アンテナマッチング装置、アンテナ装置及び移動体通信端末 |
EP10834512.5A EP2482379A4 (en) | 2009-12-01 | 2010-11-24 | ANTENNA ADAPTATION DEVICE, ANTENNA DEVICE, AND MOBILE COMMUNICATION TERMINAL |
US13/467,079 US9692099B2 (en) | 2009-12-01 | 2012-05-09 | Antenna-matching device, antenna device and mobile communication terminal |
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CN213184599U (zh) * | 2018-04-25 | 2021-05-11 | 株式会社村田制作所 | 天线耦合元件、天线装置以及通信终端装置 |
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KR102426308B1 (ko) * | 2018-12-04 | 2022-07-28 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 모듈 |
WO2021095301A1 (ja) * | 2019-11-13 | 2021-05-20 | 国立大学法人埼玉大学 | アンテナモジュールおよびそれを搭載した通信装置 |
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EP2482379A4 (en) | 2014-04-09 |
CN102648551B (zh) | 2015-11-25 |
JP5310855B2 (ja) | 2013-10-09 |
US20120218165A1 (en) | 2012-08-30 |
CN102648551A (zh) | 2012-08-22 |
US9692099B2 (en) | 2017-06-27 |
EP2482379A1 (en) | 2012-08-01 |
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